Surface Mount Chip LEDs
Technical Data
HSMx-C110/C120/C150/
C170/C177/C190/C191/
C197/C265
Features
• Small Size
• Industry Standard Footprint
• Compatible with IR Solder
• Diffused Optics
• Operating Temperature
Range of -30°C to +85°C
• Right Angle & Reverse
Mount Package Available
• Various Colors Available
• Available in 8 mm Tape on
7 in. (178 mm) Diameter
Reels
Applications
• Keypad Backlighting
• Push-Button Backlighting
• LCD Backlighting
• Symbol Backlighting
• Front Panel Indicator
Description
These chip LEDs are designed
in an industry standard package
for ease of handling and use.
Various different LED colors are
available in nine compact, single
color packages.
The HSMx-C150 has the industry
standard 3.2 x 1.6 mm footprint
that is excellent for all around use.
The HSMx-C170 has the widely
used 2.0 x 1.25 mm footprint with
0.8 mm profile. The HSMx-C177
has the widely used 2.0 x 1.25 mm
footprint with 0.4 mm profile. The
HSMx-C19x series has the industry
standard 1.6 x 0.8 mm footprint
with varying profile to suit
designers needs, the HSMx-C190
has 0.8 mm profile, the HSMx-
C191 has a low profile of 0.6 mm,
and the HSMx-C197 has the ultra
low profile of 0.4 mm. This family
with its thin profile and wide
viewing angle makes this LED
exceptional for backlighting
applications.
The HSMx-C110 is a right angle
package with the universally
accepted dimensions of 3.2 x 1.0
x 1.5 mm. The HSMx-C120 is a
smaller right angle package with
industry standard 1.6 x 0.6 x 1.0
mm. HSMx-C265 is a reverse
mount package with dimensions
of 3.4 x 1.25 x 1.1 mm. These
devices are ideal for LCD
backlighting and sidelighting
applications.
In order to facilitate pick and
place operation, these chip LEDs
are shipped in tape and reel with
4000 units per reel for HSMx-
C120, C170, C177, C190, C191,
C197 packages, and 3000 units
per reel for HSMx-C110, C150,
C265 packages.
All packages are compatible with
IR reflow solder processes. The
small size and wide viewing angle
make these LEDs prime choices
for backlighting applications and
front panel illumination especially
where space is a premium.
2
As AlGaAs
Red Description
HSMH-C110 Untinted, Non-Diffused
HSMH-C120 Untinted, Non-Diffused
HSMH-C150 Untinted, Diffused
HSMH-C170 Untinted, Diffused
HSMH-C190 Untinted, Diffused
HSMH-C191 Untinted, Diffused
HSMH-C265 Untinted, Non-Diffused
Device Selectiion Guide
GaP
Green HER Orange Yellow Description
HSMG-C110 HSMS-C110 HSMD-C110 HSMY-C110 Untinted, Non-Diffused
HSMG-C120 HSMS-C120 HSMD-C120 – Untinted, Non-Diffused
HSMG-C150 HSMS-C150 HSMD-C150 HSMY-C150 Untinted, Diffused
HSMG-C170 HSMS-C170 HSMD-C170 HSMY-C170 Untinted, Diffused
HSMG-C177 HSMS-C177 HSMD-C177 – Untinted, Diffused
HSMG-C190 HSMS-C190 HSMD-C190 HSMY-C190 Untinted, Diffused
HSMG-C191 HSMS-C191 HSMD-C191 HSMY-C191 Untinted, Diffused
HSMG-C197 HSMS-C197 HSMD-C197 HSMY-C197 Untinted, Diffused
HSMG-C265 – – – Untinted, Non-Diffused
3
Package Dimensions
Notes:
1. All dimensions in millimeters (inches).
2. Tolerance is ±0.1 mm (±0.004 in.) unless otherwise specified.
3. Polarity for HSMH-C1 x 0 will be the opposite of what is shown on above drawings.
HSMx-C150 HSMx-C170
HSMx-C190 HSMx-C110
3.2 (0.126 )
0.5 (0.020)
0.50 ± 0.2
(0.020 ± 0.008)
0.6 (0.024)
POLARITY
[3]
CATHODE
MARK
1.1 (0.043)
0.50 ± 0.2
(0.020 ± 0.008)
2.0 (0.079)
0.8 (0.031)
LED DIE
DIFFUSED
EPOXY
PC BOARD
SOLDERING
TERMINAL
1.6 (0.063)
(ANODE MARK FOR
HSMH-C150)
CATHODE LINE
2.0 (0.079 )
0.3 (0.012)
0.4 ± 0.15
(0.016 ± 0.006)
0.3 (0.012)
POLARITY
[3]
CATHODE
MARK
0.8 (0.031)
0.4 ± 0.15
(0.016 ± 0.006)
1.4
(0.055)
0.62 (0.024)
LED DIE
DIFFUSED
EPOXY
PC BOARD
SOLDERING
TERMINAL
1.25 (0.049)
(ANODE MARK FOR
HSMH-C170)
CATHODE LINE
1.6
(0.063 )
0.3 (0.012)
0.3 ± 0.15
(0.012 ± 0.006)
0.3 (0.012)
POLARITY
[3]
CATHODE
MARK
0.8 (0.031)
0.3 ± 0.15
(0.012 ± 0.006)
1.0
(0.039)
0.4 (0.016)
LED DIE
DIFFUSED EPOXY
PC BOARD
SOLDERING
TERMINAL
0.8 (0.031)
(ANODE MARK FOR
HSMH-C190)
CATHODE LINE
0.7 (0.028) MIN.
3.2 (0.126 )
0.5 (0.020)
0.8 (0.031)
POLARITY
CATHODE
LINE
1.5 (0.059)
LED DIE
CLEAR
EPOXY
PC BOARD
SOLDERING
TERMINAL
1.0 (0.039)
1.0 (0.039)
2.6 (0.102 )
1.6 (0.063 )
CATHODE LINE
3.2 (0.126 )
(ANODE MARK
FOR HSMH-C110)
4
Notes:
1. All dimensions in millimeters (inches).
2. Tolerance is ±0.1 mm (±0.004 in.) unless otherwise specified.
3. Polarity for HSMH-C1 x 0 will be the opposite of what is shown on above drawings.
HSMx-C191 HSMx-C177
HSMx-C265
1.6
(0.063 )
0.26 (0.010)
0.3 ± 0.15
(0.012 ± 0.006)
0.3 (0.012)
POLARITY
CATHODE
MARK
0.8 (0.031)
0.3 ± 0.15
(0.012 ± 0.006)
1.0
(0.039)
0.4 (0.016)
LED DIE
DIFFUSED EPOXY
PC BOARD
SOLDERING
TERMINAL
0.8 (0.031)
CATHODE LINE
0.7 (0.028) MIN.
CATHODE MARK
LED DIE
1.25
(0.049)
0.62
(0.025)
2.00 (0.079)
DIFFUSED EPOXY
PC BOARD
0.40 (0.016)
0.16 (0.006)
POLARITY
0.40 ± 0.15
(0.016 ± 0.006)
SOLDERING
TERMINAL
1.10 (0.043) MIN.
0.40 ± 0.15
(0.016 ± 0.006)
CATHODE LINE
3.4 (0.134)
0.3 (0.012)
0.50 ± 0.15
(0.020 ± 0.006)
1.1 (0.043)
POLARITY
CATHODE
MARK (ETCHED)
[ANODE MARK FOR HSMH-C265]
1.1 (0.043)
0.50 ± 0.15
(0.020 ± 0.006)
1.2
(0.047)
1.25 (0.049)
LED DIE
UNDIFFUSED
EPOXY
PC BOARD
SOLDERING
TERMINAL
GREEN SOLDER MASK
CATHODE LINE
HSMx-C197
CATHODE MARK
LED DIE
0.80
(0.031) 0.40 (0.016)
1.60
(0.063)
DIFFUSED
EPOXY
PC BOARD 0.40 (0.016)
0.16 (0.006)
POLARITY
0.70 (0.028) MIN.
SOLDERING
TERMINAL
0.30 ± 0.15
(0.012 ± 0.006)
CATHODE LINE
5
HSMx-C120
1.6 (0.063)
0.4 (0.016)
POLARITY
CATHODE MARK
(ANODE MARK FOR HSMH-C120)
1.0 (0.039)
3 – 0.3 (0.012)
1.2 (0.047)
0.3 (0.012)
LED DIE
CLEAR EPOXY
PC BOARD
SOLDERING
TERMINAL
0.6 (0.024)
CATHODE LINE
Notes:
1. All dimensions in millimeters (inches).
2. Tolerance is ±0.1 mm (±0.004 in.) unless otherwise specified.
3. Polarity for HSMH-C1x0 will be the opposite of what is shown on above drawings.
6
Absolute Maximum Ratings for GaP at TA=25°C
Parameter C110/150/265 C120/170/177/190/191/197 Units
DC Forward Current[1] 25 20 mA
Peak Pulsing Current[2] 100 100 mA
Power Dissipation 65 52 mW
Reverse Voltage (IR=100 µA) 5 5 V
LED Junction Temperature 95 95 °C
Operating Temperature Range -30 to +85 -30 to +85 °C
Storage Temperature Range -40 to +85 -40 to +85 °C
Soldering Temperature See IR soldering profile (Figure 6)
Absolute Maximum Ratings for AlGaAs at TA=25°C
Parameter C110/150 C120/170/177/190/191/197/265 Units
DC Forward Current[1] 30 25 mA
Peak Pulsing Current[2] 100 100 mA
Power Dissipation 78 65 mW
Reverse Voltage (IR=100µA) 5 5 V
LED Junction Temperature 95 95 °C
Operating Temperature Range -30 to +85 -30 to +85 °C
Storage Temperature Range -40 to +85 -40 to +85 °C
Soldering Temperature See IR soldering profile (Figure 6)
Notes:
1. Derate linearly as shown in Figure 4 for temperature above 25°C.
2. Pulse condition of 1/10 duty and 0.1 msec. width.
Electrical Characteristics at TA=25°C
Reverse Capacitance
Forward Voltage Breakdown C(pF), Thermal
Part Number Color VF(Volts) VR(Volts) @ VF = 0 V, Resistance
@ IF = 20 mA @ IR = 100 µA f = 1 MHz Rθθ
θθ
θJ-P (°C/W)
Typ. Max. Min. Typ. Typ.
HSMS-C110/150 HER 2.1 2.6 5 5 400
HSMS-C120 350
HSMS-C170/177/190/191/197 250
HSMD-C110/150 Orange 2.2 2.6 5 7 400
HSMD-C120 350
HSMD-C170/177/190/191/197 250
HSMY-C110/150 Yellow 2.1 2.6 5 6 400
HSMY-C170/190/191/197 250
HSMG-C110/150 Green 2.2 2.6 5 9 400
HSMG-C120 350
HSMG-C170/177/190191/197/265 250
HSMH-C110/150 AlGaAs 1.8 2.6 5 18 460
HSMH-C120 400
HSMH-C170/190/191/265 300
7
Color Bin Limits[1]
Orange Color Bins[1]
Dom. Wavelength (nm)
Bin ID Min. Max.
A 597.0 600.0
B 600.0 603.0
C 603.0 606.0
D 606.0 609.0
E 609.0 612.0
F 612.0 615.0
Yellow/Amber Color Bins[1]
Dom. Wavelength (nm)
Bin ID Min. Max.
A 582.0 584.5
B 584.5 587.0
C 587.0 589.5
D 589.5 592.0
E 592.0 594.5
F 594.5 597.0
Green Color Bins[1]
Dom. Wavelength (nm)
Bin ID Min. Max.
A 561.5 564.5
B 564.5 567.5
C 567.5 570.5
D 570.5 573.5
E 573.5 576.5
Tolerance: ±0.5 nm
Tolerance: ±1 nm
Tolerance: ±0.5 nm
Optical Characteristics at TA=25°C
Luminous Peak Dominant
Intensity[1] Wavelength Wavelength Viewing
Part Number Color Iv(mcd)@20mA lpeak(nm) ld(nm) Angle 2u1/2(°)[2]
Min. Typ. Typ. Typ. Typ.
HSMG-C110/177/197 Green 4.5 15.0 570 572 130
HSMG-C120 155
HSMG-C150/170/190/191/265 170
HSMS-C110/177/197 HER 2.8 10.0 630 626 130
HSMS-C120 155
HSMS-C150/170/190/191 170
HSMD-C110/177/197 Orange 2.8 8.0 605 604 130
HSMD-C120 155
HSMD-C150/170/190/191 170
HSMY-C110/197 Yellow 2.8 8.0 589 586 130
HSMY-C150/170/190/191 170
HSMH-C110 AlGaAs 7.2 17.0 660 639 130
HSMH-C120 155
HSMH-C150/170/190/191/265 170
Notes:
1. The luminous intensity, Iv, is measured at the peak of the spatial radiation pattern, which may not be aligned with the mechanical axis of
the lamp package.
2. u1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity.
8
Figure 2. Forward Current vs.
Forward Voltage. Figure 3. Luminous Intensity vs.
Forward Current. Figure 4. Maximum Forward Current
vs. Ambient Temperature.
Figure 1. Relative Intensity vs. Wavelength.
WAVELENGTH – nm
HER
GREEN
RELATIVE INTENSITY
1.0
0.5
0500 550 600 650 700 750
YELLOW
ORANGE
AlGaAs
100
10
1
0.11.5 1.7 1.9 2.1 2.3
V
F
– FORWARD VOLTAGE – V
I
F
– FORWARD CURRENT – mA
GREEN
ORANGE
YELLOW
AlGaAs HER
01020 40
I
F
– FORWARD CURRENT – mA
0
0.4
1.2
1.6
LUMINOUS INTENSITY
(NORMALIZED AT 20 mA)
30
GaP
AlGaAs
0.8
Light Intensity (Iv) Bin Limits[1]
Intensity (mcd) Intensity (mcd)
Bin ID Min. Max. Bin ID Min. Max.
A 0.11 0.18 N 28.50 45.00
B 0.18 0.29 P 45.00 71.50
C 0.29 0.45 Q 71.50 112.50
D 0.45 0.72 R 112.50 180.00
E 0.72 1.10 S 180.00 285.00
F 1.10 1.80 T 285.00 450.00
G 1.80 2.80 U 450.00 715.00
H 2.80 4.50 V 715.00 1125.00
J 4.50 7.20 W 1125.00 1800.00
K 7.20 11.20 X 1800.00 2850.00
L 11.20 18.00 Y 2850.00 4500.00
M 18.00 28.50
Note:
1. Bin categories are established for classi-
fication of products. Products may not
be available in all categories. Please con-
tact your Agilent representative for infor-
mation on currently available bins.
Tolerance: ±15%
0
35
020 60 80 100
5
I
F MAX.
– MAXIMUM FORWARD CURRENT – mA
T
A
– AMBIENT TEMPERATURE – °C
40
15
25
30
10 Rθ
J-A
=
800°C/W
Rθ
J-A
=
600°C/W
20
C110/C150/C265
HER, ORANGE,
YELLOW, GREEN
C120/C170/C177/
C190/C191/C197/
C265 AlGaAs
C120/C170/
C177/C190/
C191/C197
HER,
ORANGE,
YELLOW,
GREEN
C110/C150 AlGaAs
9
Figure 5. Relative Intensity vs. Angle for HSMx-C110.
RELATIVE INTENSITY – %
1.00
0
ANGLE
0.80
0.60
0.50
0.70
0.20
0.10
0.30
0.40
0.90
-70 -50 -30 02030507090-90 -20-80 -60 -40 -10 10 40 60 80
RELATIVE INTENSITY – %
1.00
0
ANGLE
0.80
0.60
0.50
0.70
0.20
0.10
0.30
0.40
0.90
-70 -50 -30 02030507090-90 -20-80 -60 -40 -10 10 40 60 80
Figure 6. Relative Intensity vs. Angle for HSMx-C120.
100
90
80
70
60
50
40
30
20
10
0
RELATIVE INTENSITY
-90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90
ANGLE
100
90
80
70
60
50
40
30
20
10
0
RELATIVE INTENSITY
-90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90
ANGLE
10
Figure 8. Relative Intensity vs. Angle for HSMx-C150, C170, C190, C191 and C265.
Figure 10. Recommended Pb-Free Reflow Soldering Profile.
RELATIVE INTENSITY – %
1.00
0
ANGLE
0.80
0.60
0.50
0.70
0.20
0.10
0.30
0.40
0.90
-70 -50 -30 0 2030507090-90 -20-80 -60 -40 -10 10 40 60 80
Figure 7. Relative Intensity vs. Angle for HSMx-C177 and C197.
RELATIVE INTENSITY – %
100
0
ANGLE
80
60
50
70
20
10
30
40
90
-70 -50 -30 0 2030507090-90 -20-80 -60 -40 -10 10 40 60 80
Figure 11. Recommended Soldering
Pattern for HSMx-C150.
1.5 (0.059)
1.5
(0.059) 1.5
(0.059)
2.0
(0.079)
Figure 13. Recommended Soldering
Pattern for HSMx-C190, C191 and C197.
0.8 (0.031)
0.8
(0.031) 0.7
(0.028)
0.8
(0.031)
Figure 12. Recommended Soldering
Pattern for HSMx-C170 and C177.
1.2 (0.047)
1.2
(0.047)
0.9
(0.035)
1.2
(0.047)
230°C MAX.
10 SEC. MAX.
4°C/SEC.
MAX.
OVER 2 MIN.
TIME
TEMPERATURE
4°C/SEC. MAX.
140-160°C
3°C/SEC. MAX.
Figure 9. Recommended Reflow Soldering Profile.
217 °C
MAX. 120 SEC.
6 °C/SEC. MAX.
3 °C/SEC. MAX.
100 - 150 °C
255 °C (+5/-0)
60 to 150 SEC.
10 to 20 SEC.
TIME
TEMPERATURE
* THE TIME FROM 25 °C TO PEAK TEMPERATURE = 6 MINUTES MAX.
11
Figure 14. Recommended Soldering Pattern
for HSMx-C110.
Figure 17. Reeling Orientation.
Figure 18. Reel Dimensions.
CATHODE SIDE
PRINTED LABEL
USER FEED DIRECTION
5.0 (0.200)
1.0 (0.039)
1.5
(0.059) 1.5
(0.059)
2.0
(0.079)
0.9 (0.035)
0.2 (0.008)
0.9 (0.035)
CENTERING
BOARD
0.7 (0.028)
0.8
(0.031) 0.8
(0.031)
1.2
(0.047)
0.4 (0.016)
0.15 (0.006)
0.4 (0.016)
CENTERING
BOARD
Figure 15. Recommended Soldering Pattern for HSMx-C120.
Note: All dimensions in millimeters (inches).
Figure 16. Recommended Soldering Pattern for
HSMx-C265.
10.50 ± 1.0 (0.413 ± 0.039)
59.60 ± 1.00
(2.346 ± 0.039)
Ø 20.20 MIN.
(Ø 0.795 MIN.)
6
PS
178.40 ± 1.00
(7.024 ± 0.039)
3.0 ± 0.5
(0.118 ± 0.020)
4.0 ± 0.5
(0.157 ± 0.020) 5.0 ± 0.5
(0.197 ± 0.020)
Ø 13.1 ± 0.5
(Ø 0.516 ± 0.020)
8.0 ± 1.0 (0.315 ± 0.039)
1.25 (0.049)
1.4
(0.055) 2.3
(0.091) 1.4
(0.055)
2.2 (0.087) DIA. PCB HOLE
Figure 19. Tape Dimensions.
12
8.00 ± 0.30
(0.315 ± 0.012)
USER FEED
DIRECTION
DIM. A
(SEE TABLE 1)
3.50 ± 0.05
(0.138 ± 0.002)
1.75 (0.069)
DIM. C
(SEE TABLE 1) 0.20 ± 0.05
(0.008 ± 0.002)
CARRIER TAPE
COVER TAPE
DIM. B
(SEE TABLE 1)
4.00 (0.157)
2.00 ± 0.05
(0.079 ± 0.002)
4.00 (0.157) 1.50 (0.059)
TABLE 1
DIMENSIONS IN MILLIMETERS (INCHES)
CATHODE
DIM. A
± 0.10 (0.004) DIM. B
± 0.10 (0.004)PART NUMBER DIM. C
± 0.10 (0.004)
HSMx-C110/C120
POSITION IN
CARRIER TAPE
DIM. B
(SEE TABLE 1)
DIM. A
(SEE TABLE 1)
R 1.0 ± 0.05
(0.039 ± 0.002)
HSMx-C110 SERIES
HSMx-C120 SERIES
HSMx-C150 SERIES
HSMx-C170 SERIES
HSMx-C177 SERIES
HSMx-C190 SERIES
HSMx-C191 SERIES
HSMx-C197 SERIES
R 0.5 ± 0.05
(0.020 ± 0.002)
1.20 (0.047)
0.80 (0.031)
1.27 (0.050)
0.95 (0.037)
0.60 (0.024)
0.87 (0.034)
0.87 (0.034)
0.60 (0.024)
3.40 (0.134)
1.90 (0.075)
3.50 (0.138)
2.30 (0.091)
2.30 (0.091)
1.80 (0.071)
1.86 (0.073)
1.75 (0.069)
1.70 (0.067)
1.15 (0.045)
1.88 (0.074)
1.45 (0.057)
1.40 (0.055)
0.95 (0.037)
0.89 (0.035)
0.95 (0.037)
8.00 ± 0.30
(0.315 ± 0.012)
USER FEED
DIRECTION
DIM. A
(SEE TABLE 1)
3.50 ± 0.05
(0.138 ± 0.002)
1.75 (0.069)
DIM. C
(SEE TABLE 1) 0.20 ± 0.05
(0.008 ± 0.002)
CARRIER TAPE
COVER TAPE
DIM. B
(SEE TABLE 1)
4.00 (0.157)
2.00 ± 0.05
(0.079 ± 0.002)
4.00 (0.157) 1.50 (0.059)
HSMx-C265 SERIES 3.70 (0.146) 1.45 (0.057) 1.30 (0.051)
TABLE 1
DIMENSIONS IN MILLIMETERS (INCHES)
CATHODE
DIM. A
± 0.10 (0.004) DIM. B
± 0.10 (0.004)PART NUMBER DIM. C
± 0.10 (0.004)
Notes:
1. All dimensions in millimeters (inches).
2. Tolerance is ±0.1 mm (±0.004 in.)unless otherwise specified.
Figure 20. Tape Leader and Trailer Dimensions.
Convective IR Reflow
Soldering
For more information on IR
reflow soldering, refer to
Application Note 1060, Surface
Mounting SMT LED Indicator
Components.
Storage Condition: 5 to 30˚ C
@ 60% RH max.
Baking is required under the
condition:
a) the blue silica gel indicator
becoming white/transparent color
b) the pack has been opened for
more than 1 week
Baking recommended condition:
60 +/– 5˚C for 20 hours.
www.agilent.com/semiconductors
For product information and a complete list of
distributors, please go to our web site.
For technical assistance call:
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Data subject to change.
Copyright © 2004 Agilent Technologies, Inc.
Obsoletes 5988-6271EN
March 24, 2004
5989-0463EN
END START
THERE SHALL BE A
MINIMUM OF 160 mm
(6.3 INCH) OF EMPTY
COMPONENT POCKETS
SEALED WITH COVER
TAPE.
MOUNTED WITH
COMPONENTS THERE SHALL BE A
MINIMUM OF 160 mm
(6.3 INCH) OF EMPTY
COMPONENT POCKETS
SEALED WITH COVER
TAPE.
MINIMUM OF
230 mm
(9.05 INCH)
MAY CONSIST
OF CARRIER
AND/OR
COVER TAPE.
