MAX3318 2.5-V 460-kbps RS-232 TRANSCEIVER WITH 15-kV ESD PROTECTION www.ti.com FEATURES * * * * * * ESD Protection for RS-232 I/O Pins - 15 kV (Human-Body Model) - 8 kV (IEC 61000, Contact Discharge) - 8 kV (IEC 61000, Air-Gap Discharge) 300-A Operating Supply Current 1-A Low-Power Standby (With Receivers Active) Mode Designed to Transmit at a Data Rate of 460 kbps Auto-Power-Down Plus Option Features Flexible Power-Saving Mode Operates From a Single 2.25-V to 3-V VCC Supply APPLICATIONS * * SLLS687 - OCTOBER 2005 * * * * Cellular Phones Notebooks Hand-Held Equipment Pagers DB OR PW PACKAGE (TOP VIEW) READY C1+ V+ C1- C2+ C2- V- DOUT2 RIN2 ROUT2 1 20 2 19 3 18 4 17 5 16 6 15 7 14 8 13 9 12 10 11 FORCEOFF VCC GND DOUT1 RIN1 ROUT1 FORCEON DIN1 DIN2 INVALID Battery-Powered Systems PDAs DESCRIPTION/ORDERING INFORMATION The MAX3318 is a dual-driver, dual-receiver, RS-232 compatible transceiver. The device features auto-power-down plus and enhanced electrostatic discharge (ESD) protection integrated into the chip. Driver output and receiver input are protected to 8 kV using the IEC 61000 Air-Gap Discharge method, 8 kV using the IEC 61000 Contact Discharge method, and 15 kV using the Human-Body Model (HBM). The device operates at a data rate of 460 kbps. The transceiver has a proprietary low-dropout driver output stage enabling RS-232-compatible operation from a 2.25-V to 3-V supply with a dual charge pump. The charge pump requires only four 0.1-F capacitors and features a logic-level output (READY) that asserts when the charge pump is regulating and the device is ready to begin transmitting. The MAX3318 achieves a 1-A supply current using the auto-power-down feature. This device automatically enters a low-power power-down mode when the RS-232 cable is disconnected or the drivers of the connected peripherals are inactive for more than 30 s. The device turns on again when it senses a valid transition at any driver or receiver input. Auto power down saves power without changes to the existing BIOS or operating system. This device is available in two space-saving packages: 20-pin SSOP and 20-pin TSSOP. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright (c) 2005, Texas Instruments Incorporated MAX3318 2.5-V 460-kbps RS-232 TRANSCEIVER WITH 15-kV ESD PROTECTION www.ti.com SLLS687 - OCTOBER 2005 ORDERING INFORMATION PACKAGE (1) TA SSOP - DB -0C to 70C TSSOP - PW SSOP - DB -40C to 85C TSSOP - PW (1) ORDERABLE PART NUMBER Tube of 70 MAX3318CDB Reel of 2000 MAX3318CDBR Tube of 70 MAX3318CPW Reel of 2000 MAX3318CPWR Tube of 70 MAX3318IDB Reel of 2000 MAX3318IDBR Tube of 70 MAX3318IPW Reel of 2000 MAX3318IPWR TOP-SIDE MARKING MA3318C MA3318C MA3318I MA3318I Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. DETAILED DESCRIPTION Flexible control options for power management are featured when the serial port and driver inputs are inactive. The auto-power-down plus feature functions when FORCEON is low and FORCEOFF is high. During this mode of operation, if the device does not sense valid signal transitions on all receiver and driver inputs for approximately 30 s, the built-in charge pump and drivers are powered down, reducing the supply current to 1 A. By disconnecting the serial port or placing the peripheral drivers off, auto-power-down plus can be disabled when FORCEON and FORCEOFF are high. With auto-power-down plus enabled, the device activates automatically when a valid signal is applied to any receiver or driver input. INVALID is high (valid data) if any receiver input voltage is greater than 2.7 V or less than -2.7 V, or has been between -0.3 V and 0.3 V for less than 30 s (typical number). INVALID is low (invalid data) if all receiver input voltage are between -0.3 V and 0.3 V for more than 30 s (typical number). 2 MAX3318 2.5-V 460-kbps RS-232 TRANSCEIVER WITH 15-kV ESD PROTECTION www.ti.com SLLS687 - OCTOBER 2005 FUNCTION TABLE INPUT CONDITIONS FORCEON FORCEOFF RECEIVER OR DRIVER EDGE WITHIN 30 s (1) OUTPUT STATES VALID RS-232 LEVEL PRESENT AT RECEIVER DRIVER RECEIVER INVALID READY OPERATING MODE Auto-Power-Down Plus Conditions H H No No Active Active L H Normal operation, auto-power-down plus disabled H H No Yes Active Active H H Normal operation, auto-power-down plus disabled L H Yes No Active Active L H Normal operation, auto-power-down plus enabled L H Yes Yes Active Active H H Normal operation, auto-power-down plus enabled L H No No Z Active L L Power down, auto-power-down plus enabled L H No Yes Z Active H L Power down, auto-power-down plus enabled X L X No Z Active L L Manual power down X L X Yes Z Active H L Manual power down Auto-Power-Down Conditions (1) INVALID INVALID X No Z Active L L Power down, auto power down enabled INVALID INVALID X Yes Active Active H H Normal operation, auto power down enabled H = high level, L = low level, X = irrelevant, Z = high impedance 3 MAX3318 2.5-V 460-kbps RS-232 TRANSCEIVER WITH 15-kV ESD PROTECTION www.ti.com SLLS687 - OCTOBER 2005 LOGIC DIAGRAM (POSITIVE LOGIC) DIN1 DIN2 FORCEOFF FORCEON ROUT1 13 17 12 8 20 11 14 15 Auto-Power-Down Plus 1 16 DOUT1 DOUT2 INVALID READY RIN1 5 k ROUT2 10 9 5 k 4 RIN2 MAX3318 2.5-V 460-kbps RS-232 TRANSCEIVER WITH 15-kV ESD PROTECTION www.ti.com SLLS687 - OCTOBER 2005 TERMINAL FUNCTIONS TERMINAL NAME DESCRIPTION NO. C1+ 2 Positive voltage-doubler charge-pump capacitor C1- 4 Negative voltage-doubler charge-pump capacitor C2+ 5 Positive inverting charge-pump capacitor C2- 6 Negative inverting charge-pump capacitor DIN 12, 13 CMOS driver inputs DOUT 8, 17 RS-232 driver outputs FORCEOFF 20 Force-off input, active low. Drive low to power down transmitters, receivers, and charge pump. This overrides auto power down and FORCEON (see Function Table). FORCEON 14 Force-on input, active high. Drive high to override auto power down, keeping transmitters and receivers on (FORCEOFF must be high) (see Function Table). GND 18 Ground INVALID 11 Valid signal detector output, active low. A logic high indicates that a valid RS-232 level is present on a receiver input. READY 1 Ready to transmit output, active high. READY is enabled high when V- goes below -3.5 V and the device is ready to transmit. RIN 9, 16 RS-232 receiver inputs ROUT 10, 15 CMOS receiver outputs V+ 3 2 x VCC generated by the charge pump V- 7 -2 x VCC generated by the charge pump VCC 19 2.25-V to 3-V single-supply voltage 5 MAX3318 2.5-V 460-kbps RS-232 TRANSCEIVER WITH 15-kV ESD PROTECTION www.ti.com SLLS687 - OCTOBER 2005 Absolute Maximum Ratings (1) over operating free-air temperature range (unless otherwise noted) MIN MAX VCC to GND -0.3 6 V V+ to GND (2) -0.3 7 V GND (2) -7 0.3 V 13 V V- to V+ + IV-I (2) Input voltage Output voltage Short-circuit duration Continuous power dissipation (TA = 70C) DIN, FORCEON, FORCEOFF to GND -0.3 6 13.2 DOUT to GND ROUT, INVALID, READY to GND -0.3 DOUT to GND V VCC + 0.3 Continuous 16-pin SSOP (derate 7.14 mW/C above 70C) 571 20-pin SSOP (derate 8 mW/C above 70C 640 20-pin TSSOP (derate 7 mW/C above 70C) 559 -65 Lead temperature (soldering, 10 s) (2) V 25 RIN to GND Storage temperature range (1) UNIT mW 150 C 300 C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. V+ and V- can have maximum magnitudes of 7 V, but their absolute difference cannot exceed 13 V. Recommended Operating Conditions See Figure 4 MIN NOM Supply voltage 2.25 2.5 MAX UNIT 3 V VIH Driver and control high-level input voltage DIN, FORCEOFF, FORCEON VCC = 2.5 V to 3 V 0.7 x VCC 5.5 V VIL Driver and control low-level input voltage DIN, FORCEOFF, FORCEON VCC = 2.5 V to 3 V 0 0.3 x VCC V VI Receiver input voltage -25 25 V 0 70 -40 85 TA 6 Operating free-air temperature MAX3318C MAX3318I C MAX3318 2.5-V 460-kbps RS-232 TRANSCEIVER WITH 15-kV ESD PROTECTION www.ti.com SLLS687 - OCTOBER 2005 Supply Current Section Electrical Characteristics VCC = 2.25 V to 3 V, C1-C4 = 0.1 F, TA = TMIN to TMAX (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP (1) MAX UNIT DC Characteristics (VCC = 2.5 V, TA = 25C) Auto-power-down plus supply current FORCEON = GND, FORCEOFF = VCC, All RIN and DIN idle Auto-power-down supply current FORCEOFF = GND Supply current FORCEON = FORCEOFF = VCC, No load (1) A 1 10 1 10 A 0.3 2 mA Typical values are at VCC = 2.5 V, TA = 25C. ESD Protection PARAMETER TEST CONDITIONS Human-Body Model (HBM) RIN, DOUT TYP UNIT 15 IEC G1000-4-2 Air-Gap Discharge method 8 IEC G1000-4-2 Contact Discharge method 8 kV 7 MAX3318 2.5-V 460-kbps RS-232 TRANSCEIVER WITH 15-kV ESD PROTECTION www.ti.com SLLS687 - OCTOBER 2005 Driver Section Electrical Characteristics over recommended ranges of supply voltage and operating free-air temperature, VCC = 2.25 V to 3 V, C1-C4 = 0.1 F, TA = TMIN to TMAX (unless otherwise noted) (see Figure 4) PARAMETER TEST CONDITIONS MIN TYP (1) Driver input hysteresis 0.01 Input leakage current FORCEON, DIN, FORCEOFF Output voltage swing All driver outputs loaded with 3 k to ground 3.7 4 Output resistance VCC = 0, Driver output = 2 V 300 10M 25 Output short-circuit current (2) Output leakage current (1) (2) MAX 0.3 VCC = 0 or 2.25 V to 3 V, VOUT = 12 V, Drivers disabled UNIT V 1 A V 60 mA 25 A Typical values are at VCC = 2.5 V, TA = 25C. Short-circuit durations should be controlled to prevent exceeding the device absolute power dissipation ratings, and not more than one output should be shorted at a time. Driver Section Switching Characteristics over recommended ranges of supply voltage and operating free-air temperature, VCC = 2.25 V to 3 V, C1-C4 = 0.1 F, TA = TMIN to TMAX (unless otherwise noted) (see Figure 1) PARAMETER Maximum data rate |tPHL - tPLH| 8 RL = 3 k, CL = 1000 pF, One transmitter switching MIN TYP (1) MAX 460 Driver skew (2) Transition-region slew rate (1) (2) TEST CONDITIONS kbps 100 VCC = 2.5 V, TA = 25C, RL = 3 k to 7 k, Measured from 3 V to -3 V or -3 V to 3 V, CL = 150 pF to 2500 pF Typical values are at VCC = 2.5 V, TA = 25C. Pulse skew is defined as |tPLH - tPHL| of each channel of the same device. 4 UNIT ns 30 V/s MAX3318 2.5-V 460-kbps RS-232 TRANSCEIVER WITH 15-kV ESD PROTECTION www.ti.com SLLS687 - OCTOBER 2005 Receiver Section Electrical Characteristics over recommended ranges of supply voltage and operating free-air temperature, VCC = 2.25 V to 3 V, C1-C4 = 0.1 F, TA = TMIN to TMAX (unless otherwise noted) (see Figure 4) PARAMETER MIN TYP (1) TEST CONDITIONS Input voltage range -25 Input threshold low TA = 25C Input threshold high TA = 25C 0.7 x VCC TA = 25C 3 Input hysteresis Output leakage current Output voltage low IOUT = 0.5 mA Output voltage high IOUT = -0.5 mA UNIT 25 V 0.3 x VCC V V 0.3 Input resistance (1) MAX V 5 7 k 0.05 10 A 0.1 x VCC V 0.9 x VCC V Typical values are at VCC = 2.5 V, TA = 25C. Receiver Section Switching Characteristics over recommended ranges of supply voltage and operating free-air temperature, VCC = 2.25 V to 3 V, C1-C4 = 0.1 F, TA = TMIN to TMAX (unless otherwise noted) (see Figure 4) PARAMETER tPHL Receiver propagation delay tPLH |tPHL - tPLH| (1) (2) TEST CONDITIONS RIN to ROUT, CL = 150 pF Receiver skew (2) TYP (1) 0.175 0.175 50 UNIT s ns Typical values are at VCC = 2.5 V, TA = 25C. Pulse skew is defined as |tPLH - tPHL| of each channel of the same device. 9 MAX3318 2.5-V 460-kbps RS-232 TRANSCEIVER WITH 15-kV ESD PROTECTION www.ti.com SLLS687 - OCTOBER 2005 Auto-Power-Down Plus Section Electrical Characteristics over recommended ranges of supply voltage and operating free-air temperature, VCC = 2.25 V to 3 V, C1-C4 = 0.1 F, TA = TMIN to TMAX (unless otherwise noted) (see Figure 4) PARAMETER Receiver input threshold to INVALID high TEST CONDITIONS MIN MAX Positive threshold 2.7 Negative threshold -2.7 Receiver input threshold INVALID low -0.3 INVALID, READY voltage low IOUT = 0.5 mA INVALID, READY voltage high IOUT = -0.5 mA UNIT V 0.3 V 0.1 x VCC V 0.8 x VCC V Auto-Power-Down Plus Section Switching Characteristics over recommended ranges of supply voltage and operating free-air temperature, VCC = 2.25 V to 3 V, C1-C4 = 0.1 F, TA = TMIN to TMAX (unless otherwise noted) (see Figure 4) PARAMETER TEST CONDITIONS MIN TYP (1) MAX UNIT tINVH Receiver positive or negative threshold to INVALID high VCC = 2.5 V 1 s tINVL Receiver positive or negative threshold to INVALID low VCC = 2.5 V 30 s tWU Receiver or driver edge to driver enabled VCC = 2.5 V tAUTOPRDN Receiver or driver edge to driver shutdown VCC = 2.5 V (1) 10 Typical values are at VCC = 2.5 V,TA = 25C. s 100 15 30 60 s MAX3318 2.5-V 460-kbps RS-232 TRANSCEIVER WITH 15-kV ESD PROTECTION www.ti.com SLLS687 - OCTOBER 2005 PARAMETER MEASUREMENT INFORMATION 3V Generator (see Note B) Input RS-232 Output 50 RL CL (see Note A) 3V FORCEOFF TEST CIRCUIT 0V tTHL Output SR(tr) 6V t THL or tTLH tTLH VOH 3V 3V -3 V -3 V VOL VOLTAGE WAVEFORMS NOTES: A. CL includes probe and jig capacitance. B. The pulse generator has the following characteristics: PRR = 250 kbit/s, ZO = 50 , 50% duty cycle, tr 10 ns, tf 10 ns. Figure 1. Driver Slew Rate 2.25 V Generator (see Note B) RS-232 Output 50 RL Input 1.125 V 1.125 V 0V CL (see Note A) tPLH tPHL VOH 3V FORCEOFF 50% 50% Output VOL TEST CIRCUIT VOLTAGE WAVEFORMS NOTES: A. CL includes probe and jig capacitance. B. The pulse generator has the following characteristics: PRR = 250 kbit/s, ZO = 50 , 50% duty cycle, tr 10 ns, tf 10 ns. Figure 2. Driver Pulse Skew 3V Input 0V 0V -3 V Output Generator (see Note B) tPHL 50 tPLH CL (see Note A) VOH 50% Output 50% VOL TEST CIRCUIT VOLTAGE WAVEFORMS NOTES: A. CL includes probe and jig capacitance. B. The pulse generator has the following characteristics: ZO = 50 , 50% duty cycle, tr 10 ns, tf 10 ns. Figure 3. Receiver Propagation Delay Times 11 MAX3318 2.5-V 460-kbps RS-232 TRANSCEIVER WITH 15-kV ESD PROTECTION www.ti.com SLLS687 - OCTOBER 2005 PARAMETER MEASUREMENT INFORMATION Receiver Inputs } Invalid Region Driver Inputs Driver Outputs VCC INVALID Output tINVL tINVH 0 tWU tWU VCC Ready Output 0 V+ VCC 0 V- VOLTAGE WAVEFORMS Valid RS-232 Level, INVALID High ROUT Generator (see Note B) 2.7 V 50 Indeterminate 0.3 V 0V If Signal Remains Within This Region For More Than 30 s, INVALID Is Low -0.3 V Auto-PowerDown Plus Indeterminate INVALID -2.7 V CL = 30 pF (see Note A) FORCEON FORCEOFF Valid RS-232 Level, INVALID High DIN DOUT Auto power down disables drivers and reduces supply current to 1 A. TEST CIRCUIT Figure 4. INVALID Propagation Delay Times and Supply Enabling Time 12 MAX3318 2.5-V 460-kbps RS-232 TRANSCEIVER WITH 15-kV ESD PROTECTION www.ti.com SLLS687 - OCTOBER 2005 PARAMETER MEASUREMENT INFORMATION 2.5 V + 0.1 F 19 CBYPASS 2 C1 0.1 F C2 0.1 F + 4 + 5 6 VCC C1+ V+ 3 + C1- V- C2+ 7 C2- 13 DIN1 DOUT1 17 12 DIN2 DOUT2 8 RIN1 16 15 ROUT1 C3 0.1 F C4 + 0.1 F RS-232-Compatible Outputs RS-232-Compatible Inputs 5k 10 ROUT2 1 RIN2 9 5k READY Auto-Power- INVALID 11 Down Plus To Power-Management Unit VCC FORCEOFF 20 14 FORCEON GND 18 Figure 5. Typical Application Circuit 13 PACKAGE OPTION ADDENDUM www.ti.com 28-May-2007 PACKAGING INFORMATION (1) Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty MAX3318CDB ACTIVE SSOP DB 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3318CDBE4 ACTIVE SSOP DB 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3318CDBG4 ACTIVE SSOP DB 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3318CDBR ACTIVE SSOP DB 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3318CDBRE4 ACTIVE SSOP DB 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3318CDBRG4 ACTIVE SSOP DB 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3318CPW ACTIVE TSSOP PW 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3318CPWE4 ACTIVE TSSOP PW 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3318CPWG4 ACTIVE TSSOP PW 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3318CPWR ACTIVE TSSOP PW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3318CPWRE4 ACTIVE TSSOP PW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3318CPWRG4 ACTIVE TSSOP PW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3318IDB ACTIVE SSOP DB 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3318IDBE4 ACTIVE SSOP DB 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3318IDBG4 ACTIVE SSOP DB 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3318IDBR ACTIVE SSOP DB 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3318IDBRE4 ACTIVE SSOP DB 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3318IDBRG4 ACTIVE SSOP DB 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3318IPW ACTIVE TSSOP PW 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3318IPWE4 ACTIVE TSSOP PW 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3318IPWG4 ACTIVE TSSOP PW 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3318IPWR ACTIVE TSSOP PW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3318IPWRE4 ACTIVE TSSOP PW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3318IPWRG4 ACTIVE TSSOP PW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM The marketing status values are defined as follows: Addendum-Page 1 Lead/Ball Finish MSL Peak Temp (3) PACKAGE OPTION ADDENDUM www.ti.com 28-May-2007 ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 12.0 16.0 Q1 MAX3318CDBR SSOP DB 20 2000 330.0 16.4 8.2 7.5 2.5 MAX3318CPWR TSSOP PW 20 2000 330.0 16.4 6.95 7.1 1.6 8.0 16.0 Q1 MAX3318IDBR SSOP DB 20 2000 330.0 16.4 8.2 7.5 2.5 12.0 16.0 Q1 MAX3318IPWR TSSOP PW 20 2000 330.0 16.4 6.95 7.1 1.6 8.0 16.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) MAX3318CDBR SSOP DB 20 2000 367.0 367.0 38.0 MAX3318CPWR TSSOP PW 20 2000 367.0 367.0 38.0 MAX3318IDBR SSOP DB 20 2000 367.0 367.0 38.0 MAX3318IPWR TSSOP PW 20 2000 367.0 367.0 38.0 Pack Materials-Page 2 MECHANICAL DATA MSSO002E - JANUARY 1995 - REVISED DECEMBER 2001 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 28 PINS SHOWN 0,38 0,22 0,65 28 0,15 M 15 0,25 0,09 8,20 7,40 5,60 5,00 Gage Plane 1 14 0,25 A 0-8 0,95 0,55 Seating Plane 2,00 MAX 0,10 0,05 MIN PINS ** 14 16 20 24 28 30 38 A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 DIM 4040065 /E 12/01 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-150 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as "components") are sold subject to TI's terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI's terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers' products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers' products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI's goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or "enhanced plastic" are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components which meet ISO/TS16949 requirements, mainly for automotive use. Components which have not been so designated are neither designed nor intended for automotive use; and TI will not be responsible for any failure of such components to meet such requirements. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP(R) Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Mobile Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright (c) 2012, Texas Instruments Incorporated