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FEATURES
APPLICATIONS
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
READY
C1+
V+
C1−
C2+
C2−
V−
DOUT2
RIN2
ROUT2
FORCEOFF
VCC
GND
DOUT1
RIN1
ROUT1
FORCEON
DIN1
DIN2
INVALID
DB OR PW PACKAGE
(TOP VIEW)
DESCRIPTION/ORDERING INFORMATION
MAX33182.5-V 460-kbps RS-232 TRANSCEIVERWITH ±15-kV ESD PROTECTION
SLLS687 – OCTOBER 2005
•Cellular Phones•Notebooks•ESD Protection for RS-232 I/O Pins
•Hand-Held Equipment–±15 kV (Human-Body Model)
•Pagers–±8 kV (IEC 61000, Contact Discharge)–±8 kV (IEC 61000, Air-Gap Discharge)•300- µA Operating Supply Current•1- µA Low-Power Standby (With ReceiversActive) Mode•Designed to Transmit at a Data Rate of460 kbps•Auto-Power-Down Plus Option FeaturesFlexible Power-Saving Mode•Operates From a Single 2.25-V to 3-V V
CCSupply
•Battery-Powered Systems•PDAs
The MAX3318 is a dual-driver, dual-receiver, RS-232 compatible transceiver. The device featuresauto-power-down plus and enhanced electrostatic discharge (ESD) protection integrated into the chip. Driveroutput and receiver input are protected to ±8 kV using the IEC 61000 Air-Gap Discharge method, ±8 kV usingthe IEC 61000 Contact Discharge method, and ±15 kV using the Human-Body Model (HBM).
The device operates at a data rate of 460 kbps. The transceiver has a proprietary low-dropout driver output stageenabling RS-232-compatible operation from a 2.25-V to 3-V supply with a dual charge pump. The charge pumprequires only four 0.1- µF capacitors and features a logic-level output (READY) that asserts when the chargepump is regulating and the device is ready to begin transmitting.
The MAX3318 achieves a 1- µA supply current using the auto-power-down feature. This device automaticallyenters a low-power power-down mode when the RS-232 cable is disconnected or the drivers of the connectedperipherals are inactive for more than 30 s. The device turns on again when it senses a valid transition at anydriver or receiver input. Auto power down saves power without changes to the existing BIOS or operatingsystem.
This device is available in two space-saving packages: 20-pin SSOP and 20-pin TSSOP.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of TexasInstruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2005, Texas Instruments IncorporatedProducts conform to specifications per the terms of the TexasInstruments standard warranty. Production processing does notnecessarily include testing of all parameters.
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DETAILED DESCRIPTION
MAX3318
2.5-V 460-kbps RS-232 TRANSCEIVERWITH ±15-kV ESD PROTECTION
SLLS687 – OCTOBER 2005
ORDERING INFORMATION
T
A
PACKAGE
(1)
ORDERABLE PART NUMBER TOP-SIDE MARKING
Tube of 70 MAX3318CDBSSOP – DB MA3318CReel of 2000 MAX3318CDBR–0 °C to 70 °C
Tube of 70 MAX3318CPWTSSOP – PW MA3318CReel of 2000 MAX3318CPWRTube of 70 MAX3318IDBSSOP – DB MA3318IReel of 2000 MAX3318IDBR–40 °C to 85 °C
Tube of 70 MAX3318IPWTSSOP – PW MA3318IReel of 2000 MAX3318IPWR
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available atwww.ti.com/sc/package.
Flexible control options for power management are featured when the serial port and driver inputs are inactive.The auto-power-down plus feature functions when FORCEON is low and FORCEOFF is high. During this modeof operation, if the device does not sense valid signal transitions on all receiver and driver inputs forapproximately 30 s, the built-in charge pump and drivers are powered down, reducing the supply current to 1 µA.By disconnecting the serial port or placing the peripheral drivers off, auto-power-down plus can be disabled whenFORCEON and FORCEOFF are high. With auto-power-down plus enabled, the device activates automaticallywhen a valid signal is applied to any receiver or driver input. INVALID is high (valid data) if any receiver inputvoltage is greater than 2.7 V or less than –2.7 V, or has been between –0.3 V and 0.3 V for less than 30 µs(typical number). INVALID is low (invalid data) if all receiver input voltage are between –0.3 V and 0.3 V for morethan 30 µs (typical number).
2
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MAX33182.5-V 460-kbps RS-232 TRANSCEIVERWITH ±15-kV ESD PROTECTION
SLLS687 – OCTOBER 2005
FUNCTION TABLE
(1)
INPUT CONDITIONS OUTPUT STATES
VALIDRECEIVER
OPERATINGRS-232OR DRIVER
MODEFORCEON FORCEOFF LEVEL DRIVER RECEIVER INVALID READYEDGE
PRESENT ATWITHIN 30 s
RECEIVER
Auto-Power-Down Plus Conditions
Normal operation,H H No No Active Active L H auto-power-down
plus disabled
Normal operation,H H No Yes Active Active H H auto-power-down
plus disabled
Normal operation,L H Yes No Active Active L H auto-power-down
plus enabled
Normal operation,L H Yes Yes Active Active H H auto-power-down
plus enabled
Power down,L H No No Z Active L L auto-power-down
plus enabled
Power down,L H No Yes Z Active H L auto-power-down
plus enabled
Manual powerX L X No Z Active L L
down
Manual powerX L X Yes Z Active H L
down
Auto-Power-Down Conditions
Power down, autoINVALID INVALID X No Z Active L L power downenabled
Normal operation,INVALID INVALID X Yes Active Active H H auto power downenabled
(1) H = high level, L = low level, X = irrelevant, Z = high impedance
3
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DIN2
DIN1
DOUT2
DOUT1
Auto-Power-Down Plus INVALID
RIN1
RIN2
FORCEOFF
FORCEON
ROUT1
ROUT2
13
12
20
14
15
10
17
8
11
16
9
5 k
5 k
Ω
Ω
READY
1
MAX3318
2.5-V 460-kbps RS-232 TRANSCEIVERWITH ±15-kV ESD PROTECTION
SLLS687 – OCTOBER 2005
LOGIC DIAGRAM (POSITIVE LOGIC)
4
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MAX33182.5-V 460-kbps RS-232 TRANSCEIVERWITH ±15-kV ESD PROTECTION
SLLS687 – OCTOBER 2005
TERMINAL FUNCTIONS
TERMINAL
DESCRIPTIONNAME NO.
C1+ 2 Positive voltage-doubler charge-pump capacitorC1– 4 Negative voltage-doubler charge-pump capacitorC2+ 5 Positive inverting charge-pump capacitorC2– 6 Negative inverting charge-pump capacitorDIN 12, 13 CMOS driver inputsDOUT 8, 17 RS-232 driver outputsForce-off input, active low. Drive low to power down transmitters, receivers, and charge pump. This overridesFORCEOFF 20
auto power down and FORCEON (see Function Table).Force-on input, active high. Drive high to override auto power down, keeping transmitters and receivers onFORCEON 14
( FORCEOFF must be high) (see Function Table).GND 18 Ground
Valid signal detector output, active low. A logic high indicates that a valid RS-232 level is present on a receiverINVALID 11
input.
Ready to transmit output, active high. READY is enabled high when V– goes below –3.5 V and the device isREADY 1
ready to transmit.RIN 9, 16 RS-232 receiver inputsROUT 10, 15 CMOS receiver outputsV+ 3 2 ×V
CC
generated by the charge pumpV– 7 –2 ×V
CC
generated by the charge pumpV
CC
19 2.25-V to 3-V single-supply voltage
5
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Absolute Maximum Ratings
(1)
Recommended Operating Conditions
MAX3318
2.5-V 460-kbps RS-232 TRANSCEIVERWITH ±15-kV ESD PROTECTION
SLLS687 – OCTOBER 2005
over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
V
CC
to GND –0.3 6 VV+ to GND
(2)
–0.3 7 VV– to GND
(2)
–7 0.3 VV+ + IV-I
(2)
13 VDIN, FORCEON, FORCEOFF to GND –0.3 6Input voltage VRIN to GND ±25DOUT to GND ±13.2Output voltage VROUT, INVALID, READY to GND –0.3 V
CC
+ 0.3Short-circuit duration DOUT to GND Continuous16-pin SSOP (derate 7.14 mW/ °C above 70 °C) 571Continuous power dissipation (T
A
= 70 °C) 20-pin SSOP (derate 8 mW/ °C above 70 °C 640 mW20-pin TSSOP (derate 7 mW/ °C above 70 °C) 559Storage temperature range –65 150 °CLead temperature (soldering, 10 s) 300 °C
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratingsonly, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operatingconditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.(2) V+ and V– can have maximum magnitudes of 7 V, but their absolute difference cannot exceed 13 V.
See Figure 4
MIN NOM MAX UNIT
Supply voltage 2.25 2.5 3 VDIN, FORCEOFF,V
IH
Driver and control high-level input voltage V
CC
= 2.5 V to 3 V 0.7 ×V
CC
5.5 VFORCEON
DIN, FORCEOFF,V
IL
Driver and control low-level input voltage V
CC
= 2.5 V to 3 V 0 0.3 ×V
CC
VFORCEONV
I
Receiver input voltage –25 25 VMAX3318C 0 70T
A
Operating free-air temperature °CMAX3318I –40 85
6
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Supply Current Section Electrical Characteristics
ESD Protection
MAX33182.5-V 460-kbps RS-232 TRANSCEIVERWITH ±15-kV ESD PROTECTION
SLLS687 – OCTOBER 2005
V
CC
= 2.25 V to 3 V, C1–C4 = 0.1 µF, T
A
= T
MIN
to T
MAX
(unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP
(1)
MAX UNIT
DC Characteristics (V
CC
= 2.5 V, T
A
= 25 °C)
Auto-power-down plus supply current FORCEON = GND, FORCEOFF = V
CC
, All RIN and DIN idle 1 10 µAAuto-power-down supply current FORCEOFF = GND 1 10 µASupply current FORCEON = FORCEOFF = V
CC
, No load 0.3 2 mA
(1) Typical values are at V
CC
= 2.5 V, T
A
= 25 °C.
PARAMETER TEST CONDITIONS TYP UNIT
Human-Body Model (HBM) ±15RIN, DOUT IEC G1000-4-2 Air-Gap Discharge method ±8 kVIEC G1000-4-2 Contact Discharge method ±8
7
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Driver Section Electrical Characteristics
Driver Section Switching Characteristics
MAX3318
2.5-V 460-kbps RS-232 TRANSCEIVERWITH ±15-kV ESD PROTECTION
SLLS687 – OCTOBER 2005
over recommended ranges of supply voltage and operating free-air temperature,V
CC
= 2.25 V to 3 V, C1–C4 = 0.1 µF, T
A
= T
MIN
to T
MAX
(unless otherwise noted) (see Figure 4 )
PARAMETER TEST CONDITIONS MIN TYP
(1)
MAX UNIT
Driver input hysteresis 0.3 VInput leakage current FORCEON, DIN, FORCEOFF ±0.01 ±1µAOutput voltage swing All driver outputs loaded with 3 k Ωto ground ±3.7 ±4 VOutput resistance V
CC
= 0, Driver output = ±2 V 300 10M ΩOutput short-circuit current
(2)
±25 ±60 mAOutput leakage current V
CC
= 0 or 2.25 V to 3 V, V
OUT
=±12 V, Drivers disabled ±25 µA
(1) Typical values are at V
CC
= 2.5 V, T
A
= 25 °C.(2) Short-circuit durations should be controlled to prevent exceeding the device absolute power dissipation ratings, and not more than oneoutput should be shorted at a time.
over recommended ranges of supply voltage and operating free-air temperature,V
CC
= 2.25 V to 3 V, C1–C4 = 0.1 µF, T
A
= T
MIN
to T
MAX
(unless otherwise noted) (see Figure 1 )
PARAMETER TEST CONDITIONS MIN TYP
(1)
MAX UNIT
Maximum data rate R
L
= 3 k Ω, C
L
= 1000 pF, One transmitter switching 460 kbps|t
PHL
– t
PLH
| Driver skew
(2)
100 nsV
CC
= 2.5 V, T
A
= 25 °C, R
L
= 3 k Ωto 7 k Ω,Transition-region slew rate Measured from 3 V to –3 V or –3 V to 3 V, 4 30 V/ µsC
L
= 150 pF to 2500 pF
(1) Typical values are at V
CC
= 2.5 V, T
A
= 25 °C.(2) Pulse skew is defined as |t
PLH
– t
PHL
| of each channel of the same device.
8
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Receiver Section Electrical Characteristics
Receiver Section Switching Characteristics
MAX33182.5-V 460-kbps RS-232 TRANSCEIVERWITH ±15-kV ESD PROTECTION
SLLS687 – OCTOBER 2005
over recommended ranges of supply voltage and operating free-air temperature,V
CC
= 2.25 V to 3 V, C1–C4 = 0.1 µF, T
A
= T
MIN
to T
MAX
(unless otherwise noted) (see Figure 4 )
PARAMETER TEST CONDITIONS MIN TYP
(1)
MAX UNIT
Input voltage range –25 25 VInput threshold low T
A
= 25 °C 0.3 ×V
CC
VInput threshold high T
A
= 25 °C 0.7 ×V
CC
VInput hysteresis 0.3 VInput resistance T
A
= 25 °C 3 5 7 k ΩOutput leakage current ±0.05 ±10 µAOutput voltage low I
OUT
= 0.5 mA 0.1 ×V
CC
VOutput voltage high I
OUT
= –0.5 mA 0.9 ×V
CC
V
(1) Typical values are at V
CC
= 2.5 V, T
A
= 25 °C.
over recommended ranges of supply voltage and operating free-air temperature,V
CC
= 2.25 V to 3 V, C1–C4 = 0.1 µF, T
A
= T
MIN
to T
MAX
(unless otherwise noted) (see Figure 4 )
PARAMETER TEST CONDITIONS TYP
(1)
UNIT
t
PHL
0.175Receiver propagation delay RIN to ROUT, C
L
= 150 pF µst
PLH
0.175|t
PHL
– t
PLH
| Receiver skew
(2)
50 ns
(1) Typical values are at V
CC
= 2.5 V, T
A
= 25 °C.(2) Pulse skew is defined as |t
PLH
– t
PHL
| of each channel of the same device.
9
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Auto-Power-Down Plus Section Electrical Characteristics
Auto-Power-Down Plus Section Switching Characteristics
MAX3318
2.5-V 460-kbps RS-232 TRANSCEIVERWITH ±15-kV ESD PROTECTION
SLLS687 – OCTOBER 2005
over recommended ranges of supply voltage and operating free-air temperature,V
CC
= 2.25 V to 3 V, C1–C4 = 0.1 µF, T
A
= T
MIN
to T
MAX
(unless otherwise noted) (see Figure 4 )
PARAMETER TEST CONDITIONS MIN MAX UNIT
Positive threshold 2.7Receiver input threshold to INVALID high VNegative threshold –2.7Receiver input threshold INVALID low –0.3 0.3 VINVALID, READY voltage low I
OUT
= 0.5 mA 0.1 ×V
CC
VINVALID, READY voltage high I
OUT
= –0.5 mA 0.8 ×V
CC
V
over recommended ranges of supply voltage and operating free-air temperature,V
CC
= 2.25 V to 3 V, C1–C4 = 0.1 µF, T
A
= T
MIN
to T
MAX
(unless otherwise noted) (see Figure 4 )
PARAMETER TEST CONDITIONS MIN TYP
(1)
MAX UNIT
t
INVH
Receiver positive or negative threshold to INVALID high V
CC
= 2.5 V 1 µst
INVL
Receiver positive or negative threshold to INVALID low V
CC
= 2.5 V 30 µst
WU
Receiver or driver edge to driver enabled V
CC
= 2.5 V 100 µst
AUTOPRDN
Receiver or driver edge to driver shutdown V
CC
= 2.5 V 15 30 60 s
(1) Typical values are at V
CC
= 2.5 V,T
A
= 25 °C.
10
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PARAMETER MEASUREMENT INFORMATION
50 Ω
TEST CIRCUIT VOLTAGE WA VEFORMS
−3 V
−3 V
3 V
3 V
0 V
3 V
Output
Input
VOL
VOH
tTLH
Generator
(see Note B) RL
3 V
FORCEOFF
RS-232
Output
tTHL
CL
(see Note A)
SR(tr) 6 V
tTHL or tTLH
NOTES: A. CL includes probe and jig capacitance.
B. The pulse generator has the following characteristics: PRR = 250 kbit/s, ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns.
50 Ω
TEST CIRCUIT VOLTAGE WA VEFORMS
0 V
2.25 V
Output
Input
VOL
VOH
tPLH
Generator
(see Note B) RL
3 V
FORCEOFF
RS-232
Output
tPHL
CL
(see Note A)
NOTES: A. CL includes probe and jig capacitance.
B. The pulse generator has the following characteristics: PRR = 250 kbit/s, ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns.
50% 50%
1.125 V 1.125 V
TEST CIRCUIT VOLTAGE WA VEFORMS
50 Ω
−3 V
3 V
Output
Input
VOL
VOH
tPHL
Generator
(see Note B) tPLH
Output
CL
(see Note A)
NOTES: A. CL includes probe and jig capacitance.
B. The pulse generator has the following characteristics: ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns.
0 V 0 V
50% 50%
MAX33182.5-V 460-kbps RS-232 TRANSCEIVERWITH ±15-kV ESD PROTECTION
SLLS687 – OCTOBER 2005
Figure 1. Driver Slew Rate
Figure 2. Driver Pulse Skew
Figure 3. Receiver Propagation Delay Times
11
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PARAMETER MEASUREMENT INFORMATION
tWU
VCC
0
0
V+
V−
VCC
0
Driver
Inputs
Receiver
Inputs }
INVALID
Output
Driver
Outputs
VCC
Invalid
Region
Ready
Output
tINVH
tWU
tINVL
VOLTAGE WA VEFORMS
TEST CIRCUIT
50 Ω
Generator
(see Note B)
ROUT
Auto-Power-
Down Plus INVALID
DOUTDIN
CL = 30 pF
(see Note A)
2.7 V
−2.7 V
0.3 V
−0.3 V
0 V
Valid RS-232 Level, INV ALID High
Indeterminate
Indeterminate
If Signal Remains Within This Region
For More Than 30 µs, INVALID Is Low†
Valid RS-232 Level, INVALID High
†Auto power down disables drivers and reduces supply
current to 1 µA.
FORCEON
FORCEOFF
MAX3318
2.5-V 460-kbps RS-232 TRANSCEIVERWITH ±15-kV ESD PROTECTION
SLLS687 – OCTOBER 2005
Figure 4. INVALID Propagation Delay Times and Supply Enabling Time
12
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PARAMETER MEASUREMENT INFORMATION
14
1
10
15
20
9
GND
18
13
6
5
4
2
RIN1 16
DOUT2 8
V− 7
V+ 3
19
2.5 V
5k
5k
RS-232-Compatible
Outputs
RS-232-Compatible
Inputs
To Power-Management Unit
Auto-Power-
Down Plus
C1+
C1−
C2+
C2−
DIN1
DIN2
ROUT1
READY
FORCEON
17
RIN2
11
INVALID
FORCEOFF
0.1 F
+
+
+
+
+
C3
0.1 F
C4
0.1 F
C1
0.1 F
C2
0.1 F
CBYPASS VCC
12
ROUT2
DOUT1
RIN1
VCC
MAX33182.5-V 460-kbps RS-232 TRANSCEIVERWITH ±15-kV ESD PROTECTION
SLLS687 – OCTOBER 2005
Figure 5. Typical Application Circuit
13
PACKAGING INFORMATION
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
MAX3318CDB ACTIVE SSOP DB 20 70 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3318CDBE4 ACTIVE SSOP DB 20 70 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3318CDBG4 ACTIVE SSOP DB 20 70 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3318CDBR ACTIVE SSOP DB 20 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3318CDBRE4 ACTIVE SSOP DB 20 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3318CDBRG4 ACTIVE SSOP DB 20 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3318CPW ACTIVE TSSOP PW 20 70 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3318CPWE4 ACTIVE TSSOP PW 20 70 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3318CPWG4 ACTIVE TSSOP PW 20 70 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3318CPWR ACTIVE TSSOP PW 20 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3318CPWRE4 ACTIVE TSSOP PW 20 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3318CPWRG4 ACTIVE TSSOP PW 20 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3318IDB ACTIVE SSOP DB 20 70 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3318IDBE4 ACTIVE SSOP DB 20 70 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3318IDBG4 ACTIVE SSOP DB 20 70 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3318IDBR ACTIVE SSOP DB 20 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3318IDBRE4 ACTIVE SSOP DB 20 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3318IDBRG4 ACTIVE SSOP DB 20 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3318IPW ACTIVE TSSOP PW 20 70 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3318IPWE4 ACTIVE TSSOP PW 20 70 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3318IPWG4 ACTIVE TSSOP PW 20 70 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3318IPWR ACTIVE TSSOP PW 20 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3318IPWRE4 ACTIVE TSSOP PW 20 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3318IPWRG4 ACTIVE TSSOP PW 20 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
(1) The marketing status values are defined as follows:
PACKAGE OPTION ADDENDUM
www.ti.com 28-May-2007
Addendum-Page 1
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com 28-May-2007
Addendum-Page 2
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
MAX3318CDBR SSOP DB 20 2000 330.0 16.4 8.2 7.5 2.5 12.0 16.0 Q1
MAX3318CPWR TSSOP PW 20 2000 330.0 16.4 6.95 7.1 1.6 8.0 16.0 Q1
MAX3318IDBR SSOP DB 20 2000 330.0 16.4 8.2 7.5 2.5 12.0 16.0 Q1
MAX3318IPWR TSSOP PW 20 2000 330.0 16.4 6.95 7.1 1.6 8.0 16.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
MAX3318CDBR SSOP DB 20 2000 367.0 367.0 38.0
MAX3318CPWR TSSOP PW 20 2000 367.0 367.0 38.0
MAX3318IDBR SSOP DB 20 2000 367.0 367.0 38.0
MAX3318IPWR TSSOP PW 20 2000 367.0 367.0 38.0
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 2
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE
4040065 /E 12/01
28 PINS SHOWN
Gage Plane
8,20
7,40
0,55
0,95
0,25
38
12,90
12,30
28
10,50
24
8,50
Seating Plane
9,907,90
30
10,50
9,90
0,38
5,60
5,00
15
0,22
14
A
28
1
2016
6,50
6,50
14
0,05 MIN
5,905,90
DIM
A MAX
A MIN
PINS **
2,00 MAX
6,90
7,50
0,65 M
0,15
0°–ā8°
0,10
0,09
0,25
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150
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