•This PDF document was created based on the data listed on the TDK Corporation website.
•All specifications are subject to change without notice.
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Creation Date : September 05, 2016
C2012X5R0J106M125AB (TDK item description : C2012X5R0J106MT****)
Applications Commercial Grade
Feature General (Up to 50V)
Series C2012 [EIA CC0805]
Size
Length(L) 2.00mm +/-0.20mm
Width(W) 1.25mm +/-0.20mm
Thickness(T) 1.25mm +/-0.20mm
Terminal Width(B) 0.20mm Min.
Terminal Spacing(G) 0.50mm Min.
Recommended Land Pattern(PA) 1.00 to 1.30mm (Flow Soldering)<br />0.90 to 1.20mm (Reflow Soldering)
Recommended Land Pattern(PB) 1.00 to 1.20mm (Flow Soldering)<br />0.70 to 0.90mm (Reflow Soldering)
Recommended Land Pattern(PC) 0.80 to 1.10mm (Flow Soldering)<br />0.90 to 1.20mm (Reflow Soldering)
Recommended Slit Pattern(SD)
Electrical Characteristics
Capacitance 10uF +/-20%
Rated Voltage 6.3Vdc
Temperature Characteristic X5R(+/-15%)
Dissipation Factor 10% Max.
Insulation Resistance 10MΩ Min.
Other
Soldering Method Reflow, Flow
AEC Q200 No
Packing Blister (Plastic)Taping [180mm Reel]
Package Quantity 2000Pcs Min.