1 Product Index Part Number TLP104 TLP105 TLP108 TLP109 TLP109 (IGM) TLP116A TLP117 TLP118 TLP124 TLP126 TLP127 TLP130 TLP131 TLP137 TLP148G TLP151 TLP151A TLP155E TLP160G TLP160J TLP161G TLP161J TLP163J TLP165J TLP166J TLP168J TLP170A TLP170D TLP170G TLP170J TLP172A TLP172G TLP173A TLP174G TLP174GA TLP175A TLP176A TLP176D TLP176G TLP176GA TLP179D TLP180 TLP181 TLP184 TLP185 TLP190B TLP191B TLP192A TLP192G TLP197A TLP197D TLP197G TLP197GA TLP199D TLP200D TLP202A TLP202G TLP2066 TLP206A TLP206G TLP206GA TLP2095 TLP2098 TLP209D TLP2105 TLP2108 TLP2116 TLP2118E TLP2160 TLP2166A TLP2167 TLP2168 TLP2200 TLP220A TLP220D TLP220G TLP220GA TLP220J TLP221A Package SO6 MFSOP6 MFSOP6 SO6 SO6 SO6 MFSOP6 SO6 MFSOP6 MFSOP6 MFSOP6 MFSOP6 MFSOP6 MFSOP6 MFSOP6 SO6 SO6 SO6 MFSOP6 MFSOP6 MFSOP6 MFSOP6 MFSOP6 MFSOP6 MFSOP6 MFSOP6 2.54SOP4 2.54SOP4 2.54SOP4 2.54SOP4 2.54SOP4 2.54SOP4 MFSOP6 2.54SOP4 2.54SOP4 SO6 2.54SOP4 2.54SOP4 2.54SOP4 2.54SOP4 2.54SOP4 MFSOP6 MFSOP6 SO6 SO6 MFSOP6 MFSOP6 2.54SOP6 2.54SOP6 2.54SOP6 2.54SOP6 2.54SOP6 2.54SOP6 2.54SOP6 2.54SOP8 2.54SOP8 2.54SOP8 MFSOP6 2.54SOP8 2.54SOP8 2.54SOP8 MFSOP6 MFSOP6 2.54SOP8 SO8 SO8 SO8 SO8 SO8 SO8 SO8 SO8 DIP8 DIP4 DIP4 DIP4 DIP4 DIP4 DIP4 Output IC IC IC IC IC IC IC IC Transistor Transistor Darlington transistor Transistor Transistor Transistor Thyristor IC IC IC Triac Triac Triac Triac Triac Triac Triac Triac MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) MOSFET(Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) Transistor Transistor Transistor Transistor Photovoltaic Photovoltaic MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) IC MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) IC IC MOSFET (Photorelay) IC IC IC IC IC IC IC IC IC MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) Page 22 20 18 21 22 18 17 18 11 14 16 14 11 11 37 24 24 24 34 34 34 34 34 34 34 34 28 28 28 28 28 28 28 28 28 27 28 28 28 28 28 14,38 11,38 39 39 36 36 29 29 29 29 29 29 29 30 30 30 18 30 30 30 20 20 30 21 21 18 18 19 19 17 19 21 30 30 30 30 30 30 Part Number TLP222A TLP222A-2 TLP222G TLP222G-2 TLP224G TLP224G-2 TLP224GA TLP224GA-2 TLP225A TLP227A TLP227A-2 TLP227G TLP227G-2 TLP227GA TLP227GA-2 TLP2366 TLP2367 TLP2368 TLP2403 TLP2404 TLP2405 TLP2408 TLP2409 TLP2409 (IGM) TLP2418 TLP2451 TLP2451A TLP2466 TLP2467 TLP2468 TLP2530 TLP2531 TLP2601 TLP260J TLP261J TLP2630 TLP2631 TLP2766 TLP2767 TLP2768 TLP280 TLP280-4 TLP281 TLP281-4 TLP284 TLP284-4 TLP285 TLP285-4 TLP290-4 TLP291-4 TLP3022 (S) TLP3023 (S) TLP3042 (S) TLP3043 (S) TLP3052 (S) TLP3062 (S) TLP3063 (S) TLP3064 (S) TLP3082 (S) TLP3100 TLP3110 TLP3111 TLP3113 TLP3114 TLP3115 TLP3116 TLP3118 TLP3119 TLP3120 TLP3121 TLP3122 TLP3123 TLP3125 TLP3130 TLP3131 TLP320 TLP320-2 TLP3203 TLP320-4 3 Package DIP4 DIP8 DIP4 DIP8 DIP4 DIP8 DIP4 DIP8 DIP4 DIP4 DIP8 DIP4 DIP8 DIP4 DIP8 SO6 SO6 SO6 SO8 SO8 SO8 SO8 SO8 SO8 SO8 SO8 SO8 SO8 SO8 SO8 DIP8 DIP8 DIP8 MFSOP6 MFSOP6 DIP8 DIP8 SDIP6 SDIP6 SDIP6 SOP4 SOP16 SOP4 SOP16 SOP4 SOP16 SOP4 SOP16 SO16 SO16 DIP6 DIP6 DIP6 DIP6 DIP6 DIP6 DIP6 DIP6 DIP6 2.54SOP6 2.54SOP4 2.54SOP4 2.54SOP4 2.54SOP4 2.54SOP4 2.54SOP4 2.54SOP6 2.54SOP4 2.54SOP6 2.54SOP4 2.54SOP4 2.54SOP4 2.54SOP8 2.54SOP4 2.54SOP4 DIP4 DIP8 SSOP4 DIP16 Output MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay MOSFET (Photorelay) MOSFET (Photorelay) IC IC IC IC IC IC IC IC IC IC IC IC IC IC IC IC IC IC Triac Triac IC IC IC IC IC Transistor Transistor Transistor Transistor Transistor Transistor Transistor Transistor Transistor Transistor Triac Triac Triac Triac Triac Triac Triac Triac Triac MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) Transistor Transistor MOSFET (Photorelay) Transistor Page 30 31 31 31 30 31 30 31 30 30 31 30 32 30 32 19 17 19 21 22 20 20 21 22 18 24 24 19 18 19 22 22 19 35 35 20 20 19 18 19 14,39 14 11,39 12 11,39 11 11,39 11 39 39 36,40 36,40 36,40 36,40 36,40 37,40 37,40 37,40 37,40 29 28 28 28 28 28 28 28 28 29 29 29 29 29 29 29 15 15 27 15 1 Product Index Part Number TLP3212 TLP3213 TLP3214 TLP3215 TLP3216 TLP3217 TLP3218 TLP3219 TLP3220 TLP3230 TLP3231 TLP3240 TLP3241 TLP3250 TLP3275 TLP330 TLP331 TLP3312 TLP332 TLP3375 TLP350 TLP350H TLP351 TLP351A TLP351H TLP352 TLP3542 TLP3543 TLP3544 TLP3545 TLP3546 TLP360J TLP361J TLP363J TLP371 TLP372 TLP373 TLP3762 (S) TLP3782 (S) TLP3783 (S) TLP3902 TLP3904 TLP3914 TLP3924 TLP4006G TLP4007G TLP4026G TLP4027G TLP4172G TLP4176G TLP4192G TLP4197G TLP4202G TLP4206G TLP4222G TLP4222G-2 TLP4227G TLP4227G-2 TLP4592G TLP4597G TLP504A TLP512 TLP513 TLP523 TLP523-2 TLP523-4 TLP525G TLP525G-2 TLP525G-4 TLP531 TLP532 TLP548J TLP549J TLP550 TLP551 TLP552 TLP553 TLP554 Package SSOP4 SSOP4 SSOP4 SSOP4 SSOP4 SSOP4 SSOP4 SSOP4 SSOP4 SSOP4 SSOP4 SSOP4 SSOP4 SSOP4 SSOP4 DIP6 DIP6 USOP4 DIP6 USOP4 DIP8 DIP8 DIP8 DIP8 DIP8 DIP8 DIP6 DIP6 DIP6 DIP6 DIP6 DIP4 DIP4 DIP4 DIP6 DIP6 DIP6 DIP6 DIP6 DIP6 MFSOP6 SSOP4 SSOP4 SSOP4 DIP8 DIP8 2.54SOP8 2.54SOP8 2.54SOP4 2.54SOP4 2.54SOP6 2.54SOP6 2.54SOP8 2.54SOP8 DIP4 DIP8 DIP4 DIP8 DIP6 DIP6 DIP8 DIP6 DIP6 DIP4 DIP8 DIP16 DIP4 DIP8 DIP16 DIP6 DIP6 DIP6 DIP8 DIP8 DIP8 DIP8 DIP8 DIP8 Output MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) Transistor Transistor MOSFET (Photorelay) Transistor MOSFET (Photorelay) IC IC IC IC IC IC MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) Triac Triac Triac Darlington transistor Darlington transistor Darlington transistor Triac Triac Triac Photovoltaic Photovoltaic Photovoltaic Photovoltaic MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) Transistor IC IC Darlington transistor Darlington transistor Darlington transistor Triac Triac Triac Transistor Transistor Thyristor Thyristor IC IC IC IC IC Page 27 27 27 27 27 27 27 27 27 27 27 27 27 27 27 15 12 27 12 27 24 24 24 24 24 24 31 31 31 31 31 35 35 35 16 16 16 37 37,40 37,40 38 38 38 38 33 33 33 33 32 32 32 32 33 32 32 33 33 33 32 33 12 21 19 16 16 16 35 35 35 12 12 37 37 21 21 19 21 19 Part Number TLP555 TLP557 TLP558 TLP559 TLP559 (IGM) TLP560G TLP560J TLP561G TLP561J TLP570 TLP571 TLP572 TLP590B TLP591B TLP592A TLP592G TLP597A TLP597G TLP597GA TLP598AA TLP598GA TLP620 TLP620-2 TLP620-4 TLP624 TLP624-2 TLP624-4 TLP626 TLP626-2 TLP626-4 TLP627 TLP627-2 TLP627-4 TLP628 TLP628-2 TLP628-4 TLP629 TLP629-2 TLP629-4 TLP630 TLP631 TLP632 TLP651 TLP700 TLP700H TLP701 TLP701A TLP701H TLP705 TLP705A TLP708 TLP714 TLP715 TLP716 TLP718 TLP719 TLP731 TLP732 TLP733 TLP734 TLP748J TLP750 TLP751 TLP754 TLP759 TLP759 (IGM) TLP762J TLP763J TLP781 TLP785 TLP797GA TLP797J TLP798GA 6N135 6N136 6N137 6N138 6N139 4 Package DIP8 DIP8 DIP8 DIP8 DIP8 DIP6 DIP6 DIP6 DIP6 DIP6 DIP6 DIP6 DIP6 DIP6 DIP6 DIP6 DIP6 DIP6 DIP6 DIP6 DIP6 DIP4 DIP8 DIP16 DIP4 DIP8 DIP16 DIP4 DIP8 DIP16 DIP4 DIP8 DIP16 DIP4 DIP8 DIP16 DIP4 DIP8 DIP16 DIP6 DIP6 DIP6 DIP8 SDIP6 SDIP6 SDIP6 SDIP6 SDIP6 SDIP6 SDIP6 SDIP6 SDIP6 SDIP6 SDIP6 SDIP6 SDIP6 DIP6 DIP6 DIP6 DIP6 DIP6 DIP8 DIP8 DIP8 DIP8 DIP8 DIP6 DIP6 DIP4 DIP4 DIP6 DIP6 DIP6 DIP8 DIP8 DIP8 DIP8 DIP8 Output IC IC IC IC IC Triac Triac Triac Triac Darlington transistor Darlington transistor Darlington transistor Photovoltaic Photovoltaic MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay MOSFET (Photorelay) Transistor Transistor Transistor Transistor Transistor Transistor Transistor Transistor Transistor Darlington transistor Darlington transistor Darlington transistor Transistor Transistor Transistor Transistor Transistor Transistor Transistor Transistor Transistor IC IC IC IC IC IC IC IC IC IC IC IC IC IC Transistor Transistor Transistor Transistor Thyristor IC IC IC IC IC Triac Triac Transistor Transistor MOSFET (Photorelay) MOSFET (Photorelay) MOSFET (Photorelay) IC IC IC IC IC Page 20 25 20 21 23 35 36 36 36 16 16 16 38 38 31 31 31 31 31 31 31 15,39 15,39 15 12 12 12 15 15 15 16,39 16,39 16 12 13 13 13 13 13 15 13 13 21 25 25 25 25 25 25 25 18 22 20 18 20 21 13 13 13 14 37 22 22 22 22 23 36 36 14 14 31 31 31 23 23 23 23 23 2 New Products Small Surface-Mount IC-Output Photocouplers in the SO8 Package Toshiba is expanding its portfolio of IC-output photocouplers in the small and thin SO8 package. To meet customer needs, Toshiba has released photocouplers featuring various data rates, dual-channel configurations and power device drivers. Data rate (typ.) Part Number # of Circuits Output TLP2403 TLP2404 TLP2409 TLP2405 TLP2408 TLP2105 TLP2108 TLP2466* TLP2160* TLP2418 TLP2118E TLP2468* TLP2168* TLP2116 TLP2166A TLP2467* TLP2167* 1-ch Darlington Driver Propagation Delay: 0.7 s (max) TLP2451 Driver Propagation Delay: 0.5 s (max) TLP2451A* 0.1 Mbit/s 1 Mbit/s 5 Mbit/s 15 Mbit/s to 20 Mbit/s 50 Mbit/s 1-ch 1-ch Supply Voltage Open-collector Up to 18 V 4.5 V to 30 V Up to 30 V 1-ch 1-ch 2-ch Totem-pole 4.5 V to 20 V SO8 2-ch 1-ch 2-ch 1-ch 2-ch 1-ch 2-ch 2-ch 2-ch 1-ch Totem-pole 3.3 V/5 V Open-collector 5V Open-collector 3.3 V/5 V 5 2.6 5V Totem-pole 3.3 V 6.0 1. Totem-pole 3.3 V/5 V 1-ch 0.6-A peak current 10 V to 30 V 1-ch 0.6-A peak current 10 V to 30 V 2-ch 5.1 3.9 27 SO8 *Under development. Specifications subject to change without notice. For the latest information, please contact your nearest Toshiba sales representative. IGBT/MOSFET Gate-Drive IC-Output Photocouplers with an Extended Operating Temperature Range Printed circuit boards are becoming smaller and denser as a result of product miniaturization. This is driving the need for electronic components with an extended operating temperature range. To meet this need, Toshiba has been expanding its portfolio of IC-output photocouplers that are guaranteed up to 125C instead of the conventional 100C limit. TLP351H Wide packaging options: SO6, SO8, SDIP6, DIP8 Key specifications are guaranteed over -40C to 125C (-40C to 110C for the TLP151) Low current consumption: ICC = 2 mA (max) Peak Output Current 0.6 A 2.0 A 2.5 A Part Number TLP351H* TLP701H* TLP2451 TLP2451A* TLP151* TLP151A* TLP700H* TLP350H* Package Supply Voltage (VCC) Supply Current (ICC) Input Threshold Current Propagation Delay (max) SO8 700 ns 2 mA (max) 5 mA (max) 500 ns - 700 ns - 500 ns Yes VCC 8 2+ (M2) 3- VO 6 - SO6 DIP8 (M1) - - 10 V to 30 V SO6 SDIP6 Functional Schematic (TLP2451) - DIP8 SDIP6 SO8 UVLO TLP701H 15 V to 30 V GND SHIELD 5 Yes 1: N.C. 2: Anode 3: Cathode 4: N.C. *Under development. Specifications subject to change without notice. For the latest information, please contact your nearest Toshiba sales representative. 5 5: GND 6: VO (Output) 7: N.C. 8: VCC 2 New Products General-Purpose 5-Mbit/s IC-Output Photocouplers IC-output photocouplers with a date rate of 5 Mbits/s are beneficial for applications where the user needs a data rate that is not achievable with transistor-output photocouplers. In conjunction with various packaging options, the fast IC-output photocouplers simplify system design and provide extra performance for future upgrades. Pin Configuration MFSOP6 SDIP6 SO8 Part Number # of Channels Logic Polarity TLP105 TLP108 TLP715 TLP718 TLP2405 TLP2408 TLP2105 TLP2108 1-ch Positive 1-ch Negative 1-ch Positive 1-ch Negative 1-ch Positive 1-ch Negative 2-ch Positive 2-ch Negative 4.4 VCC 3 GND 1: Anode 3: Cathode 4: GND 5: VO (Output) 6: VCC 6 5 Packaging options: MFSOP6, SDIP6, SO8 Available in positive and negative polarity versions. Key specifications guaranteed over -40C to 100C Low input current: 1.6 mA max (3 mA for the TLP715 and TLP718) Totem-pole output: Eliminates the need for an external load resistor. Wide supply voltage range: 4.5 V to 20 V Available in dual-channel versions (TLP2105/TLP2108) EN60747-5-2-certified Package 1 SHIELD 4 TLP105 1 VCC 2 7 6 3 4 1: Anode 1 2: Cathode 1 3: Cathode 2 4: Anode 2 5: GND 6: Output 2 7: Output 1 8: VCC 8 GND SHIELD 5 TLP2105 3.6 2.6 6.8 4.5 8 7.0 7 9.7 1. 27 MFSOP6 5.1 2.6 4.0 1.2 5 3.9 1. 6.0 27 SDIP6 SO8 IC-Output Photocouplers for IPM Drive Applications Toshiba offers IC-output photocouplers ideal for IPM drive applications. Compared to the conventional TLP114A (IGM), these IC-output photocouplers provide shorter propagation delay times, a wider operating temperature range and digital output. Thus, they help to simplify system design and improve system performance. The TLP104 and TLP2404 in a small surface-mount package are now available in mass-production quantities, while those in the SDIP6 and DIP8 packages will shortly be available. Wide packaging options: SO6, SO8, SDIP6, DIP8 Key specifications are guaranteed over -40C to 125C. Low current consumption: 5 mA (max) Wide supply voltage range: 4.5 to 30 V Propagation delay times: tpHL = 400 ns (max), tpLH = 550 ns (max) Propagation delay skew: |tpHL - tpLH| = 400 ns (max) SO6 Functional Schematic (TLP104) VCC 6 1+ Part Number Package TLP104 TLP2404 TLP714* TLP754* SO6 Small surface-mount package with a 2.3-mm PCB mounted height (max) SO8 Standard 8-pin small surface-mount package SDIP6 DIP8 Feature 5 VO 3- GND Small surface-mount SDIP6 package SHIELD Standard DIP8 package *Under development. Specifications subject to change without notice. For the latest information, please contact your nearest Toshiba sales representative. 1: Anode 3: Cathode 6 4 4: GND 5: VO (Output) 6: VCC Photorelays in the Ultra-Small USOP4 Package: TLP33xx Series There is a strong market need for smaller photorelays. To meet this need, Toshiba has developed photorelays in the ultra-small USOP4 package, which are suitable for high-density board assembly. These photorelays help to reduce system size and cost. They are ideal for use in small measuring instruments such as semiconductor testers that require numerous relays. The TLP3312 and TLP3375 provide well-balanced off-state voltage and on-state current, making them suitable not only for tester applications but also for various applications requiring high-density board assembly such as battery-controlled devices. Part Number 5 2.8 2.2 SSOP4 1.65 5 1. 27 3.2 USOP4 USOP4 Pin Configuration Off-State Voltage (max) On-State Current (max) 60 V 0.4 A 1.5 20 pF 3 mA 50 V 0.3 A 1.5 12 pF 3 mA TLP3312 TLP3375 On-State Total Capacitance Resistance (max) (typ.) LED Trigger Current (max) 1 4 2 3 1. Anode 2. Cathode 3. Drain 4. Drain High-ION Photorelays: TLP354x Series (Under Development) Toshiba is now developing the TLP354x Series in the DIP6 package targeting applications that deal with relatively large current. Housed in the DIP6 package, the TLP354x photorelays allow B and C connections, enabling the switching of 8-A, 7-A, 6-A and 4-A dc current respectively. They are suitable for various applications such as factory equipment, power supplies and security systems. Scheduled for mass production in April Characteristic Available Under Development Symbol Unit - - VOFF V 40 20 On-State Current (max) ION A 2.5 On-State Resistance (max) RON m Isolation Voltage (min) BVS Vrms Package Peak Off-State Voltage (min) TLP3542 TLP3543 TLP3544 TLP3545 TLP3546 40 60 100 4 3.5 3 2 100 50 60 70 200 2500 2500 2500 2500 2500 DIP6 *Under development. Specifications subject to change without notice. For the latest information, please contact your nearest Toshiba sales representative. 7 2 New Products General-Purpose Photorelays Certified for Reinforced Insulation: TLP220 Series and TLP221A (Under Development) Toshiba is now developing the TLP220 Series and the TLP221 targeting factory equipment applications, and wattmeter and smart meter applications for the monitoring of electrical energy consumption. These photorelays meet the requirements for high isolation voltage between input and output, as well as for international safety standards certification. Housed in the DIP4 package, the new photorelays save board space and provide an isolation voltage of 5 kV. The TLP220 Series is available in versions with 60-V, 200-V, 350-V, 400-V and 600-V peak off-state voltages. The TLP221A provides a 60-V peak off-state voltage and a 1.5-A on-state current. Scheduled for mass production in June to August Characteristic Existing Photorelay Examples Under Development Symbol Unit - - VOFF V 60 350 60 200 On-State Current (max) ION A 0.5 0.12 0.5 On-State Resistance (max) RON 2 50 Isolation Voltage (min) BVS Vrms 5000 5000 Package Peak Off-State Voltage (min) TLP222A TLP222G TLP220A TLP220D TLP220G TLP220GA TLP220J TLP221A 350 400 600 60 0.25 0.1 0.12 0.09 1.5 2 8 50 35 60 0.2 5000 5000 5000 5000 5000 5000 DIP4 *Under development. Specifications subject to change without notice. For the latest information, please contact your nearest Toshiba sales representative. IC-Output Photocouplers in the SO6 Package Certified for Reinforced Insulation Despite the same footprint size as the MFSOP6 package, the new SO6 package provides reinforced insulation, offering clearance and creepage distances of 5 mm; an internal isolation thickness of 0.4 mm; and an isolation voltage of 3750 Vrms. Additionally, the SO6 features the maximum PCB mounted height of 2.3 mm, approximately 20% lower than the MFSOP6. This makes the photocouplers in SO6 ideal for low-profile applications. Clearance/creepage: 5 mm Thin package: 2.3 mm Internal Faraday shield: 0.4 mm Thin package: 2.3 mm Part Number TLP104 TLP109 TLP116A TLP2366* TLP118 TLP2368* TLP2367* Data rate (typ.) SO6 Output Supply voltage Input Threshold Current (max) 1 Mbit/s Open-collector, optimized for IPM drive 4.5 V to 30 V 5 mA 1 Mbit/s Open-collector 4.5 V to 30 V - 20 Mbit/s Totem-pole inverting logic 20 Mbit/s Open-collector inverting logic 50 Mbit/s Totem-pole inverting logic 5V 5 mA 3.3 V/5 V 5 mA 5V 5 mA 3.3 V/5 V 5 mA 3.3 V/5 V 5 mA *Under development. Specifications subject to change without notice. For the latest information, please contact your nearest Toshiba sales representative. 8 5 4.5 3.7 2.3 1. 27 7.0 SO6 3 Photocoupler Product Tree Photocoupler Product Tree Package DIP4 DIP4 DIP6 DIP8 DIP16 General-purpose packages Lead-forming options for surface mounting DIP6 SDIP6 SO6 SDIP6 DIP8 DIP16 SO8 SO6 SO16 SO8 SO16 SOP4 7-mm clearance/creepage; 0.4-mm isolation thickness 6-pin SMD package (1.27-mm lead pitch) 5-mm clearance/creepage; 0.4-mm isolation thickness 5-pin SMD package (1.27-mm lead pitch); low-profile 8-pin SMD package (1.27-mm lead pitch) 16-pin SMD package (1.27-mm lead pitch) SOP16 4-pin SMD package (1.27-mm lead pitch) 16-pin SMD package (1.27-mm lead pitch) MFSOP6 SMD package (1.27-mm lead pitch) SOP4 SOP16 MFSOP6 2.54SOP4 2.54SOP4 2.54SOP6 2.54SOP6 2.54SOP8 SMD package (2.54-mm lead pitch) SSOP4 SSOP4 Ultra-small; SMD package (1.27-mm lead pitch) USOP4 USOP4 Ultra-small; SMD package (1.27-mm lead pitch) 2.54SOP8 Transistor-Output Darlington-Transistor Output Transistor-Output IC-Output Logic Output Vcc Photorelays GND Photorelays VCC Output Choices GND Gate Drive Thyristor- and Triac-Output Triac Output Photovoltaic-Output Thyristor Output Photovoltaic-Output ZC 9 4 Selection Guide 1 Transistor-Output and Darlington-Transistor-Output Photocouplers Package Features Isolation Voltage Channel 2500 Vrms 3750 Vrms SOP4 SOP16 SO6 SO16 MFSOP6 DIP6 DIP4 DIP8 DIP16 Single Quad Single Quad Single Single Single Dual Quad TLP281 TLP281-4 TLP531 TLP291-4* TLP504A TLP532 TLP285 TLP131 TLP285-4 TLP185* TLP181 TLP731 General-purpose TLP732 4000 Vrms TLP733 TLP734 5000 Vrms TLP631 TLP781 TLP632 TLP785 TLP331 TLP624 TLP624-2 TLP624-4 TLP124 3750 Vrms TLP137 Low IF 5000 Vrms TLP332 High VCEO 5000 Vrms TLP628 TLP628-2 TLP628-4 High IF 5000 Vrms TLP629 TLP629-2 TLP629-4 TLP620 TLP620-2 TLP620-4 TLP626 TLP626-2 TLP626-4 TLP330 TLP320 TLP320-2 TLP320-4 TLP570 TLP523 TLP523-2 TLP523-4 TLP627 TLP627-2 TLP627-4 2500 Vrms AC input TLP290-4* TLP280 TLP280-4 TLP284 TLP284-4 TLP184* 3750 Vrms TLP130 TLP180 5000 Vrms TLP630 3750 Vrms TLP126 Low IF 5000 Vrms High IF 5000 Vrms Darlington 2500 Vrms TLP571 TLP572 2500 Vrms TLP127 TLP371 High VCEO TLP372 5000 Vrms TLP373 *Under development. Specifications subject to change without notice. For the latest information, please contact your nearest Toshiba sales representative. 10 New Products with Reinforced Insulation in a Small, Surface-Mount SOP Package ( 5-mm Clearance/Creepage and 0.4-mm Internal Isolation Thickness) Part Number Pin Configuration Features 3 4 SOP4 Lead pitch = 1.27 mm AC Input SEMKO-approved TST part recm'ed TLP284(4) 1 2 16 15 14 13 12 11 10 9 TLP284-4 1 2 3 4 5 4 6 7 8 3 SOP4 Lead pitch = 1.27 mm SEMKO-approved TST part recm'ed TLP285 (4) 1 2 16 15 14 13 12 11 10 9 TLP285-4 1 2 3 SOP16 4-channel version of the TLP284 Lead pitch = 1.27 mm AC Input SEMKO-approved 4 5 6 7 SOP16 4-channel version of the TLP285 Lead pitch = 1.27 mm SEMKO-approved 8 Rank - Y GR BL GB - CTR (%)(3) Min Max 50 600 50 150 100 300 200 600 100 600 50 600 GB 100 600 - Y GR BL GB YH GRL GRH BLL 50 50 100 200 100 75 100 150 200 600 150 300 600 600 150 200 300 400 - 50 600 GB 100 Safety Standards(2) VDE BSI TUV VCEO BVs 5 mA, 5V 80 V 3750 Vrms / (1) 5 mA, 5V 80 V 3750 Vrms / (1) 5 mA, 5V 80 V 3750 Vrms / 5 mA, 5V 80 V 3750 Vrms / VCEO BVs 1 mA, 0.5 V 80 V 3750 Vrms / 5 mA, 5V 80 V 3750 Vrms / 1 mA, 0.5 V 80 V 3750 Vrms / 5 mA, 5V 80 V 3750 Vrms / 5 mA, 5V 80 V 2500 Vrms / @IF, VCE UL/CUL (1) IEC (1) (1) 600 General-Purpose, Transistor-Output Photocouplers Part Number Pin Configuration 6 Features Mini-flat MFSOP6 Low input drive current 1 4 Mini-flat MFSOP6 Internal base connection TLP131 3 4 5 TLP137 1 3 6 4 TLP181(4) 1 3 4 3 TLP281 (4) 1 @IF, VCE UL/CUL Safety Standards(2) VDE BSI TUV IEC - 100 1200 BV 200 1200 - Y GR BL GB 50 50 100 200 100 600 150 300 600 600 - 100 1200 3 5 1 6 CTR (%)(3) Min Max 4 TLP124 6 Rank 2 Mini-flat MFSOP6 Low input drive current Internal base connection Mini-flat MFSOP6 SEMKO-approved TST part recm'ed SOP4 Lead pitch = 1.27 mm SEMKO-approved TST part recm'ed BV 200 1200 - Y GR BL GB YH GRL GRH BLL - Y GR BL GB YH GRL GRH BLL 50 50 100 200 100 75 100 150 200 50 50 100 200 100 75 100 150 200 600 150 300 600 600 150 200 300 400 600 150 300 600 600 150 200 300 400 (1) (1) (1) Note 1: The EN60747-5-2 safety standard for compact packages is different from that for standard DIP packages. Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details. Note 2: BSI and IEC: : Approved (supplementary or basic insulation) : Approved (reinforced insulation) : Design which meets safety standard/approval pending as of January 2011 EN 60065- and IEC 60065-approved, EN 60950- and IEC 60950-approved : Design which meets safety standard/approval pending as of January 2011 TUV and VDE: : Approved EN 60747-5-2-approved with option V4 or D4 For the latest information, please contact your nearest Toshiba sales representative. Note 3: Some CTR ranks may be limited in production quantities. For details, please contact your nearest Toshiba sales representative. Note 4: Product manufactured by Toshiba Semiconductor (Thailand) Co.,Ltd. [TST] is recommended. See page 38 for detail. Japan product is non-promotional item. 11 4 Selection Guide General-Purpose, Transistor-Output Photocouplers (Continued) Part Number Pin Configuration 16 15 14 13 12 11 10 Features 9 TLP281-4 1 2 3 4 6 5 6 5 7 8 4 DIP6 Low input drive current Internal base connection TLP331 1 2 3 6 5 4 SOP16 4-channel version of the TLP281 Lead pitch = 1.27 mm SEMKO-approved Rank - CTR (%)(3) Min Max 50 1 2 8 3 7 6 5 TLP504A GB 100 600 - 100 1200 BV 200 1200 - 100 1200 BV 200 1200 - 50 600 DIP8 2 1 3 6 4 5 DIP6 Internal base connection 2 6 DIP6 High EMI immunity 2 GB 100 600 600 - 50 Y 50 150 GR 100 300 BL 200 600 GB 100 600 - 50 600 Y 50 150 GR 100 300 BL 200 600 TLP624 1 2 7 6 5 DIP8 Dual-channel version of the TLP624 TLP624-2 2 3 4 16 15 14 13 12 11 10 9 DIP16 4-channel version of the TLP624 TLP624-4 2 3 4 4 5 6 7 8 3 GB 100 600 - 100 1200 BV 200 1200 - 100 1200 BV 200 1200 - 100 1200 BV 200 1200 - 50 600 DIP4 High VCEO TLP628 1 1 mA, 0.5 V 55 V 5000 Vrms / 1 mA, 0.5 V 55 V 5000 Vrms / 5 mA, 5V 55 V 2500 Vrms /- 5 mA, 5V 55 V 2500 Vrms / 5 mA, 5V 55 V 2500 Vrms / 1 mA, 5V 55 V 5000 Vrms /- 1 mA, 5V 55 V 5000 Vrms /- 1 mA, 5V 55 V 5000 Vrms /- 5 mA, 5V 350 V 5000 Vrms /- (1) 3 DIP4 Low input drive current 1 / 3 4 1 2500 Vrms IEC 4 TLP532 8 80 V Safety Standards(2) VDE BSI TUV 3 5 1 5 mA, 5V UL/CUL 4 TLP531 1 BVs 600 DIP6 Low input drive current TLP332 VCEO @IF, VCE 2 GB 100 600 Note 1: The EN60747-5-2 safety standard for compact packages is different from that for standard DIP packages. Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details. Note 2: BSI and IEC: : Approved (supplementary or basic insulation) : Approved (reinforced insulation) : Design which meets safety standard/approval pending as of January 2011 EN 60065- and IEC 60065-approved, EN 60950- and IEC 60950-approved : Design which meets safety standard/approval pending as of January 2011 TUV and VDE: : Approved EN 60747-5-2-approved with option V4 or D4 For the latest information, please contact your nearest Toshiba sales representative. Note 3: Some CTR ranks may be limited in production quantities. For details, please contact your nearest Toshiba sales representative. 12 General-Purpose, Transistor-Output Photocouplers (Continued) Part Number Pin Configuration 8 7 6 Features 5 DIP8 Dual-channel version of the TLP628 TLP628-2 2 1 3 4 16 15 14 13 12 11 10 DIP16 4-channel version of the TLP628 2 3 4 5 4 6 7 1 2 7 6 2 3 3 6 5000 Vrms /- 5 mA, 5V 350 V 5000 Vrms /- IEC 600 GB 100 600 - 50 600 100 600 DIP4 High input current I F = 150 mA - 20 80 100 mA, 1V 55 V 5000 Vrms /- DIP8 Dual-channel version of the TLP629 - 20 80 100 mA, 1V 55 V 5000 Vrms /- DIP16 4-channel version of the TLP629 - 20 80 100 mA, 1V 55 V 5000 Vrms /- - 50 600 GB 100 600 5 mA, 5V 55 V 5000 Vrms / GR 100 300 - 50 600 GB 100 600 5 mA, 5V 55 V 5000 Vrms / GR 100 300 - 50 600 GB 100 600 5 mA, 5V 55 V 4000 Vrms / 5 mA, 5V 55 V 4000 Vrms / 5 mA, 5V 55 V 4000 Vrms /- 9 4 5 5 6 7 8 4 DIP6 Internal base connection TLP631 1 2 3 6 5 4 DIP6 High EMI immunity TLP632 1 2 3 6 5 4 DIP6 SEMKO-approved Internal base connection TLP731 1 2 3 GR 100 300 6 5 4 - 50 600 GB 100 600 GR 100 300 - 50 600 GB 100 600 GR 100 300 DIP6 SEMKO-approved TLP732 1 2 3 6 5 4 TLP733 TLP733F 1 350 V Safety Standards(2) VDE BSI TUV 4 TLP629-4 2 5 mA, 5V UL/CUL 5 16 15 14 13 12 11 10 1 BVs 3 TLP629-2 1 50 VCEO @IF, VCE GB 8 TLP629 8 - CTR (%)(3) Min Max 9 TLP628-4 1 Rank 2 3 DIP6 SEMKO-approved Internal base connection Note 1: The EN60747-5-2 safety standard for compact packages is different from that for standard DIP packages. Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details. Note 2: BSI and IEC: : Approved (supplementary or basic insulation) : Approved (reinforced insulation) : Design which meets safety standard/approval pending as of January 2011 EN 60065- and IEC 60065-approved, EN 60950- and IEC 60950-approved : Design which meets safety standard/approval pending as of January 2011 TUV and VDE: : Approved EN 60747-5-2-approved with option V4 or D4 For the latest information, please contact your nearest Toshiba sales representative. Note 3: Some CTR ranks may be limited in production quantities. For details, please contact your nearest Toshiba sales representative. 13 4 Selection Guide General-Purpose, Transistor-Output Photocouplers (Continued) Part Number Pin Configuration 6 5 Features 4 DIP6 SEMKO-approved TLP734 TLP734F 2 1 3 4 3 DIP 4 High isolation voltage UL-approved (double protection) TLP781(6) TLP781F(6) 2 1 4 3 DIP 4 High isolation voltage UL-approved (double protection) TLP785*(6) TLP785F*(6) 1 2 Rank CTR (%)(3) Min Max @IF, VCE - 50 600 GB 100 600 GR 100 300 - 50 600 Y 50 150 GR 100 300 BL 200 600 GB 100 600 YH 75 150 200 GRL 100 GRH 150 300 BLL 200 400 - 50 600 Y 50 150 GR 100 300 BL 200 600 GB 100 600 YH 75 150 200 GRL 100 GRH 150 300 BLL 200 400 Rank CTR (%)(3) Min Max Safety Standards(2) VDE BSI TUV IEC Safety Standards(2) VDE BSI TUV IEC VCEO BVs 5 mA, 5V 55 V 4000 Vrms 5 mA, 5V 80 V 5000 Vrms 5 mA, 5V 80 V 5000 Vrms VCEO BVs 1 mA, 0.5 V 80 V 3750 Vrms / 5 mA, 5V 80 V 3750 Vrms / 5 mA, 5V 80 V 3750 Vrms / (1) (1) 5 mA, 5V 80 V 2500 Vrms / (1) (1) 5 mA, 5V 80 V 2500 Vrms / UL/CUL /- (5) / (5) / AC-Input, Transistor-Output Photocouplers Part Number Pin Configuration 6 Features 4 Mini-flat MFSOP6 AC input Low input drive current TLP126 1 5 4 Mini-flat MFSOP6 AC input Internal base connection TLP130 1 3 6 4 Mini-flat MFSOP6 AC input SEMKO-approved TST part recm'ed TLP180(4) 1 3 4 3 SOP4 Lead pitch = 1.27 mm AC input SEMKO-approved TST part recm'ed TLP280(4) 1 2 16 15 14 13 12 11 10 9 TLP280-4 2 3 100 1200 - 50 600 UL/CUL 3 6 1 - @IF, VCE 4 5 6 7 8 SOP16 4-channel version of the TLP280 Lead pitch = 1.27 mm AC input SEMKO-approved GB 100 600 - 50 600 Y 50 150 GR 100 300 BL 200 600 GB 100 600 - 50 600 Y 50 150 GR 100 300 BL GB 200 100 600 600 - 50 600 GB 100 (1) 600 *Under development. Specifications subject to change without notice. For the latest information, please contact your nearest Toshiba sales representative. Note 1: The EN60747-5-2 safety standard for compact packages is different from that for standard DIP packages. Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details. Note 2: BSI and IEC: : Approved (supplementary or basic insulation) : Approved (reinforced insulation) : Design which meets safety standard/approval pending as of January 2011 EN 60065- and IEC 60065-approved, EN 60950- and IEC 60950-approved : Design which meets safety standard/approval pending as of January 2011 TUV and VDE: : Approved EN 60747-5-2-approved with option V4 or D4 For the latest information, please contact your nearest Toshiba sales representative. Note 3: Some CTR ranks may be limited in production quantities. For details, please contact your nearest Toshiba sales representative. Note 4: Product manufactured by Toshiba Semiconductor (Thailand) Co.,Ltd. [TST] is recommended. See page 38 for detail. Japan product is non-promotional item. Note 5: For safety standard compliance criteria including the operating temperature conditions, please contact your nearest Toshiba representative. Note 6: About the package dimensions and lead form options, see each datasheet. 14 AC-Input, Transistor-Output Photocouplers (Continued) Part Number Pin Configuration 4 Features CTR (%)(3) Max Min @IF, VCE VCEO BVs UL/CUL Safety Standards(2) TUV VDE BSI IEC 3 TLP320 8 Rank 1 2 7 6 DIP4 High input current AC input I F = 150 mA - 20 80 100 mA, 55 V 1V 5000 Vrms / DIP8 Dual-channel version of the TLP320 - 20 80 100 mA, 1V 55 V 5000 Vrms / DIP16 4-channel version of the TLP320 - 20 80 100 mA, 1V 55 V 5000 Vrms / DIP6 High input current AC input I F = 150 mA Internal base connection - 20 80 100 mA, 1V 55 V 5000 Vrms / 5 mA, 5V 55 V 5000 Vrms / 5 mA, 5V 55 V 5000 Vrms / 5 mA, 5V 55 V 5000 Vrms / 1200 1 mA, 0.5 V 55 V 5000 Vrms /- 1200 1 mA, 0.5 V 55 V 5000 Vrms /- 1200 1 mA, 0.5 V 55 V 5000 Vrms /- 600 5 mA, 5V 55 V 5000 Vrms / 5 TLP320-2 1 2 3 4 16 15 14 13 12 11 10 9 TLP320-4 1 2 3 4 6 5 6 5 8 7 4 TLP330 2 1 3 4 3 DIP4 AC input SEMKO-approved TST part recm'ed TLP620(4) TLP620F(4) 8 1 2 7 6 5 DIP8 Dual-channel version of the TLP620 SEMKO-approved TST part recm'ed TLP620-2(4) TLP620F-2(4) 1 2 3 4 16 15 14 13 12 11 10 TLP620-4 2 3 4 5 4 6 7 1 2 7 6 5 DIP8 Dual-channel version of the TLP626 TLP626-2 2 3 4 16 15 14 13 12 11 10 9 DIP16 4-channel version of the TLP626 TLP626-4 1 2 3 6 4 5 5 6 7 4 TLP630 1 150 GR 100 300 BL 200 600 GB 100 600 - 50 600 GB 100 600 - 50 600 GB 100 - 100 600 3 DIP4 Low input drive current AC input 1 600 50 8 TLP626 8 50 9 DIP16 4-channel version of the TLP620 1 - Y 2 3 BV 200 - 100 BV 200 - 100 BV 200 - 50 8 DIP6 AC input High isolation voltage Internal base connection GB 100 Note 1: The EN60747-5-2 safety standard for compact packages is different from that for standard DIP packages. Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details. Note 2: BSI and IEC: : Approved (supplementary or basic insulation) : Approved (reinforced insulation) : Design which meets safety standard/approval pending as of January 2011 EN 60065- and IEC 60065-approved, EN 60950- and IEC 60950-approved : Design which meets safety standard/approval pending as of January 2011 TUV and VDE: : Approved EN 60747-5-2-approved with option V4 or D4 For the latest information, please contact your nearest Toshiba sales representative. Note 3: Some CTR ranks may be limited in production quantities. For details, please contact your nearest Toshiba sales representative. Note 4: Product manufactured by Toshiba Semiconductor (Thailand) Co.,Ltd. [TST] is recommended. See page 38 for detail. Japan product is non-promotional item. 15 4 Selection Guide Darlington-Transistor-Output Photocouplers Part Number Pin Configuration 6 Features VCE (sat) CTR (%)(3) Min @IF, VCE Max @IC, IF BVs UL/CUL Safety Standards(2) VDE BSI TUV IEC 4 Mini-flat 1000 1 mA, 1V 1.2 V 100 mA, 10 mA 300 V 2500 Vrms / DIP6 High VCEO SEMKO-approved Internal base connection 1000 1 mA, 1V 1.2 V 100 mA, 10 mA 300 V 5000 Vrms / DIP6 High VCEO SEMKO-approved 1000 1 mA, 1V 1.2 V 100 mA, 10 mA 300 V 5000 Vrms / DIP6 High VCEO Long emitter-collector distance SEMKO-approved 1000 1 mA, 1V 1.2 V 100 mA, 10 mA 300 V 5000 Vrms / DIP4 500 1 mA, 1V 1V 50 mA, 10 mA 55 V 2500 Vrms / DIP8 Dual-channel version of the TLP523 500 1 mA, 1V 1V 50 mA, 10 mA 55 V 2500 Vrms / DIP16 4-channel version of the TLP523 500 1 mA, 1V 1V 50 mA, 10 mA 55 V 2500 Vrms / DIP6 High EMI immunity 1000 1 mA, 1V 1.2 V 100 mA, 10 mA 35 V 2500 Vrms / DIP6 Internal base connection 1000 1 mA, 1V 1.2 V 100 mA, 10 mA 35 V 2500 Vrms /- DIP6 Built-in RBE 1000 1 mA, 1.2 V 1.2 V 100 mA, 10 mA 55V 2500 Vrms /- DIP4 High VCEO SEMKO-approved TST part recm'ed 1000 1 mA, 1V 1.2 V 100 mA, 10 mA 300 V 5000 Vrms / DIP8 Dual-channel version of the TLP627 SEMKO-approved TST part recm'ed 1000 1 mA, 1V 1.2 V 100 mA, 10 mA 300 V 5000 Vrms / DIP16 4-channel version of the TLP627 1000 1 mA, 1V 1.2 V 100 mA, 10 mA 300 V 5000 Vrms / MFSOP6 High VCEO TLP127 (1) 3 1 6 5 4 TLP371 2 5 1 6 3 4 TLP372 1 6 2 3 4 TLP373 1 2 3 4 3 TLP523 2 6 1 7 8 VCEO 5 TLP523-2 1 2 3 4 16 15 14 13 12 11 10 9 TLP523-4 1 2 3 4 6 5 6 5 7 8 4 TLP570 1 2 3 6 5 4 TLP571 2 5 1 6 3 4 TLP572 1 2 3 4 3 TLP627(4) 1 7 8 2 6 5 TLP627-2(4) 1 2 3 4 16 15 14 13 12 11 10 9 TLP627-4 1 2 3 4 5 6 7 8 Note 1: The EN60747-5-2 safety standard for compact packages is different from that for standard DIP packages. Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details. Note 2: BSI and IEC: : Approved (supplementary or basic insulation) : Approved (reinforced insulation) : Design which meets safety standard/approval pending as of January 2011 EN 60065- and IEC 60065-approved, EN 60950- and IEC 60950-approved : Design which meets safety standard/approval pending as of January 2011 TUV and VDE: : Approved EN 60747-5-2-approved with option V4 or D4 For the latest information, please contact your nearest Toshiba sales representative. Note 3: Some CTR ranks may be limited in production quantities. For details, please contact your nearest Toshiba sales representative. Note 4: Product manufactured by Toshiba Semiconductor (Thailand) Co.,Ltd. [TST] is recommended. See page 38 for detail. Japan product is non-promotional item. 16 2 Photocouplers for Logic Signal Transmission Package Features Data Rate (Typ.) Output 0.3 Mbit/s Open-collector (Darlington) MFSOP6 (TLP112)*2 (TLP112A)*2 (TLP114A)*2 1 Mbit/s SO6 TLP109 SO8 1ch TLP2403 2ch TLP2409 SDIP6 TLP719 DIP8 1ch TLP553 DIP6 TLP512 Open-collector (TLP114A(IGM))*3 TLP109(IGM) TLP2409(IGM) TLP2404 TLP104 IPM drive Dual polarity input 5 Mbit/s TLP2405 TLP2408 TLP105 TLP108 TLP2095 TLP2098 Totem-pole TLP714*1 TLP2105 TLP2108 TLP550 TLP551 TLP559 TLP651 TLP750 TLP751 TLP759 TLP559(IGM) TLP759(IGM) TLP754*1 15 to 20 Mbit/s 50 Mbit/s (TLP113)*4 (TLP115)*4 (TLP115A)*4 5 V (TLP116)*5 TLP116A Totem3.3 V TLP2066 pole TLP2366*1 TLP2466*1 3.3 V/5 V TLP118 5V TLP2418 Opencollector 3.3 V/5 V TLP2368*1 TLP2468*1 TLP117 5V Totempole TLP2367*1 TLP2467*1 3.3 V/5 V TLP2530 TLP2531 6N138 6N139 6N135 6N136 TLP715 TLP718 TLP555 TLP558 TLP2200 TLP552 TLP554 TLP2601 3-state 10 Mbit/s JEDEC 2ch TLP513 Open-collector TLP2630 TLP2631 6N137 TLP2116 TLP716 TLP2166A TLP2160*1 TLP2766*1 TLP708 TLP2118 TLP2168*1 TLP2768*1 TLP2167*1 TLP2767*1 *1: Under development as of January 2011. For the latest information, please contact your nearest Toshiba sales representative. *2: TLP109 recommended *3: TLP109(IGM) recommended *4: TLP118 recommended *5: TLP116A recommended Photocouplers for Logic Signal Transmission at 40 to 50 Mbit/s (Typ.) Data Rate (NRZ) (Typ.) Output Form 50 Mbit/s SO8 VCC = 3.3 or 5 V Topr (max) 125C SO6 (reinforced insulation) VCC = 3.3 or 5 V Topr (max) 125C Pin Configuration 5 4 Vcc GND SHIELD 6 TLP117 1 3 7 6 VCC TLP2167* 1 2 Vcc 6 TLP2367* 1 3 5 Features Safety Standards(2) IFHL (Max) BVs Totem pole output (Inverter logic) 5 mA 3750 Vrms / 40 Mbit/s Totem pole output (Inverter logic) 5 mA 2500 Vrms / (1) 40 Mbit/s Totem pole output (Inverter logic) 5 mA 3750 Vrms / (2) UL/cUL TUV VDE (1) (1) BSI IEC Mini-flat MFSOP6 Propagation delay time: 30 ns (max) VCC = 5 V 5 GND SHIELD 8 4 4 GND SHIELD Part Number 3 *Under development. Specifications subject to change without notice. For the latest information, please contact your nearest Toshiba sales representative. Note 1: The EN60747-5-2 safety standard for compact packages is different from that for standard DIP packages. Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details. Note 2: BSI and IEC: : Approved (supplementary or basic insulation) : Approved (reinforced insulation) : Design which meets safety standard/approval pending as of January 2011 EN 60065- and IEC 60065-approved, EN 60950- and IEC 60950-approved : Design which meets safety standard/approval pending as of January 2011 TUV and VDE: : Approved EN 60747-5-2-approved with option V4 or D4 For the latest information, please contact your nearest Toshiba sales representative. 17 4 Selection Guide Photocouplers for Logic Signal Transmission at 40 to 50 Mbit/s (Typ.) (Continued) Part Number Data Rate (NRZ) (Typ.) Output Form SO8 VCC = 3.3 or 5 V Topr (max) 125C 40 Mbit/s SDIP6 (reinforced insulation) VCC = 3.3 or 5 V Topr (max) 125C 40 Mbit/s Pin Configuration 7 6 VCC TLP2467* 2 1 3 Totem pole output (Inverter logic) 5 mA 3750 Vrms / Totem pole output (Inverter logic) 5 mA 5000 Vrms / IFHL (Max) BVs UL/cUL TUV VDE BSI IEC (1) 4 Vcc TLP2767* 1 BVs 4 5 GND SHIELD 6 Safety Standards(2) IFHL (Max) 5 GND SHIELD 8 Features 3 2 Photocouplers for Logic Signal Transmission at 15 to 20 Mbit/s (Typ.) Part Number 5 Output Form SO6 (reinforced insulation) High speed: 20 Mbit/s VCC = 5 V 60 ns Totem pole output (Inverter logic) 5 mA 3750 Vrms / (1) (1) Vcc TLP116A SO8 High speed: 15 Mbit/s VCC = 5 V Dual-channel version 75 ns Totem pole output (Inverter logic) 5 mA 2500 Vrms / (1) (1) 6 5 VCC GND SHIELD 7 TLP2116 2 3 SDIP6 High speed: 15 Mbit/s VCC = 5 V High isolation voltage 75 ns Totem pole 6.5 mA output (Inverter logic) 5000 Vrms / SO6 (reinforced insulation) High speed: 20 Mbit/s VCC = 5 V Topr = 125C (max) 60 ns Open-collector (Inverter logic) 5 mA 3750 Vrms / (1) 1 SO8 High speed: 15 Mbit/s VCC = 5 V 75 ns Open-collector (Inverter logic) 5 mA 3750 Vrms / (1) SO8 High speed: 15 Mbit/s VCC = 5 V 75 ns Open-collector (Inverter logic) 5 mA 2500 Vrms / (1) 4 VCC GND 5 TLP118 1 3 6 VCC TLP2418* 2 3 4 8 7 6 5 VCC GND SHIELD 1 TLP2118E* 2 3 SDIP6 High speed: 15 Mbit/s VCC = 5 V High isolation voltage 75 ns Open-collector (Inverter logic) 5 mA 5000 Vrms / 1 Vcc TLP2066 1 2 5 SHIELD GND 4 3 60 ns Totem pole output (Inverter logic) 5 mA 3750 Vrms / 4 GND SHIELD TLP708* 6 4 5 VCC 6 IEC 5 GND SHIELD 7 1 BSI 3 2 6 8 VDE 4 Vcc TLP716 TLP716F 4 5 GND SHIELD 6 SHIELD 1 UL/cUL TUV 3 1 8 Features 4 GND SHIELD 6 Safety Standards(2) Propagation Delay Time (Max) Pin Configuration Mini-flat MFSOP6 High speed: 20 Mbit/s VCC = 3.3 V (1) (1) 3 *Under development. Specifications subject to change without notice. For the latest information, please contact your nearest Toshiba sales representative. Note 1: The EN60747-5-2 safety standard for compact packages is different from that for standard DIP packages. Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details. Note 2: BSI and IEC: : Approved (supplementary or basic insulation) : Approved (reinforced insulation) : Design which meets safety standard/approval pending as of January 2011 EN 60065- and IEC 60065-approved, EN 60950- and IEC 60950-approved : Design which meets safety standard/approval pending as of January 2011 TUV and VDE: : Approved EN 60747-5-2-approved with option V4 or D4 For the latest information, please contact your nearest Toshiba sales representative. 18 Photocouplers for Logic Signal Transmission at 15 to 20 Mbit/s (Typ.) (Continued) Part Number Pin Configuration 7 6 5 VCC GND SHIELD 8 TLP2160* 2 3 4 8 7 6 5 VCC GND SHIELD 1 TLP2168* 2 3 4 5 Vcc TLP2366* 5 VCC TLP2368* 1 UL/cUL TUV VDE SO8 VCC = 3.3 or 5 V Topr = 125C (max) Dual-channel version 20 Mbit/s Totem pole output 3.5 mA (Inverter logic) 2500 Vrms / (1) SO8 VCC = 3.3 or 5 V Topr = 125C (max) Dual-channel version 20 Mbit/s Open-collector (Inverter logic) 3750 Vrms / (1) SO6 (reinforced insulation) VCC = 3.3 or 5 V Topr = 125C (max) 20 Mbit/s Totem pole output 3.5 mA (Inverter logic) 3750 Vrms / (1) SO6 (reinforced insulation) VCC = 3.3 or 5 V Topr = 125C (max) 20 Mbit/s Open-collector (Inverter logic) 3750 Vrms / (1) SO8 VCC = 3.3 or 5 V Topr = 125C (max) 20 Mbit/s Totem pole output 3.5 mA (Inverter logic) 3750 Vrms / (1) SO8 VCC = 3.3 or 5 V Topr = 125C (max) 20 Mbit/s Open-collector (Inverter logic) 3750 Vrms / (1) SDIP6 VCC = 3.3 or 5 V Topr = 125C (max) 20 Mbit/s Totem pole output 3.5 mA (Inverter logic) 5000 Vrms / SDIP6 VCC = 3.3 or 5 V Topr = 125C (max) 20 Mbit/s Open-collector (Inverter logic) 5 mA 5000 Vrms / SO8 Propagation delay time: 75 ns VCC = 3.3 V Dual-channel version 15 Mbit/s Totem pole output (Inverter logic) 3 mA 2500 Vrms / IFHL, IFLH (Max) BVs 5 mA BSI IEC 5 mA 5 VCC GND SHIELD 6 TLP2466* 2 3 4 7 6 5 VCC GND SHIELD 1 8 TLP2468 2 3 4 Vcc TLP2766* 2 3 6 5 4 TLP2768* 2 3 6 5 VCC GND SHIELD 7 SHIELD VCC GND 1 1 TLP2166A 2 5 mA 4 5 GND SHIELD 6 1 Safety Standards(2) BVs 3 7 8 IFHL (Max) 4 GND 6 1 Output Form 3 1 8 Data Rate (NRZ) (Typ.) 4 GND SHIELD 6 SHIELD 1 Features 3 4 (1) Photocouplers for Logic Signal Transmission at 10 Mbit/s (Typ.) Part Number Pin Configuration 5 VCC TLP513 1 3 2 6 TLP552 2 3 5 VCC TLP554 3 4 7 6 5 VCC GND 2 8 TLP2601 2 3 SHIELD 1 1 Safety Standards(2) UL/cUL TUV VDE BSI IEC DIP6 6-pin package version of the TLP552 VCC = 5 V 120 ns Open-collector (Topr = 25C) 5 mA 2500 Vrms /- DIP8 Logic output VCC = 5 V 120 ns Open-collector (Topr = 25C) 5 mA 2500 Vrms /- DIP8 High CMR version of the TLP552 VCC = 5 V 120 ns Open-collector (Topr = 25C) 5 mA 2500 Vrms / DIP8 High CMR VCC = 5 V 75 ns Open-collector (Topr = 25C) 5 mA 2500 Vrms / 4 6 GND 7 SHIELD 1 8 Output Form 5 GND 7 VCC 8 Propagation Delay Time (Max) 4 GND 6 Features 4 *Under development. Specifications subject to change without notice. For the latest information, please contact your nearest Toshiba sales representative. Note 1: The EN60747-5-2 safety standard for compact packages is different from that for standard DIP packages. Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details. Note 2: BSI and IEC: : Approved (supplementary or basic insulation) : Approved (reinforced insulation) : Design which meets safety standard/approval pending as of January 2011 EN 60065- and IEC 60065-approved, EN 60950- and IEC 60950-approved : Design which meets safety standard/approval pending as of January 2011 TUV and VDE: : Approved EN 60747-5-2-approved with option V4 or D4 For the latest information, please contact your nearest Toshiba sales representative. 19 4 Selection Guide Photocouplers for Logic Signal Transmission at 10 Mbit/s (Typ.) (Continued) Part Number IFHL, IFLH (Max) BVs DIP8 75 ns Dual-channel version of Open-collector the 6N137 and the TLP552 (Topr = 25C) VCC = 5 V 5 mA 2500 Vrms / DIP8 High CMR Dual-channel version of the TLP554 VCC = 5 V 5 mA 2500 Vrms / IFHL, IFLH (Max) BVs 1.6 mA 3750 Vrms / (1) (1) Totem pole output 1.6 mA (Inverter logic) 3750 Vrms / (1) (1) 1.6 mA 3750 Vrms / (1) Totem pole output 1.6 mA (Inverter logic) 3750 Vrms / (1) 3-state (Buffer logic) Pin Configuration 7 6 5 VCC GND 8 TLP2630 2 3 4 7 6 5 VCC GND SHIELD 1 8 TLP2631 2 1 3 4 Features Propagation Delay Time (Max) Output Form 75 ns Open-collector (Topr = 25C) Safety Standards(2) UL/cUL TUV VDE BSI IEC Photocouplers for Logic Signal Transmission at 5 Mbit/s (Typ.) Pin Configuration 5 4 Vcc TLP105 1 6 6 5 VCC GND SHIELD 7 TLP2405 2 3 4 8 7 6 5 VCC GND SHIELD 1 TLP2408 2 3 4 7 6 5 2 3 4 8 7 6 5 2 3 Vcc 1 6 TLP2098 1 GND SHIELD GND SHIELD GND 3 4 Totem pole output (Buffer logic) UL/cUL TUV VDE BSI IEC 250 ns SO8 VCC = 4.5 to 20 V Low input operation IPM drive 250 ns SO8 VCC = 4.5 to 20 V Low input operation IPM drive 250 ns Totem pole output (Buffer logic) DIP8 Low input current VCC = 4.5 to 20 V 400 ns (Topr = 25C) 1.6 mA 2500 Vrms / DIP8 Inverting logic version of the TLP555 VCC = 4.5 to 20 V 400 ns 3-state 1.6 mA (Topr = 25C) (Inverter logic) 2500 Vrms / SDIP6 IPM drive High CMR VCC = 4.5 to 20 V 250 ns Totem pole output (Buffer logic) 3 mA 5000 Vrms / SDIP6 IPM drive High CMR VCC = 4.5 to 20 V 250 ns Totem pole output (Inverter logic) 3 mA 5000 Vrms / 250 ns Totem pole output (Buffer logic) 3 mA 3750 Vrms / (1) 250 ns Totem pole output (Inverter logic) 3 mA 3750 Vrms / (1) Mini-flat SHIELD TLP2095 250 ns Safety Standards(2) 3 4 2 5 Vcc 1 6 Output Form 4 2 5 Vcc 1 6 4 5 Vcc 6 3 4 5 GND 1 SHIELD VCC GND 1 TLP558 TLP718 TLP718F SHIELD VCC GND 1 8 TLP555 TLP715 TLP715F MFSOP6 VCC = 4.5 to 20 V Low input operation IPM drive 3 1 Propagation Delay Time (Max) Mini-flat GND SHIELD Vcc TLP108 8 MFSOP6 VCC = 4.5 to 20 V Low input operation IPM drive 3 4 5 Features Mini-flat GND SHIELD 6 3 MFSOP6 Dual polarity input version of the TLP105 VCC = 3 to 20 V Mini-flat SHIELD Part Number MFSOP6 Dual polarity input version of the TLP108 VCC = 3 to 20 V Note 1: The EN60747-5-2 safety standard for compact packages is different from that for standard DIP packages. Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details. Note 2: BSI and IEC: : Approved (supplementary or basic insulation) : Approved (reinforced insulation) : Design which meets safety standard/approval pending as of January 2011 EN 60065- and IEC 60065-approved, EN 60950- and IEC 60950-approved : Design which meets safety standard/approval pending as of January 2011 TUV and VDE: : Approved EN 60747-5-2-approved with option V4 or D4 For the latest information, please contact your nearest Toshiba sales representative. 20 Photocouplers for Logic Signal Transmission at 5 Mbit/s (Typ.) (Continued) Pin Configuration 7 6 5 VCC GND SHIELD 8 TLP2105 2 3 4 8 7 6 5 VCC GND SHIELD 1 TLP2108 2 3 4 7 6 5 VCC GND 1 8 TLP2200 1 2 3 SHIELD Part Number Propagation Delay Time (Max) Output Form SO8 Dual-channel version for the TLP105 VCC = 4.5 to 20 V 250 ns Totem pole output (Buffer logic) SO8 Dual-channel version for the TLP108 VCC = 4.5 to 20 V 250 ns DIP8 Low input current VCC = 4.5 to 20 V 400 ns Features IFHL, IFLH (Max) BVs 1.6 mA 3750 Vrms / (1) (1) Totem pole output 1.6 mA (Inverter logic) 3750 Vrms / (1) (1) 2500 Vrms / 3-state (Buffer logic) 1.6 mA Safety Standards(2) UL/cUL TUV VDE BSI IEC Safety Standards(2) UL/cUL TUV VDE BSI IEC 4 Photocouplers for Logic Signal Transmission at 1 Mbit/s (Typ.) Part Number Pin Configuration 5 TLP109 1 8 SHIELD 2 6 3 5 2 1 7 16 mA 3750 Vrms / (1) SO8 Topr = 125C(max) SO8 version of the TLP109 1 Mbit/s 20% (min) 16 mA 3750 Vrms / (1) DIP6 6-pin package version of the TLP550 1 Mbit/s 20% (min) 16 mA 2500 Vrms /- DIP8 High CMR 1 Mbit/s 16 mA 2500 Vrms / DIP8 Internal base connection 1 Mbit/s 16 mA 2500 Vrms / 3 6 5 1 2 3 4 8 7 6 5 TLP551 1 2 3 4 8 7 6 5 TLP2403 1 2 3 4 8 7 6 5 TLP553 2 3 4 7 6 5 SHIELD 1 8 TLP559 1 2 3 4 8 7 6 5 TLP651 2 3 5 10% (min) (19% min for rank 0) SO8 Low input current SO8 version of the TLP553 300 kbit/s 400% (min) 0.5 mA 3750 Vrms / DIP8 Low input drive current 300 kbit/s 400% (min) 0.5 mA 2500 Vrms /- 1 Mbit/s 20% (min) 16 mA 2500 Vrms / 16 mA 5000 Vrms / 16 mA 5000 Vrms / DIP8 High CMR version of the TLP550 DIP8 Internal base connection 1 Mbit/s SDIP6 High CMR 1 Mbit/s 10% (min) (19% min for rank 0) (1) 4 SHIELD 2 10% (min) (19% min for rank 0) 4 TLP719 TLP719F 1 20% (min) 4 TLP550 6 1 Mbit/s BVs 4 TLP512 1 SO6 (reinforced insulation) @IF 5 TLP2409 8 CTR 3 6 7 1 Data Rate (NRZ) (Typ.) 4 SHIELD 6 Features 20% (min) 3 Note 1: The EN60747-5-2 safety standard for compact packages is different from that for standard DIP packages. Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details. Note 2: BSI and IEC: : Approved (supplementary or basic insulation) : Approved (reinforced insulation) : Design which meets safety standard/approval pending as of January 2011 EN 60065- and IEC 60065-approved, EN 60950- and IEC 60950-approved : Design which meets safety standard/approval pending as of January 2011 TUV and VDE: : Approved EN 60747-5-2-approved with option V4 or D4 For the latest information, please contact your nearest Toshiba sales representative. 21 4 Selection Guide Photocouplers for Logic Signal Transmission at 1 Mbit/s (Typ.) (Continued) Part Number Pin Configuration 8 7 6 1 2 3 4 8 7 6 5 TLP751 TLP751F 2 1 3 7 7 3 4 6 5 TLP2530 1 2 3 4 8 7 6 5 TLP2531 2 1 @IF BVs Safety Standards(2) UL/cUL TUV VDE BSI IEC DIP8 High CMR SEMKO-approved 1 Mbit/s DIP8 Internal base connection SEMKO-approved 1 Mbit/s DIP8 IEC60950-compliant version of the TLP559 SEMKO-approved 16 mA 5000 Vrms / 10% (min) 16 mA 5000 Vrms / 1 Mbit/s 20% (min) 16 mA 5000 Vrms / DIP8 Dual-channel version of the 6N135 and the TLP550 1 Mbit/s 7% (min) 16 mA 2500 Vrms / DIP8 Dual-channel version of the 6N136 and the TLP550 1 Mbit/s 19% (min) 16 mA 2500 Vrms / IFHL, Propagation Delay Time Output Form/CTR IFLH (Max) (Max) BVs 10% (min) (19% min for rank 0) 5 SHIELD 2 8 CTR 4 6 TLP759 TLP759F 1 Data Rate (NRZ) (Typ.) 5 TLP750 TLP750F 8 Features 3 4 IPM-Drive Photocouplers Pin Configuration 5 7 6 3 2 6 SO6 (reinforced insulation) IPM drive Topr = 125C (max) 550 ns Open-collector 5 mA 3750 Vrms / (1) SO8 IPM drive Topr = 125C (max) SO8 version of the TLP104 550 ns Open-collector (Inverter logic) 5 mA 3750 Vrms / (1) SDIP6 (reinforced insulation) IPM drive Topr = 125C (max) High isolation voltage 550 ns Open-collector (Inverter logic) 5 mA 5000 Vrms / DIP8 IPM drive 550 ns Open-collector 5 mA 5000 Vrms / SO6 (reinforced insulation) IPM drive High CMR 800 ns 25% (min) 10 mA 3750 Vrms / (1) SO8 IPM drive High CMR 800 ns 20% (min) 10 mA 3750 Vrms / (1) 4 5 SHIELD 7 6 3 5 SHIELD TLP754* TLP754F* 3 2 TLP109(IGM) 3 1 7 6 5 SHIELD 8 TLP2409(IGM) 1 IEC 4 4 5 SHIELD 1 6 BSI 4 TLP714 TLP714F 1 8 VDE 3 5 TLP2404 1 UL/cUL TUV 4 TLP104 1 8 Safety Standards(2) SHIELD 6 Features SHIELD Part Number 2 3 4 *Under development. Specifications subject to change without notice. For the latest information, please contact your nearest Toshiba sales representative. Note 1: The EN60747-5-2 safety standard for compact packages is different from that for standard DIP packages. Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details. Note 2: BSI and IEC: : Approved (supplementary or basic insulation) : Approved (reinforced insulation) : Design which meets safety standard/approval pending as of January 2011 EN 60065- and IEC 60065-approved, EN 60950- and IEC 60950-approved : Design which meets safety standard/approval pending as of January 2011 TUV and VDE: : Approved EN 60747-5-2-approved with option V4 or D4 For the latest information, please contact your nearest Toshiba sales representative. 22 IPM-Drive Photocouplers (Continued) Part Number Pin Configuration 7 6 TLP559(IGM) 1 8 2 7 3 6 SHIELD 2 3 BVs Safety Standards(2) UL/cUL TUV VDE BSI IEC Safety Standards(2) UL/cUL TUV VDE BSI IEC DIP8 IPM drive High CMR 800 ns 25% (min) 10 mA 2500 Vrms / DIP8 IPM drive High CMR SEMKO-approved 800 ns 25% (min) 10 mA 5000 Vrms / Data Rate (NRZ) (Typ.) CTR IFHL, IFLH (Max) BVs JEDEC-compliant 1 Mbit/s 7% (min) 16 mA 2500 Vrms /- JEDEC-compliant 1 Mbit/s 19% (min) 16 mA 2500 Vrms /- JEDEC-compliant 10 Mbit/s 700% (Typ.) 5 mA 2500 Vrms /- JEDEC-compliant High CTR 300 kbit/s 300% (min) 1.6 mA 2500 Vrms /- JEDEC-compliant High CTR 300 kbit/s 400% (min) 0.5 mA 2500 Vrms /- 4 5 TLP759(IGM) TLP759F(IGM) 1 Propagation IFHL, Delay Time Output Form/CTR IFLH (Max) (Max) 5 SHIELD 8 Features 4 JEDEC-Compliant Photocouplers Part Number Pin Configuration 8 7 6 5 6N135 1 2 3 4 8 7 6 5 6N136 2 3 4 8 7 6 5 VCC GND 1 6N137 1 2 3 4 8 7 6 5 6N138 1 2 3 4 8 7 6 5 6N139 1 2 3 Features 4 Note 2: BSI and IEC: : Approved (supplementary or basic insulation) : Approved (reinforced insulation) : Design which meets safety standard/approval pending as of January 2011 EN 60065- and IEC 60065-approved, EN 60950- and IEC 60950-approved : Design which meets safety standard/approval pending as of January 2011 TUV and VDE: : Approved EN 60747-5-2-approved with option V4 or D4 For the latest information, please contact your nearest Toshiba sales representative. 3 Photocouplers for IGBT/MOSFET Gate Drive Package Output Peak Current SDIP6 0.25 A 0.45 A (max) TLP705 (High speed) 0.6 A (max) TLP701 TLP701A* TLP701H* TLP705A* 2.0 A (max) TLP700 TLP700H* 2.5 A (max) DIP8 TLP557 SO6 SO8 TLP351 TLP351A* TLP351E TLP351H* TLP151* TLP151A* TLP155E TLP2451 TLP2451A* TLP350 TLP350H* TLP352* *Under development. Specifications subject to change without notice. For the latest information, please contact your nearest Toshiba sales representative. 23 4 Selection Guide Photocouplers for IGBT/MOSFET Gate Drive Part Number Pin Configuration 6 5 Features SO6 (reinforced Insulation) Topr = 110C (max) Direct drive of a small-power IGBT/MOSFET TLP151A* 1 I FHL (Max) BVs Safety Standards (2) UL/cUL TUV VDE BSI IEC 0.7 s Peak output current (max): 0.6 A / 5 mA (1) 3750 Vrms 0.5 s / (1) 3 6 5 4 SO6 (reinforced Insulation) Topr = 100C (max) Direct drive of a small-power IGBT/MOSFET TLP155E 0.2 s Peak output current (max): 0.6 A 7.5 mA 3750 Vrms Peak output current (max): 0.6 A 5 mA 3750 Vrms / 3 1 7 6 5 TLP2451 TLP2451A* 1 2 3 4 8 7 6 5 TLP350 TLP350F 1 2 3 4 8 7 6 5 TLP350H* TLP350HF* 1 2 3 4 8 7 6 5 TLP351 TLP351F 1 2 3 4 8 7 6 5 TLP351A* TLP351AF* 1 2 3 4 8 7 6 5 TLP351H* TLP351HF* 1 2 3 4 8 7 6 5 TLP352* TLP352F* 1 Output 4 TLP151* 8 Propagation Delay Time (Max) 2 3 4 SO8 Topr = 125C (max) Direct drive of a small-power IGBT/MOSFET High CMR 0.7 s / 0.5 s / DIP8 Direct drive of a medium-power IGBT/MOSFET High CMR Low power dissipation 0.5 s Peak output current (max): 2.5 A 5 mA 3750 Vrms / DIP8 Topr = 125C (max) Direct drive of a medium-power IGBT/MOSFET High CMR 0.5 s Peak output current (max): 2.5 A 5 mA 3750 Vrms / DIP8 Direct drive of a medium-power IGBT/MOSFET Low power dissipation 0.7 s Peak output current (max): 0.6 A 5 mA 3750 Vrms / DIP8 Direct drive of a small-power IGBT/MOSFET Low power dissipation 0.7 s Peak output current (max): 0.6 A 5 mA 3750 Vrms / DIP8 Topr = 125C (max) Direct drive of a small-power IGBT/MOSFET High CMR 0.7 s Peak output current (max): 6.0 A 5 mA 3750 Vrms / DIP8 Direct drive of a medium-power IGBT/MOSFET Low power dissipation Topr = 125C (max) 0.2 s Peak output current (max): 2.5 A 5 mA 3750 Vrms / *Under development. Specifications subject to change without notice. For the latest information, please contact your nearest Toshiba sales representative. Note 1: The EN60747-5-2 safety standard for compact packages is different from that for standard DIP packages. Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details. Note 2: BSI and IEC: : Approved (supplementary or basic insulation) : Approved (reinforced insulation) : Design which meets safety standard/approval pending as of January 2011 EN 60065- and IEC 60065-approved, EN 60950- and IEC 60950-approved : Design which meets safety standard/approval pending as of January 2011 TUV and VDE: : Approved EN 60747-5-2-approved with option V4 or D4 For the latest information, please contact your nearest Toshiba sales representative. 24 Photocouplers for IGBT/MOSFET Gate Drive (Continued) Part Number Pin Configuration 8 7 6 2 6 3 5 BVs Constant current 5 mA output : 0.25 A 2500 Vrms / IEC DIP8 Direct drive of a power transistor 5 s SDIP6 Direct drive of a medium-power IGBT/MOSFET Low power dissipation 0.5 s Peak output current (max): 2.0 A 5 mA 5000 Vrms / SDIP6 Topr = 125C (max) Direct drive of a medium-power IGBT/MOSFET High CMR 0.5 s Peak output current (max): 2.0 A 5 mA 5000 Vrms / SDIP6 Direct drive of a medium-power IGBT/MOSFET Low power dissipation 0.7 s Peak output current (max): 0.6 A 5 mA 5000 Vrms / SDIP6 Direct drive of a small-power IGBT/MOSFET Low power dissipation 0.7 s Peak output current (max): 0.6 A 5 mA 5000 Vrms / SDIP6 Topr = 125C (max) Direct drive of a small-power IGBT/MOSFET High CMR 0.7 s Peak output current (max): 0.6 A 5 mA 5000 Vrms / SDIP6 Direct drive of a small-power IGBT/MOSFET High speed (250 kHz) Low power dissipation 0.2 s Peak output current (max): 0.45 A 8 mA 5000 Vrms / SDIP6 Direct drive of a small-power IGBT/MOSFET High speed Low power dissipation 0.2 s Peak output current (max): 0.6 A 7.5 mA 5000 Vrms / 4 1 2 3 6 5 4 TLP700H* TLP700HF* 1 2 3 6 5 4 TLP701 TLP701F 1 2 3 6 5 4 TLP701A* TLP701AF* 1 2 3 6 5 4 TLP701H* TLP701HF* 1 2 3 6 5 4 TLP705 TLP705F 1 2 3 6 5 4 TLP705A* TLP705AF* 2 Safety Standards (2) VDE BSI UL/cUL TUV I FHL (Max) Output 4 TLP700 TLP700F 1 Propagation Delay Time (Max) 5 TLP557 1 Features 3 *Under development. Specifications subject to change without notice. For the latest information, please contact your nearest Toshiba sales representative. Note 1: The EN60747-5-2 safety standard for compact packages is different from that for standard DIP packages. Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details. Note 2: BSI and IEC: : Approved (supplementary or basic insulation) : Approved (reinforced insulation) : Design which meets safety standard/approval pending as of January 2011 EN 60065- and IEC 60065-approved, EN 60950- and IEC 60950-approved : Design which meets safety standard/approval pending as of January 2011 TUV and VDE: : Approved EN 60747-5-2-approved with option V4 or D4 For the latest information, please contact your nearest Toshiba sales representative. 25 4 Selection Guide 4 Photorelays (1-Form-A and 2-Form-A) Package Features Off-State Voltage (max) (V) 20 40 50 60 80 100 200 On-State On-State Resistance Current (max) (max) () (A) 8 5 1.2 1.2 0.22 0.05 0.05 35 15 14 10 3 1.5 0.13 0.06 0.06 1.5 50 50 0.16 0.2 0.3 0.45 0.9 2.5 4 0.08 0.12 0.12 0.14 0.25 0.3 1 2.5 3.5 0.3 0.07 0.1 2 0.4 2 0.5 1.5 1.2 1.1 1 0.7 0.2 0.1 0.07 0.07 25 20 12 8 1.2 0.15 14 0.2 0.2 50 0.4 0.35 0.5 0.4 1 1.5 2.5 2.3 3 0.04 0.1 0.12 0.2 0.35 1.25 0.08 1.4 2 0.05 8 0.2 8 50 35 0.25 0.1 0.11 35 0.12 35 0.12 12 0.15 35 4 35 60 0.12 0.2 0.1 0.09 350 400 600 USOP4 SSOP4 SO6 2.54SOP4 2.54SOP6 2.54SOP8 DIP4 DIP6 DIP8 TLP3130 TLP3230 TLP3250 TLP3131 TLP3231 TLP3203 TLP3100 TLP3543* TLP3113 TLP3116 TLP3213 TLP3216 TLP3240 TLP3241 TLP3214 TLP3215 TLP3114 TLP3115 TLP3123 TLP3102 TLP3544* TLP3375 TLP3275 TLP173A TLP175A* TLP170A TLP172A TLP176A TLP192A TLP197A TLP202A TLP206A TLP220A* TLP598AA TLP222A TLP592A TLP222A-2 TLP227A TLP597A TLP227A-2 TLP3212 TLP3110 TLP225A TLP3312 TLP3122 TLP221A* TLP3542 TLP3103 TLP3545* TLP3218 TLP3217 TLP3219 TLP3118 TLP3111 TLP3119 TLP3121 TLP3120 TLP3220 TLP3105 TLP3546* TLP179D TLP170D TLP176D TLP170G TLP172G TLP199D TLP209D TLP197D TLP200D TLP220D* TLP220G* TLP192G TLP202G TLP222G TLP592G TLP174G TLP224G TLP176G TLP197G TLP206G TLP227G TLP597G TLP176GA TLP197GA TLP206GA TLP227GA TLP597GA TLP220GA* TLP797GA TLP598GA TLP798GA TLP224GA TLP174GA TLP3125 TLP797J TLP220J* TLP170J *Under development. Specifications subject to change without notice. For the latest information, please contact your nearest Toshiba sales representative. 26 TLP222G-2 TLP224G-2 TLP227G-2 TLP227GA-2 TLP224GA-2 Dual-channel : MFSOP6 MOSFET-Output Photorelays, 1-Form-A in a USOP4 Package Part Number Pin Configuration 4 3 TLP3312* TLP3375* 1 2 Features IFT (Max) RON (Max) @IF ION (Max) VOFF BVs Safety Standards (2) UL/cUL TUV USOP4 COFF: 20 pF (typ.) 3 mA 1 5 mA 0.4 A 60 V 500 Vrms USOP4 COFF: 12 pF (typ.) 3 mA 1.5 5 mA 0.3 A 50 V 500 Vrms VOFF BVs VDE BSI IEC MOSFET-Output Photorelays, 1-Form-A in a SO6 Package Part Number Pin Configuration 6 Features RON (Max) ION @IF (Max) 2 mA 0.1 A Safety Standards (2) UL/cUL TUV VDE BSI IEC 4 SO6 General-purpose Low trigger current TLP175A* 1 IFT (Max) 1 mA 50 60 V 3750 Vrms VOFF BVs /- / 3 MOSFET-Output Photorelays, 1-Form-A in a SSOP4 Package Part Number Pin Configuration Features IFT (Max) RON (Max) @IF ION (Max) Safety Standards (2) UL/cUL TUV TLP3203 SSOP4 COFF: 40 pF (typ.) 3 mA 0.22 5 mA 0.9 A 20 V 1500 Vrms TLP3212 SSOP4 COFF: 20 pF (typ.) 5 mA 1.5 5 mA 0.4 A 60 V 1500 Vrms /- TLP3213 SSOP4 COFF: 0.6 pF (typ.) 4 mA 35 5 mA 0.08 A 40 V 1500 Vrms /- TLP3214 SSOP4 COFF: 5 pF (typ.) 4 mA 3 5 mA 0.25 A 40 V 1500 Vrms /- TLP3215 SSOP4 COFF: 10 pF (typ.) 4 mA 1.5 5 mA 0.3 A 40 V 1500 Vrms /- TLP3216 SSOP4 COFF: 1 pF (typ.) 4 mA 15 5 mA 0.12 A 40 V 1500 Vrms /- TLP3217 SSOP4 COFF: 5 pF (typ.) 5 mA 12 10 mA 0.12 A 80 V 1500 Vrms /- SSOP4 COFF: 2.5 pF (typ.) 5 mA 25 5 mA 0.04 A 80 V 1500 Vrms /- SSOP4 COFF: 6.5 pF (typ.) 3 mA 8 5 mA 0.2 A 80 V 1500 Vrms /- TLP3220 SSOP4 COFF: 6 pF (typ.) 5 mA 14 10 mA 0.08 A 100 V 1500 Vrms /- TLP3230 SSOP4 COFF: 1 pF (typ.) 4 mA 8 5 mA 0.16 A 20 V 1500 Vrms /- TLP3231 SSOP4 COFF: 5 pF (typ.) 4 mA 1.2 5 mA 0.45 A 20 V 1500 Vrms /- TLP3240 SSOP4 COFF: 0.45 pF (typ.) 3 mA 14 5 mA 0.12 A 40 V 1500 Vrms /- TLP3241 SSOP4 COFF: 0.7 pF (typ.) 3 mA 10 5 mA 0.14 A 40 V 1500 Vrms /- TLP3250 SSOP4 COFF: 0.8 pF (typ.) 3 mA 5 5 mA 0.2 A 20 V 1500 Vrms /- TLP3275 SSOP4 COFF: 12 pF (typ.) 3 mA 1.5 5 mA 0.3 A 50 V 1500 Vrms /- 4 3 TLP3218 TLP3219 1 2 VDE BSI IEC IEC *Under development. Specifications subject to change without notice. For the latest information, please contact your nearest Toshiba sales representative. Note 1: The EN60747-5-2 safety standard for compact packages is different from that for standard DIP packages. Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details. Note 2: BSI and IEC: : Approved (supplementary or basic insulation) : Approved (reinforced insulation) : Design which meets safety standard/approval pending as of January 2011 EN 60065- and IEC 60065-approved, EN 60950- and IEC 60950-approved : Design which meets safety standard/approval pending as of January 2011 TUV and VDE: : Approved IEC EN 60747-5-2-approved with option V4 or D4 For the latest information, please contact your nearest Toshiba sales representative. 27 4 Selection Guide MOSFET-Output Photorelays, 1-Form-A in a 2.54SOP4 Package Part Number Pin Configuration Features IFT (Max) RON (Max) @IF ION (Max) BVs / UL/cUL TUV 2.54SOP4 TLP170A Lead pitch: 2.54 mm Low trigger LED current TLP170D Lead pitch: 2.54 mm Low trigger LED current 4 3 1 mA 2 2 mA 0.4 A 60 V 1 mA 8 2 mA 0.2 A 200 V 1500 Vrms / 1 mA 50 2 mA 0.1 A 350 V 1500 Vrms / 1 2 1 mA 60 2 mA 0.09 A 600 V 1500 Vrms / 3 mA 2 5 mA 0.4 A 60 V 1500 Vrms / 3 mA 35 5 mA 0.11 A 350 V 1500 Vrms / 2 mA 50 3 mA 0.07 A 60 V 3750 Vrms / 3 mA 35 5 mA 0.12 A 350 V 1500 Vrms / 3 mA 35 5 mA 0.12 A 400 V 1500 Vrms / 3 mA 2 5 mA 0.4 A 60 V 1500 Vrms / (1) 3 mA 8 5 mA 0.2 A 200 V 1500 Vrms / (1) 3 mA 35 5 mA 0.12 A 350 V 1500 Vrms / (1) 3 mA 35 5 mA 0.12 A 400 V 1500 Vrms / 3 mA 50 5 mA 0.05 A 200 V 1500 Vrms / 4 mA 1.2 5 mA 0.35 A 60 V 1500 Vrms /- 4 mA 20 5 mA 0.1 A 80 V 1500 Vrms /- 4 mA 35 5 mA 0.08 A 40 V 1500 Vrms /- 4 mA 3 5 mA 0.25 A 40 V 1500 Vrms /- 4 mA 1.5 5 mA 0.3 A 40 V 1500 Vrms /- 4 mA 15 5 mA 0.12 A 40 V 1500 Vrms /- 3 mA 25 5 mA 0.04 A 80 V 1500 Vrms /- 2.54SOP4 Lead pitch: 2.54 mm Low trigger LED current 2.54SOP4 TLP170J Lead pitch: 2.54 mm Low trigger LED current 2.54SOP4 TLP172A Lead pitch: 2.54 mm COFF: 130 pF (typ.) 2.54SOP4 Lead pitch: 2.54 mm COFF: 30 pF (typ.) TLP172G 6 BSI IEC 4 Mini-flat MFSOP6 TLP173A Low trigger LED current 1 VDE 1500 Vrms 2.54SOP4 TLP170G Safety Standards (2) VOFF 3 2.54SOP4 Lead pitch: 2.54 mm SEMKO-approved Current-limiting function Limit current: 150 to 300 mA TLP174G 2.54SOP4 TLP174GA Lead pitch: 2.54 mm Current-limiting function Limit current: 150 to 300 mA TLP176A Lead pitch: 2.54 mm COFF: 130 pF (typ.) TLP176D Lead pitch: 2.54 mm COFF: 100 pF (typ.) 2.54SOP4 2.54SOP4 2.54SOP4 Lead pitch: 2.54 mm SEMKO-approved COFF: 40 pF (typ.) TLP176G 2.54SOP4 TLP176GA 4 3 Lead pitch: 2.54 mm COFF: 70 pF (typ.) 2.54SOP4 Lead pitch: 2.54 mm COFF: 15 pF (typ.) TLP179D 1 2 2.54SOP4 TLP3110 Lead pitch: 2.54 mm COFF: 100 pF (typ.) TLP3111 Lead pitch: 2.54 mm COFF: 11 pF (typ.) 2.54SOP4 2.54SOP4 TLP3113 Lead pitch: 2.54 mm COFF: 0.6 pF (typ.) TLP3114 Lead pitch: 2.54 mm COFF: 5 pF (typ.) 2.54SOP4 2.54SOP4 TLP3115 Lead pitch: 2.54 mm COFF: 10 pF (typ.) 2.54SOP4 TLP3116 Lead pitch: 2.54 mm COFF: 1 pF (typ.) 2.54SOP4 TLP3118 Lead pitch: 2.54 mm COFF: 2.5 pF (typ.) Note 1: The EN60747-5-2 safety standard for compact packages is different from that for standard DIP packages. Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details. Note 2: BSI and IEC: : Approved (supplementary or basic insulation) : Approved (reinforced insulation) : Design which meets safety standard/approval pending as of January 2011 EN 60065- and IEC 60065-approved, EN 60950- and IEC 60950-approved : Design which meets safety standard/approval pending as of January 2011 TUV and VDE: : Approved EN 60747-5-2-approved with option V4 or D4 For the latest information, please contact your nearest Toshiba sales representative. 28 MOSFET-Output Photorelays, 1-Form-A in a 2.54SOP4 Package (Continued) Part Number Pin Configuration Features IFT (Max) RON (Max) ION @IF (Max) VOFF UL/cUL TUV 2.54SOP4 TLP3119 Lead pitch: 2.54 mm COFF: 6.5 pF (typ.) 3 mA 8 5 mA 0.2 A 80 V 1500 Vrms /- 4 mA 1.2 5 mA 0.35 A 80 V 1500 Vrms / 3 mA 0.7 5 mA 1.0 A 60 V 1500 Vrms / 3 mA 0.13 5 mA 1.0 A 40 V 1500 Vrms / 4 mA 8 5 mA 0.16 A 20 V 1500 Vrms /- 4 mA 1.2 5 mA 0.3 A 20 V 1500 Vrms /- 2.54SOP4 TLP3121 Lead pitch: 2.54 mm COFF: 30 pF (typ.) Safety Standards (2) BVs VDE BSI IEC 2.54SOP4 TLP3122 4 3 TLP3123 1 2 Lead pitch: 2.54 mm ION: 1 A (max)@Ta: up to 50C COFF: 90 pF (typ.) 2.54SOP4 Lead pitch: 2.54 mm ION: 1 A (max)@Ta: up to 50C COFF: 300 pF (typ.) 2.54SOP4 TLP3130 Lead pitch: 2.54 mm COFF: 1 pF (typ.) 2.54SOP4 TLP3131 Lead pitch: 2.54 mm COFF: 5 pF (typ.) MOSFET-Output Photorelays, 1-Form-A in a 2.54SOP6 or 2.54SOP8 Package Part Number Pin Configuration Features IFT (Max) RON (Max) @IF ION (Max) BVs / UL/cUL TUV 2.54SOP6 Lead pitch: 2.54 mm COFF: 130 pF (typ.) TLP192A 3 mA 2 5 mA 0.4 A 60 V 1500 Vrms 3 mA 35 5 mA 0.11 A 350 V 1500 Vrms / 3 mA 2 5 mA 0.4 A 60 V 1500 Vrms / 3 mA 8 5 mA 0.2 A 200 V 1500 Vrms / 3 mA 35 5 mA 0.12 A 350 V 1500 Vrms / 3 mA 35 5 mA 0.12 A 400 V 1500 Vrms /- 3 mA 50 5 mA 0.05 A 200 V 1500 Vrms / 3 mA 0.05 5 mA 2.5 A 20 V 1500 Vrms / 3 mA 0.06 5 mA 2.5 A 40 V 1500 Vrms / 3 mA 0.07 5 mA 2.3 A 60 V 1500 Vrms / 3 mA 0.2 5 mA 1.4 A 100 V 1500 Vrms / 5 mA 0.15 5 mA 1.25 A 80 V 1500 Vrms / 3 mA 4 5 mA 0.2 A 400 V 1500 Vrms / 2.54SOP6 Lead pitch: 2.54 mm COFF: 30 pF (typ.) TLP192G 2.54SOP6 Lead pitch: 2.54 mm COFF: 130 pF (typ.) TLP197A 2.54SOP6 TLP197D Lead pitch: 2.54 mm COFF: 100 pF (typ.) 2.54SOP6 TLP197G Lead pitch: 2.54 mm SEMKO-approved 6 5 4 2.54SOP6 Lead pitch: 2.54 mm COFF: 70 pF (typ.) TLP197GA 2.54SOP6 TLP199D 2 1 3 Lead pitch: 2.54 mm COFF: 15 pF (typ.) 2.54SOP6 TLP3100 Lead pitch : 2.54 mm ION: 2.5 A (max) @Ta: up to 50C TLP3102 2.54SOP6 TLP3103 2.54SOP6 TLP3105 2.54SOP6 ION (DC) = 5 A (max); C-connection ION (DC) = 4.6 A (max); C-connection ION (DC) = 2.8 A (max); C-connection 2.54SOP6 TLP3120 Lead pitch : 2.54 mm ION: 1.25 A (max) 8 7 6 2.54SOP8 Lead pitch: 2.54 mm COFF: 410 pF (typ.) 2 3 VDE BSI IEC (1) 5 TLP3125 1 Safety Standards (2) VOFF 4 Note 1: The EN60747-5-2 safety standard for compact packages is different from that for standard DIP packages. Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details. Note 2: BSI and IEC: : Approved (supplementary or basic insulation) : Approved (reinforced insulation) : Design which meets safety standard/approval pending as of January 2011 EN 60065- and IEC 60065-approved, EN 60950- and IEC 60950-approved : Design which meets safety standard/approval pending as of January 2011 TUV and VDE: : Approved EN 60747-5-2-approved with option V4 or D4 For the latest information, please contact your nearest Toshiba sales representative. 29 4 Selection Guide MOSFET-Output Photorelays, 2-Form-A in a 2.54SOP8 Package Part Number Pin Configuration Features IFT (Max) RON (Max) @IF ION (Max) BVs /- UL/cUL TUV 2.54SOP8 TLP200D Lead pitch: 2.54 mm Dual-channel version of the TLP176D 3 mA 8 5 mA 0.2 A 200 V 1500 Vrms 3 mA 2 5 mA 0.4 A 60 V 1500 Vrms /- 3 mA 50 5 mA 0.11 A 350 V 1500 Vrms /- 3 mA 2 5 mA 0.4 A 60 V 1500 Vrms /- 3 mA 35 5 mA 0.12 A 350 V 1500 Vrms /- 3 mA 35 5 mA 0.12 A 400 V 1500 Vrms /- 3 mA 50 5 mA 0.05 A 200 V 1500 Vrms /- VOFF BVs 2.54SOP8 TLP202A Lead pitch: 2.54 mm Dual-channel version of the TLP172A 2.54SOP8 TLP202G 8 7 6 5 Lead pitch: 2.54 mm Dual-channel version of the TLP172G 2.54SOP8 TLP206A Lead pitch: 2.54 mm Dual-channel version of the TLP176A 1 2 3 4 TLP206G 2.54SOP8 Lead pitch: 2.54 mm Dual-channel version of the TLP176G 2.54SOP8 TLP206GA Lead pitch: 2.54 mm Dual-channel version of the TLP176GA 2.54SOP8 TLP209D Lead pitch: 2.54 mm Dual-channel version of the TLP179D Safety Standards (2) VOFF VDE BSI IEC (1) MOSFET-Output Photorelays, 1-Form-A in a DIP4 Package Part Number Pin Configuration Features IFT (Max) RON (Max) ION @IF (Max) DIP4 TLP220A* 2 mA 2 5 mA 0.5 A 60 V 5000 Vrms / 2 mA 8 5 mA 0.25 A 200 V 5000 Vrms / 2 mA 50 5 mA 0.1 A 350 V 5000 Vrms / 2 mA 35 5 mA 0.12 A 400 V 5000 Vrms / 2 mA 60 5 mA 0.09 A 600 V 5000 Vrms / General-purpose Reinforced insulation 2 mA 0.2 5 mA 1.5 A 60 V 5000 Vrms / DIP4 3 mA 2 5 mA 0.5 A 60 V 2500 Vrms / 3 mA 50 5 mA 0.12 A 350 V 2500 Vrms / 3 mA 35 5 mA 0.12 A 350 V 2500 Vrms / Current-limiting function Limit current: 150 to 300 mA 3 mA 35 5 mA 0.12 A 400 V 2500 Vrms /- DIP4 SEMKO-approved 3 mA 2 5 mA 0.5 A 60 V 2500 Vrms / 3 mA 35 5 mA 0.12 A 350 V 2500 Vrms / 3 mA 35 5 mA 0.12 A 400 V 2500 Vrms /- 5 mA 1.1 10 mA 0.5 A 60 V 2500 Vrms / General-purpose Reinforced insulation DIP4 TLP220D* General-purpose Reinforced insulation DIP4 TLP220G* General-purpose Reinforced insulation DIP4 General-purpose Reinforced insulation TLP220GA* DIP4 General-purpose Reinforced insulation TLP220J* DIP4 TLP221A* 4 3 TLP222A COFF: 130 pF (typ.) 1 2 TLP222G DIP4 COFF: 30 pF (typ.) DIP4 SEMKO-approved TLP224G Current-limiting function Limit current: 150 to 300 mA DIP4 For modems TLP224GA TLP227A COFF: 130 pF (typ.) DIP4 TLP227G SEMKO-approved COFF: 40 pF (typ.) DIP4 TLP227GA SEMKO-approved 4 VDE BSI IEC 3 DIP4 TLP225A Designed for DC output modules 1 Safety Standards (2) UL/cUL TUV 2 *Under development. Specifications subject to change without notice. For the latest information, please contact your nearest Toshiba sales representative. Note 1: The EN60747-5-2 safety standard for compact packages is different from that for standard DIP packages. Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details. Note 2: BSI and IEC: : Approved (supplementary or basic insulation) : Approved (reinforced insulation) : Design which meets safety standard/approval pending as of January 2011 EN 60065- and IEC 60065-approved, EN 60950- and IEC 60950-approved : Design which meets safety standard/approval pending as of January 2011 TUV and VDE: : Approved EN 60747-5-2-approved with option V4 or D4 For the latest information, please contact your nearest Toshiba sales representative. 30 MOSFET-Output Photorelays, 1-Form-A in a DIP6 Package Part Number Pin Configuration Features DIP6 TLP592A RON (Max) ION @IF (Max) VOFF UL/cUL TUV 2 5 mA 0.5 A 60 V 2500 Vrms /- 3 mA 50 5 mA 0.12 A 350 V 2500 Vrms /- 3 mA 2 5 mA 0.5 A 60 V 2500 Vrms /- 3 mA 35 5 mA 0.12 A 350 V 2500 Vrms /- 3 mA 35 5 mA 0.12 A 400 V 2500 Vrms /- COFF: 130 pF (typ.) 3 mA 2 5 mA 0.5 A 60 V 2500 Vrms /- DIP6 3 mA 12 5 mA 0.15 A 400 V 2500 Vrms /- 3 mA 35 5 mA 0.12 A 400 V 5000 Vrms /- 5 mA 35 10 mA 0.1 A 600 V 5000 Vrms / 5 mA 12 5 mA 0.15 A 400 V 5000 Vrms /- 3 mA 0.1 10 mA 2.5 A 60 V 2500 Vrms / 3 mA 0.05 5 mA 4A 20 V 2500 Vrms / 3 mA 0.06 5 mA 3.5 A 40 V 2500 Vrms / 3 mA 0.07 5 mA 3A 60 V 2500 Vrms / 3 mA 0.2 5 mA 2A 100 V 2500 Vrms / VOFF BVs DIP6 COFF: 30 pF (typ.) DIP6 TLP597A SEMKO-approved COFF: 130 pF (typ.) DIP6 TLP597G SEMKO-approved COFF: 40 pF (typ.) DIP6 SEMKO-approved COFF: 70 pF (typ.) TLP597GA DIP6 TLP598AA TLP598GA 6 5 VDE BSI IEC 4 DIP6 TLP797GA TLP797GAF COFF: 40 pF (typ.) 1 Safety Standards (2) BVs 3 mA COFF: 130 pF (typ.) TLP592G IFT (Max) 2 3 TLP797J TLP797JF DIP6 TLP798GA DIP6 COFF: 120 pF (typ.) DIP6 TLP3542 High output current: 2.5 A (max) COFF: 400 pF (typ.) DIP6 TLP3543* High output current: 4 A (max) DIP6 TLP3544* High output current: 3.5 A (max) DIP6 TLP3545* High output current: 3 A (max) DIP6 TLP3546* High output current: 2 A (max) MOSFET-Output Photorelays, 2-Form-A in a DIP8 Package Part Number Pin Configuration Features IFT (Max) RON (Max) ION @IF (Max) Safety Standards (2) UL/cUL TUV TLP222A-2 DIP8 Dual-channel version of the TLP222A 3 mA 2 5 mA 0.5 A 60 V 2500 Vrms / TLP222G-2 DIP8 Dual-channel version of the TLP222G SEMKO-approved 3 mA 50 5 mA 0.12 A 350 V 2500 Vrms / DIP8 Dual-channel version of the TLP224G SEMKO-approved 3 mA 35 5 mA 0.12 A 350 V 2500 Vrms / TLP224GA-2 DIP8 Current-limiting function Limit current: 150 to 300 mA 3 mA 35 5 mA 0.12 A 400 V 2500 Vrms /- TLP227A-2 DIP8 Dual-channel version of the TLP227A SEMKO-approved 3 mA 2 5 mA 0.5 A 60 V 2500 Vrms / 8 7 6 5 TLP224G-2 1 2 3 4 VDE BSI IEC Note 1: The EN60747-5-2 safety standard for compact packages is different from that for standard DIP packages. Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details. Note 2: BSI and IEC: : Approved (supplementary or basic insulation) : Approved (reinforced insulation) : Design which meets safety standard/approval pending as of January 2011 EN 60065- and IEC 60065-approved, EN 60950- and IEC 60950-approved : Design which meets safety standard/approval pending as of January 2011 TUV and VDE: : Approved EN 60747-5-2-approved with option V4 or D4 For the latest information, please contact your nearest Toshiba sales representative. 31 4 Selection Guide MOSFET-Output Photorelays, 2-Form-A in a DIP8 Package (Continued) Part Number TLP227G-2 TLP227GA-2 Pin Configuration 8 7 6 5 1 2 3 4 IFT (Max) Features RON (Max) ION @IF (Max) VOFF Safety Standards (2) BVs UL/cUL TUV DIP8 Dual-channel version of the TLP227G SEMKO-approved 3 mA 35 5 mA 0.12 A 350 V 2500 Vrms / DIP8 Dual-channel version of the TLP227GA SEMKO-approved 3 mA 35 5 mA 0.12 A 400 V 2500 Vrms /- VDE BSI IEC Note 1: The EN60747-5-2 safety standard for compact packages is different from that for standard DIP packages. Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details. Note 2: BSI and IEC: : Approved (supplementary or basic insulation) : Approved (reinforced insulation) : Design which meets safety standard/approval pending as of January 2011 EN 60065- and IEC 60065-approved, EN 60950- and IEC 60950-approved : Design which meets safety standard/approval pending as of January 2011 TUV and VDE: : Approved EN 60747-5-2-approved with option V4 or D4 For the latest information, please contact your nearest Toshiba sales representative. 5 Photorelays (1-Form-B, 2-Form-B and 1-Form-A/1-Form-B) Package Features 2.54SOP4 2.54SOP6 2.54SOP8 50 0.09 TLP4172G TLP4192G TLP4202G* 50 0.10 25 0.12 TLP4176G TLP4197G TLP4206G* 25 0.15 50 0.09 50 0.10 25 0.12 1-Form-A/ 1-Form-B 1-Form-B, 2-Form-B Off-State On-State On-State Voltage Resistance Current (max) (max) (max) (V) (A) () 350 350 DIP4 DIP6 DIP8 TLP4222G TLP4592G TLP4222G-2* TLP4227G TLP4597G TLP4227G-2* TLP4027G* TLP4007G* TLP4006G* TLP4026G* * Dual-channel MOSFET-Output Photorelays, 1-Form-B Part Number Pin Configuration 4 Features IFT (Max) RON (Max) ION @IF (Max) VOFF UL/cUL TUV 2.54SOP4 Lead pitch: 2.54 mm 1-Form-B 1 3 mA 50 0 mA 0.09 A 350 V 1500 Vrms /- 3 mA 50 0 mA 0.09 A 350 V 1500 Vrms /- 3 mA 50 0 mA 0.1 A 350 V 2500 Vrms /- 3 mA 50 0 mA 0.1 A 350 V 2500 Vrms /- 3 mA 25 0 mA 0.12 A 350 V 1500 Vrms /- 3 mA 25 0 mA 0.12 A 350 V 1500 Vrms /- 2.54SOP6 Lead pitch: 2.54 mm 1-Form-B 3 2 4 3 DIP4 TLP4222G 1-Form-B 1 2 5 4 DIP6 TLP4592G 1-Form-B 1 3 2 4 3 2.54SOP4 TLP4176G Lead pitch: 2.54 mm 1-Form-B 2 1 6 5 4 2.54SOP6 TLP4197G Lead pitch: 2.54 mm 1-Form-B 1 IEC 4 TLP4192G 6 BSI 2 5 1 VDE 3 TLP4172G 6 Safety Standards (2) BVs 2 3 Note 2: BSI and IEC: : Approved (supplementary or basic insulation) : Approved (reinforced insulation) : Design which meets safety standard/approval pending as of January 2011 EN 60065- and IEC 60065-approved, EN 60950- and IEC 60950-approved : Design which meets safety standard/approval pending as of January 2011 TUV and VDE: : Approved EN 60747-5-2-approved with option V4 or D4 For the latest information, please contact your nearest Toshiba sales representative. 32 MOSFET-Output Photorelays, 1-Form-B (Continued) Part Number Pin Configuration 4 Features IFT (Max) RON (Max) ION @IF (Max) VOFF UL/cUL TUV DIP4 1-Form-B SEMKO-approved 1 BSI IEC 3 mA 25 0 mA 0.15 A 350 V 2500 Vrms /- 3 mA 25 0 mA 0.15 A 350 V 2500 Vrms /- VOFF BVs 2 5 4 DIP6 TLP4597G 1-Form-B SEMKO-approved 2 1 VDE 3 TLP4227G 6 Safety Standards (2) BVs 3 MOSFET-Output Photorelays, 2-Form-B Part Number Pin Configuration Features IFT (Max) RON (Max) ION @IF (Max) Safety Standards (2) UL/cUL TUV VDE BSI IEC 2.54SOP8 Lead pitch: 2.54 mm Dual-channel version of the TLP4172G 2-Form-B TLP4202G 3 mA 50 0 mA 0.09 A 350 V 1500 Vrms /- 3 mA 50 0 mA 0.1 A 350 V 2500 Vrms /- 3 mA 25 0 mA 0.12 A 350 V 1500 Vrms /- 3 mA 25 0 mA 0.15 A 350 V 2500 Vrms /- VOFF BVs DIP8 TLP4222G-2 8 7 6 5 1 2 3 4 Dual-channel version of the TLP4222G 2-Form-B 2.54SOP8 TLP4206G Lead pitch: 2.54 mm Dual-channel version of the TLP4176G 2-Form-B DIP8 Dual-channel version of the TLP4227G 2-Form-B SEMKO-approved TLP4227G-2 MOSFET-Output Photorelays, 1-Form-A/1-Form-B Part Number Pin Configuration Features IFT (Max) RON (Max) @IF TLP4007G Lead pitch: 2.54 1a1b (N.C. + N.O.) DIP8 8 7 6 5 1 2 3 4 1a1b (N.C. + N.O.) TLP4006G Lead pitch: 2.54 1a1b (N.C. + N.O.) DIP8 1a1b (N.C. + N.O.) UL/cUL TUV 3 mA 50 3 mA 50 (Form-A) 5 mA (Form-B) 0 mA 3 mA 25 (Form-A) 5 mA 0.12 A (Form-B) 0 mA 350 V 1500 Vrms /- 3 mA 25 (Form-A) 5 mA 0.12 A (Form-B) 0 mA 350 V 2500 Vrms /- 2.54SOP8 TLP4026G Safety Standards (2) (Form-A) 5 mA 0.09 A (Form-B) 0 mA 2.54SOP8 TLP4027G ION (Max) Note 2: BSI and IEC: 0.1 A 350 V 1500 Vrms /- 350 V 2500 Vrms /- VDE BSI IEC : Approved (supplementary or basic insulation) : Approved (reinforced insulation) : Design which meets safety standard/approval pending as of January 2011 EN 60065- and IEC 60065-approved, EN 60950- and IEC 60950-approved : Design which meets safety standard/approval pending as of January 2011 TUV and VDE: : Approved EN 60747-5-2-approved with option V4 or D4 For the latest information, please contact your nearest Toshiba sales representative. 33 4 Selection Guide 6 Triac-Output Photocouplers Package Features MFSOP6 VDRM DIP6 Isolation voltage NZC ZC 2500 Vrms TLP160G TLP161G TLP160J TLP165J TLP161J TLP163J TLP166J TLP260J TLP261J TLP168J 400 V 5000 Vrms 2500 Vrms 3000 Vrms 600 V 3750 Vrms 4000 Vrms NZC ZC NZC TLP560G TLP561G TLP3022(S) TLP3042(S) TLP3023(S) TLP3043(S) SO6 ZC NZC ZC TLP525G/-2/-4 TLP561J TLP560J TLP762J TLP763J TLP3052(S) TLP3762(S) TLP3062(S) TLP3063(S) TLP3064(S) 5000 Vrms 800 V DIP4/8/16 TLP360J TLP361J TLP363J TLP3082(S) TLP3782(S) TLP3783(S) 5000 Vrms *Under development. Specifications subject to change without notice. For the latest information, please contact your nearest Toshiba sales representative. NZC: Non-zero cross ZC: Zero cross Triac-Output Photocouplers for Solid State Relays (SSRs) Part Number Pin Configuration 6 Features 4 Mini-flat TLP160G MFSOP6 Non-zero cross 1 3 6 4 Mini-flat TLP161G ZC MFSOP6 Zero cross 1 3 6 4 TLP160J Mini-flat TLP165J Non-zero cross 1 3 6 4 Mini-flat ZC TLP168J - 10 mA IFT7 7 mA IFT5 5 mA - 10 mA IFT7 7 mA IFT5 5 mA - 10 mA MFSOP6 TLP161J TLP166J I FT (Max) Rank MFSOP6 Zero cross 3 6 4 VDRM BVs UL/c-UL Safety Standards (2) TUV VDE BSI 2.8 V 70 mA 400 V 2500 Vrms / (1) 2.8 V 70 mA 400 V 2500 Vrms / (1) 2.8 V 70 mA 600 V 2500 Vrms / (1) 2.8 V 70 mA 600 V 2500 Vrms / (1) IFT7 7 mA - 10 mA IFT7 7 mA - 3 mA 2.8 V 70 mA 600 V 2500 Vrms / - 10 mA 2.8 V 100 mA 600 V 2500 Vrms / IEC Mini-flat MFSOP6 1 VTM (Max) @ITM Zero cross Low trigger current Mini-flat MFSOP6 ZC TLP163J 1 3 Zero cross High impulse noise immunity VN=2000 V (typ.) Note 1: The EN60747-5-2 safety standard for compact packages is different from that for standard DIP packages. Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details. Note 2: BSI and IEC: : Approved (supplementary or basic insulation) : Approved (reinforced insulation) : Design which meets safety standard/approval pending as of January 2011 EN 60065- and IEC 60065-approved, EN 60950- and IEC 60950-approved : Design which meets safety standard/approval pending as of January 2011 TUV and VDE: : Approved EN 60747-5-2-approved with option V4 or D4 For the latest information, please contact your nearest Toshiba sales representative. 34 Triac-Output Photocouplers for Solid State Relays (SSRs) (Continued) Pin Configuration Part Number 6 Features I FT (Max) Rank VTM (Max) @ITM VDRM BVs UL/c-UL Safety Standards (2) TUV VDE BSI IEC 4 Mini-flat TLP260J MFSOP6 - 10 mA 2.8 V 70 mA 600 V 3000 Vrms /- (1) - 10 mA 2.8 V 70 mA 600 V 3000 Vrms /- (1) Non-zero cross 1 3 6 4 Mini-flat TLP261J MFSOP6 ZC Zero cross 3 1 Triac-Output Photocouplers for Office Equipment Part Number Pin Configuration 4 Features I FT (Max) Rank VTM (Max) @ITM VDRM BVs Safety Standards (2) UL/c-UL TUV VDE BSI IEC 3 TLP360J TLP360JF DIP4 - 10 mA IFT7 7 mA - 10 mA Non-zero cross 2.8 V 70 mA 600 V 5000 Vrms / 2.8 V 70 mA 600 V 5000 Vrms / 2.8 V 70 mA 600 V 5000 Vrms / 2 3 1 4 TLP361J TLP361JF DIP4 ZC Zero cross 2 3 1 4 TLP363J TLP363JF 7 mA - 10 mA DIP4 Zero cross High impulse noise immunity VN = 2000 V (typ.) ZC 2 1 IFT7 Triac-Output Photocouplers for AC 100 to 120 V Lines Part Number Pin Configuration 4 Features VTM (Max) @ITM VDRM BVs DIP4 1 2 7 6 - 10 mA 3V 100 mA 400 V 2500 Vrms / - 10 mA 3V 100 mA 400 V 2500 Vrms / - 10 mA 3V 100 mA 400 V 2500 Vrms / - 10 mA IFT7 7 mA 3V 100 mA 400 V 2500 Vrms /- IFT5 5 mA DIP8 Dual-channel version of the TLP525G 2 3 9 DIP16 TLP525G-4 4-channel version of the TLP525G 2 3 4 5 6 6 7 8 4 DIP6 TLP560G General-purpose Non-zero cross 1 IEC 4 16 15 14 13 12 11 10 1 Safety Standards (2) TUV VDE BSI 5 TLP525G-2 1 UL/c-UL 3 TLP525G 8 I FT (Max) Rank 2 3 Note 2: BSI and IEC: : Approved (supplementary or basic insulation) : Approved (reinforced insulation) : Design which meets safety standard/approval pending as of January 2011 EN 60065- and IEC 60065-approved, EN 60950- and IEC 60950-approved : Design which meets safety standard/approval pending as of January 2011 TUV and VDE: : Approved EN 60747-5-2-approved with option V4 or D4 For the latest information, please contact your nearest Toshiba sales representative. 35 4 Selection Guide Triac-Output Photocouplers for AC 100 to 120 V Lines (Continued) Part Number Pin Configuration 6 Features I FT (Max) Rank 4 VTM (Max) @ITM VDRM BVs 3V 100 mA 400 V 2500 Vrms /- - 10 mA IFT7 7 mA IFT5 5 mA - 10 mA 3V 100 mA 400 V 5000 Vrms / - 5 mA 3V 100 mA 400 V 5000 Vrms / - 10 mA 3V 100 mA 400 V 5000 Vrms / - 5 mA 3V 100 mA 400 V 5000 Vrms / DIP6 TLP561G ZC 1 2 General-purpose Zero cross 3 UL/c-UL Safety Standards (2) TUV VDE BSI IEC Safety Standards (2) TUV VDE BSI IEC DIP6 TLP3022(S) TLP3022F(S) 6 4 Direct replacement for XXX3020/3021/3022 SEMKO-approved Non-zero cross DIP6 TLP3023(S) TLP3023F(S) 1 2 3 Direct replacement for XXX3023 SEMKO-approved Non-zero cross DIP6 TLP3042(S) TLP3042F(S) 6 4 Direct replacement for XXX3040/3041/3042 SEMKO-approved Zero cross ZC DIP6 TLP3043(S) TLP3043F(S) 1 2 3 Direct replacement for XXX3043 SEMKO-approved Zero cross Triac-Output Photocouplers for AC 200 to 240 V Line Part Number Pin Configuration 6 Features DIP6 General-purpose Non-zero cross 2 6 VDRM BVs 3V 100 mA 600 V 2500 Vrms /- 3V 100 mA 600 V 2500 Vrms /- UL/c-UL - 10 mA IFT7 7 mA - 10 mA 3 4 DIP6 TLP561J ZC 1 VTM (Max) @ITM 4 TLP560J 1 IFT (Max) Rank 2 6 General-purpose Zero cross IFT7 7 mA - 10 mA 3V 100 mA 600 V 4000 Vrms /- - 10 mA 3V 100 mA 600 V 4000 Vrms /- - 10 mA 3V 100 mA 600 V 5000 Vrms / 3 4 DIP6 TLP762J TLP762JF Internal creepage: 4 mm (min) SEMKO-approved Non-zero cross-on 1 2 6 3 4 DIP6 TLP763J TLP763JF ZC 1 2 6 Internal creepage: 4 mm (min) SEMKO-approved Zero cross 3 4 DIP6 TLP3052(S) TLP3052F(S) High VDRM SEMKO-approved Non-zero cross-on 1 2 3 Note 2: BSI and IEC: : Approved (supplementary or basic insulation) : Approved (reinforced insulation) : Design which meets safety standard/approval pending as of January 2011 EN 60065- and IEC 60065-approved, EN 60950- and IEC 60950-approved : Design which meets safety standard/approval pending as of January 2011 TUV and VDE: : Approved EN 60747-5-2-approved with option V4 or D4 For the latest information, please contact your nearest Toshiba sales representative. 36 Triac-Output Photocouplers for AC 200 to 240 V Line (Continued) Pin Configuration Part Number IFT (Max) Rank Features VTM (Max) @ITM VDRM BVs UL/c-UL Safety Standards (2) TUV VDE BSI IEC DIP6 TLP3062(S) TLP3062F(S) - 10 mA 3V 100 mA 600 V 5000 Vrms / - 5 mA 3V 100 mA 600 V 5000 Vrms / - 3 mA 3V 100 mA 600 V 5000 Vrms / - 10 mA 3V 100 mA 600 V 5000 Vrms / - 10 mA 3V 100 mA 800 V 5000 Vrms / DIP6 - 10 mA 3V 100 mA 800 V 5000 Vrms / High impulse noise immunity VN = 1500 V (typ.) Zero cross - 5 mA 3V 100 mA 800 V 5000 Vrms / SEMKO-approved High VDRM Zero cross DIP6 TLP3063(S) TLP3063F(S) SEMKO-approved High VDRM Zero cross DIP6 TLP3064(S) TLP3064F(S) 6 SEMKO-approved Low trigger current Zero cross 4 ZC TLP3762(S) TLP3762F(S) 2 1 DIP6 Zero cross High impulse noise immunity VN = 2000 V (typ.) 3 TLP3082(S) TLP3082F(S) DIP6 Zero cross TLP3782(S) TLP3782F(S) TLP3783(S) TLP3783F(S) Note 2: BSI and IEC: : Approved (supplementary or basic insulation) : Approved (reinforced insulation) : Design which meets safety standard/approval pending as of January 2011 EN 60065- and IEC 60065-approved, EN 60950- and IEC 60950-approved : Design which meets safety standard/approval pending as of January 2011 TUV and VDE: : Approved EN 60747-5-2-approved with option V4 or D4 For the latest information, please contact your nearest Toshiba sales representative. 7 Thyristor-Output Photocouplers Replacement Devices Package New Device TLP148G TLP548J TLP549J TLP748J Features VDRM Isolation voltage MFSOP6 400 V 2500 Vrms TLP148G 600 V TLP548J TLP748J 2500 Vrms 4000 Vrms Part Number DIP6 Pin Configuration 6 5 Features DIP8 TLP549J I FT (Max) VTM (Max) @ITM VDRM BVs 10 mA 1.45 V 100 mA 400 V 2500 Vrms /- 7 mA 1.45 V 100 mA 600 V 2500 Vrms /- 7 mA 1.45 V 100 mA 600 V 2500 Vrms /- 10 mA 1.45 V 100 mA 600 V 4000 Vrms /- Mini-flat MFSOP6 6 5 Safety Standards (2) VDE BSI TUV IEC 4 DIP6 TLP548J Low trigger current 1 2 7 3 6 5 DIP8 Long anode-cathode distance (SCR) TLP549J 2 3 5 4 4 TLP748J TLP748JF DIP6 SEMKO-approved 1 UL/cUL 3 1 6 TLP747G/J The new and discontinued devices are not exactly identical in terms of electrical characteristics. For device replacement, hardware evaluation must be performed in the real-world environment. 4 TLP148G 1 Discontinued Devices TLP141G TLP541J TLP545J TLP542G TLP543J TLP641G/J TLP741G/J 2 3 Note 2: BSI and IEC: : Approved (supplementary or basic insulation) : Approved (reinforced insulation) : Design which meets safety standard/approval pending as of January 2011 EN 60065- and IEC 60065-approved, EN 60950- and IEC 60950-approved : Design which meets safety standard/approval pending as of January 2011 TUV and VDE: : Approved EN 60747-5-2-approved with option V4 or D4 For the latest information, please contact your nearest Toshiba sales representative. 37 4 Selection Guide 8 Photovoltaic-Output photocouplers Package Features SSOP4 Short-Circuit Current Open Voltage 1500 Vrms TLP3904 5 A 7V 12 A 7V 20 A 7V 24 A 7V 4 A 30 V MFSOP6 DIP6 2500 Vrms TLP3902 TLP190B TLP590B TLP191B* TLP591B* TLP3914 TLP3924 *Built-in shunt resistor Part Number Pin Configuration 6 Safety Standards (2) UL/cUL TUV VDE BSI Short-Circuit Current (Min) Open-Circuit Voltage (Min) BVs @IF @IF Rank Features IEC 4 TLP190B 1 3 6 4 TLP191B 3 1 6 Mini-flat MFSOP6 -- 12 A 10 mA 7V 10 mA 2500 Vrms / Mini-flat MFSOP6 Built-in shunt resistor -- 24 A 20 mA 7V 20 mA 2500 Vrms / -- 12 A 10 mA 7V 10 mA 20 A 2500 Vrms /- C20 -- 24 A 20 mA 7V 20 mA 2500 Vrms /- 4 TLP590B DIP6 2 1 3 6 4 DIP6 Built-in shunt resistor TLP591B 2 1 6 -- 5 A 10 mA 7V 10 mA 2500 Vrms /- SSOP4 -- 5 A 10 mA 7V 10 mA 1500 Vrms /- SSOP4 -- 20 A 10 mA 7V 10 mA 1500 Vrms /- SSOP4 High open-circuit voltage -- 4 A 10 mA 30 V 10 mA 1500 Vrms /- 3 TLP3914 1 Mini-flat MFSOP6 3 TLP3904 4 40 A 4 TLP3902 1 C40 3 2 TLP3924 Note 2: BSI and IEC: : Approved (supplementary or basic insulation) : Approved (reinforced insulation) : Design which meets safety standard/approval pending as of January 2011 EN 60065- and IEC 60065-approved, EN 60950- and IEC 60950-approved : Design which meets safety standard/approval pending as of January 2011 TUV and VDE: : Approved EN 60747-5-2-approved with option V4 or D4 For the latest information, please contact your nearest Toshiba sales representative. 9 Products Manufactured by Toshiba Semiconductor (Thailand) Co., Ltd. (TST) Transistor-Output and Darlington-Transistor-Output Photocouplers Part Number Pin Configuration 6 4 Features 1 3 6 4 AC input SEMKO-approved 1 3 80 V 3750 Vrms 80 V 3750 Vrms UL c-UL Safety Standards (2) TUV VDE BSI IEC (1) (1) Mini-flat MFSOP6 TLP181 BVs @1 Minute Mini-flat MFSOP6 TLP180 VCEO Transistor output General-purpose (1) *Under development. Specifications subject to change without notice. For the latest information, please contact your nearest Toshiba sales representative. Note 1: The EN60747-5-2 safety standard for compact packages is different from that for standard DIP packages. Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details. Note 2: BSI and IEC: : Approved (supplementary or basic insulation) : Approved (reinforced insulation) : Design which meets safety standard/approval pending as of January 2011 EN 60065- and IEC 60065-approved, EN 60950- and IEC 60950-approved : Design which meets safety standard/approval pending as of January 2011 TUV and VDE: : Approved EN 60747-5-2-approved with option V4 or D4 For the latest information, please contact your nearest Toshiba sales representative. Some of the photocouplers with triac output are also manufactured by Toshiba Semiconductor Thailand Co.,Ltd. For detailed information, please contact your nearest Toshiba sales representative. 38 Transistor-Output and Darlington-Transistor-Output Photocouplers (Continued) Part Number Pin Configuration 6 Features BVs @1 Minute 80 V 3750 Vrms (1) (1) 80 V 3750 Vrms (1) (1) 80 V 2500 Vrms (1) (1) 80 V 2500 Vrms 80 V 3750 Vrms (1) (1) 80 V 3750 Vrms (1) (1) 55 V 5000 Vrms -- 55 V 5000 Vrms SO6 (reinforced insulation) AC input 1 3 6 4 SO6 (reinforced insulation) TLP185* 1 3 4 3 -- 300 V 5000 Vrms -- 300 V 5000 Vrms -- 80 V 2500 Vrms (2) 80 V 2500 Vrms (2) SOP4 TLP280 Lead pitch = 1.27 mm AC input 1 2 4 3 1 2 Lead pitch = 1.27 mm General-purpose SEMKO-approved 4 3 SOP4 (reinforced insulation) Lead pitch = 1.27 mm Creepage/clearance 5 mm Isolation thickness 0.4 mm AC input TLP284 1 2 4 3 Lead pitch = 1.27 mm Creepage/clearance 5 mm Isolation thickness 0.4 mm SEMKO-approved 1 2 4 3 Transistor output AC input SEMKO-approved 1 2 7 6 5 2 3 4 3 Dual-channel version of the TLP620 SEMKO-approved 4 DIP4 Darlington transistor output High VCEO SEMKO-approved TLP627 1 2 7 6 5 DIP8 Dual-channel version of the TLP627 SEMKO-approved TLP627-2 2 3 4 16 15 14 13 12 11 10 9 TLP290-4* 1 2 3 4 5 6 7 16 15 14 13 12 11 10 8 9 SO16 4-channel version Lead pitch = 1.27 mm AC input SO16 TLP291-4* 4-channel version Lead pitch = 1.27 mm 2 3 4 5 (1) DIP8 TLP620-2 1 IEC DIP4 TLP620 1 BSI SOP4 (reinforced insulation) TLP285 8 c-UL SOP4 TLP281 1 UL 4 TLP184* 8 Safety Standards (2) TUV VDE VCEO 6 7 8 Photocouplers for IGBT/MOSFET Gate Drive Part Number Pin Configuration 6 5 Features Propagation Delay Time (Max) Safety Standards (2) I FHL (Max) BVs Peak output current (max): 7.5 mA 0.6 A 3750 Vrms Output UL/cUL TUV VDE BSI IEC 4 SO6 (reinforced Insulation) Topr = 100C (max) Direct drive of a small-power IGBT/MOSFET TLP155E 1 0.2 s / 3 *Under development. Specifications subject to change without notice. For the latest information, please contact your nearest Toshiba sales representative. Note 1: The EN60747-5-2 safety standard for compact packages is different from that for standard DIP packages. Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details. Note 2: BSI and IEC: : Approved (supplementary or basic insulation) : Approved (reinforced insulation) : Design which meets safety standard/approval pending as of January 2011 EN 60065- and IEC 60065-approved, EN 60950- and IEC 60950-approved : Design which meets safety standard/approval pending as of January 2011 TUV and VDE: : Approved EN 60747-5-2-approved with option V4 or D4 For the latest information, please contact your nearest Toshiba sales representative. Some of the photocouplers with triac output are also manufactured by Toshiba Semiconductor Thailand Co.,Ltd. For detailed information, please contact your nearest Toshiba sales representative. 39 4 Selection Guide Triac-Output Photocouplers Tingger LED Current, IFT Part Number Pin Configuration 4 Features Rank Max - 10 mA IFT7 7 mA - 10 mA IFT7 7 mA DIP4 Non-zero cross 1 2 4 3 DIP4 Zero cross DIP4 Zero cross High impulse noise immunity VN = 2000 V (typ.) 2 1 6 TP560G - 10 mA - IFT7 IFT5 - IFT7 - IFT7 IFT5 - IFT7 10 mA 7 mA 5 mA 10 mA 7 mA 10 mA 7 mA 5 mA 10 mA 7 mA DIP6 SEMKO-approved - 10 mA Non-zero cross - 5 mA - 10 mA 4 DIP6 General-purpose Non-zero cross TP560J 1 2 6 TP561G 3 4 DIP6 ZC TP561J 1 2 TLP3023 (S) TLP3023F (S) TLP3052 (S) TLP3052F (S) 1 4 2 General-purpose Zero cross 3 TLP3022 (S) TLP3022F (S) 6 High VDRM SEMKO-approved Non-zero cross 10 mA TLP3043 (S) Zero cross - 5 mA DIP6 SEMKO-approved - 10 mA High VDRM Zero cross - 5 mA DIP6 SEMKO-approved - 3 mA - 10 mA DIP6 - 10 mA High impulse noise immunity VN = 1500 V (typ.) - 5 mA 6 4 ZC TLP3064 (S) TLP3782 (S) TLP3782F (S) TLP3783 (S) TLP3783F (S) c-UL TUV VDE BSI IEC 2 600 V 3.0 V 100 mA 3.0 V 100 mA 600 V 400 V 600 V 3 100 mA 600 V 5000 Vrms 100 mA 600 V 400 V 600 V 3.0 V 5000 Vrms 100 mA Zero cross DIP6 Zero cross 2500 Vrms 400 V 3.0 V DIP6 3 - TLP3082 (S) 100 mA 3.0 V DIP6 SEMKO-approved 1 3.0 V UL 400 V TLP3042 (S) TLP3062 (S) TLP3062F (S) TLP3063 (S) TLP3063F (S) @ITM Safety Standards(2) 5000 Vrms ZC TLP363J TLP363JF Max Off-State Output BVs Terminal @1 Minute Voltage VDRM 3 TLP360J TLP360JF TLP361J TLP361JF Peak On-State Voltage, VTM 600 V 600 V Note 2: BSI and IEC: : Approved (supplementary or basic insulation) : Approved (reinforced insulation) : Design which meets safety standard/approval pending as of January 2011 EN 60065- and IEC 60065-approved, EN 60950- and IEC 60950-approved : Design which meets safety standard/approval pending as of January 2011 TUV and VDE: : Approved EN 60747-5-2-approved with option V4 or D4 For the latest information, please contact your nearest Toshiba sales representative. Some of the photocouplers with triac output are also manufactured by Toshiba Semiconductor Thailand Co.,Ltd. For detailed information, please contact your nearest Toshiba sales representative. 40 5 Part Naming Conventions 1. Transistor-Output, Darlington-Transistor-Output and IC-Output Photocouplers TLP F ( - - , F) , RoHS COMPATIBLE * Part number Revision code The revision code may be added to identify a revision of a device. For details, contact your nearest Toshiba sales representative. Wide-spaced leads Specify this option, if necessary. Lead form option for DIP packages Select one of the lead form options shown on page 40. Carrier tape option Select one of the carrier tape options shown on pages 51. Safety standard option Specify either "D4" or "V4" for EN60747-5-2-approved devices. Example 2: TLP781F(GR,F) Example 1: TLP781(D4-GB-TP6,F [D4] = EN60747-5-2 option [F] = Wide-spaced leads [GB] = CTR rank [GR] = CTR rank [TP6] = LF6 lead form [,F] = RoHS COMPATIBLE* Tape-and-reel packing [,F] = RoHS COMPATIBLE* The right parenthesis is omitted due to the limit to the number of characters. CTR rank See respective datasheets. 2. Triac-Output and Thyristor-Output Photocouplers TLP F ( - - , , F) Part number RoHS COMPATIBLE* VDRM G: 400 V J: 600 V L: 800 V Revision code Lead form option for DIP packages Carrier tape option Wide-spaced leads Example 3: TLP361J(D4-IFT7-TP1,S,F) Safety standard option TLP361J(D4T7TP1S,F) IFT rank No character: No IFT rank specified IFTx: For example, IFT5 denotes the 5-mA rank. The available IFT ranks differ from product to product. See datasheets. (Abbreviated due to the limit to the number of characters.) [J] = VDRM: 600 V [D4] = EN60747-5-2 option [IFT7] = [T7] = IFT = 7 mA [TP1] = LF1 lead form Tape-and-reel packing [,S] = [S] = Revision code: S [,F] = RoHS COMPATIBLE* 3. Photorelays TLP F ( - , Part number VOFF A: 60 V D: 200 V G: 350 V GA: 400 V J: 600 V Some photorelays do not have a VOFF code in their names. See respective datasheets. Wide-spaced leads Safety standard option , F) RoHS COMPATIBLE* Revision code Lead form option for DIP packages Carrier tape option Example 5: TLP3110(TP,F) Example 4: TLP227A(TP1,F) [A] = VOFF: 60 V [TP] = Tape-and-reel packing [TP1] = LF1 lead form [,F] = RoHS COMPATIBLE* Tape-and-reel packing [,F] = RoHS COMPATIBLE* *: "F" identifies the indication of product Labels with "[[G]]/RoHS COMPATIBLE". Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product. The RoHS is the Directive 2002/95/EC of the European Parliament and of the Council of 27 January 2003 on the restriction of the use of certain hazardous substances in electrical and electronic equipment. Note: The length of part names is limited to 18 characters. Longer names are abbreviated by omitting the "-" character and/or using shorthand symbols. However, be sure to give full part names when you have any inquiries. For details, please contact your nearest Toshiba sales representative. 41 6 Package Information 1 Lead Form Options for DIP Packages The DIP4, DIP6, DIP8 and DIP16 packages offer three surface-mount lead form options and a wide-spaced lead form option. The electrical characteristics are identical, regardless of these options. Lead Form Surface-Mount Wide-Spaced Appearance Lead Form Code (LF1) (LF4) (LF5) (LF2) Carrier Tape Code (TP1) (TP4) (TP5) Not available* 4-pin DIP 4 3 8-pin DIP 8 5 10.16 A 1 2 1 6-pin DIP 6 5 4 4 B 16-pin DIP 16 9 C Package Outlines 1 2 3 1 10 to 12 8 Dimensions Unit: mm Version (LF1) (LF4) (LF5) Min Max Min Max Min Max A - 10.0 - 12.0 - 10.0 B (0.35 typ.) - 0.2 6.4 - Dimension C 6.4 - (0.25 typ.) 8.0 - All other package dimensions are the same as for each standard package specification. * Tape-and-reel packing is not available with (LF2). Example 1: Standard part: TLP620(F) Surface-mount option: TLP620(LF1,F): Packed in stick magazines (see page 49). Surface-mount and tape-and-reel options: TLP620(TP1,F): Packed in tape-and-reel (see page 51). Standard part names should be used when applying for safety standard approval. The package dimensions and lead form options of the TLP781, TLP785 differ from those shown above. See the TLP781, TLP785 datasheet. 42 2 Package Dimensions (4-Pin DIP) Standard DIP4 DIP4 (LF1) / (TP1) 3 Unit: mm Unit: mm 4 3 1 2 7.62 0.25 4.58 0.25 1.2 0.15 2.5 min 7.85 to 8.80 2.54 0.25 DIP4 (LF2) 1 2 4 3 1 2 4.58 0.25 +0.1 0.5 0.15 0.25 -0.05 2.5 min 0.5 0.1 2.54 0.25 2.54 0.25 10 to 12 DIP4 (LF5) / (TP5) 3 1 2 Unit: mm +0.25 3.85 -0.20 7.62 0.25 0.5 0.1 2.54 0.25 1.2 0.15 1.0 min 10.0 max 0.2 max +0.1 0.25 -0.05 3.65 -0.25 4.58 0.25 +0.15 6.4 0.25 4 7.62 0.25 3.65 +0.15 -0.25 1.2 0.15 Unit: mm 6.4 0.25 +0.15 3.65 -0.25 10.16 0.25 7.62 0.25 0.25 min 4.58 0.25 +0.25 DIP4 (LF4) / (TP4) Unit: mm 3.9 +0.25 -0.20 3 6.4 0.25 4 1.0 min 10.0 max 43 1.2 0.15 0.75 0.25 12.0 max +0.1 0.5 0.1 2.54 0.25 +0.1 0.25 -0.05 0.25 -0.05 1.2 0.15 7.62 0.25 4.0 -0.20 0.8 0.25 4.58 0.25 3.65 +0.15 -0.25 2 3.65 +0.15 -0.25 1 6.4 0.25 6.4 0.25 4 6 Package Information 2 Package Dimensions (6-Pin DIP) Standard DIP6 5 Unit: mm 4 Unit: mm 6 5 4 1 2 3 1.2 0.15 2.54 0.25 10.0 max DIP6 (LF4) / (TP4) 4 Unit: mm Unit: mm 6 5 4 1 2 3 1.2 0.15 2.54 0.25 +0.1 0.5 0.1 0.25 -0.05 2.5 min 0.5 0.1 2.54 0.25 10 to 12 DIP6 (LF5) / (TP5) Unit: mm 5 4 1 2 3 1.2 0.15 1.0 min 10.0 max +0.25 3.85 -0.20 +0.1 0.25 -0.05 7.62 0.25 0.2 max 0.5 0.1 2.54 0.25 3.65 -0.25 7.12 0.25 +0.15 6.4 0.25 6 44 1.2 0.15 +0.1 0.75 0.25 12.0 max +0.25 7.62 0.25 3.9 -0.20 +0.15 7.12 0.25 0.25 -0.05 0.25 min 7.12 0.25 10.16 0.25 7.62 0.25 3.65 -0.25 3 +0.15 2 3.65 -0.25 1 6.4 0.25 6.4 0.25 5 1.0 min 1.2 0.15 2.54 0.25 7.85 to 8.80 DIP6 (LF2) 6 +0.25 +0.1 0.25 -0.05 2.5 min 0.5 0.1 7.62 0.25 4.0 -0.20 7.12 0.25 3.65 -0.25 7.62 0.25 0.8 0.25 7.12 0.25 +0.15 3 +0.15 2 3.65 -0.25 1 6.4 0.25 6.4 0.25 6 DIP6 (LF1) / (TP1) 2 Package Dimensions (8-Pin DIP) Standard DIP8 (LF1) / (TP1) DIP8 6 Unit: mm 5 Unit: mm 8 7 6 5 1 2 3 4 6.4 0.25 2.5 min 0.8 0.25 1.2 0.15 0.5 0.1 2.54 0.25 +0.1 0.25 -0.05 1.0 min 2.54 0.25 7.85 to 8.80 1.2 0.15 DIP8 (LF2) DIP8 (LF4) / (TP4) 5 Unit: mm Unit: mm 8 7 6 5 1 2 3 4 6.4 0.25 4 2.5 min 0.25 min 3.65 9.66 0.25 10.16 0.25 7.62 0.25 0.5 0.1 2.54 0.25 1.2 0.15 9.66 0.25 0.75 0.25 +0.1 0.25 -0.05 1.2 0.15 10 to 12 2.54 0.25 DIP8 (LF5) / (TP5) Unit: mm 7 6 5 1 2 3 4 2.54 0.25 1.2 0.15 10.0 max 3.85 +0.25 -0.20 +0.1 1.0 min 0.2 max 7.62 0.25 0.25 -0.05 3.65 -0.25 9.66 0.25 +0.15 6.4 0.25 8 7.62 0.25 45 12.0 max +0.25 3 3.9 -0.20 2 +0.15 -0.25 1 +0.1 6 10.0 max +0.15 -0.25 7 6.4 0.25 8 7.62 0.25 3.65 9.66 0.25 4.0 +0.25 -0.20 7.62 0.25 3.65 9.66 0.25 +0.15 -0.25 4 3 3.65 2 +0.15 -0.25 1 0.25 -0.05 7 6.4 0.25 8 6 Package Information 2 Package Dimensions (Other DIP Packages) 5-pin DIP6 5-pin DIP6 (LF2) 1 3 Unit: mm 1 2 1.2 0.15 2.54 0.25 6.4 0.25 7.85 to 8.80 0.5 0.1 2.54 0.25 1.2 0.15 5-pin DIP (with Pin 5 Cut) 10 to 12 DIP16 Unit: mm 1 16 15 14 13 12 11 10 9 1 8 Unit: mm 6.4 0.25 2 +0.1 0.25 -0.05 2.54 0.25 6 7 +0.15 5 3.65 -0.25 4 19.82 0.25 2.5 min 0.8 0.25 3.65 -0.25 1.2 0.15 3 +0.1 0.25 -0.05 2.5 min 0.5 0.1 2 7.62 0.25 0.8 0.25 4 6 7.12 0.25 +0.15 6.4 0.25 3 10.16 0.25 7.62 0.25 +0.15 +0.1 0.25 -0.05 2.5 min 0.5 0.1 4 6 7.12 0.25 0.25 min 0.8 0.25 7.62 0.25 3.65 -0.25 3.65 -0.25 +0.15 4 6 7.12 0.25 Unit: mm 2.5 min 2 6.4 0.25 3 0.5 0.1 7.85 to 8.80 1.2 0.15 2.54 0.25 7.62 0.25 +0.1 0.25 -0.05 7.85 to 8.80 2 Package Dimensions (Surface Mount) SO6 SO8 4 8 7 6 5 2 3 4 1 1 3 + 0.25 3.7 - 0.15 5.1 0.2 6.0 0.2 2.5 0.2 0.15 0.1 2.1 0.1 7.0 0.4 0.4 Unit: mm 3.95 0.25 Unit: mm 0.5 min 1.27 0.15 1.27 2.54 0.38 46 0.1 0.1 5 4.55 + 0.25 - 0.15 6 0.305 min 2 Package Dimensions (Surface Mount) (Continued) SDIP6 SDIP6 (F type) 4.58 0.25 6.8 0.2 2 3 1.25 0.2 11.7 0.3 3 5 4 Unit: mm 4.4 0.25 1 5-pin MFSOP6 6 Unit: mm 4.4 0.25 4 1 3 3.6 0.2 0.15 0.1 2.5 0.2 7.0 0.4 0.1 2.5 0.2 7.0 0.4 3.6 0.2 0.4 0.1 0.4 0.1 0.5 min 2.54 0.25 4-pin MFSOP6 (with Pin 5 Cut) 4 3 1 2 4.4 0.25 3.6 0.2 7.0 0.4 2.1 max 2.6 0.25 0.15 0.1 2.5 0.2 0.4 0.1 Unit: mm 0.5 min 0.4 0.1 1.27 0.2 1.27 0.2 2.54 0.25 47 7.0 0.4 1.9 6 Unit: mm 0.1 0.1 4 SOP4 4.4 0.25 1 0.5 min 1.27 0.2 2.54 0.25 3 0.75 0.25 0.4 0.1 4-pin MFSOP6 6 7.62 0.2 1.27 0.2 9.7 0.3 0.4 0.1 +0.15 -0.25 1 3.65 +0.10 0.25 -0.05 1.27 0.2 4.0 +0.25 -0.20 +0.15 -0.25 3.65 7.62 0.25 3.9 +0.25 -0.20 3 0.15 2 Unit: mm 0.15 1 4.58 0.25 6 5 4 Unit: mm +0.10 4 0.25 -0.05 5 6.8 0.2 6 0.6 0.3 6 Package Information 2 Package Dimensions (Surface Mount) (Continued) 2.54SOP4 2.54SOP6 Unit: mm 3 1 2 Unit: mm 6 5 4 1 2 3 6.3 0.25 7.0 0.4 7.0 0.4 0.4 0.1 2.54 0.25 0.6 0.3 0.6 0.3 0.1 0.1 0.1 0.1 0.15 0.15 3.9 0.25 2.1 max 2.1 max 4.4 0.25 4.4 0.25 4 2.54 0.25 0.4 0.1 2.54SOP8 SOP16 Unit: mm 5 1 2 3 4 Unit: mm 16 15 14 13 12 11 10 9 4.4 0.25 7.0 0.4 0.4 0.1 4 6 7 8 7.0 0.4 0.4 0.1 1.27 0.2 SSOP4 Unit: mm Unit: mm 3.25 1.4 1 4 2 3 1.2 3 2 4 1 2.05 1.8 0.15 1.65 3.65 0.4 0.3 1.27 2.04 0.6 0.3 USOP4 4.2 1.9 5 2.1 max 0.6 0.3 0.1 0.1 2.54 0.25 3 10.3 0.25 0.15 9.4 0.25 2 1.9 2.1 max 1 0.15 6 0.1 0.1 7 4.4 0.25 8 0.2 3.8 0.2 0.2 0.2 1.27 2.2 0.46 0.2 Unless Otherwise Specified, Tolerance 0.1 mm 4 0.35 1 3 2 Unless Otherwise Specified, Tolerance 0.2 mm 48 3 Rank Marking Transistor-output photocouplers are ranked according to their CTR ranges, whereas thyristor-output and triac-output photocouplers are ranked according to their maximum IFT value. The following gives the rank classifications and rank marks printed on packages. Note that the rank classifications differ from product to product. For details, please refer to the relevant technical datasheets. 1. CTR Rank Name and Rank Marking Available CTR Rank Selection ( : Available, : Contact Toshiba) Part Number Rank Name None GB Y GR BL YH GRL GRH BLL Rank Marking Group TLP180 TLP181 TLP280 TLP280-4 TLP281 TLP281-4 TLP531/532 TLP620 TLP620-2 TLP620-4 TLP630 TLP631/632 TLP731/732 TLP733F/734F 1 2 1 3 1 3 1 1 3 3 1 2 2 2 Part Marking when No CTR Rank Is Specified Rank Name None CTR 50 to 600% CTR Rank Other than TLP421 TLP421 See the right-side tables Blank,Y,Y+,YE, G,G+,GR,B,B+, BL,GB Part Number None TLP180 Blank, TLP280 GR, BL, GB TLP620-4 Y 50 to 150% YE YE 100 to 300% GR GR TLP630 GB 100 to 600% GB GB TLP181 BL 200 to 600% BL BL TLP281 GRL 100 to 200% G G TLP531 Y, GRH 150 to 300% G G+ TLP621 YE, TLP731 TLP732 TLP733F TLP734F 49 TLP281-4 1 TLP620-2 GR TLP632 Part Number Blank, Y, G, G, GR, B, B , BL, GB None Rank Marking Group Blank, GB 3 TLP280-4 YE, TLP531/532 TLP631 Rank Marking Group 2 6 Package Information 2. LED Trigger Current (IFT) Ranking and Marking Rank Name I FT None I FT max I FT7 7 mA max T7, T5 I FT5 5 mA max T5 I FT2 2 mA max T2 (only for photorelays) IFT Rank Marking Blank, T7, T5 3. Marking Examples (a) 4-pin mini-flat 1-channel type or Lot No. Example: TLP626: P626 Part number minus "TL" CTR or IFT rank marking P TLP620: P620 TLP181: P181 P620 TLP620 Pin No. 1 (b) TLP421, TLP421F Pin No. 1 Lot No. (Monthly code) P421F Part number (P421 or P421F) Lot No. CTR rank marking (c) TLP280, TLP281 Pin No. 1 CTR rank marking P280 Part number (P280 or P281) Lot No. (d) Others or Lot No. TLP Examples: TLP620: TLP620 Part number TLP666GF: TLP666GF TLP620 TLP620 CTR or IFT rank marking Pin No. 1 Note: When ordering a standard photocoupler, add a CTR or IFT rank in parentheses to the standard part number. Examples: TLP181(GB) TLP532(GR) Use the standard part number when applying for safety standard approval. Example Part number TLP181(GB) Use this part number TLP181 50 7 Packing Information 1 Photocoupler Magazine Packing Specifications Standard DIP DIPs with LF1, LF2, LF4 and LF5 Lead Forming Unit: mm Unit: mm 9.5 4.4 Magazine Dimensions 2.7 10.3 9.3 4.5 4.3 1.4 6.7 5.5 5.5 10.3 14 11.3 Length = 525 Thickness = 0.5 Device Quantities per Magazine Length = 525 Thickness = 0.5 Package Pin Count 4 6 8 12 16 Quantity (pcs) 100 50 50 25 25 Y B Y B X Packing Dimensions X C C A A Number of Magazines Dimensions (A x B x C) Label Position Number of Magazines Dimensions (A x B x C) Label Position 4 50 x 12 x 531 Y 4 60 x 13 x 531 Y 20 67 x 51 x 559 Y 40 135 x 58 x 568 X 60 123 x 76 x 568 X 51 Packing Information Mini-Flat Coupler (MFP) Unit: mm Unit: mm MFSOP6 (0.8) 4.2 2.8 1.8 6.2 1.3 6.2 3.4 1.7 6.2 Magazine Dimensions 10.5 4.4 3.4 10.5 4.9 3.4 10.5 4.8 Unit: mm SO8 6.2 SO6 3.4 Unit: mm SOP Photocoupler 1.6 7 4.7 4.7 Length = 555 Thickness = 0.5 4.3 Length = 555 Thickness = 0.5 5.2 10.5 Length = 555 Thickness = 0.5 Length = 555 Thickness = 0.5 Package Pin Count Device Quantities per Magazine Package Pin Count Quantity (pcs) 5 (SO6) 125 Package Pin Count 4 (MFSOP6) Quantity (pcs) Package Pin Count 150 Quantity (pcs) 8 (SO8) 100 4 (SOP4) 16 (SOP16) 150 50 Quantity (pcs) 4 Package 6 8 Pin Count (2.54SOP4) (2.54SOP6) (2.54SOP8) Quantity (pcs) 100 Y B 75 50 Y B X X C C A A Packing Dimensions Package SO6 MFSOP6 SO8 Number of Magazines Dimensions (A x B x C) Label Position Number of Magazines Dimensions (A x B x C) Label Position 40 70 x 55 x 585 X 4 29 x 13 x 563 4 29 x 13 x 563 Y Y 24 77 x 31 x 586 Y 40 67 x 55 x 586 X 24 77 x 31 x 586 Y 40 67 x 55 x 586 X 24 75 x 29 x 579 X Photocoupler Package Type Typical Devices MFSOP6 TLP160J, TLP180, TLP190B SO6 TLP104, TLP109, TLP116A SO8 TLP2105, TLP2108, TLP2116, TLP2118E, TLP2405, TLP2408 SOP4 TLP280, TLP281 SOP16 TLP280-4, TLP281-4, TLP270D, TLP270G 2.54SOP4 TLP176G, TLP176A 2.54SOP6 TLP197G 2.54SOP8 TLP206G, TLP206A 52 2 Tape-and-Reel Specifications The tape specifications differ for photocouplers manufactured in Thailand. 1. Embossed Tape Specifications for Surface-Mount Lead Form Options Photocoupler Package Types Tape Option Symbol MFSOP6, SO6 (TPL) or (TPR) SO8 (TP) TLP2105, TLP2108, TLP2405, TLP2408 Typical Devices TLP165J, TLP181, TLP190B SOP4 (TP) TLP280, TLP281 SOP16 (TP) TLP280-4, TLP281-4 2.54SOP4 (TP) TLP176G, TLP176A, TLP176D 2.54SOP6 (TP) TLP197G 2.54SOP8 (TP) TLP200D,TLP206A,TLP206G SSOP4 (TP15) SDIP6 (TP) DIP(LF1, LF5) (TP1) or (TP5) DIP(LF4) (TP4) TLP3212 to 3217, TLP3230 to TLP3250 TLP701, TLP705, TLP719 TLP550, TLP560G TLP560G 2. Tape Dimensions Unit: mm 2.0 0.1 F G KO C B D J E t A K Unit: mm Photocoupler Package Type Tape Option MFSOP6 (TPL), (TPR) (TPL), (TPR) 4.2 0.1 A 4.0 0.1 7.6 0.1 B SO8 SOP4 (TP) (TP) SOP16 2.54SOP4 2.54SOP6 2.54SOP8 SSOP4 (TP) (TP) 6.5 0.1 3.1 0.1 7.5 0.1 4.3 0.1 5.6 0.1 7.5 0.1 10.5 0.1 7.5 0.1 (TP) (TP) 7.5 0.1 6.7 0.1 10.5 0.1 (TP15) SDIP6 DIP(LF1, LF5) DIP(LF4) (TP) (TP) (TP1), (TP5) (TP4) 10.4 0.1 12.3 0.1 1 1 12.0 0.1 16.0 0.1 2.35 0.2 10.4 0.1 12.3 0.1 4.5 0.1 5.1 0.1 C 12.0 0.3 16.0 0.3 12.0 0.3 16.0 0.3 12.0 0.3 16.0 0.3 D 5.5 0.1 7.5 0.1 7.5 0.1 5.5 0.1 7.5 0.1 E F G Dimensions Symbol (See figure above) SO6 SDIP6 F type 5.5 0.1 1.75 0.1 8.0 0.1 12.0 0.1 8.0 0.1 12.0 0.1 4.0 0.1 12.0 0.1 16.0 0.1 4.0 0.1 + 0.1 1.5 - 0 J K 3.15 0.2 2.9 0.2 3.4 0.2 2.5 0.2 2.4 0.2 K0 2.8 0.1 2.6 0.1 3.1 0.1 2.3 0.1 2.2 0.1 2.6 0.2 2.5 0.2 2.4 0.2 2.4 0.2 2.4 0.1 2.3 0.1 2.2 0.1 2.1 0.1 0.3 0.05 t 4.55 0.2 4.1 0.1 0.4 0.05 1: Typical devices DIP4 DIP6 (short package) DIP8 TLP620 5.1 0.1 TLP631, TLP734, TLP747G 7.6 0.1 TLP555, TLP2601 10.1 0.1 (TP4) is not available 53 7 Packing Information 3. Reel Dimensions W1 W2 C C B A E B A U E W1 W2 o380 mm o330 mm o180 mm Unit: mm MFSOP, SO6 SO8 SOP4 Tape Option (TPL), (TPR) (TP) (TP) A o380 2 SOP16 2.54SOP4 2.54SOP6 2.54SOP8 SSOP4 (TP) (TP) SDIP6 (TP15) (TP) SDIP6 F type DIP(LF1, LF5) DIP(LF4) (TP) (TP1), (TP5) o330 2 +0 180 - 4 B o80 1 o60 o80 1 C o13 0.5 o13 o13 0.5 2.0 0.5 2 0.5 2.0 0.5 E Dimensions Symbol (See figure above) Photocoupler Package Type 4.0 0.5 4.0 0.5 W1 13.5 0.5 17.5 0.5 13.5 0.5 17.5 0.5 13 0.3 17.5 0.5 W2 17.5 1.0 21.5 1.0 17.5 1.0 21.5 1.0 15.4 1.0 21.5 1.0 U 4.0 0.5 o380 2 Photocouplers Manufactured in Thailand MFSOP DIP6(LF1,LF5,LF4) DIP4(LF1,LF5,LF4) DIP8(LF1,LF5) Tape Option (TPL), (TPR) (TP1), (TP5), (TP4) (TP1), (TP5), (TP4) (TP1), (TP5) A o380 2 o330 2 B o80 1 C o13 0.5 E U Dimensions Symbol (See figure above) Photocoupler Package Type 2.0 0.5 4.0 0.5 W1 13.5 0.5 17.5 0.5 W2 17.5 1.0 21.5 1.0 54 (TP4) 4. Other Packing Information a) Device orientation on tape Photocouplers are oriented in cavity, as shown below. User direction of feed A) B) Photocoupler Package Type Tape Option MFSOP6, SO6 TPR Photocoupler Package Type Tape Option A) MFSOP6, SO6 TPL SOP4, 2.54SOP4 TP SSOP4 TP15 Photocoupler Package Type Tape Option SOP16, SO8 TP 2.54SOP6/8 TP SDIP6 TP DIP(LF1, LF5) DIP(LF4) TP1, TP5 C) B) C) TP4 b) Tape Specifications Quantities Per Reel Photocoupler Package Type MFSOP6, SO6 SOP4, SO8 Quantity (pcs) 3000 2500 SOP16 2.54SOP4/6/8 SSOP4 SDIP6 2500 2500 1500 1500 SDIP6 F type DIP(LF1, LF5) DIP(LF4) 1000 1500 1000 Photocouplers Manufactured in Thailand Photocoupler Package Type MFSOP DIP4/6(LF1,LF5) DIP4/6(LF4) DIP8(LF1,LF5) Quantity (pcs) 3000 1500 1000 1000 Empty Cavities Item Specification Note Consecutive empty cavities Zero Non-consecutive empty cavities 0.2% max/reel 2 Any 40-mm portion of tape except leader and trailer. Except leader and trailer. 2: 6 pcs max/reel for DIP and SDIP packages c) Packing boxes e) Purchase order One or five reels per box Two or five reels per box for photocouplers manufactured in Thailand Specify the part number, tape and quantity as follows. Example TLP181(GB-TPR, F ) 3000 units *1 Quantity d) Label RoHS COMPATIBLF The reel label includes the following information: 1. Part number 2. Tape type 3. Quantity 4. Lot number *2 Tape option CTR rank Photocoupler part number *1: Must be a multiple of the quantity per-reel. *2: "F" identifies the indication of product Labels with "[[G]]/RoHS COMPATIBLE". Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product. The RoHS is the Directive 2002/95/EC of the European Parliament and of the Council of 27 January 2003 on the restriction of the use of certain hazardous substances in electrical and electronic equipment. 55 8 Board Assembly 1 Example Land Patterns Below are the example land patterns for surface-mount packages. Mini-flat and SOP couplers Unit: mm 1.2 0.8 1.2 0.8 0.8 6.3 1.27 3.73 1.27 6.3 1.27 6.3 1.2 0.8 0.95 SSOP4 [e.g., TLP3213] 2.54 2.54 MFSOP6 (5-Pin) [e.g., TLP114A] SOP4 [e.g., TLP280] 0.8 1.2 0.8 1.2 MFSOP6 (4-Pin) [e.g., TLP181] 2.54SOP4 [e.g., TLP197G] SO6 (4-Pin) [e.g., TLP265J] 1.27 1.27 5.5 6.3 1.27 1.27 1.27 1.27 2.54 SO8 [e.g., TLP2105] SO6 (5-Pin) [e.g., TLP109] Surface-Mount Lead-Formed Photocouplers Example: 6-pin DIP package Example: 6-pin SDIP package Unit: mm 1.5 0.8 2.54 0.8 1.6 1.7 10.4 8.8 10.4 8.7 1.6 1.6 1.5 Unit: mm 2.54 2.54 (LF1)&(LF5) [e.g., TLP734(LF1)] 1.27 1.27 2.54 1.27 1.27 (LF4) [e.g., TLP734(LF4)] SDIP6 [e.g., TLP719] For the example land patterns for the TLP781, see its datasheet. 56 SDIP6 (F type) [e.g., TLP719F] 2 Board Assembly Considerations 1. Soldering 2. Flux Cleaning When cleaning circuit boards to remove flux, make sure that no residual reactive ions such as sodium(Na+) or chloride(Cl-) ions remain. Note that organic solvents react with water to generate hydrogen chloride and other corrosive gases, which can degrade device performance. Washing devices with water will not cause any problems. However, make sure that no reactive ions such as sodium(Na+) or chloride(Cl-) ions are left as residue. Also, be sure to dry devices sufficiently after washing. Do not rub device markings with a brush or with your hand during cleaning or while the devices are still wet from the cleaning agent. Doing so can rub off the markings. Dip cleaning, shower cleaning and steam cleaning processes all involve the chemical action of a solvent. Use only recommended solvents for these cleaning methods. When immersing devices in a solvent or steam bath, make sure that the temperature of the liquid is 50C or below and that the circuit board is removed from the bath within one minute. If a device package allows ultrasonic cleaning, keep the duration of ultrasonic cleaning as short as possible, since long hours of ultrasonic cleaning degrade the adhesion between the mold resin and the frame material. When using a soldering iron or medium infrared ray/hot air reflow, avoid a rise in device temperature as much as possible by observing the following conditions. 1.1) Using a soldering iron a. Solder once within 10 seconds for a lead temperature of up to 260C. b. Solder once within 3 seconds for a lead temperature of up to 350C. 1.2) Using medium infrared ray/hot air reflow a. Complete the infrared ray/hot air reflow process at once within 30 seconds at a package surface temperature between 210C and 240C. b. Example of temperature profile of lead (Pb) solder Package surface temperature (C) 240 210 150 60 to 90 seconds 30 seconds or less The following ultrasonic cleaning conditions are recommended. Time Frequency: 27 kHz to 29 kHz Ultrasonic output power: 300 W or less (0.25 W/cm2 or less) Cleaning time: 30 seconds or less Example of temperature profile of lead (Pb) solder c. Example of temperature profile of lead (Pb)-free solder The profile below shows only the typical temperature profile and conditions, which might not apply to all Toshiba photocouplers. Temperature profiles and conditions may differ from product to product. Refer to the relevant technical datasheets and databooks when mounting a device. Suspend the circuit board in the solvent bath during ultrasonic cleaning in such a way that the ultrasonic vibrator does not come into direct contact with the circuit board or the device. Conventional cleaning solvents that contain freon are not recommended due to its adverse effection the earth's ozone layer. Alternative freon-free products are available on the market. Some of these alternative cleaning agents are listed in the table below. Contact Toshiba or a Toshiba distributor regarding cleaning conditions and other relevant information for each product type. Package surface temperature (C) 260 230 Examples of Alternative Cleaning Agents 190 Technocare FRW-1, FRW-17, FRV-100 GE Toshiba Silicon Asahi Clean AK-225AES Asahi Glass Co., Ltd Clean Through 750H Kao Co., Ltd. Pine Alpha ST-100S, ST-100SX Arakawa Chemical Co., Ltd. 180 60 to 120 seconds 30 to 50 seconds Time Example of temperature profile of lead (Pb)-free solder d. Precautions for heating Keeping packages at high temperature for a long period of time can degrade the quality and reliability of devices. Soldering time has to be kept as short as possible to avoid a rise in package temperature. When using a halogen lamp or infrared heater, avoid direct irradiation of packages, since this may cause a rise in package temperature. 1.3) Dip soldering (flow soldering) The thermal shock of dip soldering increases thermal stress on devices. To avoid stress, the use of a soldering iron or medium infrared ray/hot air reflow is recommended. If you want to use dip soldering, contact your nearest Toshiba sales representative. 57 9 Device Degradation 1 Projected Operating Life Based on LED Light Output Degradation Toshiba photocouplers use one of four types of LEDs and a projection of the operating life has been made for each LED. The table on page 57 shows the types of LED used in photocouplers and the figures on pages 58 to 60 show projections of long-term light output performance and operating life. Note that these operating life data are estimates extrapolated from long-term light output degradation over a single wafer lot and are shown as reference only. Projected Operating Life Ta = 40C, IF = 20 mA, failure criteria: degradation rate PO < -50% Photocouplers F50% operating life F0.1% operating life 1,300,000 h 260,000 h 2 GaA As(SH) LED 540,000 h 100,000 h 3 GaA As(DH) LED 1,000,000 h 200,000 h 4 GaA As(MQW) LED Ask your local Toshiba sales representative. 1 GaAs LED Mainly for phototransistor output devices and phototriac output devices Mainly for photo-IC couplers Mainly for photorelays (MOSFET output), photovoltaic couplers and photo-IC couplers Mainly for photo-IC couplers F50% (cumulative failure rate 50%) operating life: Time period until the projected long-term light output degradation curve of the average light output change ( X ) shown on pages 58 to 60 reaches the failure criteria. F0.1% (cumulative failure rate 0.1%) operating life: Time period until the projected long-term light output degradation curve of X - 3 shown on pages 58 to 60 reaches the failure criteria. The relationship between LED light output degradation and optical coupling characteristics is shown below. (1) The relationship between LED light output degradation and current transfer ratio (CTR)/short circuit current (ISC) is 1:1. CTR (t) CTR (o) = Po (t) Po (o) (2) The relationship between a reciprocal value of LED light output degradation and I FT/I FLH/I FHL/I FH change is 1:1. I FT (t) I FT (o) = 58 ( Po (t) Po (o) ) -1 LEDs Used in Photocouplers LED: 1 GaAs LED 2 GaA As (SH) LED 3 4 Photocouplers LED GaA As (MQW) LED Photocouplers LED 4N25 (SHORT) 1 TLP160 Series 1 TLP363 Series 1 TLP599 Series 1 TLP2630 2 4N25A (SHORT) 1 TLP161 Series 1 TLP371 1 TLP620 Series 1 TLP2631 2 4N26 (SHORT) 1 TLP163 1 TLP372 1 TLP621 Series 1 TLP3022(S) Series 1 4N27 (SHORT) 1 TLP165J 1 TLP373 1 TLP624 Series 1 TLP3042(S) Series 1 4N28 (SHORT) 1 TLP166J 1 TLP421 Series 1 TLP626 Series 1 TLP3063(S) Series 3 4N29 (SHORT) 1 TLP168J 3 TLP504A 1 TLP627 Series 1 TLP31xx Series 1 4N29A (SHORT) 1 TLP172 Series 1 TLP512 2 TLP628 Series 1 TLP32xx Series 1 4N30 (SHORT) 1 TLP174G 1 TLP513 2 TLP629 Series 1 TLP3230 1 4N31 (SHORT) 1 TLP176 Series 1 TLP521-1 1 TLP630 1 TLP3231 1 4N32 (SHORT) 1 TLP180 1 TLP521-2 1 TLP631 1 TLP3240 3 4N32A (SHORT) 1 TLP181 1 TLP521-4 1 TLP632 1 TLP3241 3 4N33 (SHORT) 1 TLP190B 3 TLP523 Series 1 TLP641 Series 1 TLP3250 3 4N35 (SHORT) 1 TLP191B 3 TLP525G Series 1 TLP651 2 TLP3762(S) Series 1 4N36 (SHORT) 1 TLP192 Series 1 TLP531 1 TLP700 3 TLP3904 1 4N37 (SHORT) 1 TLP197 Series 1 TLP532 1 TLP701 2 TLP3914 3 4N38 (SHORT) 1 TLP200D 1 TLP541G 1 TLP702 2 TLP3924 3 4N38A (SHORT) 1 TLP202 Series 1 TLP542G 1 TLP705 2 TLP4xxx Series 1 6N135 2 TLP206 Series 1 TLP543J 1 TLP706 2 TLP104 4 6N136 2 TLP222 Series 1 TLP545J 1 TLP716 2 TLP118 4 6N137 2 TLP224G Series 1 TLP550 2 TLP719 2 TLP151 4 6N138 2 TLP225A 1 TLP551 2 TLP731 1 TLP350H 4 6N139 2 TLP227 Series 1 TLP552 2 TLP732 1 TLP351H 4 TLP102 2 TLP250 Series 2 TLP553 2 TLP733 Series 1 TLP700H 4 TLP106 2 TLP251 Series 2 TLP554 2 TLP734 Series 1 TLP701H 4 TLP112 2 TLP260J 1 TLP555 2 TLP741 Series 1 TLP708 4 TLP112A 3 TLP270 Series 1 TLP557 2 TLP747 Series 1 TLP714 4 TLP113 2 TLP280 Series 1 TLP558 2 TLP750 Series 2 TLP754 4 TLP114A 3 TLP281 Series 1 TLP559 2 TLP751 Series 2 TLP2168 4 TLP115 2 TLP283 Series 1 TLP560 Series 1 TLP759 Series 2 TLP2368 4 TLP115A 3 TLP296G 1 TLP561 Series 1 TLP762J Series 1 TLP2404 4 TLP116 3 TLP320 Series 1 TLP570 1 TLP763J Series 1 TLP2409 4 TLP117 3 TLP330 1 TLP571 1 TLP797 Series 1 TLP2418 4 TLP124 1 TLP331 1 TLP572 1 TLP798GA 3 TLP2451 4 TLP126 1 TLP332 1 TLP590B 3 TLP2066 3 TLP2468 4 TLP127 1 TLP350 2 TLP591B 3 TLP2200 2 TLP2768 4 TLP130 1 TLP351 2 TLP592 Series 1 TLP2530 2 TLP131 1 TLP351A 2 TLP594 Series 1 TLP2531 2 TLP137 1 TLP360 Series 1 TLP597 Series 1 TLP2601 2 TLP361 Series 1 TLP598 Series 3 TLP260J 1 TLP141G 1 Photocouplers LED GaA As (DH) LED 59 Photocouplers LED Photocouplers LED 9 1 GaAs LED Projected Light Output Degradation Data Light output (PO) relative change (%) Device Degradation 140 Test conditions: I F = 20 mA, Ta = 40C Light output (PO) relative change (%) Test conditions: I F = 50 mA, Ta = 40C 120 100 X 80 60 40 X-3 20 0 10 1 100 1000 10000 100000 140 120 X 100 80 X-3 60 40 20 0 10 1 100 Test time (h) 1000 10000 100000 Test time (h) Light output (PO) relative change (%) Test conditions: I F = 10 mA, Ta = 40C 140 120 X 100 80 X-3 60 40 20 0 10 1 100 1000 10000 100000 Test time (h) 1 GaAs LED Projected Operating Life Data Failure criteria light output degradation PO < -50% Failure criteria light output degradation PO < -30% IF = 10 mA 10000000 10000000 IF = 10 mA 1000000 100000 IF = 10 mA IF = 30 mA IF = 40 mA IF = 50 mA IF = 20 mA IF = 30 mA IF = 40 mA IF = 50 mA Projected operating life (h) Projected operating life (h) IF = 20 mA 10000 Projected F50% operating life 1000 IF = 20 mA 1000000 IF = 10 mA 100000 10000 IF = 30 mA IF = 40 mA IF = 50 mA IF = 20 mA IF = 30 mA IF = 40 mA IF = 50 mA Projected F50% operating life 1000 Projected F0.1% operating life Projected F0.1% operating life 100 2.0 227 3.0 150 100 85 60 4.0 25 0 100 2.0 5.0 1 / K (x10-3) -30 -50 -73 227 Ambient Temperature (C) 3.0 150 100 85 60 4.0 25 0 5.0 1 / K (x10-3) -30 -50 -73 Ambient Temperature (C) The above operating life data are estimates extrapolated from long-term light output degradation over a single wafer lot and are shown as reference only. Operating conditions exceeding the maximum ratings are not guaranteed. 60 2 GaA As (SH) LED Projected Light Output Degradation Data Test conditions: I F = 20 mA, Ta = 40C Light output (PO) relative change (%) Light output (PO) relative change (%) Test conditions: I F = 50 mA, Ta = 40C 140 120 100 80 X 60 40 X-3 20 0 10 1 100 1000 10000 140 120 80 60 X-3 40 20 0 100000 X 100 10 1 100 Test time (h) 1000 10000 100000 Test time (h) Light output (PO) relative change (%) Test conditions: I F = 10 mA, Ta = 40C 140 120 X 100 80 X-3 60 40 20 0 10 1 100 1000 10000 100000 Test time (h) 2 GaA As (SH) LED Projected Operating Life Data Failure criteria light output degradation PO < -30% Failure criteria light output degradation PO < -50% 10000000 10000000 IF = 10 mA IF = 10 mA IF = 10 mA 100000 10000 Projected operating life (h) Projected operating life (h) IF = 20 mA 1000000 IF = 30 mA IF = 40 mA IF = 50 mA IF = 20 mA IF = 30 mA IF = 40 mA IF = 50 mA Projected F50% operating life 1000 1000000 IF = 20 mA IF = 10 mA IF = 30 mA IF = 40 mA IF = 50 mA 100000 10000 IF = 20 mA IF = 30 mA IF = 40 mA IF = 50 mA Projected F50% operating life 1000 Projected F0.1% operating life Projected F0.1% operating life 100 2.0 227 3.0 150 100 85 60 4.0 25 0 100 2.0 5.0 1 / K (x10-3) -30 -50 -73 227 Ambient Temperature (C) 3.0 150 100 85 60 4.0 25 0 5.0 1 / K (x10-3) -30 -50 -73 Ambient Temperature (C) The above operating life data are estimates extrapolated from long-term light output degradation over a single wafer lot and are shown as reference only. Operating conditions exceeding the maximum ratings are not guaranteed. 61 9 Device Degradation GaA As (DH) LED Projected Light Output Degradation Data 3 Test conditions: I F = 20 mA, Ta = 40C Light output (PO) relative change (%) Light output (PO) relative change (%) Test conditions: I F = 50 mA, Ta = 40C 140 120 100 X 80 60 40 X-3 20 0 10 1 100 1000 10000 140 120 X 100 80 X-3 60 40 20 0 100000 10 1 100 Test time (h) 1000 10000 100000 Test time (h) Light output (PO) relative change (%) Test conditions: I F = 10 mA, Ta = 40C 140 120 X 100 80 X-3 60 40 20 0 1 10 100 1000 10000 100000 Test time (h) GaA As (DH) LED Projected Operating Life Data 3 Failure criteria light output degradation PO < -30% Failure criteria light output degradation PO < -50% IF = 10 mA 10000000 10000000 IF = 10 mA IF = 20 mA 100000 IF = 10 mA IF = 20 mA IF = 30 mA IF = 40 mA IF = 50 mA 10000 Projected F50% operating life 1000 IF = 20 mA 1000000 IF = 30 mA IF = 40 mA IF = 50 mA Projected operating life (h) Projected operating life (h) 1000000 IF = 30 mA IF = 40 mA IF = 50 mA IF = 10 mA 100000 10000 IF = 20 mA IF = 30 mA IF = 40 mA IF = 50 mA Projected F50% operating life 1000 Projected F0.1% operating life 100 2.0 227 3.0 150 100 85 60 4.0 25 0 Projected F0.1% operating life 100 2.0 5.0 1 / K(x10-3) -30 -50 -73 227 Ambient Temperature (C) 3.0 150 100 85 60 4.0 25 0 5.0 1 / K(x10-3) -30 -50 -73 Ambient Temperature (C) The above operating life data are estimates extrapolated from long-term light output degradation over a single wafer lot and are shown as reference only. Operating conditions exceeding the maximum ratings are not guaranteed. 62 4 GaA As (MQW) LED Projected Light Output Degradation and Operating Life Data Toshiba is now preparing the light output degradation and operating life data for GaA As LEDs. These data are available for individual LEDs. Ask your local Toshiba sales representative. Note 63 9 Device Degradation Reading the Projected LED Operating Life Graph For example, let's calculate the operating life of the GaAs LED, based on the data shown on page 60. Here is an example of how to read an operating life, assuming that the ambient temperature (Ta) is 40C and that the failure criterion is a 30% decrease in light output. Suppose that the initial LED current, IF, is 20 mA. Since the horizontal axis of the failure criteria graph is the reciprocal of absolute temperature, it is necessary to convert the ambient temperature (Ta) to the reciprocal of absolute temperature (T): T= 1 1 = Ta + 273.15 40 + 273.15 3.19 x 10-3 The graph shows the projected lifetimes for F50% and F0.1% cumulative failure probabilities in solid and dashed lines respectively. Normally, it is recommended to use F0.1% lines. As X = 3.19, its intersection with the IF = 20 mA line for F0.1% is approximately 80,000 hours. (This figure is for reference only.) Failure criteria for light output degradation PO < -30% 10000000 IF = 10mA IF = 20mA Projected operating life (h) 1000000 IF = 30mA IF = 10mA IF = 40mA 100000 80000 IF = 20mA IF = 30mA IF = 50mA IF = 40mA IF = 50mA 10000 Projected F50% operating life 1000 Projected F0.1% operating life 100 2.0 227 3.0 3.19 150 100 85 60 40 4.0 25 0 5.0 1/K(x10-3) -20 -50 -73 Ambient Temperature (C) You can also estimate the projected operating life from the projected light output degradation data. Light output (PO) relative change (%) Test conditions: I F = 20 mA, Ta = 40C 140 120 X 100 -30% 80 70 60 X-3 40 20 0 1 10 100 1000 Test time (h) 64 10000 100000 80000 10 Safety Standard Approvals Toshiba offers a wide selection of photocouplers with a transistor output, IC output, thyristor output and triac output, as well as photorelays certified to UL (USA), cUL (Canada), VDE (Germany), BSI (Britain) and SEMKO (Sweden). Safety Standard Approvals for Photocouplers (DIN EN60747-5-2) Reflective Photocouplers in Single-Molded Packages Mechanical Construction Coupling Medium (Window) Transmissive Photocouplers in Single-Molded Packages Package (Body) Coupling Medium (Window) Photo Detector Chip Package (Body) Internal Construction Lead Lead LED Chip Package Isolation Creepage Path (mm) Construction Isolation Clearance (mm) Mechanical Ratings Isolation Thickness (min) (mm) Internal Creepage Path (mm) Max. VDE/TUV Working Insulation DIN Voltage (Viorm) EN Highest Allowable Overvoltage 60747-5-2 (Viotm) Photo Detector Chip SOP4/SOP16 LED Chip MFSOP6 (2 ch) 2.54SOP 4/6/8 DIP (F type) Certified Devices Triac/Thyrsitor Output DIP 4.0 5.0 4.0 4.0 4.2 4.0 6.4/7.0 8.0 4.0 5.0 4.0 4.0 4.2 4.0 6.4/7.0 8.0 0.4 0.4 0.4 - - - (0.4) (0.4) - - - - - - - - 565 Vpk 707 Vpk 565 Vpk 565 Vpk 565 Vpk 565 Vpk 630 Vpk /890 Vpk 1140 Vpk 4000 Vpk 6000 Vpk 6000 Vpk 4000 Vpk 4000 Vpk 2500 Vpk 4000 Vpk 6000 Vpk TLP350 TLP351 TLP2105 TLP2108 TLP2166A TLP2116 TLP2117 IC Output Transistor Output SO8 MFSOP6 TLP280 TLP280-4 TLP281 TLP281-4 TLP284 TLP284-4 TLP285 TLP285-4 TLP180 TLP181 TLP127 TLP260J TLP261J TLP160G TLP160J TLP161G TLP161J TLP560G TLP560J TLP561G TLP561J TLP176A TLP176D TLP176G TLP197G TLP206G Photorelay TLP350F TLP351F TLP227G TLP227G-2 TLP597G The table above lists photocouplers and photorelays that have already been approved as of January 2011. The information herein is subject to change. For the latest information, please contact your nearest Toshiba sales representative. 65 10 Safety Standard Approvals Safety Standard Approvals for Photocouplers (DIN EN60747-5-2) (Continued) Transmissive Photocouplers with an Insulating Film in Single-Molded Packages Mechanical Construction Coupling Medium (Window) Photo Detector Chip Internal Construction LED Chip Package Isolation Creepage Path (mm) Construction Isolation Clearance (mm) Mechanical Ratings Isolation Thickness (min) (mm) Internal Creepage Path (mm) VDE/TUV DIN EN 60747-5-2 Max. Working Insulation Voltage (Viorm) Highest Allowable Overvoltage (Viotm) SO8 Transmissive Photocouplers in Double-Molded Packages Package (Body) Package (Body) Lead Lead Film SDIP6 LED Chip DIP SDIP6 (F type) DIP (F type) MFSOP6 SO6 DIP (F type) 4.2 7.0 8.0 6.4/7.0 8.0 4.0 5.0 6.5/7.0 8.0 4.2 7.0 8.0 6.4/7.0 8.0 4.0 5.0 6.5/7.0 8.0 0.4 0.4 0.4 0.4/0.5 0.4/0.5 - 0.4 0.4/0.5 0.4/0.5 - - - - - - - 4.0 4.0 565 Vpk 890 Vpk 1140 Vpk 890 Vpk 1140 Vpk 565 Vpk 707 Vpk 890 Vpk /1130 Vpk 890 Vpk /1130 Vpk 6000 Vpk 8000 Vpk 8000 Vpk 6000 Vpk /8000 Vpk 6000 Vpk /8000 Vpk 4000 Vpk /6000 Vpk 6000 Vpk 6000 Vpk /8000 Vpk 6000 Vpk /8000 Vpk TLP701 TLP705 TLP715 TLP716 TLP718 TLP719 TLP701F TLP705F TLP715F TLP716F TLP718F TLP719F TLP350HF TLP351HF TLP750F TLP751F TLP759F Transistor Output TLP620 TLP620-2 TLP620-4 TLP627 TLP627-2 TLP627-4 TLP731 TLP732 TLP620F TLP620F-2 TLP621F TLP621F-2 Triac/Thyrsitor Output TLP360J TLP361J TLP363J TLP3022(S) TLP3023(S) TLP3042(S) TLP3043(S) TLP3052(S) TLP3062(S) TLP3063(S) TLP3064(S) TLP3082(S) TLP3762(S) TLP3782(S) TLP3783(S) TLP360JF TLP165J TLP361JF TLP166J TLP363JF TLP3022F(S) TLP3023F(S) TLP3042F(S) TLP3043F(S) TLP3052F(S) TLP3062F(S) TLP3063F(S) TLP3064F(S) TLP3082F(S) TLP3762F(S) TLP3782F(S) TLP3783F(S) Certified Devices DIP (1 ch) TLP350H TLP351H TLP750 TLP751 TLP759 IC Output Coupling Medium (Window) Photo Detector Chip TLP2403 TLP2405 TLP2408 TLP2409 TLP105 TLP108 TLP114A TLP116 TLP117 TLP2066 TLP109 TLP116A TLP104 TLP151 TLP265J TLP266J TLP733 TLP734 TLP781 TLP733F TLP734F TLP781F TLP762J TLP763J TLP748J TLP762JF TLP763JF TLP748JF The table above lists photocouplers and photorelays that have already been approved as of January 2011. The information herein is subject to change. For the latest information, please contact your nearest Toshiba sales representative. 66 11 Photocoupler Application Circuit Examples 1 Digital Interface Applications High Speed TLP118, TLP2601 VCC 5V VCC VCC 5V 7.5 mA 0.1 F The TLP2601 allows high-speed data transmission at up to approximately 5 MHz. Data rate of left-side circuit 1 k 390 f (typ.): 5 Mbit/s (duty cycle 1/2) LSTTL LSTTL Low Input Current Drive TLP553 VCC 5V VCC 5V 0.5 mA 4.7 k The high-CTR (current transfer ratio) TLP553 allows operation with low input current (0.5 mA) and direct driving with a CMOS signal. 510 k Data rate of left-side circuit 6.8 k 15 k 0.1 F LSTTL f (typ.): 50 kbit/s (duty cycle 1/2) CMOS No Pull-up Resistor Required TLP2200 VCC 5V VCC VCC 5V 2 k When the TLP2200 with a 3-state output is used, the next-stage logic gate can be actuated without using a pull-up resistor. 1.6 mA Data rate of left-side circuit LSTTL 120 pF f (typ.): 1 Mbit/s (duty cycle 1/2) LSTTL High VCC Tolerance By using the TLP558 which tolerates VCC up to 20 V, CMOS logic gates and other components can be driven without design restrictions on VCC. TLP558 VCC VCC VCC 5V 3 mA RL 1.1 k Data rate of left-side circuit 0.1 F CMOS f (typ.): 1 Mbit/s (duty cycle 1/2) LSTTL VCC = 5 V RL = 3 k VCC = 20 V RL = 12 k 67 11 Photocoupler Application Circuit Examples 2 Inverter and AC-DC Servo Applications [Photo-IC couplers: high-speed base/gate drive applications] TLP109 / TLP2409 TLP550 / TLP559 TLP759 GTR Direct Drive TLP557 IGBT / Power MOS Direct Drive (for medium-power IGBTs): TLP350/ TLP358/ TLP700 High-Speed TLP118 / TLP554 (for small-power IGBTs): TLP351 / TLP701 / TLP705 AC Servo Inverter (PWM) DC Servo (Numerical control, Robotics) M M Base/Gate Drive Circuit Base/Gate Drive Circuit Driving the Base of a 15-A-Class GTR (Giant Transistor) Module TLP557 VCC 8 mA 5V 390 VCC Rex 4.3 The TLP557 drives the base of a GTR directly. An external resistor, Rex, is connected between 6V pins 6 and 7. This resistor causes the base current to become constant and stabilizes the GTR drive. LSTTL 47 F Driving the Base of a 100-A-Class GTR Module TLP557 VCC 8 mA 5V 390 VCC Rex 4.3 2 8V The TLP557 photo-IC coupler and two booster transistors can drive a high-power GTR. 150 LSTTL 100 F Driving the Gate of a 15-A-Class IGBT (Insulated Gate Bipolar Transistor) Module TLP351 / TLP2541 8 mA 5V 390 1 2 3 4 The TLP151, TLP351, TLP701, TLP705 and 8 TLP2541 high-speed photo-IC photocouplers can VCC 7 0.1 F drive a low-power IGBT directly. 6 5 VEE LSTTL 68 Driving the Gate of a 50-A-Class IGBT Module The TLP350 and TLP700 can drive a medium-power TLP350 8 mA 5V 390 IGBT directly. 8 1 2 VCC 0.1 F 7 3 6 5 4 VEE LSTTL Driving the Gate of a 400-A-Class IGBT Module The TLP351, TLP701, TLP705or TLP2541 TLP351/ TLP2541 8 mA 5V 390 high-speed photo-IC photocoupler and two booster 8 1 2 0.1 F transistors can drive a high power IGBT. VCC 7 3 6 5 4 VEE LSTTL Driving the Gate of an IGBT Module Using an IGM Photocoupler TLP109 (IGM) TLP559 (IGM) TLP759 (IGM) IGM photocouplers are suitable for driving an intelligent power module (IPM). These photocouplers guarantee symmetrical low-to-high 20 k and high-to-low propagation delays (l tPLH - tPHL l) and provides a high common mode transient +15 V immunity. 0.1 F 10 mA -10 V IGM Selection Part Number TLP109 (IGM) Package SO6 BVs (Vrms) VO/VCC CTR 20 V / 30 V max 25% min 75% max @IF = 10 mA VCC = 4.5 V VO = 0.4 V 3750 TLP559 (IGM) DIP8 2500 TLP759 (IGM) DIP8 5000 69 tPLH - tPHL 0.7 s max @IF = 10 mA RL = 20 k CMH CML 10000 V / s min @IF = 0 mA RL = 20 k VCM = 1500 Vp-p - 10000 V / s min @IF = 10 mA RL = 20 k VCM = 1500 Vp-p 11 Photocoupler Application Circuit Examples 3 Home Appliance Applications Electric Oven/Grills Magnetron Thermo-Switch Door-Open Monitor Switch H.V. Transformer Magnetron Tube Blower Motor Turntable Motor Grill Heater OvenCavity Lamp TLP560G H TLP560J M 120 Vac 50/60 Hz Door-Detector Circuit Weight Sensor TLP560G Microcontroller Gas Sensor Control Panel Refrigerator Block Diagram Photocouplers used for control applications Interior Fan TLP560G + main triac Interior Lamp TLP560G + main triac Defroster Heater (for Freezer Compartment) TLP560G + main triac Damper Motor (for refrigerator/ freezer compartment) TLP560G + main triac Defroster Heater (for refrigerator/ freezer compartment) TLP560G + main triac Panel Input Microcontroller Door Switch Temperature Sensor Compressor 70 (TLP560G) Automatic Washing Machines PC1 RT Operating Panel (Key Input) Th1 TLP560G M IF Operation Modes (Manual/automatic) Water Flow Speed PC2 RT Spinning Period Number of Rinsing TLP560G IF PC3 RT Drain Valve Microcontroller Th2 Th3 TLP560G IF TLP560J IF Washing Period Operation Detection Water Supply Valve AC-Input Photocoupler TLP620 (GB) Microcontroller Power Supply Circuit Configuration 100 Vac Fan Heaters (1)Block Diagram Burner Overheat Prevention Switch Temperature Limit Switch TLP561G Electric Heater (1 kW) Panel ZC Main Switch IF1 TLP561J Adjustment Switches VT1 Burner Motor (60 W) M ZC Display Room Temperature Sensor Microcontroller Speaker IM1 IF2 TLP561J Fan Motor (30 W) VT2 M ZC IM2 TLP781 Electromagnetic Fuel Pump Drive Circuit Preheat Sensor P TLP373 Earthquake Sensor Ignition IG 71 100 Vac 11 Photocoupler Application Circuit Examples 4 Home Appliance Applications (Continued) (2)Waveform Examples 1. Example of Operating Waveform for Burner Motor 2. Example of Operating Waveform for Fan Motor Trigger Point Trigger Point waveforms Top: Medium: Bottom: Horizontal: IF1 VT1 IM1 time 20 mA/div 100 V/div 1 A/div 50 ms/div waveforms Top: Medium: Bottom: Horizontal: IF2 VT2 IM2 time 20 mA/div 100 V/div 0.5 A/div 50 ms/div Inverter Air Conditioners Temperature Fuse 100 Vac Remote Control Panel Fan Motor for Room Unit Microcontroller for Indoor Unit Control Panel TLP560G Room Temperature Sensor Temperature Sensor M Motor for Air-Flow Direction Control TLP781 TLP548J M Indoor Unit Outdoor Unit TLP781 TLP548J Filter ZC Fan Motor for Outdoor Unit M Microcontroller for Outdoor Unit TLP560G Two-Way Valve / Four-Way Valve Rectifier IGBT Module IGBT Gate Drive Circuit VCC VO Compressor Motor TLP351 x 6 72 5 Programmable Controller Applications DC Output for Sequencers TLP127 /TLP627 TLP127 /TLP627 IF = 2 mA IF = 10 mA +100 V Load +100 V Load TLP225A /TLP222A IF = 10 mA +48 V Load AC Input for Sequencers VCC TLP280-4 O1 1 O2 2 Limit Switches Thermostats Transducer DC-AC Inputs O3 3 Logic Processor Logic Outputs O4 4 COMMON GND 120-/240-Vac Output for Sequencers and Solid State Relays (SSRs) TLP160G /TLP525G 120 VAC Motor Transformer Lamp Logic Processor TLP166J /TLP561J Logic Inputs ZC 73 240 VAC AC Outputs 11 Photocoupler Application Circuit Examples 6 SSR and Power Control Circuit Applications Zero-Crossing Phototriac Output: TLP561G/TLP561J and Mini-Flat TLP161G/TLP166J TLP161G/ TLP561G/ TLP3042(S) TLP166J / TLP561J / TLP3062(S) / TLP3082(S) / TLP3782(S) VCC AC Load RF RS CS ZC G: 120 Vac J: 240 Vac TNR RG Lamp Load (1-A tungsten lamp) Waveforms Top: IF 20 mA/div Medium: VT 100 V/div Bottom: IT 5 A/div L load (2.5-A pure inductive load) Recommended conditions IF = 20 mA RG = 47 RS = 47 , CS = 0.033 F Non-Zero Crossing Phototriac Output: TLP560G/TLP560J and Mini-Flat TLP160G/TLP260J TLP160G / TLP560G / TLP3022(S) TLP260J / TLP560J / TLP3052(S) RT AC Load VCC RF G : 100 J : 200 RS CS G: 120 Vac J: 240 Vac TNR RG Lamp Load (1-A tungsten lamp) L load (2.5-A pure inductive load) IF Top: Waveforms IF 20 mA/div Medium: VT 100 V/div Bottom: 5 A/div IT Recommended conditions = 20 mA RT = 100 /200 RG = 47 RS = 47 , CS = 0.033 F 74 7 Switching Power Supply Circuit Application + Regulated Voltage Filter - + TLP181 TLP285 TLP781 - Switching Error Amplification Feedback Control Circuit (IC) + - TLP148G TLP548J TLP549J TLP748J Overvoltage Protection Transistor Output ( : Approved, as of January 2010) CTR (IC / IF) Rank (%) Safety Standard Approvals Part Number TLP181/TLP285 TLP781 TLP750 (high-speed) Package Type MFSOP6/SOP4 DIP4 DIP8 Isolation Voltage UL BSI EN60747 1577 7002(EN60950) (Note 1) (Note 2) 3750 Vrms 5000 Vrms Nordic SEMKO * 5000 Vrms Min Max 50 100 600 600 (GR) Rank 50 100 150 300 (BL) Rank 200 600 (GRL) Rank 100 200 (GRH) Rank (O) Rank 150 19 300 - 10 - No Rank (GB) Rank (Y) Rank No Rank Thyristor Output ( : Approved, as of January 2010) Safety Standard Approvals Part Number TLP148G TLP548J TLP748J Package Type MFSOP6 DIP6 Isolation Voltage UL EN60747 1577 (Note 1) 2500 Vrms 4000 Vrms I FT (mA) VDRM (V) 10 400 7 600 600 10 Note 1: EN60747-approved with option (D4) Note 2: The EN60747-5-2 safety standard for compact packages is different from those for standard DIP packages. Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details. *: Double protection 75 11 Photocoupler Application Circuit Examples 8 Push-Button Telephone Application A variety of photocouplers are used to isolate between telephone lines (L1 and L2) and a CPU. Line Detector Ring Detector Dial Pulsing Line Switch TLP222G-2 L1 L2 TLP627 TLP629 TLP320 TLP180 TLP620 Dial Circuit +V Line Control Circuit +V Push-Button Telephone CPU Main Unit Part Number Application Package Type Features DC Input Ring Detector Dial Pulsing Line Detector Line Switch AC Input TLP620 General single transistor output in compact packages Good cost performance DIP4 TLP781 MFSOP6 SOP4 TLP181 DIP4 TLP627 MFSOP6 TLP127 High-VCEO (300 V) Darlington transistor output in compact packages Suitable to generate a pulse dial signal DIP4 TLP628 High-VCEO (350 V) single transistor output DIP4 TLP629 DIP4 TLP222G* TLP227G* DIP6 TLP592G* TLP597G* DIP8 (Dual) TLP222G-2* TLP227G-2* 2.54SOP4 TLP170G* TLP176D** 2.54SOP6 TLP192G* TLP197G* 2.54SOP8 (Dual) TLP200D** TLP202G* TLP281 TLP285 TLP180 TLP280 TLP320 High LED current rating = 150 mA Directly connectable to telephone lines MOSFET-output photorelay with VOFF = 400 V Crosspoint relay replacement TLP176G* (*: VOFF = 350 V, **: VOFF = 200 V) TLP206G* 76 9 Photovoltaic Coupler Applications TLP190B TLP590B This is the simplest power MOSFET drive circuit. The resistor RSH for discharging the gate capacitor reduces turn-off time. RSH is not required for the TLP591B, which has a built-in resistor. (TON, TOFF several ms) RSH TLP191B TLP591B Both AC and DC drivers become possible by connecting power MOSFETs in a common-source configuration. Transformerless AC-DC converter TLP590B x n 100 Aac DC Outputs Photovoltaic couplers in a parallel-serial configuration convert AC power to DC without a transformer. This type of configuration requires tens to hundreds of photovoltaic couplers. 10 Photorelays for Tester Application TLP3120 /TLP3122 /TLP3542 Power Source CPU Timing Generator Waveform Squaring Circuit Pattern Generator Logic Comparator TLP3113 to TLP3116 TLP3130 /TLP3131 TLP3213 to TLP3216 TLP3230 to TLP3231 TLP3240 /TLP3241 TLP3250 TLP3312 /TLP3375 OUT DC Test Unit 11 Photorelay (MOSFET Output) Application TLP222G-2 TLP227G-2 L1 Switch Signal +5 V TLP227G-2 TLP222G-2 +5V Switch Signal FAX L2 Example of Terminal Switching Application 77 11 Photocoupler Application Circuit Examples 12 NCU Circuit (Fax Modem Card) Application No No NCU circuit (fax modem card) need for output snubber circuit need for reverse-blocking diode in input side Off-Hook Relay Dial Pulsing Relay Line transformer shorting L1 Line L2 TLP280 TLP281 +5 V +5 V TLP172G/170G 176G/192G 176D/197G SOP Photorelay Half-Pitch Mini-Flat Coupler Controller Ring Detector 13 Competitor Part Number Cross Reference Search The Toshiba Semiconductor webpage at http://www.semicon.toshiba.co.jp/eng/product/opto/selection/coupler/xref/index.html offers a cross reference search tool for photocouplers and photorelays. 78 Modem CPU 12 Competitor Cross Reference NEC Part Number PS2501-1 PS2561-1 PS2571-1 PS2581L1 PS2505-1 PS2565-1 PS2502-1 PS2562-1 PS2532-1 PS2533-1 PS2521-1 PS2525-1 PS2701-1 PS2761-1 PS2705-1 PS2765-1 PS2702-1 PS2801-1 PS2801-4 PS2861-1 PS2805-1 PS2805-4 PS2865-1 PS8601 PS8602 PS9613 PS8701 PS8101 PS9713 PS9113 PS9601 PS9614 PS9714 PS9114 PS9715 PS9115 PS9701 PS7141-1A PS7141-2A PS7141-1B PS7141-2B PS7141-1C PS7341C-1A PS7141C-2A PS7241-1A PS7241-2A PS7241-1B PS7241-2B PS7241-1C Panasonic Toshiba Part Number TLP781 TLP781 TLP781 TLP781F TLP620 TLP620 TLP627 TLP627 TLP627 TLP627 TLP629 TLP320 TLP181 TLP181 TLP180 TLP180 TLP127 TLP281 TLP281-4 TLP281 TLP280 TLP280-4 TLP280 TLP759 TLP759 TLP759 (IGM) TLP109 TLP109 TLP109 (IGM) TLP109 (IGM) TLP554 TLP554 TLP118 TLP118 TLP118 TLP118 TLP118 TLP597GA TLP227GA-2 TLP4597G TLP4227G-2 TLP4006G TLP594G TLP224G-2 TLP176GA TLP206GA TLP4176G TLP4206G TLP4026G SHARP Part Number Toshiba Part Number Part Number AQV210 AQV210E AQV210EH AQV210S AQV212 AQV212S AQV214 AQV214E AQV214EH AQV214H AQV214S AQV215 AQV216 AQV217S AQV410EH AQV414 AQV414E AQV414S AQW210 AQW210S AQW212 AQW214 AQW214S AQW215 AQW217 AQW414 AQW610S AQW614 AQY210EH AQY210LS AQY210S AQY214EH AQY214S AQY410EH AQY414EH AQY414S AQY221N1S AQY221N2S AQY221R2V AQY221N2V TLP592G TLP597G TLP797GA TLP192G TLP592A TLP197A TLP597GA TLP597G TLP797GA TLP797GA TLP197GA TLP597A TLP797J TLP197D TLP4592G TLP4592G TLP4597G TLP4197G TLP222G-2 TLP202G TLP222A-2 TLP227GA-2 TLP206GA TLP222A-2 TLP222G-2 TLP4222G-2 TLP4026G TLP4007G TLP227G TLP174G TLP174G TLP227G TLP176GA TLP4227G TLP4227G TLP4176G TLP3113 /TLP3116 TLP3113 /TLP3116 TLP3215 TLP3216 PC123 PC817 PC813 PC815 PC357NT PC354NT PC355NT PC3H7 PC3H3 PC3H21 PC410 PC942 PC923 S2S3 S2S4 PR36MF11NSZ PR36MF12NSZ S21MD3V S201D01 S201D02 Part Number TLP781 TLP781 TLP620 TLP627 TLP181 TLP180 TLP127 TLP281 TLP280 TLP525G TLP118 TLP351 TLP351 TLP260J TLP161J TLP3506 TLP3506 TLP3051 (S) TLP3526 TLP3527 Fairchild Part Number FOD617 FOD814 FOD815 FOD817 FOD852 FODM3021 FODM3022 FODM3051 FODM3052 H11A617 H11A817 H11AA814 H11B815 HMA121 HMA124 HMA2701 HMHA2801 HMHA281 HMAA2705 HMHAA280 H11A1 H11AA1 H11AG1 H11B1 H11C1 H11D1 H11G1 MOC3021-M MOC3022-M MOC3023-M MOC3041-M MOC3042-M MOC3043-M MOC3051-M MOC3052-M MOC3061-M MOC3062-M MOC3063-M Vishay SFH614A SFH615A SFH617A SFH618A TCET1100 SFH690xT TCMT1100 TCMT4100 SFH628A K815P SFH612A SFH619A SFH655A SFH692AT TCED1100 IL66 IL66B IL255 Avago Toshiba Part Number Toshiba Part Number TLP628 TLP781 TLP781 TLP624 TLP781 TLP181 TLP281 TLP281-4 TLP620 TLP627 TLP627 TLP627 TLP627 TLP127 TLP627 TLP371 TLP372 TLP330 Note: For details of equivalent devices such as electrical performance and package dimensions, please refer to the latest datasheets. 79 Toshiba Part Number TLP781 TLP620 TLP627 TLP781 TLP627 TLP160G TLP160G TLP160J TLP160J TLP781 TLP781 TLP620 TLP627 TLP181 TLP124 TLP181 TLP281 TLP281 TLP180 TLP280 TLP631 TLP630 TLP331 TLP571 TLP541G TLP371 TLP371 TLP3021 (S) TLP3022 (S) TLP3023 (S) TLP3041 (S) TLP3042 (S) TLP3043 (S) TLP3051 (S) TLP3052 (S) TLP3061 (S) TLP3062 (S) TLP3063 (S) Part Number HCPL-M600 HCPL-M601 HCPL-M611 HCPL-M452 HCPL-M453 HCPL-M456 HCPL-2601 HCPL-2611 HCPL-2201 HCPL-2530 HCPL-2531 HCPL-2630 HCPL-2631 HCPL-3120 HCPL-3140 HCPL-3150 HCPL-3180 HCPL-314J HCPL-4504 HCPL-0708 HCPL-181 HCPL-354 HCPL-814 Toshiba Part Number TLP118 TLP118 TLP118 TLP109 TLP109 TLP109 TLP2601 TLP2601 TLP555 TLP2530 TLP2531 TLP2631 TLP2631 TLP350 TLP351 TLP351 TLP350 TLP701 x2 TLP559 TLP116A TLP181 TLP180 TLP620 LITEON Part Number LTV-123 LTV-816 LTV-817 LTV-851 LTV-356T LTV-357T LTV-814 LTV-814H LTV-354T LTV-815 LTV-852 LTV-352T LTV-355T MOC3020 MOC3021 MOC3022 MOC3023 MOC3051 MOC3052 MOC3061 MOC3062 MOC3063 Toshiba Part Number TLP781 TLP781 TLP781 TLP628 TLP181 TLP181 TLP620 TLP320 TLP180 TLP627 TLP627 TLP127 TLP127 TLP3020 (S) TLP3021 (S) TLP3022 (S) TLP3023 (S) TLP3051 (S) TLP3052 (S) TLP3061 (S) TLP3062 (S) TLP3063 (S) COSMO Part Number K1010 K2010 K3010 KP3020 KP4010 KP4020 K5010 K6010 KPS2801 KPC354NT KPC355NT KPC357NT KPC452 Toshiba Part Number TLP781 TLP631 TLP620 TLP620-2 TLP627 TLP627-2 TLP371 TLP630 TLP281 TLP180 TLP127 TLP181 TLP127