EC1125T-40.960M RoHS EC11 25 Series RoHS Compliant (Pb-free) 5.0V 14 Pin DIP Metal Thru-Hole HCMOS/TTL Oscillator T Pb -40.960M Nominal Frequency 40.960MHz Frequency Tolerance/Stability 25ppm Maximum Package Pin 1 Connection No Connect Duty Cycle 50 5(%) Operating Temperature Range 0C to +70C ELECTRICAL SPECIFICATIONS Nominal Frequency 40.960MHz Frequency Tolerance/Stability 25ppm Maximum (Inclusive of all conditions: Calibration Tolerance at 25C, Frequency Stability over the Operating Temperature Range, Supply Voltage Change, Output Load Change, First Year Aging at 25C, Shock, and Vibration) Aging at 25C 5ppm/year Maximum Operating Temperature Range 0C to +70C Supply Voltage 5.0Vdc 10% Input Current 55mA Maximum Output Voltage Logic High (Voh) 2.4Vdc Minimum with TTL Load, Vdd-0.5Vdc Minimum with HCMOS Load Output Voltage Logic Low (Vol) 0.4Vdc Maximum with TTL Load, 0.5Vdc Maximum with HCMOS Load Rise/Fall Time 6nSec Maximum (Measured at 0.4Vdc to 2.4Vdc with TTL Load, at 20% to 80% of waveform with HCMOS Load) Duty Cycle 50 5(%) (Measured at 1.4Vdc) Load Drive Capability 10TTL or 15pF HCMOS Load Output Logic Type CMOS Pin 1 Connection No Connect Tri-State Input Voltage (Vih and Vil) +2.2Vdc Minimum to enable output, +0.8Vdc to disable output (High Impedance), No connect to enable output. Absolute Clock Jitter 100pSec Maximum One Sigma Clock Period Jitter 25pSec Maximum Start Up Time 10mSec Maximum Storage Temperature Range -55C to +125C ENVIRONMENTAL & MECHANICAL SPECIFICATIONS Fine Leak Test MIL-STD-883, Method 1014, Condition A Gross Leak Test MIL-STD-883, Method 1014, Condition C Lead Integrity MIL-STD-883, Method 2004 Mechanical Shock MIL-STD-202, Method 213, Condition C Resistance to Soldering Heat MIL-STD-202, Method 210 Resistance to Solvents MIL-STD-202, Method 215 Solderability MIL-STD-883, Method 2003 Temperature Cycling MIL-STD-883, Method 1010 Vibration MIL-STD-883, Method 2007, Condition A www.ecliptek.com | Specification Subject to Change Without Notice | Rev K 2/17/2010 | Page 1 of 7 EC1125T-40.960M MECHANICAL DIMENSIONS (all dimensions in millimeters) 15.240 0.203 7.620 0.203 0.9 MAX 1 7 14 8 DIA 0.457 0.100 (X4) CONNECTION 1 No Connect 7 Ground/Case Ground 8 Output 14 Supply Voltage LINE MARKING 5.08 MIN 5.08 MAX 13.2 MAX PIN MARKING ORIENTATION 1 ECLIPTEK 2 EC11 EC11=Product Series 3 40.960M 4 XXYZZ XX=Ecliptek Manufacturing Code Y=Last Digit of Year ZZ=Week of Year 20.8 MAX CLOCK OUTPUT OUTPUT WAVEFORM VOH 80% or 2.4VDC 50% or 1.4VDC 20% or 0.4VDC VOL Fall Time Rise Time TW T Duty Cycle (%) = TW/T x 100 www.ecliptek.com | Specification Subject to Change Without Notice | Rev K 2/17/2010 | Page 2 of 7 EC1125T-40.960M Test Circuit for TTL Output Output Load Drive Capability RL Value (Ohms) CL Value (pF) 10TTL 5TTL 2TTL 10LSTTL 1TTL 390 780 1100 2000 2200 15 15 6 15 3 Oscilloscope Table 1: RL Resistance Value and CL Capacitance Value Vs. Output Load Drive Capability + + Power Supply _ Current Meter _ Supply Voltage (VDD) Frequency Counter Probe (Note 2) RL (Note 4) Output + Voltage Meter _ + 0.01F (Note 1) 0.1F (Note 1) Ground CL (Note 3) Power Supply _ No Connect or Tri-State Note 1: An external 0.1F low frequency tantalum bypass capacitor in parallel with a 0.01F high frequency ceramic bypass capacitor close to the package ground and VDD pin is required. Note 2: A low capacitance (<12pF), 10X attenuation factor, high impedance (>10Mohms), and high bandwidth (>300MHz) passive probe is recommended. Note 3: Capacitance value CL includes sum of all probe and fixture capacitance. Note 4: Resistance value RL is shown in Table 1. See applicable specification sheet for 'Load Drive Capability'. Note 5: All diodes are MMBD7000, MMBD914, or equivalent. www.ecliptek.com | Specification Subject to Change Without Notice | Rev K 2/17/2010 | Page 3 of 7 EC1125T-40.960M Test Circuit for CMOS Output Frequency Counter Oscilloscope + + Power Supply _ Current Meter _ Supply Voltage (VDD) Probe (Note 2) Output + Voltage Meter _ 0.01F (Note 1) 0.1F (Note 1) Ground CL (Note 3) No Connect or Tri-State Note 1: An external 0.1F low frequency tantalum bypass capacitor in parallel with a 0.01F high frequency ceramic bypass capacitor close to the package ground and VDD pin is required. Note 2: A low capacitance (<12pF), 10X attenuation factor, high impedance (>10Mohms), and high bandwidth (>300MHz) passive probe is recommended. Note 3: Capacitance value CL includes sum of all probe and fixture capacitance. www.ecliptek.com | Specification Subject to Change Without Notice | Rev K 2/17/2010 | Page 4 of 7 EC1125T-40.960M Recommended Solder Reflow Methods Critical Zone TL to T P Temperature (T) TP Ramp-up Ramp-down TL TS Max TS Min tL t S Preheat t 25C to Peak tP Time (t) High Temperature Solder Bath (Wave Solder) TS MAX to TL (Ramp-up Rate) Preheat - Temperature Minimum (TS MIN) - Temperature Typical (TS TYP) - Temperature Maximum (TS MAX) - Time (tS MIN) Ramp-up Rate (TL to TP) Time Maintained Above: - Temperature (TL) - Time (tL) Peak Temperature (TP) Target Peak Temperature (TP Target) Time within 5C of actual peak (tp) Ramp-down Rate Time 25C to Peak Temperature (t) Moisture Sensitivity Level Additional Notes 3C/second Maximum 150C 175C 200C 60 - 180 Seconds 3C/second Maximum 217C 60 - 150 Seconds 260C Maximum for 10 Seconds Maximum 250C +0/-5C 20 - 40 seconds 6C/second Maximum 8 minutes Maximum Level 1 Temperatures shown are applied to back of PCB board and device leads only. Do not use this method for product with the Gull Wing option. www.ecliptek.com | Specification Subject to Change Without Notice | Rev K 2/17/2010 | Page 5 of 7 EC1125T-40.960M Recommended Solder Reflow Methods Critical Zone TL to T P Temperature (T) TP Ramp-up Ramp-down TL TS Max TS Min tL t S Preheat t 25C to Peak tP Time (t) Low Temperature Infrared/Convection 185C TS MAX to TL (Ramp-up Rate) Preheat - Temperature Minimum (TS MIN) - Temperature Typical (TS TYP) - Temperature Maximum (TS MAX) - Time (tS MIN) Ramp-up Rate (TL to TP) Time Maintained Above: - Temperature (TL) - Time (tL) Peak Temperature (TP) Target Peak Temperature (TP Target) Time within 5C of actual peak (tp) Ramp-down Rate Time 25C to Peak Temperature (t) Moisture Sensitivity Level Additional Notes 5C/second Maximum N/A 150C N/A 60 - 120 Seconds 5C/second Maximum 150C 200 Seconds Maximum 185C Maximum 185C Maximum 2 Times 10 seconds Maximum 2 Times 5C/second Maximum N/A Level 1 Temperatures shown are applied to body of device. Use this method only for product with the Gull Wing option. www.ecliptek.com | Specification Subject to Change Without Notice | Rev K 2/17/2010 | Page 6 of 7 EC1125T-40.960M Recommended Solder Reflow Methods Critical Zone TL to T P Temperature (T) TP Ramp-up Ramp-down TL TS Max TS Min tL t S Preheat t 25C to Peak tP Time (t) Low Temperature Solder Bath (Wave Solder) TS MAX to TL (Ramp-up Rate) Preheat - Temperature Minimum (TS MIN) - Temperature Typical (TS TYP) - Temperature Maximum (TS MAX) - Time (tS MIN) Ramp-up Rate (TL to TP) Time Maintained Above: - Temperature (TL) - Time (tL) Peak Temperature (TP) Target Peak Temperature (TP Target) Time within 5C of actual peak (tp) Ramp-down Rate Time 25C to Peak Temperature (t) Moisture Sensitivity Level Additional Notes 5C/second Maximum N/A 150C N/A 30 - 60 Seconds 5C/second Maximum 150C 200 Seconds Maximum 245C Maximum 245C Maximum 1 Time / 235C Maximum 2 Times 5 seconds Maximum 1 Time / 15 seconds Maximum 2 Times 5C/second Maximum N/A Level 1 Temperatures shown are applied to back of PCB board and device leads only. Do not use this method for product with the Gull Wing option. Low Temperature Manual Soldering 185C Maximum for 10 seconds Maximum, 2 times Maximum. (Temperatures listed are applied to device leads only. This method can be utilized with both Gull Wing and Non-Gull Wing devices.) High Temperature Manual Soldering 260C Maximum for 5 seconds Maximum, 2 times Maximum. (Temperatures listed are applied to device leads only. This method can be utilized with both Gull Wing and Non-Gull Wing devices.) www.ecliptek.com | Specification Subject to Change Without Notice | Rev K 2/17/2010 | Page 7 of 7