Freescale reserves the right to change the detail specifications as may be required to permit
improvements in the design of its products.
Freescale Semiconductor Document Number: MPXA6115A
Data Sheet: Technical Data Rev. 7.3, 04/2015
© 2007-2012, 2015 Freescale Semiconductor, Inc. All rights reserved.
MPXxx6115A, 15 to 115 kPa, Absolute,
Integrated Pressure Sensor
The MPXxx6115A series sensor integ r ates on-chip, bipolar op amp circuitry and
thin film resistor networks to provide a high output signal and temperature
compensation. The small form factor and high reliability of on-chip integration make
the pressure sensor a logical and economical choice for the system designer.
The MPXxx61 15A series piezoresistive transducer is a state-of-the-art, monolithic,
signal conditioned, silicon pressure sensor. This sensor combines advanced
micromachining techniques, thin film metallization, and bipolar semiconductor
processing to provide an accurate , high level analog output signal that is
proportional to applied pressure.
Features
• Resistant to high humidity and common automotive media
• Improved accuracy at high temperature
• Available in small and super small outline packages
• 1.5% maximum error over 0 °C to 85 °C
• Ideally suited for microprocessor or microcontroller-based systems
• Temperature compensated from -40 °C to +125 °C
• Durable Thermoplastic (PPS) Surface Mount Package
Typical applications
• Industri a l co ntrols
• Engine control/manifold absolute pressure (MAP)
• Weather station and weather reporting device barometers
MPXA6115A
MPXAZ6115A
MPXH6115A
MPXHZ6115A
Series
Top view
Pinout
1
2
3
45
6
7
8VS
VOUT
GND
DNC
DNC
DNC
DNC
DNC
Pin 1 identification
chamfered corner
or notch in pin
Small outline packages
Super small outline packages
MPXA6115AC6U/T1
MPXAZ6115AC6T1
Case 98ASB17757C
MPXH6115A6U/T1
MPXHZ6115A6U/T1
Case
98ARH99066A
MPXH6115AC6U/T1
MPXHZ6115AC6U/T1
Case
98ARH99089A
MPXA6115AC7U
Case 98ASB17759C MPXAZ6115AP/T1
Case 98ASA99303D
MPXA6115A6U/T1
Case 98ASB17756C
MPXA6115A
Sensors
2Freescale Semiconductor, Inc.
Ordering information
Device name Shipping Package # of Ports Pressure type Device
marking
None Single Dual Gauge Differential Absolute
Small outline package (MPXA6115A series)
MPXA6115A6U Rails 98ASB17756C • • MPXA6115A
MPXA6115A6T1 Tape and Reel 98ASB17756C • • MPXA6115A
MPXA6115AC6U Rails 98ASB17757C • • MPXA6115A
MPXA6115AC6T1 Tape and Reel 98ASB17757C • • MPXA6115A
MPXA6115AC7U Rails 98ASB17759C • • MPXA6115A
Small outline package (Media resistant gel) (MPXAZ6115A series)
MPXAZ6115AC6T1 Tape and Reel 98ASB17757C • • MPXAZ6115A
MPXAZ6115AP Trays 98ASA99303D • • MPXAZ6115A
MPXAZ6115APT1 Tape and Reel 98ASA99303D • • MPXAZ6115A
Super small outline package (MPXH6115A series)
MPXH6115A6U Rails 98ARH99066A • • MPXH6115A
MPXH6115A6T1 Tape and Reel 98ARH99066A • • MPXH6115A
MPXH6115AC6U Rails 98ARH99089A • • MPXH6115A
MPXH6115AC6T1 Tape and Reel 98ARH99089A • • MPXH6115A
Small outline package (Media resistant gel) (MPXHZ6115A series)
MPXHZ6115A6U Rails 98ARH99066A • • MPXHZ6115A
MPXHZ6115A6T1 Tape and Reel 98ARH99066A • • MPXHZ6115A
MPXHZ6115AC6U Rails 98ARH99089A • • MPXHZ6115A
MPXHZ6115AC6T1 Tape and Reel 98ARH99089A • • MPXHZ6115A
Related Documentation
The MPXxx6115A device features and operations are described in a variety of reference manuals, user guides, and application
notes. To find the most-current ve rsions of thes e documents:
1. Go to the Freescale homepage at: http://www.freescale.com/
2. In the Keyword search box at the top of the page, enter the device number MPXxx6115A.
3. In the Refine Your Result pane on the left, click on the Documentation link.
MPXA6115A
Sensors
Freescale Semiconductor, Inc. 3
Contents
1 General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
1.1 Block diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
1.2 Pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2 Mechanical and Electrical Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2.1 Maximum ratings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2.2 Operating characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
3 On-chip Temperature Compensation and Calibration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
4 Package Information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
4.1 Minimum recommended footprint for small and super small packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
4.2 Package dimensions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
5 Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
MPXA6115A
Sensors
4Freescale Semiconductor, Inc.
1 General Description
1.1 Block diagram
Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip.
Figure 1. Fully integrated pressure sensor schematic
1.2 Pinout
Figure 2. Device pinout (top view)
Table 1. Pin functions
Pin Name Function
1 DNC Do not connect to external circuitry or ground. Pin 1 is denoted by chamfered corner.
2V
SVoltage supply
3 GND Ground
4V
OUT Output voltage
5 DNC Do not connect to external circuitry or ground.
6 DNC Do not connect to external circuitry or ground.
7 DNC Do not connect to external circuitry or ground.
8 DNC Do not connect to external circuitry or ground.
VS Pin 2
+5.0 V
GND Pin 3
VOUT Pin 4
MPXxx6115A to ADC
100 nF
51 K
47 pF
1
2
3
45
6
7
8V
S
V
OUT
GND
DNC
DNC
DNC
DNC
DNC
Pin 1 identification, chamfered corner or notch in pin
MPXA6115A
Sensors
Freescale Semiconductor, Inc. 5
2 Mechanical and Electrical S pecifications
2.1 Maximum ratings
2.2 Operating characteristics
Table 2. Maximum ratings(1)
1.Exposure beyond the specified limits may cause permanent damage or degradation to the device.
Rating Symbol Value Units
Maximum pressure (P1 > P2) Pmax 400 kPa
Storage temperature Tstg -40° to +125°°C
Operating temperature TA-40° to +125°°C
Output source current @ full-scale output(2)
2.Maximum output current is controlled by effective impedance from VOUT to GND or VOUT to VS in the application circuit.
Io+0.5mAdc
Output sink current @ minimum pressure offset(2) Io--0.5mAdc
Table 3. Opera ting characteristics (VS = 5.0 Vdc, TA = 25 °C unless otherwise noted, P1 > P2)
Characteristic Symbol Min Typ Max Unit
Pressure range POP 15 — 115 kPa
Supply voltage(1)
1.Device is ratiometric within this specified excitation range.
VS4.75 5.0 5.25 Vdc
Supply current Io— 6.0 10 mAdc
Minimum pressure offset(2) (0 °C to 85° C) @ VS = 5.0 Volts
2.Offset (Voff) is defined as the output voltage at the minimum rated pressure.
Voff 0.133 0.200 0.268 Vdc
Full-scale output(3) (0 °C to 85° C) @ VS = 5.0 Volts
3.Full-scale output (VFSO) is defined as the output voltage at the maximum or full-rated pressure.
VFSO 4.633 4.700 4.768 Vdc
Full-scale span(4) (0 °C to 85° C) @ VS = 5.0 Volts
4.Full-scale span (VFSS) is defined as the algebraic difference between the output voltage at full-rated pressure and the output voltage at the
minimum rated pressure.
VFSS 4.433 4.500 4.568 Vdc
Accuracy(5) (0 °C to 85° C)
5.Accuracy is the deviation in actual output from nominal output over the entire pressure range and temperature range as a percent of span at
25 °C due to all sources of error including the following:
Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range.
Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to
and from the minimum or maximum operating temperature points, with zero differential pressure applied.
Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from minimum or
maximum rated pressure at 25 °C.
TcSpan: Output deviation over the temperature range of 0 °C to 85 °C, relative to 25 °C.
TcOffset: Output deviation with minimum pressure applied, over the temperature ran ge of 0 °C to 85 °C, relative to 25 °C.
———±1.5 %VFSS
Sensitivity V/P — 45.0 — mV/kPa
Response time(6)
6.Response time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a
specified step change in pressure.
tR—1.0—ms
Warm-up time(7)
7.Warm-up time is defined as the time required for the product to meet the specified output voltage after the pressure has been stabilized.
——20—ms
Offset stability(8)
8.Offset stability is the product's output deviation when subjected to 1000 cycles of pulsed pressure, temperature cycling with bias test.
——±0.25 — %VFSS
MPXA6115A
Sensors
6Freescale Semiconductor, Inc.
3 On-chip Temperature Compensation and Calibration
Figure 3 illustrates the abso lute sensing chip in the basic super small outline chip carrier (case 98ARH99066A).
Figure 4 shows a typical applica tion circuit (output source current operation).
Figure 5 shows the sensor output signal relative to pressure input. T ypical minimum and maximum output curves are shown for
operation over 0 °C to 85 °C tempera ture range. The output will saturate outside of the rated pressure range.
A fluorosilicone gel isolates the die surface and wire bonds from th e environment, while allowing the pressure sign al to be
transmitted to the silicon diaphragm. The MPXxx6115A series pressure sensor operating characteristics, internal reliability and
qualification tests are based on use of dry air as the pressure media. Media other than dry air may have adverse effects on sensor
performance and long-term reliability. Contact the factory for information regarding media compatibility in your application.
Figure 3. Cross Sectional Diagram SSOP/SOP (not to scale)
Figure 4. Typical application circuit (output so urce current operation)
Figure 5. Output vs . absolute pressure
Wire Bond
Stainless
Steel Cap
Thermoplastic
Case
Die Bond
Sealed Vacuum Re fe rence
Fluorosilicone
Gel Die Coat
Lead
Frame
Absolute Element
P1 Die
VS Pin 2
+5.0 V
GND Pin 3
VOUT Pin 4
MPXxx6115A to ADC
100 nF
51 K
47 pF
Output (Volts)
5.0
4.5
4.0
3.5
3.0
Pressure (ref: to sealed vacuu m ) in kPa
MAX
MIN
5
10
15
20
25
30
35
40
45
50
55
60
65
70
75
80
85
90
95
100
105
2.5
2.0
1.5
1.0
0.5
0
110
Transfer Function:
VOUT = Vs* (.009*P-.095) ± E rror
VS = 5.0 Vdc
TEMP = 0 to 85 °C
115
120
TYP
MPXA6115A
Sensors
Freescale Semiconductor, Inc. 7
Figure 6. Transfer function
Figure 7. Temperature error band
Figure 8. Pressure error band
Nominal Transfer Value: VOUT = VS x (0.009 x P - 0.095)
± (Pressure Error x Temp. Factor x 0.009 x VS)
VS = 5.0 ± 0.25 Vdc
Break Points
Temp Multiplier
- 40 °C 3
0 °C to 85 °C 1
125 °C 1.75
Temperature in °C
4.0
3.0
2.0
0.0
1.0
-40 -20 0 20 40 60 14012010080
Temperature error factor
NOTE: The Temperature Mult iplier is a linear response from 0 ºC to -40 ºC and from 85 ºC to 125ºC
Error Limits for Pressure
3.0
2.0
1.0
-1.0
-2.0
-3.0
0.0 20 Pressure (in kPa)
Pressure Error (kPa)
15 to 115 (kPa) ±1.5 (kPa)
40 60 80 100 120
Pressure Error (Max)
MPXA6115A
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8Freescale Semiconductor, Inc.
4 Package Information
4.1 Minimum recommended footprint for small and super small packages
Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor package must be the
correct size to ensure proper solder connection interface between the board and the package. With the correct pad geometry,
the packages will self-align when subjected to a solder reflow process. It is always recommended to fabricate boards with a solder
mask layer to avoid bridging and/or shorting between solder pads, especially on tight tolerances and/or tight layouts.
Figure 9. SOP Foo tprint (Case 98ASB17756C)
Figure 10. SSOP Footprint (Case 98ARH99066A and 98ARH99089A)
0.660
16.76
0.060 TYP 8X
1.52
0.100 TYP
2.54
0.300
7.62
inch
mm
0.100 TYP 8X
2.54
0.027 TYP 8X
0.69
0.053 TYP 8X
1.35 inch
mm
0.387
9.83
0.150
3.81
0.050
1.27
TYP
MPXA6115A
Sensors
10 Freescale Semiconductor, Inc.
This drawing is located at http://cache.freescale.com/files/shared/doc/package_info/98ASB17757C.pdf.
Case 98ASB17757C, small outline package
PIN 1 IDENTIFIER
H
SEATING
PLANE
-T-
W
C
M
J
K
V
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A10.540.4250.415 10.79
B10.540.4250.415 10.79
C12.700.5200.500 13.21
D0.960.0420.038 1.07
G0.100 BSC 2.54 BSC
H0.002 0.010 0.05 0.25
J0.009 0.011 0.23 0.28
K0.061 0.071 1.55 1.80
M0˚ 7˚ 0˚ 7˚
N0.444 0.448 11.28 11.38
S0.709 0.725 18.01 18.41
V0.245 0.255 6.22 6.48
W0.115 0.125 2.92 3.17
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).
5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT.
S
D
8 PL
G
4
5
8
1
S
B
M
0.25 (0.010) AT
-A-
-B-
N
S
MPXA6115A
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Freescale Semiconductor, Inc. 13
Case 98ASA99303D, Small outline package
PAGE 2 OF 2
MPXA6115A
Sensors
Freescale Semiconductor, Inc. 15
Case 98ARH99066A, Super small outline package
PAGE 2 OF 3
MPXA6115A
Sensors
16 Freescale Semiconductor, Inc.
Case 98ARH99066A, Super small outline package
PAGE 3 OF 3
MPXA6115A
Sensors
18 Freescale Semiconductor, Inc.
Case 98ARH99089A, Super small outline package
PAGE 2 OF 2
MPXA6115A
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Freescale Semiconductor, Inc. 19
5 Revision History
Table 4. Revision history
Revision
number Revision
date Description of changes
7.1 05/2012 • Updated Package Drawing 98ARH99066A was Rev. F, updated to Rev. H,
7.2 10/2012 • On page 1, changed typical output voltage from 4.8V to 4.7V to match typical output voltage listed on page 3 of
document
7.3 04/2015 • Removed obsolete part numbers MPXAZ6115A6U and MPXAZ6115AC6U from data sheet.
• Updated format.
Document Number: MPXA6115A
Rev. 7.3
04/2015
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