MMBZ5245BWQ-7-F - DIODES INC

MMBZ5245BWQ

Document number: DS40377 Rev. 1 - 2

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November 2017

MMBZ5245BWQ

200mW SURFACE MOUNT ZENER DIODE

Features

 Small Surface Mount Package

 Ideally Suited for Automated Assembly Processes

 Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)

 Halogen and Antimony Free. “Green” Device (Note 3)

 Qualified to AEC-Q101 Standards for High Reliability

 PPAP Capable (Note 4)

Mechanical Data

 Case: SOT323

 Case Material: Molded Plastic, "Green" Molding Compound.

UL Flammability Classification Rating 94V-0

 Moisture Sensitivity: Level 1 per J-STD-020

 Terminals: Matte Tin Finish Annealed over Alloy 42 Leadframe

(Lead Free Plating). Solderable per MIL-STD-202, Method 208

 Polarity: See Diagram

 Weight: 0.006 grams (Approximate)

Ordering Information (Notes 4 & 5)

Part Number

Qualification

Packaging

Shipping

MMBZ5245BWQ-7-F

Automotive

SOT323

3000/Tape & Reel

Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.

2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"

and Lead-free.

3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and

<1000ppm antimony compounds.

4. Automotive products are AEC-Q101 qualified and are PPAP capable. Refer to https://www.diodes.com/quality/product-compliance-definitions/

5. For packaging details, go to our website at https://www.diodes.com/design/support/packaging/diodes-packaging/.

Marking Information

Date Code Key

Year

2017

2018

2019

2020

2021

2022

2023

2024

2025

2026

Code

Month

Jan

Feb

Mar

Apr

May

Jun

Jul

Aug

Sep

Oct

Nov

Dec

Code

Top View

Device Schematic

KH5 = Product Type Marking Code

(See Electrical Characteristics Table)

YM = Date Code Marking

Y = Year (ex: E = 2017)

M = Month (ex: 9 = September)

MMBZ5245BWQ

Document number: DS40377 Rev. 1 - 2

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www.diodes.com

November 2017

MMBZ5245BWQ

Maximum Ratings (@TA = +25°C, unless otherwise specified.)

Characteristic

Symbol

Value

Unit

Forward Voltage @ IF = 10mA

0.9

Thermal Characteristics

Characteristic

Symbol

Value

Unit

Power Dissipation (Note 6)

200

Thermal Resistance, Junction to Ambient Air (Note 6)

RJA

625

C/W

Operating and Storage Temperature Range

TJ, TSTG

-65 to +150

C

Notes: 6. Mounted on FR-4 PC Board with recommended pad layout which can be found on our website at http://www.diodes.com/package-outlines.html.

Electrical Characteristics (@TA = +25°C, unless otherwise specified.)

Type

Number

Zener Voltage Range (Note 7)

Test Current

Maximum Zener Impedance

(Note 8)

Maximum Reverse

Leakage Current (Note 7)

VZ @ IZT

IZT

ZZT @ IZT

ZZK @ IZK

= 0.25mA

@ VR

Nom (V)

Min (V)

Max (V)



A

MMBZ5245BWQ

14.25

15.75

8.5

600

0.1

Notes: 7. Short duration pulse test used to minimize self-heating effect.

8. f = 1KHz.

0.1

0.2

0.3

0.4

25050 75 100 125 150

P , POWER DISSIPATION (W)

T , AMBIENT TEMPERATURE ( C)

Fig. 1 Power Derating Curve

A°

Note 6

0.001

0.01

0.1

100

1000

10 11 12 13 14 15 16 17 18 19 20

IZ, ZENER CURRENT (mA)

VZ, ZENER VOLTAGE (V)

Fig.2 Typical Zener Breakdown Characteristics

MMBZ5245BWQ

Document number: DS40377 Rev. 1 - 2

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November 2017

MMBZ5245BWQ

Package Outline Dimensions

Please see http://www.diodes.com/package-outlines.html for the latest version.

SOT323

Dim

Min

Max

Typ

0.00

0.10

0.05

0.90

1.00

0.95

0.25

0.40

0.30

0.10

0.18

0.11

1.80

2.20

2.15

2.00

2.20

2.10

1.15

1.35

1.30

0.650 BSC

1.20

1.40

1.30

0.375

0.475

0.425

0.25

0.40

0.30

0°

8°

All Dimensions in mm

Suggested Pad Layout

Please see http://www.diodes.com/package-outlines.html for the latest version.

SOT323

Dimensions

Value

(in mm)

0.650

1.300

0.470

0.600

2.500

E1E

Fe1

Y1 G

MMBZ5245BWQ

Document number: DS40377 Rev. 1 - 2

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November 2017

MMBZ5245BWQ

IMPORTANT NOTICE

DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,

INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE

(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).

Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes

without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the

application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or

trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume

all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated

website, harmless against all damages.

Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.

Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and

hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or

indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.

Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings

noted herein may also be covered by one or more United States, international or foreign trademarks.

This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the

final and determinative format released by Diodes Incorporated.

LIFE SUPPORT

Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express

written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:

A. Life support devices or systems are devices or systems which:

1. are intended to implant into the body, or

2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the

labeling can be reasonably expected to result in significant injury to the user.

B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the

failure of the life support device or to affect its safety or effectiveness.

Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and

acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any

use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related

information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its

representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.