ATT3042-100H132 - Agere Systems, Inc.

Data Sheet

February 1997

ATT3000 Series Field-Programmable Gate Arrays

Features

■High performance:

— Up to 270 MHz toggle rates

— 4-input LUT delays <2.7 ns

■User-programmable gate arrays

— Unlimited reprogrammability

— Easy design iteration through in-system

logic changes

■Flexible array architecture:

— Compatible arrays ranging from 1500 to

6000 gate logic complexity

— Extensive register, combinatorial, and I/O

capabilities

— Low-skew clock nets

— High fan-out signal distribution

— Internal 3-state bus capabilities

— TTL or CMOS input thresholds

— On-chip oscillator ampliﬁer

■Standard product availability:

— Low-power 0.55 µm CMOS, static memory

technology

— Pin-for-pin compatible with Xilinx* XC3000*

and XC3100* families

— Cost-effective for volume production

— 100% factory pretested

— Selectable conﬁguration modes

■ORCA™ Foundry for ATT3000 Development

System support

■All FPGAs processed on a QML-certiﬁed line

■Extensive packaging options

Description

The CMOS ATT3000 Series Field-Programmable

Gate Array (FPGA) family provides a group of high-

density, digital integrated circuits. Their regular,

extendable, ﬂexible, user-programmable array

architecture is composed of a conﬁguration program

store plus three types of conﬁgurable elements: a

perimeter of I/O blocks, a core array of logic blocks,

and resources for interconnection. The general struc-

ture of an FPGA is shown in Figure 1.

The ORCA Foundry for ATT3000 Development Sys-

tem provides automatic place and route of netlists.

Logic and timing simulation are available as design

veriﬁcation alternatives. The design editor is used for

interactive design optimization and to compile the

data pattern that represents the conﬁguration pro-

gram.

The FPGA’s user-logic functions and interconnec-

tions are determined by the conﬁguration program

data stored in internal static memory cells. The pro-

gram can be loaded in any of several modes to

accommodate various system requirements. The

program data resides externally in an EEPROM,

EPROM, or ROM on the application circuit board, or

on a ﬂoppy disk or hard disk. On-chip initialization

logic provides for optional automatic loading of pro-

gram data at powerup. A serial conﬁguration PROM

can provide a very simple serial conﬁguration pro-

gram storage.

*Xilinx, XC3000, and XC3100 are registered trademarks of

Xilinx, Inc.

Table 1. ATT3000 Series FPGAs

FPGA Max

Logic

Gates

Typical Gate

Range

Conﬁgurable

Logic

Blocks Array User I/Os

Max Flip-

Flops Horizontal

Long Lines Conﬁguration

Data Bits

ATT3020 1,500 1,000—1,500 64 8 x 8 64 256 16 14,779

ATT3030 2,000 1,500—2,000 100 10 x 10 80 360 20 22,176

ATT3042 3,000 2,000—3,000 144 12 x 12 96 480 24 30,784

ATT3064 4,500 3,500—4,500 224 16 x 14 120 688 32 46,064

ATT3090 6,000 5,000—6,000 320 20 x 16 144 928 40 64,160

Data Sheet

ATT3000 Series Field-Programmable Gate Arrays February 1997

2 Lucent Technologies Inc.

Contents Page

Performance .............................................................29

Device Performance .............................................29

Logic Block Performance ......................................30

Interconnect Performance .....................................30

Power ........................................................................32

Power Distribution .................................................32

Power Dissipation .................................................33

Pin Information .........................................................34

Pin Assignments .......................................................39

Package Thermal Characteristics .............................50

Package Coplanarity .................................................51

Package Parasitics ...................................................51

Absolute Maximum Ratings ......................................53

Electrical Characteristics ..........................................54

Outline Diagrams ......................................................68

Terms and Deﬁnitions ...........................................68

44-Pin PLCC .........................................................68

68-Pin PLCC .........................................................69

84-Pin PLCC .........................................................70

100-Pin QFP .........................................................71

100-Pin TQFP .......................................................72

132-Pin PPGA ......................................................73

144-Pin TQFP .......................................................74

160-Pin QFP .........................................................75

175-Pin PPGA ......................................................76

208-Pin SQFP .......................................................77

Ordering Information .................................................78

Contents Page

Features .....................................................................1

Description .................................................................1

Architecture ................................................................3

Conﬁguration Memory................................................ 4

I/O Block ..................................................................... 5

Summary of I/O Options ......................................... 6

Conﬁgurable Logic Block ............................................7

Programmable Interconnect ....................................... 9

General-Purpose Interconnect .............................10

Direct Interconnect ...............................................11

Long Lines ............................................................ 13

Internal Buses ......................................................14

Crystal Oscillator ..................................................16

Conﬁguration ............................................................ 17

Initialization Phase ............................................... 17

Conﬁguration Data ............................................... 19

Conﬁguration Modes ................................................22

Master Mode ........................................................ 22

Peripheral Mode ...................................................24

Slave Mode .......................................................... 25

Daisy Chain ..........................................................26

Special Conﬁguration Functions ..............................27

Input Thresholds ...................................................27

Readback .............................................................27

Reprogram ........................................................... 28

DONE Pull-Up ......................................................28

DONE Timing .......................................................28

RESET Timing ......................................................28

Crystal Oscillator Division ....................................28

Table of Contents

Data Sheet

February 1997 ATT3000 Series Field-Programmable Gate Arrays

Lucent Technologies Inc. 3

Architecture

The perimeter of conﬁgurable I/O blocks (IOBs) pro-

vides a programmable interface between the internal

logic array and the device package pins. The array of

conﬁgurable logic blocks (CLBs) performs user-

speciﬁed logic functions. The interconnect resources

are programmed to form networks, carrying logic

signals among blocks, analogous to printed-circuit

board traces connecting MSI/SSI packages.

The blocks’ logic functions are implemented by

programmed look-up tables. Functional options are

implemented by program-controlled multiplexers.

Interconnecting networks between blocks are

implemented with metal segments joined by program-

controlled pass transistors. These functions of the

FPGA are established by a conﬁguration program

which is loaded into an internal, distributed array of

conﬁguration memory cells. The conﬁguration program

is loaded into the FPGA at powerup and may be

reloaded on command. The FPGA includes logic and

control signals to implement automatic or passive

conﬁguration. Program data may be either bit serial or

byte parallel. The ORCA Foundry for ATT3000 Devel-

opment System generates the conﬁguration program

bit stream used to conﬁgure the FPGA. The memory

loading process is independent of the user logic func-

tions.

Figure 1. Field-Programmable Gate Array Structure

Data Sheet

ATT3000 Series Field-Programmable Gate Arrays February 1997

4Lucent Technologies Inc.

Conﬁguration Memory

The static memory cell used for the conﬁguration mem-

ory in the FPGA has been designed speciﬁcally for

high reliability and noise immunity. Integrity of the

FPGA conﬁguration memory based on this design is

ensured even under various adverse conditions. Com-

pared with other programming alternatives, static mem-

ory is believed to provide the best combination of high

density, high performance, high reliability, and compre-

hensive testability.

As shown in Figure 2, the basic memory cell consists of

two CMOS inverters plus a pass transistor used for

writing and reading cell data. The cell is only written to

during conﬁguration and only read from during read-

back. During normal operation, the cell provides contin-

uous control and the pass transistor is off and does not

affect cell stability. This is quite different from the opera-

tion of conventional memory devices, in which the cells

are frequently read and rewritten.

The memory cell outputs Q and Q use full ground and

VCC levels and provide continuous, direct control. The

additional capacitive load and the absence of address

decoding and sense ampliﬁers provide high stability to

the cell. Due to their structure, the conﬁguration mem-

ory cells are not affected by extreme power supply

excursions or very high levels of alpha particle radia-

tion. Soft errors have not been observed in reliability

testing.

Two methods of loading conﬁguration data use serial

data, while three use byte-wide data. The internal con-

ﬁguration logic utilizes framing information, embedded

in the program data by the ORCA Foundry Develop-

ment System, to direct memory cell loading. The serial

data framing and length count preamble provide pro-

gramming compatibility for mixes of various Lucent pro-

grammable gate arrays in a synchronous, serial, daisy-

chain fashion.

Figure 2. Static Conﬁguration Memory Cell

READ OR

WRITE

DATA

CONFIGURATION

CONTROL

5-3101(F)

Data Sheet

February 1997 ATT3000 Series Field-Programmable Gate Arrays

Lucent Technologies Inc. 5

I/O Block

Each user-conﬁgurable I/O block (IOB), shown in

Figure 3, provides an interface between the external

package pin of the device and the internal user logic.

Each IOB includes both registered and direct input

paths and a programmable 3-state output buffer which

may be driven by a registered or direct output signal.

Conﬁguration options allow each IOB an inversion, a

controlled slew rate, and a high-impedance pull-up.

Each input circuit also provides input clamping diodes

to provide electrostatic protection and circuits to inhibit

latch-up produced by input currents.

The input buffer portion of each IOB provides threshold

detection to translate external signals applied to the

package pin to internal logic levels. The global input-

buffer threshold of the IOB can be programmed to be

compatible with either TTL or CMOS levels. The buff-

ered input signal drives the data input of a storage

element which may be conﬁgured as a positive-edge

triggered D ﬂip-ﬂop or a low-level transparent latch. The

sense of the clock can be inverted (negative edge/high

transparent) as long as all IOBs on the same clock net

use the same clock sense. Clock/load signals (IOB pins

.ik and .ok) can be selected from either of two die edge

metal lines. I/O storage elements are reset during con-

ﬁguration or by the active-low chip RESET input. Both

direct input (from IOB pin .i) and registered input (from

IOB pin .q) signals are available for interconnect.

Figure 3. Input/Output Block

5-3102(F)

OUT

INVERT 3-STATE

INVERT OUTPUT

SELECT SLEW

RATE PASSIVE

PULL UP

PROGRAM-CONTROLLED MEMORY CELLS VCC

OUTPUT

BUFFER

FLIP-

FLOP

D Q

TTL OR

CMOS

INPUT

THRESHOLD

FLIP-

FLOP

Q D

LATCH

.lk

= PROGRAMMABLE INTERCONNECTION POINT OR PIP

CK2

(GLOBAL RESET)

I/O PAD

3-STATE

OUT

DIRECT IN

REGISTERED IN

CK1

PROGRAM-

CONTROLLED

MULTIPLEXER

OUTPUT ENABLE

.ok

Data Sheet

ATT3000 Series Field-Programmable Gate Arrays February 1997

6 Lucent Technologies Inc.

I/O Block (continued)

For reliable operation, inputs should have transition

times of less than 100 ns and should not be left ﬂoat-

ing. Floating CMOS input-pin circuits might be at

threshold and produce oscillations. This can produce

additional power dissipation and system noise. A

typical hysteresis of about 300 mV reduces sensitivity

to input noise. Each user IOB includes a programmable

high-impedance pull-up resistor which is selected by

the program to provide a constant high for otherwise

undriven package pins. Normal CMOS handling

precautions should be observed.

Flip-ﬂop loop delays for the IOB and logic block ﬂip-

ﬂops are approximately 3 ns. This short delay provides

good performance under asynchronous clock and data

conditions. Short loop delays minimize the probability

of a metastable condition which can result from asser-

tion of the clock during data transitions. Because of the

short loop delay characteristic in the FPGA, the IOB

ﬂip-ﬂops can be used to synchronize external signals

applied to the device. When synchronized in the IOB,

the signals can be used internally without further con-

sideration of their clock relative timing, except as it

applies to the internal logic and routing path delays.

Output buffers of the IOBs provide CMOS-compatible

4 mA source-or-sink drive for high fan-out CMOS or

TTL compatible signal levels. The network driving IOB

pin .o becomes the registered or direct data source for

the output buffer. The 3-state control signal (IOB pin .t)

can control output activity. An open-drain type output

may be obtained by using the same signal for driving

the output and 3-state signal nets so that the buffer out-

put is enabled only for a LOW.

Conﬁguration program bits for each IOB control

features such as optional output register, logical signal

inversion, and 3-state and slew rate control of the out-

put.

The program-controlled memory cells in Figure 3

control the following options:

■Logical inversion of the output is controlled by one

conﬁguration program bit per IOB.

■Logical 3-state control of each IOB output buffer is

determined by the states of conﬁguration program

bits which turn the buffer on or off or select the output

buffer 3-state control interconnection (IOB pin .t).

When this IOB output control signal is high, a logic 1,

the buffer is disabled and the package pin is high

impedance. When this IOB output control signal is

low, a logic 0, the buffer is enabled and the package

pin is active. Inversion of the buffer 3-state control

logic sense (output enable) is controlled by an addi-

tional conﬁguration program bit.

■Direct or registered output is selectable for each IOB.

The register uses a positive-edge, clocked ﬂip-ﬂop.

The clock source may be supplied (IOB pin .ok) by

either of two metal lines available along each die

edge. Each of these lines is driven by an invertible

buffer.

■Increased output transition speed can be selected to

improve critical timing. Slower transitions reduce

capacitive load peak currents of noncritical outputs

and minimize system noise.

■A high-impedance pull-up resistor may be used to

prevent unused inputs from ﬂoating.

Summary of I/O Options

■Inputs

—Direct

—Flip-ﬂop/latch

—CMOS/TTL threshold (chip inputs)

—Pull-up resistor/open circuit

■Outputs

—Direct/registered

—Inverted/not

—3-state/on/off

—Full speed/slew limited

—3-state/output enable (inverse)

Data Sheet

February 1997 ATT3000 Series Field-Programmable Gate Arrays

Lucent Technologies Inc. 7

Conﬁgurable Logic Block

The array of conﬁgurable logic blocks (CLBs) provides

the functional elements from which the user’s logic is

constructed. The logic blocks are arranged in a matrix

within the perimeter of IOBs. The ATT3020 has 64 such

blocks arranged in eight rows and eight columns. The

ORCA Foundry Development System is used to com-

pile the conﬁguration data for loading into the internal

conﬁguration memory to deﬁne the operation and inter-

connection of each block. User deﬁnition of CLBs and

their interconnecting networks may be done by auto-

matic translation from a schematic capture logic dia-

gram or optionally by installing library or user macros.

Each CLB has a combinatorial logic section, two ﬂip-

ﬂops, and an internal control section; see Figure 4

below. There are ﬁve logic inputs (.a, .b, .c, .d, and .e);

a common clock input (.k); an asynchronous direct

reset input (.rd); and an enable clock (.ec). All may be

driven from the interconnect resources adjacent to the

blocks. Each CLB also has two outputs (.x and .y)

which may drive interconnect networks.

Data input for either ﬂip-ﬂop within a CLB is supplied

from the function F or G outputs of the combinatorial

logic, or the block input, data-in (.di). Both ﬂip-ﬂops in

each CLB share the asynchronous reset (.rd) which,

when enabled and high, is dominant over clocked

inputs. All ﬂip-ﬂops are reset by the active-low chip

input, RESET, or during the conﬁguration process.

The ﬂip-ﬂops share the enable clock (.ec) which, when

low, recirculates the ﬂip-ﬂops’ present states and inhib-

its response to the data-in or combinatorial function

inputs on a CLB. The user may enable these control

inputs and select their sources. The user may also

select the clock net input (.k), as well as its active

sense within each logic block. This programmable

inversion eliminates the need to route both phases of a

clock signal throughout the device. Flexible routing

allows use of common or individual CLB clocking.

The combinatorial logic portion of the logic block uses

a 32 x 1 look-up table to implement Boolean functions.

Variables selected from the ﬁve logic inputs and the

two internal block ﬂip-ﬂops are used as table address

inputs. The combinatorial propagation delay through

the network is independent of the logic function gener-

ated and is spike-free for single-input variable changes.

This technique can generate two independent logic

functions of up to four variables each as shown in Fig-

ure 5A, or a single function of ﬁve variables as shown in

Figure 5B, or some functions of seven variables as

shown in Figure 5C.

Figure 4. Conﬁgurable Logic Block

MUX

MUX D Q

D Q

“1” (ENABLE)

DATA IN

LOGIC

VARIABLES

ENABLE

CLOCK

COMBINATORIAL

FUNCTION

“0” (INHIBIT)

(GLOBAL RESET)

.ec

.rd

.di

DIN

CLB OUTPUTS

DIN

CLOCK

5-3103(F)

DIRECT

RESET

Data Sheet

ATT3000 Series Field-Programmable Gate Arrays February 1997

8 Lucent Technologies Inc.

Conﬁgurable Logic Block (continued)

5A. Combinatorial Logic Option 1 generates two functions of four

variables each. One variable, A, must be common to both func-

tions. The second and third variables can be any choice among

B, C, Qx, and Qy. The fourth variable can be either D or E.

5B. Combinatorial Logic Option 2 generates any function of ﬁve

variables: A, D, E, and two choices among B, C, Qx, Qy.

5C. Combinatorial Logic Option 3 allows variable E to select

between two functions of four variables: both have common

inputs, A and D, and any choice among B, C, Qx, and Qy for

the remaining two variables. Option 3 can then implement

some functions of six or seven variables.

Figure 5. Combinatorial Logic Diagram

Figure 6 shows a modulo 8 binary counter with parallel

enable. It uses one CLB of each type. The partial func-

tions of six or seven variables are implemented by

using the input variable (.e) to dynamically select

between two functions of four different variables. For

the two functions of four variables each, the indepen-

dent results (F and G) may be used as data inputs to

either ﬂip-ﬂop or logic block output. For the single func-

tion of ﬁve variables and merged functions of six or

seven variables, the F and G outputs are identical.

Symmetry of the F and G functions and the ﬂip-ﬂops

allows the interchange of CLB outputs to optimize

routing efﬁciencies of the networks interconnecting

the logic and IOBs.

Figure 6. C8BCP Macro

QY ANY FUNCTION

OF UP TO 4

VARIABLES F

ANY FUNCTION

OF UP TO 4

VARIABLES GQY

ANY FUNCTION

OF 5

VARIABLES

ANY FUNCTION

OF UP TO 4

VARIABLES

ANY FUNCTION

OF UP TO 4

VARIABLES

5-3104(F)

CLOCK

PARALLEL

CLOCK

TERMINAL

COUNT

D0 Q0

D Q

D2 Q2

D Q

FUNCTION OF 6 VARIABLES

D Q

FUNCTION OF 5 VARIABLES

DUAL FUNCTION OF

ENABLE

4 VARIABLES

5-3105(F)

Lucent Technologies Inc. 9

Data Sheet

February 1997 ATT3000 Series Field-Programmable Gate Arrays

Programmable Interconnect

Programmable interconnection resources in the FPGA

provide routing paths to connect inputs and outputs of

the IOBs and logic blocks into logical networks. Inter-

connections between blocks are composed from a two-

layer grid of metal segments. Specially designed pass

transistors, each controlled by a conﬁguration bit, form

programmable interconnect points (PIPs) and switching

matrices used to implement the necessary connections

between selected metal segments and block pins.

Figure 7 is an example of a routed net. The ORCA

Foundry Development System provides automatic rout-

ing of these interconnections. Interactive routing is also

available for design optimization. The inputs of the logic

or IOBs are multiplexers which can be programmed to

select an input network from the adjacent interconnect

segments. Since the switch connections to block inputs

are unidirectional (as are block outputs), they are

usable only for block input connection and not routing.

Figure 8 illustrates routing access to logic block input

variables, control inputs, and block outputs.

Three types of metal resources are provided to accom-

modate various network interconnect requirements:

■General-purpose interconnect

■Direct connection

■Long lines (multiplexed buses and wide-AND gates)

Figure 7. Example of Routing Resources

Figure 8. CLB Input and Output Routing

Data Sheet

ATT3000 Series Field-Programmable Gate Arrays February 1997

10 Lucent Technologies Inc.

Programmable Interconnect (continued)

General-Purpose Interconnect

General-purpose interconnect, as shown in Figure 9,

consists of a grid of ﬁve horizontal and ﬁve vertical

metal segments located between the rows and col-

umns of logic and IOBs. Each segment is the height or

width of a logic block. Switching matrices join the ends

of these segments and allow programmed interconnec-

tions between the metal grid segments of adjoining

rows and columns. The switches of an unprogrammed

device are all nonconducting. The connections through

the switch matrix may be established by automatic or

interactive routing by selecting the desired pairs of

matrix pins to be connected or disconnected. The

legitimate switching matrix combinations for each pin

are indicated in Figure 10.

Special buffers within the general interconnect areas

provide periodic signal isolation and restoration for

improved performance of lengthy nets. The intercon-

nect buffers are available to propagate signals in either

direction on a given general interconnect segment.

These bidirectional (bidi) buffers are found adjacent to

the switching matrices, above and to the right. The

other PIPs adjacent to the matrices are accessed to or

from long lines. The development system automatically

deﬁnes the buffer direction based on the location of the

interconnection network source. The delay calculator in

the ORCA Foundry Development System automatically

calculates and displays the block, interconnect, and

buffer delays for any paths selected. Generation of the

simulation netlist with a worst-case delay model is also

provided by the development system.

Some of the interconnect PIPs are directional, as

indicated below:

■ND is a nondirectional interconnection.

■D:H->V is a PIP which drives from a horizontal to a

vertical line.

■D:V->H is a PIP which drives from a vertical to a

horizontal line.

■D:C->T is a T-PIP which drives from a cross of a

T to the tail.

■D:CW is a corner PIP which drives in the clockwise

direction.

■P0 indicates the PIP is nonconducting; P1 is on.

Figure 9. FPGA General-Purpose Interconnect

Figure 10. Switch Matrix Interconnection Options

12345

6 7 8 9 10

11 12 13 14 15

16 17 18 19 20

Lucent Technologies Inc. 11

Data Sheet

February 1997 ATT3000 Series Field-Programmable Gate Arrays

Programmable Interconnect (continued)

Direct Interconnect

Direct interconnect (shown in Figure 11) provides the

most efﬁcient implementation of networks between

adjacent logic or IOBs. Signals routed from block to

block using the direct interconnect exhibit minimum

interconnect propagation and use no general intercon-

nect resources. For each CLB, the .x output may be

connected directly to the .b input of the CLB immedi-

ately to its right and to the .c input of the CLB to its left.

The .y output can use direct interconnect to drive the .d

input of the block immediately above, and the .a input

of the block below. Direct interconnect should be used

to maximize the speed of high-performance portions of

logic. Where logic blocks are adjacent to IOBs, direct

connect is provided alternately to the IOB inputs (.i)

and outputs (.o) on all four edges of the die. The right

edge provides additional direct connects from CLB out-

puts to adjacent IOBs. Direct interconnections of IOBs

with CLBs are shown in Figure 12.

Figure 11. Direct Interconnect

Data Sheet

ATT3000 Series Field-Programmable Gate Arrays February 1997

12 Lucent Technologies Inc.

Programmable Interconnect (continued)

Figure 12. ATT3020 Die Edge I/O Blocks with Direct Access to Adjacent CLB

Data Sheet

February 1997 ATT3000 Series Field-Programmable Gate Arrays

Lucent Technologies Inc. 13

Programmable Interconnect (continued)

Long Lines

The long lines bypass the switch matrices and are

intended primarily for signals which must travel a long

distance, or must have minimum skew among multiple

destinations. Long lines, shown in Figure 13, run

vertically and horizontally the height or width of the

interconnect area. Each interconnection column has

three vertical long lines, and each interconnection row

has two horizontal long lines. Additionally, two long

lines are located adjacent to the outer sets of switching

matrices. Two vertical long lines in each column are

connectable half-length lines, except on the ATT3020,

where only the outer long lines serve that function.

Long lines can be driven by a logic block or IOB output

on a column-by-column basis. This capability provides

a common low-skew control or clock line within each

column of logic blocks. Interconnections of these long

lines are shown in Figure 14. Isolation buffers are pro-

vided at each input to a long line and are enabled auto-

matically by the development system when a

connection is made.

Figure 13. Horizontal and Vertical Long Lines in the FPGA

Data Sheet

ATT3000 Series Field-Programmable Gate Arrays February 1997

14 Lucent Technologies Inc.

Programmable Interconnect (continued)

A buffer in the upper left corner of the FPGA chip drives

a global net which is available to all .k inputs of logic

blocks. Using the global buffer for a clock signal pro-

vides a skew-free, high fan-out, synchronized clock for

use at any or all of the I/O and logic blocks. Conﬁgura-

tion bits for the .k input to each logic block can select

this global line, or another routing resource, as the

clock source for its ﬂip-ﬂops. This net may also be pro-

grammed to drive the die edge clock lines for IOB use.

An enhanced speed, CMOS threshold, offers direct

access to this buffer and is available at the

second pad from the top of the left die edge.

A buffer in the lower right corner of the array drives a

horizontal long line that can drive programmed connec-

tions to a vertical long line in each interconnection

column. This alternate buffer also has low skew and

high fan-out. The network formed by this alternate buf-

fer’s long lines can be selected to drive the .k inputs of

the logic blocks. CMOS threshold, high-speed access

to this buffer is available from the third pad from the

bottom of the right die edge.

Internal Buses

A pair of 3-state buffers is located adjacent to each

CLB. These buffers allow logic to drive the horizontal

long lines. Logical operation of the 3-state buffer

controls allows them to implement wide multiplexing

functions. Any 3-state buffer input can be selected as

drive for the horizontal long line bus by applying a low

logic level on its 3-state control line (see Figure 15A).

The user is required to avoid contention that can result

from multiple drivers with opposing logic levels. Control

of the 3-state input by the same signal that drives the

buffer input creates an open-drain wired-AND function.

A logical high on both buffer inputs creates a high

impedance which represents no contention. A logical

low enables the buffer to drive the long line low (see

Figure 15B). Pull-up resistors are available at each end

of the long line to provide a high output when all con-

nected buffers are nonconducting. This forms fast, wide

gating functions. When data drives the inputs and sep-

arate signals drive the 3-state control lines, these buff-

ers form multiplexers (3-state buses). In this case, care

must be used to prevent contention through multiple

active buffers of conﬂicting levels on a common line.

Figure 16 shows 3-state buffers, long lines, and pull-up

resistors.

Figure 14. Programmable Interconnection of Long Lines

3-STATE

Data Sheet

February 1997 ATT3000 Series Field-Programmable Gate Arrays

Lucent Technologies Inc. 15

Programmable Interconnect (continued)

Figure 15A. 3-State Buffers Implement a Wired-AND Function

Figure 15B. 3-State Buffers Implement a Multiplexer

Figure 16. Lower-Right Corner of ATT3020

5-3106(F)

Z = DA • DB • DC • ... • DN

(LOW)

DNDCDBDA

VCC VCC

5-3107(F)

Z = DA • A + DB • B + DC • C + ... + DN • N

DNDCDBDA

A B C N

WEAK KEEPER CIRCUIT

P47

P48

BCL

KIN

HG HH

RST

P46

P43P42P41P40

.l .lk

.q.ok

GG GH

HORIZONTAL LONG LINE

PULL-UP RESISTOR

HORIZONTAL LONG LINE

OSCILLATOR

AMPLIFIER OUTPUT

DIRECT INPUT OF P47

TO AUXILIARY BUFFER

CRYSTAL OSCILLATOR

BUFFER

3-STATE INPUT

3-STATE CONTROL

3-STATE BUFFER

ALTERNATE BUFFER

OSCILLATOR

AMPLIFIER INPUT

3 VERTICAL LONG LINES

PER COLUMN

GLOBAL NET

BIDIRECTIONAL

INTERCONNECT

BUFFERS

5-3108(F)

Data Sheet

ATT3000 Series Field-Programmable Gate Arrays February 1997

16 Lucent Technologies Inc.

Programmable Interconnect (continued)

Crystal Oscillator

Figure 16 shows the location of an internal high-speed

inverting ampliﬁer which may be used to implement an

on-chip crystal oscillator. It is associated with the auxil-

iary buffer in the lower right corner of the die. When the

oscillator is conﬁgured and connected as a signal

source, two special user IOBs are also conﬁgured to

connect the oscillator ampliﬁer with external crystal

oscillator components as shown in Figure 17. A divide-

by-two option is available to ensure symmetry. The

oscillator circuit becomes active before conﬁguration is

complete in order to allow the oscillator to stabilize.

Actual internal connection is delayed until completion

of conﬁguration. In Figure 17, the feedback resistor,

R1, between output and input biases the ampliﬁer at

threshold. The value should be as large as is practical

to minimize loading of the crystal. The inversion of the

ampliﬁer, together with the R-C networks and an AT cut

series resonant crystal, produces the 360° phase shift

of the Pierce oscillator. A series resistor, R2, may be

included to add to the ampliﬁer output impedance when

needed for phase shift control or crystal resistance

matching, or to limit the ampliﬁer input swing to control

clipping at large amplitudes. Excess feedback voltage

may be corrected by the ratio of C2/C1. The ampliﬁer is

designed to be used from 1 MHz to one-half the speci-

ﬁed CLB toggle frequency. Use at frequencies below

1 MHz may require individual characterization with

respect to a series resistance. Crystal oscillators above

20 MHz generally require a crystal which operates in a

third overtone mode, where the fundamental frequency

must be suppressed by an inductor across C2. When

the oscillator inverter is not used, these IOBs and their

package pins are available for general user I/O.

Suggested component values:

R1—0.5 MΩ to 1 MΩ

R2—0 kΩ to 1 kΩ (may be required for low frequency, phase shift, and/or compensation level for Crystal Q)

C1, C2—10 pF to 40 pF

Y1—1 MHz to 20 MHz AT cut series resonant

Figure 17. Crystal Oscillator Inverter

Pin 44-Pin

PLCC 68-Pin

PLCC 84-Pin

PLCC

100-Pin 132-Pin

PPGA 144-Pin

TQFP 160-Pin

QFP 175-Pin

PPGA 208-Pin

SQFP

QFP TQFP

XTAL1 (OUT) 30 47 57 82 79 P13 75 82 T14 110

XTAL2 (IN) 26 43 53 76 73 M13 69 76 P15 100

XTAL1 (OUT)

XTAL2

(IN)

ALTERNATE

CLOCK BUFFER

INTERNAL EXTERNAL

D Q

LTHIRD

OVERTONE

ONLY 5-3109(F)

Lucent Technologies Inc. 17

Data Sheet

February 1997 ATT3000 Series Field-Programmable Gate Arrays

Conﬁguration

Initialization Phase

An internal power-on-reset circuit is triggered when

power is applied. When VCC reaches the voltage where

portions of the FPGA begin to operate (2.5 V to 3 V),

the programmable I/O output buffers are disabled and a

high-impedance pull-up resistor is provided for the user

I/O pins. A time-out delay is initiated to allow the power

supply voltage to stabilize. During this time, the power-

down mode is inhibited. The initialization state time-out

(about 11 ms to 33 ms) is determined by a 14-bit

counter driven by a self-generated, internal timer. This

nominal 1 MHz timer is subject to variations with pro-

cess, temperature, and power supply over the range of

0.5 MHz to 1.5 MHz. As shown in Table 2, ﬁve conﬁgu-

ration mode choices are available, as determined by

the input levels of three mode pins: M0, M1, and M2.

In master conﬁguration mode, the FPGA becomes the

source of conﬁguration clock (CCLK). Beginning con-

ﬁguration of devices using peripheral or slave modes

must be delayed long enough for their initialization to

be completed. An FPGA with mode lines selecting a

master conﬁguration mode extends its initialization

state using four times the delay (43 ms to 130 ms) to

ensure that all daisy-chained slave devices it may be

driving will be ready, even if the master is very fast and

the slave(s), very slow (see Figure 18). At the end of

initialization, the FPGA enters the clear state where it

clears conﬁguration memory. The active-low, open-

drain initialization signal INIT indicates when the initial-

ization and clear states are complete. The FPGA tests

for the absence of an external active-low RESET before

it makes a ﬁnal sample of the mode lines and enters

the conﬁguration state. An external wired-AND of one

or more INIT pins can be used to control conﬁguration

by the assertion of the active-low RESET of a master

mode device or to signal a processor that the FPGAs

are not yet initialized.

If a conﬁguration has begun, a reassertion of RESET for

a minimum of three internal timer cycles will be recog-

nized and the FPGA will initiate an abort, returning to

the clear state to clear the partially loaded conﬁgura-

tion memory words. The FPGA will then resample

RESET and the mode lines before reentering the con-

ﬁguration state.

A reprogram is initiated when a conﬁgured FPGA

senses a high-to-low transition on the DONE/PROG

package pin. The FPGA returns to the clear state

where conﬁguration memory is cleared and mode lines

resampled, as for an aborted conﬁguration. The com-

plete conﬁguration program is cleared and loaded dur-

ing each conﬁguration program cycle.

Table 2. Conﬁguration Modes

M0 M1 M2 Clock Mode Data

0 0 0 Active Master Bit Serial

0 0 1 Active Master Byte Wide

(Address = 0000

up)

0 1 0 — Reserved —

0 1 1 Active Master Byte Wide

(Address = FFFF

down)

1 0 0 — Reserved —

1 0 1 Active Peripheral Byte Wide

1 1 0 — Reserved —

1 1 1 Passive Slave Bit Serial

Data Sheet

ATT3000 Series Field-Programmable Gate Arrays February 1997

18 Lucent Technologies Inc.

Conﬁguration (continued)

Figure 18. State Diagram of Conﬁguration Process for Powerup and Reprogram

5-3110(F)

INITIALIZATION

POWER-ON

TIME DELAY

CLEAR

CONFIGURATION

MEMORY

YES

RESET

ACTIVE

NO TEST

MODE PINS CONFIGURATION

PROGRAM MODE OPERATIONAL

MODE

START-UP

INIT = LOW

USER I/O PINS WITH HIGH-IMPEDANCE PULL-UP

HDC = HIGH

LDC = LOW

ACTIVE RESET

POWERDOWN

NO HDC, LDC

OR PULL-UP

INACTIVE

PWRDWN

ACTIVE RESET

OPERATES ON

USER LOGIC

LOW ON DONE/PROG AND RESET

ACTIVE

PWRDWN

Length count control allows a system of multiple

FPGAs in assorted sizes to begin operation in a syn-

chronized fashion. The conﬁguration program gener-

ated by the ORCA Foundry Development System

begins with a preamble of 111111110010 (binary), fol-

lowed by a 24-bit length count representing the total

number of conﬁguration clocks needed to complete

loading of the conﬁguration program(s). The data fram-

ing is shown in Figure 19. All FPGAs connected in

series read and shift preamble and length count in (on

positive) and out (on negative) CCLK edges. An FPGA

which has received the preamble and length count then

presents a HIGH data out until it has intercepted the

appropriate number of data frames. When the conﬁgu-

ration program memory of an FPGA is full and the

length count does not compare, the FPGA shifts any

additional data through, as it did for preamble and

length count.

When the FPGA conﬁguration memory is full and the

length count compares, the FPGA will execute a syn-

chronous start-up sequence and become operational

(see Figure 20 on page 20). Two CCLK cycles after the

completion of loading conﬁguration data, the user

I/O pins are enabled as conﬁgured. As selected in

ORCA Foundry, the internal user-logic reset is released

either one clock cycle before or after the I/O pins

become active. A similar timing selection is program-

mable for the DONE/PROG output signal. DONE/PROG

may also be programmed to be an open drain or

include a pull-up resistor to accommodate wired-

ANDing. The high during conﬁguration (HDC) and low

during conﬁguration (LDC) are two user I/O pins which

are driven active when an FPGA is in initialization,

clear, or conﬁgure states. These signals and DONE/

PROG provide for control of external logic signals such

as reset, bus enable, or PROM enable during

conﬁguration.

For parallel master conﬁguration modes, these signals

provide PROM enable control and allow the data pins

to be shared with user logic signals.

User I/O inputs can be programmed to be either TTL or

CMOS compatible thresholds. At powerup, all inputs

have TTL thresholds and can change to CMOS thresh-

olds at the completion of conﬁguration, if the user has

selected CMOS thresholds. The threshold of PWRDWN

and the direct clock inputs are ﬁxed at a CMOS level.

If the crystal oscillator is used, it will begin operation

before conﬁguration is complete to allow time for

stabilization before it is connected to the internal

circuitry.

Data Sheet

February 1997 ATT3000 Series Field-Programmable Gate Arrays

Lucent Technologies Inc. 19

Conﬁguration (continued)

Conﬁguration Data

Conﬁguration data to deﬁne the function and interconnection within an FPGA are loaded from an external storage

at powerup and on a reprogram signal. Several methods of automatic and controlled loading of the required data

are available. Logic levels applied to mode selection pins at the start of conﬁguration time determine the method to

be used (see Table 2). The data may be either bit-serial or byte-parallel, depending on the conﬁguration mode.

Various Lucent programmable gate arrays have different sizes and numbers of data frames. For the ATT3020, con-

ﬁguration requires 14779 bits for each device, arranged in 197 data frames. An additional 40 bits are used in the

header (see Figure 20).

* The FPGA devices require four dummy bits minimum.

Figure 19. Internal Conﬁguration Data Structure

11111111

0010

< 24-BIT LENGTH COUNT >

1111

0 < DATA FRAME # 001 > 111

0 < DATA FRAME # 002 > 111

0 < DATA FRAME # 003 > 111

. . .

– DUMMY BITS*

– PREAMBLE CODE

– CONFIGURATION PROGRAM LENGTH

– DUMMY BITS (4 BITS MINIMUM)

197 CONFIGURATION DATA FRAMES

(EACH FRAME CONSISTS OF:

A START BIT (0)

A 71-BIT DATA FIELD

THREE STOP BITS

POSTAMBLE CODE (4 BITS MINIMUM)

REPEATED FOR EACH LOGIC

CELL ARRAY IN A DAISY CHAIN

0 < DATA FRAME # 196 > 111

0 < DATA FRAME # 197 > 111

1111

FOR ATT3020

HEADER

PROGRAM DATA

)

Data Sheet

ATT3000 Series Field-Programmable Gate Arrays February 1997

20 Lucent Technologies Inc.

Conﬁguration (continued)

Note: The length count produced by the bit stream generation program = [(40-bit preamble + sum of program data + 1 per daisy-chain device)

rounded up to a multiple of 8] – (2 ≤ K ≤ 4), where K is a function of DONE and RESET timing selected. An additional 8 is added if the

roundup increment is less than K. K additional clocks are needed to complete start-up after length count is reached.

* The conﬁguration data consists of a composite 40-bit preamble/length count, followed by one or more concatenated FPGA programs,

separated by 4-bit postambles. An additional ﬁnal postamble bit is added for each slave device, and the result rounded up to byte boundary.

The length count is two less than the number of resulting bits. Timing of the assertion of DONE and termination of the internal RESET may

each be programmed to occur one cycle before or after the I/O outputs become active.

Figure 20. FPGA Conﬁguration and Start-Up

Table 3. ATT3000 Device Conﬁguration Data

Device ATT3020 ATT3030 ATT3042 ATT3064 ATT3090

Gates 1500 2000 3000 4500 6000

CLBs

(row x column) 64

(8 x 8) 100

(10 x 10) 144

(12 x 12) 224

(16 x 14) 320

(20 x 16)

IOBs 64 80 96 120 144

Flip-ﬂops 256 360 480 688 928

Bits-per-frame

(with 1 start/3 stop) 75 92 108 140 172

Frames 197 241 285 329 373

Program Data =

Bits * Frames + 4

(excludes header)

14779 22176 30784 46064 64160

PROM Size (bits) =

Program Data

+ 40-bit Headers

14819 22216 30824 46104 64200

PREAMBLE LENGTH COUNT

12 24 75

STOP

DATA FRAME

START START

LAST FRAME

POSTAMBLE

STOP

LENGTH COUNT*

WEAK PULL-UP

PROG

INTERNAL RESET

I/O ACTIVE

DONE

DOUT LEAD DEVICE

HIGH

1/2 CLOCK CYCLE

DELAY FROM DATA INPUT

DATA 3

5-3111(F)

Lucent Technologies Inc. 21

Data Sheet

February 1997 ATT3000 Series Field-Programmable Gate Arrays

Conﬁguration (continued)

The speciﬁc data format for each device is produced by

the bit stream generation program, and one or more of

these ﬁles can then be combined and appended to a

length count preamble and be transformed into a

PROM format ﬁle by the PROM generation program of

the ORCA Foundry Development System. The tie

option of the bit stream generation program deﬁnes

output levels of unused blocks of a design and con-

nects these to unused routing resources. This prevents

indeterminate levels which might produce parasitic

supply currents. This tie option can be omitted for quick

breadboard iterations where a few additional mA of ICC

are acceptable.

The conﬁguration bit stream begins with high preamble

bits, a 4-bit preamble code, and a 24-bit length count.

When conﬁguration is initiated, a counter in the FPGA

is set to 0 and begins to count the total number of con-

ﬁguration clock cycles applied to the device. As each

conﬁguration data frame is supplied to the FPGA, it is

internally assembled into a data word. As each data

word is completely assembled, it is loaded in parallel

into one word of the internal conﬁguration memory

array. The conﬁguration loading process is complete

when the current length count equals the loaded length

count and the required conﬁguration program data

frames have been written. Internal user ﬂip-ﬂops are

held reset during conﬁguration.

Two user-programmable pins are deﬁned in the uncon-

ﬁgured FPGA: high during conﬁguration (HDC) and low

during conﬁguration (LDC), and DONE/PROG may be

used as external control signals during conﬁguration. In

master mode conﬁgurations, it is convenient to use LDC

as an active-low EPROM chip enable. After the last

conﬁguration data bit is loaded and the length count

compares, the user I/O pins become active. Options in

the bit stream generation program allow timing choices

of one clock earlier or later for the timing of the end of

the internal logic reset and the assertion of the DONE

signal. The open-drain DONE/PROG output can be

AND-tied with multiple FPGAs and used as an active-

high READY, an active-low PROM enable, or a RESET

to other portions of the system. The state diagram of

Figure 18 illustrates the conﬁguration process.

Data Sheet

ATT3000 Series Field-Programmable Gate Arrays February 1997

22 Lucent Technologies Inc.

Conﬁguration Modes

Master Mode

In master mode, the FPGA automatically loads conﬁgu-

ration data from an external memory device. There are

three master modes which use the internal timing

source to supply the conﬁguration clock (CCLK) to time

the incoming data. Serial master mode uses serial con-

ﬁguration data supplied to data-in (DIN) from a syn-

chronous serial source such as the serial conﬁguration

PROM shown in Figure 21. Parallel master low and

master high modes automatically use parallel data sup-

plied to the D[7:0] pins in response to the 16-bit

address generated by the FPGA. Figure 22 shows an

example of the parallel master mode connections

required. The FPGA HEX starting address is 0000 and

increments for master low mode, and it is FFFF and

decrements for master high mode. These two modes

provide address compatibility with microprocessors

which begin execution from opposite ends of memory.

For master high or low, data bytes are read in parallel

by each read clock (RCLK) and internally serialized by

the conﬁguration clock. As each data byte is read, the

least signiﬁcant bit of the next byte, D0, becomes the

next bit in the internal serial conﬁguration word. One

master mode FPGA can be used to interface the

conﬁguration program-store, and pass additional

concatenated conﬁguration data to additional FPGAs in

a serial daisy-chain fashion. CCLK is provided for the

slaved devices, and their serialized data is supplied

from DOUT to DIN, DOUT to DIN, etc.

Note: The serial conﬁguration PROM supports automatic loading of conﬁguration programs up to 36/64/128 Kbits. Multiple devices can be

cascaded to support additional FPGAs. An early DONE inhibits the data output one CCLK cycle before the FPGA I/O becomes active.

Figure 21. Master Serial Mode

5-3112(C)

DURING CONFIGURATION

THE 5 kΩ M2 PULL-DOWN

RESISTOR OVERCOMES THE

INTERNAL PULL-UP,

BUT IT ALLOWS M2 TO

BE USER I/O.

M0 M1 PWRDWN

+5 V

DOUT

HDC

LDC

OTHER

I/O PINS

ATT3000

SERIES

FPGA

GENERAL-

PURPOSE

USER I/O

PINS

RESET

SYSTEM RESET

D/P

CCLK

DIN

CLK

DATA

OE/RESET

ATT1700A

CEO

(HIGH RESETS THE ADDRESS POINTER)

CASCADED

ATT1700A

MEMORY

OPTIONAL

IDENTICAL SLAVE

FPGAs CONFIGURED

THE SAME

CLK

DATA

INIT OE/RESET

Data Sheet

February 1997 ATT3000 Series Field-Programmable Gate Arrays

Lucent Technologies Inc. 23

Conﬁguration Modes (continued)

Figure 22. Master Parallel Mode

5-3113(F)

M0 M1 PWRDWN

FPGA

+5 V

HDC

OTHER

RCLK

I/O PINS

DATA BUS

GENERAL-

PURPOSE

USER I/O

PNS

5 kΩDOUT

INIT

RESET

A15

A14

A13

A12

A11

A10

EPROM

(2K x 8

OR LARGER)

SYSTEM

USER CONTROL OF HIGHER

ORDER FROM ADDRESS BITS

CAN BE USED TO SELECT FROM

ALTERNATIVE CONFIGURATIONS

CCLK

+5 V

5 kΩ

LDC

RESET

D/P

Data Sheet

ATT3000 Series Field-Programmable Gate Arrays February 1997

24 Lucent Technologies Inc.

Conﬁguration Modes (continued)

Peripheral Mode

Peripheral mode provides a simpliﬁed interface through which the device may be loaded byte-wide, as a processor

peripheral. Figure 23 shows the peripheral mode connections. Processor write cycles are decoded from the com-

mon assertion of the active-low write strobe (WS), and two active-low and one active-high chip selects (CS0, CS1,

CS2). If all of these signals are not available, the unused inputs should be driven to their respective active levels.

The FPGA will accept 1 byte of conﬁguration data on the D[7:0] inputs for each selected processor write cycle.

Each byte of data is loaded into a buffer register. The FPGA generates a CCLK from the internal timing generator

and serializes the parallel input data for internal framing or for succeeding slaves on data out (DOUT). An output

HIGH on READY/BUSY pin indicates the completion of loading for each byte when the input register is ready for a

new byte. As with master modes, peripheral mode may also be used as a lead device for a daisy-chain of slave

devices.

Figure 23. Peripheral Mode

REPROGRAM

+5 V

ADDRESS

BUS

CONTROL

SIGNALS

ADDRESS

DECODE

LOGIC

GENERAL-

PURPOSE

USER I/O

OTHER

I/O PINS

LDC

HDC

DOUT

CCLK

CS0

D[7:0]

CS1

CS2

RDY/BUSY

INIT

D/P

RESET

D[7:0]

M0 M1 PWRDWN

+5 V

DATA

BUS 5 kΩ

5-3114(F)

Data Sheet

February 1997 ATT3000 Series Field-Programmable Gate Arrays

Lucent Technologies Inc. 25

Conﬁguration Modes (continued)

Slave Mode

Slave mode provides a simple interface for loading the FPGA conﬁguration as shown in Figure 24. Serial data is

supplied in conjunction with a synchronizing input clock. Most slave mode applications are in daisy-chain conﬁgu-

rations in which the data input is supplied by the previous FPGA’s data out, while the clock is supplied by a lead

device in master or peripheral mode. Data may also be supplied by a processor or other special circuits.

Figure 24. Slave Mode

5-3115(F)

MICROCOMPUTER

I/O PORT

STRB

OTHER

+5 V

RESET

D/P

RESET

INIT

GENERAL-

PURPOSE

USER I/O

I/O PINS

FPGA LDC

HDC

DOUT

5 kΩ

+5 V

M0 M1 PWRDWN

CCLK

DIN

SYSTEM

RESET

Data Sheet

ATT3000 Series Field-Programmable Gate Arrays February 1997

26 Lucent Technologies Inc.

Conﬁguration Modes (continued)

Daisy Chain

The ORCA Foundry for ATT3000 Development System

is used to create a composite conﬁguration bit stream

for selected FPGAs including a preamble, a length

count for the total bit stream, multiple concatenated

data programs, a postamble, plus an additional ﬁll bit

per device in the serial chain. After loading and passing

on the preamble and length count to a possible daisy

chain, a lead device will load its conﬁguration data

frames while providing a high DOUT to possible down-

stream devices as shown in Figure 25. Loading contin-

ues while the lead device has received its conﬁguration

program and the current length count has not reached

the full value. Additional data is passed through the

lead device and appears on the data out (DOUT) pin in

serial form. The lead device also generates the CCLK

to synchronize the serial output data and data in of

downstream FPGAs. Data is read in on DIN of slave

devices by the positive edge of CCLK and shifted out

the DOUT on the negative edge of CCLK. A parallel

master mode device uses its internal timing generator

to produce an internal CCLK of eight times its EPROM

address rate, while a peripheral mode device produces

a burst of eight CCLKs for each chip select and write-

strobe cycle. The internal timing generator continues to

operate for general timing and synchronization of

inputs in all modes.

Figure 25. Master Mode with Daisy-Chained Slave Mode Devices

5-3116(F)

M0 M1 PWRDWN

FPGA

+5 V

HDC

OTHER

RCLK

I/O PINS

GENERAL-

PURPOSE

USER I/O

PINS

5 kΩ

A15

A14

A13

A12

A11

A10

EPROM

D/P

+5 V

RESET

REPROGRAM

SYSTEM

OPEN COLLECTOR

M0 M1 PWRDWN

+5 V

5 kΩ

HDC

OTHER

LDC

I/O PINS

GENERAL-

PURPOSE

USER I/O

INIT

DIN

CCLK

D/P

RESET

DOUT

M0 M1 PWRDWN

+5 V

5 kΩ

HDC

OTHER

LDC

I/O PINS

GENERAL-

PURPOSE

USER I/O

DIN

CCLK

D/P

RESET

DOUT

FPGA

SLAVE #1 FPGA

SLAVE #n

5 kΩ EACH

+5 V

INIT

RESET

CCLK

DOUT

A15

A14

A13

A12

A11

MASTER

INIT

LDC

Lucent Technologies Inc. 27

Data Sheet

February 1997 ATT3000 Series Field-Programmable Gate Arrays

Special Conﬁguration Functions

The conﬁguration data includes control over several

special functions in addition to the normal user logic

functions and interconnects:

■Input thresholds

■Readback enable

■DONE pull-up resistor

■DONE timing

■RESET timing

■Oscillator frequency divided by two

Each of these functions is controlled by conﬁguration

data bits which are selected as part of the normal

development system bit stream generation process.

Input Thresholds

Prior to the completion of conﬁguration, all FPGA input

thresholds are TTL compatible. Upon completion of

conﬁguration, the input thresholds become either TTL

or CMOS compatible as programmed. The use of the

TTL threshold option requires some additional supply

current for threshold shifting. The exception is the

threshold of the PWRDWN input and direct clocks which

always have a CMOS input. Prior to the completion of

conﬁguration, the user I/O pins each have a high-

impedance pull-up. The conﬁguration program can be

used to enable the IOB pull-up resistors in the opera-

tional mode to act either as an input load or to avoid a

ﬂoating input on an otherwise unused pin.

Readback

The contents of an FPGA may be read back if it has

been programmed with a bit stream in which the read-

back option has been enabled. Readback may be used

for veriﬁcation of conﬁguration and as a method for

determining the state of internal logic nodes. There are

three options in generating the conﬁguration bit stream:

■Never will inhibit the readback capability.

■One-time will inhibit readback after one readback

has been executed to verify the conﬁguration.

■On-command will allow unrestricted use of read-

back.

Readback is accomplished without the use of any of

the user I/O pins; only M0, M1, and CCLK are used.

The initiation of readback is produced by a low-to-high

transition of the M0/RTRIG (read trigger) pin. Once the

readback command has been given, the input CCLK is

driven by external logic to read back each data bit in a

format similar to loading. After two dummy bits, the ﬁrst

data frame is shifted out on the M1/RDATA (read data)

pin. The logic polarity of the readback data is always

inverted, such that a zero in conﬁguration becomes a

one in readback and vice versa. Each readback frame

has one start bit and one stop bit per frame (conﬁgura-

tion writes at least 3 stop bits per frame). All data

frames must be read back to complete the process and

return the mode select and CCLK pins to their normal

functions.

The readback data includes the current state of each

internal logic block storage element, and the state of

the input (.i and .ri) connection pins on each IOB. The

data is imbedded into unused conﬁguration bit posi-

tions during readback. This state information is used by

the FPGA development system in-circuit veriﬁer to pro-

vide visibility into the internal operation of the logic

while the system is operating. To read back a uniform

time sample of all storage elements, it may be neces-

sary to inhibit the system clock.

Data Sheet

ATT3000 Series Field-Programmable Gate Arrays February 1997

28 Lucent Technologies Inc.

Special Conﬁguration Functions

(continued)

Reprogram

The FPGA conﬁguration memory can be rewritten

while the device is operating in the user’s system. To

initiate a reprogramming cycle, the dual-function pack-

age pin DONE/PROG must be given a high-to-low tran-

sition. To reduce sensitivity to noise, the input signal is

ﬁltered for two cycles of the FPGA’s internal timing gen-

erator. When reprogram begins, the user-programma-

ble I/O output buffers are disabled and high-impedance

pull-ups are provided for the package pins. The device

returns to the clear state and clears the conﬁguration

memory before it prompts INITIALIZED. Since this

clear operation uses chip-individual internal timing, the

master might complete the clear operation and then

start conﬁguration before the slave has completed the

clear operation. To avoid this, wire-AND the slave INIT

pins and use them to force a RESET on the master (see

Figure 25). Reprogram control is often implemented by

using an external open-collector driver which pulls

DONE/PROG low. Once it recognizes a stable request,

the FPGA will hold a low until the new conﬁguration has

been completed. Even if the reprogram request is

externally held low beyond the conﬁguration period, the

FPGA will begin operation upon completion of conﬁgu-

ration.

DONE Pull-Up

DONE/PROG is an open-drain I/O pin that indicates the

FPGA is in the operational state. An optional internal

pull-up resistor can be enabled by the user of the devel-

opment system when the bit stream generation pro-

gram is executed. The DONE/PROG pins of multiple

FPGAs in a daisy chain may be connected together to

indicate that all are DONE or to direct them all to repro-

gram.

DONE Timing

The timing of the DONE status signal can be controlled

by a selection in the bit stream generation program to

occur a CCLK cycle before, or after, the timing of out-

puts being activated (see Figure 20). This facilitates

control of external functions, such as a PROM enable

or holding a system in a wait-state.

RESET Timing

As with DONE timing, the timing of the release of the

internal RESET can be controlled by a selection in the

bit stream generation program to occur a CCLK cycle

before, or after, the timing of outputs being enabled

(see Figure 20). This reset maintains all user-program-

mable ﬂip-ﬂops and latches in a zero state during con-

ﬁguration.

Crystal Oscillator Division

A selection in the bit stream generation program allows

the user to incorporate a dedicated divide-by-two ﬂip-

ﬂop in the crystal oscillator function. This provides

higher assurance of a symmetrical timing signal.

Although the frequency stability of crystal oscillators is

high, the symmetry of the waveform can be affected by

bias or feedback drive.

Data Sheet

February 1997 ATT3000 Series Field-Programmable Gate Arrays

Lucent Technologies Inc. 29

Performance

Device Performance

The high performance of the FPGA is due in part to the

manufacturing process, which is similar to that used for

high-speed CMOS static memories. Performance can

be measured in terms of minimum propagation times

for logic elements. The parameter which traditionally

describes the overall performance of a gate array is the

toggle frequency of a ﬂip-ﬂop. The conﬁguration for

determining the toggle performance of the FPGA is

shown in Figure 26. The ﬂip-ﬂop output Q is fed back

through the combinatorial logic as Q to form the toggle

ﬂip-ﬂop.

Figure 26. Toggle Flip-Flop

FPGA performance is determined by the timing of

critical paths, including both the ﬁxed timing for the

logic and storage elements in that path, and the timing

associated with the routing of the network. Examples

of internal worst-case timing are included in the

performance data to allow the user to make the best

use of the capabilities of the device. The ORCA

Foundry Development System timing calculator or

ORCA Foundry-generated simulation models should

be used to calculate worst-case paths by using actual

impedance and loading information.

Figure 27 shows a variety of elements which are

involved in determining system performance. Table 20

gives the parameter values for the different speed

grades. Actual measurement of internal timing is not

practical, and often only the sum of component

timing is relevant as in the case of input to output. The

relationship between input and output timing is arbi-

trary, and only the total determines performance.

Timing components of internal functions may be deter-

mined by the measurement of differences at the pins of

the package. A synchronous logic function which

involves a clock to block-output and a block-input to

clock setup is capable of higher-speed operation than a

logic conﬁguration of two synchronous blocks with an

extra combinatorial block level between them. System

clock rates to 60% of the toggle frequency are practical

for logic in which an extra combinatorial level is located

between synchronized blocks. This allows implementa-

tion of functions of up to 25 variables. The use of the

wired-AND is also available for wide, high-speed

functions.

CLOCK

D Q

5-3117(F)

Figure 27. Examples of Primary Block Speed Factors

CLOCK

LOGIC LOGIC

CLB CLB CLB

(K) (K)

IOB

PAD

TCKO TILO TICK TOP

CLOCK TO

OUTPUT COMBINATORIAL SETUP

IOB

TPID TOKOP

TCKO

PAD

5-3118(F)

Data Sheet

ATT3000 Series Field-Programmable Gate Arrays February 1997

30 Lucent Technologies Inc.

Performance (continued)

Logic Block Performance

Logic block performance is expressed as the propaga-

tion time from the interconnect point at the input of the

combinatorial logic to the output of the block in the

interconnect area. Combinatorial performance is inde-

pendent of the speciﬁc logic function because of the

table look-up based implementation. Timing is different

when the combinatorial logic is used in conjunction with

the storage element. For the combinatorial logic func-

tion driving the data input of the storage element, the

critical timing is data setup relative to the clock edge

provided to the ﬂip-ﬂop element. The delay from the

clock source to the output of the logic block is critical in

the timing of signals produced by storage elements.

Loading of a logic block output is limited only by the

resulting propagation delay of the larger interconnect

network. Speed performance of the logic block is a

function of supply voltage and temperature (see

Figures 28 and 29).

Interconnect Performance

Interconnect performance depends on the routing

resource used to implement the signal path. As dis-

cussed earlier, direct interconnect from block to block

provides a fast path for a signal. The single metal

segment used for long lines exhibits low resistance

from end to end, but relatively high capacitance.

Signals driven through a programmable switch will

have the additional impedance of the switch added to

their normal drive impedance.

General-purpose interconnect performance depends

on the number of switches and segments used, the

presence of the bidirectional repowering buffers, and

the overall loading on the signal path at all points along

the path. In calculating the worst-case timing for a

general interconnect path, the timing calculator portion

of the ORCA Foundry Development System accounts

for all of these elements.

As an approximation, interconnect timing is propor-

tional to the summation of totals of local metal seg-

ments beyond each programmable switch. In effect, the

time is a sum of R-C time each approximated by an R

times the total C it drives. The R of the switch and the C

of the interconnect are functions of the particular

device performance grade.

For a string of three local interconnects, the approxi-

mate time at the ﬁrst segment after the ﬁrst switch

resistance would be three units—an additional two

units after the next switch plus an additional unit after

the last switch in the chain. The interconnect R-C chain

terminates at each repowering buffer. The capacitance

of the actual block inputs is not signiﬁcant; the capaci-

tance is in the interconnect metal and switches.

Figure 30 illustrates this.

Data Sheet

February 1997 ATT3000 Series Field-Programmable Gate Arrays

Lucent Technologies Inc. 31

Performance (continued)

Figure 28. Change in Speed Performance Figure 29. Speed Performance of a CMOS Device

1.3

1.2

1.1

1.0

0.9

0.8

0.7

0.5

0.6

–55 –40 0 30 70 85 125

TEMPERATURE (°C) 5-3119(F)

1.2

1.1

1.0

0.9

4.0 4.5 5.0 5.5 6.0

VCC 5-3120(F)

Figure 30. Interconnection Timing Example

CLB

TIMING: INCREMENTAL

IF R1 = R2 = R3 = R AND C1 = C2 = C3 = C,

THEN CUMULATIVE TIMING

R1(C1 + C2 + C3)

T1 = 3RC

= 3RC

+ R2(C2 + C3)

T2 = 3RC + 2RC

= 5RC

+ R3 + C3

T3 = 3RC + 2RC + RC

= 6RC

6RC + BUFFER

C1 C2 C3 C4

REPOWERING

BUFFER

R2 R3

SWITCH MATRIX

5-3121(F)

Data Sheet

ATT3000 Series Field-Programmable Gate Arrays February 1997

32 Lucent Technologies Inc.

Power

Power Distribution

Power for the FPGA is distributed through a grid to

achieve high noise immunity and isolation between

logic and I/O. Inside the FPGA, a dedicated VCC and

ground ring surrounding the logic array provides power

to the I/O drivers (see Figure 31 below). An indepen-

dent matrix of VCC and ground lines supplies the inte-

rior logic of the device. This power distribution grid

provides a stable supply and ground for all internal

logic, provided that the external package power pins

are all connected and appropriately decoupled. Typi-

cally, a 0.1 µF capacitor connected near the VCC and

ground pins of the package will provide adequate

decoupling.

Output buffers which drive the speciﬁed 4 mA loads

under worst-case conditions may drive 25 to 30 times

this amount under best-case process conditions. Noise

can be reduced by minimizing external load capaci-

tance and reducing simultaneous output transitions in

the same direction. It may also be beneﬁcial to locate

heavily loaded output buffers near the ground pads.

The IOB output buffers have a slew-limited mode which

should be used where output rise and fall times are not

speed critical.

Slew-limited outputs maintain their dc drive capability

but generate less external reﬂections and internal

noise. More than 32 fast outputs should not be switch-

ing in the same direction simultaneously.

Figure 31. FPGA Power Distribution

VCC VCC

GND

GROUND AND

VCC RING FOR

I/O DRIVERS

LOGIC POWER GRID

5-3122(F)

Lucent Technologies Inc. 33

Data Sheet

February 1997 ATT3000 Series Field-Programmable Gate Arrays

Power (continued)

Power Dissipation

The FPGA exhibits the low power consumption charac-

teristic of CMOS ICs. The conﬁguration option of TTL

chip input threshold requires power for the threshold

reference. The power required by the static memory

cells that hold the conﬁguration data is very low and

may be maintained in a powerdown mode.

Typically, most of the power dissipation is produced by

external capacitive loads on the output buffers. This

load and frequency dependent power is 25 µW/pF/MHz

per output. Another component of I/O power is the dc

loading on each output pin by devices driven by the

FPGA.

Internal power dissipation is a function of the number

and size of the nodes, and the frequency at which they

change. In an FPGA, the fraction of nodes changing on

a given clock is typically low (10% to 20%). For

example, in a large binary counter, the average clock

cycle produces changes equal to one CLB output at

the clock frequency. Typical global clock buffer power is

between 1.7 mW/MHz for the ATT3020 and 3.5 mW/

MHz for the ATT3090. The internal capacitive load is

more a function of interconnect than fan-out. With a

typical load of three general interconnect segments,

each conﬁgurable logic block output requires about

0.22 mW/MHz of its output frequency:

Total Power = VCC + ICCO + External

(dc + Capacitive) + Internal

(CLB + IOB + Long Line + Pull-up)

Because the control storage of the FPGA is CMOS

static memory, its cells require a very low standby cur-

rent for data retention. In some systems, this low data

retention current characteristic can be used as a

method of preserving conﬁgurations in the event of a

primary power loss. The FPGA has built-in powerdown

logic which, when activated, will disable normal opera-

tion of the device and retain only the conﬁguration data.

All internal operation is suspended and output buffers

are placed in their high-impedance state with no pull-

ups. Powerdown data retention is possible with a sim-

ple battery backup circuit, because the power require-

ment is extremely low. For retention at 2.4 V, the

required current is typically on the order of 50 nA.

To force the FPGA into the powerdown state, the user

must pull the PWRDWN pin low and continue to supply

a retention voltage to the VCC pins of the package.

When normal power is restored, VCC is elevated to its

normal operating voltage and PWRDWN is returned to a

high. The FPGA resumes operation with the same

internal sequence that occurs at the conclusion of

conﬁguration. Internal I/O and logic block storage ele-

ments will be reset, the outputs will become enabled,

and the DONE/PROG pin will be released. No conﬁgu-

ration programming is involved.

When the power supply is removed from a CMOS

device, it is possible to supply some power from an

input signal. The conventional electrostatic input pro-

tection is implemented with diodes to the supply and

ground. A positive voltage applied to an I/O will cause

the positive protection diode to conduct and drive the

power pin. This condition can produce invalid power

conditions and should be avoided. A large series resis-

tor might be used to limit the current or a bipolar buffer

may be used to isolate the input signal.

Data Sheet

ATT3000 Series Field-Programmable Gate Arrays February 1997

34 Lucent Technologies Inc.

Pin Information

Table 4. Permanently Dedicated Pins

Symbol Name/Description

VCC Two to eight (depending on package type) connections to the nominal +5 V supply voltage. All

must be connected.

GND Two to eight (depending on package type) connections to ground. All must be connected.

PWRDWN A low on this CMOS compatible input stops all internal activity to minimize VCC power, and puts

all output buffers in a high-impedance state; conﬁguration is retained. When the PWRDWN pin

returns high, the device returns to operation with the same sequence of buffer enable and

DONE/PROG as at the completion of conﬁguration. All internal storage elements are reset. If

not used, PWRDWN must be tied to VCC.

RESET This is an active-low input which has three functions:

■Prior to the start of conﬁguration, a low input will delay the start of the conﬁguration process.

An internal circuit senses the application of power and begins a minimal time-out cycle. When

the time-out and RESET are complete, the levels of the M lines are sampled and conﬁguration

begins.

■If RESET is asserted during a conﬁguration, the FPGA is reinitialized and will restart the con-

ﬁguration at the termination of RESET.

■If RESET is asserted after conﬁguration is complete, it will provide an asynchronous reset of all

IOB and CLB storage elements of the FPGA.

CCLK Conﬁguration Clock. During conﬁguration, this is an output of an FPGA in master mode or

peripheral mode. FPGAs in slave mode use it as a clock input. During a readback operation, it is

a clock input for the conﬁguration data being ﬁltered out.

DONE/

PROG DONE Output. Conﬁgurable as open drain with or without an internal pull-up resistor. At the

completion of conﬁguration, the circuitry of the FPGA becomes active in a synchronous order,

and DONE may be programmed to occur one cycle before or after that occurs. Once conﬁgura-

tion is done, a high-to-low transition of this pin will cause an initialization of the FPGA and start a

reconﬁguration.

M0/RTRIG Mode 0. This input, M1, and M2 are sampled before the start of conﬁguration to establish the

conﬁguration mode to be used. After conﬁguration is complete, a low-to-high transition acts as a

read trigger to initiate a readback of conﬁguration and storage-element data clocked by CCLK.

M1/RDATA Mode 1. This input, M0, and M2 are sampled before the start of conﬁguration to establish the

conﬁguration mode to be used. After conﬁguration is complete, this pin is the active-low output of

the readback data.

Data Sheet

February 1997 ATT3000 Series Field-Programmable Gate Arrays

Lucent Technologies Inc. 35

Pin Information (continued)

Table 5. I/O Pins with Special Functions

Symbol Name/Description

M2 Mode 2. This input has a passive pull-up during conﬁguration. Together with M0 and M1, it is

sampled before the start of conﬁguration to establish the conﬁguration mode to be used. After

conﬁguration, this pin becomes a user-programmable I/O pin.

HDC High During Conﬁguration. HDC is held at a high level by the FPGA until after conﬁguration. It

is available as a control output indicating that conﬁguration is not yet completed. After

conﬁguration, this pin is a user I/O pin.

LDC Low During Conﬁguration. This active-low signal is held at a low level by the FPGA until after

conﬁguration. It is available as a control output indicating that conﬁguration is not yet completed.

It is particularly useful in master mode as a low enable for an EPROM. After conﬁguration, this

pin is a user I/O pin. If used as a low EPROM enable, it must be programmed as a high after

conﬁguration.

INIT This is an active-low, open-drain output which is held low during the power stabilization and

internal clearing of the conﬁguration memory. It can be used to indicate status to a conﬁguring

microprocessor or, as a wired-AND of several slave mode devices, a hold-off signal for a master

mode device. After conﬁguration, this pin becomes a user-programmable I/O pin.

BCLKIN This is a direct CMOS level input to the alternate clock buffer (auxiliary buffer) in the lower right

corner.

XTL1 This user I/O pin can be used to operate as the output of an ampliﬁer driving an external crystal

and bias circuitry.

XTL2 This user I/O pin can be used as the input of an ampliﬁer connected to an external crystal and

bias circuitry. The I/O block is left unconﬁgured. The oscillator conﬁguration is activated by

routing a net from the oscillator buffer symbol output and by the ORCA Foundry bit stream

generation program.

CS0, CS1,

CS2, WS These four inputs represent a set of signals, three active-low and one active-high, which are

used in the peripheral mode to control conﬁguration data entry. The assertion of all four

generates a write to the internal data buffer. The removal of any assertion clocks in the D[7:0]

data present. In the master parallel mode, WS and CS2 are the A0 and A1 outputs. After

conﬁguration, the pins are user-programmable I/O pins.

Data Sheet

ATT3000 Series Field-Programmable Gate Arrays February 1997

36 Lucent Technologies Inc.

RCLK During master parallel mode conﬁguration, RCLK represents a read of an external dynamic

memory device (normally not used).

RDY/BUSY During peripheral parallel mode conﬁguration, this pin indicates when the chip is ready for

another byte of data to be written to it. After conﬁguration is complete, this pin becomes a user-

programmed I/O pin.

D[7:0] This set of eight pins represents the parallel conﬁguration byte for the parallel master and

peripheral modes. After conﬁguration is complete, they are user-programmed I/O pins.

A[15:0] This set of 16 pins presents an address output for a conﬁguration EPROM during master parallel

mode. After conﬁguration is complete, they are user-programmed I/O pins.

DIN This user I/O pin is used as serial data input during slave or master serial conﬁguration. This pin

is data zero input in master or peripheral conﬁguration mode.

DOUT This user I/O pin is used during conﬁguration to output serial conﬁguration data for daisy-

chained slaves’ data in.

TCLKIN This is a direct CMOS level input to the global clock buffer.

I/O Input/Output (Unrestricted). May be programmed by the user to be input and/or output pin

following conﬁguration. Some of these pins present a high-impedance pull-up (see next page) or

perform other functions before conﬁguration is complete (see above).

Pin Information (continued)

Table 5. I/O Pins with Special Functions (continued)

Symbol Name/Description

Data Sheet

February 1997 ATT3000 Series Field-Programmable Gate Arrays

Lucent Technologies Inc. 37

Pin Information (continued)

Table 6A. ATT3000 Family Conﬁguration (44, 68, and 84 PLCC; 100 QFP; and 100 TQFP)

Conﬁguration Mode (M2:M1:M0) 44

PLCC*68

PLCC 84

PLCC†100

QFP 100

TQFP User

Operation

Slave

(1:1:1) Master-Serial

(0:0:0) Peripheral

(1:0:1) Master-High

(1:1:0) Master-Low

(1:0:0)

PWRDWN PWRDWN PWRDWN PWRDWN PWRDWN 7 10 12 29 26 PWRDWN

VCC VCC VCC VCC VCC 12 18 22 41 38 VCC

M1 (High) M1 (Low) M1 (Low) M1 (High) M1 (Low) 16 25 31 52 49 RDATA

M0 (High) M0 (Low) M0 (Low) M0 (High) M0 (Low) 17 26 32 54 51 RTRIG

M2 (High) M2 (Low) M2 (High) M2 (High) M2 (Low) 18 27 33 56 53 I/O

HDC (High) HDC (High) HDC (High) HDC (High) HDC (High) 19 28 34 57 54 I/O

LDC (Low) LDC (Low) LDC (Low) LDC (Low) LDC (Low) 20 30 36 59 56 I/O

INIT‡INIT‡INIT‡INIT‡INIT‡22 34 42 65 62 I/O

GND GND GND GND GND 23 35 43 66 63 GND

26 43 53 76 73 XTL2–I/O

RESET RESET RESET RESET RESET 27 44 54 78 75 RESET

DONE DONE DONE DONE DONE 28 45 55 80 77 PROG

D7 D7 D7 — 46 56 81 78 I/O

30 47 57 82 79 XTL1–I/O

D6 D6 D6 — 48 58 83 80 I/O

D5 D5 D5 — 49 60 87 84 I/O

CS0 — — — 50 61 88 85 I/O

D4 D4 D4 — 51 62 89 86 I/O

VCC VCC VCC VCC VCC 34 52 64 91 88 VCC

D3 D3 D3 — 53 65 92 89 I/O

CS1 — — — 54 66 93 90 I/O

D2 D2 D2 — 55 67 94 91 I/O

D1 D1 D1 — 56 70 98 95 I/O

RDY/BUSY RCLK RCLK — 57 71 99 96 I/O

DIN DIN D0 D0 D0 38 58 72 100 97 I/O

DOUT DOUT DOUT DOUT DOUT 39 59 73 1 98 I/O

CCLK CCLK CCLK CCLK CCLK 40 60 74 2 99 CCLK

WS A0 A0 — 61 75 5 2 I/O

CS2 A1 A1 — 62 76 6 3 I/O

A2 A2 — 63 77 8 5 I/O

A3 A3 — 64 78 9 6 I/O

A15 A15 — 65 81 12 9 I/O

A4 A4 — 66 82 13 10 I/O

A14 A14 — 67 83 14 11 I/O

A5 A5 — 68 84 15 12 I/O

GND GND GND GND GND 1 1 1 16 13 GND

A13 A13 — 2 2 17 14 I/O

A6 A6 — 3 3 18 15 I/O

A12 A12 — 4 4 19 16 I/O

A7 A7 — 5 5 20 17 I/O

A11 A11 — 6 8 23 20 I/O

A8 A8 — 7 9 24 21 I/O

A10 A10 — 8 10 25 22 I/O

A9 A9 — 9 11 26 23 I/O

Represents a 50 kΩ to 100 kΩ pull-up.

* Peripheral mode and master parallel mode are not supported in the 44-pin PLCC package; see Table 7.

† Pin assignments for the ATT3064/ATT3090 differ from those shown; see page 42.

‡ INIT is an open-drain output during configuration.

Data Sheet

ATT3000 Series Field-Programmable Gate Arrays February 1997

38 Lucent Technologies Inc.

Pin Information (continued)

Table 6B. ATT3000 Family Conﬁguration (132 PPGA, 144 TQFP, 160 QFP, 175 PPGA, 208 SQFP)

Conﬁguration Mode (M2:M1:M0) 132

PPGA 144

TQFP 160

QFP 175

PPGA 208

SQFP User

Operation

Slave

(1:1:1) Master-Serial

(0:0:0) Peripheral

(1:0:1) Master-High

(1:1:0) Master-Low

(1:0:0)

PWRDWN PWRDWN PWRDWN PWRDWN PWRDWN A1 1 159 B2 3 PWRDWN

VCC VCC VCC VCC VCC C8 19 20 D9 26 VCC

M1 (High) M1 (Low) M1 (Low) M1 (High) M1 (Low) B13 36 40 B14 48 RDATA

M0 (High) M0 (Low) M0 (Low) M0 (High) M0 (Low) A14 38 42 B15 50 RTRIG

M2 (High) M2 (Low) M2 (High) M2 (High) M2 (Low) C13 40 44 C15 56 I/O

HDC (High) HDC (High) HDC (High) HDC (High) HDC (High) B14 41 45 E14 57 I/O

LDC (Low) LDC (Low) LDC (Low) LDC (Low) LDC (Low) D14 45 49 D16 61 I/O

INIT* INIT* INIT* INIT* INIT* G14 53 59 H15 77 I/O

GND GND GND GND GND H12 55 19 J14 25 GND

M13 69 76 P15 100 XTL2–I/O

RESET RESET RESET RESET RESET P14 71 78 R15 102 RESET

DONE DONE DONE DONE DONE N13 73 80 R14 107 PROG

D7 D7 D7 M12 74 81 N13 109 I/O

P13 75 82 T14 110 XTL1–I/O

D6 D6 D6 N11 78 86 P12 115 I/O

D5 D5 D5 M9 84 92 T11 122 I/O

CS0 — — N9 85 93 R10 123 I/O

D4 D4 D4 N8 88 98 R9 128 I/O

VCC VCC VCC VCC VCC M8 90 100 N9 130 VCC

D3 D3 D3 N7 92 102 P8 132 I/O

CS1 — — P6 93 103 R8 133 I/O

D2 D2 D2 M6 96 108 R7 138 I/O

D1 D1 D1 M5 102 114 R5 145 I/O

RDY/BUSY RCLK RCLK N4 103 115 P5 146 I/O

DIN DIN D0 D0 D0 N2 106 119 R3 151 I/O

DOUT DOUT DOUT DOUT DOUT M3 107 120 N4 152 I/O

CCLK CCLK CCLK CCLK CCLK P1 108 121 R2 153 CCLK

WS A0 A0 M2 111 124 P2 161 I/O

CS2 A1 A1 N1 112 125 M3 162 I/O

A2 A2 L2 115 128 P1 165 I/O

A3 A3 L1 116 129 N1 166 I/O

A15 A15 K1 119 132 M1 172 I/O

A4 A4 J2 120 133 L2 173 I/O

A14 A14 H1 123 136 K2 178 I/O

A5 A5 H2 124 137 K1 179 I/O

GND GND GND GND GND H3 126 139 J3 182 GND

A13 A13 G2 128 141 H2 184 I/O

A6 A6 G1 129 142 H1 185 I/O

A12 A12 F2 133 147 F2 192 I/O

A7 A7 E1 134 148 E1 193 I/O

A11 A11 D1 137 151 D1 199 I/O

A8 A8 D2 138 152 C1 200 I/O

A10 A10 B1 141 155 E3 203 I/O

A9 A9 C2 142 156 C2 204 I/O

Represents a 50 kΩ to 100 kΩ pull-up.

* INIT is an open-drain output during configuration.

Data Sheet

February 1997 ATT3000 Series Field-Programmable Gate Arrays

Lucent Technologies Inc. 39

Pin Assignments

Notes:

Peripheral mode and master parallel mode are not supported in the M44 package.

Parallel address and data pins are not assigned.

Table 7. ATT3030 44-Pin PLCC Pinout

Pin No. Function Pin No. Function

1 GND 23 GND

2 I/O 24 I/O

3 I/O 25 I/O

4 I/O 26 XTL2–I/O

5 I/O 27 RESET

6 I/O 28 DONE–PROG

7PWRDWN 29 I/O

8TCLKIN–I/O 30 XTL1–BCLKIN–I/O

9I/O 31 I/O

10 I/O 32 I/O

11 I/O 33 I/O

12 VCC 34 VCC

13 I/O 35 I/O

14 I/O 36 I/O

15 I/O 37 I/O

16 M1–RDATA 38 DIN–I/O

17 M0–RTRIG 39 DOUT–I/O

18 M2–I/O 40 CCLK

19 HDC–I/O 41 I/O

20 LDC–I/O 42 I/O

21 I/O 43 I/O

22 INIT–I/O 44 I/O

Data Sheet

ATT3000 Series Field-Programmable Gate Arrays February 1997

40 Lucent Technologies Inc.

Pin Assignments (continued)

Table 8. ATT3020, ATT3030, and ATT3042; 68-Pin PLCC and 84-Pin PLCC Pinout*

Pin Numbers Function Pin Numbers Function

68 PLCC 84 PLCC 68 PLCC 84 PLCC

10 12 PWRDWN 38 46 I/O

11 13 TCLKIN–I/O 39 47 I/O

— 14 I/O†40 48 I/O

12 15 I/O 41 49 I/O

13 16 I/O — 50 I/O†

— 17 I/O — 51 I/O†

14 18 I/O 42 52 I/O

15 19 I/O 43 53 XTL2–I/O

16 20 I/O 44 54 RESET

17 21 I/O 45 55 DONE–PROG

18 22 VCC 46 56 D7–I/O

19 23 I/O 47 57 XTL1–BCLKIN–I/O

—24 I/O 48 58 D6–I/O

20 25 I/O — 59 I/O

21 26 I/O 49 60 D5–I/O

22 27 I/O 50 61 CS0–I/O

— 28 I/O 51 62 D4–I/O

23 29 I/O — 63 I/O

24 30 I/O 52 64 VCC

25 31 M1–RDATA 53 65 D3–I/O

26 32 M0–RTRIG 54 66 CS1–I/O

27 33 M2–I/O 55 67 D2–I/O

28 34 HDC–I/O — 68 I/O

29 35 I/O — 69 I/O†

30 36 LDC–I/O 56 70 D1–I/O

31 37 I/O 57 71 RDY/BUSY–RCLK–I/O

— 38 I/O†58 72 D0–DIN–I/O

32 39 I/O 59 73 DOUT–I/O

33 40 I/O 60 74 CCLK

— 41 I/O†61 75 A0–WS–I/O

34 42 INIT–I/O 62 76 A1–CS2–I/O

35 43 GND 63 77 A2–I/O

36 44 I/O 64 78 A3–I/O

37 45 I/O — 79 I/O†

* Unprogrammed IOBs have a default pull-up; this prevents an undeﬁned pad level for unbonded or unused IOBs. Programmed outputs are

default slew-limited.

† Indicates unconnected package pins for the ATT3020.

Data Sheet

February 1997 ATT3000 Series Field-Programmable Gate Arrays

Lucent Technologies Inc. 41

Note: Table 8 describes the pin assignments for three different chips in two different packages. The function column lists 84 of the 118 pads on

the ATT3042 and 84 of the 98 pads on the ATT3030. Ten pads [indicated with a dagger (†)] do not exist on the ATT3020, which has

74 pads; therefore, the corresponding pins on the 84-pin packages have no connections to an ATT3020.

—80 I/O†4 4 A12–I/O

65 81 A15–I/O 5 5 A7–I/O

66 82 A4–I/O — 6 I/O†

67 83 A14–I/O — 7 I/O†

68 84 A5–I/O 6 8 A11–I/O

1 1 GND 7 9 A8–I/O

2 2 A13–I/O 8 10 A10–I/O

3 3 A6–I/O 9 11 A9–I/O

Pin Assignments (continued)

Table 8. ATT3020, ATT3030, and ATT3042; 68-Pin PLCC and 84-Pin PLCC Pinout* (continued)

Pin Numbers Function Pin Numbers Function

68 PLCC 84 PLCC 68 PLCC 84 PLCC

* Unprogrammed IOBs have a default pull-up; this prevents an undeﬁned pad level for unbonded or unused IOBs. Programmed outputs are

default slew-limited.

† Indicates unconnected package pins for the ATT3020.

Data Sheet

ATT3000 Series Field-Programmable Gate Arrays February 1997

42 Lucent Technologies Inc.

Pin Assignments (continued)

*Different pin deﬁnition than ATT3020/ATT3030/ATT3042 PC84 package.

Note: Unprogrammed IOBs have a default pull-up; this prevents an undeﬁned pad level for unbonded or unused IOBs. Programmed

outputs are default slew-limited.

Table 9. ATT3064 and ATT3090 84-Pin PLCC Pinout

PLCC Function 84

PLCC Function

12 PWRDWN 40 I/O 68 D2–I/O*

13 TCLKIN–I/O 41 INIT–I/O* 69 I/O

14 I/O 42 VCC* 70 D1–I/O

15 I/O 43 GND 71 RDY/BUSY–RCLK–I/O

16 I/O 44 I/O 72 D0–DIN–I/O

17 I/O 45 I/O 73 DOUT–I/O

18 I/O 46 I/O 74 CCLK

19 I/O 47 I/O 75 A0–WS–I/O

20 I/O 48 I/O 76 A1–CS2–I/O

21 GND* 49 I/O 77 A2–I/O

22 VCC 50 I/O 78 A3–I/O

23 I/O 51 I/O 79 I/O*

24 I/O 52 I/O 80 I/O*

25 I/O 53 XTL2–I/O 81 A15–I/O

26 I/O 54 RESET 82 A4–I/O

27 I/O 55 DONE–PROG 83 A14–I/O

28 I/O 56 D7–I/O 84 A5–I/O

29 I/O 57 XTL1–BCLKIN–I/O 1 GND

30 I/O 58 D6–I/O 2 VCC*

31 M1–RDATA 59 I/O 3 A13–I/O*

32 M0–RTRIG 60 D5–I/O 4 A6–I/O*

33 M2–I/O 61 CS0–I/O 5 A12–I/O*

34 HDC–I/O 62 D4–I/O 6 A7–I/O*

35 I/O 63 I/O 7 I/O

36 LDC–I/O 64 VCC 8 A11–I/O

37 I/O 65 GND* 9 A8–I/O

38 I/O 66 D3–I/O* 10 A10–I/O

39 I/O 67 CS1–I/O* 11 A9–I/O

Data Sheet

February 1997 ATT3000 Series Field-Programmable Gate Arrays

Lucent Technologies Inc. 43

Pin Assignments (continued)

* Only 100 of the 118 pads on the ATT3042 are connected to the 100 package pins. Two pads, indicated by double asterisks, do not exist on

the ATT3030, which has 98 pads; therefore, the corresponding pins have no connections. Twenty-six pads, indicated by single or double

asterisks, do not exist on the ATT3020, which has 74 pads; therefore, the corresponding pins have no connections.

Note: Unprogrammed IOBs have a default pull-up; this prevents an undeﬁned pad level for unbonded or unused IOBs. Programmed outputs

are default slew-limited.

Table 10. ATT3020, ATT3030, and ATT3042 100-Pin QFP Pinout

100

QFP Function 100

QFP Function

16 GND 50 I/O* 84 I/O*

17 A13–I/O 51 I/O* 85 I/O*

18 A6–I/O 52 M1–RDATA 86 I/O

19 A12–I/O 53 GND* 87 D5–I/O

20 A7–I/O 54 M0–RTRIG 88 CS0–I/O

21 I/O* 55 VCC* 89 D4–I/O

22 I/O* 56 M2–I/O 90 I/O

23 A11–I/O 57 HDC–I/O 91 VCC

24 A8–I/O 58 I/O 92 D3–I/O

25 A10–I/O 59 LDC–I/O 93 CS1–I/O

26 A9–I/O 60 I/O* 94 D2–I/O

27* VCC 61 I/O* 95 I/O

28* GND 62 I/O 96 I/O*

29 PWRDWN 63 I/O 97 I/O*

30 TCLKIN–I/O 64 I/O 98 D1–I/O

31 I/O** 65 INIT–I/O 99 RCLK–RDY/BUSY–I/O

32 I/O* 66 GND 100 D0–DIN–I/O

33 I/O* 67 I/O 1 DOUT–I/O

34 I/O 68 I/O 2 CCLK

35 I/O 69 I/O 3 VCC*

36 I/O 70 I/O 4 GND*

37 I/O 71 I/O 5 A0–WS–I/O

38 I/O 72 I/O 6 A1–CS2–I/O

39 I/O 73 I/O 7 I/O**

40 I/O 74 I/O* 8 A2–I/O

41 VCC 75 I/O* 9 A3–I/O

42 I/O 76 XTL2–I/O 10 I/O*

43 I/O 77* GND 11 I/O*

44 I/O 78 RESET 12 A15–I/O

45 I/O 79 VCC* 13 A4–I/O

46 I/O 80 DONE–PROG 14 A14–I/O

47 I/O 81 D7–I/O 15 A5–I/O

48 I/O 82 XTL1–BCLKIN–I/O — —

49 I/O 83 D6–I/O — —

Data Sheet

ATT3000 Series Field-Programmable Gate Arrays February 1997

44 Lucent Technologies Inc.

Pin Assignments (continued)

* Indicates unconnected package pins for the ATT3030.

Note: Unprogrammed IOBs have a default pull-up; this prevents an undeﬁned pad level for unbonded or unused IOBs. Programmed outputs

are default slew-limited.

Table 11. ATT3030, ATT3042, and ATT3064 100-Pin TQFP Pinout

100

TQFP Function 100

TQFP Function

13 GND 47 I/O 81 I/O

14 A13–I/O 48 I/O 82 I/O

15 A6–I/O 49 M1–RDATA 83 I/O

16 A12–I/O 50 GND 84 D5–I/O

17 A7–I/O 51 M0–RTRIG 85 CS0–I/O

18 I/O 52 VCC 86 D4–I/O

19 I/O 53 M2–I/O 87 I/O

20 A11–I/O 54 HDC–I/O 88 VCC

21 A8–I/O 55 I/O 89 D3–I/O

22 A10–I/O 56 LDC–I/O 90 CS1–I/O

23 A9–I/O 57 I/O 91 D2–I/O

24 VCC 58 I/O 92 I/O

25 GND 59 I/O 93 I/O

26 PWRDWN 60 I/O 94 I/O

27 TCLKIN–I/O 61 I/O 95 D1–I/O

28 I/O* 62 INIT–I/O 96 RCLK–RDY/BUSY–I/O

29 I/O 63 GND 97 D0–DIN–I/O

30 I/O 64 I/O 98 DOUT–I/O

31 I/O 65 I/O 99 CCLK

32 I/O 66 I/O 100 VCC

33 I/O 67 I/O 1 GND

34 I/O 68 I/O 2 A0–WS–I/O

35 I/O 69 I/O 3 A1–CS2–I/O

36 I/O 70 I/O 4 I/O*

37 I/O 71 I/O 5 A2–I/O

38 VCC 72 I/O 6 A3–I/O

39 I/O 73 XTL2–I/O 7 I/O

40 I/O 74 GND 8 I/O

41 I/O 75 RESET 9A15–I/O

42 I/O 76 VCC 10 A4–I/O

43 I/O 77 DONE–PROG 11 A14–I/O

44 I/O 78 D7–I/O 12 A5–I/O

45 I/O 79 XTL1–BCLKIN–I/O — —

46 I/O 80 D6–I/O — —

Data Sheet

February 1997 ATT3000 Series Field-Programmable Gate Arrays

Lucent Technologies Inc. 45

Pin Assignments (continued)

* Indicates unconnected package pins for the ATT3030.

Note: Unprogrammed IOBs have a default pull-up; this prevents an undeﬁned pad level for unbonded or unused IOBs. Programmed outputs

are default slew-limited.

Table 12. ATT3042 and ATT3064 132-Pin PPGA Pinout

132

PPGA Function 132

PPGA Function

C4 GND F12 I/O N6 I/O*

A1 PWRDWN E14 I/O P5 I/O*

C3 TCLKIN–I/O F13 I/O M6 D2–I/O

B2 I/O F14 I/O N5 I/O

B3 I/O G13 I/O P4 I/O

A2 I/O* G14 INIT–I/O P3 I/O

B4 I/O G12 VCC M5 D1–I/O

C5 I/O H12 GND N4 RCLK–RDY/BUSY–I/O

A3 I/O* H14 I/O P2 I/O

A4 I/O H13 I/O N3 I/O

B5 I/O J14 I/O N2 D0–DIN–I/O

C6 I/O J13 I/O M3 DOUT–I/O

A5 I/O K14 I/O P1 CCLK

B6 I/O J12 I/O M4 VCC

A6 I/O K13 I/O L3 GND

B7 I/O L14 I/O* M2 A0–WS–I/O

C7 GND L13 I/O N1 A1–CS2–I/O

C8 VCC K12 I/O M1 I/O

A7 I/O M14 I/O K3 I/O

B8 I/O N14 I/O L2 A2–I/O

A8 I/O M13 XTL2–I/O L1 A3–I/O

A9 I/O L12 GND K2 I/O

B9 I/O P14 RESET J3 I/O

C9 I/O M11 VCC K1 A15–I/O

A10 I/O N13 DONE–PROG J2 A4–I/O

B10 I/O M12 D7–I/O J1 I/O*

A11 I/O* P13 XTL1–BCLKIN–I/O H1 A14–I/O

C10 I/O N12 I/O H2 A5–I/O

B11 I/O P12 I/O H3 GND

A12 I/O* N11 D6–I/O G3 VCC

B12 I/O M10 I/O G2 A13–I/O

A13 I/O* P11 I/O* G1 A6–I/O

C12 I/O N10 I/O F1 I/O*

B13 M1–RDATA P10 I/O F2 A12–I/O

C11 GND M9 D5–I/O E1 A7–I/O

A14 M0–RTRIG N9 CS0–I/O F3 I/O

D12 VCC P9 I/O* E2 I/O

C13 M2–I/O P8 I/O* D1 A11–I/O

B14 HDC–I/O N8 D4–I/O D2 A8–I/O

C14 I/O P7 I/O E3 I/O

E12 I/O M8 VCC C1 I/O

D13 I/O M7 GND B1 A10–I/O

D14 LDC–I/O N7 D3–I/O C2 A9–I/O

E13 I/O* P6 CS1–I/O D3 VCC

Data Sheet

ATT3000 Series Field-Programmable Gate Arrays February 1997

46 Lucent Technologies Inc.

Pin Assignments (continued)

* Indicates unconnected package pins for the ATT3042.

Note: Unprogrammed IOBs have a default pull-up; this prevents an undeﬁned pad level for unbonded or unused IOBs. Programmed outputs

are default slew-limited.

Table 13. ATT3042 and ATT3064 144-Pin TQFP Pinout

144

TQFP Function 144

TQFP Function

1PWRDWN 37 GND 73 DONE—PROG 109 VCC

2 TCLKIN—I/O 38 M0–RTRIG 74 D7–I/O 110 GND

3 I/O* 39 VCC 75 XTL1–BCLKIN–I/O 111 A0–WS–I/O

4 I/O 40 M2–I/O 76 I/O 112 A1–CS2–I/O

5I/O 41 HDC–I/O 77 I/O 113 I/O

6 I/O* 42 I/O 78 D6–I/O 114 I/O

7 I/O 43 I/O 79 I/O 115 A2–I/O

8I/O 44 I/O 80 I/O* 116 A3–I/O

9I/O* 45 LDC—I/O 81 I/O 117 I/O

10 I/O 46 I/O* 82 I/O 118 I/O

11 I/O 47 I/O 83 I/O* 119 A15–I/O

12 I/O 48 I/O 84 D5–I/O 120 A4–I/O

13 I/O 49 I/O 85 CS0–I/O 121 I/O*

14 I/O 50 I/O* 86 I/O* 122 I/O*

15 I/O* 51 I/O 87 I/O* 123 A14–I/O

16 I/O 52 I/O 88 D4–I/O 124 A5–I/O

17 I/O 53 INIT–I/O 89 I/O 125 —

18 GND 54 VCC 90 VCC 126 GND

19 VCC 55 GND 91 GND 127 VCC

20 I/O 56 I/O 92 D3—I/O 128 A13–I/O

21 I/O 57 I/O 93 CS1—I/O 129 A6–I/O

22 I/O 58 I/O 94 I/O* 130 I/O*

23 I/O 59 I/O 95 I/O* 131 —

24 I/O 60 I/O 96 D2—I/O 132 I/O*

25 I/O 61 I/O 97 I/O 133 A12–I/O

26 I/O 62 I/O 98 I/O 134 A7–I/O

27 I/O 63 I/O* 99 I/O* 135 I/O

28 I/O* 64 I/O* 100 I/O 136 I/O

29 I/O 65 I/O 101 I/O* 137 A11–I/O

30 I/O 66 I/O 102 D1—I/O 138 A8–I/O

31 I/O* 67 I/O 103 RCLK—BUSY/RDY—I/O 139 I/O

32 I/O* 68 I/O 104 I/O 140 I/O

33 I/O 69 XTL2—I/O 105 I/O 141 A10–I/O

34 I/O* 70 GND 106 D0—DIN—I/O 142 A9–I/O

35 I/O 71 RESET 107 DOUT–I/O 143 VCC

36 M1–RDATA 72 VCC 108 CCLK 144 GND

Data Sheet

February 1997 ATT3000 Series Field-Programmable Gate Arrays

Lucent Technologies Inc. 47

Pin Assignments (continued)

* Indicates unconnected package pins for the ATT3064.

Note: Unprogrammed IOBs have a default pull-up; this prevents an undeﬁned pad level for unbonded or unused IOBs. Programmed outputs

are default slew-limited.

Table 14. ATT3064 and ATT3090 160-Pin QFP Pinout

160

QFP Function 160

QFP Function

1 I/O* 41 GND 81 D7–I/O 121 CCLK

2 I/O* 42 M0–RTRIG 82 XTL1–BCLKIN–I/O 122 VCC

3 I/O* 43 VCC 83 I/O* 123 GND

4 I/O 44 M2–I/O 84 I/O 124 A0–WS–I/O

5 I/O 45 HDC–I/O 85 I/O 125 A1–CS2–I/O

6I/O 46 I/O 86 D6–I/O 126 I/O

7 I/O 47 I/O 87 I/O 127 I/O

8 I/O 48 I/O 88 I/O 128 A2–I/O

9I/O 49 LDC–I/O 89 I/O 129 A3–I/O

10 I/O 50 I/O* 90 I/O 130 I/O

11 I/O 51 I/O* 91 I/O 131 I/O

12 I/O 52 I/O 92 D5–I/O 132 A15–I/O

13 I/O 53 I/O 93 CS0– I/O 133 A4–I/O

14 I/O 54 I/O 94 I/O* 134 I/O

15 I/O 55 I/O 95 I/O* 135 I/O

16 I/O 56 I/O 96 I/O 136 A14–I/O

17 I/O 57 I/O 97 I/O 137 A5–I/O

18 I/O 58 I/O 98 D4–I/O 138 I/O*

19 GND 59 INIT–I/O 99 I/O 139 GND

20 VCC 60 VCC 100 VCC 140 VCC

21 I/O* 61 GND 101 GND 141 A13–I/O

22 I/O 62 I/O 102 D3–I/O 142 A6–I/O

23 I/O 63 I/O 103 CS1–I/O 143 I/O*

24 I/O 64 I/O 104 I/O 144 I/O*

25 I/O 65 I/O 105 I/O 145 I/O

26 I/O 66 I/O 106 I/O* 146 I/O

27 I/O 67 I/O 107 I/O* 147 A12–I/O

28 I/O 68 I/O 108 D2–I/O 148 A7–I/O

29 I/O 69 I/O 109 I/O 149 I/O

30 I/O 70 I/O 110 I/O 150 I/O

31 I/O 71 I/O 111 I/O 151 A11–I/O

32 I/O 72 I/O 112 I/O 152 A8–I/O

33 I/O 73 I/O 113 I/O 153 I/O

34 I/O 74 I/O 114 D1–I/O 154 I/O

35 I/O 75 I/O* 115 RCLK–RDY/BUSY–I/O 155 A10–I/O

36 I/O 76 XTL2–I/O 116 I/O 156 A9–I/O

37 I/O 77 GND 117 I/O 157 VCC

38 I/O*78 RESET 118 I/O*158 GND

39 I/O*79 VCC 119 D0–DIN–I/O 159 PWRDWN

40 M1–RDATA 80 DONE–PROG 120 DOUT–I/O 160 TCLKIN–I/O

Data Sheet

ATT3000 Series Field-Programmable Gate Arrays February 1997

48 Lucent Technologies Inc.

Pin Assignments (continued)

Table 15. ATT3000 Family 175-Pin PPGA Pinout

175

PPGA Function 175

PPGA Function

B2 PWRDWN D13 I/O R14 DONE–PROG R3 D0–DIN–I/O

D4 TCLKIN–I/O B14 M1–RDATA N13 D7–I/O N4 DOUT–I/O

B3 I/O C14 GND T14 XTL1–BCLKIN–I/O R2 CCLK

C4 I/O B15 M0–RTRIG P13 I/O P3 VCC

B4 I/O D14 VCC R13 I/O N3 GND

A4 I/O C15 M2–I/O T13 I/O P2 A0–WS–I/O

D5 I/O E14 HDC–I/O N12 I/O M3 A1–CS2–I/O

C5 I/O B16 I/O P12 D6–I/O R1 I/O

B5 I/O D15 I/O R12 I/O N2 I/O

A5 I/O C16 I/O T12 I/O P1 A2–I/O

C6 I/O D16 LDC–I/O P11 I/O N1 A3–I/O

D6 I/O F14 I/O N11 I/O L3 I/O

B6 I/O E15 I/O R11 I/O M2 I/O

A6 I/O E16 I/O T11 D5–I/O M1 A15–I/O

B7 I/O F15 I/O R10 CS0–I/O L2 A4–I/O

C7 I/O F16 I/O P10 I/O L1 I/O

D7 I/O G14 I/O N10 I/O K3 I/O

A7 I/O G15 I/O T10 I/O K2 A14–I/O

A8 I/O G16 I/O T9 I/O K1 A5–I/O

B8 I/O H16 I/O R9 D4–I/O J1 I/O

C8 I/O H15 INIT–I/O P9 I/O J2 I/O

D8 GND H14 VCC N9 VCC J3 GND

D9 VCC J14 GND N8 GND H3 VCC

C9 I/O J15 I/O P8 D3–I/O H2 A13–I/O

B9 I/O J16 I/O R8 CS1–I/O H1 A6–I/O

A9 I/O K16 I/O T8 I/O G1 I/O

A10 I/O K15 I/O T7 I/O G2 I/O

D10 I/O K14 I/O N7 I/O G3 I/O

C10 I/O L16 I/O P7 I/O F1 I/O

B10 I/O L15 I/O R7 D2–I/O F2 A12–I/O

A11 I/O M16 I/O T6 I/O E1 A7–I/O

B11 I/O M15 I/O R6 I/O E2 I/O

D11 I/O L14 I/O N6 I/O F3 I/O

C11 I/O N16 I/O P6 I/O D1 A11–I/O

A12 I/O P16 I/O T5 I/O C1 A8–I/O

B12 I/O N15 I/O R5 D1–I/O D2 I/O

C12 I/O R16 I/O P5 RDY/BUSY–RCLK–I/O B1 I/O

D12 I/O M14 I/O N5 I/O E3 A10–I/O

A13 I/O P15 XTL2–I/O T4 I/O C2 A9–I/O

B13 I/O N14 GND R4 I/O D3 VCC

C13 I/O R15 RESET P4 I/O C3 GND

A14 I/O P14 VCC — — — —

Note:Unprogrammed IOBs have a default pull-up; this prevents an undeﬁned pad level for unbonded or unused IOBs. Programmed

outputs are default slew-limited. Pins A2, A3, A15, A16, T1, T2, T3, T15, and T16 are not connected. Pin A1 does not exist.

Data Sheet

February 1997 ATT3000 Series Field-Programmable Gate Arrays

Lucent Technologies Inc. 49

Pin Assignments (continued)

Note: Unprogrammed IOBs have a default pull-up; this prevents an undeﬁned pad level for unbonded or unused IOBs. Programmed outputs

are default slew-limited.

Table 16. ATT3000 Family 208-Pin SQFP Pinout

208

SQFP Function 208

SQFP Function

1 — 53 — 105 — 157 —

2 GND 54 — 106 VCC 158 —

3 PWRDWN 55 VCC 107 DONE–PROG 159 —

4TCLKIN–I/O 56 M2–I/O 108 — 160 GND

5 I/O 57 HDC–I/O 109 D7–I/O 161 A0–WS–I/O

6 I/O 58 I/O 110 XTL1–BCLKIN–I/O 162 A1–CS2–I/O

7I/O 59 I/O 111 I/O 163 I/O

8 I/O 60 I/O 112 I/O 164 I/O

9 I/O 61 LDC–I/O 113 I/O 165 A2–I/O

10 I/O 62 I/O 114 I/O 166 A3–I/O

11 I/O 63 I/O 115 D6–I/O 167 I/O

12 I/O 64 — 116 I/O 168 I/O

13 I/O 65 — 117 I/O 169 —

14 I/O 66 — 118 I/O 170 —

15 I/O 67 — 119 — 171 —

16 I/O 68 I/O 120 I/O 172 A15–I/O

17 I/O 69 I/O 121 I/O 173 A4–I/O

18 I/O 70 I/O 122 D5–I/O 174 I/O

19 I/O 71 I/O 123 CS0–I/O 175 I/O

20 I/O 72 — 124 I/O 176 —

21 I/O 73 — 125 I/O 177 —

22 I/O 74 I/O 126 I/O 178 A14–I/O

23 I/O 75 I/O 127 I/O 179 A5–I/O

24 I/O 76 I/O 128 D4–I/O 180 I/O

25 GND 77 INIT–I/O 129 I/O 181 I/O

26 VCC 78 VCC 130 VCC 182 GND

27 I/O 79 GND 131 GND 183 VCC

28 I/O 80 I/O 132 D3–I/O 184 A13–I/O

29 I/O 81 I/O 133 CS1–I/O 185 A6–I/O

30 I/O 82 I/O 134 I/O 186 I/O

31 I/O 83 — 135 I/O 187 I/O

32 I/O 84 — 136 I/O 188 —

33 I/O 85 I/O 137 I/O 189 —

34 I/O 86 I/O 138 D2–I/O 190 I/O

35 I/O 87 I/O 139 I/O 191 I/O

36 I/O 88 I/O 140 I/O 192 A12–I/O

37 — 89 I/O 141 I/O 193 A7–I/O

38 I/O 90 — 142 — 194 —

39 I/O 91 — 143 I/O 195 —

40 I/O 92 — 144 I/O 196 —

41 I/O 93 I/O 145 D1–I/O 197 I/O

42 I/O 94 I/O 146 RDY/BUSY–RCLK–I/O 198 I/O

43 I/O 95 I/O 147 I/O 199 A11–I/O

44 I/O 96 I/O 148 I/O 200 A8–I/O

45 I/O 97 I/O 149 I/O 201 I/O

46 I/O 98 I/O 150 I/O 202 I/O

47 I/O 99 I/O 151 D0–DIN–I/O 203 A10–I/O

48 M1–RDATA 100 XTL2–I/O 152 DOUT–I/O 204 A9–I/O

49 GND 101 GND 153 CCLK 205 VCC

50 M0–RTRIG 102 RESET 154 VCC 206 —

51 — 103 — 155 — 207 —

52 — 104 — 156 — 208 —

Data Sheet

ATT3000 Series Field-Programmable Gate Arrays February 1997

50 Lucent Technologies Inc.

Package Thermal Characteristics

When silicon die junction temperature is below the rec-

ommended junction temperature of 125 °C, the

temperature-activated failure mechanisms are mini-

mized. There are four major factors that affect the ther-

mal resistance value: silicon device size/paddle size,

board-mounting conﬁguration (board density, multilayer

nature of board), package type and size, and system

airﬂow over the package. The values in the table below

reﬂect the capability of the various package types to

dissipate heat at given airﬂow rates. The numbers rep-

resent the delta °C/W between the ambient tempera-

ture and the device junction temperature.

To test package thermal characteristics, a single pack-

age containing a 0.269 in. sq. test IC of each conﬁgura-

tion is mounted at the center of a printed-circuit board

(PCB) measuring 8 in. x 13 in. x 0.062 in. The assem-

bled PCB is mounted vertically in the center of the rect-

angular test section of a wind tunnel. The walls of the

wind tunnel simulate adjacent boards in the electronic

rack and can be adjusted to study the effects of PCB

spacing. Forced air at room temperature is supplied by

a pair of push-pull blowers which can be regulated to

supply the desired air velocities. The air velocity is

measured with a hot-wire anemometer at the center of

the channel, 3 in. upstream from the package.

A typical test consists of regulating the wind tunnel

blowers to obtain the desired air velocity and applying

power to the test IC. The power to the IC is adjusted

until the maximum junction temperature (as measured

by its diodes) reaches 115 °C to 120 °C. The thermal

resistance ΘJA (°C/W) is computed by using the power

supplied to the IC, junction temperature, ambient tem-

perature, and air velocity:

where:

TJ = peak temperature on the active surface of the IC

TA = ambient air temperature

QC = IC power

The tests are repeated at several velocities from 0 fpm

(feet per minute) to 1000 fpm.

The deﬁnition of the junction to case thermal resistance

ΘJC is:

where:

TC = temperature measured to the thermocouple at

the top dead center of the package

The actual ΘJC measurement performed at Lucent,

ΘJ – TDC, uses a different package mounting arrange-

ment than the one deﬁned for ΘJC in MIL-STD-883D

and SEMI standards. Please contact Lucent for a dia-

gram.

The maximum power dissipation for a package is cal-

culated from the maximum junction temperature, maxi-

mum operating temperature, and the junction to

ambient characteristic ΘJA. The maximum power dissi-

pation for commercial grade ICs is calculated as fol-

lows: max power (watts) = (125 °C – 70 °C) x (1/ΘJA),

where 125 °C is the maximum junction temperature.

Table 17 lists the ATT3000 plastic package thermal

characteristics.

ΘJA TJTA–

--------------------

ΘJC TJTC–

--------------------

Data Sheet

February 1997 ATT3000 Series Field-Programmable Gate Arrays

Lucent Technologies Inc. 51

Package Thermal Characteristics (continued)

Table 17. ATT3000 Plastic Package Thermal Characteristics

Package QJA (°C/W) QJC

(°C/W) Max Power

(70 °C—0 fpm)

0 fpm 200 fpm 400 fpm

44-Pin PLCC 49 43 40 — 1.12 W

68-Pin PLCC 43 38 35 11 1.28 W

84-Pin PLCC 40 35 32 9 1.38 W

100-Pin QFP 81 67 64 11 0.68 W

100-Pin TQFP 61 49 46 6 0.90 W

132-Pin PPGA 22 18 16 — 2.50 W

144-Pin TQFP 52 39 36 4 1.06 W

160-Pin QFP 40 36 32 8 1.38 W

175-Pin PPGA 23 20 17 — 2.39 W

208-Pin SQFP 37 33 29 8 1.49 W

Package Coplanarity

The coplanarity of Lucent Technologies postmolded

packages is 4 mils. The coplanarity of the SQFP and

TQFP packages is 3.15 mils.

Package Parasitics

The electrical performance of an IC package, such as

signal quality and noise sensitivity, is directly affected

by the package parasitics. Table 18 lists eight parasitics

associated with the ATT3000 packages. These parasit-

ics represent the contributions of all components of a

package, which include the bond wires, all internal

package routing, and the external leads.

Four inductances in nH are listed: LW and LL, the self-

inductance of the lead; and LMW and LML, the mutual

inductance to the nearest neighbor lead. These

parameters are important in determining ground

bounce noise and inductive crosstalk noise. Three

capacitances in pF are listed: CM, the mutual capaci-

tance of the lead to the nearest neighbor lead; and C1

and C2, the total capacitance of the lead to all other

leads (all other leads are assumed to be grounded).

These parameters are important in determining capaci-

tive crosstalk and the capacitive loading effect of the

lead.

The parasitic values in Table 18 are for the circuit

model of bond wire and package lead parasitics. If the

mutual capacitance value is not used in the designer’s

model, then the value listed as mutual capacitance

should be added to each of the C1 and C2 capacitors.

The PGAs contain power and ground planes that will

make the inductance value for power and ground leads

the minimum value listed. The PGAs also have a signif-

icant range of parasitic values. This is due to the large

variation in internal trace lengths and is also due to two

signal metal layers that are separated from the ground

plane by different distances. The upper signal layer is

more inductive but less capacitive than the closer,

lower signal layer.

Data Sheet

ATT3000 Series Field-Programmable Gate Arrays February 1997

52 Lucent Technologies Inc.

Package Parasitics (continued)

* Leads designated as ground (power) can be connected to the ground plane, reducing the trace inductance to the minimum value listed.

Figure 32. Package Parasitics

Table 18. Package Parasitics

Package Type L WMWRWC1C2CMLLML

44-Pin PLCC 3 1 140 0.5 0.5 0.3 5—6 2—2.5

68-Pin PLCC 3 1 140 0.5 0.5 0.4 6—9 3—4

84-Pin PLCC 3 1 140 1 1 0.5 7—11 3—6

100-Pin QFP 3 1 160 1 1 0.5 7—9 4—5

100-Pin TQFP 3 1 150 0.5 0.5 0.4 4—6 2—3

132-Pin PPGA 3 1 150 1 1 0.25 4—10 0.5—1

144-Pin TQFP 3 1 140 1 1 0.6 4—6 2—2.5

160-Pin QFP 4 1.5 180 1.5 1.5 1 10—13 6—8

175-Pin PPGA 3 1 150 1 1 0.3 5—11 1—1.5

208-Pin SQFP 4 2 200 1 1 1 7—10 4—6

5-3862(C)

PAD N LWRWCIRCUIT

BOARD PAD

LWRWLL

LMW

C2C1

LML

PAD N + 1

Data Sheet

February 1997 ATT3000 Series Field-Programmable Gate Arrays

Lucent Technologies Inc. 53

Absolute Maximum Ratings

Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are abso-

lute stress ratings only. Functional operation of the device is not implied at these or any other conditions in excess

of those given in the operational sections of the data sheet. Exposure to absolute maximum ratings for extended

periods can adversely affect device reliability.

Parameter Symbol Min Max Unit

Supply Voltage Relative to GND VCC –0.5 7.0 V

Input Voltage Relative to GND VIN –0.5 0.5 V

Voltage Applied to 3-state Output VTS –0.5 0.5 V

Storage Temperature (ambient) Tstg –65 150 °C

Maximum Soldering Temperature

(10 seconds at 1/16 in.) TSOL — 260 °C

Junction Temperature TJ—125 °C

Data Sheet

ATT3000 Series Field-Programmable Gate Arrays February 1997

54 Lucent Technologies Inc.

Electrical Characteristics

* Sample tested.

Note: With no output current loads, no active input or long-line pull-up resistors, all package pins at VCC or GND, and the FPGA conﬁgured

with a bit stream generation program tie option.

Table 19. dc Electrical Characteristics Over Operating Conditions

Commercial: VCC = 5.0 V ± 5%; 0 °C ≤ TA ≤ 70 °C; Industrial: VCC = 5.0 ± 10%, –40 °C ≤ TA ≤ +85 °C.

Parameter/Conditions Symbol -50, -70, -100, and -125 -3, -4, and -5 Unit

Min Max Min Max

High-level Input Voltage

CMOS Level

TTL Level VIHC

VIHT 70%

2.0 100%

VCC 70%

2.0 100%

VCC V

Low-level Input Voltage

CMOS Level

TTL Level VILC

VILT 0

020%

0.8 0

020%

0.8 V

Output Voltage

High

(IOH = –4 mA)

(IOH = –8 mA)

Low

(IOL = 4 mA)

(IOL = 8 mA)

VOH

VOL

3.86

—

0.40

—

3.86

—

0.40

Input Signal Transition Time TIN — 250 — 250 ns

Powerdown Supply Current

ATT3020

ATT3030

ATT3042

ATT3064

ATT3090

ICCPD —

—

120

170

250

—

120

170

250

µA

Quiescent FPGA Supply Current

(in addition to ICCPD)

CMOS Inputs

ATT3020

ATT3030

ATT3042

ATT3064

ATT3090

TTL Inputs

ICCO

—

500

—

500

µA

Leakage Current IIL –10 10 –10 10 µA

Input Capacitance*

All Packages Except 175-PGA:

All Pins Except XTL1/XTL2

XTL1 and XTL2

175-PGA Package:

All Pins Except XTL1/XTL2

XTL1 and XTL2

CIN

—

Pad Pull-up* (when selected)

(at VIN = 0 V) IRIN 0.02 0.17 0.02 0.17 mA

Horizontal Long-line Pull-up (when

selected) at Logic LOW IRLL 0.2 2.5 0.2 2.8 mA

Data Sheet

February 1997 ATT3000 Series Field-Programmable Gate Arrays

Lucent Technologies Inc. 55

Electrical Characteristics (continued)

* These parameters are for clock pulses within an FPGA device. For externally applied clock, increase values by 20%.

Note: The CLB K to Q output delay (TCKO—#8) of any CLB, plus the shortest possible interconnect delay, is always longer than the data in

hold time requirement (TCKDI—#5) of any CLB on the same die.

Table 20. CLB Switching Characteristics (-50, -70, -100, and -125)

Commercial: VCC = 5.0 V ± 5%; 0 °C ≤ TA ≤ 70 °C; Industrial: VCC = 5.0 ± 10%, –40 °C ≤ TA ≤ +85 °C.

Description Symbol -50 -70 -100 -125 Unit

Min Max Min Max Min Max Min Max

Combinatorial Delay 1 TILO — 14.0 — 9.0 — 7.0 — 5.5 ns

Sequential Delay

Clock K to Outputs x or y

Clock K to Outputs x or y when Q

Returned Through Function

Generators F or G to Drives x or y

—TCKO

TQLO —

—12.0

23.0 —

—6.0

13.0 —

—5.0

10.0 —

—4.5

8.0 ns

Setup Time

Logic Variables

Data In

Enable Clock

Reset Direct Active

—

TICK

TDICK

TECCK

TRDCK

12.0

8.0

10.0

1.0

—

8.0

5.0

7.0

1.0

—

7.0

4.0

5.0

1.0

—

5.5

3.0

4.5

1.0

—

Hold Time

Logic Variables

Data In

Enable Clock

TCKI

TCKDI

TCKEC

1.0

6.0

—

4.0

—

2.0

—

1.5

—

Clock

High Time*

Low Time*

Flip-Flop Toggle Rate*

—

TCH

TCL

FCLK

9.0

—

5.0

—

4.0

100

—

3.0

125

—

MHz

Reset Direct (rd)

rd Width

Delay from rd to Outputs x, y 13

9TRPW

TRIO 12.0

——

12.0 8.0

——

8.0 7.0

——

7.0 6.0

——

6.0 ns

Master Reset (MR)

MR Width

Delay from MR to Outputs x, y —

—TMRW

TMRQ 30

——

27 25

——

23 21

——

19 20

——

17 ns

Data Sheet

ATT3000 Series Field-Programmable Gate Arrays February 1997

56 Lucent Technologies Inc.

Electrical Characteristics (continued)

* These parameters are for clock pulses within an FPGA device. For externally applied clock, increase values by 20%.

Note: The CLB K to Q output delay (TCKO—#8) of any CLB, plus the shortest possible interconnect delay, is always longer than the data in

hold time requirement (TCKDI—#5) of any CLB on the same die.

Table 21. CLB Switching Characteristics (-3, -4, and -5)

Commercial: VCC = 5.0 V ± 5%; 0 °C ≤ TA ≤ 70 °C; Industrial: VCC = 5.0 ± 10%, –40 °C ≤ TA ≤ +85 °C.

Description Symbol -5 -4 -3 Unit

Min Max Min Max Min Max

Combinatorial Delay 1 TILO — 4.1 — 3.3 — 2.7 ns

Sequential Delay

Clock K to Outputs x or y

Clock K to Outputs x or y when Q Returned

Through Function Generators F or G to

Drives x or y

—TCKO

TQLO —

—3.1

6.3 —

—2.5

5.2 —

—2.1

4.3 ns

Setup Time

Logic Variables

Data In

Enable Clock

Reset Direct Active

—

TICK

TDICK

TECCK

TRDCK

3.1

2.0

3.8

1.0

—

2.5

1.6

3.2

1.0

—

2.1

1.4

2.7

1.0

—

Hold Time

Logic Variables

Data In

Enable Clock

TCKI

TCKDI

TCKEC

1.2

1.0

—

1.0

0.8

—

0.9

0.7

—

Clock

High Time*

Low Time*

Flip-Flop Toggle Rate*

—

TCH

TCL

FCLK

2.4

190

—

2.0

230

—

1.6

270

—

MHz

Reset Direct (rd)

rd Width

Delay from rd to Outputs x, y 13

9TRPW

TRIO 3.8

——

4.4 3.2

——

3.7 2.7

——

3.1 ns

Master Reset (MR)

MR Width

Delay from MR to Outputs x, y —

—TMRW

TMRQ 18.0

——

17.0 15.0

——

14.0 13.0

——

12.0 ns

Data Sheet

February 1997 ATT3000 Series Field-Programmable Gate Arrays

Lucent Technologies Inc. 57

Electrical Characteristics (continued)

Figure 33. CLB Switching Characteristics

CLB OUTPUT (X,Y)

CLB INPUT

CLB CLOCK

CLB INPUT

CLB OUTPUT

TILO

CLB INPUT

(COMBINATORIAL)

(A, B, C, D, E)

(DIRECT IN)

(ENABLE CLOCK)

(FLIP-FLOP)

(RESET DIRECT)

CLB OUTPUT

(FLIP-FLOP)

TICK TCKI

TCL TDICK TCH

TCKDI

TECCK TCKEC

TCKO

TRPW

TRIO

5-3124(F)

Data Sheet

ATT3000 Series Field-Programmable Gate Arrays February 1997

58 Lucent Technologies Inc.

Electrical Characteristics (continued)

* These parameters are for clock pulses within an FPGA device. For externally applied clock, increase values by 20%.

Notes:

Timing is measured at pin threshold with 50 pF external capacitive loads (including test ﬁxture).

Typical fast mode output rise/fall times are 2 ns and will increase approximately 2%/pF of additional load.

Typical slew-rate limited output rise/fall times are approximately 4 times longer.

A maximum total external capacitive load for simultaneous fast mode switching in the same direction is 200 pF per power/ground pin pair. For

slew-rate limited outputs, this total is 4 times larger. Exceeding this maximum capacitive load can result in ground bounce of >1.5 V amplitude

and <5 ns duration, which may cause problems when the FPGA drives clocks and other asynchronous signals.

Voltage levels of unused (bonded and unbonded) pads must be valid logic levels. Each can be conﬁgured with the internal pull-up resistor or

alternatively conﬁgured as a driven output or driven from an external source.

Input pad setup time is speciﬁed with respect to the internal clock (ik).

To calculate system setup time, subtract clock delay (pad to ik) from the input pad setup time value. Input pad hold time with respect to the inter-

nal clock (ik) is negative. This means that pad levels changed immediately before the internal clock edge (ik) will not be recognized.

Table 22. IOB Switching Characteristics (-50, -70, -100, and -125)

Commercial: VCC = 5.0 V ± 5%; 0 °C ≤ TA ≤ 70 °C; Industrial: VCC = 5.0 ± 10%, –40 °C ≤ TA ≤ +85 °C.

Description Symbol -50 -70 -100 -125 Unit

Min Max Min Max Min Max Min Max

Input Delays

Pad to Direct In

Pad to Registered In

Clock to Registered In

—

TPID

TPTG

TIKRI

—

9.0

34.0

11.0

—

6.0

21.0

5.5

—

4.0

17.0

4.0

—

3.0

16.0

3.0

Setup Time (Input):

Clock Setup Time 1 TPICK 30.0 — 20.0 — 17.0 — 16.0 — ns

Output Delays

Clock to Pad

Fast

Slew-rate Limited

Output to Pad

Fast

Slew-rate Limited

3-state to Pad Hi-Z

Fast

Slew-rate Limited

3-state to Pad Valid

Fast

Slew-rate Limited

TOKPO

TOPF

TOPS

TTSHZ

TTSON

—

18.0

43.0

15.0

40.0

10.0

37.0

20.0

45.0

—

13.0

33.0

9.0

29.0

8.0

28.0

14.0

34.0

—

10.0

27.0

6.0

23.0

8.0

25.0

12.0

29.0

—

9.0

24.0

5.0

20.0

7.0

24.0

11.0

27.0

Setup and Hold Times (out-

put)

Clock Setup Time

Clock Hold Time 5

6TOCK

TOKO 15.0

0—

—10.0

0—

—9.0

0—

—8.0

0—

—ns

Clock

High Time*

Low Time*

Max. Flip-Flop Toggle*

—

TCH

TCL

FCLK

9.0

—

5.0

—

4.0

—

100

3.0

—

125

MHz

Master Reset Delays

RESET to:

Registered In

Output Pad (fast)

Output Pad (slew-

rate limited)

TRRI

TRPO

—

Data Sheet

February 1997 ATT3000 Series Field-Programmable Gate Arrays

Lucent Technologies Inc. 59