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DFM400PXM33-A000
FEATURES
■Low Reverse Recovery Charge
■High Switching Speed
■Low Forward Voltage Drop
■Isolated Base
■MMC Baseplate With AlN Substrates
APPLICATIONS
■Free-wheel Circuits
■Motor Drives
■Resonant Converters
■Multi-level Switch Inverters
The DFM400PXM33-A000 is a series pair 3300 volt,
fast recovery diode (FRD) module. Designed for low power
loss, the module is suitable for a variety of high voltage
applications in motor drives and power conversion.
Fast switching times and low reverse recovery losses
make the device suitable for the latest drive designs
employing pwm and high frequency switching.
These module incorporates an electrically isolated
base plate and low inductance construction enabling
circuit designers to optimise circuit layouts and utilise
grounded heat sinks for safety.
ORDERING INFORMATION
Order As:
DFM400PXM33-A000
Note: When ordering, please use the complete part number.
DFM400PXM33-A000
Fast Recovery Diode Module
Target Information
DS5488-1.3 November 2002
KEY PARAMETERS
VRRM 3300V
VF(typ) 2.5V
IF(max) 400A
IFM (max) 800A
Fig. 1 Circuit diagram
Fig. 2 Electrical connections - (not to scale)
Outline type code: P
(See package details for further information)
1(A2/K1)
2(K2) 3(A1)
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Units
V
A
A
A2s
kW
kV
pC
ABSOLUTE MAXIMUM RATINGS
Stresses above those listed under 'Absolute Maximum Ratings' may cause permanent damage to the device. In extreme
conditions, as with all semiconductors, this may include potentially hazardous rupture of the package. Appropriate safety
precautions should always be followed. Exposure to Absolute Maximum Ratings may affect device reliability.
Tcase = 25˚C unless stated otherwise
Symbol
VRRM
IF
IFM
I2t
Pmax
Visol
Qpd
Test Conditions
Tvj = 125˚C
DC, Tcase = 70˚C
Tcase = 115˚C, tp = 1ms
VR = 0, tp = 10ms, Tvj = 125˚C
Tcase = 25˚C, Tvj = 125˚C
Commoned terminals to base plate. AC RMS, 1 min, 50Hz
IEC1287. V1 = 2400V, V2 = 1800V, 50Hz RMS
Max.
3300
400
800
80
1.85
6
10
Parameter
Repetitive peak reverse voltage
Forward current (per arm)
Max. forward current
I2t value fuse current rating
Maximum power dissipation
Isolation voltage
Partial discharge
Test Conditions
Continuous dissipation -
junction to case
Mounting torque 5Nm
(with mounting grease)
-
-
Mounting - M6
Electrical connections - M8
Parameter
Thermal resistance - diode (per arm)
Thermal resistance - case to heatsink
(per module)
Junction temperature
Storage temperature range
Screw torque
THERMAL AND MECHANICAL RATINGS
Symbol
Rth(j-c)
Rth(c-h)
Tj
Tstg
-
Units
˚C/kW
˚C/kW
˚C
˚C
Nm
Nm
Max.
54
16
125
125
5
10
Typ.
-
-
-
-
-
-
Min.
-
-
–40
-
-
-
Internal insulation: AlN
Baseplate material: AlSiC
Creepage distance: 20mm
Clearance: 10mm
CTI (Critical Tracking Index): 175
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DFM400PXM33-A000
Test Conditions
VR = 3300V, Tvj = 125˚C
IF = 400A
IF = 400A, Tvj = 125˚C
-
Parameter
Peak reverse current
Forward voltage
Inductance
STATIC ELECTRICAL CHARACTERISTICS
Tvj = 25˚C unless stated otherwise.
Symbol
IRM
VF
L
Units
mA
V
V
nH
Max.
30
-
-
-
Typ.
-
2.5
2.5
25
Min.
-
-
-
-
Test Conditions
IF = 400A,
dIF/dt = 2800A/µs,
VR = 1800V
Parameter
Peak reverse recovery current
Reverse recovery charge
Reverse recovery energy
Symbol
Irr
Qrr
Erec
Units
A
µC
mJ
Max.
-
-
-
Typ.
400
280
300
Min.
-
-
-
DYNAMIC ELECTRICAL CHARACTERISTICS
Tvj = 25˚C unless stated otherwise.
Tvj = 125˚C unless stated otherwise.
Test Conditions
IF = 400A,
dIF/dt = 2000A/µs,
VR = 1800V
Parameter
Peak reverse recovery current
Reverse recovery charge
Reverse recovery energy
Symbol
Irr
Qrr
Erec
Units
A
µC
mJ
Max.
-
-
-
Typ.
430
450
550
Min.
-
-
-
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TYPICAL CHARACTERISTICS
Fig. 2 Diode typical forward characteristics Fig. 4 Transient thermal impedance
Fig. 5 Power dissipation Fig. 6DC current rating vs case temperature
0
100
200
300
400
500
600
700
800
0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0
Forward voltage, VF - (V)
Forward current, IF - (A)
Tj = 25˚C
Tj = 125˚C
200
400
600
800
1000
1200
1400
1600
1800
2000
0 25 50 75 100 125 150
Case temperature, Tcase - (°C)
Power Dissipation - Ptot (W)
0
100
200
300
400
500
600
700
0 25 50 75 100 125 150
Case temperature, Tcase - (°C)
DC forward current, I
F
- (A)
1
10
100
0.001 0.01 10.1 10
Pulse width, t
p
- (s)
Transient thermal impedance, Z
th (j-c)
- (°C/kW )
R
i (˚C/KW)
τi (ms)
1
1.4773
0.0843
2
7.823
3.7205
3
11.1257
33.2138
4
33.6616
236.5275
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DFM400PXM33-A000
Fig. 7 RBSOA
0
200
100
400
600
300
500
700
0 500 1000 1500 2000 2500 3000 3500
Reverse voltage, V
R
- (V)
Reverse recovery current, I
rr
- (A)
T
j
= 125˚C
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PACKAGE DETAILS
For further package information, please contact your local Customer Service Centre. All dimensions in mm, unless stated otherwise.
DO NOT SCALE.
www.dynexsemi.com
POWER ASSEMBLY CAPABILITY
The Power Assembly group was set up to provide a support service for those customers requiring more than the basic
semiconductor, and has developed a flexible range of heatsink and clamping systems in line with advances in device voltages
and current capability of our semiconductors.
We offer an extensive range of air and liquid cooled assemblies covering the full range of circuit designs in general use today.
The Assembly group offers high quality engineering support dedicated to designing new units to satisfy the growing needs of
our customers.
Using the latest CAD methods our team of design and applications engineers aim to provide the Power Assembly Complete
Solution (PACs).
HEATSINKS
The Power Assembly group has its own proprietary range of extruded aluminium heatsinks which have been designed to
optimise the performance of Dynex semiconductors. Data with respect to air natural, forced air and liquid cooling (with flow
rates) is available on request.
For further information on device clamps, heatsinks and assemblies, please contact your nearest sales representative or
Customer Services.
CUSTOMER SERVICE
Tel: +44 (0)1522 502753 / 502901. Fax: +44 (0)1522 500020
SALES OFFICES
Benelux, Italy & Switzerland: Tel: +33 (0)1 64 66 42 17. Fax: +33 (0)1 64 66 42 19.
France: Tel: +33 (0)2 47 55 75 52. Fax: +33 (0)2 47 55 75 59.
Germany, Northern Europe, Spain & Rest Of World: Tel: +44 (0)1522 502753 / 502901.
Fax: +44 (0)1522 500020
North America: Tel: (949) 733-3005. Fax: (949) 733-2986.
These offices are supported by Representatives and Distributors in many countries world-wide.
© Dynex Semiconductor 2002 TECHNICAL DOCUMENTATION – NOT FOR RESALE. PRODUCED IN
UNITED KINGDOM
HEADQUARTERS OPERATIONS
DYNEX SEMICONDUCTOR LTD
Doddington Road, Lincoln.
Lincolnshire. LN6 3LF. United Kingdom.
Tel: +44-(0)1522-500500
Fax: +44-(0)1522-500550
This publication is issued to provide information only which (unless agreed by the Company in writing) may not be used, applied or reproduced for any purpose nor form part of any order or contract nor to be regarded
as a representation relating to the products or services concerned. No warranty or guarantee express or implied is made regarding the capability, performance or suitability of any product or service. The Company
reserves the right to alter without prior notice the specification, design or price of any product or service. Information concerning possible methods of use is provided as a guide only and does not constitute any guarantee
that such methods of use will be satisfactory in a specific piece of equipment. It is the user's responsibility to fully determine the performance and suitability of any equipment using such information and to ensure
that any publication or data used is up to date and has not been superseded. These products are not suitable for use in any medical products whose failure to perform may result in significant injury
or death to the user. All products and materials are sold and services provided subject to the Company's conditions of sale, which are available on request.
All brand names and product names used in this publication are trademarks, registered trademarks or trade names of their respective owners.
http://www.dynexsemi.com
e-mail: power_solutions@dynexsemi.com
Datasheet Annotations:
Dynex Semiconductor annotate datasheets in the top right hard corner of the front page, to indicate product status. The annotations are as follows:-
Target Information: This is the most tentative form of information and represents a very preliminary specification. No actual design work on the product has been started.
Preliminary Information: The product is in design and development. The datasheet represents the product as it is understood but details may change.
Advance Information: The product design is complete and final characterisation for volume production is well in hand.
No Annotation: The product parameters are fixed and the product is available to datasheet specification.
