ASMB-BTE1-0B332
High Brightness PLCC4 Tricolor LED
Data Sheet
CAUTION: LEDs are ESD-sensitive. Please observe appropriate precautions during han-
dling and processing. Refer to Avago Application Note AN-1142 for additional details.
Description
This family of SMT LEDs packaged in the form of PLCC-4
with common Anode pin.
The full black plastic housing with white inner reector
provides good contrast without compromising bright-
ness. A typical viewing angle of 110° together with the
built-in reector drives up the intensity of light output,
making these LEDs suitable for use in interior electronics
signs.
These LEDs are compatible with reow soldering process.
For easy pick and place, every reel is shipped from a single
intensity and color bin; except red color for better unifor-
mity.
Features
• PLCC-4 package (Plastic Leaded Chip Carrier) with
common pin conguration
• LED package with diused silicone encapsulation
• High brightness using AlInGaP and InGaN dice
technologies
• Typical viewing angle at 110°
• Compatible with reow soldering process
• Good contrast with black body and diused
encapsulation
• JEDEC MSL 3
Applications
• Indoor full color display
2
Package Dimensions
1.10
0.85
1.90
0.80
3.50
4
3
2
1
Package
Marking
3.20
2.80
0.8
2.20
∅ 2.40
4
1
32
Notes:
1. All Dimensions are in millimeters
2. Tolerance ± 0.2 mm unless specied.
3. Terminal Finish: Ag plating
Lead Conguration
1 Cathode Blue
2 Common Anode
3 Cathode Red
4 Cathode Green
2.20
0.80 0.60
3
Part Numbering System
Green Color Bin Table
Bin
ID
Min
Dom
Max
Dom Chromaticity Coordinate
A 525.0 531.0 x 0.1142 0.1624 0.2001 0.1625
y 0.8262 0.7178 0.6983 0.8012
B 528.0 534.0 x 0.1387 0.1815 0.2179 0.1854
y 0.8148 0.7089 0.6870 0.7867
D 531.0 537.0 x 0.1625 0.2001 0.2238 0.1929
y 0.8012 0.6983 0.6830 0.7816
Tolerance of each bin limit is ± 1 nm
Blue Color Bin Table
Bin
ID
Min
Dom
Max
Dom Chromaticity Coordinate
A 465.0 469.0 x 0.1355 0.1751 0.168 0.127
y 0.0399 0.0986 0.1094 0.053
B 467.0 471.0 x 0.1314 0.1718 0.1638 0.122
y 0.0459 0.1034 0.1167 0.063
C 469.0 473.0 x 0.1267 0.168 0.1593 0.116
y 0.0534 0.1094 0.1255 0.074
Tolerance of each bin limit is ± 1 nm
Intensity Bin Limits
Bin ID Min (mcd) Max (mcd)
T1 285.0 355.0
T2 355.0 450.0
U1 450.0 560.0
U2 560.0 715.0
V1 715.0 900.0
V2 900.0 1125.0
W1 1125.0 1400.0
W2 1400.0 1800.0
X1 1800.0 2240.0
Tolerance of each bin limit ± 12%
Color Bin Limits
Red Color Bin Table
Bin
ID
Dominant
Wavelength
Chromaticity CoordinateMin Max
Full
range
617.0 628.0 x 0.6850 0.6674 0.6866 0.7052
y 0.3149 0.3158 0.2967 0.2948
Tolerance of each bin limit is ± 1 nm
Table 1. Device Selection Guide
Parameter Option Code
ASMB-BTE1-0B332
Red Green Blue
Intensity Bin X2X3 = B3 U1, U2, V1 W1, W2, X1 T1, T 2, U1
Color Bin X4 = 3 Full Range A,B,D A,B,C
Packaging Option X5 = 2 Test Current: 20 mA
Packaging Option
2: 20 mA testing current
Color Bin Selection
3: 3 color bins for Green and Blue: Green (A,B,D), Blue (A,B,C)
Number of intensity bin
3: 3 half-intensity bins
Minimum Intensity Bin
B: Red U1 / Green W1/ Blue T1
Package Type
E: Full black body with inner white reector
Color
T: Tricolor
Product Family
B: Black Belle Tricolor PLCC
A S M B - B T E 1 - 0 X2 X3 X4 X5
4
Table 2. Absolute Maximum Ratings (TA = 25 °C)
Parameter Red Green & Blue Unit
DC forward current [1] 30 25 mA
Peak forward current [2] 100 100 mA
Power dissipation 78 90 mW
Reverse Voltage Not recommended for reverse bias
Maximum junction temperature Tj max 110 °C
Operating board temperature, TA range - 40 to + 100 [3] °C
Storage temperature range - 40 to + 100 °C
Notes:
1. Derate linearly as shown in Figure 4a and Figure 4b.
2. Duty Factor = 10% Frequency = 1 kHz.
3. For more information, see Figure 4a and Figure 4b.
Table 3. Optical Characteristics (TA = 25 °C)
Color
Luminous Intensity,
Iv, mcd [1]
Dominant Wavelength,
ld (nm) [2]
Peak Wavelength,
lp (nm)
Viewing Angle
2q½ (°) [3] Test
Current
(mA)Min Typ Max. Min Typ Max Typ. Typ
Red 450 630 900 617 622 628 629 110 20
Green 1125 1500 2240 525 529 535 521 110 20
Blue 285 350 560 465 469 473 464 110 20
Notes:
1. The luminous intensity Iv is measured at the mechanical axis of LED package and it is tested in pulsing condition. The actual peak of the spatial
radiation pattern may not be aligned with the axis.
2. The dominant wavelength is derived from the CIE Chromaticity Diagram and represents the perceived color of the device.
3. q½ is the o-axis angle where the luminous intensity is ½ the peak intensity
Table 4. Electrical Characteristics (TA = 25 °C)
Color
Forward Voltage,
VF (V) [1]
Reverse Voltage
VR @ 100 mA [2]
Reverse Voltage
VR @ 10 mA [2]
Thermal Resistance RqJ-P (°C/W) [3]
Single chip on 3 chips on
Min. Typ. Max. Min. Min. Typ. Typ.
Red 1.8 2.1 2.6 4 - 609 653
Green 2.8 3.1 3.6 - 4 320 430
Blue 2.8 3.1 3.6 - 4 320 430
Notes:
1. Tolerance ± 0.1 V.
2. Indicates product nal testing condition. Long-term reverse bias is not recommended.
5
Figure 1. Relative Intensity vs. Wavelength Figure 2. Forward Current vs. Forward Voltage
Figure 3. Relative Intensity vs. Forward Current
Figure 4a. Maximum forward current vs. ambient temperature (3 chips) Figure 4b. Maximum forward current vs. ambient temperature (single chip)
0.0
0.2
0.4
0.6
0.8
1.0
400 450 500 550 600 650 700
NORMALIZED INTENSITY
WAVELENGTH (nm)
Blue
Green Red
0
20
40
60
80
100
0 1 2 3 4 5
FORWARD CURRENT (mA)
FORWARD VOLTAGE (V)
RED
GREEN/BLUE
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
0 5 10 15 20 25 30
NORMALIZED INTENSITY
FORWARD CURRENT (mA)
Red
Green
Blue
0
10
20
30
40
0 20 40 60 80 100
MAXIMUM FORWARD CURRENT (mA)
AMBIENT TEMPERATURE (°C)
AlInGaP
InGaN
0
10
20
30
40
0 20 40 60 80 100
AlInGaP
InGaN
AMBIENT TEMPERATURE (°C)
MAXIMUM FORWARD CURRENT (mA)
6
Figure 5a. Radiation Pattern for x-axis Figure 5b. Radiation Pattern for y-axis
Figure 5c. Component Axis for Radiation Patterns
Figure 6. Relative Intensity vs. Junction Temperature Figure 7. Forward Voltage vs. Junction Temperature
Y
Y
X
X
0.0
0.2
0.4
0.6
0.8
1.0
-90 -60 -30 0 30 60 90
NORMALIZED INTENSITY
ANGULAR DISPLACEMENT (°)
Red Green Blue
0.0
0.2
0.4
0.6
0.8
1.0
-90 -60 -30 0 30 60 90
NORMALIZED INTENSITY
ANGULAR DISPLACEMENT (°)
Red Green Blue
0.1
1
10
-40 -20 0 20 40 60 80 100 120
NORMALZIED INTENSITY (PHOTO)
TJ - JUNCTION TEMPERATURE
Blue
Green
Red
-0.3
-0.2
-0.1
0
0.1
0.2
0.3
0.4
0.5
-40 -20 0 20 40 60 80 100 120
FORWARD VOLTAGE SHIFT (V)
TJ - JUNCTION TEMPERATURE
Blue
Green
Red
7
Figure 8a. Recommended soldering land pattern
Figure 8b. LED conguration on land pattern Figure 9. Recommended Pick and Place Nozzle Tip
ID
OD
ID = 1.7mm
OD = 3.5mm
3.30
0.50
3.30
7.50
0.40
2.60
1.10
4.50
1.50
SOLDER RESIST
SOLDER MASK
REFLOW
SOLDERING DIRECTION
Figure 10. Recommended leaded reow soldering prole Figure 11. Recommended Pb-free reow soldering prole
240°C MAX.
20 SEC. MAX.
3°C/SEC.
MAX.
120 SEC. MAX.
TIME
TEMPERATURE
183°C
100-150°C
-6°C/SEC.
MAX.
60-150 SEC.
3°C/SEC. MAX. 217 °C
200 °C
60 - 120 SEC.
6 °C/SEC. MAX.
3 °C/SEC. MAX.
3 °C/SEC. MAX.
150 °C
255 - 260 °C
100 SEC. MAX.
10 to 30 SEC.
TIME
TEMPERATURE
8
Figure 13. Reel Dimension
Figure 14. Reel Orientation
CATHODE SIDE
PRINTED LABEL
USER FEED DIRECTION
14.4 (MAX. MEASURED AT HUB)
7.9 (MIN.)
10.9 (MAX.)
62.5
2+0.5
–0
∅20.5 ± 0.3
∅13 ± 0.2
+0
–2.5
8.4 +1.50
–0.00
180
LABEL AREA (111 mm x 57 mm)
WITH DEPRESSION (0.25 mm)
(MEASURED AT OUTER EDGE)
Figure 12. Carrier tape Dimension
C
A
4 ± 0.2 4 ± 0.2 2 ± 0.2
3.05 ± 0.20
3.5 ± 0.20
8+0.3
–0.1
1.75 ± 0.20
3.81 ± 0.20
2.29 ± 0.2
0.229 ± 0.1
∅1.5 +0.1
–0
∅1+0.1
–0
9
Packaging Label:
(i) Avago Mother Label (Available on MBB bags)
(1P) Item: Part Number
(1T) Lot: Lot Number
LPN:
(9D) MFG Date: Manufacturing Date
(P) Customer Item:
(V) Vendor ID:
DeptID: Made In: Country of Origin
(Q) QTY: Quantity
CAT: Intensity Bin
BIN: Color Bin
(9D) Date Code: Date Code
STANDARD LABEL LS0002
RoHS Compliant Halogen Free
e4 Max Temp 260C MSL3
(1P) PART #: Part Number
(1T) LOT #: Lot Number
(9D)MFG DATE: Manufacturing Date
C/O: Country of Origin
(1T) TAPE DATE:
Date Code VF:
INTENSITY BIN
COLOR BIN
BABY LABEL COSB 001B
QUANTITY:
D/C:
CAT:
BIN:
(9D): DATE CODE:
Packing Quantity
(1P) Item: Part Number
(1T) Lot: Lot Number
LPN:
(9D) MFG Date: Manufacturing Date
(P) Customer Item:
(V) Vendor ID:
DeptID: Made In: Country of Origin
(Q) QTY: Quantity
CAT: Intensity Bin
BIN: Color Bin
(9D) Date Code: Date Code
STANDARD LABEL LS0002
RoHS Compliant Halogen Free
e4 Max Temp 260C MSL3
(1P) PART #: Part Number
(1T) LOT #: Lot Number
(9D)MFG DATE: Manufacturing Date
C/O: Country of Origin
(1T) TAPE DATE:
Date Code VF:
INTENSITY BIN
COLOR BIN
BABY LABEL COSB 001B
QUANTITY:
D/C:
CAT:
BIN:
(9D): DATE CODE:
Packing Quantity
(ii) Avago Baby Label (Available on reel)
Example indicates luminous Intensity information for
Red, Green and Blue, respectively from label:
Example indicates color bin information for Green and
Blue from label:
BIN: A B
Color Bin for Blue
Color Bin for Green
CAT: U1 T1
Intensity for Blue
Intensity for Green
Intensity for Red
W1 BIN: A B
Color Bin for Blue
Color Bin for Green
CAT: U1 T1
Intensity for Blue
Intensity for Green
Intensity for Red
W1
Note:
There will be no red color bin information appearing on label; this is
because it is not binned and supported with full distribution range.
For product information and a complete list of distributors, please go to our web site: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2013 Avago Technologies. All rights reserved.
AV02-4236EN - July 25, 2013
Handling Precaution
The encapsulation material of the LED is made of silicone
for better product reliability. As silicone is a soft material,
avoid pressing on the silicon or poking the silicon with a
sharp object as the product could be damaged and cause
premature failure. During assembly handling, the unit
should be held by the body only. Please refer to Avago
Application Note AN 5288 for additional handling infor-
mation and proper procedures.
Moisture Sensitivity
This product has a Moisture Sensitive Level 3 rating
per JEDEC J-STD-020. Refer to Avago Application Note
AN5305, Handling of Moisture Sensitive Surface Mount
Devices, for additional details and a review of proper han-
dling procedures.
A. Storage before use
- An Unopened moisture barrier bag (MBB) can be
stored at < 40 °C/90% RH for 12 months. If the actual
shelf life has exceeded 12 months and the Humidity
Indicator Card (HIC) indicates that baking is not
required, then it is safe to reow the LEDs per the
original MSL rating.
- It is recommended that the MBB is not opened
before assembly (e.g., for IQC).
B. Control after opening the MBB
- The humidity indicator card (HIC) shall be read
immediately upon opening of the MBB.
- The LEDs must be kept at < 30 °C/60% RH at all
times and all high temperature related processes
including soldering, curing or rework need to be
completed within 168 hours.
C. Control for unnished reel
- Unused LEDs must be stored in a sealed MBB with
desiccant or desiccator at < 5% RH.
D. Control of assembled boards
- If the PCB soldered with the LEDs is to be subjected
to other high temperature processes, the PCB
must be stored in a sealed MBB with desiccant or
desiccator at < 5% RH to ensure that all LEDs have
not exceeded their oor life of 168 hours.
E. Baking is required if:
- The HIC indicator is not BROWN at 10% and is AZURE
at 5%.
- The LEDs are exposed to condition of >30 °C/60%
RH at any time.
- The LED oor life exceeded 168 hrs. The
recommended baking condition is 60 ± 5 ºC for 20
hrs.
DISCLAIMER: Avago’s products and software are not specically designed, manufactured or authorized for sale
as parts, components or assemblies for the planning, construction, maintenenace or direct operation of a
nuclear facility or for use in medical devices or applications. Customer is solely responsible, and waives all rights to
make claims against avago or its suppliers, for all loss, damage, expense or liability in connection with such use.
