12-Channel, 10-Bit Programmable Gamma
and VCOM Reference Voltages
MAX9679
19-5756; Rev 2; 5/13
Simplified Block Diagram
General Description
The MAX9679 provides multiple programmable
reference voltages for gamma correction in TFT LCDs
and a programmable reference voltage for VCOM
adjustment. All gamma and VCOM reference voltages
have a 10-bit digital-to-analog converter (DAC) and high-
current buffer, which reduces the recovery time of the
output voltages when critical levels and patterns are
displayed. A programmable internal reference sets the
full-scale voltage of the DACs.
Two independent sets of gamma curves and VCOM
codes can be stored in the IC's volatile memory; BKSEL
signal selects between the two sets.
The IC has multiple-time programmable (MTP) memory
to store gamma and VCOM codes on the chip, eliminat-
ing the need for external EEPROM.
Applications
TFT LCDs
Features
S 12 Channels of Programmable Gamma Voltages
with 10-Bit Resolution
S Programmable VCOM Voltage with 10-Bit
Resolution
S Programmable Reference for DACs
S Multiple-Time Programmable Memory to Store
Gamma and VCOM Codes
S Switching Between Two Gamma Curves and
VCOM Voltages
S AVDD1, AVDD2, and AVDD_AMP Supplies to
Reduce Heat
S I2C Interface (1MHz Fast-Mode Plus)
+Denotes a lead(Pb)-free/RoHS-compliant package.
*EP = Exposed pad.
Ordering Information
I2C
BKSEL
GAMMA
OUTPUTS
VCOM
OUTPUT
MAX9679
PROG
REF
PROG
REF
VCOM1
VCOM2
GAMMA
BANK 1
GAMMA
BANK 2
VCOM1
GAMMA
BANK 1
PROG
REF
PROG
REF
VCOM1
VCOM2
GAMMA
BANK 1
2:1
MUX
2:1
MUX DAC
GAMMA
BANK 2
MTP
REG
I2C
REG
CONTROL
DAC
REG
VCOM
AMPLIFIER
12 DACs 12 GAMMA
BUFFERS
12
PART TEMP RANGE PIN-PACKAGE
MAX9679ETG+ -40NC to +85NC24 TQFN-EP*
For pricing, delivery, and ordering information, please contact Maxim Direct
at 1-888-629-4642, or visit Maxim’s website at www.maximintegrated.com.
2 Maxim Integrated
12-Channel, 10-Bit Programmable Gamma
and VCOM Reference Voltages
MAX9679
Functional Diagram
MTP
MEMORY
PROG
REF
I
2
C
INTERFACE
VCOM1
I
2
C
REG
PROG
REF
VCOM1
VCOM2
DAC
REG
PROG
REF
GAMMA
BANK 1
GAMMA
BANK 1
GAMMA
BANK 1
VCOM1
VCOM2
GAMMA
BANK 2
GAMMA
BANK 2
SDA
SCL
DVDD
A0 12 GAMMA, 1 VCOM
MAX9679
BKSEL
10
10
DAC
AGND
10
DAC
10
DAC
10
DAC
10
DAC
10
DAC
2:1
MUX
2:1
MUX
10
DAC
AGND
10
DAC
10
DAC
10
DAC
10
DAC
10
DAC
10
DAC
PROG
REF
V
PREF
AVDD1
AVDD2
GMA1
GMA2
GMA3
GMA4
GMA5
GMA6
GMA7
GMA8
GMA9
GMA10
GMA11
GMA12
AVDD_AMP
VCOM
VCOM_FB
AGND
3Maxim Integrated
12-Channel, 10-Bit Programmable Gamma
and VCOM Reference Voltages
MAX9679
Typical Application Circuit
MTP
MEMORY
PROG
REF
I2C
INTERFACE
TCON
VCOM1
GAMMA
BANK 1
SDA
SCL
DVDD
A0 12 GAMMA, 1 VCOM
MAX9679
BKSEL
10
10
DAC
AGND
10
DAC
10
DAC
10
DAC
10
DAC
10
DAC
2:1
MUX
2:1
MUX
10
DAC
AGND
10
DAC
10
DAC
10
DAC
10
DAC
10
DAC
10
DAC
PROG
REF
VPREF
AVDD1
AVDD2 HVDD
HVDD
TO LCD PANEL
GMA1
GMA2
GMA3
GMA4
GMA5
GMA6
GMA7
GMA8
GMA9
GMA10
GMA11
GMA12
AVDD_AMP
VCOM
VCOM_FB
AGND
I
2
C
REG
PROG
REF
VCOM1
VCOM2
GAMMA
BANK 1
GAMMA
BANK 2
I
2
C
REG
PROG
REF
VCOM1
VCOM2
GAMMA
BANK 1
GAMMA
BANK 2
SERVICE
DRIVER
CHIP
TO LCD
PANEL
SOURCE
DRIVER
CHIP
PMIC
12V
4 Maxim Integrated
12-Channel, 10-Bit Programmable Gamma
and VCOM Reference Voltages
MAX9679
(All voltages are with respect to AGND.)
Supply Voltages
AVDD1, AVDD2, AVDD_AMP ............................ -0.3V to +22V
DVDD ................................................................... -0.3V to +4V
Outputs
GMA1–GMA6 ...................................-0.3V to (VAVDD1 + 0.3V)
GMA7–GMA12 .................................-0.3V to (VAVDD2 + 0.3V)
VCOM ....................................... -0.3V to (VAVDD_AMP + 0.3V)
Inputs
SDA, SCL, A0, BKSEL ......................................... -0.3V to +6V
VCOM_FB ................................. -0.3V to (VAVDD_AMP + 0.3V)
Continuous Current
SDA, SCL ..................................................................... Q20mA
GMA1–GMA8 ............................................................. Q200mA
VCOM ........................................................................ Q600mA
Continuous Power Dissipation (TA = +70NC)
TQFN Multilayer Board
(derate 25.6mW/NC above +70NC) .........................2051.3mW
Junction Temperature .....................................................+125NC
Operating Temperature Range .......................... -40NC to +85NC
Storage Temperature Range ............................ -65NC to +150NC
Lead Temperature (soldering, 10s) ................................+300NC
Soldering Temperature (reflow) ......................................+260NC
ELECTRICAL CHARACTERISTICS
(VAVDD1 = 18V, VAVDD2 = VAVDD_AMP = 9V, VDVDD = 3.3V, VAGND = 0V, VCOM = VCOM_FB, programmable reference code = 905,
no load, TA = -40NC to +85NC, unless otherwise noted. Typical values are at TA = +25NC.) (Note 2)
ABSOLUTE MAXIMUM RATINGS
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
TQFN
Junction-to-Ambient Thermal Resistance (qJA) ..........39°C/W
Junction-to-Case Thermal Resistance (qJC) .................6°C/W
PACKAGE THERMAL CHARACTERISTICS (Note 1)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
SUPPLIES
AVDD1 Analog Supply Voltage
Range VAVDD1 Guaranteed by PSRR 9 20 V
AVDD2 Analog Supply Voltage
Range VAVDD2 Guaranteed by PSRR 6 20 V
AVDD_AMP Analog Supply
Voltage Range VAVDD_AMP Guaranteed by PSRR 9 20 V
Digital Supply Voltage VDVDD 2.7 3.6 V
Slowest DVDD Ramp-Up Time DVDD ramp-up time from 1.5V to 2.3V to
ensure correct MTP loading 20 25 ms
AVDD1 Analog Quiescent
Current IAVDD1 7 11 mA
AVDD2 Quiescent Current IAVDD2 6 9 mA
AVDD_AMP Quiescent Current IAVDD_AMP 5 8 mA
Digital Quiescent Current IDVDD No SCL or SDA transitions 1.5 3 mA
Thermal Shutdown +160 NC
Thermal-Shutdown Hysteresis 15 NC
Undervoltage-Lockout Threshold UVLO DVDD undervoltage-lockout threshold 2.1 2.3 2.6 V
Analog Supply Voltage Range
for Programming MTP 15 20 V
5Maxim Integrated
12-Channel, 10-Bit Programmable Gamma
and VCOM Reference Voltages
MAX9679
ELECTRICAL CHARACTERISTICS (continued)
(VAVDD1 = 18V, VAVDD2 = VAVDD_AMP = 9V, VDVDD = 3.3V, VAGND = 0V, VCOM = VCOM_FB, programmable reference code = 905,
no load, TA = -40NC to +85NC, unless otherwise noted. Typical values are at TA = +25NC.) (Note 2)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
PROGRAMMABLE REFERENCE (VPREF)
Full-Scale Voltage Referred to output, TA = +25NC19.96 19.98 20.00 V
Resolution 10 Bits
Integral Nonlinearity Error TA = +25NC, 336 P reference code P 1007 0.5 1 LSB
Differential Nonlinearity Error TA = +25NC, 336 P reference code P 1007 0.5 1 LSB
DAC
Resolution 10 Bits
Integral Nonlinearity Error TA = +25NC, 16 P code P 1008 for gamma,
256 P code P 1008 for VCOM 0.5 1 LSB
Differential Nonlinearity Error TA = +25NC, 16 P code P 1008 for gamma,
256 P code P 1008 for VCOM 0.5 1 LSB
GAMMA
Short-Circuit Current Output connected to either supply rail 200 mA
Total Output Error
TA = +25NC, code = 768 for
GMA1–GMA6 and code = 256 for GMA7–
GMA12
40 mV
Load Regulation
-5mA P ILOAD P +5mA, code = 768 for
GMA1–GMA6 and code = 256 for
GMA7–GMA12
0.5 mV/mA
Low Output Voltage Sinking 4mA, referred to lower supply rail 0.15 0.2 V
High Output Voltage Sourcing 4mA, referred to upper supply rail -0.2 -0.15 V
Power-Supply Rejection Ratio
GMA1–GMA6, code = 768, VAVDD1 = 9V
to 20V; GMA7–GMA12, code = 256,
VAVDD2 = 5V to 20V
60 90
dB
GMA1–GMA6, code = 768,
frequency = 120kHz; GMA7–GMA12,
code = 256, frequency = 120kHz
40
Output Resistance Buffer is disabled 78 kI
Maximum Capacitive Load Placed directly at output 150 pF
Noise RMS noise (10MHz bandwidth) 375 FV
VCOM OUTPUT (VCOM)
Short-Circuit Current Output connected to either VCOM
amplifier supplies 600 mA
Total Output Error TA = +25NC, code = 256,
VAVDD_AMP = 9V and 20V 40 mV
Load Regulation -80mA P ILOAD P +80mA, code = 256 0.5 mV/mA
Low Output Voltage Sinking 10mA, referred to lower
supply rail 0.15 0.2 V
High Output Voltage Sourcing 10mA, referred to upper
supply rail -0.2 -0.15 V
6 Maxim Integrated
12-Channel, 10-Bit Programmable Gamma
and VCOM Reference Voltages
MAX9679
DIGITAL I/O CHARACTERISTICS
(VDVDD = 3.3V, VAGND = 0V, TA = TMIN to TMAX, unless otherwise noted. Typical values are at TA = +25NC.) (Note 2)
I2C TIMING CHARACTERISTICS
(VDVDD = 3.3V, VAGND = 0V, TA = TMIN to TMAX, unless otherwise noted. Typical values are at TA = +25NC.) (Note 2)
ELECTRICAL CHARACTERISTICS (continued)
(VAVDD1 = 18V, VAVDD2 = VAVDD_AMP = 9V, VDVDD = 3.3V, VAGND = 0V, VCOM = VCOM_FB, programmable reference code = 905,
no load, TA = -40NC to +85NC, unless otherwise noted. Typical values are at TA = +25NC.) (Note 2)
Note 2: 100% production tested at TA = +25NC. Specifications over temperature limits are guaranteed by design.
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
Power-Supply Rejection Ratio 9V P VAVDD_AMP P 20V, code = 256 60 90 dB
Frequency = 120kHz, code = 256 40
Maximum Capacitive Load Placed directly at output 50 pF
Slew Rate Swing 4VP-P at VCOM, 10% to 90%,
RL = 10kI, CL = 50pF 100 V/Fs
Bandwidth RL = 10kI, CL = 50pF 60 MHz
Noise RMS noise (10MHz bandwidth) 375 FV
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
Input High Voltage VIH 0.7 x
DVDD V
Input Low Voltage VIL 0.3 x
DVDD V
Hysteresis of Schmitt Trigger
Inputs VHYS 0.05 x
DVDD V
Low-Level Output Voltage VOL Open drain, ISINK = 3mA 0 0.4 V
Low-Level Output Current IOL VOL = 0.4V 20 mA
Input Leakage Current IIH, IIL VIN = 0 or DVDD -10 +0.01 +10 FA
Input Capacitance 5 pF
Power-Down Input Current IIN DVDD = 0, VIN = 1.98V -10 +10 FA
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
Serial-Clock Frequency fSCL 0 1000 kHz
Hold Time (REPEATED) START
Condition tHD,STA After this period, the first clock pulse is
generated 0.26 Fs
SCL Pulse-Width Low tLOW 0.5 Fs
SCL Pulse-Width High tHIGH 0.26 Fs
Setup Time for a REPEATED
START Condition tSU,STA 0.26 Fs
Data Hold Time tHD,DAT I2C-bus devices 0 ns
Data Setup Time tSU,DAT 50 ns
SDA and SCL Receiving Rise Time tR120 ns
SDA and SCL Receiving Fall Time tF120 ns
SDA Transmitting Fall Time tF120 ns
7Maxim Integrated
12-Channel, 10-Bit Programmable Gamma
and VCOM Reference Voltages
MAX9679
I2C TIMING CHARACTERISTICS (continued)
(VDVDD = 3.3V, VAGND = 0V, TA = TMIN to TMAX, unless otherwise noted. Typical values are at TA = +25NC.) (Note 2)
Typical Operating Characteristics
(VAVDD1 = 18V, VAVDD2 = VAVDD_AMP = 9V, VDVDD = 3.3V, VAGND = 0V, VCOM = VCOM_FB, programmable reference code = 905,
no load, TA = -40NC to +85NC, unless otherwise noted. Typical values are at TA = +25NC.)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
Setup Time for STOP Condition tSU,STO 0.26 Fs
Bus Free Time Between STOP and
START Conditions tBUF 0.5 Fs
Bus Capacitance CB550 pF
Data Valid Time tVD;DAT 0.45 Fs
Data Valid Acknowledge Time tVD;ACK 0.45 Fs
Pulse Width of Suppressed Spike tSP 0 50 ns
GAMMA LOAD REGULATION
MAX9679 toc01
CURRENT LOAD (A)
GAMMA VOLTAGE (V)
7.91
7.92
7.93
7.94
7.95
7.90
-0.020
-0.015
-0.010
-0.005
0
0.005
0.010
0.015
0.020
VCOM LOAD REGULATION
MAX9679 toc02
CURRENT LOAD (mA)
VCOM VOLTAGE (V)
806020 40-60 -40 -20 0-80
8.92
8.94
8.96
8.98
9.00
9.02
9.04
9.06
9.08
9.10
8.90
-100 100
VCOM CODE x 1FF
DNL (LSB)
-0.4
-0.3
-0.2
-0.1
0
0.1
0.2
0.3
0.4
0.5
-0.5
GAMMA DNL
MAX9679 toc03
CODE
200 400 600 8000 1000
INL (LSB)
-0.4
-0.3
-0.2
-0.1
0
0.1
0.2
0.3
0.4
0.5
-0.5
VCOM INL
MAX9679 toc06
CODE
200 400 600 8000 1000
INL (LSB)
-0.4
-0.3
-0.2
-0.1
0
0.1
0.2
0.3
0.4
0.5
-0.5
GAMMA INL
MAX9679 toc04
CODE
200 400 600 8000 1000
DNL (LSB)
-0.4
-0.3
-0.2
-0.1
0
0.1
0.2
0.3
0.4
0.5
-0.5
VCOM DNL
MAX9679 toc05
CODE
200 400 600 8000 1000
8 Maxim Integrated
12-Channel, 10-Bit Programmable Gamma
and VCOM Reference Voltages
MAX9679
Typical Operating Characteristics (continued)
(VAVDD1 = 18V, VAVDD2 = VAVDD_AMP = 9V, VDVDD = 3.3V, VAGND = 0V, VCOM = VCOM_FB, programmable reference code =
905, no load, TA = -40NC to +85NC, unless otherwise noted. Typical values are at TA = +25NC.)
GAMMA OUTPUT vs. TEMPERATURE
MAX9679 toc07
TEMPERATURE (°C)
GAMMA OUTPUT VOLTAGE (V)
6035-15 10
9.965
9.970
9.975
9.980
9.990
9.985
9.995
10.000
9.960
-40 85
GAMMA CODE x 1FF
BANK SWITCHING SETTLING
TIME FOR GAMMA
MAX9679 toc10
GMA1
5V/div
BKSEL
5V/div
200ns/div
BANK SWITCHING SETTLING
TIME FOR VCOM
MAX9679 toc08
BKSEL
2V/div
VCOM
5V/div
400ns/div
BANK SWITCHING SETTLING
TIME FOR GAMMA
MAX9679 toc11
GMA1
5V/div
BKSEL
5V/div
200ns/div
BANK SWITCHING SETTLING
TIME FOR VCOM
MAX9679 toc09
VCOM
5V/div
BKSEL
5V/div
200ns/div
FREQUENCY (Hz)
PSRR (dB)
1M100k10k 10M
POWER-SUPPLY REJECTION
RATIO (GMA = 9V)
MAX9679 toc12
-50
-40
-30
-20
-10
0
-60
VAVDD1 = 18V Q100mVP-P
FREQUENCY (Hz)
PSRR (dB)
1M100k10k 10M
POWER-SUPPLY REJECTION
RATIO (VCOM = 9V)
MAX9679 toc13
-50
-40
-30
-20
-10
0
-60
VAVDD_AMP = 18V Q100mVP-P
9Maxim Integrated
12-Channel, 10-Bit Programmable Gamma
and VCOM Reference Voltages
MAX9679
Typical Operating Characteristics (continued)
(VAVDD1 = 18V, VAVDD2 = VAVDD_AMP = 9V, VDVDD = 3.3V, VAGND = 0V, VCOM = VCOM_FB, programmable reference code = 905,
no load, TA = -40NC to +85NC, unless otherwise noted. Typical values are at TA = +25NC.)
FREQUENCY (Hz)
PSRR (dB)
1M 10M100k10k
POWER-SUPPLY REJECTION
RATIO (VPREF = 2.5V)
MAX9679 toc14
-50
-40
-30
-20
-10
0
-60
VAVDD1 = 18V Q100mVP-P
GAMMA LOAD TRANSIENT
MAX9679 toc15
GMA1
5V/div
IOUT
100mA/div
2µs/div
VCOM LOAD TRANSIENT
MAX9679 toc16
VVCOM
1V/div
IOUT
200mA/div
2µs/div
GAMMA PROGRAM TO OUTPUT DELAY
MAX9679 toc17
GMA1
5V/div
SCL
2V/div
SDA
2V/div
20µs/div
VCOM PROGRAM TO OUTPUT DELAY
MAX9679 toc18
VVCOM
5V/div
SCL
2V/div
SDA
2V/div
20µs/div
PROGRAMMABLE REFERENCE
vs. AVDD1 SUPPLY VOLTAGE
MAX9679 toc19
VAVDD1 (V)
VPREF (V)
171610 11 12 1413 15
4.9605
4.9610
4.9615
4.9620
4.9625
4.9630
4.9635
4.9640
4.9600
91
8
PROGRAMMABLE REFERENCE
vs. TEMPERATURE
MAX9679 toc20
TEMPERATURE (°C)
VPREF (V)
8035-10
4.9600
4.9605
4.9610
4.9615
4.9620
4.9625
4.9630
4.9595
-55 125
10 Maxim Integrated
12-Channel, 10-Bit Programmable Gamma
and VCOM Reference Voltages
MAX9679
Pin Configuration
Pin Description
TQFN
MAX9679
19
20
21
22
12 3456
18 17 16 15 14 13
23
24
12
11
10
9
8
7
GMA11
AVDD2
GMA12
AVDD_AMP
VCOM_FB
AGND
DVDD
SCL
SDA
BKSEL
A0
GMA10
GMA9
GMA7
GMA6
GMA5
VCOM
GMA4
GMA2
GMA3
GMA1
AGND
AVDD1
GMA8
TOP VIEW
+EP
PIN NAME FUNCTION
1, 7 AGND Analog Ground
2 DVDD Digital Power Supply. Bypass DVDD with a 0.1FF capacitor to AGND.
3 SCL I2C-Compatible Serial-Clock Input
4 SDA I2C-Compatible Serial-Data Input/Output
5 BKSEL Bank Select Logic Input. Selects which bank of volatile registers are switched through to the DACs.
6 A0 I2C-Compatible Device Address Bit 0 (Input)
8 AVDD1 Analog Power Supply 1. The buffers for GMA1 through GMA6 operate from AVDD1. Bypass
AVDD1 with a 0.1FF capacitor to AGND.
9 GMA1 Gamma DAC Analog Output 1
10 GMA2 Gamma DAC Analog Output 2
11 GMA3 Gamma DAC Analog Output 3
12 GMA4 Gamma DAC Analog Output 4
13 GMA5 Gamma DAC Analog Output 5
14 GMA6 Gamma DAC Analog Output 6
15 GMA7 Gamma DAC Analog Output 7
16 GMA8 Gamma DAC Analog Output 8
17 GMA9 Gamma DAC Analog Output 9
18 GMA10 Gamma DAC Analog Output 10
19 GMA11 Gamma DAC Analog Output 11
20 GMA12 Gamma DAC Analog Output 12
21 AVDD2 Analog Power Supply 2. The buffers for GMA7 through GMA12 operate from AVDD2. Bypass
AVDD2 with a 0.1FF capacitor to AGND.
22 AVDD_AMP Power Supply for VCOM Amplifier. Bypass AVDD_AMP with a 0.1FF capacitor to AGND.
23 VCOM VCOM Output
24 VCOM_FB Feedback for VCOM Amplifier. VCOM_FB is the negative input terminal of the VCOM operational
amplifier.
EP Exposed Pad. EP is internally connected to AGND. EP must be connected to AGND.
11Maxim Integrated
12-Channel, 10-Bit Programmable Gamma
and VCOM Reference Voltages
MAX9679
Detailed Description
The MAX9679 combines gamma, VCOM, and the DAC
reference voltage into a single chip. All the output
voltages are programmable. Power sequencing is well
behaved since a single chip generates all the various
reference voltages needed for the LCD panel.
Previous generations of programmable gamma
chips required an external reference voltage for the
digital-to-analog converters (DACs). This IC integrates a
programmable reference voltage (VPREF) for the DACs,
eliminating the need for an external reference voltage.
Accuracy of the full-scale programmable reference
voltage is ±0.1%, and resolution is 10 bits. Both the DC
and AC power-supply rejection of the programmable
reference voltage is extremely high since it is powered
from an internal linear regulator.
The gamma outputs are divided into an upper bank
(GMA1–GMA6) that is powered from AVDD1 and a lower
bank (GMA7–GMA12) that is powered from AVDD2.
AVDD1 is the analog supply voltage for the LCD panel.
AVDD2 can be connected to the same supply as
AVDD1. If the IC's heat generation needs to be reduced,
AVDD2 can be connected to a lower voltage such as
12V (input voltage to the LCD panel) or HVDD (half of
the AVDD1 supply).
The VCOM operational amplifier operates from
AVDD_AMP. Similar to AVDD2, AVDD_AMP can be
connected to AVDD1, 12V, or HVDD. Peak VCOM out-
put current is 600mA. The negative input terminal of
the VCOM operational amplifier is available for applica-
tions that require external push-pull transistors.
The IC contains nonvolatile, multiple-time programmable
memory that can store the gamma, VCOM, and the pro-
grammable reference codes.
The interface and control of the IC are completely digi-
tal. Functions that are not real-time such as gamma and
VCOM are set through the I2C interface. Real-time func-
tions, such as the switching of the gamma and VCOM,
are done through the dedicated logic input signal
BKSEL.
Programmable Reference
The IC has an internal programmable reference, which
when referred to the output, has a full-scale voltage of
20V (Q0.1%). The reference voltage is calculated using
the following equation:
VPREF = (20V × CODE)/2N
where CODE is the numeric value stored in register
address and N is the bits of resolution. For the IC, N =
10 and CODE ranges from 0 to 1023.
Note that VPREF cannot be 20V because the maximum
value of CODE is always one LSB less than the full-scale
voltage. When the programmable reference code is
1023, then VPREF is:
VPREF = (20V × 1023)/210 = 19.98V
10-Bit Digital-to-Analog Converters
VPREF sets the full-scale output of the DACs. Determine
the output voltages using the following equations:
VGMA_ = (VPREF × CODE)/2N
VVCOM = (VPREF × CODE)/2N
where CODE is the numeric value of the DAC’s binary
input code and N is the bits of resolution. For the IC,
N = 10 and CODE ranges from 0 to 1023.
Note that the DAC can never output VPREF because the
maximum value of CODE is always one LSB less than
the reference. For example, if VPREF = 16V and the DAC
CODE is 1023, then the gamma output voltage is:
VGMA_ = (16V × 1023)/210 = 15.98438V
Gamma Buffers
The gamma buffers can typically source or sink 4mA of
DC current within 200mV of the supplies.
The source drivers can kick back a great deal of current
to the buffer outputs during a horizontal line change or a
polarity switch. The DAC output buffers can source/sink
200mA of peak transient current to reduce the recovery
time of the output voltages when critical levels and pat-
terns are displayed.
VCOM Amplifier
The operational amplifier attached to the VCOM DAC
holds the VCOM voltage stable while providing the ability
to source and sink 600mA into the backplane of a TFT-
LCD panel. The operational amplifier can directly drive
the capacitive load of the TFT-LCD backplane without
the need for a series resistor in most cases. The VCOM
amplifier has current limiting on its output to protect its
bond wires.
If the application requires more than 600mA, buffer the
output of the VCOM amplifier with a MAX9650, a VCOM
power amplifier. The MAX9650 can source or sink 1.3A
of current.
12 Maxim Integrated
12-Channel, 10-Bit Programmable Gamma
and VCOM Reference Voltages
MAX9679
Switching Gamma and VCOM
The IC can keep two independent sets of gamma and
VCOM codes in volatile memory (Table 1).
The BKSEL signal determines which set of gamma and
VCOM codes is driven out (Table 2).
Multiple-Time Programmable
(MTP) Memory
MTP memory, which is a form of nonvolatile memory,
stores the DAC code values even when the chip is not
powered. When the chip is powered up, the code values
are automatically transferred from MTP memory to the
I2C registers. See the Power-On Reset (POR)/Power-Up
section for more details. The user can program DAC
codes into MTP memory up to 100 times.
Power-On Reset (POR)/Power-Up
The POR circuit that monitors DVDD ensures that all I2C
registers are reset to their MTP values upon power-up
or POR. Once DVDD rises above 2.4V (typ), the POR
circuit releases the I2C registers and the values stored
in MTP are loaded. Should DVDD drop to less than 2.4V
typical, then the contents of the registers can no longer
be guaranteed and a reset is generated. When DVDD
rises back above the POR voltage, the values stored in
MTP are loaded back into the I2C registers. The transfer
time of the MTP registers to I2C registers is 300Fs typi-
cal and is less than 400Fs in the worst case. During this
time, AVDD should not be powered up, and the I2C does
not acknowledge any commands. The I2C only starts
acknowledging commands after all registers have been
loaded from MTP.
Thermal Shutdown
The IC features thermal-shutdown protection with tem-
perature hysteresis. When the die temperature reaches
+165NC, all of the gamma outputs and the VCOM output
are disabled. When the die cools down by 15NC, the
outputs are enabled again.
Register and Bit Descriptions
The IC has both volatile memory and also nonvolatile
MTP memory. The volatile memory structure has I2C reg-
isters and DAC registers (see the Functional Diagram).
The I2C master must first write data into the I2C registers
of the IC before the data can be moved into the DAC
registers (or MTP memory). The advantage of having the
I2C registers serve as a data buffer for the IC is that data
can be transferred in a parallel operation from the I2C
registers to the DAC registers, and so the entire gamma
curve is essentially updated instantaneously rather than
serially on a point-by-point basis.
The volatile memory stores two independent sets of
gamma curves and VCOM codes. The first set consists
of gamma codes from bank 1, VCOM1 code, VCOM1MIN
code, and VCOM1MAX code. The second set consists
of gamma codes from bank 2, VCOM2 code, VCOM2MIN
code, and VCOM2MAX code. In addition, volatile memo-
ry stores the programmable reference code.
Table 1. Registers in Each of the Two
Independent Sets
Table 2. BKSEL Logic Table
REGISTERS IN SET 1 REGISTERS IN SET 2
GMA1BK1 GMA1BK2
GMA2BK1 GMA2BK2
GMA3BK1 GMA3BK2
GMA4BK1 GMA4BK2
GMA5BK1 GMA5BK2
GMA6BK1 GMA6BK2
GMA7BK1 GMA7BK2
GMA8BK1 GMA8BK2
GMA9BK1 GMA9BK2
GMA10BK1 GMA10BK2
GMA11BK1 GMA11BK2
GMA12BK1 GMA12BK2
VCOM1 VCOM2
VCOM1MIN VCOM2MIN
VCOM1MAX VCOM2MAX
OUTPUT BKSEL = LOW BKSEL = HIGH
GMA1 GMA1BK1 GMA1BK2
GMA2 GMA2BK1 GMA2BK2
GMA3 GMA3BK1 GMA3BK2
GMA4 GMA4BK1 GMA4BK2
GMA5 GMA5BK1 GMA5BK2
GMA6 GMA6BK1 GMA6BK2
GMA7 GMA7BK1 GMA7BK2
GMA8 GMA8BK1 GMA8BK2
GMA9 GMA9BK1 GMA9BK2
GMA10 GMA10BK1 GMA10BK2
GMA11 GMA11BK1 GMA11BK2
GMA12 GMA12BK1 GMA12BK2
VCOM VCOM1 VCOM2
13Maxim Integrated
12-Channel, 10-Bit Programmable Gamma
and VCOM Reference Voltages
MAX9679
The nonvolatile MTP memory stores all the data except
for the second set of gamma curves and VCOM codes.
During power-up, the codes in the MTP memory are
transferred into the I2C and DAC registers.
Each memory location whether in nonvolatile or volatile
memory holds a 10-bit word. Two bytes must be read or
written through the I2C interface for every register. Table
3 shows the register map. The same register address
and register name exists in the MTP memory bank, I2C
register bank, and the DAC register bank. The write
control bits determine into which memory location the
data is stored.
Register Description
Only the 10 least significant bits (LSBs) are written to the
registers (Table 4). During a write operation, the write
control bits (the two MSBs) are stripped from the incom-
ing data stream and are used to determine whether the
MTP or DAC registers are updated (Table 5). Note the
I2C registers are only 10 bits.
Table 3. Register Map
REGISTER
ADDRESS
REGISTER
NAME REGISTER DESCRIPTION POWER-ON
RESET VALUE
MTP FACTORY
INITIALIZATION VALUE
0x00 GMA1BK1 Gamma 1 of Bank 1 0x200 0x200
0x01 GMA2BK1 Gamma 2 of Bank 1 0x200 0x200
0x02 GMA3BK1 Gamma 3 of Bank 1 0x200 0x200
0x03 GMA4BK1 Gamma 4 of Bank 1 0x200 0x200
0x04 GMA5BK1 Gamma 5 of Bank 1 0x200 0x200
0x05 GMA6BK1 Gamma 6 of Bank 1 0x200 0x200
0x06 GMA7BK1 Gamma 7 of Bank 1 0x200 0x200
0x07 GMA8BK1 Gamma 8 of Bank 1 0x200 0x200
0x08 GMA9BK1 Gamma 9 of Bank 1 0x200 0x200
0x09 GMA10BK1 Gamma 10 of Bank 1 0x200 0x200
0x0A GMA11BK1 Gamma 11 of Bank 1 0x200 0x200
0x0B GMA12BK1 Gamma 12 of Bank 1 0x200 0x200
0x0C Reserved 0x000
0x0D Reserved 0x000
0x0E Reserved 0x000
0x0F Reserved 0x000
0x10 Reserved 0x000
0x11 Reserved 0x000
0x12 VCOM1 Common voltage 1 0x200 0x200
0x13 Reserved 0x000
0x14 Reserved 0x000
0x15 Reserved 0x000
0x16 Reserved 0x000
0x17 Reserved 0x000
0x18 VCOM1MIN Minimum VCOM1 value 0x000 0x000
0x19 VCOM1MAX Maximum VCOM1 value 0x3FF 0x3FF
0x1A Reserved 0x000
0x1B Reserved 0x000
0x1C Reserved 0x000
0x1D Reserved 0x000
0x1E Reserved 0x000
14 Maxim Integrated
12-Channel, 10-Bit Programmable Gamma
and VCOM Reference Voltages
MAX9679
Table 3. Register Map (continued)
Table 4. Register Description
REGISTER
ADDRESS
REGISTER
NAME REGISTER DESCRIPTION POWER-ON
RESET VALUE
MTP FACTORY
INITIALIZATION VALUE
0x1F VPREF Programmable reference voltage 0x200 0x200
0x20 GMA1BK2 Gamma 1 of Bank 2 0x200
0x21 GMA2BK2 Gamma 2 of Bank 2 0x200
0x22 GMA3BK2 Gamma 3 of Bank 2 0x200
0x23 GMA4BK2 Gamma 4 of Bank 2 0x200
0x24 GMA5BK2 Gamma 5 of Bank 2 0x200
0x25 GMA6BK2 Gamma 6 of Bank 2 0x200
0x26 GMA7BK2 Gamma 7 of Bank 2 0x200
0x27 GMA8BK2 Gamma 8 of Bank 2 0x200
0x28 GMA9BK2 Gamma 9 of Bank 2 0x200
0x29 GMA10BK2 Gamma 10 of Bank 2 0x200
0x2A GMA11BK2 Gamma 11 of Bank 2 0x200
0x2B GMA12BK2 Gamma 12 of Bank 2 0x200
0x2C VCOM2 Common voltage 2 0x200
0x2D VCOM2MIN Minimum VCOM2 value 0x000
0x2E VCOM2MAX Maximum VCOM2 value 0x3FF
REG REG
ADDR B15 B14 B13 B12 B11 B10 B9 B8 B7 B6 B5 B4 B3 B2 B1 B0
GMA1BK1 0x00 W1 W0 X X X X b9 b8 b7 b6 b5 b4 b3 b2 b1 b0
GMA2BK1 0x01 W1 W0 X X X X b9 b8 b7 b6 b5 b4 b3 b2 b1 b0
GMA3BK1 0x02 W1 W0 X X X X b9 b8 b7 b6 b5 b4 b3 b2 b1 b0
GMA4BK1 0x03 W1 W0 X X X X b9 b8 b7 b6 b5 b4 b3 b2 b1 b0
GMA5BK1 0x04 W1 W0 X X X X b9 b8 b7 b6 b5 b4 b3 b2 b1 b0
GMA6BK1 0x05 W1 W0 X X X X b9 b8 b7 b6 b5 b4 b3 b2 b1 b0
GMA7BK1 0x06 W1 W0 X X X X b9 b8 b7 b6 b5 b4 b3 b2 b1 b0
GMA8BK1 0x07 W1 W0 X X X X b9 b8 b7 b6 b5 b4 b3 b2 b1 b0
GMA9BK1 0x08 W1 W0 X X X X b9 b8 b7 b6 b5 b4 b3 b2 b1 b0
GMA10BK1 0x09 W1 W0 X X X X b9 b8 b7 b6 b5 b4 b3 b2 b1 b0
GMA11BK1 0x0A W1 W0 X X X X b9 b8 b7 b6 b5 b4 b3 b2 b1 b0
GMA12BK1 0x0B W1 W0 X X X X b9 b8 b7 b6 b5 b4 b3 b2 b1 b0
Reserved 0x0C
Reserved 0x0D
Reserved 0x0E
Reserved 0x0F
Reserved 0x10
Reserved 0x11
VCOM1 0x12 W1 W0 X X X X b9 b8 b7 b6 b5 b4 b3 b2 b1 b0
15Maxim Integrated
12-Channel, 10-Bit Programmable Gamma
and VCOM Reference Voltages
MAX9679
Table 4. Register Description (continued)
Table 5. Write Control Bits
REG REG
ADDR B15 B14 B13 B12 B11 B10 B9 B8 B7 B6 B5 B4 B3 B2 B1 B0
Reserved 0x13
Reserved 0x14
Reserved 0x15
Reserved 0x16
Reserved 0x17
VCOM1MIN 0x18 W1 W0 X X X X b9 b8 b7 b6 b5 b4 b3 b2 b1 b0
VCOM1MAX 0x19 W1 W0 X X X X b9 b8 b7 b6 b5 b4 b3 b2 b1 b0
Reserved 0x1A
Reserved 0x1B
Reserved 0x1C
Reserved 0x1D
Reserved 0x1E
VPREF 0x1F W1 W0 X X X X b9 b8 b7 b6 b5 b4 b3 b2 b1 b0
GMA1BK2 0x20 W1 W0 X X X X b9 b8 b7 b6 b5 b4 b3 b2 b1 b0
GMA2BK2 0x21 W1 W0 X X X X b9 b8 b7 b6 b5 b4 b3 b2 b1 b0
GMA3BK2 0x22 W1 W0 X X X X b9 b8 b7 b6 b5 b4 b3 b2 b1 b0
GMA4BK2 0x23 W1 W0 X X X X b9 b8 b7 b6 b5 b4 b3 b2 b1 b0
GMA5BK2 0x24 W1 W0 X X X X b9 b8 b7 b6 b5 b4 b3 b2 b1 b0
GMA6BK2 0x25 W1 W0 X X X X b9 b8 b7 b6 b5 b4 b3 b2 b1 b0
GMA7BK2 0x26 W1 W0 X X X X b9 b8 b7 b6 b5 b4 b3 b2 b1 b0
GMA8BK2 0x27 W1 W0 X X X X b9 b8 b7 b6 b5 b4 b3 b2 b1 b0
GMA9BK2 0x28 W1 W0 X X X X b9 b8 b7 b6 b5 b4 b3 b2 b1 b0
GMA10BK2 0x29 W1 W0 X X X X b9 b8 b7 b6 b5 b4 b3 b2 b1 b0
GMA11BK2 0x2A W1 W0 X X X X b9 b8 b7 b6 b5 b4 b3 b2 b1 b0
GMA12BK2 0x2B W1 W0 X X X X b9 b8 b7 b6 b5 b4 b3 b2 b1 b0
VCOM2 0x2C W1 W0 X X X X b9 b8 b7 b6 b5 b4 b3 b2 b1 b0
VCOM2MIN 0x2D W1 W0 X X X X b9 b8 b7 b6 b5 b4 b3 b2 b1 b0
VCOM2MAX 0x2E W1 W0 X X X X b9 b8 b7 b6 b5 b4 b3 b2 b1 b0
W1 W0 ACTION
0 0 No update.
0 1 MTP registers get updated when the current I2C register has finished updating. See the
Nonvolatile Memory section for more details.
1 0 All DAC registers get updated when the current I2C register has finished updating (end of B0).
1 1 No update.
16 Maxim Integrated
12-Channel, 10-Bit Programmable Gamma
and VCOM Reference Voltages
MAX9679
VCOM Programmable Range
(VCOMMIN and VCOMMAX)
The IC features a programmable range for VCOM1
and VCOM2. VCOM1MIN and VCOM1MAX registers
provide low and high limits for the VCOM1 register. At
the factory, VCOM1MIN is set to 0 and VCOM1MAX is
set to 1023 (default values) to provide the full rail-to-rail
programmable range for VCOM1. Later, the user can
define their own limits by programming VCOM1MIN and
VCOM1MAX registers and MTP.
VCOM1 register values are limited to the defined range.
If the VCOM1 register accidentally gets programmed
with a value higher than VCOM1MAX, it automatically
gets locked to the VCOM1MAX value. The I2C bus does
acknowledge and receive the data sent on the bus;
however, internally the part recognizes that the value
is outside of the range and adjusts it accordingly. The
same scenario is true if the value programming VCOM1
is below VCOM1MIN.
VCOM2MIN and VCOM2MAX have a similar relationship
with VCOM2.
Memory
The IC includes both volatile memory (I2C registers and
DAC registers) and nonvolatile memory (MTP registers).
It is possible to write to each single volatile memory reg-
ister from a MTP register individually or to write to all at
once through memory write bits (M1, M0), which are the
two MSBs of the register address byte. Table 6 shows
the memory write bits. Set both M1 and M0 to low or high
when writing to or reading from the I2C registers through
the I2C bus.
Volatile Memory
The IC features a double-buffered register structure with
the I2C registers as the first buffer and the DAC registers
as the second buffer. The benefit is that the I2C registers
can be updated without updating the DAC registers.
After the I2C registers have been updated, the value or
values in the I2C registers can be transferred all at the
same time to the DAC registers.
Figure 1 shows how to program a single DAC register.
The output voltage is updated after sending LSB (D0).
It is possible to write to multiple I2C registers first, then
update the output voltage of all channels simultane-
ously, as shown in Figure 2. In this mode, it is pos-
sible for the I2C master to write to all registers of the IC
(gamma, VCOM, and programmable reference) in one
communication. In that case, the value programmed
on addresses 0x0C–0x11, 0x13–0x17, 0x1A–0x1E, and
0x20–0x2E are meaningless. However, the IC does send
an acknowledge bit for each of the two bytes on any of
these addresses. The control bits (W1, W0) shown in
Figure 2 are set in a way that all DACs are programmed
to their desired value with no changes to the output volt-
ages until the LSB of the last DAC is received and then
all the channels update simultaneously.
Table 6. Memory Write Bits
Figure 1. Single DAC Programming
M1 M0 ACTION
0 0 None.
0 1 Only the addressed I2C registers and DAC registers get set to the MTP values.
1 0 All I2C registers and DAC registers get set to the MTP values.
1 1 None.
SLAVE ID DAC/VCOM ADDRESSM1
SR/W
= 0 A111010B100D5D4D3D2D1D0A
M0
A10XXXXD9 D7 D6 D5 D4 D3 D2 D1 D0 APD8
DATA DATA
17Maxim Integrated
12-Channel, 10-Bit Programmable Gamma
and VCOM Reference Voltages
MAX9679
Nonvolatile Memory
The IC is able to write to nonvolatile memory (MTP) of any
single DAC/VCOM register in a single or burst I2C trans-
action. This memory can be written to at least 100 times.
Figure 3 shows a single write to a MTP address. The
control bits are set in a way that the MTP register is
updated at the end of LSB (D0).
Figure 4 shows how to program multiple MTP registers
in one communication transition. Similar to programming
the volatile memory, the first 2 bytes of data correspond
to the DAC/VCOM address specified by the master
on the previous byte and the following 2 bytes of data
correspond to the next address and so on. In this con-
figuration, all the MTP registers are programmed at the
same time following the LSB of the last set of data byte.
The last set of data bytes is different than the
previous bytes because bit 15 and bit 14 are 0b0 and
0b1, respectively. If, for some reason, the master issues
a stop condition before sending the last two bytes of the
data with appropriate values of bit 15 (0b0) and bit 14
(0b1), then none of the MTP registers are updated.
Programming the MTP registers also updates the DAC
registers and consequently the output voltages. Similar
to multiple volatile memory programming, the update
only occurs after the LSB of the last byte is received. All
the outputs are programmed and updated simultane-
ously; however, depending on the number of MTP regis-
ters: it takes 31ms to 500ms to store the values into the
nonvolatile memory. During this time, the IC is not avail-
able on the I2C bus and any communication from the
master should be delayed until the MTP is programmed.
Any attempt from the I2C master to talk to the IC is not
acknowledged.
General and Single Acquire Commands
It is possible to update all the DAC outputs to the previ-
ously stored MTP values with one special command. Set
the 2 MSB bits (M1 and M0) of the register address to
0b10 to set all the I2C registers, DAC registers and the
output voltages to the values of MTP (Figure 5).
The IC ignores the rest of the register address in this
case.
It is also possible to update the I2C register, DAC regis-
ter and DAC output voltage of only one channel from the
MTP. Set the 2 MSB bits (M1 and M0) of the DAC/VCOM
address to 0b01 (Figure 6) to move a specific value from
MTP into the I2C register and DAC register of a single
channel.
.
Figure 2. Multiple (or All) DACs Programming
SLAVE ID DAC/VCOM ADDRESSM1
SR/W
= 0 A111010B1 00D5 D4 D3 D2 D1 D0 A
M0
A00XXXXD9 D7 D6 D5 D4 D3 D2 D1 D0 AD8
DATA DATA
A00XXXXD9 D7 D6 D5 D4 D3 D2 D1 D0 AD8
DATA DATA
A10XXXXD9 D7 D6 D5 D4 D3 D2 D1 D0 APD8
DATA DATA
18 Maxim Integrated
12-Channel, 10-Bit Programmable Gamma
and VCOM Reference Voltages
MAX9679
Figure 3. Single MTP Programming
Figure 4. Multiple MTP Programming
Figure 5. General Acquire Command to Updated All Outputs with MTP
Figure 6. Single Acquire Command to Updated One Output with MTP
SLAVE ID DAC/VCOM ADDRESSM1
SR/W
= 0 A1 11010B1 00D5 D4 D3 D2 D1 D0 A
M0
A01XXXXD9 D7 D6 D5 D4 D3 D2 D1 D0 APD8
DATA DATA
SLAVE ID DAC/VCOM ADDRESSM1
SR/W
= 0 A111010B1 00D5 D4 D3 D2 D1 D0 A
M0
A00XXXXD9 D7 D6 D5 D4 D3 D2 D1 D0 AD8
DATA DATA
A00XXXXD9 D7 D6 D5 D4 D3 D2 D1 D0 AD8
DATA DATA
A01XXXXD9 D7 D6 D5 D4 D3 D2 D1 D0 APD8
DATA DATA
SLAVE ID M1
SR/W
= 0 A111010B1 10000000A
M0
P
DAC/VCOM ADDRESSM1
SR/W
= 0 A111010B1 01D5 D4 D3 D2 D1 D0 A
M0
P
SLAVE ID
19Maxim Integrated
12-Channel, 10-Bit Programmable Gamma
and VCOM Reference Voltages
MAX9679
SMBus is a trademark of Intel Corp.
I2C Serial Interface
The IC features an I2C/SMBusK-compatible, 2-wire
serial interface consisting of a serial-data line (SDA) and
a serial-clock line (SCL). SDA and SCL facilitate com-
munication between the devices and the master at clock
rates up to 1MHz. Figure 7 shows the 2-wire interface
timing diagram. The master generates SCL and initiates
data transfer on the bus. A master device writes data
to the devices by transmitting the proper slave address
followed by the register address and then the data word.
Each transmit sequence is framed by a START (S) or
REPEATED START (Sr) condition and a STOP (P) con-
dition. Each word transmitted to the MAX9679 is 8 bits
long and is followed by an acknowledge clock pulse. A
master reading data from the devices transmits the
proper slave address followed by a series of nine SCL
pulses. The devices transmit data on SDA in sync with
the master-generated SCL pulses. The master acknowl-
edges receipt of each byte of data. Each read sequence
is framed by a START (S) or REPEATED START (Sr)
condition, a not acknowledge, and a STOP (P) condi-
tion. SDA operates as both an input and an open-drain
output. A pullup resistor, typically greater than 500I, is
required on the SDA bus. SCL operates as only an input.
A pullup resistor, typically greater than 500I, is required
on SCL if there are multiple masters on the bus, or if the
master in a single-master system has an open-drain SCL
output. Series resistors in line with SDA and SCL are
optional. Series resistors protect the digital inputs of the
devices from high-voltage spikes on the bus lines, and
minimize crosstalk and undershoot of the bus signals.
Bit Transfer
One data bit is transferred during each SCL cycle. The
data on SDA must remain stable during the high period
of the SCL pulse. Changes in SDA while SCL is high are
control signals. See the START and STOP Conditions
section. SDA and SCL idle high when the I2C bus is not
busy.
START and STOP Conditions
SDA and SCL idle high when the bus is not in use. A
master initiates communication by issuing a START (S)
condition. A START condition is a high-to-low transition
on SDA with SCL high. A STOP (P) condition is a low-to-
high transition on SDA while SCL is high (Figure 8).
A START condition from the master signals the beginning
of a transmission to the IC. The master terminates trans-
mission, and frees the bus, by issuing a STOP condition.
The bus remains active if a REPEATED START (Sr) con-
dition is generated instead of a STOP condition.
Figure 8. START, STOP, and REPEATED START Conditions
SCL
SDA
SS
rP
Figure 7. I2C Interface Timing Diagram
SCL
SDA
START
CONDITION
STOP
CONDITION
REPEATED
START CONDITION
START
CONDITION
tHD,STA
tSU,STA tHD,STA tSP
tBUF
tSU,STO
tLOW
tSU,DAT
tHD,DAT
tHIGH
tRtF
20 Maxim Integrated
12-Channel, 10-Bit Programmable Gamma
and VCOM Reference Voltages
MAX9679
Early STOP Conditions
The IC recognizes a STOP condition at any point during
data transmission except if the STOP condition occurs in
the same high pulse as a START condition. For proper
operation, do not send a STOP condition during the
same SCL high pulse as the START condition.
Slave Address
The slave address is defined as the 7 most significant
bits (MSBs) followed by the read/write (R/W) bit. Set the
R/W bit to 1 to configure the IC to read mode. Set the R/W
bit to 0 to configure the IC to write mode. The address is
the first byte of information sent to the IC after the START
condition. The IC’s slave address is configured with A0.
Table 7 shows the possible addresses for the IC.
Acknowledge
The acknowledge bit (ACK) is a clocked 9th bit that the
IC uses to handshake receipt of each byte of data when
in write mode (Figure 9).
The IC pulls down SDA during the entire master-generat-
ed ninth clock pulse if the previous byte is successfully
received. Monitoring ACK allows for detection of unsuc-
cessful data transfers. An unsuccessful data transfer
occurs if a receiving device is busy or if a system fault
has occurred. In the event of an unsuccessful data trans-
fer, the bus master may retry communication. The master
pulls down SDA during the ninth clock cycle to acknowl-
edge receipt of data when the IC is in read mode. An
acknowledge is sent by the master after each read byte
to allow data transfer to continue. A not acknowledge is
sent when the master reads the final byte of data from
the IC, followed by a STOP condition.
Write Data Format
A write to the IC consists of transmitting a START condi-
tion, the slave address with the R/W bit set to 0, one data
byte of data to configure the internal register address
pointer, one word (2 bytes) of data or more, and a STOP
condition.
Figure 10 illustrates the proper frame format for writing
one word of data to the IC. Figure 11 illustrates the frame
format for writing n-bytes of data to the IC.
The slave address with the R/W bit set to 0 indicates
that the master intends to write data to the IC. The IC
acknowledges receipt of the address byte during the
master-generated 9th SCL pulse.
The second byte transmitted from the master configures
the IC’s internal register address pointer. The IC’s inter-
nal address pointer consists of the six least significant
bits (LSB) of the second byte. The 2 MSBs of the second
byte (M1 and M0) are set to 00b when writing to the inter-
nal registers. See the Memory section for more details.
The pointer tells the IC where to write the next byte of
data. An acknowledge pulse is sent by the IC upon
receipt of the address pointer data when writing to the
Figure 9. Acknowledge
Figure 10. Writing a Word of Data to the IC
Table 7. Slave Address
1
SCL
START
CONDITION
SDA
289
CLOCK PULSE FOR
ACKNOWLEDGMENT
ACKNOWLEDGE
NOT ACKNOWLEDGE
ONE WORD
ACKNOWLEDGE FROM
THE IC
A
AP
0
ACKNOWLEDGE FROM THE IC
R/W
S SLAVE ADDRESS REGISTER ADDRESS DATA BYTE 2
AUTOINCREMENT INTERNAL
REGISTER ADDRESS POINTER
A00 DATA BYTE 1
ACKNOWLEDGE FROM THE IC
ACKNOWLEDGE FROM THE IC
W1 W0 D9 D8XXXXD7D6 D1 D0D2D4 D3D5
M0M1
A/A
A0 READ ADDRESS WRITE ADDRESS
AGND E9h (11101001) E8h (11101000)
DVDD EBh (11101011) EAh (11101010)
21Maxim Integrated
12-Channel, 10-Bit Programmable Gamma
and VCOM Reference Voltages
MAX9679
DAC registers. When writing to the MTP, a not acknowl-
edge is sent from the IC after the master writes the final
byte of data, followed by a STOP condition.
The third and fourth bytes sent to the IC contain the
data that is written to the chosen register and which
type of register it writes to, volatile (DAC) or nonvolatile
memory (MTP). See the Nonvolatile Memory section for
more details. An acknowledge pulse from the IC signals
receipt of each data byte. The address pointer autoincre-
ments to the next register address after receiving every
other data byte. This autoincrement feature allows a
master to write to sequential register address locations
within one continuous frame. The master signals the end
of transmission by issuing a STOP condition. If data is
written into register address 0x2E, the address pointer
autoincrements to 0xFF and stays at 0xFF until the mas-
ter writes a new value into the register address pointer.
Read Data Format
The master presets the address pointer by first sending
the IC’s slave address with the R/W bit set to 0 followed
by the register address with M1 and M0 set to 00 after
a START condition. The IC acknowledges receipt of its
slave address and the register address by pulling SDA
low during the 9th SCL clock pulse. A REPEATED START
condition is then sent followed by the slave address with
the R/W bit set to 1. The IC transmits the contents of the
specified register. Transmitted data is valid on the rising
edge of the master-generated serial clock (SCL). The
address pointer autoincrements after every other read
Figure 12. Reading One Indexed Word of Data from the IC
Figure 11. Writing n-Bytes of Data to the IC
A0Sr
ACKNOWLEDGE FROM THE IC
R/W
S
AUTOINCREMENT INTERNAL
REGISTER ADDRESS POINTER
A00
ACKNOWLEDGE FROM THE IC
ONE WORD
NOT ACKNOWLEDGE FROM MASTER
AA
P
ACKNOWLEDGE FROM MASTER
XX D9 D8XXXXD7D
6D
1D0D2D4 D3D5
M0
M1
1A
REPEATED START R/W
SLAVE ADDRESS REGISTER ADDRESS SLAVE ADDRESS
DATA BYTE 1 DATA BYTE 2
ACKNOWLEDGE FROM THE IC
ONE WORD
ACKNOWLEDGE THE IC
A
AA
0
ACKNOWLEDGE FROM THE IC
R/W
S SLAVE ADDRESS REGISTER ADDRESS DATA BYTE 2
AUTOINCREMENT INTERNAL
REGISTER ADDRESS POINTER
A00 DATA BYTE 1
ACKNOWLEDGE FROM THE IC
ACKNOWLEDGE FROM THE IC
W1 W0 D9 D8XXXXD7D6D1D0D2D4 D3D5
ONE WORD
ACKNOWLEDGE FROM THE IC
A A/A PDATA BYTE nDATA BYTE n-1
ACKNOWLEDGE FROM THE IC
W1 W0 D9 D8XXXXD7D6D1D0D2D4 D3D5
M0M1
22 Maxim Integrated
12-Channel, 10-Bit Programmable Gamma
and VCOM Reference Voltages
MAX9679
Figure 13. Reading n Bytes of Indexed Data from the IC
data byte. This autoincrement feature allows all registers
to be read sequentially within one continuous frame. A
STOP condition can be issued after any number of read
data bytes. If a STOP condition is issued followed by
another read operation, the first data byte to be read is
from the register address location set by the previous
transaction and not 0x00, and subsequent reads autoin-
crement the address pointer until the next STOP condi-
tion. Attempting to read from register addresses higher
than 0x2E results in repeated reads from a dummy
register containing all one data. The master acknowl-
edges receipt of each read byte during the acknowledge
clock pulse. The master must acknowledge all correctly
received bytes except the last byte. The final byte must
be followed by a not acknowledge from the master and
then a STOP condition. Figure 12 and Figure 13 illustrate
the frame format for reading data from the IC.
Applications Information
Power Sequencing
AVDD1, AVDD2, AVDD_AMP, and DVDD are indepen-
dent of each other and can be powered up and powered
down in any sequence. However, output voltages are
only guaranteed to power up in a well-behaved manner
when DVDD is powered up first and powered down last
with 1ms allowed between DVDD and AVDD (Figure 14
and Figure 15). Connecting AVDD2 and AVDD_AMP to
half AVDD supply reduces the temperature of the IC.
If AVDD2 and AVDD_AMP are connected to the 12V
supply to the LCD module because a half AVDD supply
is not available, then Figure 16 shows the power-up and
power-down sequence. The gamma and VCOM outputs
are close to ground until AVDD1 is greater than its pow-
er-on reset voltage because AVDD1 is used to power the
internal voltage reference.
DVDD must be powered up within 25ms from 1.5V to
2.3V to ensure proper MTP loading/read. See Figure 17.
PCB Layout and Grounding
If the IC is mounted using reflow soldering or waver
soldering, the ground vias for the exposed pad should
have a finished hole size of at least 14 mils to ensure
adequate wicking of soldering onto the exposed pad. If
the IC is mounted using solder mask technique, the vias
requirement does not apply. In either case, the exposed
pad on the TQFN package is electrically connected to
both digital and analog grounds through a low thermal
resistance path to ensure adequate heat dissipation. Do
not route traces under these packages. The layout of
the exposed pad should have multiple small vias over a
single large via as shown in Figure 18.
Thermal resistance between top and ground layers can be
optimized with multiple small vias, and it is recommended
to have a plated via with 15 mils diameter. The via should
be flooded with solder for good thermal performance.
Power-Supply Bypassing
The IC operates from a single 9V to 20V analog sup-
ply (AVDD) and a 2.7V to 3.6V digital supply (DVDD).
Bypass AVDD to AGND with 0.1FF and 10FF capacitors
in parallel. Use an extensive ground plane to ensure
optimum performance. Bypass DVDD to AGND with a
0.1FF capacitor. The 0.1FF bypass capacitors should be
as close as possible to the device. Refer to the MAX9679
Evaluation Kit for a proven PCB layout.
A0SrSA00
ONE WORD
NOT ACKNOWLEDGE FROM MASTER
AA
P
ACKNOWLEDGE FROM MASTER
XX D9 D8XXXXD7D6D1D0D2D4 D3D5
M0M1
1A
AUTOINCREMENT INTERNAL
REGISTER ADDRESS POINTER
ONE WORD
ACKNOWLEDGE FROM MASTER
AA
ACKNOWLEDGE FROM MASTER
XX D9 D8XXXXD7D6D1D0D2D4 D3D5
REPEATED START
SLAVE ADDRESS REGISTER ADDRESS SLAVE ADDRESS
DATA BYTE 1 DATA BYTE 2 DATA BYTE nDATA BYTE n-1
R/W R/W
ACKNOWLEDGE FROM THE IC ACKNOWLEDGE FROM THE IC ACKNOWLEDGE FROM THE IC
23Maxim Integrated
12-Channel, 10-Bit Programmable Gamma
and VCOM Reference Voltages
MAX9679
Figure 14. Conventional Power-Up and Power-Down Sequence
Figure 15. Power-Up and Power-Down Sequence with AVDD2 and AVDD_AMP Connected to Half AVDD
Figure 16. Power-Up and Power-Down Sequence with AVDD2 and AVDD_AMP Connected to 12V
DVDD
>1ms
DVDD
TIME
VOLTAGE
AVDD1 = AVDD2 = AVDD_AMP AVDD1 = AVDD2 = AVDD_AMP
TIME
VOLTAGE
AVDD1AVDD1
DVDD
AVDD2 = AVDD_AMP AVDD2 = AVDD_AMP
DVDD
>1ms
DVDD DVDD
AVDD1 AVDD1
AVDD2 = AVDD_AMP AVDD2 = AVDD_AMP
TIME
VOLTAGE
>1ms
24 Maxim Integrated
12-Channel, 10-Bit Programmable Gamma
and VCOM Reference Voltages
MAX9679
Figure 18. Multiple Small Vias are Recommended over a Single Large Via in the PCB Layout
Figure 17. DVDD Power Up Requirement
NOT RECOMMENDEDRECOMMENDED
UVLO < DVDD < MTP_POR : NO EFFECT
DVDD < UVLO : IC RESET
1.5V
2.3V
DVDD 3.3V
2.3V
1.5V
DVDD 3.3V
tSTART < 25ms : NORMAL STARTUP
MTP_POR 2.3V
UVLO 1.5V
MTP_POR 2.3V
CASE 1
NORMAL
STARTUP
CASE 2
VERY SLOW
STARTUP
UVLO 1.5V
tSTART > 25ms : MTP NOT READ
GAMMA, VCOM = DEFAULT (5V)
25Maxim Integrated
12-Channel, 10-Bit Programmable Gamma
and VCOM Reference Voltages
MAX9679
PACKAGE TYPE PACKAGE CODE PACKAGE CODE LAND PATTERN NO.
24 TQFN T2444M+1 21-0139 90-0068
Package Information
For the latest package outline information and land patterns (footrprints), go to www.maximintegrated.com/packages. Note that
a “+”, “#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the
drawing pertains to the package regardless of RoHS status.
26 Maxim Integrated
12-Channel, 10-Bit Programmable Gamma
and VCOM Reference Voltages
MAX9679
Package Information (continued)
For the latest package outline information and land patterns (footrprints), go to www.maximintegrated.com/packages. Note that
a “+”, “#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the
drawing pertains to the package regardless of RoHS status.
27Maxim Integrated
12-Channel, 10-Bit Programmable Gamma
and VCOM Reference Voltages
MAX9679
Package Information (continued)
For the latest package outline information and land patterns (footrprints), go to www.maximintegrated.com/packages. Note that
a “+”, “#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the
drawing pertains to the package regardless of RoHS status.
12-Channel, 10-Bit Programmable Gamma
and VCOM Reference Voltages
MAX9679
Maxim Integrated cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim Integrated product. No circuit patent
licenses are implied. Maxim Integrated reserves the right to change the circuitry and specifications without notice at any time. The parametric values (min and
max limits) shown in the Electrical Characteristics table are guaranteed. Other parametric values quoted in this data sheet are provided for guidance.
28 Maxim Integrated 160 Rio Robles, San Jose, CA 95134 USA 1-408-601-1000
© 2013 Maxim Integrated Products, Inc. Maxim Integrated and the Maxim Integrated logo are trademarks of Maxim Integrated Products, Inc.
Revision History
REVISION
NUMBER
REVISION
DATE DESCRIPTION PAGES
CHANGED
0 7/11 Initial release
1 1/13 Added ramp-up time parameter to Electrical Characteristics table, added new
Figure 17 and updated Power Sequencing section and Figures 14–16 4, 22–24
2 5/13 Added minimum value and removed the maximum value to the slowest DVDD ramp-
up time parameter 4