1
Data sheet acquired from Harris Semiconductor
SCHS152A
Features
Two Enable Inputs to Facilitate Demultiplexing and
Cascading Functions
Fanout (Over Temperature Range)
- Standard Outputs. . . . . . . . . . . . . . . 10 LSTTL Loads
- Bus Driver Outputs . . . . . . . . . . . . . 15 LSTTL Loads
Wide Operating T emperature Range . . . -55oC to 125oC
Balanced Propagation Delay and Transition Times
Significant Power Reduction Compared to LSTTL
Logic ICs
HC Types
- 2V to 6V Operation
- High Noise Immunity: NIL = 30%, NIH = 30%of VCC at
VCC = 5V
HCT Types
- 4.5V to 5.5V Operation
- Direct LSTTL Input Logic Compatibility,
VIL= 0.8V (Max), VIH = 2V (Min)
- CMOS Input Compatibility, Il1µA at VOL, VOH
Description
The ’HC154 and ’HCT154 are 4-to-16 line
decoders/demultiplexers with two enable inputs, E1 and E2.
A High on either enable input forces the output into the High
state. The demultiplexing function is performed by using the
four input lines, A0 to A3, to select the output lines Y0 to
Y15, and using one enable as the data input while holding
the other enable low.
Pinout
CD54HC154, CD54HCT154
(CERDIP)
CD74HC154, CD74HCT154
(PDIP, SOIC)
TOP VIEW
Ordering Information
PART NUMBER TEMP. RANGE
(oC) PACKAGE
CD54HC154F3A -55 to 125 24 Ld CERDIP
CD74HC154E -55 to 125 24 Ld PDIP
CD74HC154EN -55 to 125 24 Ld PDIP
CD74HC154M -55 to 125 24 Ld SOIC
CD54HCT154F3A -55 to 125 24 Ld CERDIP
CD74HCT154E -55 to 125 24 Ld PDIP
CD74HCT154EN -55 to 125 24 Ld PDIP
CD74HCT154M -55 to 125 24 Ld SOIC
NOTES:
1. When ordering, use the entire part number. Add the suffix 96 to
obtain the variant in the tape and reel.
2. Waferor diefor thispart numberis availablewhich meetsall elec-
trical specifications. Please contact your local TI sales office or
customer service for ordering information.
1
2
3
4
5
6
7
8
9
10
11
12
Y0
Y1
Y2
Y3
Y4
Y5
Y6
Y7
Y8
Y9
Y10
GND
16
17
18
19
20
21
22
23
24
15
14
13
VCC
A1
A2
A3
E2
Y15
Y13
Y12
Y11
A0
E1
Y14
September 1997 - Revised May 2000
CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper IC Handling Procedures.
Copyright © 2000, Texas Instruments Incorporated
CD54/74HC154,
CD54/74HCT154
High Speed CMOS Logic
4-to-16 Line Decoder/Demultiplexer
[ /Title
(CD74
HC154
,
CD74
HCT15
4)
/
Sub-
j
ect
(High
Speed
CMOS
Logic
4-to-16
Line
Decod
er/Dem
2
Functional Diagram
TRUTH TABLE
INPUTS OUTPUTS
E1 E2 A3 A2 A1 A0 Y0 Y1 Y2 Y3 Y4 Y5 Y6 Y7 Y8 Y9 Y10 Y11 Y12 Y13 Y14 Y15
LLLLLLLHHHHHHHHHHHHHHH
LLLLLHHLHHHHHHHHHHHHHH
LLLLHLHHLHHHHHHHHHHHHH
LLLLHHHHHLHHHHHHHHHHHH
LLLHLLHHHHLHHHHHHHHHHH
LLLHLHHHHHHLHHHHHHHHHH
LLLHHLHHHHHHLHHHHHHHHH
LLLHHHHHHHHHHLHHHHHHHH
LLHLLLHHHHHHHHLHHHHHHH
LLLHLHHHHHHHHHHLHHHHHH
LLHLHLHHHHHHHHHHLHHHHH
LLHLHHHHHHHHHHHHHLHHHH
LLHHLLHHHHHHHHHHHHLHHH
LLHHLHHHHHHHHHHHHHHLHH
LLHHHLHHHHHHHHHHHHHHLH
LLHHHHHHHHHHHHHHHHHHHL
LHXXXXHHHHHHHHHHHHHHHH
HLXXXXHHHHHHHHHHHHHHHH
HHXXXXHHHHHHHHHHHHHHHH
NOTE: H = High Voltage Level, L = Low Voltage Level, X = Don’t Care
1
2
3
4
6
8
7
5
Y0
Y7
Y6
Y5
Y4
Y3
Y2
Y1
9Y8
10 Y9
11 Y10
GND = 12
VCC = 24
13
14
15
16
17
Y11
Y12
Y13
Y14
18
19
E1
E2
23
22
21
20
A1
A0
A2
A3
Y15
CD54/74HC154, CD54/74HCT154
3
Absolute Maximum Ratings Thermal Information
DC Supply Voltage, VCC . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 7V
DC Input Diode Current, IIK
For VI < -0.5V or VI > VCC + 0.5V. . . . . . . . . . . . . . . . . . . . . .±20mA
DC Output Diode Current, IOK
For VO < -0.5V or VO > VCC + 0.5V . . . . . . . . . . . . . . . . . . . .±20mA
DC Output Source or Sink Current per Output Pin, IO
For VO > -0.5V or VO < VCC + 0.5V . . . . . . . . . . . . . . . . . . . .±25mA
DC VCC or Ground Current, ICC or IGND . . . . . . . . . . . . . . . . . .±50mA
Operating Conditions
Temperature Range (TA) . . . . . . . . . . . . . . . . . . . . . -55oC to 125oC
Supply Voltage Range, VCC
HC Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2V to 6V
HCT Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4.5V to 5.5V
DC Input or Output Voltage, VI, VO . . . . . . . . . . . . . . . . . 0V to VCC
Input Rise and Fall Time
2V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1000ns (Max)
4.5V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500ns (Max)
6V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400ns (Max)
Thermal Resistance (Typical, Note 3) θJA (oC/W)
PDIP Package (.300). . . . . . . . . . . . . . . . . . . . . . . . 75
PDIP Package (.600). . . . . . . . . . . . . . . . . . . . . . . . 60
SOIC Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75
Maximum Junction Temperature. . . . . . . . . . . . . . . . . . . . . . . 150oC
Maximum Storage Temperature Range . . . . . . . . . .-65oC to 150oC
Maximum Lead Temperature (Soldering 10s). . . . . . . . . . . . .300oC
(SOIC - Lead Tips Only)
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation
of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
3. θJA is measured with the component mounted on an evaluation PC board in free air.
DC Electrical Specifications
PARAMETER SYMBOL
TEST
CONDITIONS VCC
(V)
25oC -40oC TO 85oC -55oC TO 125oC
UNITSVI(V) IO(mA) MIN TYP MAX MIN MAX MIN MAX
HC TYPES
High Level Input
Voltage VIH - - 2 1.5 - - 1.5 - 1.5 - V
4.5 3.15 - - 3.15 - 3.15 - V
6 4.2 - - 4.2 - 4.2 - V
Low Level Input
Voltage VIL - - 2 - - 0.5 - 0.5 - 0.5 V
4.5 - - 1.35 - 1.35 - 1.35 V
6 - - 1.8 - 1.8 - 1.8 V
High Level Output
Voltage
CMOS Loads
VOH VIH or VIL -0.02 2 1.9 - - 1.9 - 1.9 - V
-0.02 4.5 4.4 - - 4.4 - 4.4 - V
-0.02 6 5.9 - - 5.9 - 5.9 - V
High Level Output
Voltage
TTL Loads
- - ---- - - -V
-4 4.5 3.98 - - 3.84 - 3.7 - V
-5.2 6 5.48 - - 5.34 - 5.2 - V
Low Level Output
Voltage
CMOS Loads
VOL VIH or VIL 0.02 2 - - 0.1 - 0.1 - 0.1 V
0.02 4.5 - - 0.1 - 0.1 - 0.1 V
0.02 6 - - 0.1 - 0.1 - 0.1 V
Low Level Output
Voltage
TTL Loads
- - ---- - - -V
4 4.5 - - 0.26 - 0.33 - 0.4 V
5.2 6 - - 0.26 - 0.33 - 0.4 V
Input Leakage
Current IIVCC or
GND -6--±0.1 - ±1-±1µA
Quiescent Device
Current ICC VCC or
GND 0 6 - - 8 - 80 - 160 µA
CD54/74HC154, CD54/74HCT154
4
HCT TYPES
High Level Input
Voltage VIH - - 4.5 to
5.5 2--2 - 2 - V
Low Level Input
Voltage VIL - - 4.5 to
5.5 - - 0.8 - 0.8 - 0.8 V
High Level Output
Voltage
CMOS Loads
VOH VIH or VIL -0.02 4.5 4.4 - - 4.4 - 4.4 - V
High Level Output
Voltage
TTL Loads
-4 4.5 3.98 - - 3.84 - 3.7 - V
Low Level Output
Voltage
CMOS Loads
VOL VIH or VIL 0.02 4.5 - - 0.1 - 0.1 - 0.1 V
Low Level Output
Voltage
TTL Loads
4 4.5 - - 0.26 - 0.33 - 0.4 V
Input Leakage
Current IIVCC and
GND 0 5.5 - ±0.1 - ±1-±1µA
Quiescent Device
Current ICC VCC or
GND 0 5.5 - - 8 - 80 - 160 µA
Additional Quiescent
Device Current Per
Input Pin: 1 Unit Load
ICC VCC
-2.1 - 4.5 to
5.5 - 100 360 - 450 - 490 µA
NOTE: For dual-supply systems theoretical worst case (VI = 2.4V, VCC = 5.5V) specification is 1.8mA.
DC Electrical Specifications (Continued)
PARAMETER SYMBOL
TEST
CONDITIONS VCC
(V)
25oC -40oC TO 85oC -55oC TO 125oC
UNITSVI(V) IO(mA) MIN TYP MAX MIN MAX MIN MAX
HCT Input Loading Table
INPUT UNIT LOADS
A0 - A3 1.4
E1, E2 1.3
NOTE: Unit Load is ICC limit specified in DC Electrical Table, e.g.,
360µA max at 25oC.
Switching Specifications Input tr, tf = 6ns
PARAMETER SYMBOL TEST
CONDITIONS VCC (V)
25oC-40oC TO
85oC -55oC T O 125oC
UNITSMIN TYP MAX MIN MAX MIN MAX
HC TYPES
Propagation Delay (Figure 1) tPLH, tPHL CL= 50pF 2 - - 175 - 220 - 265 ns
Address to Output 4.5 - - 35 - 44 - 53 ns
CL=15pF 5 - 14 - - - - - ns
CL= 50pF 6 - - 30 - 37 - 45 ns
E1 to Output tPLH, tPHL CL= 50pF 2 - - 175 - 220 - 265 ns
4.5 - - 35 - 44 - 53 ns
CL=15pF 5 - 14 - - - - - ns
CL= 50pF 6 - - 30 - 37 - 45 ns
CD54/74HC154, CD54/74HCT154
5
E2 to Output tPLH, tPHL CL= 50pF 2 - - 175 - 220 - 265 ns
4.5 - - 35 - 44 - 53 ns
CL=15pF 5 - 14 - - - - - ns
CL= 50pF 6 - - 30 - 37 - 45 ns
Output Transition Time
(Figure 1) tTLH, tTHL CL= 50pF 2 - - 75 - 95 - 110 ns
4.5 - - 15 - 19 - 22 ns
6 - - 13 - 16 - 19 ns
Input Capacitance CIN - - - - 10 - 10 - 10 pF
Power Dissipation Capacitance
(Notes 4, 5) CPD -5-88-----pF
HCT TYPES
Propagation Delay (Figure 2) tPLH, tPHL
Address to Output CL= 50pF 4.5 - - 35 - 44 - 53 ns
CL=15pF 5 - 14 - - - - ns
E1 to Output tPLH, tPHL CL= 50pF 4.5 - - 34 - 43 - 51 ns
CL=15pF 5 - 14 - - - - - ns
E2 to Output tPLH, tPHL CL= 50pF 4.5 - 34 - 43 - 51 ns
CL=15pF 5 - 14 - - - - - ns
Output Transition Time tTLH, tTHL CL= 50pF 4.5 - - 15 - 19 - 22 ns
Input Capacitance CIN - - - - 10 - 10 - 10 pF
Power Dissipation Capacitance
(Notes 4, 5) CPD - 5 84 - - - - - pF
NOTES:
4. CPD is used to determine the dynamic power consumption, per gate.
5. PD = VCC2 fi(CPD + CL) where fi = input frequency, CL = output load capacitance, VCC = supply voltage.
Switching Specifications Input tr, tf = 6ns (Continued)
PARAMETER SYMBOL TEST
CONDITIONS VCC (V)
25oC-40oC TO
85oC -55oC T O 125oC
UNITSMIN TYP MAX MIN MAX MIN MAX
Test Circuits and Waveforms
FIGURE 1. HC AND HCU TRANSITION TIMES AND PROPAGA-
TION DELAY TIMES, COMBINATION LOGIC FIGURE 2. HCT TRANSITION TIMES AND PROPAGATION
DELAY TIMES, COMBINATION LOGIC
tPHL tPLH
tTHL tTLH
90%
50%
10%
50%
10%
INVERTING
OUTPUT
INPUT
GND
VCC
tr = 6ns tf = 6ns
90%
tPHL tPLH
tTHL tTLH
2.7V
1.3V
0.3V
1.3V
10%
INVERTING
OUTPUT
INPUT
GND
3V
tr = 6ns tf = 6ns
90%
CD54/74HC154, CD54/74HCT154
IMPORTANT NOTICE
Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue
any product or service without notice, and advise customers to obtain the latest version of relevant information
to verify, before placing orders, that information being relied on is current and complete. All products are sold
subject to the terms and conditions of sale supplied at the time of order acknowledgment, including those
pertaining to warranty, patent infringement, and limitation of liability.
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent
TI deems necessary to support this warranty . Specific testing of all parameters of each device is not necessarily
performed, except those mandated by government requirements.
Customers are responsible for their applications using TI components.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards must be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent
that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other
intellectual property right of TI covering or relating to any combination, machine, or process in which such
semiconductor products or services might be or are used. TI’s publication of information regarding any third
party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.
Copyright 2000, Texas Instruments Incorporated