SN74LVCHR16245A 16-BIT BUS TRANSCEIVER WITH 3-STATE OUTPUTS www.ti.com SCAS582P - NOVEMBER 1996 - REVISED DECEMBER 2005 FEATURES * * * * * * * * * * * * DGG, DGV, OR DL PACKAGE (TOP VIEW) Member of the Texas Instruments WidebusTM Family Operates From 1.65 V to 3.6 V Inputs Accept Voltages to 5.5 V Max tpd of 4.8 ns at 3.3 V Typical VOLP (Output Ground Bounce) <0.8 V at VCC = 3.3 V, TA = 25C Typical VOHV (Output VOH Undershoot) >2 V at VCC = 3.3 V, TA = 25C Supports Mixed-Mode Signal Operation on All Ports (5-V Input/Output Voltage With 3.3-V VCC) Bus Hold on Data Inputs Eliminates the Need for External Pullup/Pulldown Resistors All Outputs Have Equivalent 26- Series Resistors, So No External Resistors Are Required Ioff Supports Partial-Power-Down Mode Operation Latch-Up Performance Exceeds 250 mA Per JESD 17 ESD Protection Exceeds JESD 22 - 2000-V Human-Body Model (A114-A) - 200-V Machine Model (A115-A) 1DIR 1B1 1B2 GND 1B3 1B4 VCC 1B5 1B6 GND 1B7 1B8 2B1 2B2 GND 2B3 2B4 VCC 2B5 2B6 GND 2B7 2B8 2DIR 1 48 2 47 3 46 4 45 5 44 6 43 7 42 8 41 9 40 10 39 11 38 12 37 13 36 14 35 15 34 16 33 17 32 18 31 19 30 20 29 21 28 22 27 23 26 24 25 1OE 1A1 1A2 GND 1A3 1A4 VCC 1A5 1A6 GND 1A7 1A8 2A1 2A2 GND 2A3 2A4 VCC 2A5 2A6 GND 2A7 2A8 2OE DESCRIPTION/ORDERING INFORMATION This 16-bit (dual-octal) noninverting bus transceiver is designed for 1.65-V to 3.6-V VCC operation. The SN74LVCHR16245A is designed for asynchronous communication control-function implementation minimizes external-timing requirements. between data buses. The ORDERING INFORMATION PACKAGE (1) TA FBGA - GRD FBGA - ZRD (Pb-free) Tape and reel SSOP - DL Tape and reel TSSOP - DGG Tape and reel TVSOP - DGV Tape and reel -40C to 85C VFBGA - GQL VFBGA - ZQL (Pb-free) (1) Tape and reel ORDERABLE PART NUMBER 74LVCHR16245AGRDR 74LVCHR16245AZRDR SN74LVCHR16245ALR 74LVCHR16245ALRG4 SN74LVCHR16245AGR 74LVCHR16245AGRG4 SN74LVCHR16245AVR 74LVCHR16245AVRE4 SN74LVCHR16245AKR 74LVCHR16245AZQLR TOP-SIDE MARKING LR245A LVCHR16245A LVCHR16245A LDR245A LR245A Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines areavailable at www.ti.com/sc/package. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Widebus is a trademark of Texas Instruments. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright (c) 1996-2005, Texas Instruments Incorporated SN74LVCHR16245A 16-BIT BUS TRANSCEIVER WITH 3-STATE OUTPUTS www.ti.com SCAS582P - NOVEMBER 1996 - REVISED DECEMBER 2005 DESCRIPTION/ORDERING INFORMATION (CONTINUED) This device can be used as two 8-bit transceivers or one 16-bit transceiver. It allows data transmission from the A bus to the B bus or from the B bus to the A bus, depending on the logic level at the direction-control (DIR) input. The output-enable (OE) input can disable the device so that the buses are effectively isolated. All outputs, which are designed to sink up to 12 mA, include equivalent 26- series resistors to reduce overshoot and undershoot. Inputs can be driven from either 3.3-V or 5-V devices. This feature allows the use of this device as a translator in a mixed 3.3-V/5-V system environment. To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver. This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. Active bus-hold circuitry is provided to hold unused or floating data inputs at a valid logic level. Use of pullup or pulldown resistors with the bus-hold circuitry is not recommended. The bus-hold circuitry is part of the input circuit and is not disabled by OE or DIR. GQL OR ZQL PACKAGE (TOP VIEW) TERMINAL ASSIGNMENTS (1) (56-Ball GQL/ZQL Package) 1 2 3 4 5 6 A B C D E F G H J K xxxxx 1 2 3 4 6 A 1DIR NC NC NC NC 1OE B 1B2 1B1 GND GND 1A1 1A2 C 1B4 1B3 VCC VCC 1A3 1A4 D 1B6 1B5 GND GND 1A5 1A6 E 1B8 1B7 1A7 1A8 F 2B1 2B2 2A2 2A1 G2B3 2B4 GND 2A4 2A3 H 2B5 2B6 VCC VCC 2A6 2A5 J 2B7 2B8 GND GND 2A8 2A7 K 2DIR NC NC NC NC 2OE (1) GND NC - No internal connection GRD OR ZRD PACKAGE (TOP VIEW) 1 2 3 4 5 6 TERMINAL ASSIGNMENTS (1) (54-Ball GRD/ZRD Package) 1 2 3 4 5 6 A 1B1 NC 1DIR 1OE NC 1A1 B 1B3 1B2 NC NC 1A2 1A3 C 1B5 1B4 VCC VCC 1A4 1A5 D 1B7 1B6 GND GND 1A6 1A7 D E 2B1 1B8 GND GND 1A8 2A1 E F 2B3 2B2 GND GND 2A2 2A3 G 2B5 2B4 VCC VCC 2A4 2A5 H 2B7 2B6 NC NC 2A6 2A7 J 2B8 NC 2DIR 2OE NC 2A8 A B C F G H J (1) 2 5 NC - No internal connection SN74LVCHR16245A 16-BIT BUS TRANSCEIVER WITH 3-STATE OUTPUTS www.ti.com SCAS582P - NOVEMBER 1996 - REVISED DECEMBER 2005 FUNCTION TABLE (1) (EACH 8-BIT SECTION) CONTROL INPUTS (1) OUTPUT CIRCUITS OPERATION OE DIR A PORT B PORT L L Enabled Hi-Z B data to A bus L H Hi-Z Enabled A data to B bus H X Hi-Z Hi-Z Isolation Input circuits of the data I/Os always are active. LOGIC DIAGRAM (POSITIVE LOGIC) 1DIR 1 2DIR 48 1A1 25 1OE 47 2A1 2 To Seven Other Channels 24 2OE 36 13 1B1 2B1 To Seven Other Channels 3 SN74LVCHR16245A 16-BIT BUS TRANSCEIVER WITH 3-STATE OUTPUTS www.ti.com SCAS582P - NOVEMBER 1996 - REVISED DECEMBER 2005 Absolute Maximum Ratings (1) over operating free-air temperature range (unless otherwise noted) MIN MAX VCC Supply voltage range -0.5 6.5 V VI Input voltage range (2) -0.5 6.5 V -0.5 6.5 V -0.5 VCC + 0.5 state (2) UNIT VO Voltage range applied to any output in the high-impedance or power-off VO Voltage range applied to any output in the high or low state (2) (3) IIK Input clamp current VI < 0 -50 mA IOK Output clamp current VO < 0 -50 mA IO Continuous output current 50 mA 100 mA Continuous current through each VCC or GND JA Package thermal impedance (4) DGG package 70 DGV package 58 DL package 63 GQL/ZQL package 42 GRD/ZRD package Tstg (1) (2) (3) (4) Storage temperature range V C/W 36 -65 150 C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed. The value of VCC is provided in the recommended operating conditions table. The package thermal impedance is calculated in accordance with JESD 51-7. Recommended Operating Conditions (1) VCC Supply voltage VIH High-level input voltage Operating Data retention only VCC = 1.65 V to 1.95 V MIN MAX 1.65 3.6 1.5 Low-level input voltage VI 1.7 VCC = 2.7 V to 3.6 V 2 VO Output voltage IOH High-level output current 0.35 x VCC 0.7 VCC = 2.7 V to 3.6 V 0.8 0 5.5 High or low state 0 VCC 3-state 0 5.5 VCC = 1.65 V -2 VCC = 2.3 V -4 VCC = 2.7 V -8 VCC = 3 V IOL Low-level output current t/v Input transition rise or fall rate TA Operating free-air temperature 4 V V V mA -12 VCC = 1.65 V 2 VCC = 2.3 V 4 VCC = 2.7 V 8 VCC = 3 V (1) V VCC = 2.3 V to 2.7 V Input voltage V 0.65 x VCC VCC = 2.3 V to 2.7 V VCC = 1.65 V to 1.95 V VIL UNIT mA 12 -40 10 ns/V 85 C All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. SN74LVCHR16245A 16-BIT BUS TRANSCEIVER WITH 3-STATE OUTPUTS www.ti.com SCAS582P - NOVEMBER 1996 - REVISED DECEMBER 2005 Electrical Characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS VCC IOH = -100 A 1.65 V to 3.6 V IOH = -2 mA 2.3 V 1.7 2.7 V 2.2 IOH = -6 mA 3V 2.4 IOH = -8 mA 2.7 V 2 IOH = -12 mA 3V 2 IOL = 100 A 1.65 V to 3.6 V 0.2 1.65 V 0.45 2.3 V 0.7 IOL = 4 mA II 0.4 IOL = 6 mA 3V 0.55 IOL = 8 mA 2.7 V 0.6 IOL = 12 mA 3V 0.8 3.6 V 1.65 V VI = 1.07 V VI = 0.7 V A or B port 2.3 V VI = 1.7 V VI = 0.8 V 3V VI = 2 V VI = 0 to 3.6 V (3) Ioff VI or VO = 5.5 V IOZ (4) VO = 0 V or (VCC to 5.5 V) VI = VCC or GND ICC 3.6 V VI 5.5 V (5) ICC 5 V A (2) VI = 0.58 V II(hold) V 2.7 V Control inputs VI = 0 to 5.5 V UNIT VCC - 0.2 1.2 IOL = 2 mA VOL TYP (1) MAX 1.65 V IOH = -4 mA VOH MIN IO = 0 One input at VCC - 0.6 V, Other inputs at VCC or GND (2) 45 A -45 75 -75 3.6 V 500 0 10 A 2.3 V to 3.6 V 5 A 20 3.6 V 20 2.7 V to 3.6 V 500 A A Ci Control inputs VI = VCC or GND 3.3 V 3 pF Cio A or B port 3.3 V 12 pF (1) (2) (3) (4) (5) VO = VCC or GND All typical values are at VCC = 3.3 V, TA = 25C. This information was not available at the time of publication. This is the bus-hold maximum dynamic current. It is the minimum overdrive current required to switch the input from one state to another. For the total leakage current in an I/O port, please consult the II(hold) specification for the input voltage condition 0 V < VI < VCC, and the IOZ specification for the input voltage conditions VI = 0 V or VI = VCC to 5.5 V. The bus-hold current, at input voltages greater than VCC, is negligible. This applies in the disabled state only. 5 SN74LVCHR16245A 16-BIT BUS TRANSCEIVER WITH 3-STATE OUTPUTS www.ti.com SCAS582P - NOVEMBER 1996 - REVISED DECEMBER 2005 Switching Characteristics over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1) FROM (INPUT) TO (OUTPUT) tpd A or B ten OE tdis OE PARAMETER VCC = 1.8 V 0.15 V VCC = 2.5 V 0.2 V MIN MAX MIN B or A 1 12.5 A or B 1 15.8 A or B 1 19.2 VCC = 2.7 V VCC = 3.3 V 0.3 V UNIT MAX MIN MAX MIN MAX 1 9.5 1 5.7 1.5 4.8 ns 1 12.2 1 7.9 1.5 6.3 ns 1 11.9 1 8.3 2.2 7.4 ns Operating Characteristics TA = 25C TEST CONDITIONS PARAMETER Cpd (1) 6 Power dissipation capacitance per transceiver Outputs enabled Outputs disabled This information was not available at the time of publication. f = 10 MHz VCC = 1.8 V VCC = 2.5 V VCC = 3.3 V TYP TYP TYP (1) (1) 39 (1) (1) 4 UNIT pF SN74LVCHR16245A 16-BIT BUS TRANSCEIVER WITH 3-STATE OUTPUTS www.ti.com SCAS582P - NOVEMBER 1996 - REVISED DECEMBER 2005 PARAMETER MEASUREMENT INFORMATION VLOAD S1 RL From Output Under Test Open GND CL (see Note A) RL TEST S1 tPLH/tPHL tPLZ/tPZL tPHZ/tPZH Open VLOAD GND LOAD CIRCUIT INPUT VCC 1.8 V 0.15 V 2.5 V 0.2 V 2.7 V 3.3 V 0.3 V VI tr/tf VCC VCC 2.7 V 2.7 V 2 ns 2 ns 2.5 ns 2.5 ns VM VLOAD CL RL V VCC/2 VCC/2 1.5 V 1.5 V VCC VCC 6V 6V 30 pF 30 pF 50 pF 50 pF 1 k 500 500 500 0.15 V 0.15 V 0.3 V 0.3 V VI Timing Input VM 0V tw tsu th VI VM Input VM VI VM Data Input VM 0V 0V VOLTAGE WAVEFORMS PULSE DURATION VOLTAGE WAVEFORMS SETUP AND HOLD TIMES VI VM Input VM 0V tPHL tPLH VOH VM Output VM VOL tPHL VM VOL VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES INVERTING AND NONINVERTING OUTPUTS VM VM 0V tPZL tPLZ VLOAD/2 VM tPZH VOH Output Output Waveform 1 S1 at VLOAD (see Note B) tPLH VM VI Output Control Output Waveform 2 S1 at GND (see Note B) VOL + V VOL tPHZ VM VOH - V VOH 0 V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES LOW- AND HIGH-LEVEL ENABLING NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR 10 MHz, ZO = 50 . D. The outputs are measured one at a time, with one transition per measurement. E. tPLZ and tPHZ are the same as tdis. F. tPZL and tPZH are the same as ten. G. tPLH and tPHL are the same as tpd. H. All parameters and waveforms are not applicable to all devices. Figure 1. Load Circuit and Voltage Waveforms 7 PACKAGE OPTION ADDENDUM www.ti.com 4-May-2012 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish SNPB MSL Peak Temp (3) Samples (Requires Login) 74LVCHR16245AGRDR LIFEBUY BGA MICROSTAR JUNIOR GRD 54 1000 TBD Level-1-240C-UNLIM 74LVCHR16245AGRG4 ACTIVE TSSOP DGG 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74LVCHR16245ALRG4 ACTIVE SSOP DL 48 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74LVCHR16245AVRE4 ACTIVE TVSOP DGV 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74LVCHR16245AVRG4 ACTIVE TVSOP DGV 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74LVCHR16245AZQLR ACTIVE BGA MICROSTAR JUNIOR ZQL 56 1000 Green (RoHS & no Sb/Br) SNAGCU Level-1-260C-UNLIM 74LVCHR16245AZRDR ACTIVE BGA MICROSTAR JUNIOR ZRD 54 1000 Green (RoHS & no Sb/Br) SNAGCU Level-1-260C-UNLIM SN74LVCHR16245AGR ACTIVE TSSOP DGG 48 2000 Green (RoHS & no Sb/Br) SN74LVCHR16245AKR LIFEBUY BGA MICROSTAR JUNIOR GQL 56 1000 TBD SN74LVCHR16245ALR ACTIVE SSOP DL 48 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVCHR16245AVR ACTIVE TVSOP DGV 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM SNPB Level-1-240C-UNLIM (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 4-May-2012 TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 23-Jul-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 74LVCHR16245AGRDR BGA MI CROSTA R JUNI OR GRD 54 1000 330.0 16.4 5.8 8.3 1.55 8.0 16.0 Q1 74LVCHR16245AZQLR BGA MI CROSTA R JUNI OR ZQL 56 1000 330.0 16.4 4.8 7.3 1.5 8.0 16.0 Q1 74LVCHR16245AZRDR BGA MI CROSTA R JUNI OR ZRD 54 1000 330.0 16.4 5.8 8.3 1.55 8.0 16.0 Q1 SN74LVCHR16245AGR TSSOP DGG 48 2000 330.0 24.4 8.6 15.8 1.8 12.0 24.0 Q1 SN74LVCHR16245AKR BGA MI CROSTA R JUNI OR GQL 56 1000 330.0 16.4 4.8 7.3 1.45 8.0 16.0 Q1 SN74LVCHR16245ALR SSOP DL 48 1000 330.0 32.4 11.35 16.2 3.1 16.0 32.0 Q1 SN74LVCHR16245AVR TVSOP DGV 48 2000 330.0 16.4 7.1 10.2 1.6 12.0 16.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 23-Jul-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) 74LVCHR16245AGRDR BGA MICROSTAR JUNIOR GRD 54 1000 333.2 345.9 28.6 74LVCHR16245AZQLR BGA MICROSTAR JUNIOR ZQL 56 1000 333.2 345.9 28.6 74LVCHR16245AZRDR BGA MICROSTAR JUNIOR ZRD 54 1000 333.2 345.9 28.6 SN74LVCHR16245AGR TSSOP DGG 48 2000 367.0 367.0 45.0 SN74LVCHR16245AKR BGA MICROSTAR JUNIOR GQL 56 1000 333.2 345.9 28.6 SN74LVCHR16245ALR SSOP DL 48 1000 367.0 367.0 55.0 SN74LVCHR16245AVR TVSOP DGV 48 2000 367.0 367.0 38.0 Pack Materials-Page 2 MECHANICAL DATA MPDS006C - FEBRUARY 1996 - REVISED AUGUST 2000 DGV (R-PDSO-G**) PLASTIC SMALL-OUTLINE 24 PINS SHOWN 0,40 0,23 0,13 24 13 0,07 M 0,16 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 0-8 1 0,75 0,50 12 A Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,08 14 16 20 24 38 48 56 A MAX 3,70 3,70 5,10 5,10 7,90 9,80 11,40 A MIN 3,50 3,50 4,90 4,90 7,70 9,60 11,20 DIM 4073251/E 08/00 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side. Falls within JEDEC: 24/48 Pins - MO-153 14/16/20/56 Pins - MO-194 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 MECHANICAL DATA MSSO001C - JANUARY 1995 - REVISED DECEMBER 2001 DL (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 48 PINS SHOWN 0.025 (0,635) 0.0135 (0,343) 0.008 (0,203) 48 0.005 (0,13) M 25 0.010 (0,25) 0.005 (0,13) 0.299 (7,59) 0.291 (7,39) 0.420 (10,67) 0.395 (10,03) Gage Plane 0.010 (0,25) 1 0-8 24 0.040 (1,02) A 0.020 (0,51) Seating Plane 0.110 (2,79) MAX 0.004 (0,10) 0.008 (0,20) MIN PINS ** 28 48 56 A MAX 0.380 (9,65) 0.630 (16,00) 0.730 (18,54) A MIN 0.370 (9,40) 0.620 (15,75) 0.720 (18,29) DIM 4040048 / E 12/01 NOTES: A. B. C. D. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15). Falls within JEDEC MO-118 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 MECHANICAL DATA MTSS003D - JANUARY 1995 - REVISED JANUARY 1998 DGG (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 48 PINS SHOWN 0,27 0,17 0,50 48 0,08 M 25 6,20 6,00 8,30 7,90 0,15 NOM Gage Plane 1 0,25 24 0- 8 A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 48 56 64 A MAX 12,60 14,10 17,10 A MIN 12,40 13,90 16,90 DIM 4040078 / F 12/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold protrusion not to exceed 0,15. Falls within JEDEC MO-153 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as "components") are sold subject to TI's terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI's terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers' products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers' products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI's goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or "enhanced plastic" are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components which meet ISO/TS16949 requirements, mainly for automotive use. Components which have not been so designated are neither designed nor intended for automotive use; and TI will not be responsible for any failure of such components to meet such requirements. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP(R) Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Mobile Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright (c) 2012, Texas Instruments Incorporated