TLV717 SBVS176 - OCTOBER 2011 www.ti.com 150 mA, Low IQ, Low-Dropout Regulator for Portables Check for Samples: TLV717 FEATURES DESCRIPTION * * * * The TLV717xx series of low-dropout (LDO) linear regulators are low quiescent current LDOs with excellent line and load transient performance and are designed for power-sensitive applications. These devices provide a typical accuracy of 0.5%. 2 * * * * Very Low Dropout: 250 mV at 150 mA Accuracy: 0.5% (typical) Low IQ: 35 A Available in Fixed-Output Voltages: 1.2 V to 5.0 V High PSRR: - 70 dB at 1 kHz - 50 dB at 1 MHz Stable with Effective Output Capacitance: 0.1 F Foldback Current Limit Package: 1-mm x 1-mm DFN (1) See the Package Option Addendum at the end of this document for a complete list of available voltage options. (2) See the Input and Output Capacitor Requirements section in the Application Information for more details. APPLICATIONS * * * Wireless Handsets, Smart Phones, PDAs MP3 Players Other Hand-Held Products TLV717x 1-mm x 1-mm DQN (Bottom View) EN IN GND OUT The TLV717xx series offer current foldback which throttles down the output current with a decrease in load resistance. The typical value at which current foldback kicks in is 350 mA; the typical value of the output short current limit value is 40 mA. Furthermore, these devices are stable with an effective output capacitance of only 0.1 F. This feature enables the use of cost-effective capacitors that have higher bias voltages and temperature derating. The devices regulate to specified accuracy with no output load. The TLV717xx series is available in a 1-mm x 1-mm DQN package that makes them ideal for hand-held applications. The TLV717xxP provides an active pull-down circuit to quickly discarge output loads. Typical Application Circuit VIN IN OUT CIN COUT VOUT 1 mF Ceramic TLV717 Series On Off EN GND 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. Copyright (c) 2011, Texas Instruments Incorporated PRODUCT PREVIEW 1 TLV717 SBVS176 - OCTOBER 2011 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. ORDERING INFORMATION (1) PRODUCT VOUT TLV717xx(x) P yyy z (1) XX(X) is nominal output voltage. For output voltages with a resolution of 100 mV, two digits are used in the ordering number; otherwise, three digits are used (for example, 28 = 2.8 V; 475 = 4.75 V). P is optional; devices with P have an LDO regulator with an active output discharge. YYY is package designator. Z is package quantity. R is for reel (3000 pieces), T is for tape (250 pieces). For the most current package and ordering information see the Package Option Addendum at the end of this document, or visit the device product folder on www.ti.com. ABSOLUTE MAXIMUM RATINGS (1) At TJ = -25C, unless otherwise noted. All voltages are with respect to GND. VALUE PRODUCT PREVIEW Voltage Current MIN MAX Input range, VIN -0.3 6.0 V Enable range, VEN -0.3 VIN + 0.3 V Output range, VOUT -0.3 6.0 V Maximum output, IOUT Internally limited Output short-circuit duration Indefinite Continuous total power dissipation, PDISS Temperature Electrostatic discharge rating (1) UNIT See Thermal Information table Junction range, TJ -55 +150 C Storage junction range, Tstg -55 +150 C 2000 V 500 V Human body model (HBM) Charged device model (CDM) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated is not implied. Exposure to absolute-maximum rated conditions for extended periods may affect device reliability. THERMAL INFORMATION TLV71713PDQN THERMAL METRIC (1) DQN UNITS 4 PINS JA Junction-to-ambient thermal resistance 393.3 JC(top) Junction-to-case(top) thermal resistance 140.3 JB Junction-to-board thermal resistance 330 JT Junction-to-top characterization parameter 6.5 JB Junction-to-board characterization parameter 329 JC(bottom) Junction-to-case(bottom) thermal resistance N/A (1) 2 C/W For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. Submit Documentation Feedback Copyright (c) 2011, Texas Instruments Incorporated Product Folder Link(s): TLV717 TLV717 SBVS176 - OCTOBER 2011 www.ti.com ELECTRICAL CHARACTERISTICS At operating temperature range (TA = -40C to +85C), TA = +25C, VIN = VOUT(NOM) + 0.5 V or 1.7 V (whichever is greater), IOUT = 10 mA, VEN = VIN, and COUT = 1 F, unless otherwise noted. TLV717 TEST CONDITIONS MIN TYP MAX UNIT Input voltage range 1.7 5.5 V VOUT Output voltage range 1.2 5.0 V IOUT Output current 150 TA = +25C DC output accuracy mA 0.5 VOUT 1.2 V, -40C TA +85C -1.5 % +1.5 VOUT 1.2 V % 25 mV 1 5 mV 10 20 mV 1.2 V VOUT < 1.8 V 330 450 mV 1.8 V VOUT 5.0 V VO/VIN Line regulation VOUT(NOM) + 0.5 V VIN 5.5 V VO/IOUT Load regulation 0 mA IOUT 150 mA VDO Dropout voltage VIN = 0.98 x VOUT(NOM), IOUT = 150 mA 215 350 mV IGND Ground pin current IOUT = 0 mA 35 55 A ISHDN Shutdown current VEN 0.4 V, 2.0 V VIN 4.5 V 0.1 0.5 A PSRR Power-supply rejection ratio VIN = 2.3 V, VOUT = 1.8 V, IOUT = 10 mA f = 10 Hz 75 dB f = 100 Hz 75 dB f = 1 kHz 75 dB f = 10 kHz 60 dB f = 100 kHz 50 dB 55 VRMS VNOISE Output noise voltage BW = 100 Hz to 100 kHz, VIN = 2.3 V, VOUT = 1.8 V, IOUT = 10 mA tSTR Startup time COUT = 1.0 F, IOUT = 150 mA ISC Short current limit VIN = min (VOUT(NOM) + 1 V, 5.5 V), VOUT = 0 V VHI Enable high (enabled) VLO Enable low (disabled) IEN EN pin current RPULLDOWN Pull-down resistor (TLV717P only) UVLO Undervoltage lockout TJ Operating junction temperature range 100 s 40 mA 0.9 VIN 0 EN = 5.5 V VIN rising -40 0.4 Product Folder Link(s): TLV717 V A 120 1.6 V Submit Documentation Feedback Copyright (c) 2011, Texas Instruments Incorporated V 0.01 +125 PRODUCT PREVIEW PARAMETER VIN C 3 TLV717 SBVS176 - OCTOBER 2011 www.ti.com DEVICE INFORMATION FUNCTIONAL BLOCK DIAGRAMS IN OUT Foldback Current Limit UVLO EN Bandgap PRODUCT PREVIEW LOGIC TLV717xx GND Figure 1. TLV717xx Block Diagram IN OUT Foldback Current Limit UVLO EN 120 W Bandgap LOGIC TLV717xxP GND Figure 2. TLV717xxP Block Diagram 4 Submit Documentation Feedback Copyright (c) 2011, Texas Instruments Incorporated Product Folder Link(s): TLV717 TLV717 SBVS176 - OCTOBER 2011 www.ti.com PIN CONFIGURATIONS DQN PACKAGE 1-mm x 1-mm TBD (Top View) IN EN 4 3 1 2 OUT GND DQN PACKAGE 1-mm x 1-mm TBD (Bottom View) EN IN 3 4 2 1 GND OUT PIN DESCRIPTIONS PIN NAME DESCRIPTION 1 OUT Regulated output voltage pin. A small 1-F ceramic capacitor is needed from this pin to ground to assure stability. See the Input and Output Capacitor Requirements section in the Application Information for more details. 2 GND Ground pin 3 EN Enable pin. Driving EN over 1.2 V turns on the regulator. Driving EN below 0.4 V puts the regulator into shutdown mode. 4 IN Input pin. A small capacitor is needed from this pin to ground to assure stability. See the Input and Output Capacitor Requirements section in the Application Information for more details. -- Thermal pad This pin can be left open or tied to any voltage between GND and IN. It is recommended to connect this pin to GND to minimize noise and maximize thermal performance. Submit Documentation Feedback Copyright (c) 2011, Texas Instruments Incorporated Product Folder Link(s): TLV717 PRODUCT PREVIEW NO. 5 TLV717 SBVS176 - OCTOBER 2011 www.ti.com TYPICAL CHARACTERISTICS At operating temperature range (TA = -40C to +85C), TA = +25C, VIN = VOUT(NOM) + 0.5 V or 1.7 V (whichever is greater), IOUT = 10 mA, VEN = VIN, and COUT = 1 F, unless otherwise noted. LOAD REGULATION LINE REGULATION 2.9 2.88 2.88 2.86 2.86 Output Voltage (V) 2.9 VOUT (V) 2.84 2.82 2.8 2.78 2.76 +85C +25C -40C 2.74 2.72 IOUT = 10 mA 2.84 2.82 2.8 2.78 2.76 +85C +25C -40C 2.74 2.72 2.7 2.7 20 0 40 60 80 100 120 140 160 180 200 IOUT (mA) 3.5 3 4 G001 Figure 3. PRODUCT PREVIEW VOUT = 5.0 V Dropout Voltage (V) Output Voltage (V) 2.84 2.82 2.8 2.78 2.76 +85C +25C -40C 2.74 2.72 0.25 0.2 0.15 +85C +25C -40C 0.1 2.7 3.5 3 4 4.5 5 5.5 Input Voltage (V) 1.5 2 2.5 3 3.5 4 5 4.5 Input Voltage (V) G003 Figure 5. G004 Figure 6. DROPOUT VOLTAGE vs OUTPUT CURRENT OUTPUT VOLTAGE vs TEMPERATURE 0.3 2.838 2.828 Output Voltage (V) 0.25 Dropout Voltage (V) G002 DROPOUT VOLTAGE vs INPUT VOLTAGE 2.86 0.2 0.15 0.1 2.818 2.808 2.798 2.788 2.778 +85C +25C -40C 0.05 10 mA 150 mA 2.768 0 2.758 50 60 70 80 90 100 110 120 130 140 150 Output Current (mA) -40 -27.5 -15 -2.5 G005 Figure 7. 6 5.5 0.3 IOUT = 150 mA 2.88 5 Figure 4. LINE REGULATION 2.9 4.5 Input Voltage (V) 10 22.5 35 Temperature (C) 47.5 60 72.5 85 G006 Figure 8. Submit Documentation Feedback Copyright (c) 2011, Texas Instruments Incorporated Product Folder Link(s): TLV717 TLV717 SBVS176 - OCTOBER 2011 www.ti.com TYPICAL CHARACTERISTICS (continued) At operating temperature range (TA = -40C to +85C), TA = +25C, VIN = VOUT(NOM) + 0.5 V or 1.7 V (whichever is greater), IOUT = 10 mA, VEN = VIN, and COUT = 1 F, unless otherwise noted. GROUND PIN CURRENT vs INPUT VOLTAGE 45 Ground Pin Current (mA) IOUT = 0 mA 40 35 30 25 20 15 10 +85C +25C -40C 5 2500 2000 1500 1000 +85C +25C -40C 500 0 0 3 3.5 4 4.5 5.5 5 Input Voltage (V) 0 25 50 Figure 9. G008 2.5 35 30 25 20 15 10 2 1.5 1 +85C +25C -40C 0.5 5 0 0 -40 -27.5 -15 -2.5 10 22.5 35 47.5 60 85 72.5 Temperature (C) 0 50 100 150 200 250 300 350 Output Current (mA) G009 G010 Figure 11. Figure 12. TLV71728 PSRR vs FREQUENCY TLV71728 PSRR vs FREQUENCY 80 80 Power-Supply Rejection Ratio (dB) Power-Supply Rejection Ratio (dB) 150 OUTPUT VOLTAGE vs OUTPUT CURRENT Output Voltage (V) Ground Pin Current (mA) 125 3 IOUT = 0 mA 40 100 Figure 10. GROUND PIN CURRENT vs TEMPERATURE 45 75 Output Current (mA) G007 PRODUCT PREVIEW Ground Pin Current (mA) GROUND PIN CURRENT vs OUTPUT CURRENT 3000 70 60 50 40 30 20 IOUT = 30 mA IOUT = 150 mA 10 VIN - VOUT = 0.5 V 0 70 60 50 40 30 20 IOUT = 30 mA IOUT = 150 mA 10 VIN - VOUT = 1 V 0 10 100 1k 10k 100k Frequency (Hz) 1M 10M 10 G011 Figure 13. 100 1k 10k 100k 1M 10M Frequency (Hz) G012 Figure 14. Submit Documentation Feedback Copyright (c) 2011, Texas Instruments Incorporated Product Folder Link(s): TLV717 7 TLV717 SBVS176 - OCTOBER 2011 www.ti.com TYPICAL CHARACTERISTICS (continued) At operating temperature range (TA = -40C to +85C), TA = +25C, VIN = VOUT(NOM) + 0.5 V or 1.7 V (whichever is greater), IOUT = 10 mA, VEN = VIN, and COUT = 1 F, unless otherwise noted. PSRR vs INPUT VOLTAGE OUTPUT SPECTRAL NOISE DENSITY vs FREQUENCY 10 80 Noise Spectral Density (mV/OHz) Power-Supply Rejection Ratio (dB) 90 70 60 50 40 30 1 kHz 10 kHz 100 kHz 20 10 1 0.1 0.01 1.2 2.8 5 0 0 3.6 3.7 3.8 3.9 4 Input Voltage (V) 4.1 4.2 4.3 10 G013 Figure 15. 100 1k 10k 100k Frequency (Hz) 1M 10M G014 Figure 16. PRODUCT PREVIEW 8 Submit Documentation Feedback Copyright (c) 2011, Texas Instruments Incorporated Product Folder Link(s): TLV717 TLV717 SBVS176 - OCTOBER 2011 www.ti.com APPLICATION INFORMATION The TLV717xx belongs to a new family of next-generation value LDO regulators. These devices consume low quiescent current and deliver excellent line and load transient performance. These characteristics, combined with low noise, very good PSRR with little (VIN - VOUT) headroom, make this family of devices ideal for RF portable applications. This family of regulators offers current foldback. Operating junction temperature of the device is -40C to +125C. X5R- and X7R-type ceramic capacitors are recommended because these capacitors have minimal variation in value and equivalent series resistance (ESR) over temperature. The TLV717xx is designed to be stable with an effective capacitance of 0.1 F or larger at the output, though a 1-F ceramic capacitor is recommended for typical applications. Thus, the device is stable with capacitors of other dielectric types as well, as long as the effective capacitance under operating bias voltage and temperature is greater than 0.1 F. This effective capacitance refers to the capacitance that the LDO sees under operating bias voltage and temperature conditions; that is, the capacitance after taking both bias voltage and temperature derating into consideration. In addition to allowing the use of cheaper dielectrics, this capability of being stable with 0.1-F effective capacitance also enables the use of smaller footprint capacitors that have higher derating in size- and space-constrained applications. Note that using a 0.1-F rated capacitor at the output of the LDO does not ensure stability because the effective capacitance under the specified operating conditions would be less than 0.1 F. Maximum ESR should be less than 200 m. Although an input capacitor is not required for stability, it is good analog design practice to connect a 0.1-F to 1.0-F, low ESR capacitor across the IN pin and GND pin of the regulator. This capacitor counteracts reactive input sources and improves transient response, noise rejection, and ripple rejection. A higher-value capacitor may be necessary if large, fast, rise-time load transients are anticipated, or if the device is not located close to the power source. If source impedance is more than 2 , a 0.1-F input capacitor may be necessary to ensure stability. BOARD LAYOUT RECOMMENDATIONS TO IMPROVE PSRR AND NOISE PERFORMANCE Input and output capacitors should be placed as close to the device pins as possible. To improve ac performance such as PSRR, output noise, and transient response, it is recommended that the board be designed with separate ground planes for VIN and VOUT, with the ground plane connected only at the GND pin of the device. In addition, the ground connection for the output capacitor should be connected directly to the GND pin of the device. High ESR capacitors may degrade PSRR performance. INTERNAL CURRENT LIMIT The TLV717xx has an internal foldback current limit that helps to protect the regulator during fault conditions. The current supplied by the device is gradually throttled down as the output voltage decreases. When the output is shorted, the LDO supplies a typical current of 40 mA. Output voltage is not regulated when the device is in current limit, and is VOUT = ILIMIT x RLOAD. The advantage of foldback current limit is that the ILIMIT value is less than the fixed current limit. Therefore, the power that the PMOS pass transistor dissipates (VIN - VOUT) x ILIMIT is much less. The PMOS pass element in the TLV717xx has a built-in body diode that conducts current when the voltage at OUT exceeds the voltage at IN. This current is not limited, so if extended reverse voltage operation is anticipated, external limiting to 5% of the rated output current is recommended. SHUTDOWN The enable pin (EN) is active high. The device is enabled when the voltage at the EN pin goes above 0.9 V. This relatively lower value of voltage that is required to turn the LDO on can be exploited to power the LDO with a GPIO of recent processors whose GPIO logic 1 voltage level is lower than traditional microcontrollers. The device is turned off when the EN pin is held at less than 0.4 V. When shutdown capability is not required, EN can be connected to the IN pin. Submit Documentation Feedback Copyright (c) 2011, Texas Instruments Incorporated Product Folder Link(s): TLV717 9 PRODUCT PREVIEW INPUT AND OUTPUT CAPACITOR REQUIREMENTS TLV717 SBVS176 - OCTOBER 2011 www.ti.com DROPOUT VOLTAGE The TLV717xx uses a PMOS pass transistor to achieve low dropout. When (VIN - VOUT) is less than the dropout voltage (VDO), the PMOS pass device is in the linear region of operation and the input-to-output resistance is the RDS(ON) of the PMOS pass element. VDO scales approximately with output current because the PMOS device behaves as a resistor in dropout. As with any linear regulator, PSRR and transient response are degraded as (VIN - VOUT) approaches dropout. TRANSIENT RESPONSE As with any regulator, increasing the size of the output capacitor reduces over-/undershoot magnitude but increases the duration of the transient response. UNDERVOLTAGE LOCKOUT (UVLO) The TLV717xx uses an undervoltage lockout circuit (UVLO = 1.6 V) to keep the output shut off until internal circuitry is operating properly. POWER DISSIPATION PRODUCT PREVIEW The ability to remove heat from the die is different for each package type, presenting different considerations in the printed circuit board (PCB) layout. The PCB area around the device that is free of other components moves the heat from the device to ambient air. Performance data for JEDEC low and high-K boards are given in the Thermal Information table. Using heavier copper increases the effectiveness in removing heat from the device. The addition, plated through-holes to heat-dissipating layers also improves heatsink effectiveness. Power dissipation depends on input voltage and load conditions. Power dissipation (PD) is equal to the product of the output current and the voltage drop across the output pass element, as shown in Equation 1. PD = (VIN - VOUT) x IOUT 10 (1) Submit Documentation Feedback Copyright (c) 2011, Texas Instruments Incorporated Product Folder Link(s): TLV717 PACKAGE OPTION ADDENDUM www.ti.com 11-Sep-2012 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp ACTIVE X2SON DQN 4 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV71712PDQNT ACTIVE X2SON DQN 4 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV71713PDQNR ACTIVE X2SON DQN 4 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV71713PDQNT ACTIVE X2SON DQN 4 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV71715PDQNR ACTIVE X2SON DQN 4 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV71715PDQNT ACTIVE X2SON DQN 4 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV71718PDBVR PREVIEW SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV71718PDBVT PREVIEW SOT-23 DBV 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV71718PDQNR ACTIVE X2SON DQN 4 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV71718PDQNT ACTIVE X2SON DQN 4 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV71721PDQNR PREVIEW X2SON DQN 4 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV71721PDQNT PREVIEW X2SON DQN 4 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV71727PDQNR PREVIEW X2SON DQN 4 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV71727PDQNT PREVIEW X2SON DQN 4 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV717285PDQNT ACTIVE X2SON DQN 4 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV717285PQNR PREVIEW X2SON DQN 5 3000 TBD TLV71728PDQNR ACTIVE X2SON DQN 4 3000 Green (RoHS & no Sb/Br) Addendum-Page 1 Samples (Requires Login) TLV71712PDQNR Call TI (3) Call TI CU NIPDAU Level-1-260C-UNLIM PACKAGE OPTION ADDENDUM www.ti.com Orderable Device 11-Sep-2012 Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp TLV71728PDQNT ACTIVE X2SON DQN 4 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV71729PDQNR PREVIEW X2SON DQN 4 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV71729PDQNT PREVIEW X2SON DQN 4 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV71730PDBVR PREVIEW SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV71730PDBVT PREVIEW SOT-23 DBV 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV71730PDQNR ACTIVE X2SON DQN 4 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV71730PDQNT ACTIVE X2SON DQN 4 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV71733PDBVR PREVIEW SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV71733PDBVT PREVIEW SOT-23 DBV 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV71733PDQNR ACTIVE X2SON DQN 4 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV71733PDQNT ACTIVE X2SON DQN 4 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV71736PDBVR PREVIEW SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV71736PDBVT PREVIEW SOT-23 DBV 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV71736PDQNR ACTIVE X2SON DQN 4 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV71736PDQNT ACTIVE X2SON DQN 4 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. Addendum-Page 2 (3) Samples (Requires Login) PACKAGE OPTION ADDENDUM www.ti.com 11-Sep-2012 (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 3 PACKAGE MATERIALS INFORMATION www.ti.com 31-Aug-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant TLV71712PDQNR X2SON DQN 4 3000 180.0 9.5 1.16 1.16 0.63 4.0 8.0 Q2 TLV71712PDQNR X2SON DQN 4 3000 180.0 8.4 1.16 1.16 0.63 4.0 8.0 Q2 TLV71712PDQNT X2SON DQN 4 250 180.0 8.4 1.16 1.16 0.63 4.0 8.0 Q2 TLV71712PDQNT X2SON DQN 4 250 180.0 9.5 1.16 1.16 0.63 4.0 8.0 Q2 TLV71713PDQNR X2SON DQN 4 3000 180.0 8.4 1.16 1.16 0.63 4.0 8.0 Q2 TLV71713PDQNR X2SON DQN 4 3000 180.0 9.5 1.16 1.16 0.63 4.0 8.0 Q2 TLV71713PDQNT X2SON DQN 4 250 180.0 8.4 1.16 1.16 0.63 4.0 8.0 Q2 TLV71713PDQNT X2SON DQN 4 250 180.0 9.5 1.16 1.16 0.63 4.0 8.0 Q2 TLV71715PDQNR X2SON DQN 4 3000 180.0 8.4 1.16 1.16 0.63 4.0 8.0 Q2 TLV71715PDQNR X2SON DQN 4 3000 180.0 9.5 1.16 1.16 0.63 4.0 8.0 Q2 TLV71715PDQNT X2SON DQN 4 250 180.0 9.5 1.16 1.16 0.63 4.0 8.0 Q2 TLV71715PDQNT X2SON DQN 4 250 180.0 8.4 1.16 1.16 0.63 4.0 8.0 Q2 TLV71718PDQNR X2SON DQN 4 3000 180.0 8.4 1.16 1.16 0.63 4.0 8.0 Q2 TLV71718PDQNR X2SON DQN 4 3000 180.0 9.5 1.16 1.16 0.63 4.0 8.0 Q2 TLV71718PDQNT X2SON DQN 4 250 180.0 9.5 1.16 1.16 0.63 4.0 8.0 Q2 TLV71718PDQNT X2SON DQN 4 250 180.0 8.4 1.16 1.16 0.63 4.0 8.0 Q2 TLV717285PDQNT X2SON DQN 4 250 180.0 9.5 1.16 1.16 0.63 4.0 8.0 Q2 TLV717285PDQNT X2SON DQN 4 250 180.0 8.4 1.16 1.16 0.63 4.0 8.0 Q2 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 31-Aug-2012 Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant TLV71728PDQNR X2SON DQN 4 3000 180.0 8.4 1.16 1.16 0.63 4.0 8.0 Q2 TLV71728PDQNR X2SON DQN 4 3000 180.0 9.5 1.16 1.16 0.63 4.0 8.0 Q2 TLV71728PDQNT X2SON DQN 4 250 180.0 9.5 1.16 1.16 0.63 4.0 8.0 Q2 TLV71728PDQNT X2SON DQN 4 250 180.0 8.4 1.16 1.16 0.63 4.0 8.0 Q2 TLV71730PDQNR X2SON DQN 4 3000 180.0 9.5 1.16 1.16 0.63 4.0 8.0 Q2 TLV71730PDQNR X2SON DQN 4 3000 180.0 8.4 1.16 1.16 0.63 4.0 8.0 Q2 TLV71730PDQNT X2SON DQN 4 250 180.0 9.5 1.16 1.16 0.63 4.0 8.0 Q2 TLV71730PDQNT X2SON DQN 4 250 180.0 8.4 1.16 1.16 0.63 4.0 8.0 Q2 TLV71733PDQNR X2SON DQN 4 3000 180.0 8.4 1.16 1.16 0.63 4.0 8.0 Q2 TLV71733PDQNR X2SON DQN 4 3000 180.0 9.5 1.16 1.16 0.63 4.0 8.0 Q2 TLV71733PDQNT X2SON DQN 4 250 180.0 9.5 1.16 1.16 0.63 4.0 8.0 Q2 TLV71733PDQNT X2SON DQN 4 250 180.0 8.4 1.16 1.16 0.63 4.0 8.0 Q2 TLV71736PDQNR X2SON DQN 4 3000 180.0 9.5 1.16 1.16 0.63 4.0 8.0 Q2 TLV71736PDQNT X2SON DQN 4 250 180.0 9.5 1.16 1.16 0.63 4.0 8.0 Q2 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TLV71712PDQNR X2SON DQN 4 3000 180.0 180.0 30.0 TLV71712PDQNR X2SON DQN 4 3000 202.0 201.0 28.0 TLV71712PDQNT X2SON DQN 4 250 202.0 201.0 28.0 Pack Materials-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 31-Aug-2012 Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TLV71712PDQNT X2SON DQN 4 250 180.0 180.0 30.0 TLV71713PDQNR X2SON DQN 4 3000 202.0 201.0 28.0 TLV71713PDQNR X2SON DQN 4 3000 180.0 180.0 30.0 TLV71713PDQNT X2SON DQN 4 250 202.0 201.0 28.0 TLV71713PDQNT X2SON DQN 4 250 180.0 180.0 30.0 TLV71715PDQNR X2SON DQN 4 3000 202.0 201.0 28.0 TLV71715PDQNR X2SON DQN 4 3000 180.0 180.0 30.0 TLV71715PDQNT X2SON DQN 4 250 180.0 180.0 30.0 TLV71715PDQNT X2SON DQN 4 250 202.0 201.0 28.0 TLV71718PDQNR X2SON DQN 4 3000 202.0 201.0 28.0 TLV71718PDQNR X2SON DQN 4 3000 180.0 180.0 30.0 TLV71718PDQNT X2SON DQN 4 250 180.0 180.0 30.0 TLV71718PDQNT X2SON DQN 4 250 202.0 201.0 28.0 TLV717285PDQNT X2SON DQN 4 250 180.0 180.0 30.0 TLV717285PDQNT X2SON DQN 4 250 202.0 201.0 28.0 TLV71728PDQNR X2SON DQN 4 3000 202.0 201.0 28.0 TLV71728PDQNR X2SON DQN 4 3000 180.0 180.0 30.0 TLV71728PDQNT X2SON DQN 4 250 180.0 180.0 30.0 TLV71728PDQNT X2SON DQN 4 250 202.0 201.0 28.0 TLV71730PDQNR X2SON DQN 4 3000 180.0 180.0 30.0 TLV71730PDQNR X2SON DQN 4 3000 202.0 201.0 28.0 TLV71730PDQNT X2SON DQN 4 250 180.0 180.0 30.0 TLV71730PDQNT X2SON DQN 4 250 202.0 201.0 28.0 TLV71733PDQNR X2SON DQN 4 3000 202.0 201.0 28.0 TLV71733PDQNR X2SON DQN 4 3000 180.0 180.0 30.0 TLV71733PDQNT X2SON DQN 4 250 180.0 180.0 30.0 TLV71733PDQNT X2SON DQN 4 250 202.0 201.0 28.0 TLV71736PDQNR X2SON DQN 4 3000 180.0 180.0 30.0 TLV71736PDQNT X2SON DQN 4 250 180.0 180.0 30.0 Pack Materials-Page 3 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as "components") are sold subject to TI's terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI's terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers' products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers' products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI's goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or "enhanced plastic" are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components which meet ISO/TS16949 requirements, mainly for automotive use. Components which have not been so designated are neither designed nor intended for automotive use; and TI will not be responsible for any failure of such components to meet such requirements. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP(R) Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright (c) 2012, Texas Instruments Incorporated