September 2013 Doc ID 7382 Rev 4 1/26
1
VNN3NV04, VNS3NV04
VND3NV04, VND3NV04-1
OMNIFET II
fully autoprotected Power MOSFET
Features
■
Linear curr en t limi tation
■
Thermal shutdown
■
Short circuit protection
■
Integrated clamp
■
Low current drawn from input pin
■
Diagnostic feedback through input pin
■
ESD protection
■
Direct access to the gate of the Power
MOSFET (analog driving)
■
Compatible with standard Power MOSFET in
compliance with the 2002/95/EC European
Directive
Description
The VNN3NV04, VNS3NV04, VND3NV04
VND3NV04-1, are monolithic devices designed in
STMicroelectronics™ VIPower™ M0-3
Technology, intended for replacement of standard
Power MOSFETs from DC up to 50 kHz
applications. Built in thermal shutdown, linear
current limitation and overvoltage clamp protect
the chip in hars h envi r onm ents.
Fault feedback can be detected by monitoring the
voltage at the input pin.
Type R
DS(on)
I
lim
V
clamp
VNN3NV04
VNS3NV04
VND3NV04
VND3NV04-1
120 mΩ3.5 A 40 V
SOT-223 SO-8
TO251 (IPAK)
12
2
3
1
3
3
2
1
TO252 (DPAK)
Table 1. Device summary
Package Order codes
Tube Tube (lead-free) Tape and reel Tape and reel (lead-free)
SOT-223 VNN3NV04 - VNN3NV0413TR -
SO-8 VNS3NV04 - VNS3NV0413TR -
TO-252 VND3NV04 VND3NV04-E VND3NV0413TR VND3NV04TR-E
TO-251 VND3NV04-1 VND3NV04-1-E - -
www.st.com
Contents VNN3NV04, VNS3NV04, VND3NV04, VND3NV04-1
2/26 Doc ID 7382 Rev 4
Contents
1 Block diagram and pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2 Electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.1 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.2 Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.3 Elect rical char acteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
3 Protection features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
3.1 Electrical characteristics curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
4 Package and packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
4.1 ECOPACK
®
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
4.2 T O-251 (IPAK) mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
4.3 TO-252 (DPAK) mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
4.4 SOT-223 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
4.5 SO-8 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
4.6 SOT-223 pa cking information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
4.7 SO-8 packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
4.8 DPAK packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
4.9 IPAK packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
5 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
VNN3NV04, VNS3NV04, VND3NV04, VND3NV04-1 List of tables
Doc ID 7382 Rev 4 3/26
List of tables
Table 1. Device summary. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Table 2. Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Table 3. Thermal data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Table 4. Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Table 5. TO-251 (IPAK) mechanical data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Table 6. TO-252 (DPAK) mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Table 7. SOT-223 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Table 8. SO-8 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Table 9. Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
List of figures VNN3NV04, VNS3NV04, VND3NV04, VND3NV04-1
4/26 Doc ID 7382 Rev 4
List of figures
Figure 1. Block diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Figure 2. Configuration diagram (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Figure 3. Current and voltage conventions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Figure 4. Switching time test circuit for resistive load . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Figure 5. Test circuit for diode recovery times. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Figure 6. Unclamped inductive load test circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Figure 7. Input charge test circuit. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Figure 8. Unclamped inductive waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Figure 9. Thermal impedance for DPAK/IPAK. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Figure 10. Thermal impedance for SOT-223 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Figure 11. Derating curve . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Figure 12. Transconductance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Figure 13. Static drain-source on resistance vs input voltage (part 1/2) . . . . . . . . . . . . . . . . . . . . . . . 12
Figure 14. Static drain-source on resistance vs input voltage (part 2/2) . . . . . . . . . . . . . . . . . . . . . . . 12
Figure 15. Source-drain diode forward characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Figure 16. Static drain source on resistance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Figure 17. Turn-on current slope (part 1/2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Figure 18. Turn-on current slope (part 2/2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Figure 19. Transfer characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Figure 20. Static drain-source on resistance vs Id. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Figure 21. Input voltage vs input charge . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Figure 22. Turn-off drain source voltage slope (part 1/2). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Figure 23. Turn-off drain source voltage slope (part 2/2). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Figure 24. Capacitance variations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Figure 25. Output characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Figure 26. Normalized on resistance vs temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Figure 27. Switching time resistive load (part 1/2). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 28. Switching time resistive load (part 2/2). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 29. Normalized input threshold voltage vs temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 30. Normalized current limit vs junction temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 31. Step response current limit. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 32. TO-251 (IPAK) package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Figure 33. TO-252 (DPAK) package dimensions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Figure 34. SOT-223 package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Figure 35. SO-8 package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Figure 36. SOT-223 tape and reel shipment (suffix “TR”) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Figure 37. SO-8 tube shipment (no suffix). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Figure 38. SO-8 tape and reel shipment (suffix “TR”) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Figure 39. DPAK footprint and tube shipment (no suffix). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Figure 40. DPAK tape and reel shipment (suffix “TR”) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Figure 41. IPAK tube shipment (no suffix) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
VNN3NV04, VNS3NV04, VND3NV04, VND3NV04-1 Block diagram and pin description
Doc ID 7382 Rev 4 5/26
1 Block diagram and pin description
Figure 1. Block diagram
Figure 2. Configuration diagram (top view)
1. For the pins configuration related to SOT-223, DPAK, IPAK see outlines at page 1.
Overvoltage
Gate
Linear
DRAIN
SOURCE
Clamp
1
2
3
Current
Limiter
Control
Over
Temperature
INPUT
FC01000
SO-8 Package
(1)
DRAIN
DRAIN
DRAIN
DRAIN
INPUT
SOURCE
SOURCE
SOURCE 1
45
8
Electrical specifications VNN3NV04, VNS3NV04, VND3NV04, VND3NV04-1
6/26 Doc ID 7382 Rev 4
2 Electrical specifications
Figure 3. Current and voltage conventions
2.1 Absolute maximum ratings
DRAIN
INPUT
SOURCE
I
D
I
IN
V
IN
V
DS
R
IN
Table 2. Absolute maximum ratings
Symbol Parameter Value Unit
SOT-223 SO-8 DPAK/IPAK
V
DS
Drain-s our ce volta ge (V
IN
=0 V) Internally clamped V
V
IN
Input voltage Internally clamped V
I
IN
Input current +/-20 mA
R
IN MIN
Minimum input series impedance 220 Ω
I
D
Drain current Internally limited A
I
R
Reverse DC output current -5.5 A
V
ESD1
Electrostatic discha rge (R =1.5 KΩ,
C=100 pF) 4000 V
V
ESD2
Electrostatic discharge on output pin
only (R=330 Ω, C=150 pF) 16500 V
P
tot
Total dissipation at T
c
=25 °C 7 8.3 35 W
T
j
Operating junction temperature Internally limited °C
T
c
Case operating temperature Internally limited °C
T
stg
Storage temperature -55 to 150 °C
VNN3NV04, VNS3NV04, VND3NV04, VND3NV04-1 Electrical specifications
Doc ID 7382 Rev 4 7/26
2.2 Thermal data
2.3 Electrical characteristics
-40 °C < T
j
< 150 °C, unless otherwise specified.
Table 3. Thermal data
Symbol Parameter Value Unit
SOT-223 SO-8 DPAK IPAK
R
thj-case
Thermal resistance junction-case max 18 3.5 3.5 °C/W
R
thj-lead
Thermal resistance junction-lead max 15 °C/W
R
thj-amb
Thermal resistance junction-ambient max 70
(1)
65
(1)
54
(1)
100 °C/W
1. When mounted on a standard single-sided FR4 board with 50 mm
2
of Cu (at least 35 mm thick) connected to all DRAIN
pins.
Table 4. Electrical characteristics
Symbol Parameter Test conditions Min Typ Max Unit
Off
V
CLAMP
Drain-source clamp
voltage V
IN
=0 V; I
D
=1.5 A 40 45 55 V
V
CLTH
Drain-source clamp
threshold voltage V
IN
=0 V; I
D
=2 mA 36 V
V
INTH
Input threshold voltage V
DS
=V
IN
; I
D
=1 mA 0.5 2.5 V
I
ISS
Supply current from input
pin V
DS
=0 V; V
IN
=5 V 100 150 µA
V
INCL
Input-source clamp
voltage I
IN
=1 mA
I
IN
=-1 mA 6
-1.0 6.8 8
-0.3 V
I
DSS
Zero input voltage drain
current (V
IN
=0 V) V
DS
=13 V; V
IN
=0 V; T
j
=25 °C
V
DS
=25 V; V
IN
=0 V 30
75 µA
On
R
DS(on)
Static drain-source on
resistance V
IN
=5 V; I
D
=1.5 A; T
j
=25 °C
V
IN
=5 V; I
D
=1.5 A 120
240 mΩ
Dynamic (T
j
=25 °C, unless otherwise specified)
g
fs
(1)
Forward
transconductance V
DD
=13 V; I
D
=1.5 A 5.0 S
C
OSS
Output capacitance V
DS
=13 V; f=1 MHz; V
IN
=0 V 150 pF
Switching
(T
j
=25 °C, unless otherwise specified)
Electrical specifications VNN3NV04, VNS3NV04, VND3NV04, VND3NV04-1
8/26 Doc ID 7382 Rev 4
t
d(on)
Turn-on del ay time V
DD
=15 V; I
D
=1.5 A
V
gen
=5 V; R
gen
=R
IN MIN
=220 Ω
(see figure Fig ure 4.)
90 300 ns
t
r
Rise time 250 750 ns
t
d(off)
Turn-off delay time 450 1350 ns
t
f
Fall time 250 750 ns
t
d(on)
Turn-on del ay time V
DD
=15 V; I
D
=1.5 A
V
gen
=5 V; R
gen
=2.2 KΩ
(see figure Fig ure 4.)
0.45 1.35 µs
t
r
Rise time 2.5 7.5 µs
t
d(off)
Turn-off delay time 3.3 10.0 µ s
t
f
Fall time 2.0 6.0 µs
(dI/dt)
on
Turn-on curr ent sl ope V
DD
=15 V; I
D
=1.5 A
V
gen
=5 V; R
gen
=R
IN MIN
=220 Ω4.7 A/µs
Q
i
Total input charge V
DD
=12 V; I
D
=1.5 A; V
IN
=5 V
I
gen
=2.13 mA (see figure Figure 7.)8.5 nC
Source drain diode (T
j
=25 °C, unless otherwise specified)
V
SD(1)
Forward on voltage I
SD
=1.5 A; V
IN
=0 V 0.8 V
t
rr
Reverse recovery time I
SD
=1.5 A; dI/d t=1 2 A/µs
V
DD
=30V; L=200µH
(see test circuit, figure Fi gure 5.)
107 ns
Q
rr
Rev erse reco very charg e 37 µC
I
RRM
Revers e recovery current 0.7 A
Protections (-40 °C < T
j
< 150 °C, unless otherwise specified)
I
lim
Drain current limit V
IN
=5 V; V
DS
=13 V 3.5 5 7 A
t
dlim
Step response cu rrent
limit V
IN
=5 V; V
DS
=13 V 10 µs
T
jsh
Over temper atur e
shutdown 150 175 200 °C
T
jrs
Over temperature reset 135 °C
I
gf
Fault sink current V
IN
=5 V; V
DS
=13 V; T
j
=T
jsh
10 15 20 mA
E
as
Single pulse avalanche
energy
st arti ng T
j
=25µ°C; V
DD
=24 V
V
IN
=5 V R
gen
=R
IN MIN
=220 Ω; L=24 mH
(see figures Figure 6. & Figure 8.)100 mJ
1. Pulsed: Pulse duration = 300 µs, duty cycle 1.5 %
Table 4. Electrical characteristics (continued)
Symbol Parameter Test conditions Min Typ Max Unit
VNN3NV04, VNS3NV04, VND3NV04, VND3NV04-1 Protection features
Doc ID 7382 Rev 4 9/26
3 Protection features
During normal operation, the input pin is electrically connected to the gate of the internal
Power MOSFET through a low impedance path.
The device then behaves like a standard Power MOSFET and can be used as a switch from
DC up to 50 kHz. The only difference from the user’s standpoint is that a small DC current
I
ISS
(typ. 100µA) flows into the input pin in order to supply the internal circuitry.
The device integrates:
●
Overvoltage clamp protection: internally set at 45 V, along with the rugged avalanche
characteristics of the Power MOSFET stage give this device unrivalled ruggedness and
energy handling capability. This feature is mainly important when driving inductive
loads.
●
Linear current limiter circuit: limits the drain current I
D
to I
lim
whatever the input pin
voltages. When the current limiter is active, the device operates in the linear region, so
power dissipation may exceed the capability of the heatsink. Both case and junction
temperatures increase, and if this phase lasts long enough, junction temperature may
reach the over temperature threshold T
jsh
.
●
Over temperature and short circuit protection: these are based on sensing the chip
temperature and are not dependent on the input voltage. The location of the sensing
element on the chip in the power stage area ensures fast, accurate detection of the
junction temperature. Over temperature cutout occurs in the range 150 to 190 °C, a
typical value being 170 °C. The device is automatically restarted when the chip
temperature falls of about 15 °C below shutdown temperature.
●
Status feedback: in the case of an over temperature fault condition (T
j
> T
jsh
), the
device tries to sink a diagnostic current I
gf
through the input pin in order to indicate fault
condition. If driven from a low impedance source, this current may be used in order to
warn the control circuit of a device shutdown. If the drive impedance is high enough so
that the input pin driver is not able to supply the current I
gf
, the input pin will fall to 0 V.
This will not however affect the device operation: no requirement is put on the current
capability of the input pin driver except to be able to supply the normal operation drive
current I
ISS
.
Additional features of this device are ESD protection according to the Human Body model
and the ability to be driven from a TTL logic circuit.
Protection features VNN3NV04, VNS3NV04, VND3NV04, VND3NV04-1
10/26 Doc ID 7382 Rev 4
Figure 4. Switching time test circuit for resistive load
Figure 5. Test ci rcuit for diode recovery times
R
gen
V
gen
V
D
t
I
D
90%
10%
t
V
gen
t
d(on)
t
d(off)
t
f
t
r
L=100uH
A
B
8.5
Ω
V
DD
R
gen
FAST
DIODE
OMNIFET
A
D
I
S
220
Ω
B
OMNIFET
D
S
I
V
gen
VNN3NV04, VNS3NV04, VND3NV04, VND3NV04-1 Protection features
Doc I D 7382 Rev 4 11/2 6
Figure 6. Unclamped inductiv e load te st
circuits Figure 7. Input charge test circuit
Figure 8. Unclamped inductive waveforms
GEN
ND8003
V
IN
Protection features VNN3NV04, VNS3NV04, VND3NV04, VND3NV04-1
12/26 Doc ID 7382 Rev 4
3.1 Electrical characteristics curves
Figure 9. Thermal impedance for DPAK/IPAK Figure 10. Thermal impedance for SOT-223
Figure 11. Derating curve Figure 12. Transconductance
Figure 13. Static drain-source on resistance
vs input voltage (part 1/2) Figure 14. Static drain-source on resis tance
vs input voltage (part 2/2)
0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5
Id (A)
0
1
2
3
4
5
6
7
8
9
10
11
Gfs (S)
Vds=13V
Tj=25ºC
Tj=150ºC
Tj=-40ºC
3 3.5 4 4.5 5 5.5 6 6.5
Vin(V)
0
25
50
75
100
125
150
175
200
225
250
275
300
Rds(on) (mohms)
Id=3.5A
Id=1A
Id=3.5A
Id=1A
Id=3.5A
Id=1A
Tj=25ºC
Tj=150ºC
Tj=-40ºC
VNN3NV04, VNS3NV04, VND3NV04, VND3NV04-1 Protection features
Doc I D 7382 Rev 4 13/26
Figure 15. Source-drain diode forward
characteristics Figu re 16. Static drain source on resistance
Figure 17. Turn-on current slope (part 1/2) Figure 18. Turn-on current slope (part 2/2)
Figure 19. Transfer characteristics Figure 20. Static drain-source on resistance
vs Id
0123456789101112
Id (A)
600
650
700
750
800
850
900
950
1000
1050
1100
Vsd (mV)
Vin=0V
0 0.05 0.1 0.15 0.2 0.25 0.3
Id(A)
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
Rds(on) (ohms)
Tj=25ºC
Tj=150ºC
Tj=-40ºC
Vin=2.5V
0250 500 750 1000 1250 1500 1750 2000 2250 2500
Rg(ohm)
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
di/dt(A/us)
Vin=5V
Vdd=15V
Id=1.5A
0250 500 750 1000 1250 1500 1750 2000 2250 2500
Rg(ohm)
0
0.25
0.5
0.75
1
1.25
1.5
1.75
di/dt(A/usec)
Vin=3.5V
Vdd=15V
Id=1.5A
1.5 1.75 22.25 2.5 2.75 33.25 3.5 3.75 44.25 4.5 4.75 5
Vin(V)
0
0.25
0.5
0.75
1
1.25
1.5
1.75
2
2.25
Idon(A)
Vds=13.5V
Tj=150ºC
Tj=25ºC
Tj=-40ºC
0 0.5 1 1.5 2 2.5 3 3.5 4
Id (A)
0
25
50
75
100
125
150
175
200
225
250
Rds(on) (mohms)
Tj=25ºC
Tj=150ºC
Tj= - 40ºC
Vin=5V
Protection features VNN3NV04, VNS3NV04, VND3NV04, VND3NV04-1
14/26 Doc ID 7382 Rev 4
Figure 21. Input voltage vs input char ge Figure 22. Turn-off drain source voltage slope
(part 1/2)
Figure 23. Turn-off drain source voltage slope
(part 2/2) Figure 24. Ca pacitance vari atio ns
Figure 25. Output characteristics Figure 26. Normalized on resistance vs
temperature
v
0123456
Qg (nC)
0
1
2
3
4
5
6
Vin (V)
Vds=12V
Id=0.5A
0250 500 750 1000 1250 1500 1750 2000 2250 2500
Rg(ohm)
0
25
50
75
100
125
150
175
200
225
250
275
300
dv/dt(V/usec)
Vin=5V
Vdd=15V
Id=1.5A
0250 500 750 1000 1250 1500 1750 2000 2250 2500
Rg(ohm)
0
25
50
75
100
125
150
175
200
225
250
275
300
dv/dt(V/usec)
Vin=3.5V
Vdd=15V
Id=1.5A
0 5 10 15 20 25 30 35
Vds(V)
50
100
150
200
250
300
350
C(pF)
f=1MHz
Vin=0V
-50 -25 0 25 50 75 100 125 150 175
Tc )ºC)
0.5
1
1.5
2
2.5
3
3.5
4
Rds(on) (mOhm)
Vin=5V
Id=1.5A
VNN3NV04, VNS3NV04, VND3NV04, VND3NV04-1 Protection features
Doc I D 7382 Rev 4 15/26
Figure 27. Switching time resistive load (part
1/2) Figure 28. Switching time resistive load (part
2/2)
Figure 29. Normalized input threshold voltage
vs temperature Figure 30. Normalized current limit vs junction
temperature
Figure 31. Step response current limit
0250 500 750 1000 1250 1500 1750 2000 2250 2500
Rg(ohm)
0
0.5
1
1.5
2
2.5
3
3.5
4
t(usec)
Vdd=15V
Id=1.5A
Vin=5V
td(off)
tr
td(on)
tf
3.25 3.5 3.75 4 4.25 4.5 4.75 5 5.25
Vin(V)
0
100
200
300
400
500
600
700
800
900
t(nsec)
Vdd=15V
Id=1.5A
Rg=220ohm
tf
tr
td(off)
td(on)
-50 -25 0 25 50 75 100 125 150 175
Tc (ºC)
0
0.2
0.4
0.6
0.8
1
1.2
1.4
1.6
1.8
2
Vinth (V)
Vds=Vin
Id=1mA
-50 -25 0 25 50 75 100 125 150 175
Tc (ºC)
0
1
2
3
4
5
6
7
8
9
10
Ilim (A)
Vin=5V
Vds=13V
5 7.5 10 12.5 15 17.5 20 22.5 25 27.5 30 32.5
Vdd(V)
7.5
8
8.5
9
9.5
10
10.5
11
11.5
12
12.5
13
Tdlim(usec)
Vin=5V
Rg=220ohm
Package and packing information VNN3NV04, VNS3NV04, VND3NV04, VND3NV04-1
16/26 Doc ID 7382 Rev 4
4 Package and packing information
4.1 ECOPACK
®
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
4.2 TO-251 (IPAK) mechanical data
Table 5. TO-251 (IPAK) mechanical data
Symbol millimeters
Min. Typ. Max.
A2.2 2.4
A1 0.9 1.1
A3 0.7 1.3
B 0.64 0.9
B2 5.2 5.4
B3 0.85
B5 0.3
B6 0.95
C 0.45 0.6
C2 0.48 0.6
D6 6.2
E6.4 6.6
G4.4 4.6
H15.9 16.3
L9 9.4
L1 0.8 1.2
L2 0.8 1
VNN3NV04, VNS3NV04, VND3NV04, VND3NV04-1 Package and packing information
Doc I D 7382 Rev 4 17/26
Figure 32. TO-251 (IPAK) package dimensions
4.3 TO-252 (DPAK) mechanical data
Table 6. TO-252 (DPAK) mechanical data
Symbol millimeters
Min. Typ. Max.
A2.20 2.40
A1 0.90 1.10
A2 0.03 0.23
B0.64 0.90
B2 5.20 5.40
C0.45 0.60
C2 0.48 0.60
D6.00 6.20
D1 5.1
E6.40 6.60
E1 4.7
e2.28
G4.40 4.60
H9.35 10.10
Package and packing information VNN3NV04, VNS3NV04, VND3NV04, VND3NV04-1
18/26 Doc ID 7382 Rev 4
Figure 33. TO-252 (DPAK) package dimensions
4.4 SOT-223 mechanical data
L2 0.8
L4 0.60 1.00
R0.2
V2 0° 8°
Package Weight Gr. 0.29
Table 6. TO-252 (DPAK) mechanical data (continued)
Symbol millimeters
Min. Typ. Max.
P032P
Table 7. SOT-223 mechanical data
Symbol millimeters
Min. Typ. Max.
A1.8
B0.60.70.85
B1 2.9 3 3.15
c 0.24 0.26 0.35
D 6.3 6.5 6.7
e2.3
VNN3NV04, VNS3NV04, VND3NV04, VND3NV04-1 Package and packing information
Doc I D 7382 Rev 4 19/26
Figure 34. SOT-223 pa ckage dimensions
4.5 SO-8 mechanical data
e1 4.6
E 3.3 3.5 3.7
H6.777.3
V 10 (max)
A1 0.02 0.1
Table 7. SOT-223 mechanical data (continued)
Symbol millimeters
Min. Typ. Max.
0046067
Table 8. SO-8 mechanical data
Symbol millimeters
Min Typ Max
A1.75
a1 0.1 0.25
a2 1.65
a3 0.65 0.85
b0.35 0.48
A 1.75
A1 0.10 0.25
Package and packing information VNN3NV04, VNS3NV04, VND3NV04, VND3NV04-1
20/26 Doc ID 7382 Rev 4
Figure 35. SO-8 package dimensions
A2 1.25
b 0.28 0.48
c 0.17 0.23
D
(1)
4.80 4.90 5.00
E 5.80 6.00 6.20
E1
(2)
3.80 3.90 4.00
e 1.27
h 0.25 0.50
L 0.40 1.27
L1 1.04
k 0° 8°
ccc 0.10
1. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusions or gate burrs
shall not exceed 0.15 mm in total (both side).
2. Dimension “E1” does not include interlead flash or protrusions. Interlead flash or protrusions shall not
exceed 0.25 mm per side.
Table 8. SO-8 mechanical data (continued)
Symbol millimeters
Min Typ Max
001602 3 D
VNN3NV04, VNS3NV04, VND3NV04, VND3NV04-1 Package and packing information
Doc I D 7382 Rev 4 21/26
4.6 SOT-223 packing information
Figure 36. SOT-223 tape and reel shipment (suffix “TR”)
REEL DIMENSIONS
Base Q.t y 1000
Bulk Q.ty 1000
A (max) 330
B (min) 1.5
C (± 0.2) 13
F20.2
G (+ 2 / -0) 12.4
N (min) 60
T (max ) 18.4
TAPE DIMENSIONS
According to Electronic Industries Association
(EIA) Standard 481 rev. A, Feb. 1986
All dimensions are in mm.
Tape width W 12
Tape Hole Spacing P0 (± 0.1) 4
Compone nt Spacing P 8
Hole Diameter D (± 0.1/-0) 1.5
Hole Diameter D1 (min) 1.5
Hole Position F (± 0.05) 5.5
Compartment Depth K (max) 4.5
Hole Spacing P1 (± 0.1) 2
Top
cover
tape
End
Start
No componentsNo components Components
500mm min
500mm min
Empty components pockets
saled with cover tape.
User direction of feed
Package and packing information VNN3NV04, VNS3NV04, VND3NV04, VND3NV04-1
22/26 Doc ID 7382 Rev 4
4.7 SO-8 packing information
Figure 37. SO-8
tube shipment (no suffix)
Figure 38. SO-8 tape and reel shipment (suffix “TR”)
Base Q.ty 100
Bul k Q. ty 2000
Tube length (± 0.5) 532
A3.2
B6
C (± 0.1) 0.6
C
B
A
TAPE DIMENSIONS
According to Electronic Industries Association
(EIA) Standard 481 rev. A, Feb 1986
All dimensions are in mm.
Tape width W 12
Tape Hole Spacing P0 (± 0.1) 4
Component Spacing P 8
Hole Diameter D (± 0.1/-0) 1.5
Hole Diameter D1 (min) 1.5
Hole Position F (± 0.05) 5.5
Compartment Depth K (max) 4.5
Hole Spacing P1 (± 0.1) 2
Top
cover
tape
End
Start
No componentsNo components Components
500mm min
500mm min
Empty components pockets
saled with cover ta pe.
User direction of feed
REEL DIMENSIONS
All dimensions are in mm.
Base Q.ty 2500
Bulk Q.ty 2500
A (max) 330
B (min) 1.5
C (± 0.2) 13
F20.2
G (+ 2 / -0) 12.4
N (min) 60
T (max) 18.4
VNN3NV04, VNS3NV04, VND3NV04, VND3NV04-1 Package and packing information
Doc I D 7382 Rev 4 23/26
4.8 DPAK packing information
Figure 39. DPAK footprint and tube shipment (no suffix)
Figure 40. DPAK tape and reel shipment (suffix “TR”)
6.7 3.01.8 1.6
2.3
2.3
6.7
A
C
B
Base Q.ty 75
Bulk Q.ty 3000
Tube length (± 0.5) 532
A6
B21.3
C (± 0.1) 0.6
REEL DIMENSIONS
Base Q.ty 2500
Bulk Q.ty 2500
A (max) 330
B (min) 1.5
C (± 0.2) 13
F20.2
G (+ 2 / -0) 16.4
N (min) 60
T (max ) 22.4
TAPE DIMENSIONS
According to Electronic Industries Association
(EIA) Standard 481 rev. A, Feb 1986
All dimensions are in mm.
Tape width W 16
Tape Hole Spacing P0 (± 0.1) 4
Component Spacing P 8
Hole Diameter D (± 0.1/-0) 1.5
Hole Diameter D1 (min) 1.5
Hole Position F (± 0.05) 7.5
Compartment Depth K (max) 6.5
Hole Spacing P1 (± 0.1) 2
Top
cover
tape
End
Start
No componentsNo components Com ponents
500mm min
500mm min
Empty components pockets
saled with cover tape.
User direction of feed
Package and packing information VNN3NV04, VNS3NV04, VND3NV04, VND3NV04-1
24/26 Doc ID 7382 Rev 4
4.9 IPAK packing information
Figure 41. IPAK tube shipment (no suffix)
All dimensions are in mm.
Base Q.ty 75
Bulk Q.ty 3000
Tube length (± 0.5) 532
A6
B21.3
C (± 0.1) 0.6
A
C
B
VNN3NV04, VNS3NV04, VND3NV04, VND3NV04-1 Revision history
Doc I D 7382 Rev 4 25/26
5 Revision history
Table 9. Document revision history
Date Revision Changes
01-Feb-2003 1 Initial Release
27-Apr-2009 2 Added Table 1: Device summary on page 1
Updated Table 4: Package and packing information on page 16
05-Apr-2011 3 Table 2: Absolute maximum ratings:
–R
IN MIN
: changed unit from W to Ω
Inserted Section 4.1: ECOPACK
®
20-Sep-2013 4 Updated Disclaimer.
VNN3NV04, VNS3NV04, VND3NV04, VND3NV04-1
26/26 Doc ID 7382 Rev 4
Please Read Carefully:
Informa tion in this do cument is prov ided solely in connec tion with ST products. STMic roelect ronics NV and its subsidiari es (“ST”) reser ve the
right to mak e chang es, c or recti ons , modif ic ations or improv ement s, t o th is documen t, and the prod ucts an d servic es des crib ed he rein a t any
time, without notice.
All ST produ cts are sold purs uant to ST’s terms and conditions of sale.
Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no
liability whatsoev er relating to the choice, sele ct ion or use of the ST products and services descr i bed herein.
No license, express or implied, by estopp el or otherwise, to any intellectual property rights is granted under this document. If any part of this
document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products
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third party products or services or any intellectual property contained therein.
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OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.
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DOMAINS ACCORDING TO ST PRODUCT DESIGN SPECIFICATIONS. PRODUCTS FORMALLY ESCC, QML OR JAN QUALIFIED ARE
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