1. Product profile
1.1 General description
NPN medium power transistor series encapsulated in an ultra thin
DFN2020D-3 (SOT1061D) leadless small Surface-Mounted Device (SMD) plastic
package with medium power capability and visible and solderable side pads.
[1] Valid for all available selection groups.
1.2 Features and benefits
1.3 Applications
1.4 Quick reference data
BC54PAS; BC55PAS; BC56PAS
45V/60V/80V, 1A NPN medium power transistors
Rev. 1 — 11 November 2014 Product data sheet
DFN2020D-3
Table 1. Product overview
Type number[1] Package PNP complement
BC54PAS DFN2020D-3 SOT1061D BC51PAS
BC55PAS BC52PAS
BC56PAS BC53PAS
High collector current capability IC and
ICM
Three current gain selections
Reduced Printed-Circuit Board (PCB)
area requirements
Leadless very small SMD plastic
package with medium power capability
Exposed heat sink for excellent thermal
and electrical conductivity
Suitable for Automatic Optical
Inspection (AOI) of solder joint
AEC-Q101 qualified
Linear voltage regulators Low-side switches
Battery driven devices Power management
MOSFET drivers Amplifiers
Table 2. Quick reference data
Symbol Parameter Conditions Min Typ Max Unit
VCEO collector-emitter voltage open base
BC54PAS --45V
BC55PAS --60V
BC56PAS --80V
ICcollector current - - 1 A
BC54_55_56PAS_SER All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 1 — 11 November 2014 2 of 14
NXP Semiconductors BC54PAS; BC55PAS; BC56PAS
45V/60V/80V, 1A NPN medium po w er tran sis to rs
[1] Pulse test: tp 300 s; 0.02
2. Pinning information
3. Ordering information
[1] Valid for all available selection groups.
ICM peak collector current single pulse; tp1ms --2A
hFE DC current gain VCE =2V; I
C=150mA [1] 63 - 250
hFE selection -10 VCE =2V; I
C=150mA [1] 63 - 160
hFE selection -16 VCE =2V; I
C=150mA [1] 100 - 250
Table 2. Quick reference data …continued
Symbol Parameter Conditions Min Typ Max Unit
Table 3. Pinning
Pin Description Simplified outline Graphic symbol
1base
2emitter
3 collector
Transparent top view
12
3
sym021
3
2
1
Table 4. Ordering informatio n
Type number[1] Package
Name Description Version
BC54PAS DFN2020D-3 DFN2020D-3: plastic thermal enhance d ultra thin small outline
package; no leads; 3 terminals; body 2 20.65 mm. SOT1061D
BC55PAS
BC56PAS
BC54_55_56PAS_SER All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 1 — 11 November 2014 3 of 14
NXP Semiconductors BC54PAS; BC55PAS; BC56PAS
45V/60V/80V, 1A NPN medium po w er tran sis to rs
4. Marking
5. Limiting values
Table 5. Marking codes
Type number Marking code
BC54PAS CD
BC54-10PAS CE
BC54-16-PAS CF
BC55PAS CG
BC55-10PAS CH
BC55-16PAS CJ
BC56PAS CK
BC56-10PAS CL
BC56-16PAS CM
Table 6. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
VCBO collector-base voltage open emitter
BC54PAS - 45 V
BC55PAS - 60 V
BC56PAS - 100 V
VCEO collector-emitter voltage open base
BC54PAS - 45 V
BC55PAS - 60 V
BC56PAS - 80 V
VEBO emitter-base voltage open collector - 5 V
ICcollector current - 1 A
ICM peak collector current single pulse;
tp1ms -2A
IBbase current - 0.3 A
BC54_55_56PAS_SER All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 1 — 11 November 2014 4 of 14
NXP Semiconductors BC54PAS; BC55PAS; BC56PAS
45V/60V/80V, 1A NPN medium po w er tran sis to rs
[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin -plated and standard
footprint.
[2] Device mounted on an FR4 PCB, 4-layer copper, tin-plated and standard footprint.
[3] Device mounted on an FR4 PCB, single-sided copper, tin-plated and mounting pad for collector 1 cm2.
[4] Device mounted on an FR4 PCB, single-sided copper, tin-plated and mounting pad for collector 6 cm2.
[5] Device mounted on an FR4 PCB, 4-layer copper, tin-plated and mounting pad for collector 1 cm2.
Ptot total power dissipation Tamb 25 C[1] -0.42W
[2] -0.81W
[3] -0.83W
[4] -1.10W
[5] -1.65W
Tjjunction temperature - 150 C
Tamb ambient temperature 55 150 C
Tstg storage temperature 65 150 C
(1) FR4 PCB, 4-layer copper, 1 cm2
(2) FR4 PCB, single-sided copper, 6 cm2
(3) FR4 PCB, single-sided copper, 1 cm2
(4) FR4 PCB, 4-layer copper, standard footprint
(5) FR4 PCB, single-sided copper, standard footprint
Fig 1. Power derating curves
Table 6. Limiting values …continued
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
Tamb (°C)
–75 17512525 75–25
006aac676
1.0
0.5
1.5
2.0
Ptot
(W)
0.0
(1)
(2)
(3)
(4)
(5)
BC54_55_56PAS_SER All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 1 — 11 November 2014 5 of 14
NXP Semiconductors BC54PAS; BC55PAS; BC56PAS
45V/60V/80V, 1A NPN medium po w er tran sis to rs
6. Thermal characteristics
[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin -plated and standard
footprint.
[2] Device mounted on an FR4 PCB, 4-layer copper, tin-plated and standard footprint.
[3] Device mounted on an FR4 PCB, single-sided copper, tin-plated and mounting pad for collector 1 cm2.
[4] Device mounted on an FR4 PCB, single-sided copper, tin-plated and mounting pad for collector 6 cm2.
[5] Device mounted on an FR4 PCB, 4-layer copper, tin-plated and mounting pad for collector 1 cm2.
Table 7. Thermal characteris tics
Symbol Parameter Conditions Max Unit
Rth(j-a) thermal resistance from junction
to ambient in free air [1] 298 K/W
[2] 154 K/W
[3] 151 K/W
[4] 114 K/W
[5] 76 K/W
Rth(j-sp) thermal resistance from junction
to solder point in free air 20 K/W
FR4 PCB, single-sided copper, tin-plated and standard footprint
Fig 2. Transient thermal impedance from junction to ambi ent as a function of pulse duration; typical values
006aac683
10
1
102
103
Zth(j-a)
(K/W)
10–1
10–5 1010–2
10–4 102
10–1 tp (s)
10–3 103
1
0
duty cycle = 1
0.01
0.05
0.1 0.2
0.33
0.5 0.75
0.02
0.25
BC54_55_56PAS_SER All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 1 — 11 November 2014 6 of 14
NXP Semiconductors BC54PAS; BC55PAS; BC56PAS
45V/60V/80V, 1A NPN medium po w er tran sis to rs
FR4 PCB, 4-layer copper, tin-plated and standard footprint
Fig 3. Transient thermal impedance from junction to ambi ent as a function of pulse duration; typical values
FR4 PCB, single-sided copper, tin-plated and mounting pad for collector 1 cm2
Fig 4. Transient thermal impedance from junction to ambi ent as a function of pulse duration; typical values
006aac686
10
1
102
103
Zth(j-a)
(K/W)
10–1
10–5 1010–2
10–4 102
10–1 tp (s)
10–3 103
1
0
duty cycle = 1
0.01
0.05
0.1 0.2
0.33
0.5 0.75
0.02
0.25
006aac684
10
1
102
103
Zth(j-a)
(K/W)
10–1
10–5 1010–2
10–4 102
10–1 tp (s)
10–3 103
1
0
duty cycle = 1
0.01
0.05
0.1 0.2
0.33
0.5 0.75
0.02
0.25
BC54_55_56PAS_SER All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 1 — 11 November 2014 7 of 14
NXP Semiconductors BC54PAS; BC55PAS; BC56PAS
45V/60V/80V, 1A NPN medium po w er tran sis to rs
FR4 PCB, single-sided copper, tin-plated and mounting pad for collector 6 cm2
Fig 5. Transient thermal impedance from junction to ambi ent as a function of pulse duration; typical values
FR4 PCB, 4-layer copper, tin-plated and mounting pad for collector 1 cm2
Fig 6. Transient thermal impedance from junction to ambi ent as a function of pulse duration; typical values
006aac685
10
1
102
103
Zth(j-a)
(K/W)
10–1
10–5 1010–2
10–4 102
10–1 tp (s)
10–3 103
1
0
duty cycle = 1
0.01
0.05
0.1 0.2
0.33
0.5 0.75
0.02
0.25
006aac687
10
1
102
103
Zth(j-a)
(K/W)
10–1
10–5 1010–2
10–4 102
10–1 tp (s)
10–3 103
1
0
duty cycle = 1
0.01
0.05
0.1 0.2
0.33
0.5 0.75
0.02
0.25
BC54_55_56PAS_SER All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 1 — 11 November 2014 8 of 14
NXP Semiconductors BC54PAS; BC55PAS; BC56PAS
45V/60V/80V, 1A NPN medium po w er tran sis to rs
7. Characteristics
[1] Pulse test: tp300 s; 0.02
Table 8. Characteristics
Tamb =25
C unless otherwise specified
Symbol Parameter Conditions Min Typ Max Unit
ICBO collector-base cut-off current VCB =30V; I
E= 0 A - - 100 nA
VCB =30V; I
E=0A; T
j= 150 C --10A
IEBO emitter-base cut-off current VEB =5V; I
C= 0 A - - 100 nA
hFE DC current gain VCE =2V; I
C=5mA 63 - -
VCE =2V; I
C=150mA [1] 63 - 250
VCE =2 V; I
C=500mA [1] 40 - -
hFE selection -10 VCE =2V; I
C=150mA [1] 63 - 160
hFE selection -16 VCE =2V; I
C=150mA [1] 100 - 250
VCEsat collector-emitter saturation
voltage IC= 500 mA; IB=50mA [1] - - 500 mV
VBE base-emitter voltage VCE =2V; I
C=500mA [1] --1V
Cccollector capacitance VCB =10V; I
E=i
e = 0A; f=1MHz - 6 - pF
fTtransition frequency VCE =5V; I
C= 50 mA; f = 100 MHz 100 180 - MHz
VCE =2V
(1) Tamb = 100 C
(2) Tamb =25C
(3) Tamb =55 C
Tamb =25C
Fig 7. DC current gain as a function of collector
current; typical values Fig 8. Collector current as a function of
collector-emitter voltage; typical values
006aac691
100
200
300
hFE
0
IC (A)
10–4 10110–3 10–1
10–2
(1)
(2)
(3)
VCE (V)
0 2.01.60.8 1.20.4
006aaa084
0.8
0.4
1.2
1.6
IC
(A)
0
25
20
15
10
5
IB (mA) = 50 45 40 35 30
BC54_55_56PAS_SER All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 1 — 11 November 2014 9 of 14
NXP Semiconductors BC54PAS; BC55PAS; BC56PAS
45V/60V/80V, 1A NPN medium po w er tran sis to rs
8. Test information
8.1 Quality information
This product has been qualified in accordance with the Automotive Electronics Council
(AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is
suitable for use in automotive applications.
9. Package outline
VCE =2V
(1) Tamb =55 C
(2) Tamb =25C
(3) Tamb = 100 C
IC/IB=10
(1) Tamb = 100 C
(2) Tamb =25C
(3) Tamb =55 C
Fig 9. Base-emitter voltage as a function of collector
current; typical values Fig 10. Coll ec tor-emitter sa turation voltage as a
function of collector current; typical values
006aac692
0.4
0.8
1.2
VBE
(V)
0.0
IC (mA)
10–1 104
103
110
2
10
(1)
(2)
(3)
006aac693
IC (mA)
10–1 104
103
110
2
10
10–1
1
VCEsat
(V)
10–2
(1)
(2)
(3)
Fig 11. Package outline DFN2020D-3 (SOT1061D)
14-03-18Dimensions in mm
0.65
max 0.04
max
0.3
0.2
0.45
0.35
2.1
1.9
1.1
0.9
0.35
0.25
2.1
1.9
1.6
1.4
1.3
21
3
BC54_55_56PAS_SER All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 1 — 11 November 2014 10 of 14
NXP Semiconductors BC54PAS; BC55PAS; BC56PAS
45V/60V/80V, 1A NPN medium po w er tran sis to rs
10. Soldering
Fig 12. Reflow soldering footprint DF N2020D-3 (SOT1061D)
0.25
SOT1061DFootprint information for reflow soldering of DFN2020D-3 package
sot1061d_fr
occupied area
solder paste
solder resist
solder lands
Issue date
Dimensions in mm
14-03-05
14-03-12
0.5 (2x)
0.5 (2x)
0.25 1
0.35 0.35 0.35
1.1 1.2
0.7 (2x)0.6 (2x)
2.1
1.7
1.3
0.4 (2x)
0.3 (2x)
0.3
0.25
0.3
0.35
1.1
2.32.5
0.4
0.5
1.5
1.6
1.7
BC54_55_56PAS_SER All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 1 — 11 November 2014 11 of 14
NXP Semiconductors BC54PAS; BC55PAS; BC56PAS
45V/60V/80V, 1A NPN medium po w er tran sis to rs
11. Revision history
Table 9. Revision history
Document ID Release date Data sheet status Change notice Supersedes
BC54_55_56PAS_SER v.1 20141111 Product data sheet - -
BC54_55_56PAS_SER All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 1 — 11 November 2014 12 of 14
NXP Semiconductors BC54PAS; BC55PAS; BC56PAS
45V/60V/80V, 1A NPN medium po w er tran sis to rs
12. Legal information
12.1 Data sheet status
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The product status of de vice(s) descr ibed in th is docume nt may have cha nged since this docume nt was publis hed and ma y dif fer in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
12.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liab ility for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and tit le. A short data sh eet is intended
for quick reference only and shou ld not be rel ied u pon to cont ain det ailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall pre vail.
Product specificatio n — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to off er functions and qualities beyond tho se described in the
Product data sheet.
12.3 Disclaimers
Limited warr a nty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Se miconductors takes no
responsibility for the content in this document if provided by an inf ormation
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequ ential damages (including - wit hout limitatio n - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ ag gregate and cumulative l iability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semicondu ctors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all informa tion supplied prior
to the publication hereof .
Suitability for use in automotive applications — This NXP
Semiconductors product has been qualified for use in automotive
applications. Unless ot herwise agreed in writing, the product is not designed,
authorized or warranted to be suitable for use in life support, lif e-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in perso nal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconducto rs products in such equipment or
applications an d ther efo re su ch inclusi on a nd/or use is at the cu stome r's own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty tha t such application s will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and ope ration of their applications
and products using NXP Semiconductors product s, and NXP Semiconductors
accepts no liability for any assistance with applicati ons or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suit able and fit for the custome r’s applications and
products planned, as well as fo r the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for th e customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanent ly and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individua l agreement. In case an individual
agreement is concluded only the ter ms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Document status[1][2] Product status[3] Definition
Objective [short] data sheet Development This document contains data from the objective specification for product develop ment.
Preliminary [short] dat a sheet Qualification This document contains data from the preliminary specification.
Product [short] dat a sheet Production This document contains the product specification.
BC54_55_56PAS_SER All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 1 — 11 November 2014 13 of 14
NXP Semiconductors BC54PAS; BC55PAS; BC56PAS
45V/60V/80V, 1A NPN medium po w er tran sis to rs
No offer to sell or license — Nothing in this document may be interpret ed or
construed as an of fer to sell product s that is op en for accept ance or the grant ,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Quick reference data — The Quick reference dat a is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Translations — A non-English (translated) version of a docume nt is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
12.4 Trademarks
Notice: All referenced b rands, produc t names, service names and trademarks
are the property of their respect i ve ow ners.
13. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
NXP Semiconductors BC54PAS; BC55PAS; BC56PAS
45V/60V/80V, 1A NPN medium po w er tran sis to rs
© NXP Semiconductors N.V. 2014. All rights reserved.
For more information, please visit: http://www.nxp.co m
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 11 November 2014
Document identifier: BC54_55_56PAS_SER
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
14. Contents
1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1 General description . . . . . . . . . . . . . . . . . . . . . 1
1.2 Features and benefits. . . . . . . . . . . . . . . . . . . . 1
1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 1
2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 2
3 Ordering information. . . . . . . . . . . . . . . . . . . . . 2
4 Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3
6 Thermal characteristics . . . . . . . . . . . . . . . . . . 5
7 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 8
8 Test information. . . . . . . . . . . . . . . . . . . . . . . . . 9
8.1 Quality information . . . . . . . . . . . . . . . . . . . . . . 9
9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9
10 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
11 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 11
12 Legal information. . . . . . . . . . . . . . . . . . . . . . . 12
12.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 12
12.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
12.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 12
12.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 13
13 Contact information. . . . . . . . . . . . . . . . . . . . . 13
14 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
