LM4510SD/NOPB - National Semiconductor

LM4510

January 30, 2010

Synchronous Step-Up DC/DC Converter with True

Shutdown Isolation

General Description

The LM4510 is a current mode step-up DC/DC converter with

a 1.2A internal NMOS switch designed to deliver up to 120

mA at 16V from a Li-Ion battery.

The device's synchronous switching operation (no external

Schottky diode) at heavy-load, and non-synchronous switch-

ing operation at light-load, maximizes power efficiency.

True shutdown function by synchronous FET and related cir-

cuitry ensures input and output isolation.

A programmable soft-start circuit allows the user to limit the

amount of inrush current during startup. The output voltage

can be adjusted by external resistors.

The LM4510 features advanced short-circuit protection to

maximize safety during output to ground short condition. Dur-

ing shutdown the feedback resistors and the load are discon-

nected from the input to prevent leakage current paths to

ground.

The LM4510 is available in a 10-pin thermally enhanced

Leadless Leadframe Package: LLP-10.

Features

■18V@80 mA from 3.2V input

■5V@280 mA from 3.2V input

■No external Schottky diode required

■85% peak efficiency

■Soft start

■True shutdown isolation

■Stable with small ceramic or tantalum output capacitors

■Output short-circuit protection

■Feedback fault protection

■Input under-voltage lock out

■Thermal shutdown

■0.002 µA shutdown current

■Wide input voltage range: 2.7V to 5.5V

■1.0 MHz fixed frequency operation

■Low-profile 10–pin LLP package (3mm x 3mm x 0.8mm)

Applications

■Organic LED Panel Power Supply

■Charging Holster

■White LED Backlight

■USB Power Supply

■Class D Audio Amplifier

■Camera Flash LED Driver

Typical Application Circuit

30031001

FIGURE 1. Typical Application Circuit

LM4510 Synchronous Step-Up DC/DC Converter with True Shutdown Isolation

Efficiency at VOUT = 16V

30031030

Connection Diagram

LLP-10 No Pullback Package, 3mm x 3mm x 0.8mm

NS Package Number SDA10A

30031002

Ordering Information

Order Number SPEC Package Type NSC Package Drawing Package Marking Supplied As

LM4510SD NOPB LLP-10 SDA10A L4510 1000 Units, Tape and Reel

LM4510SDX NOPB LLP-10 SDA10A L4510 4500 Units, Tape and Reel

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LM4510

Pin Descriptions/Functions

Pin Name Function

1 SW Switch pin. Drain connections of both internal NMOS and PMOS devices.

2 PGND Power ground

3 VIN Analog and Power supply input. Input range: 2.7V to 5.5V.

4 EN Enable logic input. HIGH= Enabled, LOW=Shutdown.

5 SS Soft-start pin

6 AGND Analog ground

7 COMP Compensation network connection.

8 FB Output voltage feedback connection.

9 N/C No internal connection.

10 VOUT Internal PMOS source connection for synchronous rectification.

DAP DAP Die Attach Pad thermal connection

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LM4510

Absolute Maximum Ratings (Note 1, Note

If Military/Aerospace specified devices are required,

please contact the National Semiconductor Sales Office/

Distributors for availability and specifications.

VIN −0.3V to 6.5V

VOUT −0.3V to 21V

SW (Note 3) −0.3V to VOUT+0.3V

EN, SS, COMP FB −0.3V to 6.5V

PGND to AGND −0.2V to 0.2V

Continuous Power Dissipation

(Note 4) Internally Limited

Junction Temperature (TJ-MAX) 150°C

Storage Temperature Range

(TS)

−65°C to +150°C

Lead Temperature

(Soldering, 10 sec) (Note 5) 260°C

ESD Ratings (Note 12)

Human Body Model 2.0kV

Machine Model 200V

Operating Conditions

Supply Voltage Range (VIN) 2.7V to 5.5V

Junction Temperature Range

(TJ) (Note 6)−40°C to +125°C

Output Voltage Range (VOUT) Up to 18V

Thermal Properties

Junction to Ambient Thermal

Resistance (θJA) LLP-10

Package (Note 7)

36°C/W

Electrical Characteristics (Note 8, Note 9)

Limits in standard type face are for TJ = 25°C only. Limits in boldface type apply over the full operating junction temperature range

( −40°C ≤ TJ ≤+125°C). Unless otherwise stated the following conditions apply: VIN = 3.6V, EN = 3.6V.

Symbol Parameter Conditions Min

(Note 8)

Typ

(Note 9)

Max

(Note 8)Units

VFB FB Pin Voltage 2.7V ≤ VIN ≤ 5.5V 1.24 1.265 1.29 V

IFB FB Pin Bias Current (Note 11) 0.050 1.5 µA

RDS(on)

NMOS Switch RDS(on) ISW = 0.3A 0.45 1.1 Ω

PMOS Switch RDS(on) ISW = 0.3A, VOUT = 10V 0.9 1.1

ICL NMOS Switch Current Limit 1.0 1.2 1.8 A

Device Switching EN = 3.6V, FB = COMP 1.7 2.5 mA

Non-switching Current EN = 3.6V, FB > 1.29V 0.8 2.0 mA

Shutdown Current EN = 0V 0.002 0.050 µA

SW Leakage Current (Note

11)

SW = 20V 0.01 0.150 µA

IVOUT VOUT Bias Current (Note 11)VOUT = 20V 50 90 150 µA

IVL

PMOS Switch Leakage

Current

SW = 0V, VOUT = 20V 0.001 0.100 µA

fSW Switching Frequency 0.85 1.0 1.2 MHz

DMAX Maximum Duty Cycle FB = 0V 88 94 %

DMIN Minimum Duty Cycle 15 20 %

Gm Error Amplifier

Transconductance 70 130 200 µmho

Threshold

Device Enable HIGH 1.2 0.81 V

Device Shutdown LOW 0.78 0.4

IEN EN Pin Bias Current 0 < EN < 3.6V 3.2 8.0 µA

FB Fault

Protection Feedback Fault Protection ON Threshold 18.0 19.7 20.7 V

OFF Threshold 17.0 18.7 20.0

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LM4510

Symbol Parameter Conditions Min

(Note 8)

Typ

(Note 9)

Max

(Note 8)Units

UVLO Input Undervoltage Lockout ON Threshold 2.5 2.65 V

OFF Threshold 2.1 2.35

ISS

Soft-Start Pin Current (Note

10) 911.3 15 µA

Note 1: Absolute maximum ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions for which the device is intended

to be functional, but device parameter specifications may not be guaranteed. For guaranteed specifications and test conditions, see the Electrical Characteristics.

Note 2: All voltages are with respect to the potential at the GND pin.

Note 3: This condition applies if VIN < VOUT. If VIN > VOUT, a voltage greater than VIN + 0.3V should not be applied to the VOUT or VSW pins. The absolute

maximum specification applies to DC voltage. An extended negative voltage limit of -1V applies for a pulse of up to 1 µs, and -2V for a pulse of up to 40 ns. An

extended positive voltage limit of 22V applies for a pulse of up to 20 ns.

Note 4: Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ=150°C (Typ.) and disengages at

TJ=140°C (Typ.).

Note 5: For detailed soldering information and specifications, please refer to National Semiconductor Application Note 1187: Leadless Leadframe Package (LLP) ,

available at www.national.com.

Note 6: In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may have to be

derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP = 125°C), the maximum power

dissipation of the device in the application (PD-MAX), and the junction-to ambient thermal resistance of the part/package in the application (θJA), as given by the

following equation: TA-MAX = TJ-MAX-OP – (θJA × PD-MAX)

Note 7: Junction-to-ambient thermal resistance (θJA) is taken by a numerical analysis conforming to JEDEC standards. In applications where high maximum

power dissipation exists (high VIN, high IOUT), special care must be paid to thermal dissipation issues when designing the board layout. For more information on

these topics, please refer to Application Note 1187: Leadless Leadframe Package (LLP).

Note 8: All limits guaranteed at room temperature (standard typeface) and at temperature extremes (bold typeface). All room temperature limits are production

tested, guaranteed through statistical analysis or guaranteed by design. All limits at temperature extremes are guaranteed via correlation using standard Statistical

Quality Control (SQC) methods. All limits are used to calculate Average Outgoing Quality Level (AOQL).

Note 9: Typical numbers are at 25°C and represent the most likely norm.

Note 10: Current flows out of the pin.

Note 11: Current flows into the pin.

Note 12: The Human body model is a 100 pF capacitor discharged through a 1.5 kΩ resistor into each pin (MIL-STD-883 3015.7). The machine model is a 200

pF capacitor discharged directly into each pin.

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LM4510

Typical Performance Characteristics

LM4510SD, Circuit of Figure 1, (L=4.7 µH, COILCRAFT, DO3316-472ML; CIN=4.7 µF, TDK, C2012X5R0J475K; COUT=10 µF, AVX,

12103D106KAT2A; CS=10 nF, TDK, C1608C0G1E103J; CC1=2.2 nF, Taiyo Yuden, TMK107SD222JA-T; RC=46.4 KΩ, Yageo,

9t06031A4642FBHFT), VIN=3.6V, VOUT=16V, TA=25°C, unless otherwise noted.

Switching Quiescent Current vs VIN

30031005

RDS(on) vs Temperature at VIN= 3.6V

30031035

Load Capabilty vs VIN

(VOUT = 16 V )

30031006

Output Voltage vs Temperature

(VOUT = 17 V )

30031010

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LM4510

Switching Frequency vs Temperature

30031011

Load Regulation

(VOUT = 16 V )

30031012

Load Regulation

(VOUT = 5 V )

30031034

Line Regulation

(VOUT = 16 V )

30031029

Line Regulation

(VOUT = 5 V )

30031033

Efficiency vs Output Current

(VOUT = 16 V )

30031030

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LM4510

Efficiency vs Output Current

(VOUT = 12 V )

30031031

Efficiency vs Output Current

(VOUT = 5 V, L= DO3314-472ML)

30031032

Line Transient Response

(VOUT = 16 V )

30031003

Load Transient Response

(VOUT = 16 V )

30031004

Start Up

(VOUT = 16 V, RLOAD = 530 Ω)

30031007

Shut Down

(VOUT = 16 V, RLOAD = 940 Ω)

30031009

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LM4510

Short Circuit Response

(VOUT = 16 V)

30031008

Output Voltage Ripple

(VOUT = 16 V, IOUT = 90 mA)

30031098

Output Voltage Ripple

(VOUT = 5 V, IOUT = 100 mA)

30031099

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LM4510

Block Diagram

30031013

FIGURE 2. LM4510 Block Diagram

Operation Description

LM4510 is a peak current-mode, fixed-frequency PWM boost

regulator that employs both Synchronous and

Non-Synchronous Switching.

The DC/DC regulator regulates the feedback output voltage

providing excellent line and load transient response. The op-

eration of the LM4510 can best be understood by referring to

the Block Diagram.

NON-SYNCHRONOUS OPERATION

The device operates in Non-synchronous Mode at light load

(IOUT < 10 mA) or when output voltage is lower than 10V (typ.).

At light load, LM4510 automatically changes its switching op-

eration from 'Synchronous' to 'Non-Synchronous' depending

on VIN and L. Non-Synchronous operation at light load maxi-

mizes power efficiency by reducing PMOS driving loss.

OPERATION IN SYNCHRONOUS CONTINUOUS

CONDUCTION MODE (CYCLE 1, CYCLE 2)

30031014

FIGURE 3. Schematic of Synchronous Boost Converter

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LM4510

Synchronous boost converter is shown in Figure 3. At the start

of each cycle, the oscillator sets the driver logic and turns on

the NMOS power device and turns off the PMOS power de-

vice.

Cycle 1 Description

Refer to Figure 4. NMOS switch turn-on → Inductor current

increases and flows to GND.

PMOS switch turn-off → Isolate VOUT from SW → Output ca-

pacitor supplies load current.

30031015

FIGURE 4. Equivalent Circuit During Cycle 1

During operation, EAMP output voltage (VCOMP) increases for

larger loads and decreases for smaller loads. When the sum

of the ramp compensation and the sensed NMOS current

reaches a level determined by the EAMP output voltage, the

PWM COMP resets the logic, turning off the NMOS power

device and turning on the PMOS power device.

Cycle 2 Description

Refer to Figure 5. NMOS Switch turn-off → PMOS Switch turn-

on→ Inductor current decreases and flows through PMOS

→ Inductor current recharges output capacitor and supplies

load current.

30031016

FIGURE 5. Equivalent Circuit During Cycle 2

After the switching period the oscillator then sets the driver

logic again repeating the process.

ON/OFF CONTROL

The LM4510 shuts down when the EN pin is low. In this mode

the feedback resistors and the load are disconnected from the

input in order to avoid leakage current flow and to allow the

output voltage to drop to 0V.

The LM4510 turns on when EN is high. There is an internal

pull-down resistor on the EN pin so the device is in a normally

off state.

SHORT CIRCUIT PROTECTION

When VOUT goes down to VIN–0.7V (typ.), the device stops

switching due to the short-circuit protection circuitry and the

short-circuit output current is limited to IINIT_CHARGE.

FEEDBACK FAULT PROTECTION

The LM4510 features unique Feedback Fault Protection to

maximize safety when the feedback resistor is not properly

connected to a circuit or the feedback node is shorted directly

to ground.

Feedback fault triggers VOUT monitoring. During monitoring,

if VOUT reaches a protection level, the device shuts down.

When the feedback network is reconnected and VOUT is lower

than the OFF threshold level of Feedback Fault Protection,

VOUT monitoring stops. VOUT is then regulated by the control

loop.

INPUT UNDER-VOLTAGE LOCK-OUT

The LM4510 has dedicated circuitry to protect the IC and the

external components when the battery voltage is lower than

the preset threshold. This under-voltage lock-out with hys-

teresis prevents malfunctions during startup or abnormal

power off.

THERMAL SHUTDOWN

If the die temperature exceeds 150°C (typ.), the thermal pro-

tection circuitry shuts down the device. The switches remain

off until the die temperature is reduced to approximately

140°C (typ.).

Application Information

ADJUSTING OUTPUT VOLTAGE

The output voltage is set using the feedback pin and a resistor

voltage divider (RF1, RF2) connected to the output as shown

in the Typical Application Circuit.

The ratio of the feedback resistors sets the output voltage.

RF2 Selection

First of all choose a value for RF2 generally between 10 kΩ

and 25 kΩ.

RF1 Selection

Calculate RF1 using the following equation:

Table 1 gives suggested component values for several typical

output voltages.

TABLE 1. Suggested Component Values for Different Output Voltages

Output Voltage (V) RF2 (kΩ) RF1 (kΩ) RC (kΩ) CC1 (nF)

16 20.5 240 46.4 2.2

12 20.5 174 46.4 2.2

5 20.5 60.4 46.4 2.2

3.3 20.5 33 46.4 2.2

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LM4510

MAXIMUM OUTPUT CURRENT

When the output voltage is set at different level, it is important

to know the maximum load capability. By first order estima-

tion, IOUT(MAX) can be estimated by the following equation:

INDUCTOR SELECTION

The larger value inductor makes lower peak inductor current

and reduces stress on internal power NMOS.

On the other hand, the smaller value inductor has smaller

outline, lower DCR and a higher current capacity. Generally

a 4.7 μH to 15 μH inductor is recommended.

IL_AVE CHECK

The average inductor current is given by the following equa-

tion:

Where IOUT is output current, η is the converter efficiency of

the total driven load and D’ is the off duty cycle of the switching

regulator.

Inductor DC current rating (40°C temperature rise) should be

more than the average inductor current at worst case.

ΔI Define

The inductor ripple current is given by the following equations:

Where D is the on-duty cycle of the switching regulator. A

common choice is to set ΔIL to about 30% of IL_AVE.

IL_PK≤ ICL Check & IMIN Define

The peak inductor current is given by the following equation:

To prevent loss of regulation, ensure that the NMOS power

switch current limit is greater than the worst-case peak in-

ductor current in the target application.

Also make sure that the inductor saturation current is greater

than the peak inductor current under the worst-case load

transient, high ambient temperature and startup conditions.

Refer to Table 2 for suggested inductors.

TABLE 2. Suggested Inductors and Their Suppliers

Model Vendor Dimensions LxWxH (mm) D.C.R (max)

DO3314-472ML COILCRAFT 3.3mm x 3.3mm x 1.4mm 320 mΩ

DO3316P-472ML COILCRAFT 12.95mm x 9.4mm x 5.4mm 18 mΩ

INPUT CAPACITOR SELECTION

Due to the presence of an inductor, the input current wave-

form is continuous and triangular. So the input capacitor is

less critical than output capacitor in boost applications. Typi-

cally, a 4.7 μF to 10 μF ceramic input capacitor is recom-

mended on the VIN pin of the IC.

ICIN_RMS Check

The RMS current in the input capacitor is given by the follow-

ing equation:

The input capacitor should be capable of handling the RMS

current.

OUTPUT CAPACITOR SELECTION

The output capacitor in a boost converter provides all the out-

put current when the switch is closed and the inductor is

charging. As a result, it sees very large ripple currents.

A ceramic capacitor of value 4.7 μF to 10 μF is recommended

at the output. If larger amounts of capacitance are desired for

improved line support and transient response, tantalum ca-

pacitors can be used.

ICOUT_RMS Check

The RMS current in the output capacitor is given by the fol-

lowing equation:

The output capacitor should be capable of handling the RMS

current.

The ESR and ESL of the output capacitor directly control the

output ripple. Use capacitors with low ESR and ESL at the

output for high efficiency and low ripple voltage. The output

capacitor also affects the soft-start time. See Soft-Start Func-

tion and Soft-Start Capacitor Selection. Table 3 shows sug-

gested input and output capacitors.

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LM4510

TABLE 3. Suggested CIN and COUT Capacitors and Their Suppliers

Model Type Vendor Voltage Rating Case Size

Inch (mm)

4.7 µF for CIN

C2012X5R0J475 Ceramic, X5R TDK 6.3V 0805 (2012)

GRM21BR60J475 Ceramic, X5R muRata 6.3V 0805 (2012)

JMK212BJ475 Ceramic, X5R Taiyo-Yuden 6.3V 0805 (2012)

C2012X5R0J475K Ceramic, X5R TDK 6.3V 0603 (1608)

10 µF for COUT

TMK316BJ106KL Ceramic, X5R Taiyo-Yuden 25V 1206 (3216)

12103D106KAT2A Ceramic, X5R AVX 25V 1210 (3225)

SOFT-START FUNCTION AND SOFT-START

CAPACITOR SELECTION

The LM4510 has a soft-start pin that can be used to limit the

input inrush current. Connect a capacitor from SS pin to GND

to set the soft-start period. Figure 6 describes the soft start

process.

•Initial charging period: When the device is turned on, the

control circuitry linearly regulating initial charge current

charges VOUT by limiting the inrush current.

•Soft-start period: After VOUT reaches VIN -0.7V (typ.), the

device starts switching and the CS is charged at a constant

current of 11 μA, ramping up to VIN. This period ends when

VSS reaches VFB. CS should be large enough to ensure

soft-start period ends after CO is fully charged.

During the initial charging period, the required load current

must be smaller than the initial charge current to ensure

VOUT reaches VIN -0.7V (typ.).

30031023

FIGURE 6. Soft Start Timing Diagram

CS Selection

The soft-start time without load can be estimated as:

Where the IINIT_CHARGE is Initial Charging Current depending

on VIN and ISS_CHARGE (11 μA (typ.)). Also, when selecting the

fuse current rating, make sure the value is higher than the

initial charging current.

COMPENSATION COMPONENT SELECTION

The LM4510 provides a compensation pin COMP to cus-

tomize the voltage loop feedback. It is recommended that a

series combination of RC and CC1 be used for the compen-

sation network, as shown in the typical application circuit. In

addition, CC2 is used for compensating high frequency zeros.

The series combination of RC and CC1 introduces a pole-zero

pair according to the following equations:

In addition, CC2 introduces a pole according to the following

equation:

Where RO is the output impedance of the error amplifier, ap-

proximately 1 MΩ, and amplifier voltage gain is typically 200

V/V depending on temperature and VIN.

Refer to Table 4 for suggested soft start capacitor and com-

pensation components.

TABLE 4. Suggested CS and Compensation Components

Model Type Vendor Voltage Rating Case Size

Inch (mm)

(CS) C1608C0G1E103J Ceramic, X5R TDK 6.3V 603 (1608)

(C1)TMK107SD222JA-T Ceramic, X5R Taiyo Yuden 25V 603 (1608)

(RC) 9t06031A4642FBHFT Resistor Yageo Corporation 1/10W 603 (1608)

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LM4510

LAYOUT CONSIDERATIONS AND THERMAL

MANAGEMENT

30031096

FIGURE 7. Evaluation Board Layout

High frequency switching regulators require very careful lay-

out of components in order to get stable operation and low

noise. All components must be as close as possible to the

LM4510 device. Refer to Figure 7 as an example. Some ad-

ditional guidelines to be observed:

1. CIN must be placed close to the device and connected di-

rectly from VIN to PGND pins. This reduces copper trace

resistance, which affects the input voltage ripple of the device.

For additional input voltage filtering, typically a 0.1 uF bypass

capacitor can be placed between VIN and AGND. This by-

pass capacitor should be placed near the device closer than

CIN.

2. COUT must also be placed close to the device and connect-

ed directly from VOUT to PGND pins. Any copper trace

connections for the COUT capacitor can increase the series

resistance, which directly affects output voltage ripple and

makes noise during output voltage sensing.

3. All voltage-sensing resistors (RF1, RF2) should be kept

close to the FB pin to minimize copper trace connections that

can inject noise into the system. The ground connection for

the voltage-sensing resistor should be connected directly to

the AGND pin.

4. Trace connections made to the inductor should be mini-

mized to reduce power dissipation, EMI radiation and in-

crease overall efficiency. Also poor trace connection increas-

es the ripple of SW.

5. CS, CC1, CC2, RC must be placed close to the device and

connected to AGND.

6. The AGND pin should connect directly to the ground. Not

connecting the AGND pin directly, as close to the chip as

possible, may affect the performance of the LM4510 and limit

its current driving capability. AGND and PGND should be

separate planes and should be connected at a single point.

7. For better thermal performance, DAP should be connected

to ground, but cannot be used as the primary ground con-

nection. The PC board land may be modified to a "dog bone"

shape to reduce LLP thermal impedance. For detail informa-

tion, refer to Application Note AN-1187.

FLASH/TORCH APPLICATION

LM4510 can be configured to drive white LEDs for the flash

and torch functions. The flash/torch can be set up with the

circuit shown in Figure 8 by using the resistor RT to determine

the current in Torch Mode and RF to determine the current in

Flash Mode. The amount of current can be estimated using

the following equations:

30031028

FIGURE 8. Flash/Torch Circuit Using LM4510

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LM4510

Physical Dimensions inches (millimeters) unless otherwise noted

10-pin LLP Package

For Ordering, Refer to Ordering Information Table

NS Package Number SDA10A

3mm x 3mm x 0.8mm

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LM4510

Notes

LM4510 Synchronous Step-Up DC/DC Converter with True Shutdown Isolation

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