- Patented Trench Schottky technology
- Excellent high temperature stability
- Low forward voltage
- Low power loss/ high efficiency
- High forward surge capability
- Ideal for automated placement
- Halogen-free according to IEC 61249-2-21 definition
Packing code with suffix "G" means green compound (halogen-free)
Terminal: Matte tin plated leads, solderable per JESD22-B102
Meet JESD 201 class 2 whisker test
SYMBOL UNIT
V
RRM
V
I
F(AV)
A
I
F
= 5A
I
F
= 10A
I
F
= 5A
I
F
= 10A
T
J
= 25°C µA
T
J
= 125°C mA
R
θJL
°C/W
T
J
°C
T
STG
°C
Document Number: DS_D1411030 Version: E15
TYP TYP MAX
0.56 -
30
0.60
0.51
0.49 -
Trench Schottky barrier rectifier is designed for high frequency miniature
switched mode power supplies such as adapters, lighting and on-board
DC/DC converters.
0.57 0.67
Peak forward surge current, 8.3 ms single half sine-wave
superimposed on rated load per diode I
FSM
0.60
-
0.68
-
MAX
Polarity: Indicated by cathode band
Weight: 0.095g (approximately)
Maximum average forward rectified current 10
10U120
Molding compound meets UL 94 V-0 flammability rating
TSP10U100S - TSP10U120S
10A, 100V - 120V Trench Schottky Rectifiers
FEATURES
Moisture sensitivity level: level 1, per J-STD-020
- Compliant to RoHS Directive 2011/65/EU and
in accordance to WEEE 2002/96/EC
TYPIC AL APPLICATIONS
TO-277A (SMPC)
Taiwan Semiconductor
MECHANICAL DATA
Case: TO-277A (SMPC)
A
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (T
A
=25°C unless otherwise noted)
PARAMETER
Marking code
Maximum repetitive peak reverse voltage
TSP10U100S TSP10U120S
10U100
100 120
Maximum instantaneous reverse current
per diode at rated reverse voltage
140
Maximum instantaneous forward voltage
per diode (Note 1) V
F
0.52
0.42
T
J
= 25°C
T
J
= 125°C
0.68
6
10
0.78
10 150
630
Note 1: Pulse Test with Pulse Width=300μs, 1% Duty Cycle
Typical thermal resistance
Operating temperature range - 55 to +150
11
V
I
R
150
Storage temperature range - 55 to +150
PART NO.
Note 1: "xx" defines voltage from 100V (TSP10U100S) to 120V (TSP10U120S)
Note 2: Whole series with green compound
(T
A
=25°C unless otherwise noted)
Document Number: DS_D1411030 Version: E15
TSP10U100S - TSP10U120S
RATINGS AND CHARACTERISTICS CURVES
S2 SMPC
PACKING CODE PACKING CODE
SUFFIX PACKAGE
Taiwan Semiconductor
ORDERING INFORMATION
EXAMPLE
TSP10U1xxS
(Note 1,2)
S1 GSMPC
PART NO.
PREFERRED
PART NO.
TSP10U100S
PACKING CODE
S1TSP10U100S S1G
PACKING
PACKING CODE
SUFFIX
G Green compound
DESCRIPTION
6,000/ 13" Plastic reel
1,500/ 7" Plastic reel
0
2
4
6
8
10
12
0 25 50 75 100 125 150
AVERAGE FORWARD CURRENT (A)
LEAD TEMPERATURE (oC)
FIG.1 FORWARD CURRENT DERATING CURVE
WITH HEATSINK
0.0001
0.001
0.01
0.1
1
10
100
10 20 30 40 50 60 70 80 90 100
INSTANTANEOUS REVERSE CURRENT (mA)
PERCENT OF RATED PEAK REVERSE VOLTAGE (%)
FIG. 4 TYPICAL REVERSE CHARACTERISTICS
TJ=25oC
TJ=100oC
TJ=125oC
TJ=150oC
TSP10U100S
0.1
1
10
100
0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1
INSTANTANEOUS FORWARD CURRENT (A)
FORWARD VOLTAGE (V)
FIG. 2 TYPICAL FORWARD CHARACTERISTICS
TJ=25oC
TJ=100oC
TJ=125oC
TJ=150oC
TSP10U100S
0.1
1
10
100
0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1
TJ=25oC
TJ=125oC
TJ=150oC
TJ=100oC
FIG. 3 TYPICAL FORWARD CHARACTERISTICS
TSP10U120S
INSTANTANEOUS FORWARD CURRENT (A)
FORWARD VOLTAGE (V)
Document Number: DS_D1411030 Version: E15
TSP10U100S - TSP10U120S
Taiwan Semiconductor
100
1000
10000
0.1 1 10 100
JUNCTION CAPACITANCE (pF) A
REVERSE VOLTAGE (V)
FIG. 6 TYPICAL JUNCTION CAPACITANCE
f=1.0MHz
Vsig=50mVp-p
0.0001
0.001
0.01
0.1
1
10
100
10 20 30 40 50 60 70 80 90 100
INSTANTANEOUS REVERSE CURRENT (mA)
PERCENT OF RATED PEAK REVERSE VOLTAGE (%)
FIG. 5 TYPICAL REVERSE CHARACTERISTICS
TJ=25oC
TJ=100oC
TJ=125oC
TJ=150oC
TSP10U120S
0
40
80
120
160
200
1 10 100
PEAK FORWARD SURGE CURRENT (A)
NUMBER OF CYCLES AT 60 Hz
FIG. 7 MAXIMUM NON-REPETITIVE FORWARD
SURGE CURRENT
8.3ms Single Half Sine-Wave
8.3ms Single Half Sine-Wave
DIM. Min Max Min Max
A 5.650 5.750 0.222 0.226
B 6.350 6.650 0.250 0.262
C 4.550 4.650 0.179 0.183
D 3.540 3.840 0.139 0.151
E 4.235 4.535 0.167 0.179
F 1.850 2.150 0.073 0.085
G 3.170 3.470 0.125 0.137
H 1.043 1.343 0.041 0.053
I 1.000 1.300 0.039 0.051
J 1.930 2.230 0.076 0.088
K 0.175 0.325 0.007 0.013
L 1.000 1.200 0.039 0.047
SUGG ESTED PAD LAYOUT
Symbol
A
B
C
D
E
F
P/N = Marking Code
YW = Date Code
F = Factory Code
Document Number: DS_D1411030 Version: E15
TSP10U100S - TSP10U120S
Taiwan Semiconductor
PACKAGE OUTLINE DIMENSIONS
TO-277A (SMPC)
Unit (mm) Unit (inch)
Unit (mm) Unit (inch)
4.80 0.189
4.72 0.186
1.04 0.041
MARKING DIAGRAM
1.40 0.055
1.27 0.050
6.80 0.268
CREAT BY ART
Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf,
assumes no responsibility or liability for any errors or inaccuracies.
Information contained herein is intended to provide a product description only. No license, express or implied, to
any intellectual property rights is granted by this document. Except as provided in TSC's terms and conditions of
sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty,
relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose,
merchantability, or infringement of any patent, copyright, or other intellectual property right.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications.
Customers using or selling these products for use in such applications do so at their own risk and agree to fully
indemnify TSC for any damages resulting from such improper use or sale.
Document Number: DS_D1411030 Version: D14
TSP10U100S - TSP10U120S
Taiwan Semiconductor
Notice
