LPV321, LPV324-N, LPV358-N www.ti.com SNOS413D - AUGUST 2000 - REVISED MARCH 2013 LPV321-N Single/LPV358 Dual/LPV324 Quad General Purpose, Low Voltage, Low Power, Rail-to-Rail Output Operational Amplifiers Check for Samples: LPV321, LPV324-N, LPV358-N FEATURES DESCRIPTION 1 (For V+ = 5V and V- = 0V, Typical Unless Otherwise Noted) 2 * * * * * * * * Ensured 2.7V and 5V Performance No Crossover Distortion Space Saving Package - 5-Pin SC70 2.0x2.1x1.0 mm Industrial Temperature Range, -40C to +85C Gain-Bandwidth Product, 152 kHz Low Supply Current - LPV321-N, 9 A - LPV358, 15 A - LPV324, 28 A Rail-to-Rail Output Swing @ 100 k Load - V+-3.5 mV - V-+90 mV VCM, -0.2V to V+-0.8V APPLICATIONS * * * Active Filters General Purpose Low Voltage Applications General Purpose Portable Devices The LPV321-N/358/324 are low power (9 A per channel at 5.0V) versions of the LMV321/358/324 op amps. This is another addition to the LMV321N/358/324 family of commodity op amps. The LPV321-N/358/324 are the most cost effective solutions for the applications where low voltage, low power operation, space saving and low price are needed. The LPV321-N/358/324 have rail-to-rail output swing capability and the input common-mode voltage range includes ground. They all exhibit excellent speed-power ratio, achieving 5 kHz of bandwidth with a supply current of only 9 A. The LPV321-N is available in space saving 5-Pin SC70, which is approximately half the size of 5-Pin SOT-23. The small package saves space on PC boards, and enables the design of small portable electronic devices. It also allows the designer to place the device closer to the signal source to reduce noise pickup and increase signal integrity. The chips are built with Texas Instruments's advanced submicron silicon-gate BiCMOS process. The LPV321-N/358/324 have bipolar input and output stages for improved noise performance and higher output current drive. Connection Diagram Top View Figure 1. 5-Pin SC70 and SOT-23 Packages See Package Numbers DCK0005A and DBV0005A Top View Top View Figure 2. 8-Pin SOIC and VSSOP Figure 3. 14-Pin SOIC and TSSOP Packages Packages See Package Numbers D0008A See Package Numbers D0014A and DGK0008A and PW0014A 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright (c) 2000-2013, Texas Instruments Incorporated LPV321, LPV324-N, LPV358-N SNOS413D - AUGUST 2000 - REVISED MARCH 2013 www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. Absolute Maximum Ratings ESD Tolerance (1) (2) (3) Human Body Model LPV324 2000V LPV358 1500V LPV321-N 1500V Machine Model 100V Differential Input Voltage Supply Voltage Supply Voltage (V+-V -) 5.5V Output Short Circuit to V + (4) Output Short Circuit to V - (5) Soldering Information Infrared or Convection (20 sec) 235C Storage Temperature Range -65C to 150C (6) 150C Junction Temp. (TJ, max) (1) (2) (3) (4) (5) (6) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test conditions, see the Electrical Characteristics. If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and specifications. Human Body Model, applicable std. MIL-STD-883, Method 3015.7. Machine Model, applicable std. JESD22-A115-A (ESD MM std. of JEDEC)Field-Induced Charge-Device Model, applicable std. JESD22-C101-C (ESD FICDM std. of JEDEC). Shorting output to V+ will adversely affect reliability. Shorting output to V- will adversely affect reliability. The maximum power dissipation is a function of TJ(MAX), JA. The maximum allowable power dissipation at any ambient temperature is PD = (TJ(MAX) - TA)/ JA. All numbers apply for packages soldered directly onto a PC Board. Operating Ratings (1) Supply Voltage 2.7V to 5V -40C to +85C Temperature Range Thermal Resistance (JA) (2) (1) (2) 2 5-Pin SC70 478C/W 5-Pin SOT-23 265C/W 8-Pin SOIC 190C/W 8-Pin VSSOP 235C/W 14-Pin SOIC 145C/W 14-Pin TSSOP 155C/W Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test conditions, see the Electrical Characteristics. All numbers are typical, and apply for packages soldered directly onto a PC board in still air. Submit Documentation Feedback Copyright (c) 2000-2013, Texas Instruments Incorporated Product Folder Links: LPV321 LPV324-N LPV358-N LPV321, LPV324-N, LPV358-N www.ti.com SNOS413D - AUGUST 2000 - REVISED MARCH 2013 2.7V DC Electrical Characteristics Unless otherwise specified, all limits specified for TJ = 25C, V+ = 2.7V, V- = 0V, VCM = 1.0V, VO = V+/2 and R L > 1 M. Parameter Test Conditions Min (1) Typ (2) (1) Units VOS Input Offset Voltage TCVOS Input Offset Voltage Average Drift IB Input Bias Current 1.7 50 nA IOS Input Offset Current 0.6 40 nA CMRR Common Mode Rejection Ratio 0V VCM 1.7V 50 70 dB PSRR Power Supply Rejection Ratio 2.7V V+ 5V VO = 1V, VCM = 1V 50 65 dB VCM Input Common-Mode Voltage Range For CMRR 50 dB 0 -0.2 Output Swing RL = 100 k to 1.35V VO 1.2 Max 1.9 (1) (2) Supply Current mV V/C V+ -100 V 1.7 V+ -3 80 IS 7 2 mV 180 LPV321-N 4 8 LPV358 Both Amplifiers 8 16 LPV324 All Four Amplifiers 16 A 24 All limits are specified by testing or statistical analysis. Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may vary over time and will also depend on the application and configuration. The typical values are not tested and are not ensured on shipped production material. 2.7V AC Electrical Characteristics Unless otherwise specified, all limits specified for TJ = 25C, V+ = 2.7V, V- = 0V, VCM = 1.0V, VO = V+/2 and R L > 1 M. Parameter Test Conditions Min (1) (2) Max (1) Units GBWP Gain-Bandwidth Product 112 kHz m Phase Margin 97 Deg Gm Gain Margin 35 dB en Input-Referred Voltage Noise f = 1 kHz 178 nV/Hz in Input-Referred Current Noise f = 1 kHz 0.50 pA/Hz (1) (2) CL = 22 pF Typ All limits are specified by testing or statistical analysis. Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may vary over time and will also depend on the application and configuration. The typical values are not tested and are not ensured on shipped production material. 5V DC Electrical Characteristics Unless otherwise specified, all limits specified for TJ = 25C, V+ = 5V, V- = 0V, VCM = 2.0V, VO = V+/2 and R L > 1 M. Boldface limits apply at the temperature extremes. Parameter Test Conditions Min (1) Typ (2) (1) Units VOS Input Offset Voltage TCVOS Input Offset Voltage Average Drift 2 IB Input Bias Current 2 50 60 nA IOS Input Offset Current 0.6 40 50 nA CMRR Common Mode Rejection Ratio (1) (2) 1.5 Max 0V VCM 4V 50 7 10 mV V/C 71 dB All limits are specified by testing or statistical analysis. Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may vary over time and will also depend on the application and configuration. The typical values are not tested and are not ensured on shipped production material. Copyright (c) 2000-2013, Texas Instruments Incorporated Product Folder Links: LPV321 LPV324-N LPV358-N Submit Documentation Feedback 3 LPV321, LPV324-N, LPV358-N SNOS413D - AUGUST 2000 - REVISED MARCH 2013 www.ti.com 5V DC Electrical Characteristics (continued) Unless otherwise specified, all limits specified for TJ = 25C, V+ = 5V, V- = 0V, VCM = 2.0V, VO = V+/2 and R L > 1 M. Boldface limits apply at the temperature extremes. Parameter Test Conditions + Min (1) Typ (2) PSRR Power Supply Rejection Ratio 2.7V V 5V VO = 1V, VCM = 1V 50 65 VCM Input Common-Mode Voltage Range For CMRR 50 dB 0 -0.2 Large Signal Voltage Gain RL = 100 k AV VO Output Swing RL = 100 k to 2.5V 15 10 V+ + -100 V -200 Output Short Circuit Current Sourcing LPV324, LPV358, and LPV321-N VO = 0V Output Short Circuit Current Sinking LPV321-N VO = 5V LPV324 and LPV358 VO = 5V IS (3) Supply Current Units V 4 100 V/mV + V -3.5 90 IO (1) dB 4.2 (3) Max 2 16 20 60 11 16 180 220 mV mA LPV321-N 9 12 15 LPV358 Both amplifiers 15 20 24 LPV324 All four amplifiers 28 42 46 A RL is connected to V -. The output voltage is 0.5V VO 4.5V. 5V AC Electrical Characteristics Unless otherwise specified, all limits specified for TJ = 25C, V+ = 5V, V- = 0V, VCM = 2.0V, VO = V+/2 and R L > 1M. Boldface limits apply at the temperature extremes. Parameter SR Slew Rate GBWP Gain-Bandwidth Product m Gm en Input-Referred Voltage Noise in Input-Referred Current Noise (1) (2) (3) 4 Test Conditions Min (1) (3) Typ (2) Min (1) Units 0.1 V/s 152 kHz Phase Margin 87 Deg Gain Margin 19 dB f = 1 kHz, 146 nV/Hz f = 1 kHz 0.30 pA/Hz CL = 22 pF All limits are specified by testing or statistical analysis. Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may vary over time and will also depend on the application and configuration. The typical values are not tested and are not ensured on shipped production material. Connected as voltage follower with 3V step input. Number specified is the slower of the positive and negative slew rates. Submit Documentation Feedback Copyright (c) 2000-2013, Texas Instruments Incorporated Product Folder Links: LPV321 LPV324-N LPV358-N LPV321, LPV324-N, LPV358-N www.ti.com SNOS413D - AUGUST 2000 - REVISED MARCH 2013 Typical Performance Characteristics Unless otherwise specified, VS = +5V, single supply, TA = 25C. Supply Current vs. Supply Voltage (LPV321-N) Input Current vs. Temperature Figure 4. Figure 5. Sourcing Current vs. Output Voltage Sourcing Current vs. Output Voltage Figure 6. Figure 7. Sinking Current vs. Output Voltage Sinking Current vs. Output Voltage Figure 8. Figure 9. Copyright (c) 2000-2013, Texas Instruments Incorporated Product Folder Links: LPV321 LPV324-N LPV358-N Submit Documentation Feedback 5 LPV321, LPV324-N, LPV358-N SNOS413D - AUGUST 2000 - REVISED MARCH 2013 www.ti.com Typical Performance Characteristics (continued) Unless otherwise specified, VS = +5V, single supply, TA = 25C. 6 Output Voltage Swing vs. Supply Voltage Input Voltage Noise vs. Frequency Figure 10. Figure 11. Input Current Noise vs Frequency Input Current Noise vs Frequency Figure 12. Figure 13. Crosstalk Rejection vs. Frequency PSRR vs. Frequency Figure 14. Figure 15. Submit Documentation Feedback Copyright (c) 2000-2013, Texas Instruments Incorporated Product Folder Links: LPV321 LPV324-N LPV358-N LPV321, LPV324-N, LPV358-N www.ti.com SNOS413D - AUGUST 2000 - REVISED MARCH 2013 Typical Performance Characteristics (continued) Unless otherwise specified, VS = +5V, single supply, TA = 25C. CMRR vs. Frequency CMRR vs. Input Common Mode Voltage Figure 16. Figure 17. CMRR vs. Input Common Mode Voltage VOS vs. VCM Figure 18. Figure 19. VOS vs. VCM Input Voltage vs. Output Voltage Figure 20. Figure 21. Copyright (c) 2000-2013, Texas Instruments Incorporated Product Folder Links: LPV321 LPV324-N LPV358-N Submit Documentation Feedback 7 LPV321, LPV324-N, LPV358-N SNOS413D - AUGUST 2000 - REVISED MARCH 2013 www.ti.com Typical Performance Characteristics (continued) Unless otherwise specified, VS = +5V, single supply, TA = 25C. 8 Input Voltage vs. Output Voltage Open Loop Frequency Response Figure 22. Figure 23. Open Loop Frequency Response Gain and Phase vs. Capacitive Load Figure 24. Figure 25. Gain and Phase vs. Capacitive Load Slew Rate vs. Supply Voltage Figure 26. Figure 27. Submit Documentation Feedback Copyright (c) 2000-2013, Texas Instruments Incorporated Product Folder Links: LPV321 LPV324-N LPV358-N LPV321, LPV324-N, LPV358-N www.ti.com SNOS413D - AUGUST 2000 - REVISED MARCH 2013 Typical Performance Characteristics (continued) Unless otherwise specified, VS = +5V, single supply, TA = 25C. Non-Inverting Large Signal Pulse Response Non-Inverting Small Signal Pulse Response Figure 28. Figure 29. Inverting Large Signal Pulse Response Inverting Small Signal Pulse Response Figure 30. Figure 31. Stability vs. Capacitive Load Stability vs. Capacitive Load Figure 32. Figure 33. Copyright (c) 2000-2013, Texas Instruments Incorporated Product Folder Links: LPV321 LPV324-N LPV358-N Submit Documentation Feedback 9 LPV321, LPV324-N, LPV358-N SNOS413D - AUGUST 2000 - REVISED MARCH 2013 www.ti.com Typical Performance Characteristics (continued) Unless otherwise specified, VS = +5V, single supply, TA = 25C. 10 Stability vs. Capacitive Load Stability vs. Capacitive Load Figure 34. Figure 35. THD vs. Frequency Open Loop Output Impedance vs Frequency Figure 36. Figure 37. Short Circuit Current vs. Temperature (Sinking) Short Circuit Current vs. Temperature (Sourcing) Figure 38. Figure 39. Submit Documentation Feedback Copyright (c) 2000-2013, Texas Instruments Incorporated Product Folder Links: LPV321 LPV324-N LPV358-N LPV321, LPV324-N, LPV358-N www.ti.com SNOS413D - AUGUST 2000 - REVISED MARCH 2013 APPLICATION INFORMATION Benefits of the LPV321-N/358/324 Size The small footprints of the LPV321-N/358/324 packages save space on printed circuit boards, and enable the design of smaller electronic products, such as cellular phones, pagers, or other portable systems. The low profile of the LPV321-N/358/324 make them possible to use in PCMCIA type III cards. Signal Integrity Signals can pick up noise between the signal source and the amplifier. By using a physically smaller amplifier package, the LPV321-N/358/324 can be placed closer to the signal source, reducing noise pickup and increasing signal integrity. Simplified Board Layout These products help you to avoid using long pc traces in your pc board layout. This means that no additional components, such as capacitors and resistors, are needed to filter out the unwanted signals due to the interference between the long pc traces. Low Supply Current These devices will help you to maximize battery life. They are ideal for battery powered systems. Low Supply Voltage TI provides ensured performance at 2.7V and 5V. These specifications ensure operation throughout the battery lifetime. Rail-to-Rail Output Rail-to-rail output swing provides maximum possible dynamic range at the output. This is particularly important when operating on low supply voltages. Input Includes Ground Allows direct sensing near GND in single supply operation. The differential input voltage may be larger than V+ without damaging the device. Protection should be provided to prevent the input voltages from going negative more than -0.3V (at 25C). An input clamp diode with a resistor to the IC input terminal can be used. Capacitive Load Tolerance The LPV321-N/358/324 can directly drive 200 pF in unity-gain without oscillation. The unity-gain follower is the most sensitive configuration to capacitive loading. Direct capacitive loading reduces the phase margin of amplifiers. The combination of the amplifier's output impedance and the capacitive load induces phase lag. This results in either an underdamped pulse response or oscillation. To drive a heavier capacitive load, circuit in Figure 40 can be used. Figure 40. Indirectly Driving A Capacitive Load Using Resistive Isolation Copyright (c) 2000-2013, Texas Instruments Incorporated Product Folder Links: LPV321 LPV324-N LPV358-N Submit Documentation Feedback 11 LPV321, LPV324-N, LPV358-N SNOS413D - AUGUST 2000 - REVISED MARCH 2013 www.ti.com In Figure 40, the isolation resistor RISO and the load capacitor CL form a pole to increase stability by adding more phase margin to the overall system. The desired performance depends on the value of RISO. The bigger the RISO resistor value, the more stable VOUT will be. Figure 41 is an output waveform of Figure 40 using 100 k for RISO and 1000 pF for CL. Figure 41. Pulse Response of the LPV324 Circuit in Figure 40 The circuit in Figure 42 is an improvement to the one in Figure 40 because it provides DC accuracy as well as AC stability. If there were a load resistor in Figure 40, the output would be voltage divided by RISO and the load resistor. Instead, in Figure 42, RF provides the DC accuracy by using feed-forward techniques to connect VIN to RL. Caution is needed in choosing the value of RF due to the input bias current of the LPV321-N/358/324. CF and RISO serve to counteract the loss of phase margin by feeding the high frequency component of the output signal back to the amplifier's inverting input, thereby preserving phase margin in the overall feedback loop. Increased capacitive drive is possible by increasing the value of CF. This in turn will slow down the pulse response. Figure 42. Indirectly Driving A Capacitive Load with DC Accuracy Input Bias Current Cancellation The LPV321-N/358/324 family has a bipolar input stage. The typical input bias current of LPV321-N/358/324 is 1.5 nA with 5V supply. Thus a 100 k input resistor will cause 0.15 mV of error voltage. By balancing the resistor values at both inverting and non-inverting inputs, the error caused by the amplifier's input bias current will be reduced. The circuit in Figure 43 shows how to cancel the error caused by input bias current. Figure 43. Cancelling the Error Caused by Input Bias Current 12 Submit Documentation Feedback Copyright (c) 2000-2013, Texas Instruments Incorporated Product Folder Links: LPV321 LPV324-N LPV358-N LPV321, LPV324-N, LPV358-N www.ti.com SNOS413D - AUGUST 2000 - REVISED MARCH 2013 Typical Single-Supply Application Circuits Difference Amplifier The difference amplifier allows the subtraction of two voltages or, as a special case, the cancellation of a signal common to two inputs. It is useful as a computational amplifier, in making a differential to single-ended conversion or in rejecting a common mode signal. Figure 44. Difference Amplifier (1) Instrumentation Circuits The input impedance of the previous difference amplifier is set by the resistor R1, R2, R3, and R4. To eliminate the problems of low input impedance, one way is to use a voltage follower ahead of each input as shown in the following two instrumentation amplifiers. Three-op-amp Instrumentation Amplifier The quad LPV324 can be used to build a three-op-amp instrumentation amplifier as shown in Figure 45 Figure 45. Three-op-amp Instrumentation Amplifier The first stage of this instrumentation amplifier is a differential-input, differential-output amplifier, with two voltage followers. These two voltage followers assure that the input impedance is over 100 M. The gain of this instrumentation amplifier is set by the ratio of R2/R1. R3 should equal R1 and R4 equal R2. Matching of R3 to R1 and R4 to R2 affects the CMRR. For good CMRR over temperature, low drift resistors should be used. Making R4 Slightly smaller than R 2 and adding a trim pot equal to twice the difference between R 2 and R4 will allow the CMRR to be adjusted for optimum. Copyright (c) 2000-2013, Texas Instruments Incorporated Product Folder Links: LPV321 LPV324-N LPV358-N Submit Documentation Feedback 13 LPV321, LPV324-N, LPV358-N SNOS413D - AUGUST 2000 - REVISED MARCH 2013 www.ti.com Two-op-amp Instrumentation Amplifier A two-op-amp instrumentation amplifier can also be used to make a high-input-impedance DC differential amplifier (Figure 46). As in the three-op-amp circuit, this instrumentation amplifier requires precise resistor matching for good CMRR. R4 should equal to R1 and R3 should equal R2. Figure 46. Two-op-amp Instrumentation Amplifier (2) Single-Supply Inverting Amplifier There may be cases where the input signal going into the amplifier is negative. Because the amplifier is operating in single supply voltage, a voltage divider using R3 and R4 is implemented to bias the amplifier so the input signal is within the input common-common voltage range of the amplifier. The capacitor C1 is placed between the inverting input and resistor R1 to block the DC signal going into the AC signal source, VIN. The values of R1 and C1 affect the cutoff frequency, fc = 1/2 R 1C1 (3) As a result, the output signal is centered around mid-supply (if the voltage divider provides V+/2 at the noninverting input). The output can swing to both rails, maximizing the signal-to-noise ratio in a low voltage system. Figure 47. Single-Supply Inverting Amplifier (4) Active Filter Simple Low-Pass Active Filter The simple low-pass filter is shown in Figure 48. Its low-frequency gain( o) is defined by -R3/R1. This allows low-frequency gains other than unity to be obtained. The filter has a -20 dB/decade roll-off after its corner frequency fc. R2 should be chosen equal to the parallel combination of R1 and R3 to minimize errors due to bais current. The frequency response of the filter is shown in Figure 49 14 Submit Documentation Feedback Copyright (c) 2000-2013, Texas Instruments Incorporated Product Folder Links: LPV321 LPV324-N LPV358-N LPV321, LPV324-N, LPV358-N www.ti.com SNOS413D - AUGUST 2000 - REVISED MARCH 2013 Figure 48. Simple Low-Pass Active Filter (5) Figure 49. Frequency Response of Simple Low-pass Active Filter in Figure 9 Note that the single-op-amp active filters are used in to the applications that require low quality factor, Q ( 10), low frequency ( 5 kHz), and low gain ( 10), or a small value for the product of gain times Q ( 100). The op amp should have an open loop voltage gain at the highest frequency of interest at least 50 times larger than the gain of the filter at this frequency. In addition, the selected op amp should have a slew rate that meets the following requirement: Slew Rate 0.5 x (HV OPP) X 10-6V/sec where * * H is the highest frequency of interest VOPP is the output peak-to-peak voltage Copyright (c) 2000-2013, Texas Instruments Incorporated Product Folder Links: LPV321 LPV324-N LPV358-N (6) Submit Documentation Feedback 15 LPV321, LPV324-N, LPV358-N SNOS413D - AUGUST 2000 - REVISED MARCH 2013 www.ti.com REVISION HISTORY Changes from Revision C (March 2013) to Revision D * 16 Page Changed layout of National Data Sheet to TI format .......................................................................................................... 15 Submit Documentation Feedback Copyright (c) 2000-2013, Texas Instruments Incorporated Product Folder Links: LPV321 LPV324-N LPV358-N PACKAGE OPTION ADDENDUM www.ti.com 1-Nov-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (C) Device Marking (4/5) LPV321M5 NRND SOT-23 DBV 5 1000 TBD Call TI Call TI -40 to 85 A27A LPV321M5/NOPB ACTIVE SOT-23 DBV 5 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 A27A LPV321M5X NRND SOT-23 DBV 5 3000 TBD Call TI Call TI -40 to 85 A27A LPV321M5X/NOPB ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 A27A LPV321M7 NRND SC70 DCK 5 1000 TBD Call TI Call TI -40 to 85 A19 LPV321M7/NOPB ACTIVE SC70 DCK 5 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 A19 LPV321M7X NRND SC70 DCK 5 3000 TBD Call TI Call TI -40 to 85 A19 LPV321M7X/NOPB ACTIVE SC70 DCK 5 3000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 A19 LPV324M/NOPB ACTIVE SOIC D 14 55 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 LPV324M LPV324MT/NOPB ACTIVE TSSOP PW 14 94 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 LPV324 MT LPV324MTX NRND TSSOP PW 14 2500 TBD Call TI Call TI -40 to 85 LPV324 MT LPV324MTX/NOPB ACTIVE TSSOP PW 14 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 LPV324 MT LPV324MX NRND SOIC D 14 2500 TBD Call TI Call TI -40 to 85 LPV324M LPV324MX/NOPB ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 LPV324M LPV358M/NOPB ACTIVE SOIC D 8 95 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM LPV 358M LPV358MM NRND VSSOP DGK 8 1000 TBD Call TI Call TI -40 to 85 P358 LPV358MM/NOPB ACTIVE VSSOP DGK 8 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 P358 LPV358MMX/NOPB ACTIVE VSSOP DGK 8 3500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 P358 LPV358MX NRND SOIC D 8 2500 TBD Call TI Call TI -40 to 85 LPV 358M Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com Orderable Device 1-Nov-2013 Status (1) LPV358MX/NOPB ACTIVE Package Type Package Pins Package Drawing Qty SOIC D 8 2500 Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM Op Temp (C) Device Marking (4/5) -40 to 85 LPV 358M (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 Samples PACKAGE MATERIALS INFORMATION www.ti.com 23-Sep-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) LPV321M5 SOT-23 DBV 5 1000 178.0 8.4 LPV321M5/NOPB SOT-23 DBV 5 1000 178.0 LPV321M5X SOT-23 DBV 5 3000 178.0 LPV321M5X/NOPB SOT-23 DBV 5 3000 LPV321M7 SC70 DCK 5 LPV321M7/NOPB SC70 DCK LPV321M7X SC70 DCK LPV321M7X/NOPB SC70 W Pin1 (mm) Quadrant 3.2 3.2 1.4 4.0 8.0 Q3 8.4 3.2 3.2 1.4 4.0 8.0 Q3 8.4 3.2 3.2 1.4 4.0 8.0 Q3 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 1000 178.0 8.4 2.25 2.45 1.2 4.0 8.0 Q3 5 1000 178.0 8.4 2.25 2.45 1.2 4.0 8.0 Q3 5 3000 178.0 8.4 2.25 2.45 1.2 4.0 8.0 Q3 DCK 5 3000 178.0 8.4 2.25 2.45 1.2 4.0 8.0 Q3 LPV324MTX TSSOP PW 14 2500 330.0 12.4 6.95 8.3 1.6 8.0 12.0 Q1 LPV324MTX/NOPB TSSOP PW 14 2500 330.0 12.4 6.95 8.3 1.6 8.0 12.0 Q1 LPV324MX SOIC D 14 2500 330.0 16.4 6.5 9.35 2.3 8.0 16.0 Q1 LPV324MX/NOPB SOIC D 14 2500 330.0 16.4 6.5 9.35 2.3 8.0 16.0 Q1 LPV358MM VSSOP DGK 8 1000 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 LPV358MM/NOPB VSSOP DGK 8 1000 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 LPV358MMX/NOPB VSSOP DGK 8 3500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 LPV358MX SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 LPV358MX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 23-Sep-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LPV321M5 SOT-23 DBV 5 1000 210.0 185.0 35.0 LPV321M5/NOPB SOT-23 DBV 5 1000 210.0 185.0 35.0 LPV321M5X SOT-23 DBV 5 3000 210.0 185.0 35.0 LPV321M5X/NOPB SOT-23 DBV 5 3000 210.0 185.0 35.0 LPV321M7 SC70 DCK 5 1000 210.0 185.0 35.0 LPV321M7/NOPB SC70 DCK 5 1000 210.0 185.0 35.0 LPV321M7X SC70 DCK 5 3000 210.0 185.0 35.0 LPV321M7X/NOPB SC70 DCK 5 3000 210.0 185.0 35.0 LPV324MTX TSSOP PW 14 2500 367.0 367.0 35.0 LPV324MTX/NOPB TSSOP PW 14 2500 367.0 367.0 35.0 LPV324MX SOIC D 14 2500 367.0 367.0 35.0 LPV324MX/NOPB SOIC D 14 2500 367.0 367.0 35.0 LPV358MM VSSOP DGK 8 1000 210.0 185.0 35.0 LPV358MM/NOPB VSSOP DGK 8 1000 210.0 185.0 35.0 LPV358MMX/NOPB VSSOP DGK 8 3500 367.0 367.0 35.0 LPV358MX SOIC D 8 2500 367.0 367.0 35.0 LPV358MX/NOPB SOIC D 8 2500 367.0 367.0 35.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as "components") are sold subject to TI's terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI's terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers' products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers' products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI's goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or "enhanced plastic" are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of non-designated products, TI will not be responsible for any failure to meet ISO/TS16949. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP(R) Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright (c) 2013, Texas Instruments Incorporated