SCOPE: MICROPROCESSOR SUPERVISORY CIRCUITS
Device Type Generic Number
01 MAX696(x)/883B
02 MAX697(x)/883B
Case Outline(s). The case outlines shall be designated in Mil-Std-1835 and as follows:
Outline Letter Mil-Std-1835 Case Outline Package Code
MAXIM SMD
JE E GDIP1-T16 or CDIP2-T16 16 LEAD CERDIP J16
LP 2 CQCC1-N20 20 Pin Leadless Chip L20
A bsolute Maximum Ratings
Terminal Voltage
VCC for 01 ....................................................................................................... -0.3V to +6.0V
VCC for 02 ..................................................................................................................... +0.3V
VBATT for 01 .................................................................................................... -0.3V to +6.0V
GND for 02 .................................................................................................................... -0.3V
All other Inputs 1/ ................................................................................. -0.3V to (VOUT+0.5V)
Input Current
VCC ............................................................................................................................... 200mA
VBATT .............................................................................................................................. 50mA
GND ............................................................................................................................... 20mA
Output Current
VOUT .................................................................................................. Short-circuit protected
All other outputs ........................................................................................................... 20mA
Rate of Rise, VCC, VBATT ................................................................................................ 100V/µs
Lead Temperature (soldering, 10 seconds) ...................................................................... +300°C
Storage Temperature ......................................................................................... -65°C to +160°C
Continuous Power Dissipation ................................................................................... TA=+70°C
16 lead CERDIP(derate 10.0mW/°C above +70°C) ................................................. 800mW
20 lead LCC(derate 9.1mW/°C above +70°C) ......................................................... 727mW
Junct ion Temperature TJ ............................................................................................ +150°C
Thermal Resista nce, J unction to Case, ΘJC:
Case Outline 16 lead CERDIP................................................................... 50°C/W
Case Outline 20 leadless Chip carrier ....................................................... 20°C/W
Thermal Resistance, Junction to Ambient, ΘJA:
Case Outline 16 lead CERDIP................................................................. 100°C/W
Case Outline 20 leadless Chip carrier ..................................................... 110°C/W
Recommended Operating Co ndit ions
Ambient Operating Range (TA) ............................................................. -55°C to +125°C
Supply Voltage Range (VCC) ....................................................................... +3.0V to 5.5V
NOTE 1: The input voltage limits on PFI and WDI may be exceeded if the input current is limited to
less than 10mA.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device.
These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those indicated in the operational section s of the sp ecifica tions is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
---------------------------- Electrical Characteristics of MAX696/697/883B 19-2554 Rev. D
for /883B and SMD 5962-93125 Page 2 of 8