2002-2011 Microchip Technology Inc. DS21465C-page 1
TC7660
Features
Wide Input Voltage Range: +1.5V to +10V
Efficient Voltage Conversion (99.9%, typ)
Excellent Power Efficiency (98%, typ)
Low Power Consumption: 80 µA (typ) @ VIN = 5V
Low Cost and Easy to Use
- Only Two External Capacitors Required
Available in 8-Pin Small Outline (SOIC), 8-Pin
PDIP and 8-Pin CERDIP Packages
Improved ESD Protection (3 kV HBM)
No External Diode Required for High-Voltage
Operation
Applications
RS-232 Negative Power Supply
Simple Conversion of +5V to ±5V Supplies
Voltage Multiplication VOUT = ± n V+
Negative Supplies for Data Acquisition Systems
and Instrumentation
Package Types
General Description
The TC7660 device is a pin-compatible replacement
for the industry standard 7660 charge pump voltage
converter. It converts a +1.5V to +10V input to a corre-
sponding -1.5V to -10V output using only two low-cost
capacitors, eliminating inductors and their associated
cost, size and electromagnetic interference (EMI).
The on-board oscillator operates at a nominal fre-
quency of 10 kHz. Operation below 10 kHz (for lower
supply current applications) is possible by connecting
an external capacitor from OSC to ground.
The TC7660 is available in 8-Pin PDIP, 8-Pin Small
Outline (SOIC) and 8-Pin CERDIP packages in
commercial and extended temperature ranges.
Functional Block Diagram
1
2
3
4
8
7
6
5
TC7660
NC
CAP+
GND
CAP-VOUT
LOW
VOLTAGE (LV)
OSC
PDIP/CERDIP/SOIC
V+
TC7660
GND
Internal
Voltage
Regulator
RC
Oscillator
Voltage
Level
Translator
V
+
CAP
+
82
7
6
OSC
LV
3
Logic
Network
V
OUT
5
CAP-
4

2
Internal
Voltage
Regulator
Charge Pump DC-to-DC Voltage Converter
TC7660
DS21465C-page 2 2002-2011 Microchip Technology Inc.
1.0 ELECTRICAL
CHARACTERISTICS
Absolute Maximum Ratings*
Supply Voltage .............................................................+10.5V
LV and OSC Inputs Voltage: (Note 1)
.............................................. -0.3V to VSS for V+ < 5.5V
.....................................(V+ – 5.5V) to (V+) for V+ > 5.5V
Current into LV .........................................20 µA for V+ > 3.5V
Output Short Duration (VSUPPLY 5.5V)...............Continuous
Package Power Dissipation: (TA 70°C)
8-Pin CERDIP ....................................................800 mW
8-Pin PDIP .........................................................730 mW
8-Pin SOIC.........................................................470 mW
Operating Temperature Range:
C Suffix.......................................................0°C to +70°C
I Suffix .....................................................-25°C to +85°C
E Suffix....................................................-40°C to +85°C
M Suffix .................................................-55°C to +125°C
Storage Temperature Range .........................-65°C to +160°C
ESD protection on all pins (HBM) ................................. 3kV
Maximum Junction Temperature ........... ....................... 150°C
* Notice: Stresses above those listed under “Maximum Rat-
ings” may cause permanent damage to the device. This is a
stress rating only and functional operation of the device at
those or any other conditions above those indicated in the
operational sections of this specification is not intended. Expo-
sure to maximum rating conditions for extended periods may
affect device reliability.
FIGURE 1-1: TC7660 Test Circuit.
ELECTRICAL SPECIFICATIONS
1
2
3
4
8
7
6
5
TC7660
+
V+
(+5V)
VOUT
C1
10 µF
COSC
+
C2
10 µF
IL
RL
IS
Electrical Characteristics: Unless otherwise noted, specifications measured over operating temperature range with V+ = 5V,
COSC = 0, refer to test circuit in Figure 1-1.
Parameters Sym Min Typ Max Units Conditions
Supply Current I+ 80 180 µA RL =
Supply Voltage Range, High V+H3.0 10 V Min TAMax, RL = 10 k, LV Open
Supply Voltage Range, Low V+L1.5 3.5 V Min TAMax, RL = 10 k, LV to GND
Output Source Resistance ROUT 70 100 IOUT=20 mA, TA = +25°C
120 IOUT=20 mA, TA +70°C (C Device)
130 IOUT=20 mA, TA +85°C (E and I Device)
104 150 IOUT=20 mA, TA +125°C (M Device)
150 300 V+ = 2V, IOUT = 3 mA, LV to GND
0°C TA +70°C
160 600 V+ = 2V, IOUT = 3 mA, LV to GND
-55°C TA +125°C (M Device)
Oscillator Frequency fOSC 10 kHz Pin 7 open
Power Efficiency PEFF 95 98 % RL = 5 k
Voltage Conversion Efficiency VOUTEFF 97 99.9 % RL =
Oscillator Impedance ZOSC —1.0—MV+ = 2V
100 kV+ = 5V
Note 1: Destructive latch-up may occur if voltages greater than V+ or less than GND are supplied to any input pin.
2002-2011 Microchip Technology Inc. DS21465C-page 3
TC7660
2.0 TYPICAL PERFORMANCE CURVES
Note: Unless otherwise indicated, C1 = C2 = 10 µF, ESRC1 = ESRC2 = 1 , TA = 25°C. See Figure 1-1.
FIGURE 2-1: Operating Voltage vs.
Temperature.
FIGURE 2-2: Output Source Resistance
vs. Supply Voltage.
FIGURE 2-3: Frequency of Oscillation vs.
Oscillator Capacitance.
FIGURE 2-4: Power Conversion
Efficiency vs. Oscillator Frequency.
FIGURE 2-5: Output Source Resistance
vs. Temperature.
FIGURE 2-6: Unloaded Oscillator
Frequency vs. Temperature.
Note: The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
-2
5
0
+2
5
+7
5
+1
00
+12
5
+
50
-
55
TEMPERATURE
(
°
C
)
SU
PPLY V
O
LTA
G
E RAN
GE
7 8
10k
1k
100Ω
OUTPUT SOURCE RESISTANCE (Ω)
6543210
SUPPLY VOLTAGE (V)
10Ω
OSCILLATOR CAPACITANCE (pF)
10k
OSCILLATOR FREQUENCY (Hz)
1
1k
100
10
10 100 1000 10k
V+ = +5V
OSCILLATOR FREQUENCY (Hz)
100
POWER CONVERSION EFFICIENCY (%)
98
96
92
90
88
86
84
82
80
94
100 1k 10k
V+ = +5V
I
OUT
= 1 mA
I
OUT
= 15 mA
500
450
400
200
150
100
50
0
-55 -25 0 +25 +50 +75 +100 +125
TEMPERATURE (°C)
OUTPUT SOURCE RESISTANCE (Ω)
V+ = +2V
V + = +5V
I
OUT
= 1 mA
TEMPERATURE (°C)
OSCILLATOR FREQUENCY (kHz)
20
-55
18
16
14
12
10
8
6
-25 0 +25 +50 +75 +100 +125
V+ = +5V
TC7660
DS21465C-page 4 2002-2011 Microchip Technology Inc.
Note: Unless otherwise indicated, C1 = C2 = 10 µF, ESRC1 = ESRC2 = 1 , TA = 25°C. See Figure 1-1.
FIGURE 2-7: Output Voltage vs. Output
Current.
FIGURE 2-8: Supply Current and Power
Conversion Efficiency vs. Load Current.
FIGURE 2-9: Output Voltage vs. Load
Current.
FIGURE 2-10: Output Voltage vs. Load
Current.
FIGURE 2-11: Supply Current and Power
Conversion Efficiency vs. Load Current.
OUTPUT CURRENT (mA)
OUTPUT VOLTAGE (V)
0
0
-1
-2
-3
-4
-5
-6
-7
-8
-9
-10
10 20 30 40 50 60 70 80 90 100
LV OPEN
POWER CONVERSION EFFICIENCY (%)
0
LOAD CURRENT (mA)
10
20
30
40
50
60
70
80
90
100
1.5 3.0 4.5 6.0 7.5 9.0
0
2
4
6
8
10
12
14
16
18
20
SUPPLY CURRENT (mA)
V+ = 2V
2
0
OUTPUT VOLTAGE (V)
1
0
-1
-2
123 4 5 6 7 8
LOAD CURRENT (mA)
SLOPE 150Ω
V+ = +2V
LOAD CURRENT (mA)
OUTPUT VOLTAGE (V)
1
0
5
4
3
2
0
-1
-2
-3
-4
-5
10 20 30 40 50 60 70 80
V+ = +5V
SLOPE 55Ω
LOAD CURRENT (mA)
POWER CONVERSION EFFICIENCY (%)
0
10
20
30
40
50
60
70
80
90
100
0
10
20
30
40
50
60
70
80
90
100
SUPPLY CURRENT (mA)
10 20 30 40 50 60
V+ = +5V
2002-2011 Microchip Technology Inc. DS21465C-page 5
TC7660
3.0 PIN DESCRIPTIONS
The descriptions of the pins are listed in Tab le 3 -1 .
TABLE 3-1: PIN FUNCTION TABLE
3.1 Charge Pump Capacitor (CAP+)
Positive connection for the charge pump capacitor, or
flying capacitor, used to transfer charge from the input
source to the output. In the voltage-inverting configura-
tion, the charge pump capacitor is charged to the input
voltage during the first half of the switching cycle. Dur-
ing the second half of the switching cycle, the charge
pump capacitor is inverted and charge is transferred to
the output capacitor and load.
It is recommended that a low ESR (equivalent series
resistance) capacitor be used. Additionally, larger
values will lower the output resistance.
3.2 Ground (GND)
Input and output zero volt reference.
3.3 Charge Pump Capacitor (CAP-)
Negative connection for the charge pump capacitor, or
flying capacitor, used to transfer charge from the input
to the output. Proper orientation is imperative when
using a polarized capacitor.
3.4 Output Voltage (VOUT)
Negative connection for the charge pump output
capacitor. In the voltage-inverting configuration, the
charge pump output capacitor supplies the output load
during the first half of the switching cycle. During the
second half of the switching cycle, charge is restored to
the charge pump output capacitor.
It is recommended that a low ESR (equivalent series
resistance) capacitor be used. Additionally, larger
values will lower the output ripple.
3.5 Low Voltage Pin (LV)
The low voltage pin ensures proper operation of the
internal oscillator for input voltages below 3.5V. The low
voltage pin should be connected to ground (GND) for
input voltages below 3.5V. Otherwise, the low voltage
pin should be allowed to float.
3.6 Oscillator Control Input (OSC)
The oscillator control input can be utilized to slow down
or speed up the operation of the TC7660. Refer to
Section 5.4 “Changing the TC7660 Oscillator Fre-
quency”, for details on altering the oscillator
frequency.
3.7 Power Supply (V+)
Positive power supply input voltage connection. It is
recommended that a low ESR (equivalent series resis-
tance) capacitor be used to bypass the power supply
input to ground (GND).
Pin No. Symbol Description
1 NC No connection
2CAP
+Charge pump capacitor positive terminal
3 GND Ground terminal
4CAP
-Charge pump capacitor negative terminal
5V
OUT Output voltage
6 LV Low voltage pin. Connect to GND for V+ < 3.5V
7 OSC Oscillator control input. Bypass with an external capacitor to slow the oscillator
8V
+Power supply positive voltage input
TC7660
DS21465C-page 6 2002-2011 Microchip Technology Inc.
4.0 DETAILED DESCRIPTION
4.1 Theory of Operation
The TC7660 charge pump converter inverts the voltage
applied to the V+
pin. The conversion consists of a two-
phase operation (Figure 4-1). During the first phase,
switches S2 and S4 are open and switches S1 and S3
are closed. C1 charges to the voltage applied to the V+
pin, with the load current being supplied from C2. Dur-
ing the second phase, switches S2 and S4 are closed
and switches S1 and S3 are open. Charge is trans-
ferred from C1 to C2, with the load current being
supplied from C1.
FIGURE 4-1: Ideal Switched Capacitor
Inverter.
In this manner, the TC7660 performs a voltage inver-
sion, but does not provide regulation. The average out-
put voltage will drop in a linear manner with respect to
load current. The equivalent circuit of the charge pump
inverter can be modeled as an ideal voltage source in
series with a resistor, as shown in Figure 4-2.
FIGURE 4-2: Switched Capacitor Inverter
Equivalent Circuit Model.
The value of the series resistor (ROUT) is a function of
the switching frequency, capacitance and equivalent
series resistance (ESR) of C1 and C2 and the on-resis-
tance of switches S1, S2, S3 and S4. A close
approximation for ROUT is given in the following
equation:
EQUATION
4.2 Switched Capacitor Inverter
Power Losses
The overall power loss of a switched capacitor inverter
is affected by four factors:
1. Losses from power consumed by the internal
oscillator, switch drive, etc. These losses will
vary with input voltage, temperature and
oscillator frequency.
2. Conduction losses in the non-ideal switches.
3. Losses due to the non-ideal nature of the
external capacitors.
4. Losses that occur during charge transfer from
C1 to C2 when a voltage difference between the
capacitors exists.
Figure 4-3 depicts the non-ideal elements associated
with the switched capacitor inverter power loss.
FIGURE 4-3: Non-Ideal Switched
Capacitor Inverter.
The power loss is calculated using the following
equation:
EQUATION
V+
GND S3
S1S2
S4
C2
VOUT = -VIN
C1
+
+
-
+
ROUT
VOUT
V+
ROUT
1
fPUMP C1
----------------------------- 8RSW 4ESRC1ESRC2
++ +=
RSW on-resistance of the switches=
ESRC1equivalent series resistance of C1
=
ESRC2equivalent series resistance of C2
=
fPUMP
fOSC
2
-----------=
Where:
LOAD
C1C2
RSW
S1
IDD
ESRC1
V+
+
-
RSW
S2
RSW S3RSW S4
ESRC2
IOUT
++
PLOSS IOUT
2ROUT
IDD V+
+=
2002-2011 Microchip Technology Inc. DS21465C-page 7
TC7660
5.0 APPLICATIONS INFORMATION
5.1 Simple Negative Voltage
Converter
Figure 5-1 shows typical connections to provide a
negative supply where a positive supply is available. A
similar scheme may be employed for supply voltages
anywhere in the operating range of +1.5V to +10V,
keeping in mind that pin 6 (LV) is tied to the supply
negative (GND) only for supply voltages below 3.5V.
FIGURE 5-1: Simple Negative Converter.
The output characteristics of the circuit in Figure 5-1
are those of a nearly ideal voltage source in series with
a 70resistor. Thus, for a load current of -10 mA and
a supply voltage of +5V, the output voltage would be
-4.3V.
5.2 Paralleling Devices
To reduce the value of ROUT
, multiple TC7660 voltage
converters can be connected in parallel (Figure 5-2).
The output resistance will be reduced by approximately
a factor of n, where n is the number of devices
connected in parallel.
EQUATION
While each device requires its own pump capacitor
(C1), all devices may share one reservoir capacitor
(C2). To preserve ripple performance, the value of C2
should be scaled according to the number of devices
connected in parallel.
5.3 Cascading Devices
A larger negative multiplication of the initial supply volt-
age can be obtained by cascading multiple TC7660
devices. The output voltage and the output resistance
will both increase by approximately a factor of n, where
n is the number of devices cascaded.
EQUATION
FIGURE 5-2: Paralleling Devices Lowers Output Impedance.
FIGURE 5-3: Increased Output Voltage By Cascading Devices.
+
V+
+
1
2
3
4
8
7
6
5
TC7660
VOUT*
C1
10 µF
* VOUT = -V+ for 1.5V V+ 10V
C2
10 µF
ROUT
ROUT of TC7660
nnumber of devices
---------------------------------------------------------=
VOUT nV+
=
ROUT nROUT of TC7660=
“n”
“1”
R
L
+
V+
+
1
2
3
4
8
7
6
5
TC7660
C1
C2
+
1
2
3
4
8
7
6
5
TC7660
C1
VOUT *
“1”
+
V+
+
1
2
3
4
8
7
6
5
TC7660
10 µF
* VOUT = -n V+ for 1.5V V+ 10V
“n”
+
1
2
3
4
8
7
6
5
TC7660
10 µF
10 µF
+10 µF
TC7660
DS21465C-page 8 2002-2011 Microchip Technology Inc.
5.4 Changing the TC7660 Oscillator
Frequency
The operating frequency of the TC7660 can be
changed in order to optimize the system performance.
The frequency can be increased by over-driving the
OSC input (Figure 5-4). Any CMOS logic gate can be
utilized in conjunction with a 1 k series resistor. The
resistor is required to prevent device latch-up. While
TTL level signals can be utilized, an additional 10 k
pull-up resistor to V+ is required. Transitions occur on
the rising edge of the clock input. The resultant output
voltage ripple frequency is one half the clock input.
Higher clock frequencies allow for the use of smaller
pump and reservoir capacitors for a given output volt-
age ripple and droop. Additionally, this allows the
TC7660 to be synchronized to an external clock,
eliminating undesirable beat frequencies.
At light loads, lowering the oscillator frequency can
increase the efficiency of the TC7660 (Figure 5-5). By
lowering the oscillator frequency, the switching losses
are reduced. Refer to Figure 2-3 to determine the typi-
cal operating frequency based on the value of the
external capacitor. At lower operating frequencies, it
may be necessary to increase the values of the pump
and reservoir capacitors in order to maintain the
desired output voltage ripple and output impedance.
FIGURE 5-4: External Clocking.
FIGURE 5-5: Lowering Oscillator
Frequency.
5.5 Positive Voltage Multiplication
Positive voltage multiplication can be obtained by
employing two external diodes (Figure 5-6). Refer to
the theory of operation of the TC7660 (Section 4.1
“Theory of Operation”). During the half cycle when
switch S2 is closed, capacitor C1 of Figure 5-6 is
charged up to a voltage of V+ - VF1, where VF1 is the
forward voltage drop of diode D1. During the next half
cycle, switch S1 is closed, shifting the reference of
capacitor C1 from GND to V+. The energy in capacitor
C1 is transferred to capacitor C2 through diode D2, pro-
ducing an output voltage of approximately:
EQUATION
FIGURE 5-6: Positive Voltage Multiplier.
5.6 Combined Negative Voltage
Conversion and Positive Supply
Multiplication
Simultaneous voltage inversion and positive voltage
multiplication can be obtained (Figure 5-7). Capacitors
C1 and C3 perform the voltage inversion, while capaci-
tors C2 and C4, plus the two diodes, perform the posi-
tive voltage multiplication. Capacitors C1 and C2 are
the pump capacitors, while capacitors C3 and C4 are
the reservoir capacitors for their respective functions.
Both functions utilize the same switches of the TC7660.
As a result, if either output is loaded, both outputs will
drop towards GND.
CMOS
GATE
1k
VOUT
“1”
+
V+
+
1
2
3
4
8
7
6
5
TC7660
10 µF
10 µF
V+
VOUT
+
+
1
2
3
4
8
7
6
5
TC7660
C1
C2
V+
COSC
VOUT 2V+
VF1VF2
+=
where:
VF1 is the forward voltage drop of diode D1
and
VF2 is the forward voltage drop of diode D2.
+C2
D1D2
+C1
VOUT =
1
2
3
4
8
7
6
5
TC7660
V+
(2 V+) - (2 VF)
2002-2011 Microchip Technology Inc. DS21465C-page 9
TC7660
FIGURE 5-7: Combined Negative
Converter and Positive Multiplier.
5.7 Efficient Positive Voltage
Multiplication/Conversion
Since the switches that allow the charge pumping
operation are bidirectional, the charge transfer can be
performed backwards as easily as forwards.
Figure 5-8 shows a TC7660 transforming -5V to +5V
(or +5V to +10V, etc.). The only problem here is that the
internal clock and switch-drive section will not operate
until some positive voltage has been generated. An ini-
tial inefficient pump, as shown in Figure 5-7, could be
used to start this circuit up, after which it will bypass the
other (D1 and D2 in Figure 5-7 would never turn on), or
else the diode and resistor shown dotted in Figure 5-8
can be used to “force” the internal regulator on.
FIGURE 5-8: Positive Voltage
Conversion.
+
C1
D1
+
+
C3
C4
C2
D2
+
VOUT =
1
2
3
4
8
7
6
5
TC7660
V+
(2 V+) - (2 VF)
VOUT
= -V+
VOUT = -V-
+
1M
V-
input
+
1
2
3
4
8
7
6
5
TC7660
10 µF
10 µF
C1
TC7660
DS21465C-page 10 2002-2011 Microchip Technology Inc.
6.0 PACKAGING INFORMATION
6.1 Package Marking Information
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line thus limiting the number of available characters
for customer specific information.
Legend: XX...X Customer-specific information
Y Year code (last digit of calendar year)
YY Year code (last 2 digits of calendar year)
WW Week code (week of January 1 is week ‘01’)
NNN Alphanumeric traceability code
Pb-free JEDEC designator for Matte Tin (Sn)
*This package is Pb-free. The Pb-free JEDEC designator ( )
can be found on the outer packaging for this package.
3
e
3
e
TC7660C
OA 1208
3
e
8-Lead SOIC (3.90 mm) Example
NNN
Example
TC7660C
OA1208
256
256
8-Lead CERDIP (.300”) Example
XXXXXNNN
XXXXXXXX
YYWW
Example
TC7660
MJA 256
TC7660
MJA256
3
e
1208 1208
8-Lead PDIP (300 mil) Example
XXXXXXXX
XXXXXNNN
YYWW
Example
TC7660
CPA 256
3
e
TC7660
CPA256
1208 1208
2002-2011 Microchip Technology Inc. DS21465C-page 11
TC7660
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 

 

 
   

 
 
    
  
   
    
   
   
   
    
   
  
N
E1
NOTE 1
D
123
A
A1
A2
L
b1
b
e
E
eB
c
   
TC7660
DS21465C-page 12 2002-2011 Microchip Technology Inc.
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2002-2011 Microchip Technology Inc. DS21465C-page 13
TC7660
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
TC7660
DS21465C-page 14 2002-2011 Microchip Technology Inc.
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2002-2011 Microchip Technology Inc. DS21465C-page 15
TC7660
!""##$%&'!"(
 

TC7660
DS21465C-page 16 2002-2012 Microchip Technology Inc.
APPENDIX A: REVISION HISTORY
Revision C (March 2012)
The following is the list of modifications.
1. Updated Figure 5-5.
2. Added Appendix A.
Revision B (March 2003)
Undocumented changes.
Revision A (May 2002)
Original release of this document.
2002-2012 Microchip Technology Inc. DS21465C-page 17
TC7660
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO. X/XX
PackageTemperature
Range
Device
Device: TC7660: DC-to-DC Voltage Converter
Temperature Range: C = 0°C to +70°C
E = -40°C to +85°C
I = -25°C to +85°C (CERDIP only)
M = -55°C to +125°C (CERDIP only)
Package: PA = Plastic DIP, (300 mil body), 8-lead
JA = Ceramic DIP, (300 mil body), 8-lead
OA = SOIC (Narrow), 8-lead
OA713 = SOIC (Narrow), 8-lead (Tape and Reel)
Examples:
a) TC7660COA: Commercial Temp., SOIC
package.
b) TC7660COA713:Tape and Reel, Commercial
Temp., SOIC package.
c) TC7660CPA: Commercial Temp., PDIP
package.
d) TC7660EOA: Extended Temp., SOIC
package.
e) TC7660EOA713: Tape and Reel, Extended
Temp., SOIC package.
f) TC7660EPA: Extended Temp., PDIP
package.
g) TC7660IJA: Industrial Temp., CERDIP
package
h) TC7660MJA: Military Temp., CERDIP
package.
TC7660
DS21465C-page 18 2002-2012 Microchip Technology Inc.
NOTES:
2002-2012 Microchip Technology Inc. DS21465C-page 19
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART,
PIC32 logo, rfPIC and UNI/O are registered trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor,
MXDEV, MXLAB, SEEVAL and The Embedded Control
Solutions Company are registered trademarks of Microchip
Technology Incorporated in the U.S.A.
Analog-for-the-Digital Age, Application Maestro, chipKIT,
chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net,
dsPICworks, dsSPEAK, ECAN, ECONOMONITOR,
FanSense, HI-TIDE, In-Circuit Serial Programming, ICSP,
Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB,
MPLINK, mTouch, Omniscient Code Generation, PICC,
PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, REAL ICE,
rfLAB, Select Mode, Total Endurance, TSHARC,
UniWinDriver, WiperLock and ZENA are trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2002-2012, Microchip Technology Incorporated, Printed in
the U.S.A., All Rights Reserved.
Printed on recycled paper.
ISBN: 978-1-62076-089-5
Note the following details of the code protection feature on Microchip devices:
Microchip products meet the specification contained in their particular Microchip Data Sheet.
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
QUALITY MANAGEMENT S
YSTEM
CERTIFIED BY DNV
== ISO/TS 16949 ==
DS21465C-page 20 2002-2012 Microchip Technology Inc.
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11/29/11