TLP3052AF(D4,F(O - TOSHIBA - Datasheet.World

TLP3052A,TLP3052AF

1

Photocouplers GaAs Infrared LED & Photo Triac

TLP3052A,TLP3052AF

Start of commercial production

2015-08

1.

1. Applications

Applications

• Solid-State Relays

• Triac Drivers

• Home Electric Appliances

• Office Equipment

2.

2. General

General

The TLP3052A consists of a non zero crossing photo triac, optically coupled to a gallium arsenide infrared emitting

diode. The TLP3052A is housed in the DIP6 package and guarantees insulation thickness of 0.4 mm (min).

Therefore, the TLP3052A meets the reinforced insulation class requirements of international safety standards.

3.

3. Features

Features

(1) Halogen-free

For details, see "Devices in Halogen-Free Resin Packages" at the end of this datasheet.

(2) Peak off-state voltage: 600 V (min)

(3) Non zero crossing functionary (NZC)

(4) Trigger LED current: 10 mA (max)

(5) On-state current: 100 mA (max)

(6) Isolation voltage: 5000 Vrms (min)

(7) Safety standards

UL-approved: UL1577, File No.E67349

cUL-approved: CSA Component Acceptance Service No.5A File No.E67349

VDE-approved: EN60747-5-5, EN60065 or EN60950-1 (Note 1)

(Note 1)

CQC-approved: GB4943.1, GB8898 Japan Factory

Note 1: When a VDE approved type is needed, please designate the Option (D4)

Option (D4)

Option (D4).

Table

Table 3.1

3.1

3.1 Mechanical Parameters

Mechanical Parameters

Characteristics

Creepage distances

Clearance distances

Internal isolation thickness

7.62 mm Pitch

TLP3052A

7.0 (min)

0.4 (min)

10.16 mm Pitch

TLP3052AF

8.0 (min)

0.4 (min)

Unit

mm

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4.

4. Packaging (Note)

Packaging (Note)

TLP3052A

11-7A10S

TLP3052A(LF1,TP1)

11-7A1001S

TLP3052A(LF5,TP5)

11-7A1005S

TLP3052AF

11-7A1002S

TLP3052AF(LF4,TP4)

11-7A1004S

Note: Through-hole type: TLP3052A, TLP3052AF

Lead forming option: (LF1), (LF4), (LF5)

Taping option: (TP1), (TP4), (TP5)

5.

5. Pin Assignment

Pin Assignment

1: Anode

2: Cathode

3: N.C.

4: Triac terminal

6: Triac terminal

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6.

6. Product Naming Conventions

Product Naming Conventions

Type of package used for shipment is denoted by a symbol suffix after a part number. The method of classification

is as below.

Example) TLP3052A(TP1,F(O

Part number: TLP3052A

Tape type: TP1 (Note 1)

(Note 1)

[[G]]/RoHS COMPATIBLE: F (Note 2)

(Note 2)

Domestic ID (Country/Region of origin: Japan): (O

Note 1: At the part of tape type, below options are used including lead forming type.

TLP3052A: LF1, TP1, LF5, TP5

TLP3052AF: LF4, TP4

Note 2: Please contact your Toshiba sales representative for details on environmental information such as the product's

RoHS compatibility.

RoHS is the Directive 2011/65/EU of the European Parliament and of the Council of 8 June 2011 on the

restriction of the use of certain hazardous substances in electrical and electronic equipment.

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7.

7. Absolute Maximum Ratings (Note) (Unless otherwise specified, T

Absolute Maximum Ratings (Note) (Unless otherwise specified, T

Absolute Maximum Ratings (Note) (Unless otherwise specified, Ta

a

a = 25

= 25

= 25 



)

)

LED

Detector

Common

Characteristics

Input forward current

Input forward current derating

Input forward current (pulsed)

Input reverse voltage

Input power dissipation

Input power dissipation derating

Junction temperature

Off-state output terminal voltage

R.M.S. on-state current

R.M.S. on-state current derating

ON-state current (pulsed)

Peak non-repetitive surge current

Output power dissipation

Output power dissipation derating

Junction temperature

Total power dissipation

Total power dissipation derating

Operating temperature

Storage temperature

Lead soldering temperature

Isolation voltage

(Ta ≥ 53 )

(Ta ≥ 25 )

(Ta = 25 )

(Ta = 70 )

(Ta ≥ 25 )

(10 s)

AC, 60 s, R.H. ≤ 60 %

Symbol

IF

∆IF/∆Ta

IFP

VR

PD

∆PD/∆Ta

Tj

VDRM

IT(RMS)

∆IT(RMS)/∆Ta

IONP

ITSM

PO

∆PO/∆Ta

Tj

PT

∆PT/∆Ta

Topr

Tstg

Tsol

BVS

Note

(Note 1)

(Note 2)

(Note 3)

(Note 4)

Rating

50

-0.7

1

5

100

-1.0

125

600

100

50

-1.1

2

1.2

300

-4.0

125

400

-4.4

-40 to 100

-55 to 125

260

5000

Unit

mA

mA/

A

V

mW

mW/



V

mA

mA/

A

mW

mW/



mW

mW/



Vrms

Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the

significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even

if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum

ratings.

Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook

("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test

report and estimated failure rate, etc).

Note 1: Pulse width (PW) ≤ 100 µs, 100 pps

Note 2: Pulse width (PW) ≤ 100 µs, 120 pps

Note 3: Pulse width (PW) ≤ 10 ms

Note 4: This device is considered as a two-terminal device: Pins 1, 2 and 3 are shorted together, and pins 4 and 6 are

shorted together.

8.

8. Recommended Operating Conditions (Note)

Recommended Operating Conditions (Note)

Characteristics

AC mains voltage

Input forward current

ON-state current (pulsed)

Operating temperature

Symbol

VAC

IF

IONP

Topr

Note

(Note 1)

Min



15



-25

Typ.



20



Max

240

25

1

85

Unit

V

mA

A



Note: The recommended operating conditions are given as a design guide necessary to obtain the intended

performance of the device. Each parameter is an independent value. When creating a system design using

this device, the electrical characteristics specified in this data sheet should also be considered.

Note 1: AC use only.

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9.

9. Electrical Characteristics (Unless otherwise specified, T

Electrical Characteristics (Unless otherwise specified, T

Electrical Characteristics (Unless otherwise specified, Ta

a

a = 25

= 25

= 25 



)

)

LED

Detector

Characteristics

Input forward voltage

Input reverse current

Input capacitance

Peak off-state current

Peak on-state voltage

Holding current

Critical rate of rise of off-state

voltage

Critical rate of rise of

commutating voltage (dv/dt)

Symbol

VF

IR

Ct

IDRM

VTM

IH

dv/dt

dv/dt(c)

Note Test Condition

IF = 10 mA

VR = 5 V

V = 0 V, f = 1 MHz

VDRM = 600 V

ITM = 100 mA



Vin = 240 V, Ta = 25 

See Fig. 9.1

Vin = 60 Vrms, IT = 15 mA

See Fig. 9.1

Min

1.0



Typ.

1.15



30

10

1.7

0.6

2000

0.2

Max

1.3

10



1000

3.0



Unit

V

µA

pF

nA

V

mA

V/µs

Fig.

Fig. 9.1

9.1

9.1 dv/dt Test Circuit and Waveform

dv/dt Test Circuit and Waveform

10.

10. Coupled Electrical Characteristics (Unless otherwise specified, T

Coupled Electrical Characteristics (Unless otherwise specified, T

Coupled Electrical Characteristics (Unless otherwise specified, Ta

a

a = 25

= 25

= 25 



)

)

Characteristics

Trigger LED current

Symbol

IFT

Note Test Condition

VT = 6 V

Min



Typ.



Max

10

Unit

mA

11.

11. Isolation Characteristics (Unless otherwise specified, T

Isolation Characteristics (Unless otherwise specified, T

Isolation Characteristics (Unless otherwise specified, Ta

a

a = 25

= 25

= 25 



)

)

Characteristics

Total capacitance (input to

output)

Isolation resistance

Isolation voltage

Symbol

CS

RS

BVS

Note

(Note 1)

Test Condition

VS = 0 V, f = 1 MHz

VS = 500 V, R.H. ≤ 60%

AC, 60 s

AC, 1 s in oil

DC, 60 s in oil

Min



1 × 1012

5000



Typ.

0.8

1014



10000

Max



Unit

pF

Ω

Vrms

Vdc

Note 1: This device is considered as a two-terminal device: Pins 1, 2 and 3 are shorted together, and pins 4 and 6 are

shorted together.

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12.

12. Characteristics Curves (Note)

Characteristics Curves (Note)

Fig.

Fig. 12.1

12.1

12.1 I

I

IF

F

F - T

- T

- Ta

a

aFig.

Fig.

Fig. 12.2

12.2

12.2 I

I

IT(RMS)

T(RMS)

T(RMS) - T

- T

- Ta

a

Fig.

Fig. 12.3

12.3

12.3 I

I

IF

F

F - V

- V

- VF

F

FFig.

Fig.

Fig. 12.4

12.4

12.4 I

I

IFP

FP

FP - D

- D

- DR

R

Fig.

Fig. 12.5

12.5

12.5 ∆

∆

∆V

V

VF

F

F/

/

/∆

∆

∆T

T

Ta

a

a - I

- I

- IF

F

FFig.

Fig.

Fig. 12.6

12.6

12.6 I

I

IFP

FP

FP - V

- V

- VFP

FP

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Fig.

Fig. 12.7

12.7

12.7 Normalized I

Normalized I

Normalized IFT

FT

FT - T

- T

- Ta

a

aFig.

Fig.

Fig. 12.8

12.8

12.8 Normalized I

Normalized I

Normalized IDRM

DRM

DRM - T

- T

- Ta

a

Fig.

Fig. 12.9

12.9

12.9 Normalized V

Normalized V

Normalized VDRM

DRM

DRM - T

- T

- Ta

a

aFig.

Fig.

Fig. 12.10

12.10

12.10 Normalized I

Normalized I

Normalized IH

H

H - T

- T

- Ta

a

Note: The above characteristics curves are presented for reference only and not guaranteed by production test,

unless otherwise noted.

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13.

13. Soldering and Storage

Soldering and Storage

13.1.

13.1. Precautions for Soldering

Precautions for Soldering

The soldering temperature should be controlled as closely as possible to the conditions shown below, irrespective

of whether a soldering iron or a reflow soldering method is used.

• When using soldering reflow.

The soldering temperature profile is based on the package surface temperature.

(See the figure shown below, which is based on the package surface temperature.)

Reflow soldering must be performed once or twice.

The mounting should be completed with the interval from the first to the last mountings being 2 weeks.

Fig.

Fig. 13.1.1

13.1.1

13.1.1 An Example of a Temperature Profile When Lead(Pb)-Free Solder Is Used

An Example of a Temperature Profile When Lead(Pb)-Free Solder Is Used

• When using soldering flow

Preheat the device at a temperature of 150  (package surface temperature) for 60 to 120 seconds.

Mounting condition of 260  within 10 seconds is recommended.

Flow soldering must be performed once.

• When using soldering Iron

Complete soldering within 10 seconds for lead temperature not exceeding 260  or within 3 seconds not

exceeding 350 

Heating by soldering iron must be done only once per lead.

13.2.

13.2. Precautions for General Storage

Precautions for General Storage

• Avoid storage locations where devices may be exposed to moisture or direct sunlight.

• Follow the precautions printed on the packing label of the device for transportation and storage.

• Keep the storage location temperature and humidity within a range of 5  to 35  and 45% to 75%,

respectively.

• Do not store the products in locations with poisonous gases (especially corrosive gases) or in dusty

conditions.

• Store the products in locations with minimal temperature fluctuations. Rapid temperature changes during

storage can cause condensation, resulting in lead oxidation or corrosion, which will deteriorate the

solderability of the leads.

• When restoring devices after removal from their packing, use anti-static containers.

• Do not allow loads to be applied directly to devices while they are in storage.

• If devices have been stored for more than two years under normal storage conditions, it is recommended

that you check the leads for ease of soldering prior to use.

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14.

14. Land Pattern Dimensions (for reference only)

Land Pattern Dimensions (for reference only)

(Unit: mm)

Fig.

Fig. 14.1

14.1

14.1 TLP3052A

TLP3052A

Lead forming and taping option

(LF1), (TP1), (LF5), (TP5)

Fig.

Fig. 14.2

14.2

14.2 TLP3052AF

TLP3052AF

Lead forming and taping option

(LF4), (TP4)

15.

15. Marking (Note)

Marking (Note)

Fig.

Fig. 15.1

15.1

15.1 TLP3052A

TLP3052A

TLP3052A Fig.

Fig.

Fig. 15.2

15.2

15.2 TLP3052AF

TLP3052AF

Note: A different marking is used for photocouplers that have been qualified according to option (D4) of EN60747.

See Fig.16.3 and Fig.16.4.

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16.

16. EN60747-5-5 Option (D4) Specification

EN60747-5-5 Option (D4) Specification

• Part number: TLP3052A (Note 1)

(Note 1)

• The following part naming conventions are used for the devices that have been qualified according to

option (D4) of EN60747.

Example: TLP3052A(D4TP1,F(O

D4: EN60747 option

TP1: Tape type

F: [[G]]/RoHS COMPATIBLE (Note 2)

(Note 2)

(O: Domestic ID (Country/Region of origin: Japan)

Note 1: Use TOSHIBA standard type number for safety standard application.

e.g., TLP3052A(D4TP1,F(O → TLP3052A

Note 2: Please contact your Toshiba sales representative for details on environmental information such as the product's

RoHS compatibility.

RoHS is the Directive 2011/65/EU of the European Parliament and of the Council of 8 June 2011 on the

restriction of the use of certain hazardous substances in electrical and electronic equipment.

Fig.

Fig. 16.1

16.1

16.1 EN60747 Insulation Characteristics

EN60747 Insulation Characteristics

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Table

Table 16.1

16.1

16.1 Insulation Related Specifications (Note)

Insulation Related Specifications (Note)

Insulation Related Parameters

Minimum creepage distance

Minimum clearance

Minimum insulation thickness

Comparative tracking index

Symbol

Cr

Cl

ti

CTI

TLP3052A

7.0 mm

0.4 mm

175

TLP3052AF

8.0 mm

0.4 mm

175

Note: If a printed circuit is incorporated, the creepage distance and clearance may be reduced below this value. (e.

g., at a standard distance between soldering eye centers of 7.5 mm). If this is not permissible, the user shall

take suitable measures.

Note: This photocoupler is suitable for safe electrical isolation

safe electrical isolation

safe electrical isolation only within the safety limit data.

Maintenance of the safety data shall be ensured by means of protective circuits.

Fig.

Fig. 16.2

16.2

16.2 Marking on packing

Marking on packing

for EN60747

Fig.

Fig. 16.3

16.3

16.3 Marking Example of TLP3052A (Note)

Marking Example of TLP3052A (Note)

Marking Example of TLP3052A (Note) Fig.

Fig.

Fig. 16.4

16.4

16.4 Marking Example of TLP3052AF (Note)

Marking Example of TLP3052AF (Note)

Note: The above marking is applied to the photocouplers that have been qualified according to option (D4) of EN60747.

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Fig.

Fig. 16.5

16.5

16.5 Measurement Procedure

Measurement Procedure

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17.

17. Ordering Information (Example of Item Name)

Ordering Information (Example of Item Name)

Item Name

TLP3052A(F(O

TLP3052A(LF1,F(O

TLP3052A(LF5,F(O

TLP3052A(TP1,F(O

TLP3052A(TP5,F(O

TLP3052A(D4,F(O

TLP3052A(D4LF1,F(O

TLP3052A(D4LF5,F(O

TLP3052A(D4TP1,F(O

TLP3052A(D4TP5,F(O

TLP3052AF(F(O

TLP3052AF(LF4,F(O

TLP3052AF(TP4,F(O

TLP3052AF(D4,F(O

TLP3052AF(D4LF4F(O

TLP3052AF(D4TP4F(O

Packaging (Note 1)

TH

LF1

LF5

LF1

LF5

TH

LF1

LF5

LF1

LF5

TH, Wide forming

LF4, Wide forming

TH, Wide forming

LF4, Wide forming

VDE Option

EN60747-5-5

Packing (MOQ)

Magazine (50 pcs)

Tape and reel (1500 pcs)

Magazine (50 pcs)

Tape and reel (1500 pcs)

Magazine (50 pcs)

Tape and reel (1000 pcs)

Magazine (50 pcs)

Tape and reel (1000 pcs)

Note 1: TH: Through-hole, LF: Lead forming for surface mount

18.

18. Devices in Halogen-Free Resin Packages

Devices in Halogen-Free Resin Packages

This product is Halogen-Free

Toshiba Electronic Devices & Storage Corporation ("Toshiba") defines a "Halogen-Free resin semiconductor

product" as a semiconductor product in which:

(1) the encapsulating resins do not contain any of the following elements: bromine (Br), chlorine (Cl) and antimony

(Sb), respectively, in an amount exceeding 0.09 weight percent, and do not contain chlorine and bromine in an

aggregate amount exceeding 0.15 weight percent of the encapsulating resins, and/or

(2) the resin portion(s) in printed circuit boards do not contain any of the following elements: bromine,

chlorine and antimony, respectively, in an amount exceeding 0.09 weight percent, and do not contain

chlorine and bromine in an aggregate amount exceeding 0.15 weight percent of the each resin portion(s) in

printed circuit boards.

For avoidance of doubt, "Halogen-Free resin semiconductor product" does not mean, and Toshiba does not make

any warranty of any kind, that said semiconductor product is entirely free of antimony or of any of the following

elements of the halogen family: bromine, chlorine, iodine (I), fluorine (F) and astatine (At).

In addition, a Halogen-Free resin semiconductor product may contain antimony and/or any of the elements of

the halogen family as mentioned in the above paragraph in one or more portion(s) of the semiconductor product

other than the encapsulating resins and the resin portion(s) in printed circuit boards.

The information provided herein is accurate as of the date that it was provided, to the best of the knowledge and

belief of the Toshiba Electronic Devices & Storage Corporation ("Toshiba"), Toshiba bases such knowledge and

belief on information provided by third parties, and Toshiba makes no representation or warranty as to the

accuracy of such third party information. Toshiba has taken and will continue to take, reasonable steps to provide

accurate information to its customers, but may not have conducted destructive testing or chemical analysis on

incoming materials and chemicals.

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Package Dimensions

Unit: mm

TLP3052A

Weight: 0.40 g (typ.)

Package Name(s)

TOSHIBA: 11-7A10S

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Package Dimensions

Unit: mm

TLP3052A(LF1,TP1)

Weight: 0.39 g (typ.)

Package Name(s)

TOSHIBA: 11-7A1001S

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Package Dimensions

Unit: mm

TLP3052A(LF5,TP5)

Weight: 0.39 g (typ.)

Package Name(s)

TOSHIBA: 11-7A1005S

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Package Dimensions

Unit: mm

TLP3052AF

Weight: 0.40 g (typ.)

Package Name(s)

TOSHIBA: 11-7A1002S

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Package Dimensions

Unit: mm

TLP3052AF(LF4,TP4)

Weight: 0.39 g (typ.)

Package Name(s)

TOSHIBA: 11-7A1004S

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intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.

• ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE

ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE

FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY WHATSOEVER,

INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR LOSS, INCLUDING

WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND LOSS OF DATA, AND

(2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO SALE, USE OF PRODUCT,

OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR

PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.

• GaAs (Gallium Arsenide) is used in Product. GaAs is harmful to humans if consumed or absorbed, whether in the form of dust or vapor.

Handle with care and do not break, cut, crush, grind, dissolve chemically or otherwise expose GaAs in Product.

• Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation,

for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology products

(mass destruction weapons). Product and related software and technology may be controlled under the applicable export laws and

regulations including, without limitation, the Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration

Regulations. Export and re-export of Product or related software or technology are strictly prohibited except in compliance with all

applicable export laws and regulations.

• Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.

Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,

including without limitation, the EU RoHS Directive. TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES OCCURRING

TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES OCCURRING

AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS.

2017-10-16

Rev.4.0

Toshiba Electronic Devices & Storage Corporation