ULN2064B - ULN2066B ULN2068B - ULN2070B ULN2074B - ULN2076B 50V - 1.5A QUAD DARLINGTON SWITCHES . .. . . . OUTPUT CURRENT TO 1.5 A EACH DARLINGTON MINIMUM BREAKDOWN 50 V SUSTAINING VOLTAGE AT LEAST 35 V INTEGRAL SUPPRESSION DIODES (ULN2064B, ULN2066B, ULN2068B and ULN2070B) ISOLATED DARLINGTON PINOUT (ULN2074B, ULN2076B) VERSIONS COMPATIBLE WITH ALL POPULAR LOGIC FAMILIES DESCRIPTION Designed to interface logic to a wide variety of high current, high voltage loads, these devices each contain four NPN darlington switches delivering up to 1.5 A with a specified minimum breakdown of 50 V and a sustaining voltage of 35 V measured at 100 mA. The ULN2064B, ULN2066B, ULN2068B and ULN2070B contain integral suppression diodes for inductive loads have common emitters. The ULN2074B and ULN2076B feature isolated darlington pinouts and are intended for applications such as emitter follower configurations. Inputs of the ULN2064B, ULN2068B and ULN2074B are compatible with popular 5 V logic families and the ULN2066B and ULN2076B are compatible with 615 V CMOS and PMOS. Types ULN2068B and ULN2070B include a predriver stage to reduce loading on the control logic. POWERDIP 12 + 2 + 2 PIN CONNECTIONS AND ORDER CODES ULN2064B ULN2066B April 1993 ULN2068B ULN2070B ULN2074B ULN2076B 1/8 ULN2064B-ULN2066B-ULN2068B-ULN2070B-ULN2074B-ULN2076B SCHEMATIC DIAGRAM ULN2064B : RIN = 350 ULN2066B : RIN = 3k ULN2068B : RIN = 2.5k, Rs = 900 ULN2070B : RIN = 11.6k, Rs = 3.4k ULN2074B : RIN = 350 ULN2076B : RIN = 3k ABSOLUTE MAXIMUM RATINGS Symbol VCEX VCE(sus) Parameter Output Voltage Output Sustaining Voltage IO Output Current Vi Input Voltage for ULN2066B - 2070B - 2074B - 2076B for ULN2064B - 2068B Value Unit 50 V 35 V 1.75 A 30 15 V V 25 mA 10 20 V V 4.3 1 W W II Input Current Vs Supply Voltage Ptot Power Dissipation at Tpins = 90 C at Tamb = 70 C Tamb Operating Ambient Temperature Range - 20 to 85 C Tstg Storage Temperature - 55 to 150 C for ULN2068B for ULN2070B o ELECTRICAL CHARACTERISTICS (Tamb = 25 C unless otherwise specified ) Symbol ICEX Parameter Output Leakage Current Test Conditions VCE(sus) Collector-emitter Sustaining Voltage IC = 100mA, Vi = 0.4V VCE(sat) Collector-emitter Saturation Voltage IC IC IC IC Input Current for ULN2064B and ULN2074B Vi = 2.4V Vi = 3.75V for ULN2066B and ULN2076B Vi = 5V Vi = 12V for ULN2068B Vi = 2.75V Vi = 3.75V for ULN2070B Vi = 5V Vi = 12V Ii(on) 2/8 Min. VCE = 50V Tamb = 25C Tamb = 70C = = = = 500mA 750mA 1A 1.25A IB IB IB IB = = = = Typ. Max. Unit 100 500 A A 35 Fig. 1 V 2 1.1 1.2 1.3 1.4 V V V V 3 3 3 3 1.4 3.3 4.3 9.6 mA mA 4 4 0.6 1.7 1.8 5.2 mA mA 4 4 0.55 1.0 mA mA 4 4 0.4 1.25 mA mA 4 4 625A 935A 1.25mA 2mA ULN2064B-ULN2066B-ULN2068B-ULN2070B-ULN2074B-ULN2076B o ELECTRICAL CHARACTERISTICS (Tamb = 25 C unless otherwise specified ) (continued) Symbol Vi(on) Is Parameter Input Voltage Supply Current for ULN2068B IC = 500mA, Vi = 2.75V for ULN2070B IC = 500mA, Vi = 5V Typ. Max. Unit Fig. 2 6.5 V V 5 5 2.5 10 2.75 5 V V V V 5 5 5 5 6 mA 8 8 4.5 mA 1 s Turn-off Delay Time 0.5 Vi to 0.5 Vo 1.5 s Clamp Diode Leakage Current for ULN2064B-ULN2066B and ULN2068B-ULN2070B VR = 50 V Tamb = 25C Tamb = 70C Turn-on Delay Time tPHL VF VCE = 2V, IC = 1A ULN2064B, ULN2074B ULN2066B, ULN2076B VCE = 2V, IC = 1.5A ULN2064B, ULN2074B ULN2066B, ULN2076B ULN2068B ULN2070B Min. 0.5 Vi to 0.5 Vo tPLH IR Test Conditions Clamp Diode Forward Voltage for ULN2064B-ULN2066B and ULN2068B-ULN2070B IF = 1 A IF = 1.5 A 6 50 100 A A 7 1.75 2 V V Notes : 1. Input voltage is with reference to the substrate (no connection to any other pins) for the ULN2074B and ULN2076B reference is ground for all other types. 2. Input current may be limited by maximum allowable input voltage. TEST CIRCUITS Figure 1. Figure 2. Figure 3. Figure 4. 3/8 ULN2064B-ULN2066B-ULN2068B-ULN2070B-ULN2074B-ULN2076B Figure 5. Figure 6. Figure 7. Figure 8. Figure 9 : Input Current as a Function of Input Voltage. Figure 10 : Input Current as a Function of Input Voltage. Figure 11 : Collector Current as a Function of Input Current. 4/8 ULN2064B-ULN2066B-ULN2068B-ULN2070B-ULN2074B-ULN2076B MOUNTING INSTRUCTIONS The Rth j-amb can be reduced by soldering the GND pins to a suitable copper area of the printed circuit board (Fig. 12) or to an external heatsink (Fig. 13). The diagram of Figure 14 shows the maximum dissipable power Ptot and the Rth j-amb as a function of the side "" of two equal square copper areas having a thickness of 35 (1.4 mils). During soldering the pins temperature must not exceed 260 C and the soldering time must not be longer than 12 seconds. The external heatsink or printed circuit copper area must be connected to electrical ground. Figure 12 : Example of P.C. Board Area which is Used as Heatsink. Figure 13 : External Heatsink Mounting Example. Figure 14 : Maximum Dissipable Power and Junction to Ambient Thermal Resistance vs. Side "". Figure 15 : Maximum Allowable Power Dissipation vs. Ambient Temperature. 5/8 ULN2064B-ULN2066B-ULN2068B-ULN2070B-ULN2074B-ULN2076B TYPICAL APPLICATIONS Figure 16 : Common-anode LED Drivers. 6/8 Figure 17 : Common-cathode LED Drivers. ULN2064B-ULN2066B-ULN2068B-ULN2070B-ULN2074B-ULN2076B POWERDIP 16 PACKAGE MECHANICAL DATA mm DIM. MIN. a1 0.51 B 0.85 b b1 TYP. inch MAX. MIN. TYP. MAX. 0.020 1.40 0.033 0.50 0.38 0.020 0.50 D 0.055 0.015 0.020 20.0 0.787 E 8.80 0.346 e 2.54 0.100 e3 17.78 0.700 F 7.10 0.280 I 5.10 0.201 L Z 3.30 0.130 1.27 0.050 7/8 ULN2064B-ULN2066B-ULN2068B-ULN2070B-ULN2074B-ULN2076B Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics. Specification mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. SGS-THOMSON Microelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of SGS-THOMSON Microelectronics. (c) 1996 SGS-THOMSON Microelectronics - Printed in Italy - All Rights Reserved SGS-THOMSON Microelectronics GROUP OF COMPANIES Australia - Brazil - Canada - China - France - Germany - Hong Kong - Italy - Japan - Korea - Malaysia - Malta - Morocco The Netherlands - Singapore - Spain - Sweden - Switzerland - Taiwan - Thailand - United Kingdom - U.S.A. 8/8