STPS3030/CT/CG/CR Low drop power Schottky rectifier Main product characteristics A1 IF(AV) 2 x 15 A VRRM 30 V Tj (max) 150 C VF(max) 0.42 V K A2 K Features and benefits Very small conduction losses Negligible switching losses Extremely fast switching Low forward voltage drop for higher efficiency Low thermal resistance Avalanche capability specified A2 A1 A1 D2PAK STPS3030CG K A2 TO-220AB STPS3030CT Description Dual Schottky rectifier suited for switch mode power supply and high frequency DC to DC converters. K A1 I2PAK STPS3030CR Packaged in TO-220AB, D2PAK and I2PAK, this device is intended for use in low voltage high frequency inverters, free-wheeling and polarity protection applications. October 2006 A2 j Rev 4 1/9 www.st.com 9 Characteristics 1 STPS3030CT/CG/CR Characteristics Table 1. Absolute ratings (limiting values, per diode) Symbol Unit Repetitive peak reverse voltage 30 V IF(RMS) RMS forward current 30 A Tc = 135 C Per diode 15 = 0.5 30 IF(AV) Average forward current IFSM Surge non repetitive forward current tp = 10 ms sinusoidal IRRM Peak repetitive reverse current IRSM PARM A tp = 2 s square F= 1 kHz 1 A Non repetitive peak reverse current tp = 100 s square 3 A Repetitive peak avalanche power tp = 1 s Tj = 25 C 4100 W -65 to + 150 C 150 C 10000 V/s Value Unit Critical rate of rise of reverse voltage (rated VR, Tj = 25 C) Thermal resistance Symbol Rth(j-c) Parameter Junction to case TO-220AB - D2PAK - I2PAK Rth(c) Table 3. Symbol VF(1) (1) 1 - condition to avoid thermal runaway for a diode on its own heatsink < ------------------------Rth ( j - a ) Table 2. IR(1) A 250 Maximum operating junction temperature dV/dt dPtot --------------dTj Per device Storage temperature range Tj Per diode 1.2 Total 0.8 Coupling 0.4 C/W Static electrical characteristics (per diode) Parameter Reverse leakage current Test conditions Tj = 25 C Tj = 125 C Forward voltage drop VR = VRRM Min. Typ. Max. 0.23 1.0 125 180 IF = 15 A 0.44 0.49 Tj = 125 C IF = 15 A 0.36 0.40 Tj = 25 C IF = 30 A 0.53 0.58 Tj = 125 C IF = 30 A 0.49 0.53 To evaluate the conduction losses use the following equation: P = 0.26 x IF(AV) + 0.0107 IF2(RMS) Unit mA Tj = 25 C 1. Pulse test: tp = 380 s, < 2% 2/9 Value VRRM Tstg 1. Parameter V STPS3030CT/CG/CR Figure 1. Characteristics Conduction losses versus average Figure 2. current Average forward current versus ambient temperature ( = 0.5) IF(av)(A) P(W) 18 10 = 0.05 9 = 0.2 = 0.1 = 0.5 16 8 Rth(j-a)=Rth(j-c) 14 =1 7 12 6 10 5 8 4 Rth(j-a)=50C/W 6 3 T 2 1 2 IF(av)(A) =tp/T 0 0 2 Figure 3. 4 6 8 10 4 12 14 16 Tamb(C) tp 0 18 20 Normalized avalanche power derating versus pulse duration 0 25 Figure 4. PARM(tp) PARM(1s) 1 50 75 100 125 150 Normalized avalanche power derating versus junction temperature PARM(tp) PARM(25C) 1.2 1 0.1 0.8 0.6 0.4 0.01 0.2 0.001 0.01 Figure 5. Tj(C) tp(s) 0.1 1 0 10 100 1000 Non repetitive surge peak forward current versus overload duration (maximum values) 0 25 Figure 6. IM(A) 50 75 100 125 150 Relative variation of thermal impedance junction to case versus pulse duration Zth(j-c)/Rth(j-c) 250 1.0 225 0.9 200 0.8 175 0.7 150 0.6 125 TC=25C 100 TC=75C 75 TC=125C 50 = 0.5 0.5 0.4 = 0.2 0.3 = 0.1 T 0.2 Single pulse 25 0 1.E-03 0.1 t(s) 1.E-02 1.E-01 1.E+00 0.0 1.E-03 tp(s) 1.E-02 =tp/T 1.E-01 tp 1.E+00 3/9 Characteristics Figure 7. STPS3030CT/CG/CR Reverse leakage current versus reverse voltage applied (typical values) Figure 8. IR(mA) Junction capacitance versus reverse voltage applied (typical values) C(nF) 1.E+03 10.0 F=1MHz Vosc=30mV Tj=25C Tj=150C 1.E+02 Tj=125C Tj=100C 1.E+01 1.0 Tj=75C 1.E+00 Tj=50C 1.E-01 Tj=25C VR(V) VR(V) 0.1 1.E-02 0 5 Figure 9. 10 15 20 25 1 30 Forward voltage drop versus forward current 10 100 Figure 10. Thermal resistance junction to ambient versus copper surface under tab (epoxy printed board FR4, Cu = 35 m) Rth(j-a)(C/W) IFM(A) 80 100 DPAK 70 Tj=125C (Maximum values) 60 Tj=125C (Typical values) 50 10 40 Tj=25C (Maximum values) 30 20 10 VFM(V) 1 0.0 4/9 S(cm) 0 0.2 0.4 0.6 0.8 1.0 1.2 0 5 10 15 20 25 30 35 40 STPS3030CT/CG/CR 2 Package information Package information Epoxy meets UL94,V0 Cooling method: C Recommended torque value: 0.55 Nm Maximum torque value: 0.70 Nm I2PAK dimensions Table 4. Dimensions Ref. A E c2 L2 D L1 A1 b1 L b c Millimeters Inches Min. Max. Min. Max. A 4.40 4.60 0.173 0.181 A1 2.40 2.72 0.094 0.107 b 0.61 0.88 0.024 0.035 b1 1.14 1.70 0.044 0.067 c 0.49 0.70 0.019 0.028 c2 1.23 1.32 0.048 0.052 D 8.95 9.35 0.352 0.368 e 2.40 2.70 0.094 0.106 e1 4.95 5.15 0.195 0.203 E 10 10.40 0.394 0.409 L 13 14 0.512 0.551 L1 3.50 3.93 0.138 0.155 L2 1.27 1.40 0.050 0.055 e e1 5/9 Package information Table 5. STPS3030CT/CG/CR D2PAK dimensions Dimensions Ref A E C2 L2 D L L3 Millimeters Inches Min. Max. Min. Max. A 4.40 4.60 0.173 0.181 A1 2.49 2.69 0.098 0.106 A2 0.03 0.23 0.001 0.009 B 0.70 0.93 0.027 0.037 B2 1.14 1.70 0.045 0.067 C 0.45 0.60 0.017 0.024 C2 1.23 1.36 0.048 0.054 D 8.95 9.35 0.352 0.368 E 10.00 10.40 0.393 0.409 G 4.88 5.28 0.192 0.208 L 15.00 15.85 0.590 0.624 L2 1.27 1.40 0.050 0.055 L3 1.40 1.75 0.055 0.069 M 2.40 3.20 0.094 0.126 A1 B2 R C B G A2 M * V2 * FLAT ZONE NO LESS THAN 2mm R V2 0.40 typ. 0 8 Figure 11. Footprint (dimensions in millimeters) 16.90 10.30 5.08 1.30 3.70 8.90 6/9 0.016 typ. 0 8 STPS3030CT/CG/CR Package information Table 6. TO-220AB dimensions Dimensions Ref A H2 Dia C L5 L7 L6 L2 F2 F1 D L9 L4 F Inches Min. Max. Min. Max. A 4.40 4.60 0.173 0.181 C 1.23 1.32 0.048 0.051 D 2.40 2.72 0.094 0.107 E 0.49 0.70 0.019 0.027 F 0.61 0.88 0.024 0.034 F1 1.14 1.70 0.044 0.066 F2 1.14 1.70 0.044 0.066 G 4.95 5.15 0.194 0.202 G1 2.40 2.70 0.094 0.106 H2 10 10.40 0.393 0.409 L2 M G1 Millimeters 16.4 typ. 0.645 typ. E G L4 13 14 0.511 0.551 L5 2.65 2.95 0.104 0.116 L6 15.25 15.75 0.600 0.620 L7 6.20 6.60 0.244 0.259 L9 3.50 3.93 0.137 0.154 M Diam 2.6 typ. 3.75 3.85 0.102 typ. 0.147 0.151 In order to meet environmental requirements, ST offers these devices in ECOPACK(R) packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. 7/9 Ordering information 3 Ordering information Ordering type Marking Package Weight Base qty Delivery mode STPS3030CT STPS3030CT TO-220AB STPS3030CG 4 8/9 STPS3030CT/CG/CR STPS3030CG 2.2 g 50 Tube 2 1.48 g 50 Tube 2 D PAK STPS3030CG-TR STPS3030CG D PAK 1.48 g 1000 Tape and reel STPS3030CR STPS3030CR I2PAK 1.49 g 50 Tube Revision history Date Revision Jul-2006 3A 16-Oct-2006 4 Changes Initial release. Reformatted to current standards. Corrected dimensions for I2PAK in Table 4 STPS3030CT/CG/CR Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries ("ST") reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST's terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST'S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER'S OWN RISK. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. (c) 2006 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 9/9