VND600SP Double channel high-side solid state relay Features Type RDS(on) IOUT VCC VND600SP 30m(1) 25A(1) 36V 10 1. Per each channel. 1 PowerSO-10 DC short circuit current: 25A CMOS compatible inputs Proportional load current sense Under-voltage and over-voltage shutdown Over-voltage clamp Thermal shutdown Current limitation Very low standby power consumption Protection against loss of ground and loss of VCC Reverse battery protection Description The VND600SP is a monolithic device made using STMicroelectronics VIPower M0-3 technology. It is intended for driving resistive or inductive loads with one side connected to ground. Active VCC pin voltage clamp protects the device against low energy spikes (see ISO7637 transient compatibility table). This device has two channels in high-side configuration; each channel has an analog sense output on which the sensing current is proportional (according to a known ratio) to the corresponding load current. Built-in thermal shutdown and outputs current limitation protect the chip from over-temperature and short circuit. Device turns-off in case of ground pin disconnection. Table 1. Device summary Order codes Package PowerSO-10 December 2008 Tube Tape and reel VND600SP VND600SP13TR Rev 4 1/26 www.st.com 26 Contents VND600SP Contents 1 Block diagram and pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2 Electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 3 2.1 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 2.2 Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 2.3 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 2.4 Electrical characteristics curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 3.1 4 6 2/26 3.1.1 Solution 1: a resistor in the ground line (RGND only) . . . . . . . . . . . . . . 16 3.1.2 Solution 2: a diode (DGND) in the ground line . . . . . . . . . . . . . . . . . . . . 17 3.2 Load dump protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 3.3 MCU I/O protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 3.4 Maximum demagnetization energy (VCC = 13.5V) . . . . . . . . . . . . . . . . . . 18 Package and PCB thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 4.1 5 GND protection network against reverse battery . . . . . . . . . . . . . . . . . . . 16 PowerSO-10 thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Package and packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 5.1 ECOPACK(R) packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 5.2 PowerSO-10 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 5.3 PowerSO-10 packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 VND600SP List of tables List of tables Table 1. Table 2. Table 3. Table 4. Table 5. Table 6. Table 7. Table 8. Table 9. Table 10. Table 11. Table 12. Table 13. Table 14. Table 15. Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Suggested connections for unused and not connected pins . . . . . . . . . . . . . . . . . . . . . . . . 5 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Thermal data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Protections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 VCC - output diode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Current sense (9V VCC 16V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Logic inputs. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Switching (VCC = 13V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Truth table. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Electrical transient requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Thermal parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 PowerSO-10 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 3/26 List of figures VND600SP List of figures Figure 1. Figure 2. Figure 3. Figure 4. Figure 5. Figure 6. Figure 7. Figure 8. Figure 9. Figure 10. Figure 11. Figure 12. Figure 13. Figure 14. Figure 15. Figure 16. Figure 17. Figure 18. Figure 19. Figure 20. Figure 21. Figure 22. Figure 23. Figure 24. Figure 25. Figure 26. Figure 27. Figure 28. 4/26 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Configuration diagram (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Current and voltage conventions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Switching characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 IOUT/ISENSE versus IOUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Off-state output current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 High level input current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Input clamp voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Turn-on voltage slope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Over-voltage shutdown . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Turn-off voltage slope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 ILIM vs Tcase . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 On-state resistance vs VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Input high level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Input hysteresis voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 On-state resistance vs Tcase . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Input low level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Application schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Maximum turn-off current versus load inductance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 PowerSO-10 PC board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Rthj-amb Vs PCB copper area in open box free air condition . . . . . . . . . . . . . . . . . . . . . . 19 Thermal impedance junction ambient single pulse . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Thermal fitting model of a quad channel HSD in PowerSO-10. . . . . . . . . . . . . . . . . . . . . . 20 PowerSO-10 package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 PowerSO-10 suggested pad layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 PowerSO-10 tube shipment (no suffix) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 PowerSO-10 tape and reel shipment (suffix "TR") . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 VND600SP 1 Block diagram and pin description Block diagram and pin description Figure 1. Block diagram VCC OVER-VOLTAGE VCC CLAMP UNDER-VOLTAGE PwCLAMP 1 DRIVER 1 OUTPUT 1 ILIM1 INPUT 1 Vdslim1 LOGIC IOUT1 INPUT 2 Ot1 CURRENT SENSE 1 K PwCLAMP 2 DRIVER 2 GND Ot1 OVER-TEMP. 1 OVER-TEMP. 2 Figure 2. OUTPUT 2 ILIM2 Vdslim2 IOUT2 Ot2 Ot2 CURRENT SENSE 2 K Configuration diagram (top view) OUTPUT 2 OUTPUT 2 N.C. OUTPUT 1 OUTPUT 1 5 4 3 6 7 8 9 10 GROUND INPUT 2 INPUT 1 C.SENSE1 C.SENSE2 2 1 11 VCC Table 2. Suggested connections for unused and not connected pins Connection / pin Current sense Floating To ground Through 10K resistor N.C. Output Input X X X X Through 10K resistor 5/26 Electrical specifications 2 VND600SP Electrical specifications Figure 3. Current and voltage conventions IS VCC VF1 (*) VCC IOUT1 IIN1 INPUT1 VIN1 OUTPUT1 CURRENT SENSE 1 IOUT2 IIN2 VIN2 INPUT2 VOUT1 ISENSE1 OUTPUT2 CURRENT SENSE 2 GROUND VSENSE1 VOUT2 ISENSE2 VSENSE2 IGND 2.1 Absolute maximum ratings Stressing the device above the rating listed in the "Absolute maximum ratings" table may cause permanent damage to the device. These are stress ratings only and operation of the device at these or any other conditions above those indicated in the Operating sections of this specification is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. Refer also to the STMicroelectronics SURE Program and other relevant quality document. Table 3. Absolute maximum ratings Symbol Parameter Unit 41 V VCC DC supply voltage -VCC Reverse supply voltage - 0.3 V - IGND DC reverse ground pin current - 200 mA Internally limited A - 21 A +/- 10 mA -3 + 15 V V 4000 2000 5000 5000 V V V V IOUT Output current IR Reverse output current IIN Input current VCSENSE Current sense maximum voltage VESD 6/26 Value Electrostatic discharge (human body model: R = 1.5K; C = 100pF) - INPUT - CURRENT SENSE - OUTPUT - VCC VND600SP Electrical specifications Table 3. Symbol Parameter Value Unit EMAX Maximum switching energy (L = 0.13mH; RL = 0; Vbat = 13.5V; Tjstart = 150C; IL = 40A) 145 mJ Ptot Power dissipation at Tc = 25C 96.1 W Tj Junction operating temperature Internally limited C Tc Case operating temperature -40 to 150 C Storage temperature -55 to 150 C TSTG 2.2 Absolute maximum ratings (continued) Thermal data Table 4. Thermal data Symbol Parameter Rthj-case Thermal resistance junction-case Rthj-amb Thermal resistance junction-ambient 1. When mounted on a standard single-sided FR-4 board with Max. value Unit 1.3 C/W 51.3(1) 0.5cm2 37(2) C/W of Cu (at least 35 m thick). 2. When mounted on a standard single-sided FR-4 board with 6 cm2 of Cu (at least 35 m thick). 2.3 Electrical characteristics Values specified in this section are for 8V < VCC < 36V; -40C < Tj < 150C, unless otherwise stated. Table 5. Symbol VCC(1) Power Parameter Test conditions Operating supply voltage Min. Typ. Max. Unit 5.5 13 36 V VUSD(1) Under-voltage shutdown 3 4 5.5 V VOV(1) 36 RON Vclamp IS(1) Over-voltage shutdown On-state resistance IOUT = 5A; Tj = 25C IOUT = 5A; Tj = 150C IOUT = 3A; VCC = 6V Clamp voltage ICC = 20mA(2) Supply current 30 60 100 m m m 48 55 V Off-state; VCC=13V; VIN=VOUT=0V 12 40 A Off-state; VCC=13V; VIN=VOUT=0V; Tj=25C 12 25 mA 6 mA 50 A 41 On-state; VIN = 5V; VCC = 13V; IOUT = 0A; RSENSE = 3.9k IL(off1) Off-state output current V VIN = VOUT = 0V 0 7/26 Electrical specifications Table 5. VND600SP Power (continued) Symbol Parameter Test conditions Min. Typ. Max. Unit -75 0 A IL(off2) Off-state output current VIN = 0V; VOUT = 3.5V IL(off3) Off-state output current VIN = VOUT=0V; VCC=13V; Tj =125C 5 A IL(off4) Off-state output current VIN =VOUT = 0V; VCC = 13V; Tj = 25C 3 A 1. Per device. 2. Vclamp and VOV are correlated. Typical difference is 5V. Table 6. Symbol Ilim TTSD TR Min. Typ. Max. Unit 25 40 70 70 A A Thermal shutdown temperature 150 175 200 C Thermal reset temperature 135 DC short circuit current Test conditions VCC = 13V 5.5V < VCC < 36V Thermal hysteresis Vdemag Turn-off output voltage clamp IOUT = 2A; VIN = 0V; L = 6mH Output voltage drop limitation IOUT = 0.5A Tj = -40C...+150C C 7 15 VCC41 VCC48 C VCC55 50 V mV To ensure long term reliability under heavy over-load or short circuit conditions, protection and related diagnostic signals must be used together with a proper software strategy. If the device is subjected to abnormal conditions, this software must limit the duration and number of activation cycles. Table 7. 8/26 Parameter THYST VON Note: Protections VCC - output diode Symbol Parameter Test conditions VF Forward on voltage - IOUT = 2.6A; Tj = 150C Min. Typ. Max. Unit 0.6 V VND600SP Electrical specifications Table 8. Symbol K1 dK1/K1 K2 dK2/K2 K3 dK3/K3 Current sense (9V VCC 16V) Parameter Test conditions Min. Typ. Max. IOUT/ISENSE IOUT1 or IOUT2 = 0.5A; VSENSE = 0.5V; other channels open; Tj = -40C...150C 3300 4400 6000 Current sense ratio drift IOUT1 or IOUT2 = 0.5A; VSENSE = 0.5V; other channels open; Tj= - 40C...150C -10 IOUT/ISENSE IOUT1 or IOUT2 = 5A; VSENSE = 4V; other channels open; Tj = - 40C Tj= 25C...150C Current sense ratio drift IOUT1 or IOUT2 = 5A; VSENSE = 4V; other channels open; Tj = -40C...150C IOUT/ISENSE IOUT1 or IOUT2 = 15A; VSENSE = 4V; other channels open; Tj = -40C Tj = 25C...150C Current sense ratio drift IOUT1 or IOUT2 = 15A; VSENSE = 4V; other channels open; Tj = -40C...150C Max analog VSENSE1,2 sense output voltage VSENSEH VCC = 5.5V; IOUT1,2 = 2.5A; RSENSE = 10k VCC > 8V, IOUT1,2 = 5A; RSENSE = 10k Analog sense output voltage in VCC = 13V; RSENSE = 3.9k over-temperature condition Analog sense output VCC = 13V; Tj > TTSD; RVSENSEH impedance in all channels open over-temperature condition tDSENSE Current sense delay response To 90% ISENSE(1) 4200 4400 +10 4900 4900 -6 4200 4400 -6 % 6000 5750 +6 4900 4900 Unit % 5500 5250 +6 % 2 V 4 V 5.5 V 400 500 s 1. Current sense signal delay after positive input slope. 9/26 Electrical specifications Table 9. VND600SP Logic inputs Symbol Parameter VIL Input low level voltage IIL Low level input current VIH Input high level voltage IIH High level input current VI(hyst) Input hysteresis voltage VICL Min. VIN = 1.25V Typ. Max. Unit 1.25 V 1 A 3.25 V VIN = 3.25V 10 0.5 IIN = 1mA IIN = - 1mA Input clamp voltage Table 10. 6 A V 6.8 -0.7 8 V V Switching (VCC = 13V) Symbol Parameter Test conditions Min. Typ. Max. Unit td(on) Turn-on delay time RL= 2.6 (see Figure 4.) 30 s td(off) Turn-on delay time RL = 2.6 (see Figure 4.) 30 s (dVOUT/dt)on Turn-on voltage slope RL = 2.6 (see Figure 4.) See Figure 10. V/ s (dVOUT/dt)off Turn-off voltage slope RL = 2.6 (see Figure 4.) See Figure 12. V/ s Table 11. Truth table Conditions 10/26 Test conditions Input Output Sense Normal operation L H L H 0 Nominal Over-temperature L H L L 0 VSENSEH Under-voltage L H L L 0 0 Over-voltage L H L L 0 0 Short circuit to GND L H H L L L Short circuit to VCC L H H H 0 < Nominal Negative output voltage clamp L L 0 0 (Tj<TTSD) 0 (Tj>TTSD) VSENSEH VND600SP Electrical specifications Table 12. Electrical transient requirements ISO T/R Test level 7637/1 Test pulse I II III IV 1 - 25V(1) - 50V(1) - 75V(1) - 100V(1) 2 25V(1) (1) (1) (1) 0.2ms, 10 (1) + + 50V (1) + 75V (1) Delays and impedance + 100V (1) 2ms, 10 3a - 25V - 50V - 100V - 150V 0.1s, 50 3b + 25V(1) + 50V(1) + 75V(1) + 100V(1) 0.1s, 50 4 5 - 4V(1) (1) (1) - 5V (1) - 6V (2) + 46.5V + 26.5V (1) + 66.5V - 7V (2) + 86.5V (2) 100ms, 0.01 400ms, 2 1. All functions of the device are performed as designed after exposure to disturbance. 2. One or more functions of the device is not performed as designed after exposure and cannot be returned to proper operation without replacing the device. Figure 4. Switching characteristics VOUT 90% 80% dVOUT/dt(off) dVOUT/dt(on) tr 10% tf t ISENSE 90% INPUT t tDSENSE td(on) td(off) t 11/26 Electrical specifications Figure 5. VND600SP IOUT/ISENSE versus IOUT IOUT/ISENSE 6500 6000 max.Tj=-40C 5500 max.Tj=25...150C 5000 typical value min.Tj=25...150C 4500 4000 min.Tj=-40C 3500 3000 0 2 4 6 8 IOUT (A) 12/26 10 12 14 16 VND600SP Electrical specifications Figure 6. Waveforms NORMAL OPERATION INPUTn LOAD CURRENTn SENSEn UNDER-VOLTAGE VCC VUSDhyst VUSD INPUTn LOAD CURRENTn SENSEn OVER-VOLTAGE VOV VCC VCC < VOV VCC > VOV INPUTn LOAD CURRENTn SENSEn SHORT TO GROUND INPUTn LOAD CURRENTn LOAD VOLTAGEn SENSEn SHORT TO VCC INPUTn LOAD VOLTAGEn LOAD CURRENTn SENSEn <Nominal <Nominal OVER-TEMPERATURE Tj TTSD TR INPUTn LOAD CURRENTn SENSEn ISENSE= VSENSEH RSENSE 13/26 Electrical specifications VND600SP 2.4 Electrical characteristics curves Figure 7. Off-state output current Figure 8. IL(off1) (uA) High level input current Iih (uA) 2.5 5 2.25 4.5 Off state Vcc=36V Vin=Vout=0V 2 1.75 Vin=3.25V 4 3.5 1.5 3 1.25 2.5 1 2 0.75 1.5 0.5 1 0.25 0.5 0 0 -50 -25 0 25 50 75 100 125 150 175 -50 -25 0 25 Tc (C ) Figure 9. 75 100 125 150 175 150 175 150 175 Tc (C ) Input clamp voltage Figure 10. Turn-on voltage slope dVout/dt(on) (V/ms) Vicl (V) 750 8 700 7.8 Iin=1mA 7.6 Vcc=13V Rl=2.6Ohm 650 7.4 600 7.2 550 7 500 6.8 450 6.6 400 6.4 350 6.2 300 250 6 -50 -25 0 25 50 75 100 125 150 -50 175 -25 0 25 50 75 100 125 Tc (C ) Tc (C ) Figure 11. Over-voltage shutdown Figure 12. Turn-off voltage slope Vov (V) dVout/dt(off) (V/ms) 50 500 48 450 46 400 44 350 42 300 40 250 38 200 36 150 34 100 32 50 30 Vcc=13V Rl=2.6Ohm 0 -50 -25 0 25 50 75 Tc (C ) 14/26 50 100 125 150 175 -50 -25 0 25 50 75 Tc (C ) 100 125 VND600SP Electrical specifications Figure 13. ILIM vs Tcase Figure 14. On-state resistance vs VCC Ilim (A) R on (mOhm) 80 80 70 70 Iout=5A Vcc=13V 60 60 50 50 40 40 30 30 20 20 10 10 Tc=150C Tc=25C Tc=- 40C 0 0 -50 -25 0 25 50 75 100 125 150 175 5 10 15 20 Tc (C ) 25 30 35 40 Vcc (V) Figure 15. Input high level Figure 16. Input hysteresis voltage Vih (V) Vhyst (V) 3.6 1.5 1.4 3.4 1.3 3.2 1.2 3 1.1 2.8 1 0.9 2.6 0.8 2.4 0.7 2.2 0.6 2 0.5 -50 -25 0 25 50 75 100 125 150 175 -50 -25 0 25 Tc (C ) 75 100 125 150 175 Tc (C ) Figure 17. On-state resistance vs Tcase Figure 18. Input low level Ron (mOhm) Vil (V) 100 2.6 90 2.4 Iout=5A Vcc=8V & 36V 80 50 2.2 70 2 60 50 1.8 40 1.6 30 1.4 20 1.2 10 0 1 -75 -50 -25 0 25 50 Tc (C) 75 100 125 150 175 -50 -25 0 25 50 75 100 125 150 175 Tc (C ) 15/26 Application information 3 VND600SP Application information Figure 19. Application schematic +5V Rprot INPUT1 VCC Dld C Rprot CURRENT SENSE1 Rprot INPUT2 Rprot CURRENT SENSE2 OUTPUT1 GND RSENSE1 3.1 RSENSE2 VGND RGND OUTPUT2 DGND GND protection network against reverse battery This section provides two solutions for implementing a ground protection network against reverse battery. 3.1.1 Solution 1: a resistor in the ground line (RGND only) This can be used with any type of load. The following show how to dimension the RGND resistor: 1. RGND 600mV / 2 (IS(on)max) 2. RGND ( - VCC) / ( - IGND) where - IGND is the DC reverse ground pin current and can be found in the absolute maximum rating section of the device datasheet. Power dissipation in RGND (when VCC < 0 during reverse battery situations) is: PD = ( - VCC)2/ RGND This resistor can be shared amongst several different HSDs. Please note that the value of this resistor should be calculated with formula (1) where IS(on)max becomes the sum of the maximum on-state currents of the different devices. 16/26 VND600SP Application information Please note that, if the microprocessor ground is not shared by the device ground, then the RGND will produce a shift (IS(on)max * RGND) in the input thresholds and the status output values. This shift will vary depending on how many devices are ON in the case of several high-side drivers sharing the same RGND . If the calculated power dissipation requires the use of a large resistor, or several devices have to share the same resistor, then ST suggests using solution 2 below. 3.1.2 Solution 2: a diode (DGND) in the ground line A resistor (RGND = 1k) should be inserted in parallel to DGND if the device will be driving an inductive load. This small signal diode can be safely shared amongst several different HSD. Also in this case, the presence of the ground network will produce a shift (j600mV) in the input threshold and the status output values if the microprocessor ground is not common with the device ground. This shift will not vary if more than one HSD shares the same diode/resistor network. Series resistor in INPUT and STATUS lines are also required to prevent that, during battery voltage transient, the current exceeds the Absolute Maximum Rating. Safest configuration for unused INPUT and STATUS pin is to leave them unconnected. 3.2 Load dump protection Dld is necessary (voltage transient suppressor) if the load dump peak voltage exceeds the VCC maximum DC rating. The same applies if the device is subject to transients on the VCC line that are greater than those shown in the ISO T/R 7637/1 table. 3.3 MCU I/O protection If a ground protection network is used and negative transients are present on the VCC line, the control pins will be pulled negative. ST suggests to insert a resistor (Rprot) in line to prevent the C I/O pins from latching up. The value of these resistors is a compromise between the leakage current of C and the current required by the HSD I/Os (Input levels compatibility) with the latch-up limit of C I/Os: - VCCpeak / Ilatchup Rprot (VOHC - VIH - VGND) / IIHmax Example For the following conditions: VCCpeak = - 100V Ilatchup 20mA VOHC 4.5V 5k Rprot 65k. Recommended values are: Rprot = 10k 17/26 Application information 3.4 VND600SP Maximum demagnetization energy (VCC = 13.5V) Figure 20. Maximum turn-off current versus load inductance ILM A X (A ) 100 10 A B C 1 0,01 0,1 1 10 100 L(mH) A = single pulse at TJstart = 150C B= repetitive pulse at TJstart = 100C C= repetitive pulse at TJstart = 125C VIN, IL Demagnetization Demagnetization Demagnetization t Note: Values are generated with RL = 0. In case of repetitive pulses, Tjstart (at beginning of each demagnetization) of every pulse must not exceed the temperature specified above for curves B and C. 18/26 VND600SP Package and PCB thermal data 4 Package and PCB thermal data 4.1 PowerSO-10 thermal data Figure 21. PowerSO-10 PC board Note: Layout condition of Rth and Zth measurements (PCB FR4 area = 58mm x 58mm, PCB thickness = 2mm, Cu thickness = 35m, Copper areas: from minimum pad-lay-out to 8cm2). Figure 22. Rthj-amb Vs PCB copper area in open box free air condition RTHj_amb (C/W) 55 Tj-Tamb=50C 50 45 40 35 30 0 2 4 6 8 10 PCB Cu heatsink area (cm^2) 19/26 Package and PCB thermal data VND600SP Figure 23. Thermal impedance junction ambient single pulse ZTH (C/W) 1000 100 Footprint 6 cm2 10 1 0.1 0.01 0.0001 0.001 0.01 0.1 1 Time (s) 10 100 1000 Equation 1: pulse calculation formula Z TH = R TH + Z THtp ( 1 - ) where = tp T Figure 24. Thermal fitting model of a quad channel HSD in PowerSO-10 Tj_1 Pd1 Tj_2 C1 C2 C3 C4 C5 C6 R1 R2 R3 R4 R5 R6 C1 C2 R1 R2 Pd2 T_amb 20/26 VND600SP Package and PCB thermal data Table 13. Thermal parameters Area / island (cm2) Footprint R1 (C/W) 0.05 R2 (C/W) 0.3 R3 (C/W) 0.3 R4 (C/W) 0.8 R5 (C/W) 12 R6 (C/W) 37 C1 (W.s/C) 0.001 C2 (W.s/C) 5E-03 C3 (W.s/C) 0.02 C4 (W.s/C) 0.3 C5 (W.s/C) 0.75 C6 (W.s/C) 3 6 22 5 21/26 Package and packing information VND600SP 5 Package and packing information 5.1 ECOPACK(R) packages In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK(R) packages, depending on their level of environmental compliance. ECOPACK(R) specifications, grade definitions and product status are available at: www.st.com. ECOPACK(R) is an ST trademark. 5.2 PowerSO-10 mechanical data Figure 25. PowerSO-10 package dimensions B 0.10 A B 10 H E E E2 1 S EATING P LANE e B DETAIL "A" A C 0.25 h E4 D = D1 = = = S EATING PLANE A F A1 A1 L DETAIL "A" 22/26 VND600SP Package and packing information Table 14. PowerSO-10 mechanical data mm Dim. Min. Typ. Max. A 3.35 3.65 A(1) 3.4 3.6 A1 0 0.10 B 0.40 0.60 B(1) 0.37 0.53 C 0.35 0.55 C(1) 0.23 0.32 D 9.40 9.60 D1 7.40 7.60 E 9.30 9.50 E2 7.20 7.60 E2(1) 7.30 7.50 E4 5.90 6.10 E4(1) 5.90 6.30 e 1.27 F 1.25 1.35 F(1) 1.20 1.40 H 13.80 14.40 H(1) 13.85 14.35 h 0.50 L 1.20 1.80 L(1) 0.80 1.10 0 8 (1) 2 8 1. Muar only POA P013P. 23/26 Package and packing information 5.3 VND600SP PowerSO-10 packing information Figure 26. PowerSO-10 suggested Figure 27. PowerSO-10 tube shipment pad layout (no suffix) 14.6 - 14.9 CASABLANCA B 10.8 - 11 MUAR C 6.30 C A A 0.67 - 0.73 1 9.5 10 9 8 2 3 7 4 5 6 B 0.54 - 0.6 All dimensions are in mm. 1.27 Base Q.ty Bulk Q.ty Casablanca Muar 50 50 1000 1000 Tube length ( 0.5) 532 532 A B 10.4 16.4 4.9 17.2 C ( 0.1) 0.8 0.8 Figure 28. PowerSO-10 tape and reel shipment (suffix "TR") Reel dimensions Base Q.ty Bulk Q.ty A (max) B (min) C ( 0.2) F G (+ 2 / -0) N (min) T (max) 600 600 330 1.5 13 20.2 24.4 60 30.4 Tape dimensions According to Electronic Industries Association (EIA) Standard 481 rev. A, Feb. 1986 Tape width Tape Hole Spacing Component Spacing Hole Diameter Hole Diameter Hole Position Compartment Depth Hole Spacing W P0 ( 0.1) P D ( 0.1/-0) D1 (min) F ( 0.05) K (max) P1 ( 0.1) All dimensions are in mm. 24 4 24 1.5 1.5 11.5 6.5 2 End Start Top cover tape No components Components 500mm min Empty components pockets saled with cover tape. User direction of feed 24/26 No components 500mm min VND600SP 6 Revision history Revision history Table 15. Document revision history Date Revision Changes 07-Jul-2004 1 Initial release. 09-Sep-2004 2 Current and voltage convention update (page 2). Configuration diagram (top view) & suggested connections for unused and n.c. pins insertion (page 2). 6 cm2 Cu condition insertion in thermal data table (page 3). VCC - output diode section update (page 3). Revision history table insertion (page 17). Disclaimers update (page 18). 03-May-2006 3 Suggested connections for unused and n.c. pins correction. 15-Dec-2008 4 Document reformatted and restructured. Added contents, list of tables and figures. Added ECOPACK(R) packages information. 25/26 VND600SP Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries ("ST") reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST's terms and conditions of sale. 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