ASMB-MTB1-0A3A2 - Avago Technologies

ASMB-MTB1-0A3A2

PLCC-4 Tricolor Black Surface LED

Data Sheet

CAUTION: LEDs are ESD-sensitive. Please observe appropriate precautions during handling

and processing. Refer to Avago Application Note AN-1142 for additional details.

Description

This family of SMT LEDs are in PLCC-4 package. A wide

viewing angle together with the built in reector drives

up the intensity of light output making these LEDs

suitable for use in interior electronics signs. The black top

surface of the LED provides better contrast enhancement,

especially in full color display.

These LEDs are compatible with reow soldering process.

For easy pick & place, the LEDs are shipped in tape and

reel. Every reel is shipped from a single intensity and color

bin except red color for better uniformity.

Features

• Standard PLCC-4 package (Plastic Leaded Chip Carrier)

• LED package with diused silicone encapsulation

• Using AlInGaP and InGaN dice technologies

• Typical viewing angle at 115°

• Compatible with reow soldering process

• JEDEC MSL 3

Applications

• Indoor full color display

Package Dimensions

2.8

∅2.4

Package

Marking

3.2

0.7

0.86

1.9

0.8

3.5

0.7 0.8

2.2

2 3

Lead Conguration

1 Cathode (Red)

2 Cathode (Green)

3 Cathode (Blue)

4 Common Anode

Notes:

1. All dimensions are in millimeters (mm).

2. Unless otherwise specied, tolerance = ± 0.20 mm.

3. Encapsulation = silicone

4. Terminal Finish: Silver plating

Table 1. Absolute Maximum Ratings (TJ = 25 °C)

Parameter Red Green/Blue Unit

DC Forward Current [1] 25 25 mA

Peak Forward Current [2] 100 100 mA

Power dissipation 65 90 mW

Reverse Voltage Not recommended for reverse bias

Junction Temperature 110 °C

Operating Temperature Range -40 to 100 °C

Storage Temperature Range -40 to 100 °C

Notes:

1. Derate linearly as shown in Figure 7 to Figure 10.

2. Duty factor = 10% frequency = 1 kHz.

Table 2. Optical Characteristics (TJ = 25 °C)

Color

Luminous Intensity, IV (mcd)

@ IF = 20 mA [1]

Dominant Wavelength, ld (nm)

@ IF = 20 mA [2]

Peak Wavelength, lP (nm)

@ IF = 20 mA

Viewing Angle,

2q½ (°) [3]

Min. Typ. Max. Min. Typ. Max. Typ. Typ.

Red 450 540 900 619.0 625.0 629.0 634.0 115

Green 1125 1600 2240 525.0 530.0 535.0 522.0 115

Blue 285 350 560 465.0 470.0 473.0 465.0 115

Notes:

1. Luminous intensity, IV is measured at the mechanical axis of the LED package at a single current pulse condition. The actual peak of the spatial

radiation pattern may not be aligned with the axis.

2. Dominant wavelength is derived from the CIE Chromaticity Diagram and represents the perceived color of the device.

3. q1/2 is the o-axis angle where the luminous intensity is ½ of the peak intensity.

Table 3. Electrical Characteristics (TJ = 25 °C)

Color Forward Voltage, VF (V)

@ IF = 20 mA [1]

Reverse Voltage, VR (V)

@ IR = 100 µA [2]

Reverse Voltage, VR (V)

@ IR = 10 µA [2]

Thermal Resistance,

RqJ-S (°C/W)

Min. Typ. Max. Min. Min. Single chip on Three chips on

Red 1.8 2.1 2.6 4.0 - 609 653

Green 2.8 3.1 3.6 - 4.0 320 430

Blue 2.8 3.1 3.6 - 4.0 320 430

Notes:

1. Tolerance = ± 0.1 V.

2. Indicates product nal testing condition. Long-term reverse bias is not recommended.

Code Description Option

x1 Package type B Black surface

x2 Minimum intensity bin A Red: bin U1 Red: bin U1, U2, V1

Green: bin W1, W2, X1

Blue: bin T1, T2, U1

Green: bin W1

Blue: bin T1

x3 Number of intensity bins 3 3 intensity bins from minimum

x4 Color bin combination A Red: full distribution

Green: bin A, B, D

Blue: bin A, B, C

x5 Test option 2 Test current = 20 mA

A S M B - M T B 1 - 0 A 3 A 2

x1 x2 x3 x4 x5

Part Numbering System

Intensity Bins (CAT)

Bin ID

Luminous intensity (mcd)

Min. Max.

T1 285.0 355.0

T2 355.0 450.0

U1 450.0 560.0

U2 560.0 715.0

V1 715.0 900.0

V2 900.0 1125.0

W1 1125.0 1400.0

W2 1400.0 1800.0

X1 1800.0 2240.0

Tolerance: ±12%

Color Bins (BIN) – Blue

Bin ID

Dominant Wavelength

(nm)

Chromaticity coordinate

(for reference)

Min. Max. Cx Cy

A 465.0 469.0 0.1355 0.0399

0.1751 0.0986

0.1680 0.1094

0.1267 0.0534

B 467.0 471.0 0.1314 0.0459

0.1718 0.1034

0.1638 0.1167

0.1215 0.0626

C 469.0 473.0 0.1267 0.0534

0.1680 0.1094

0.1593 0.1255

0.1158 0.0736

Tolerance: ±1 nm

Color Bins (BIN) – Green

Bin ID

Dominant Wavelength

(nm)

Chromaticity Coordinate

(for reference)

Min. Max. Cx Cy

A 525.0 531.0 0.1142 0.8262

0.1624 0.7178

0.2001 0.6983

0.1625 0.8012

B 528.0 534.0 0.1387 0.8148

0.1815 0.7089

0.2179 0.6870

0.1854 0.7867

D 531.0 535.0 0.1625 0.8012

0.2001 0.6983

0.2238 0.6830

0.1929 0.7816

Tolerance: ± 1 nm

Color Bins (BIN) – Red

Bin ID

Dominant Wavelength

(nm)

Chromaticity Coordinate

(for reference)

Min. Max. Cx Cy

-- 619.0 629.0 0.6894 0.3104

0.6752 0.3113

0.6916 0.2950

0.7066 0.2934

Tolerance: ±1 nm

Table 4. Bin Information

Figure 1. Relative Intensity vs. Wavelength Figure 2. Forward Current vs. Forward Voltage

Figure 3. Relative Luminous Intensity vs. Forward Current

Figure 5. Relative Luminous Flux vs. Junction Temperature Figure 6. Forward Voltage Shift vs. Junction Temperature

Figure 4. Dominant Wavelength Shift vs. Forward Current

Characteristics

0.1

-40 -20 0 20 40 60 80 100 120

NORMALZIED INTENSITY

TJ-JUNCTION TEMPERATURE (°C)

-0.3

-0.2

-0.1

0.1

0.2

0.3

0.4

0.5

-40 -20 0 20 40 60 80 100 120

FORWARD VOLTAGE SHIFT (V)

TJ-JUNCTION TEMPERATURE (°C)

RED

GREEN

BLUE

RED

GREEN

BLUE

0.2

0.4

0.6

0.8

1.0

400 450 500 550 600 650 700

NORMALIZED INTENSITY

WAVELENGTH (nm)

Blue

Green Red

100

0 1 2 3 4 5

FORWARD CURRENT (mA)

FORWARD VOLTAGE (V)

RED

GREEN/BLUE

0.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

0 5 10 15 20 25

NORMALIZED INTENSITY

FORWARD CURRENT (mA)

-2

-1

0 5 10 15 20 25

RELATIVE DOMINANT WAVELENGTH SHIFT (nm)

FORWARD CURRENT (mA)

0.0

Green

Blue

Red

Green

Blue

Red

0 20 40 60 80 100 120

0 20 40 60 80 100

MAXIMUM FORWARD CURRENT (mA)

TEMPERATURE (°C)

0 20 40 60 80 100

MAXIMUM FORWARD CURRENT (mA)

TEMPERATURE (°C)

MAXIMUM FORWARD CURRENT (mA)

TEMPERATURE (°C)

MAXIMUM FORWARD CURRENT (mA)

TEMPERATURE (°C)

Figure 7. Maximum Forward Current vs. Temperature For Red (1 Chip On) Figure 8. Maximum Forward Current vs. Temperature For Red (3 Chips On)

Figure 10. Maximum Forward Current vs. Temperature for Green & Blue

(3 Chips On)

Note:

Maximum forward current graphs based on ambient temperature, TA are with reference to thermal resistance RqJ-A (see below).

For more details, see Precautionary Notes, item 4.

Condition Thermal resistance from LED junction to ambient, RqJ-A (°C/W)

Red Green & Blue

1 chip on 725 454

3 chips on 970 747

Figure 9. Maximum Forward Current vs. Temperature for Green & Blue

(1 Chip On)

Figure 11a. Radiation pattern along x-axis of the package Figure 11b. Radiation pattern along y-axis of the package

Figure 11c. Illustration of package axis for radiation pattern

0.00

0.20

0.40

0.60

0.80

1.00

-90 -60 -30 0 30 60 90

NORMALIZED INTENSITY

ANGULAR DISPLACEMENT (DEGREE)

0.0

0.2

0.4

0.6

0.8

1.0

-90 -60 -30 0 30 60 90

NORMALIZED INTENSITY

ANGULAR DISPLACEMENT (DEGREE)

RED

GREEN

BLUE

RED

GREEN

BLUE

Figure 12. Recommended soldering land pattern

Figure 13. Carrier Tape Dimension

Copper pad

Solder mask

Maximize the size of copper pad of PIN 4

for better heat dissipation.

2.6

1.1

4.5

1.5

USER FEED DIRECTION

∅1.0+0.2

3.05 ± 0.1

3.81 ± 0.1

0.23 ± 0.05

2.14 ± 0.1

8.0+0.3

+0.1

3.50 ± 0.05 1.75 ± 0.1

4 ± 0.1 4 ± 0.1 2 ± 0.05

∅1.5 +0.1

PACKAGE MARKING

Figure 15. Reel Dimension

10.50 ± 1.0 (0.413 ± 0.039)

59.60 ± 1.00

(2.346 ± 0.039)

20.20 MIN.

(0.795 MIN.)

178.40 ± 1.00

(7.024 ± 0.039)

3.0 ± 0.5

(0.118 ± 0.020)

4.0 ± 0.5

(0.157 ± 0.020)

5.0 ± 0.5

(0.197 ± 0.020)

13.1 ± 0.5

(0.516 ± 0.020)

8.0 ± 1.0 (0.315 ± 0.039)

PACKAGE MARKING

USER FEED DIRECTION

PRINTED LABEL

Figure 14. Reel Orientation

(1P) Item: Part Number

(1T) Lot: Lot Number

LPN:

(9D)MFG Date: Manufacturing Date

(P) Customer Item:

(V) Vendor ID:

DeptID: Made In: Country of Origin

(Q) QTY: Quantity

CAT: Intensity Bin

BIN: Color Bin

(9D) Date Code: Date Code

STANDARD LABEL LS0002

RoHS Compliant Halogen Free

e4 Max Temp 260C MSL3

(1P) PART #: Part Number

(1T) LOT #: Lot Number

(9D)MFG DATE: Manufacturing Date

C/O: Country of Origin

(1T) TAPE DATE:

QUANTITY: Packing Quantity

D/C: Date Code VF:

CAT: INTENSITY BIN

BIN: COLOR BIN

BABY LABEL COSB001B V0.0

(9D): DATE CODE:

Packing Label

(i) Standard label (attached on moisture barrier bag)

(ii) Baby label (attached on plastic reel)

Example of luminous intensity (Iv) bin information on

label:

Example of color bin information on label:

Note:

There is no color bin ID for Red as there is only one range, as stated in

Table 4.

BIN: A B

Color Bin for Blue: B

Color Bin for Green: A

CAT: U1 T1

Intensity for Blue: T1

Intensity for Green: W1

Intensity for Red: U1

W1 BIN: A B

Color Bin for Blue: B

Color Bin for Green: A

CAT: U1 T1

Intensity for Blue: T1

Intensity for Green: W1

Intensity for Red: U1

Soldering

Recommended reow soldering condition:

a. Reow soldering must not be done more than two

times. Make sure you take the necessary precautions

for handling a moisture-sensitive device, as stated in

the following section.

b. Recommended board reow direction:

(i) Leaded reow soldering: (ii) Lead-free reow soldering:

c. Do not apply any pressure or force on the LED during

reow and after reow when the LED is still hot.

d. It is preferred that you use reow soldering to

solder the LED. Use hand soldering only for rework

if unavoidable but must be strictly controlled to the

following conditions:

- Soldering iron tip temperature = 320 °C max.

- Soldering duration = 3 sec max.

- Number of cycles = 1 only

- Power of soldering iron = 50 W max.

e. Do not touch the LED body with a hot soldering iron

except the soldering terminals as this may damage the

LED.

f. For de-soldering, it is recommended that you use a

double at tip.

g. Please conrm beforehand whether the functionality

and performance of the LED is aected by hand

soldering.

REFLOW DIRECTION

240°C MAX.

20 SEC. MAX.

3°C/SEC.

MAX.

120 SEC. MAX.

TIME

TEMPERATURE

183°C

100-150°C

-6°C/SEC.

MAX.

60-150 SEC.

3°C/SEC. MAX.

217 °C

200 °C

60 - 120 SEC.

6 °C/SEC. MAX.

3 °C/SEC. MAX.

150 °C

255 - 260 °C

100 SEC. MAX.

10 to 30 SEC.

TIME

TEMPERATURE

PRECAUTIONARY NOTES

1. Handling precautions

The encapsulation material of the LED is made of sili-

cone for better product reliability. Compared to epoxy

encapsulant, which is hard and brittle, silicone is softer

and exible. Observe special handling precautions dur-

ing assembly of silicone-encapsulated LED products.

Failure to comply might lead to damage and prema-

ture failure of the LED. For more information, refer to

Application Note AN5288, Silicone Encapsulation for

LED: Advantages and Handling Precautions.

a. Do not poke sharp objects into the silicone

encapsulant. Sharp objects such as tweezers and

syringes might cause excessive force to be applied

or even pierce through the silicone, inducing failures

in the LED die or wire bond.

b. Do not touch the silicone encapsulant. Uncontrolled

force acting on the silicone encapsulant might result

in excessive stress on the wire bond. The LED should

be held only by the body.

c. Do no stack assembled PCBs together. Use an

appropriate rack to hold the PCBs.

d. The surface of silicone material attracts more dust

and dirt compared to epoxy due to its surface

tackiness. To remove foreign particles on the surface

of silicone, a cotton bud can be used with isopropyl

alcohol (IPA). During cleaning, rub the surface gently

without applying excessive pressure on the silicone.

Ultrasonic cleaning is not recommended.

e. For automated pick and place, Avago has tested

the following nozzle size to work ne with this

LED. However, due to possible variations in other

parameters such as pick and place machine

maker/model and other settings of the machine,

it is recommended that you verify that the nozzle

selected will not damage the LED.

2. Handling of moisture-sensitive device

This product has a Moisture Sensitive Level 3 rating

per JEDEC J-STD-020. Refer to Avago Application Note

AN5305, Handling of Moisture Sensitive Surface Mount

Devices, for additional details and a review of proper

handling procedures.

a. Before use

- An unopened moisture barrier bag (MBB) can be stored

at < 40 °C/90% RH for 12 months. If the actual shelf life

has exceeded 12 months and the Humidity Indicator Card

(HIC) indicates that baking is not required, then it is safe to

reow the LEDs per the original MSL rating.

- It is recommended that the MBB not be opened before

assembly (e.g., for IQC).

b. Control after opening the MBB

- Read the HIC immediately upon opening the MBB.

- The LEDs must be kept at < 30 °C/60% RH at all

times and all high temperature related processes

including soldering, curing or rework must be

completed within 168 hours.

c. Control for unnished reel

- Unused LEDs must be stored in a sealed MBB with

desiccant or desiccator at < 5% RH.

d. Control of assembled boards

- If the PCB soldered with the LEDs is to be subjected

to other high temperature processes, then the PCB

must be stored in a sealed MBB with desiccant or

desiccator at < 5% RH to ensure that all LEDs have

not exceeded their oor life of 168 hours.

e. Baking is required if:

- The HIC indicator is not BROWN at 10% and is AZURE

at 5%.

- The LEDs are exposed to a condition of > 30 °C/60%

RH at any time.

- The LED oor life exceeded 168 hours.

The recommended baking condition is: 60 ± 5 °C for

20 hours.

Baking should be done only once.

f. Storage

- The soldering terminals of these Avago LEDs are

silver-plated. If the LEDs are exposed in ambient

environment for too long, the silver plating

might be oxidized and thus aect its solderability

performance. As such, unused LEDs must be kept in

a sealed MBB with desiccant or in desiccator at < 5%

RH.

ID = 1.7 mm

OD = 3.5 mm

For product information and a complete list of distributors, please go to our web site: www.avagotech.com

Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.

AV02-4194EN - May 22, 2015

DISCLAIMER: Avago’s products and software are not specically designed, manufactured or authorized for sale

as parts, components or assemblies for the planning, construction, maintenenace or direct operation of a

nuclear facility or for use in medical devices or applications. Customer is solely responsible, and waives all rights to

make claims against Avago or its suppliers, for all loss, damage, expense or liability in connection with such use.

3. Application precautions

a. Drive current of the LED must not exceed the

maximum allowable limit across temperature as

stated in the datasheet. Constant current driving is

recommended to ensure consistent performance.

b. The LED is not intended for reverse bias. Do use

other appropriate components for such a purpose.

When driving the LED in matrix form, make sure the

reverse bias voltage does not exceed the allowable

limit for the LED.

c. Do not use the LED in the vicinity of material with

sulfur content, in an environment of high gaseous

sulfur compound and corrosive elements. Examples

of materials that may contain sulfur are rubber

gasket, Room Temperature Vulcanizing (RTV)

silicone rubber, rubber gloves, and so on. Prolonged

exposure to such an environment may aect the

optical characteristics and product life.

d. Avoid a rapid change in ambient temperature

especially in a high humidity environment as this

will cause condensation on the LED.

4. Thermal management

Optical, electrical and reliability characteristics of LED

are aected by temperature. The junction temperature

(TJ) of the LED must be kept below the allowable limit

at all times. TJ can be calculated as follows:

TJ = TA + RqJ-A × IF × VFmax

where

TA = ambient temperature [°C]

RqJ-A = thermal resistance from LED junction to ambi-

ent [°C/W]

IF = forward current [A]

VFmax = maximum forward voltage [V]

The complication of using this formula lies in TA and

RqJ-A. Actual TA is sometimes subjective and hard to de-

termine. RqJ-A varies from system to system depending

on design and is usually not known.

Another way of calculating TJ is by using solder point

temperature TS as shown as follows:

TJ = TS + RqJ-S × IF × VFmax

where

TS = LED solder point temperature as shown in the fol-

lowing illustration [°C]

RqJ-S = thermal resistance from junction to solder point

[°C/W]

TS can be easily measured by having a thermocouple

mounted on the soldering joint, as shown in this illus-

tration, while RqJ-S is provided in the datasheet. Please

verify the TS of the LED in the nal product to ensure

that the LEDs are operated within all maximum ratings

stated in the datasheet.

5. Eye safety precautions

LEDs may pose optical hazards when in operation. It is

not advisable to view directly at operating LEDs as it

may be harmful to the eyes. For safety reasons, use ap-

propriate shielding or personal protective equipment.

Ts point

(PIN 4)

Mouser Electronics

Authorized Distributor

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