© 2006 IXYS All rights reserved
Symbol Test Conditions Maximum Ratings
VDSS TJ= 25°C to 150°C 300 V
VDGR TJ= 25°C to 150°C; RGS = 1 MΩ300 V
VGS Continuous ±20 V
VGSM Transient ±30 V
ID25 TC= 25°C 102 A
ID(RMS) External lead current limit 75 A
IDM TC= 25°C, pulse width limited by TJM 250 A
IAR TC= 25°C60A
EAR TC= 25°C60mJ
EAS TC= 25°C 2.5 J
dv/dt IS≤ I
DM, di/dt ≤ 100 A/µs, VDD ≤ V
DSS, 10 V/ns
TJ≤ 150°C, RG = 4 Ω
PDTC= 25°C 700 W
TJ-55 ... +150 °C
TJM 150 °C
Tstg -55 ... +150 °C
TL1.6 mm (0.062 in.) from case for 10 s 300 °C
TSOLD Plastic body for 10 s 260 °C
MdMounting torque, Terminal lead torque 1.13/10 Nm/lb.in.
Weight TO-264 10 g
DS99221E(05/06)
Symbol Test Conditions Characteristic Values
(TJ = 25°C, unless otherwise specified) Min. Typ. Max.
BVDSS VGS = 0 V, ID = 250 µA 300 V
VGS(th) VDS = VGS, ID = 4 mA 2.5 5.0 V
IGSS VGS = ±20 VDC, VDS = 0 ±200 nA
IDSS VDS = VDSS 25 µA
VGS = 0 V TJ = 125°C 250 µA
RDS(on) VGS = 10 V, ID = 0.5 ID25 33 m Ω
Pulse test, t ≤ 300 µs, duty cycle d ≤ 2 %
PolarHTTM HiPerFET
Power MOSFET
IXFK 102N30P
N-Channel Enhancement Mode
Fast Intrinsic Diode
Avalanche Rated
Features
lInternational standard package
lUnclamped Inductive Switching (UIS)
rated
lLow package inductance
- easy to drive and to protect
Advantages
lEasy to mount
lSpace savings
lHigh power density
VDSS = 300 V
ID25 = 102 A
RDS(on) ≤≤
≤≤
≤33 mΩΩ
ΩΩ
Ω
trr ≤≤
≤≤
≤200 ns
G = Gate D = Drain
S = Source
TO-264 (IXFK)
(TAB)
GDS
Preliminary Technical Information
IXYS reserves the right to change limits, test conditions, and dimensions.
IXFK 102N30P
Symbol Test Conditions Characteristic Values
(TJ = 25°C, unless otherwise specified)
Min. Typ. Max.
gfs VDS= 10 V; ID = 0.5 ID25, pulse test 45 57 S
Ciss 7500 pF
Coss VGS = 0 V, VDS = 25 V, f = 1 MHz 1150 pF
Crss 230 pF
td(on) 30 ns
trVGS = 10 V, VDS = 0.5 VDSS, ID = 60 A 28 ns
td(off) RG = 3.3 Ω (External) 130 ns
tf30 ns
Qg(on) 224 nC
Qgs VGS= 10 V, VDS = 0.5 VDSS, ID = 0.5 ID25 50 nC
Qgd 110 nC
RthJC 0.18°C/W
RthCS 0.15 °C/W
Source-Drain Diode Characteristic Values
(TJ = 25°C, unless otherwise specified)
Symbol Test Conditions Min. Typ. Max.
ISVGS = 0 V 102 A
ISM Repetitive 250 A
VSD IF = IS, VGS = 0 V, 1.5 V
Pulse test, t ≤ 300 µs, duty cycle d ≤ 2 %
trr IF = 25 A, -di/dt = 100 A/µs 200 ns
QRM VR = 100 V, VGS = 0 V 0.8 µC
TO-264 Outline
Millimeter Inches
Min. Max. Min. Max.
A 4.82 5.13 .190 .202
A1 2.54 2.89 .100 .114
A2 2.00 2.10 .079 .083
b 1.12 1.42 .044 .056
b1 2.39 2.69 .094 .106
b2 2.90 3.09 .114 .122
c 0.53 0.83 .021 .033
D 25.91 26.16 1.020 1.030
E 19.81 19.96 .780 .786
e 5.46 BSC .215 BSC
J 0.00 0.25 .000 .010
K 0.00 0.25 .000 .010
L 20.32 20.83 .800 .820
L1 2.29 2.59 .090 .102
P 3.17 3.66 .125 .144
Q 6.07 6.27 .239 .247
Q1 8.38 8.69 .330 .342
R 3.81 4.32 .150 .170
R1 1.78 2.29 .070 .090
S 6.04 6.30 .238 .248
T 1.57 1.83 .062 .072
Dim.
IXYS MOSFETs and IGBTs are covered by 4,835,592 4,931,844 5,049,961 5,237,481 6,162,665 6,404,065 B1 6,683,344 6,727,585
one or moreof the following U.S. patents: 4,850,072 5,017,508 5,063,307 5,381,025 6,259,123 B1 6,534,343 6,710,405B2 6,759,692
4,881,106 5,034,796 5,187,117 5,486,715 6,306,728 B1 6,583,505 6,710,463 6,771,478 B2
PRELIMINARY TECHNICAL INFORMATION
The product presented herein is under development. The Technical Specifications offered
are derived from data gathered during objective characterizations of preliminary engineer-
ing lots; but also may yet contain some information supplied during a pre-production
design evaluation. IXYS reserves the right to change limits, test conditions, and dimen-
sions without notice.
