Freescale Semiconductor, Inc. Data Sheet: Technical Data Document Number: KL26P121M48SF4 Rev 5 08/2014 Kinetis KL26 Sub-Family MKL26Z256VLH4 MKL26Z256VMP4 MKL26ZxxxVLL4 MKL26ZxxxVMC4 48 MHz Cortex-M0+ Based Microcontroller Designed with efficiency in mind. Compatible with all other Kinetis L families as well as Kinetis K2x family. General purpose MCU with USB 2.0, featuring market leading ultra low-power to provide developers an appropriate entry-level 32-bit solution. This product offers: * Run power consumption down to 50 A/MHz in very low power run mode * Static power consumption down to 2 A with full state retention and 4.5 s wakeup * Ultra-efficient Cortex-M0+ processor running up to 48 MHz with industry leading throughput * Memory option is up to 256 KB flash and 32 KB RAM * Energy-saving architecture is optimized for low power with 90nm TFS technology, clock and power gating techniques, and zero wait state flash memory controller Performance * 48 MHz ARM(R) Cortex(R)-M0+ core Memories and memory interfaces * Up to 256 KB program flash memory * Up to 32 KB SRAM 64-pin LQFP (LH) 64-pin MAPBGA (MP) 10 x 10 x 1.4 Pitch 0.5 5 x 5 x 1.23 Pitch 0.5 mm mm 100-pin LQFP (LL) 121-pin MAPBGA (MP) 14 x 14 x 1.4 Pitch 0.5 8 x 8 x 0.8 Pitch 0.65 mm mm Human-machine interface * Low-power hardware touch sensor interface (TSI) * Up to 84 general-purpose input/output (GPIO) Communication interfaces * USB full-/low-speed On-the-Go controller with onchip transceiver and 5 V to 3.3 V regulator System peripherals * Two 16-bit SPI modules * Nine low-power modes to provide power optimization * I2S (SAI) module based on application requirements * One low power UART module * COP Software watchdog * Two UART modules * 4-channel DMA controller, supporting up to 63 request * Two I2C module sources Analog Modules * Low-leakage wakeup unit * SWD debug interface and Micro Trace Buffer * 16-bit SAR ADC * Bit Manipulation Engine * 12-bit DAC * Analog comparator (CMP) containing a 6-bit DAC Clocks and programmable reference input * 32 kHz to 40 kHz or 3 MHz to 32 MHz crystal oscillator * Multi-purpose clock source Timers * Six channel Timer/PWM (TPM) Operating Characteristics * Two 2-channel Timer/PWM modules * Voltage range: 1.71 to 3.6 V * Periodic interrupt timers * Flash write voltage range: 1.71 to 3.6 V * 16-bit low-power timer (LPTMR) * Temperature range (ambient): -40 to 105C * Real time clock Freescale reserves the right to change the detail specifications as may be required to permit improvements in the design of its products. (c) 2012-2014 Freescale Semiconductor, Inc. All rights reserved. Security and integrity modules * 80-bit unique identification number per chip Ordering Information 1 Part Number Memory Maximum number of I\O's Flash (KB) SRAM (KB) MKL26Z256VLH4 256 32 50 MKL26Z256VMP4 256 32 50 MKL26Z128VLL4 128 16 80 MKL26Z256VLL4 256 32 80 MKL26Z128VMC4 128 16 84 MKL26Z256VMC4 256 32 84 1. To confirm current availability of ordererable part numbers, go to http://www.freescale.com and perform a part number search. Related Resources Type Description Resource Selector Guide The Freescale Solution Advisor is a web-based tool that features interactive application wizards and a dynamic product selector. Solution Advisor Reference Manual The Reference Manual contains a comprehensive description of the structure and function (operation) of a device. KL26P121M48SF4RM1 Data Sheet The Data Sheet includes electrical characteristics and signal connections. KL26P121M48SF41 Chip Errata The chip mask set Errata provides additional or corrective information for a particular device mask set. KINETIS_L_xN40H2 Package drawing Package dimensions are provided in package drawings. LQFP 64-pin: 98ASS23234W1 MAPBGA 64-pin: 98ASA00420D1 LQFP 100-pin: 98ASS23308W1 MAPBGA 121-pin: 98ASA00344D1 1. To find the associated resource, go to http://www.freescale.com and perform a search using this term. 2. To find the associated resource, go to http://www.freescale.com and perform a search using this term with the "x" replaced by the revision of the device you are using. 2 Freescale Semiconductor, Inc. Kinetis KL26 Sub-Family, Rev5 08/2014. Table of Contents 1 Ratings.................................................................................. 4 1.1 Thermal handling ratings............................................... 4 1.2 Moisture handling ratings...............................................4 1.3 ESD handling ratings..................................................... 4 1.4 Voltage and current operating ratings............................4 2 General................................................................................. 5 2.1 AC electrical characteristics...........................................5 2.2 Nonswitching electrical specifications............................6 2.2.1 Voltage and current operating requirements......6 2.2.2 LVD and POR operating requirements.............. 6 2.2.3 Voltage and current operating behaviors........... 7 2.2.4 Power mode transition operating behaviors.......8 2.2.5 Power consumption operating behaviors...........9 2.2.6 EMC radiated emissions operating behaviors... 15 2.2.7 Designing with radiated emissions in mind........ 16 2.2.8 Capacitance attributes....................................... 16 2.3 Switching specifications................................................. 16 2.3.1 Device clock specifications................................ 16 2.3.2 General switching specifications........................17 2.4 Thermal specifications................................................... 17 2.4.1 Thermal operating requirements........................17 2.4.2 Thermal attributes.............................................. 17 3 Peripheral operating requirements and behaviors................ 18 3.1 Core modules................................................................ 18 3.1.1 SWD electricals .................................................18 3.2 System modules............................................................ 20 3.3 Clock modules............................................................... 20 3.3.1 MCG specifications............................................ 20 3.3.2 Oscillator electrical specifications...................... 22 3.4 Memories and memory interfaces................................. 24 3.4.1 Flash electrical specifications............................ 24 3.5 Security and integrity modules.......................................26 3.6 Analog............................................................................26 3.6.1 3.6.2 ADC electrical specifications..............................26 CMP and 6-bit DAC electrical specifications......31 Kinetis KL26 Sub-Family, Rev5 08/2014. 4 5 6 7 8 3.6.3 12-bit DAC electrical characteristics.................. 33 3.7 Timers............................................................................ 36 3.8 Communication interfaces............................................. 36 3.8.1 USB electrical specifications..............................36 3.8.2 USB VREG electrical specifications...................37 3.8.3 SPI switching specifications...............................37 3.8.4 Inter-Integrated Circuit Interface (I2C) timing.....42 3.8.5 UART................................................................. 43 3.8.6 I2S/SAI switching specifications........................ 43 3.9 Human-machine interfaces (HMI).................................. 47 3.9.1 TSI electrical specifications................................47 Dimensions........................................................................... 48 4.1 Obtaining package dimensions......................................48 Pinout.................................................................................... 48 5.1 KL26 Signal Multiplexing and Pin Assignments.............48 5.2 KL26 pinouts.................................................................. 52 Ordering parts....................................................................... 56 6.1 Determining valid orderable parts.................................. 56 Part identification...................................................................56 7.1 Description..................................................................... 56 7.2 Format........................................................................... 57 7.3 Fields............................................................................. 57 7.4 Example......................................................................... 57 Terminology and guidelines.................................................. 58 8.1 Definition: Operating requirement.................................. 58 8.2 Definition: Operating behavior....................................... 58 8.3 Definition: Attribute........................................................ 58 8.4 Definition: Rating........................................................... 59 8.5 Result of exceeding a rating.......................................... 59 8.6 Relationship between ratings and operating requirements.................................................................. 59 8.7 Guidelines for ratings and operating requirements........ 60 8.8 Definition: Typical value................................................. 60 8.9 Typical value conditions.................................................61 9 Revision history.....................................................................62 3 Freescale Semiconductor, Inc. Ratings 1 Ratings 1.1 Thermal handling ratings Table 1. Thermal handling ratings Symbol Description Min. Max. Unit Notes TSTG Storage temperature -55 150 C 1 TSDR Solder temperature, lead-free -- 260 C 2 1. Determined according to JEDEC Standard JESD22-A103, High Temperature Storage Life. 2. Determined according to IPC/JEDEC Standard J-STD-020, Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices. 1.2 Moisture handling ratings Table 2. Moisture handling ratings Symbol MSL Description Moisture sensitivity level Min. Max. Unit Notes -- 3 -- 1 1. Determined according to IPC/JEDEC Standard J-STD-020, Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices. 1.3 ESD handling ratings Table 3. ESD handling ratings Symbol Description Min. Max. Unit Notes VHBM Electrostatic discharge voltage, human body model -2000 +2000 V 1 VCDM Electrostatic discharge voltage, charged-device model -500 +500 V 2 Latch-up current at ambient temperature of 105 C -100 +100 mA 3 ILAT 1. Determined according to JEDEC Standard JESD22-A114, Electrostatic Discharge (ESD) Sensitivity Testing Human Body Model (HBM). 2. Determined according to JEDEC Standard JESD22-C101, Field-Induced Charged-Device Model Test Method for Electrostatic-Discharge-Withstand Thresholds of Microelectronic Components. 3. Determined according to JEDEC Standard JESD78, IC Latch-Up Test. 4 Freescale Semiconductor, Inc. Kinetis KL26 Sub-Family, Rev5 08/2014. General 1.4 Voltage and current operating ratings Table 4. Voltage and current operating ratings Symbol Description Min. Max. Unit VDD Digital supply voltage -0.3 3.8 V IDD Digital supply current -- 120 mA VIO IO pin input voltage -0.3 VDD + 0.3 V Instantaneous maximum current single pin limit (applies to all port pins) -25 25 mA ID VDDA Analog supply voltage VDD - 0.3 VDD + 0.3 V VUSB_DP USB_DP input voltage -0.3 3.63 V VUSB_DM USB_DM input voltage -0.3 3.63 V USB regulator input -0.3 6.0 V VREGIN 2 General 2.1 AC electrical characteristics Unless otherwise specified, propagation delays are measured from the 50% to the 50% point, and rise and fall times are measured at the 20% and 80% points, as shown in the following figure. Low VIH Input Signal High 80% 50% 20% Midpoint1 VIL Fall Time Rise Time The midpoint is VIL + (VIH - VIL) / 2 Figure 2. Input signal measurement reference All digital I/O switching characteristics, unless otherwise specified, assume the output pins have the following characteristics. * CL=30 pF loads * Slew rate disabled * Normal drive strength Kinetis KL26 Sub-Family, Rev5 08/2014. 5 Freescale Semiconductor, Inc. General 2.2 Nonswitching electrical specifications 2.2.1 Voltage and current operating requirements Table 5. Voltage and current operating requirements Symbol Description Min. Max. Unit VDD Supply voltage 1.71 3.6 V VDDA Analog supply voltage 1.71 3.6 V VDD - VDDA VDD-to-VDDA differential voltage -0.1 0.1 V VSS - VSSA VSS-to-VSSA differential voltage -0.1 0.1 V * 2.7 V VDD 3.6 V 0.7 x VDD -- V * 1.7 V VDD 2.7 V 0.75 x VDD -- V * 2.7 V VDD 3.6 V -- 0.35 x VDD V * 1.7 V VDD 2.7 V -- 0.3 x VDD V 0.06 x VDD -- V -3 -- mA -25 -- mA VIH VIL Input high voltage Input low voltage VHYS Input hysteresis IICIO IO pin negative DC injection current -- single pin 1 * VIN < VSS-0.3V IICcont Notes Contiguous pin DC injection current --regional limit, includes sum of negative injection currents of 16 contiguous pins * Negative current injection VODPU Open drain pullup voltage level VDD VDD V VRAM VDD voltage required to retain RAM 1.2 -- V 2 1. All I/O pins are internally clamped to VSS through a ESD protection diode. There is no diode connection to VDD. If VIN greater than VIO_MIN (= VSS-0.3 V) is observed, then there is no need to provide current limiting resistors at the pads. If this limit cannot be observed then a current limiting resistor is required. The negative DC injection current limiting resistor is calculated as R = (VIO_MIN - VIN)/|IICIO|. 2. Open drain outputs must be pulled to VDD. 2.2.2 LVD and POR operating requirements Table 6. VDD supply LVD and POR operating requirements Symbol VPOR Description Min. Typ. Max. Unit Notes Falling VDD POR detect voltage 0.8 1.1 1.5 V -- Table continues on the next page... 6 Freescale Semiconductor, Inc. Kinetis KL26 Sub-Family, Rev5 08/2014. General Table 6. VDD supply LVD and POR operating requirements (continued) Symbol VLVDH Description Min. Typ. Max. Unit Notes Falling low-voltage detect threshold -- high range (LVDV = 01) 2.48 2.56 2.64 V -- Low-voltage warning thresholds -- high range VLVW1H * Level 1 falling (LVWV = 00) VLVW2H * Level 2 falling (LVWV = 01) VLVW3H * Level 3 falling (LVWV = 10) VLVW4H * Level 4 falling (LVWV = 11) VHYSH Low-voltage inhibit reset/recover hysteresis -- high range VLVDL Falling low-voltage detect threshold -- low range (LVDV=00) 1 2.62 2.70 2.78 V 2.72 2.80 2.88 V 2.82 2.90 2.98 V 2.92 3.00 3.08 V -- 60 -- mV -- 1.54 1.60 1.66 V -- Low-voltage warning thresholds -- low range VLVW1L * Level 1 falling (LVWV = 00) VLVW2L * Level 2 falling (LVWV = 01) VLVW3L * Level 3 falling (LVWV = 10) VLVW4L * Level 4 falling (LVWV = 11) VHYSL Low-voltage inhibit reset/recover hysteresis -- low range 1 1.74 1.80 1.86 V 1.84 1.90 1.96 V 1.94 2.00 2.06 V 2.04 2.10 2.16 V -- 40 -- mV -- VBG Bandgap voltage reference 0.97 1.00 1.03 V -- tLPO Internal low power oscillator period -- factory trimmed 900 1000 1100 s -- 1. Rising thresholds are falling threshold + hysteresis voltage 2.2.3 Voltage and current operating behaviors Table 7. Voltage and current operating behaviors Symbol VOH Description Min. Output high voltage -- Normal drive pad (except RESET_b) * 2.7 V VDD 3.6 V, IOH = -5 mA * 1.71 V VDD 2.7 V, IOH = -2.5 mA VOH Output high voltage -- High drive pad (except RESET_b) * 2.7 V VDD 3.6 V, IOH = -20 mA * 1.71 V VDD 2.7 V, IOH = -10 mA IOHT Output high current total for all ports Max. Unit Notes 1, 2 VDD - 0.5 -- V VDD - 0.5 -- V 1, 2 VDD - 0.5 -- V VDD - 0.5 -- V -- 100 mA Table continues on the next page... Kinetis KL26 Sub-Family, Rev5 08/2014. 7 Freescale Semiconductor, Inc. General Table 7. Voltage and current operating behaviors (continued) Symbol VOL VOL Description Min. Max. Unit Notes Output low voltage -- Normal drive pad 1 * 2.7 V VDD 3.6 V, IOL = 5 mA -- 0.5 V * 1.71 V VDD 2.7 V, IOL = 2.5 mA -- 0.5 V Output low voltage -- High drive pad 1 * 2.7 V VDD 3.6 V, IOL = 20 mA -- 0.5 V * 1.71 V VDD 2.7 V, IOL = 10 mA -- 0.5 V Output low current total for all ports -- 100 mA IIN Input leakage current (per pin) for full temperature range -- 1 A 3 IIN Input leakage current (per pin) at 25 C -- 0.025 A 3 IIN Input leakage current (total all pins) for full temperature range -- A 3 IOZ Hi-Z (off-state) leakage current (per pin) -- 1 A RPU Internal pullup resistors 20 50 k IOLT 4 1. PTB0, PTB1, PTD6, and PTD7 I/O have both high drive and normal drive capability selected by the associated PTx_PCRn[DSE] control bit. All other GPIOs are normal drive only. 2. The reset pin only contains an active pull down device when configured as the RESET signal or as a GPIO. When configured as a GPIO output, it acts as a pseudo open drain output. 3. Measured at VDD = 3.6 V 4. Measured at VDD supply voltage = VDD min and Vinput = VSS 2.2.4 Power mode transition operating behaviors All specifications except tPOR and VLLSxRUN recovery times in the following table assume this clock configuration: * CPU and system clocks = 48 MHz * Bus and flash clock = 24 MHz * FEI clock mode POR and VLLSxRUN recovery use FEI clock mode at the default CPU and system frequency of 21 MHz, and a bus and flash clock frequency of 10.5 MHz. Table 8. Power mode transition operating behaviors Symbol tPOR Description After a POR event, amount of time from the point VDD reaches 1.8 V to execution of the first instruction across the operating temperature range of the chip. Min. Typ. Max. Unit Notes -- -- 300 s 1 Table continues on the next page... 8 Freescale Semiconductor, Inc. Kinetis KL26 Sub-Family, Rev5 08/2014. General Table 8. Power mode transition operating behaviors (continued) Symbol Description Min. Typ. Max. Unit -- 113 124 s -- 112 124 s -- 53 60 s -- 4.5 5.0 s -- 4.5 5.0 s -- 4.5 5.0 s Notes * VLLS0 RUN * VLLS1 RUN * VLLS3 RUN * LLS RUN * VLPS RUN * STOP RUN 1. Normal boot (FTFA_FOPT[LPBOOT]=11). 2.2.5 Power consumption operating behaviors The maximum values stated in the following table represent characterized results equivalent to the mean plus three times the standard deviation (mean + 3 sigma). Table 9. Power consumption operating behaviors Symbol Typ. Max Unit Note -- -- See note mA 1 IDD_RUNCO_ CM Run mode current in compute operation -- - 48 MHz core / 24 MHz flash/ bus disabled, LPTMR running using 4 MHz internal reference clock, CoreMark(R) benchmark code executing from flash, at 3.0 V 6.7 -- mA 2 IDD_RUNCO Run mode current in compute operation -- - 48 MHz core / 24 MHz flash / bus clock disabled, code of while(1) loop executing from flash, at 3.0 V 4.5 5.1 mA 3 Run mode current - 48 MHz core / 24 at 1.8 V MHz bus and flash, all peripheral clocks at 3.0 V disabled, code executing from flash 5.6 6.3 mA 3 5.4 6.0 mA Run mode current - 48 MHz core / 24 -- MHz bus and flash, all peripheral clocks enabled, code executing from flash, at 1.8 V 6.9 7.3 mA IDDA IDD_RUN IDD_RUN Description Analog supply current 3, 4 Table continues on the next page... Kinetis KL26 Sub-Family, Rev5 08/2014. 9 Freescale Semiconductor, Inc. General Table 9. Power consumption operating behaviors (continued) Symbol Description Typ. Max Unit Run mode current - 48 MHz core / 24 at 25 C MHz bus and flash, all peripheral clocks at 125 C enabled, code executing from flash, at 3.0 V 6.9 7.1 mA 7.3 7.6 mA IDD_WAIT Wait mode current - core disabled / 48 MHz system / 24 MHz bus / flash disabled (flash doze enabled), all peripheral clocks disabled, at 3.0 V -- 2.9 3.5 mA 3 IDD_WAIT Wait mode current - core disabled / 24 -- MHz system / 24 MHz bus / flash disabled (flash doze enabled), wait mode reduced frequency current at 3.0 V -- all peripheral clocks disabled 2.2 2.8 mA 3 Stop mode current with partial stop 2 clocking option - core and system disabled / 10.5 MHz bus, at 3.0 V -- 1.6 2.1 mA 3 Very-low-power run mode current in -- compute operation - 4 MHz core / 0.8 MHz flash / bus clock disabled, LPTMR running with 4 MHz internal reference clock, CoreMark benchmark code executing from flash, at 3.0 V 798 -- A 5 IDD_VLPRCO Very low power run mode current in compute operation - 4 MHz core / 0.8 MHz flash / bus clock disabled, code executing from flash, at 3.0 V -- 167 336 A 6 IDD_VLPR Very low power run mode current - 4 MHz core / 0.8 MHz bus and flash, all peripheral clocks disabled, code executing from flash, at 3.0 V -- 192 354 A 6 IDD_VLPR Very low power run mode current - 4 MHz core / 0.8 MHz bus and flash, all peripheral clocks enabled, code executing from flash, at 3.0 V -- 257 431 A 4, 6 IDD_VLPW Very low power wait mode current -- core disabled / 4 MHz system / 0.8 MHz bus / flash disabled (flash doze enabled), all peripheral clocks disabled, at 3.0 V 112 286 A 6 IDD_STOP Stop mode current at 3.0 V at 25 C 306 328 A -- at 50 C 322 349 A at 70 C 348 382 A at 85 C 384 433 A at 105 C 481 578 A at 25 C 2.71 5.03 A at 50 C 7.05 11.94 A at 70 C 15.80 26.87 A IDD_PSTOP2 IDD_VLPRCO _CM IDD_VLPS Very-low-power stop mode current at 3.0 V Note -- Table continues on the next page... 10 Freescale Semiconductor, Inc. Kinetis KL26 Sub-Family, Rev5 08/2014. General Table 9. Power consumption operating behaviors (continued) Symbol IDD_LLS IDD_VLLS3 IDD_VLLS1 IDD_VLLS0 IDD_VLLS0 Description Typ. Max Unit at 85 C 29.60 47.30 A at 105 C 69.13 106.04 A at 25 C 2.00 2.7 A at 50 C 3.96 5.14 A at 70 C 7.77 10.71 A at 85 C 14.15 18.79 A at 105 C 33.20 43.67 A at 25 C 1.5 2.2 A at 50 C 2.83 3.55 A at 70 C 5.53 7.26 A at 85 C 9.92 12.71 A at 105 C 22.90 29.23 A at 25 C 0.71 1.2 A at 50 C 1.27 1.9 A at 70 C 2.48 3.51 A at 85 C 4.65 6.29 A at 105 C 11.55 14.34 A Very low-leakage stop mode 0 current at 25 C (SMC_STOPCTRL[PORPO] = 0) at 3.0 at 50 C V at 70 C 0.41 0.9 A 0.96 1.56 A 2.17 3.1 A at 85 C 4.35 5.32 A at 105 C 11.24 14.00 A Very low-leakage stop mode 0 current at 25 C (SMC_STOPCTRL[PORPO] = 1) at 3.0 at 50 C V at 70 C 0.23 0.69 A 0.77 1.35 A 1.98 2.52 A at 85 C 4.16 5.14 A at 105 C 11.05 13.80 A Low leakage stop mode current at 3.0 V Very low-leakage stop mode 3 current at 3.0 V Very low-leakage stop mode 1 current at 3.0V Note -- -- -- -- 7 1. The analog supply current is the sum of the active or disabled current for each of the analog modules on the device. See each module's specification for its supply current. 2. MCG configured for PEE mode. CoreMark benchmark compiled using IAR 6.40 with optimization level high, optimized for balanced. 3. MCG configured for FEI mode. 4. Incremental current consumption from peripheral activity is not included. 5. MCG configured for BLPI mode. CoreMark benchmark compiled using IAR 6.40 with optimization level high, optimized for balanced. 6. MCG configured for BLPI mode. 7. No brownout. Kinetis KL26 Sub-Family, Rev5 08/2014. 11 Freescale Semiconductor, Inc. General Table 10. Low power mode peripheral adders -- typical value Symbol Description Temperature (C) Unit -40 25 50 70 85 105 IIREFSTEN4MHz 4 MHz internal reference clock (IRC) adder. Measured by entering STOP or VLPS mode with 4 MHz IRC enabled. 56 56 56 56 56 56 A IIREFSTEN32KHz 32 kHz internal reference clock (IRC) adder. Measured by entering STOP mode with the 32 kHz IRC enabled. 52 52 52 52 52 52 A IEREFSTEN4MHz External 4 MHz crystal clock adder. Measured by entering STOP or VLPS mode with the crystal enabled. 206 228 237 245 251 258 A IEREFSTEN32KHz External 32 kHz crystal clock adder by means of the OSC0_CR[EREFSTEN and EREFSTEN] bits. Measured by entering all modes with the crystal enabled. VLLS1 440 490 540 560 570 580 nA VLLS3 440 490 540 560 570 580 LLS 490 490 540 560 570 680 VLPS 510 560 560 560 610 680 STOP 510 560 560 560 610 680 ICMP CMP peripheral adder measured by placing the device in VLLS1 mode with CMP enabled using the 6-bit DAC and a single external input for compare. Includes 6-bit DAC power consumption. 22 22 22 22 22 22 A IRTC RTC peripheral adder measured by placing the device in VLLS1 mode with external 32 kHz crystal enabled by means of the RTC_CR[OSCE] bit and the RTC ALARM set for 1 minute. Includes ERCLK32K (32 kHz external crystal) power consumption. 432 357 388 475 532 810 nA IUART UART peripheral adder measured by placing the device in STOP or VLPS mode with selected clock source waiting for RX data at 115200 baud rate. Includes selected clock source power consumption. MCGIRCLK (4 MHz internal reference clock) 66 66 66 66 66 66 A OSCERCLK (4 MHz external crystal) 214 237 246 254 260 268 MCGIRCLK (4 MHz internal reference clock) 86 86 86 86 86 86 OSCERCLK (4 MHz external crystal) 235 256 265 274 280 287 ITPM TPM peripheral adder measured by placing the device in STOP or VLPS mode with selected clock source configured for output compare generating 100 Hz clock signal. No load is placed on the I/O generating the clock signal. Includes selected clock source and I/O switching currents. A Table continues on the next page... 12 Freescale Semiconductor, Inc. Kinetis KL26 Sub-Family, Rev5 08/2014. General Table 10. Low power mode peripheral adders -- typical value (continued) Symbol Description Temperature (C) Unit -40 25 50 70 85 105 IBG Bandgap adder when BGEN bit is set and device is placed in VLPx, LLS, or VLLSx mode. 45 45 45 45 45 45 A IADC ADC peripheral adder combining the measured values at VDD and VDDA by placing the device in STOP or VLPS mode. ADC is configured for low power mode using the internal clock and continuous conversions. 366 366 366 366 366 366 A 2.2.5.1 Diagram: Typical IDD_RUN operating behavior The following data was measured under these conditions: * * * * * MCG in FBE for run mode, and BLPE for VLPR mode USB regulator disabled No GPIOs toggled Code execution from flash with cache enabled For the ALLOFF curve, all peripheral clocks are disabled except FTFA Kinetis KL26 Sub-Family, Rev5 08/2014. 13 Freescale Semiconductor, Inc. General Run Mode Current Vs Core Frequency Temperature = 25, VDD = 3, CACHE = Enable, Code Residence = Flash, Clocking Mode = FBE 8.00E-03 7.00E-03 Current Consumption on VDD(A) 6.00E-03 5.00E-03 All Peripheral CLK Gates 4.00E-03 All Off All On 3.00E-03 2.00E-03 1.00E-03 000.00E+00 '1-1 '1-1 '1-1 '1-1 '1-1 '1-1 '1-1 '1-2 1 2 3 4 6 12 24 48 CLK Ratio Flash-Core Core Freq (MHz) Figure 3. Run mode supply current vs. core frequency 14 Freescale Semiconductor, Inc. Kinetis KL26 Sub-Family, Rev5 08/2014. General VLPR Mode Current Vs Core Frequency Temperature = 25, VDD = 3, CACHE = Enable, Code Residence = Flash, Clocking Mode = BLPE 350.00E-06 Current Consumption on VDD (A) 300.00E-06 250.00E-06 All Peripheral CLK Gates 200.00E-06 All Off All On 150.00E-06 100.00E-06 50.00E-06 000.00E+00 '1-1 '1-2 1 '1-2 '1-4 2 4 CLK Ratio Flash-Core Core Freq (MHz) Figure 4. VLPR mode current vs. core frequency 2.2.6 EMC radiated emissions operating behaviors Table 11. EMC radiated emissions operating behaviors Symbol Description Frequency band (MHz) Typ. Unit Notes 1,2 VRE1 Radiated emissions voltage, band 1 0.15-50 12 dBV VRE2 Radiated emissions voltage, band 2 50-150 8 dBV VRE3 Radiated emissions voltage, band 3 150-500 7 dBV VRE4 Radiated emissions voltage, band 4 500-1000 4 dBV IEC level 0.15-1000 M -- VRE_IEC 2,3 1. Determined according to IEC Standard 61967-1, Integrated Circuits - Measurement of Electromagnetic Emissions, 150 kHz to 1 GHz Part 1: General Conditions and Definitions and IEC Standard 61967-2, Integrated Circuits Measurement of Electromagnetic Emissions, 150 kHz to 1 GHz Part 2: Measurement of Radiated Emissions--TEM Cell and Wideband TEM Cell Method. Measurements were made while the microcontroller was running basic application code. The reported emission level is the value of the maximum measured emission, rounded up to the next whole number, from among the measured orientations in each frequency range. 2. VDD = 3.3 V, TA = 25 C, fOSC = 8 MHz (crystal), fSYS = 48 MHz, fBUS = 24 MHz 3. Specified according to Annex D of IEC Standard 61967-2, Measurement of Radiated Emissions--TEM Cell and Wideband TEM Cell Method Kinetis KL26 Sub-Family, Rev5 08/2014. 15 Freescale Semiconductor, Inc. General 2.2.7 Designing with radiated emissions in mind To find application notes that provide guidance on designing your system to minimize interference from radiated emissions: 1. Go to www.freescale.com. 2. Perform a keyword search for "EMC design." 2.2.8 Capacitance attributes Table 12. Capacitance attributes Symbol CIN Description Input capacitance Min. Max. Unit -- 7 pF Min. Max. Unit 2.3 Switching specifications 2.3.1 Device clock specifications Table 13. Device clock specifications Symbol Description Normal run mode fSYS System and core clock -- 48 MHz fBUS Bus clock -- 24 MHz Flash clock -- 24 MHz System and core clock when Full Speed USB in operation 20 -- MHz LPTMR clock -- 24 MHz fFLASH fSYS_USB fLPTMR VLPR and VLPS modes1 fSYS System and core clock -- 4 MHz fBUS Bus clock -- 1 MHz Flash clock -- 1 MHz -- 24 MHz -- 16 MHz -- 16 MHz Oscillator crystal or resonator frequency -- high frequency mode (high range) (MCG_C2[RANGE]=1x) -- 16 MHz TPM asynchronous clock -- 8 MHz UART0 asynchronous clock -- 8 MHz fFLASH clock2 fLPTMR LPTMR fERCLK External reference clock fLPTMR_ERCLK LPTMR external reference clock fosc_hi_2 fTPM fUART0 16 Freescale Semiconductor, Inc. Kinetis KL26 Sub-Family, Rev5 08/2014. General 1. The frequency limitations in VLPR and VLPS modes here override any frequency specification listed in the timing specification for any other module. These same frequency limits apply to VLPS, whether VLPS was entered from RUN or from VLPR. 2. The LPTMR can be clocked at this speed in VLPR or VLPS only when the source is an external pin. 2.3.2 General switching specifications These general-purpose specifications apply to all signals configured for GPIO and UART signals. Table 14. General switching specifications Description Min. Max. Unit Notes GPIO pin interrupt pulse width (digital glitch filter disabled) -- Synchronous path 1.5 -- Bus clock cycles 1 External RESET and NMI pin interrupt pulse width -- Asynchronous path 100 -- ns 2 GPIO pin interrupt pulse width -- Asynchronous path 16 -- ns 2 Port rise and fall time -- 36 ns 3 1. The greater synchronous and asynchronous timing must be met. 2. This is the shortest pulse that is guaranteed to be recognized. 3. 75 pF load 2.4 Thermal specifications 2.4.1 Thermal operating requirements Table 15. Thermal operating requirements Symbol Description Min. Max. Unit TJ Die junction temperature -40 125 C TA Ambient temperature -40 105 C Kinetis KL26 Sub-Family, Rev5 08/2014. 17 Freescale Semiconductor, Inc. Peripheral operating requirements and behaviors 2.4.2 Thermal attributes Table 16. Thermal attributes Board type Symbol Single-layer (1S) RJA Four-layer (2s2p) Description 121 MAPBG A 100 LQFP 64 LQFP 64 MAPBG A Unit Notes Thermal resistance, junction to ambient (natural convection) 94 64 69 49.8 C/W 1 RJA Thermal resistance, junction to ambient (natural convection) 57 51 51 42.3 C/W Single-layer (1S) RJMA Thermal resistance, junction to ambient (200 ft./min. air speed) 81 54 58 40.9 C/W Four-layer (2s2p) RJMA Thermal resistance, junction to ambient (200 ft./min. air speed) 53 45 44 37.7 C/W -- RJB Thermal resistance, junction to board 40 37 33 39.2 C/W 2 -- RJC Thermal resistance, junction to case 30 19 19 50.3 C/W 3 -- JT Thermal characterization parameter, junction to package top outside center (natural convection) 8 4 4 2.2 C/W 4 1. Determined according to JEDEC Standard JESD51-2, Integrated Circuits Thermal Test Method Environmental Conditions--Natural Convection (Still Air), or EIA/JEDEC Standard JESD51-6, Integrated Circuit Thermal Test Method Environmental Conditions--Forced Convection (Moving Air). 2. Determined according to JEDEC Standard JESD51-8, Integrated Circuit Thermal Test Method Environmental Conditions--Junction-to-Board. 3. Determined according to Method 1012.1 of MIL-STD 883, Test Method Standard, Microcircuits, with the cold plate temperature used for the case temperature. The value includes the thermal resistance of the interface material between the top of the package and the cold plate. 4. Determined according to JEDEC Standard JESD51-2, Integrated Circuits Thermal Test Method Environmental Conditions--Natural Convection (Still Air). 3 Peripheral operating requirements and behaviors 3.1 Core modules 18 Freescale Semiconductor, Inc. Kinetis KL26 Sub-Family, Rev5 08/2014. Peripheral operating requirements and behaviors 3.1.1 SWD electricals Table 17. SWD full voltage range electricals Symbol J1 Description Min. Max. Unit Operating voltage 1.71 3.6 V 0 25 MHz 1/J1 -- ns 20 -- ns SWD_CLK frequency of operation * Serial wire debug J2 SWD_CLK cycle period J3 SWD_CLK clock pulse width * Serial wire debug J4 SWD_CLK rise and fall times -- 3 ns J9 SWD_DIO input data setup time to SWD_CLK rise 10 -- ns J10 SWD_DIO input data hold time after SWD_CLK rise 0 -- ns J11 SWD_CLK high to SWD_DIO data valid -- 32 ns J12 SWD_CLK high to SWD_DIO high-Z 5 -- ns J2 J3 J3 SWD_CLK (input) J4 J4 Figure 5. Serial wire clock input timing Kinetis KL26 Sub-Family, Rev5 08/2014. 19 Freescale Semiconductor, Inc. Peripheral operating requirements and behaviors SWD_CLK J9 SWD_DIO J10 Input data valid J11 SWD_DIO Output data valid J12 SWD_DIO J11 SWD_DIO Output data valid Figure 6. Serial wire data timing 3.2 System modules There are no specifications necessary for the device's system modules. 3.3 Clock modules 3.3.1 MCG specifications Table 18. MCG specifications Symbol Description Min. Typ. Max. Unit fints_ft Internal reference frequency (slow clock) -- factory trimmed at nominal VDD and 25 C -- 32.768 -- kHz fints_t Internal reference frequency (slow clock) -- user trimmed 31.25 -- 39.0625 kHz -- 0.3 0.6 %fdco fdco_res_t Resolution of trimmed average DCO output frequency at fixed voltage and temperature -- using C3[SCTRIM] and C4[SCFTRIM] Notes 1 Table continues on the next page... 20 Freescale Semiconductor, Inc. Kinetis KL26 Sub-Family, Rev5 08/2014. Peripheral operating requirements and behaviors Table 18. MCG specifications (continued) Symbol Description Min. Typ. Max. Unit Notes fdco_t Total deviation of trimmed average DCO output frequency over voltage and temperature -- +0.5/-0.7 3 %fdco 1, 2 fdco_t Total deviation of trimmed average DCO output frequency over fixed voltage and temperature range of 0-70 C -- 0.4 1.5 %fdco 1, 2 Internal reference frequency (fast clock) -- factory trimmed at nominal VDD and 25 C -- 4 -- MHz fintf_ft Frequency deviation of internal reference clock (fast clock) over temperature and voltage -- factory trimmed at nominal VDD and 25 C -- +1/-2 3 %fintf_ft fintf_t Internal reference frequency (fast clock) -- user trimmed at nominal VDD and 25 C 3 -- 5 MHz fintf_ft 2 floc_low Loss of external clock minimum frequency -- RANGE = 00 (3/5) x fints_t -- -- kHz floc_high Loss of external clock minimum frequency -- (16/5) x fints_t -- -- kHz 31.25 -- 39.0625 kHz 20 20.97 25 MHz 40 41.94 48 MHz -- 23.99 -- MHz -- 47.97 -- MHz -- 180 -- ps 7 -- -- 1 ms 8 48.0 -- 100 MHz -- 1060 -- A -- 600 -- A 2.0 -- 4.0 MHz FLL ffll_ref fdco FLL reference frequency range DCO output frequency range Low range (DRS = 00) 3, 4 640 x ffll_ref Mid range (DRS = 01) 1280 x ffll_ref fdco_t_DMX3 DCO output frequency 2 Low range (DRS = 00) 5, 6 732 x ffll_ref Mid range (DRS = 01) 1464 x ffll_ref Jcyc_fll FLL period jitter * fVCO = 48 MHz tfll_acquire FLL target frequency acquisition time PLL fvco VCO operating frequency Ipll PLL operating current * PLL at 96 MHz (fosc_hi_1 = 8 MHz, fpll_ref = 2 MHz, VDIV multiplier = 48) Ipll PLL operating current * PLL at 48 MHz (fosc_hi_1 = 8 MHz, fpll_ref = 2 MHz, VDIV multiplier = 24) fpll_ref PLL reference frequency range Jcyc_pll PLL period jitter (RMS) 9 9 10 * fvco = 48 MHz -- * fvco = 100 MHz -- 120 -- ps -- ps Table continues on the next page... Kinetis KL26 Sub-Family, Rev5 08/2014. 21 Freescale Semiconductor, Inc. Peripheral operating requirements and behaviors Table 18. MCG specifications (continued) Symbol Description Min. Jacc_pll PLL accumulated jitter over 1s (RMS) Typ. Max. Unit 10 * fvco = 48 MHz -- 1350 -- ps * fvco = 100 MHz -- 600 -- ps Dlock Lock entry frequency tolerance 1.49 -- 2.98 % Dunl Lock exit frequency tolerance 4.47 -- 5.97 % tpll_lock Lock detector detection time Notes -- -- 10-6 150 x + 1075(1/ fpll_ref) s 11 1. This parameter is measured with the internal reference (slow clock) being used as a reference to the FLL (FEI clock mode). 2. The deviation is relative to the factory trimmed frequency at nominal VDD and 25 C, fints_ft. 3. These typical values listed are with the slow internal reference clock (FEI) using factory trim and DMX32 = 0. 4. The resulting system clock frequencies must not exceed their maximum specified values. The DCO frequency deviation (fdco_t) over voltage and temperature must be considered. 5. These typical values listed are with the slow internal reference clock (FEI) using factory trim and DMX32 = 1. 6. The resulting clock frequency must not exceed the maximum specified clock frequency of the device. 7. This specification is based on standard deviation (RMS) of period or frequency. 8. This specification applies to any time the FLL reference source or reference divider is changed, trim value is changed, DMX32 bit is changed, DRS bits are changed, or changing from FLL disabled (BLPE, BLPI) to FLL enabled (FEI, FEE, FBE, FBI). If a crystal/resonator is being used as the reference, this specification assumes it is already running. 9. Excludes any oscillator currents that are also consuming power while PLL is in operation. 10. This specification was obtained using a Freescale developed PCB. PLL jitter is dependent on the noise characteristics of each PCB and results will vary. 11. This specification applies to any time the PLL VCO divider or reference divider is changed, or changing from PLL disabled (BLPE, BLPI) to PLL enabled (PBE, PEE). If a crystal/resonator is being used as the reference, this specification assumes it is already running. 3.3.2 Oscillator electrical specifications 3.3.2.1 Oscillator DC electrical specifications Table 19. Oscillator DC electrical specifications Symbol Description Min. Typ. Max. Unit VDD Supply voltage 1.71 -- 3.6 V IDDOSC Supply current -- low-power mode (HGO=0) Notes 1 * 32 kHz -- 500 -- nA * 4 MHz -- 200 -- A * 8 MHz (RANGE=01) -- 300 -- A * 16 MHz -- 950 -- A -- 1.2 -- mA Table continues on the next page... 22 Freescale Semiconductor, Inc. Kinetis KL26 Sub-Family, Rev5 08/2014. Peripheral operating requirements and behaviors Table 19. Oscillator DC electrical specifications (continued) Symbol Description * 24 MHz Min. Typ. Max. Unit -- 1.5 -- mA Notes * 32 MHz IDDOSC Supply current -- high gain mode (HGO=1) 1 * 32 kHz -- 25 -- A * 4 MHz -- 400 -- A * 8 MHz (RANGE=01) -- 500 -- A * 16 MHz -- 2.5 -- mA * 24 MHz -- 3 -- mA * 32 MHz -- 4 -- mA Cx EXTAL load capacitance -- -- -- Cy XTAL load capacitance -- -- -- RF Feedback resistor -- low-frequency, low-power mode (HGO=0) -- -- -- M Feedback resistor -- low-frequency, high-gain mode (HGO=1) -- 10 -- M Feedback resistor -- high-frequency, low-power mode (HGO=0) -- -- -- M Feedback resistor -- high-frequency, high-gain mode (HGO=1) -- 1 -- M Series resistor -- low-frequency, low-power mode (HGO=0) -- -- -- k Series resistor -- low-frequency, high-gain mode (HGO=1) -- 200 -- k Series resistor -- high-frequency, low-power mode (HGO=0) -- -- -- k -- 0 -- k Peak-to-peak amplitude of oscillation (oscillator mode) -- low-frequency, low-power mode (HGO=0) -- 0.6 -- V Peak-to-peak amplitude of oscillation (oscillator mode) -- low-frequency, high-gain mode (HGO=1) -- VDD -- V Peak-to-peak amplitude of oscillation (oscillator mode) -- high-frequency, low-power mode (HGO=0) -- 0.6 -- V Peak-to-peak amplitude of oscillation (oscillator mode) -- high-frequency, high-gain mode (HGO=1) -- VDD -- V RS 2, 3 2, 3 2, 4 Series resistor -- high-frequency, high-gain mode (HGO=1) 5 Vpp 1. VDD=3.3 V, Temperature =25 C 2. See crystal or resonator manufacturer's recommendation Kinetis KL26 Sub-Family, Rev5 08/2014. 23 Freescale Semiconductor, Inc. Peripheral operating requirements and behaviors 3. Cx,Cy can be provided by using the integrated capacitors when the low frequency oscillator (RANGE = 00) is used. For all other cases external capacitors must be used. 4. When low power mode is selected, RF is integrated and must not be attached externally. 5. The EXTAL and XTAL pins should only be connected to required oscillator components and must not be connected to any other devices. 3.3.2.2 Symbol Oscillator frequency specifications Table 20. Oscillator frequency specifications Description Min. Typ. Max. Unit fosc_lo Oscillator crystal or resonator frequency -- lowfrequency mode (MCG_C2[RANGE]=00) 32 -- 40 kHz fosc_hi_1 Oscillator crystal or resonator frequency -- highfrequency mode (low range) (MCG_C2[RANGE]=01) 3 -- 8 MHz fosc_hi_2 Oscillator crystal or resonator frequency -- high frequency mode (high range) (MCG_C2[RANGE]=1x) 8 -- 32 MHz fec_extal Input clock frequency (external clock mode) -- -- 48 MHz tdc_extal Input clock duty cycle (external clock mode) 40 50 60 % Crystal startup time -- 32 kHz low-frequency, low-power mode (HGO=0) -- 750 -- ms Crystal startup time -- 32 kHz low-frequency, high-gain mode (HGO=1) -- 250 -- ms Crystal startup time -- 8 MHz high-frequency (MCG_C2[RANGE]=01), low-power mode (HGO=0) -- 0.6 -- ms Crystal startup time -- 8 MHz high-frequency (MCG_C2[RANGE]=01), high-gain mode (HGO=1) -- 1 -- ms tcst Notes 1, 2 3, 4 1. Other frequency limits may apply when external clock is being used as a reference for the FLL or PLL. 2. When transitioning from FEI or FBI to FBE mode, restrict the frequency of the input clock so that, when it is divided by FRDIV, it remains within the limits of the DCO input clock frequency. 3. Proper PC board layout procedures must be followed to achieve specifications. 4. Crystal startup time is defined as the time between the oscillator being enabled and the OSCINIT bit in the MCG_S register being set. 3.4 Memories and memory interfaces 3.4.1 Flash electrical specifications This section describes the electrical characteristics of the flash memory module. 24 Freescale Semiconductor, Inc. Kinetis KL26 Sub-Family, Rev5 08/2014. Peripheral operating requirements and behaviors 3.4.1.1 Flash timing specifications -- program and erase The following specifications represent the amount of time the internal charge pumps are active and do not include command overhead. Table 21. NVM program/erase timing specifications Symbol Description Min. Typ. Max. Unit Notes thvpgm4 Longword Program high-voltage time -- 7.5 18 s -- thversscr Sector Erase high-voltage time -- 13 113 ms 1 -- 52 452 ms 1 -- 52 452 ms 1 Unit Notes thversblk128k Erase Block high-voltage time for 128 KB thversall Erase All high-voltage time 1. Maximum time based on expectations at cycling end-of-life. 3.4.1.2 Symbol Flash timing specifications -- commands Table 22. Flash command timing specifications Description Min. Typ. Max. Read 1s Block execution time trd1blk128k * 128 KB program flash -- -- -- 1.7 ms trd1sec1k Read 1s Section execution time (flash sector) -- -- 60 s 1 tpgmchk Program Check execution time -- -- 45 s 1 trdrsrc Read Resource execution time -- -- 30 s 1 tpgm4 Program Longword execution time -- 65 145 s -- Erase Flash Block execution time tersblk128k * 128 KB program flash 2 -- 88 600 ms tersscr Erase Flash Sector execution time -- 14 114 ms 2 trd1all Read 1s All Blocks execution time -- -- 1.8 ms -- trdonce Read Once execution time -- -- 25 s 1 Program Once execution time -- 65 -- s -- tersall Erase All Blocks execution time -- 175 1300 ms 2 tvfykey Verify Backdoor Access Key execution time -- -- 30 s 1 tpgmonce 1. Assumes 25 MHz flash clock frequency. 2. Maximum times for erase parameters based on expectations at cycling end-of-life. Kinetis KL26 Sub-Family, Rev5 08/2014. 25 Freescale Semiconductor, Inc. Peripheral operating requirements and behaviors 3.4.1.3 Flash high voltage current behaviors Table 23. Flash high voltage current behaviors Symbol Description IDD_PGM IDD_ERS 3.4.1.4 Symbol Min. Typ. Max. Unit Average current adder during high voltage flash programming operation -- 2.5 6.0 mA Average current adder during high voltage flash erase operation -- 1.5 4.0 mA Reliability specifications Table 24. NVM reliability specifications Description Min. Typ.1 Max. Unit Notes Program Flash tnvmretp10k Data retention after up to 10 K cycles 5 50 -- years -- tnvmretp1k Data retention after up to 1 K cycles 20 100 -- years -- nnvmcycp Cycling endurance 10 K 50 K -- cycles 2 1. Typical data retention values are based on measured response accelerated at high temperature and derated to a constant 25 C use profile. Engineering Bulletin EB618 does not apply to this technology. Typical endurance defined in Engineering Bulletin EB619. 2. Cycling endurance represents number of program/erase cycles at -40 C Tj 125 C. 3.5 Security and integrity modules There are no specifications necessary for the device's security and integrity modules. 3.6 Analog 3.6.1 ADC electrical specifications The 16-bit accuracy specifications listed in Table 25 and Table 26 are achievable on the differential pins ADCx_DP0, ADCx_DM0. All other ADC channels meet the 13-bit differential/12-bit single-ended accuracy specifications. 26 Freescale Semiconductor, Inc. Kinetis KL26 Sub-Family, Rev5 08/2014. Peripheral operating requirements and behaviors 3.6.1.1 16-bit ADC operating conditions Table 25. 16-bit ADC operating conditions Symbol Description Conditions Min. Typ.1 Max. Unit Notes VDDA Supply voltage Absolute 1.71 -- 3.6 V -- VDDA Supply voltage Delta to VDD (VDD - VDDA) -100 0 +100 mV 2 VSSA Ground voltage Delta to VSS (VSS - VSSA) -100 0 +100 mV 2 VREFH ADC reference voltage high 1.13 VDDA VDDA V VREFL ADC reference voltage low VSSA VSSA VSSA V VADIN Input voltage * 16-bit differential mode VREFL -- 31/32 * VREFH V -- * All other modes VREFL -- * 16-bit mode -- 8 10 pF -- * 8-bit / 10-bit / 12-bit modes -- 4 5 -- 2 5 k -- CADIN RADIN RAS Input capacitance Input series resistance Analog source resistance (external) VREFH 13-bit / 12-bit modes 3 fADCK < 4 MHz -- -- 5 k fADCK ADC conversion 13-bit mode clock frequency 1.0 -- 18.0 MHz 4 fADCK ADC conversion 16-bit mode clock frequency 2.0 -- 12.0 MHz 4 Crate ADC conversion 13-bit modes rate No ADC hardware averaging 5 20.000 -- 818.330 Ksps Continuous conversions enabled, subsequent conversion time Crate ADC conversion 16-bit mode rate No ADC hardware averaging 5 37.037 -- 461.467 Ksps Continuous conversions enabled, subsequent conversion time 1. Typical values assume VDDA = 3.0 V, Temp = 25 C, fADCK = 1.0 MHz, unless otherwise stated. Typical values are for reference only, and are not tested in production. 2. DC potential difference. 3. This resistance is external to MCU. To achieve the best results, the analog source resistance must be kept as low as possible. The results in this data sheet were derived from a system that had < 8 analog source resistance. The RAS/CAS time constant should be kept to < 1 ns. 4. To use the maximum ADC conversion clock frequency, CFG2[ADHSC] must be set and CFG1[ADLPC] must be clear. 5. For guidelines and examples of conversion rate calculation, download the ADC calculator tool. Kinetis KL26 Sub-Family, Rev5 08/2014. 27 Freescale Semiconductor, Inc. Peripheral operating requirements and behaviors SIMPLIFIED INPUT PIN EQUIVALENT CIRCUIT ZADIN SIMPLIFIED CHANNEL SELECT CIRCUIT Pad leakage due to input protection ZAS RAS ADC SAR ENGINE RADIN VADIN CAS VAS RADIN INPUT PIN RADIN INPUT PIN RADIN INPUT PIN CADIN Figure 7. ADC input impedance equivalency diagram 3.6.1.2 16-bit ADC electrical characteristics Table 26. 16-bit ADC characteristics (VREFH = VDDA, VREFL = VSSA) Symbol Description IDDA_ADC Supply current ADC asynchronous clock source fADACK Conditions1 * ADLPC = 1, ADHSC = 0 * ADLPC = 1, ADHSC = 1 * ADLPC = 0, ADHSC = 0 Min. Typ.2 Max. Unit Notes 0.215 -- 1.7 mA 3 1.2 2.4 3.9 MHz 2.4 4.0 6.1 MHz tADACK = 1/fADACK 3.0 5.2 7.3 MHz 4.4 6.2 9.5 MHz LSB4 5 LSB4 5 * ADLPC = 0, ADHSC = 1 Sample Time TUE DNL See Reference Manual chapter for sample times Total unadjusted error * 12-bit modes -- 4 6.8 * <12-bit modes -- 1.4 2.1 Differential nonlinearity * 12-bit modes -- 0.7 -1.1 to +1.9 * <12-bit modes -- 0.2 -0.3 to 0.5 Table continues on the next page... 28 Freescale Semiconductor, Inc. Kinetis KL26 Sub-Family, Rev5 08/2014. Peripheral operating requirements and behaviors Table 26. 16-bit ADC characteristics (VREFH = VDDA, VREFL = VSSA) (continued) Symbol INL Description Integral nonlinearity EFS Full-scale error EQ Quantization error ENOB Conditions1 Min. Typ.2 Max. Unit Notes -2.7 to +1.9 LSB4 5 LSB4 VADIN = VDDA5 * 12-bit modes -- 1.0 * <12-bit modes -- 0.5 * 12-bit modes -- -4 -5.4 * <12-bit modes -- -1.4 -1.8 * 16-bit modes -- -1 to 0 -- * 13-bit modes -- -- 0.5 12.8 14.5 -- bits 11.9 13.8 -- bits 12.2 13.9 -- bits 11.4 13.1 -- bits Effective number 16-bit differential mode of bits * Avg = 32 -0.7 to +0.5 LSB4 6 * Avg = 4 16-bit single-ended mode * Avg = 32 * Avg = 4 SINAD THD Signal-to-noise plus distortion See ENOB Total harmonic distortion 16-bit differential mode 6.02 x ENOB + 1.76 dB -- -94 -- dB -- -85 -- dB 82 95 -- dB 78 90 -- dB 7 * Avg = 32 16-bit single-ended mode * Avg = 32 SFDR Spurious free dynamic range 16-bit differential mode 7 * Avg = 32 16-bit single-ended mode * Avg = 32 EIL Input leakage error IIn x RAS mV IIn = leakage current (refer to the MCU's voltage and current operating ratings) VTEMP25 Temp sensor slope Across the full temperature range of the device 1.55 1.62 1.69 mV/C 8 Temp sensor voltage 25 C 706 716 726 mV 8 Kinetis KL26 Sub-Family, Rev5 08/2014. 29 Freescale Semiconductor, Inc. Peripheral operating requirements and behaviors 1. All accuracy numbers assume the ADC is calibrated with VREFH = VDDA 2. Typical values assume VDDA = 3.0 V, Temp = 25 C, fADCK = 2.0 MHz unless otherwise stated. Typical values are for reference only and are not tested in production. 3. The ADC supply current depends on the ADC conversion clock speed, conversion rate and ADC_CFG1[ADLPC] (low power). For lowest power operation, ADC_CFG1[ADLPC] must be set, the ADC_CFG2[ADHSC] bit must be clear with 1 MHz ADC conversion clock speed. 4. 1 LSB = (VREFH - VREFL)/2N 5. ADC conversion clock < 16 MHz, Max hardware averaging (AVGE = %1, AVGS = %11) 6. Input data is 100 Hz sine wave. ADC conversion clock < 12 MHz. 7. Input data is 1 kHz sine wave. ADC conversion clock < 12 MHz. 8. ADC conversion clock < 3 MHz Typical ADC 16-bit Differential ENOB vs ADC Clock 100Hz, 90% FS Sine Input 15.00 14.70 14.40 14.10 ENOB 13.80 13.50 13.20 12.90 12.60 Hardware Averaging Disabled Averaging of 4 samples Averaging of 8 samples Averaging of 32 samples 12.30 12.00 1 2 3 4 5 6 7 8 9 10 11 12 ADC Clock Frequency (MHz) Figure 8. Typical ENOB vs. ADC_CLK for 16-bit differential mode Typical ADC 16-bit Single-Ended ENOB vs ADC Clock 100Hz, 90% FS Sine Input 14.00 13.75 13.50 13.25 13.00 ENOB 12.75 12.50 12.25 12.00 11.75 11.50 11.25 11.00 Averaging of 4 samples Averaging of 32 samples 1 2 3 4 5 6 7 8 9 10 11 12 ADC Clock Frequency (MHz) Figure 9. Typical ENOB vs. ADC_CLK for 16-bit single-ended mode 30 Freescale Semiconductor, Inc. Kinetis KL26 Sub-Family, Rev5 08/2014. Peripheral operating requirements and behaviors 3.6.2 CMP and 6-bit DAC electrical specifications Table 27. Comparator and 6-bit DAC electrical specifications Symbol Description Min. Typ. Max. Unit VDD Supply voltage 1.71 -- 3.6 V IDDHS Supply current, High-speed mode (EN=1, PMODE=1) -- -- 200 A IDDLS Supply current, low-speed mode (EN=1, PMODE=0) -- -- 20 A VAIN Analog input voltage VSS - 0.3 -- VDD V VAIO Analog input offset voltage -- -- 20 mV * CR0[HYSTCTR] = 00 -- 5 -- mV * CR0[HYSTCTR] = 01 -- 10 -- mV * CR0[HYSTCTR] = 10 -- 20 -- mV * CR0[HYSTCTR] = 11 -- 30 -- mV VH Analog comparator hysteresis1 VCMPOh Output high VDD - 0.5 -- -- V VCMPOl Output low -- -- 0.5 V tDHS Propagation delay, high-speed mode (EN=1, PMODE=1) 20 50 200 ns tDLS Propagation delay, low-speed mode (EN=1, PMODE=0) 80 250 600 ns Analog comparator initialization delay2 -- -- 40 s 6-bit DAC current adder (enabled) -- 7 -- A IDAC6b INL 6-bit DAC integral non-linearity -0.5 -- 0.5 LSB3 DNL 6-bit DAC differential non-linearity -0.3 -- 0.3 LSB 1. Typical hysteresis is measured with input voltage range limited to 0.6 to VDD-0.6 V. 2. Comparator initialization delay is defined as the time between software writes to change control inputs (Writes to CMP_DACCR[DACEN], CMP_DACCR[VRSEL], CMP_DACCR[VOSEL], CMP_MUXCR[PSEL], and CMP_MUXCR[MSEL]) and the comparator output settling to a stable level. 3. 1 LSB = Vreference/64 Kinetis KL26 Sub-Family, Rev5 08/2014. 31 Freescale Semiconductor, Inc. Peripheral operating requirements and behaviors 0.08 0.07 CMP Hystereris (V) 0.06 HYSTCTR Setting 0.05 00 0.04 01 10 11 0.03 0.02 0.01 0 0.1 0.4 0.7 1 1.3 1.6 1.9 2.2 2.5 2.8 3.1 Vin level (V) Figure 10. Typical hysteresis vs. Vin level (VDD = 3.3 V, PMODE = 0) 32 Freescale Semiconductor, Inc. Kinetis KL26 Sub-Family, Rev5 08/2014. Peripheral operating requirements and behaviors 0.18 0.16 0.14 CMP Hysteresis (V) 0.12 HYSTCTR Setting 0.1 00 01 10 11 0.08 0.06 0.04 0.02 0 0.1 0.4 0.7 1 1.3 1.6 1.9 Vin level (V) 2.2 2.5 2.8 3.1 Figure 11. Typical hysteresis vs. Vin level (VDD = 3.3 V, PMODE = 1) 3.6.3 12-bit DAC electrical characteristics 3.6.3.1 Symbol 12-bit DAC operating requirements Table 28. 12-bit DAC operating requirements Desciption Min. Max. Unit VDDA Supply voltage 1.71 3.6 V VDACR Reference voltage 1.13 3.6 V 1 2 CL Output load capacitance -- 100 pF IL Output load current -- 1 mA Notes 1. The DAC reference can be selected to be VDDA or VREFH. 2. A small load capacitance (47 pF) can improve the bandwidth performance of the DAC. Kinetis KL26 Sub-Family, Rev5 08/2014. 33 Freescale Semiconductor, Inc. Peripheral operating requirements and behaviors 3.6.3.2 Symbol 12-bit DAC operating behaviors Table 29. 12-bit DAC operating behaviors Description IDDA_DACL Supply current -- low-power mode Min. Typ. Max. Unit -- -- 250 A -- -- 900 A Notes P IDDA_DACH Supply current -- high-speed mode P tDACLP Full-scale settling time (0x080 to 0xF7F) -- low-power mode -- 100 200 s 1 tDACHP Full-scale settling time (0x080 to 0xF7F) -- high-power mode -- 15 30 s 1 tCCDACLP Code-to-code settling time (0xBF8 to 0xC08) -- low-power mode and high-speed mode -- 0.7 1 s 1 Vdacoutl DAC output voltage range low -- highspeed mode, no load, DAC set to 0x000 -- -- 100 mV Vdacouth DAC output voltage range high -- highspeed mode, no load, DAC set to 0xFFF VDACR -100 -- VDACR mV INL Integral non-linearity error -- high speed mode -- -- 8 LSB 2 DNL Differential non-linearity error -- VDACR > 2 V -- -- 1 LSB 3 DNL Differential non-linearity error -- VDACR = VREF_OUT -- -- 1 LSB 4 -- 0.4 0.8 %FSR 5 Gain error -- 0.1 0.6 %FSR 5 Power supply rejection ratio, VDDA 2.4 V 60 -- 90 dB TCO Temperature coefficient offset voltage -- 3.7 -- V/C TGE Temperature coefficient gain error -- 0.000421 -- %FSR/C Rop Output resistance (load = 3 k) -- -- 250 SR Slew rate -80h F7Fh 80h VOFFSET Offset error EG PSRR BW 6 V/s * High power (SPHP) 1.2 1.7 -- * Low power (SPLP) 0.05 0.12 -- 3dB bandwidth kHz * High power (SPHP) 550 -- -- * Low power (SPLP) 40 -- -- 1. 2. 3. 4. 5. 6. Settling within 1 LSB The INL is measured for 0 + 100 mV to VDACR -100 mV The DNL is measured for 0 + 100 mV to VDACR -100 mV The DNL is measured for 0 + 100 mV to VDACR -100 mV with VDDA > 2.4 V Calculated by a best fit curve from VSS + 100 mV to VDACR - 100 mV VDDA = 3.0 V, reference select set for VDDA (DACx_CO:DACRFS = 1), high power mode (DACx_C0:LPEN = 0), DAC set to 0x800, temperature range is across the full range of the device 34 Kinetis KL26 Sub-Family, Rev5 08/2014. Freescale Semiconductor, Inc. Peripheral operating requirements and behaviors 8 6 4 DAC12 INL (LSB) 2 0 -2 -4 -6 -8 0 500 1000 1500 2000 2500 3000 3500 4000 Digital Code Figure 12. Typical INL error vs. digital code Kinetis KL26 Sub-Family, Rev5 08/2014. 35 Freescale Semiconductor, Inc. Peripheral operating requirements and behaviors 1.499 DAC12 Mid Level Code Voltage 1.4985 1.498 1.4975 1.497 1.4965 1.496 55 25 -40 85 105 125 Temperature C Figure 13. Offset at half scale vs. temperature 3.7 Timers See General switching specifications. 3.8 Communication interfaces 3.8.1 USB electrical specifications The USB electricals for the USB On-the-Go module conform to the standards documented by the Universal Serial Bus Implementers Forum. For the most up-to-date standards, visit usb.org. 36 Freescale Semiconductor, Inc. Kinetis KL26 Sub-Family, Rev5 08/2014. Peripheral operating requirements and behaviors NOTE The MCGPLLCLK meets the USB jitter specifications for certification with the use of an external clock/crystal for both Device and Host modes. The MCGFLLCLK does not meet the USB jitter specifications for certification. 3.8.2 USB VREG electrical specifications Table 30. USB VREG electrical specifications Symbol Description Min. Typ.1 Max. Unit VREGIN Input supply voltage 2.7 -- 5.5 V IDDon Quiescent current -- Run mode, load current equal zero, input supply (VREGIN) > 3.6 V -- 125 186 A IDDstby Quiescent current -- Standby mode, load current equal zero -- 1.1 10 A IDDoff Quiescent current -- Shutdown mode -- 650 -- nA -- -- 4 A * VREGIN = 5.0 V and temperature=25 C * Across operating voltage and temperature ILOADrun Maximum load current -- Run mode -- -- 120 mA ILOADstby Maximum load current -- Standby mode -- -- 1 mA 3 3.3 3.6 V 2.1 2.8 3.6 V 2.1 -- 3.6 V 1.76 2.2 8.16 F Notes VReg33out Regulator output voltage -- Input supply (VREGIN) > 3.6 V * Run mode * Standby mode VReg33out Regulator output voltage -- Input supply (VREGIN) < 3.6 V, pass-through mode COUT External output capacitor ESR External output capacitor equivalent series resistance 1 -- 100 m ILIM Short circuit current -- 290 -- mA 2 1. Typical values assume VREGIN = 5.0 V, Temp = 25 C unless otherwise stated. 2. Operating in pass-through mode: regulator output voltage equal to the input voltage minus a drop proportional to ILoad. Kinetis KL26 Sub-Family, Rev5 08/2014. 37 Freescale Semiconductor, Inc. Peripheral operating requirements and behaviors 3.8.3 SPI switching specifications The Serial Peripheral Interface (SPI) provides a synchronous serial bus with master and slave operations. Many of the transfer attributes are programmable. The following tables provide timing characteristics for classic SPI timing modes. See the SPI chapter of the chip's Reference Manual for information about the modified transfer formats used for communicating with slower peripheral devices. All timing is shown with respect to 20% VDD and 80% VDD thresholds, unless noted, as well as input signal transitions of 3 ns and a 30 pF maximum load on all SPI pins. Table 31. SPI master mode timing on slew rate disabled pads Num. Symbol 1 fop 2 tSPSCK 3 tLead 4 tLag 5 tWSPSCK 6 tSU 7 Description Min. Max. Unit Note fperiph/2048 fperiph/2 Hz 1 2 x tperiph 2048 x tperiph ns 2 Enable lead time 1/2 -- tSPSCK -- Enable lag time 1/2 -- tSPSCK -- tperiph - 30 1024 x tperiph ns -- Data setup time (inputs) 18 -- ns -- tHI Data hold time (inputs) 0 -- ns -- 8 tv Data valid (after SPSCK edge) -- 15 ns -- 9 tHO Data hold time (outputs) 0 -- ns -- 10 tRI Rise time input -- tperiph - 25 ns -- tFI Fall time input 11 tRO Rise time output -- 25 ns -- tFO Fall time output Frequency of operation SPSCK period Clock (SPSCK) high or low time 1. For SPI0 fperiph is the bus clock (fBUS). For SPI1 fperiph is the system clock (fSYS). 2. tperiph = 1/fperiph Table 32. SPI master mode timing on slew rate enabled pads Num. Symbol 1 fop 2 tSPSCK 3 tLead 4 tLag 5 tWSPSCK 6 tSU 7 tHI Description Min. Max. Unit Note fperiph/2048 fperiph/2 Hz 1 2 x tperiph 2048 x tperiph ns 2 Enable lead time 1/2 -- tSPSCK -- Enable lag time 1/2 -- tSPSCK -- tperiph - 30 1024 x tperiph ns -- Data setup time (inputs) 96 -- ns -- Data hold time (inputs) 0 -- ns -- Frequency of operation SPSCK period Clock (SPSCK) high or low time Table continues on the next page... 38 Freescale Semiconductor, Inc. Kinetis KL26 Sub-Family, Rev5 08/2014. Peripheral operating requirements and behaviors Table 32. SPI master mode timing on slew rate enabled pads (continued) Num. Symbol 8 tv 9 Description Min. Max. Unit Note Data valid (after SPSCK edge) -- 52 ns -- tHO Data hold time (outputs) 0 -- ns -- 10 tRI Rise time input -- tperiph - 25 ns -- tFI Fall time input 11 tRO Rise time output -- 36 ns -- tFO Fall time output 1. For SPI0 fperiph is the bus clock (fBUS). For SPI1 fperiph is the system clock (fSYS). 2. tperiph = 1/fperiph SS1 (OUTPUT) 3 2 SPSCK (CPOL=0) (OUTPUT) 11 10 11 4 5 SPSCK (CPOL=1) (OUTPUT) 6 MISO (INPUT) 10 5 7 MSB IN2 BIT 6 . . . 1 LSB IN 8 MOSI (OUTPUT) MSB OUT2 BIT 6 . . . 1 9 LSB OUT 1. If configured as an output. 2. LSBF = 0. For LSBF = 1, bit order is LSB, bit 1, ..., bit 6, MSB. Figure 14. SPI master mode timing (CPHA = 0) Kinetis KL26 Sub-Family, Rev5 08/2014. 39 Freescale Semiconductor, Inc. Peripheral operating requirements and behaviors SS1 (OUTPUT) 2 3 SPSCK (CPOL=0) (OUTPUT) 5 SPSCK (CPOL=1) (OUTPUT) 5 6 MISO (INPUT) 11 4 10 11 7 MSB IN2 BIT 6 . . . 1 LSB IN 9 8 MOSI (OUTPUT) 10 PORT DATA MASTER MSB OUT2 BIT 6 . . . 1 PORT DATA MASTER LSB OUT 1.If configured as output 2. LSBF = 0. For LSBF = 1, bit order is LSB, bit 1, ..., bit 6, MSB. Figure 15. SPI master mode timing (CPHA = 1) Table 33. SPI slave mode timing on slew rate disabled pads Num. Symbol 1 fop 2 tSPSCK 3 tLead 4 tLag 5 tWSPSCK 6 tSU 7 Min. Max. Unit Note 0 fperiph/4 Hz 1 4 x tperiph -- ns 2 Enable lead time 1 -- tperiph -- Enable lag time 1 -- tperiph -- tperiph - 30 -- ns -- Data setup time (inputs) 2.5 -- ns -- tHI Data hold time (inputs) 3.5 -- ns -- 8 ta Slave access time -- tperiph ns 3 9 tdis Slave MISO disable time -- tperiph ns 4 10 tv Data valid (after SPSCK edge) -- 31 ns -- 11 tHO Data hold time (outputs) 0 -- ns -- 12 tRI Rise time input -- tperiph - 25 ns -- tFI Fall time input tRO Rise time output -- 25 ns -- tFO Fall time output 13 1. 2. 3. 4. Description Frequency of operation SPSCK period Clock (SPSCK) high or low time For SPI0 fperiph is the bus clock (fBUS). For SPI1 fperiph is the system clock (fSYS). tperiph = 1/fperiph Time to data active from high-impedance state Hold time to high-impedance state 38 40 Freescale Semiconductor, Inc. <<CLASSIFICATION>> <<NDA MESSAGE>> Kinetis KL26 Sub-Family, Rev5 08/2014. Peripheral operating requirements and behaviors Table 34. SPI slave mode timing on slew rate enabled pads Num. Symbol 1 fop 2 tSPSCK 3 tLead Enable lead time 4 tLag Enable lag time 5 tWSPSCK 6 tSU 7 Frequency of operation SPSCK period Min. Max. Unit Note 0 fperiph/4 Hz 1 4 x tperiph -- ns 2 1 -- tperiph -- 1 -- tperiph -- tperiph - 30 -- ns -- Data setup time (inputs) 2 -- ns -- tHI Data hold time (inputs) 7 -- ns -- 8 ta Slave access time -- tperiph ns 3 9 tdis Slave MISO disable time -- tperiph ns 4 10 tv Data valid (after SPSCK edge) -- 122 ns -- 11 tHO Data hold time (outputs) 0 -- ns -- 12 tRI Rise time input -- tperiph - 25 ns -- tFI Fall time input tRO Rise time output -- 36 ns -- tFO Fall time output 13 1. 2. 3. 4. Description Clock (SPSCK) high or low time For SPI0 fperiph is the bus clock (fBUS). For SPI1 fperiph is the system clock (fSYS). tperiph = 1/fperiph Time to data active from high-impedance state Hold time to high-impedance state SS (INPUT) 2 12 13 12 13 4 SPSCK (CPOL=0) (INPUT) 5 3 SPSCK (CPOL=1) (INPUT) 5 9 8 MISO (OUTPUT) see note SLAVE MSB 6 MOSI (INPUT) 10 11 11 BIT 6 . . . 1 SLAVE LSB OUT SEE NOTE 7 MSB IN BIT 6 . . . 1 LSB IN NOTE: Not defined Figure 16. SPI slave mode timing (CPHA = 0) Kinetis KL26 Sub-Family, Rev5 08/2014. 41 Freescale Semiconductor, Inc. Peripheral operating requirements and behaviors SS (INPUT) 4 2 3 SPSCK (CPOL=0) (INPUT) 5 SPSCK (CPOL=1) (INPUT) 5 see note SLAVE 8 MSB OUT 6 MOSI (INPUT) 13 12 13 11 10 MISO (OUTPUT) 12 9 BIT 6 . . . 1 SLAVE LSB OUT BIT 6 . . . 1 LSB IN 7 MSB IN NOTE: Not defined Figure 17. SPI slave mode timing (CPHA = 1) 3.8.4 Inter-Integrated Circuit Interface (I2C) timing Table 35. I2C timing Characteristic Symbol Standard Mode Fast Mode Minimum Maximum Minimum Maximum Unit SCL Clock Frequency fSCL 0 100 0 4001 kHz Hold time (repeated) START condition. After this period, the first clock pulse is generated. tHD; STA 4 -- 0.6 -- s LOW period of the SCL clock tLOW 4.7 -- 1.3 -- s HIGH period of the SCL clock tHIGH 4 -- 0.6 -- s Set-up time for a repeated START condition tSU; STA 4.7 -- 0.6 -- s Data hold time for I2C bus devices tHD; DAT 02 3.453 04 0.92 s tSU; DAT 2505 -- 1003, 6 Data set-up time -- ns 7 Rise time of SDA and SCL signals tr -- 1000 20 +0.1Cb 300 ns Fall time of SDA and SCL signals tf -- 300 20 +0.1Cb6 300 ns Set-up time for STOP condition tSU; STO 4 -- 0.6 -- s Bus free time between STOP and START condition tBUF 4.7 -- 1.3 -- s Pulse width of spikes that must be suppressed by the input filter tSP N/A N/A 0 50 ns 1. The maximum SCL Clock Frequency in Fast mode with maximum bus loading can only achieved when using the High drive pins (see Voltage and current operating behaviors) or when using the Normal drive pins and VDD 2.7 V 42 Freescale Semiconductor, Inc. Kinetis KL26 Sub-Family, Rev5 08/2014. Peripheral operating requirements and behaviors 2. The master mode I2C deasserts ACK of an address byte simultaneously with the falling edge of SCL. If no slaves acknowledge this address byte, then a negative hold time can result, depending on the edge rates of the SDA and SCL lines. 3. The maximum tHD; DAT must be met only if the device does not stretch the LOW period (tLOW) of the SCL signal. 4. Input signal Slew = 10 ns and Output Load = 50 pF 5. Set-up time in slave-transmitter mode is 1 IPBus clock period, if the TX FIFO is empty. 6. A Fast mode I2C bus device can be used in a Standard mode I2C bus system, but the requirement tSU; DAT 250 ns must then be met. This is automatically the case if the device does not stretch the LOW period of the SCL signal. If such a device does stretch the LOW period of the SCL signal, then it must output the next data bit to the SDA line trmax + tSU; DAT = 1000 + 250 = 1250 ns (according to the Standard mode I2C bus specification) before the SCL line is released. 7. Cb = total capacitance of the one bus line in pF. SDA tf tLOW tSU; DAT tr tf tHD; STA tSP tr tBUF SCL S HD; STA tHD; DAT tHIGH tSU; STA SR tSU; STO P S Figure 18. Timing definition for fast and standard mode devices on the I2C bus 3.8.5 UART See General switching specifications. 3.8.6 I2S/SAI switching specifications This section provides the AC timing for the I2S/SAI module in master mode (clocks are driven) and slave mode (clocks are input). All timing is given for noninverted serial clock polarity (TCR2[BCP] is 0, RCR2[BCP] is 0) and a noninverted frame sync (TCR4[FSP] is 0, RCR4[FSP] is 0). If the polarity of the clock and/or the frame sync have been inverted, all the timing remains valid by inverting the bit clock signal (BCLK) and/or the frame sync (FS) signal shown in the following figures. Kinetis KL26 Sub-Family, Rev5 08/2014. 43 Freescale Semiconductor, Inc. Peripheral operating requirements and behaviors 3.8.6.1 Normal Run, Wait and Stop mode performance over the full operating voltage range This section provides the operating performance over the full operating voltage for the device in Normal Run, Wait and Stop modes. Table 36. I2S/SAI master mode timing Num. Characteristic Min. Max. Unit Operating voltage 1.71 3.6 V S1 I2S_MCLK cycle time 40 -- ns S2 I2S_MCLK (as an input) pulse width high/low 45% 55% MCLK period S3 I2S_TX_BCLK/I2S_RX_BCLK cycle time (output) 80 -- ns S4 I2S_TX_BCLK/I2S_RX_BCLK pulse width high/low 45% 55% BCLK period S5 I2S_TX_BCLK/I2S_RX_BCLK to I2S_TX_FS/ I2S_RX_FS output valid -- 15.5 ns S6 I2S_TX_BCLK/I2S_RX_BCLK to I2S_TX_FS/ I2S_RX_FS output invalid 0 -- ns S7 I2S_TX_BCLK to I2S_TXD valid -- 19 ns S8 I2S_TX_BCLK to I2S_TXD invalid 0 -- ns S9 I2S_RXD/I2S_RX_FS input setup before I2S_RX_BCLK 26 -- ns S10 I2S_RXD/I2S_RX_FS input hold after I2S_RX_BCLK 0 -- ns S1 S2 S2 I2S_MCLK (output) S3 I2S_TX_BCLK/ I2S_RX_BCLK (output) S4 S4 S6 S5 I2S_TX_FS/ I2S_RX_FS (output) S10 S9 I2S_TX_FS/ I2S_RX_FS (input) S7 S8 S7 S8 I2S_TXD S9 S10 I2S_RXD Figure 19. I2S/SAI timing -- master modes 44 Freescale Semiconductor, Inc. Kinetis KL26 Sub-Family, Rev5 08/2014. Peripheral operating requirements and behaviors Table 37. I2S/SAI slave mode timing Num. Characteristic Min. Max. Unit Operating voltage 1.71 3.6 V S11 I2S_TX_BCLK/I2S_RX_BCLK cycle time (input) 80 -- ns S12 I2S_TX_BCLK/I2S_RX_BCLK pulse width high/low (input) 45% 55% MCLK period S13 I2S_TX_FS/I2S_RX_FS input setup before I2S_TX_BCLK/I2S_RX_BCLK 10 -- ns S14 I2S_TX_FS/I2S_RX_FS input hold after I2S_TX_BCLK/I2S_RX_BCLK 2 -- ns S15 I2S_TX_BCLK to I2S_TXD/I2S_TX_FS output valid -- 33 ns S16 I2S_TX_BCLK to I2S_TXD/I2S_TX_FS output invalid 0 -- ns S17 I2S_RXD setup before I2S_RX_BCLK 10 -- ns S18 I2S_RXD hold after I2S_RX_BCLK 2 -- ns -- 28 ns S19 I2S_TX_FS input assertion to I2S_TXD output valid1 1. Applies to first bit in each frame and only if the TCR4[FSE] bit is clear S11 S12 I2S_TX_BCLK/ I2S_RX_BCLK (input) S12 S15 S16 I2S_TX_FS/ I2S_RX_FS (output) S13 I2S_TX_FS/ I2S_RX_FS (input) S19 S14 S15 S16 S15 S16 I2S_TXD S17 S18 I2S_RXD Figure 20. I2S/SAI timing -- slave modes 3.8.6.2 VLPR, VLPW, and VLPS mode performance over the full operating voltage range This section provides the operating performance over the full operating voltage for the device in VLPR, VLPW, and VLPS modes. Kinetis KL26 Sub-Family, Rev5 08/2014. 45 Freescale Semiconductor, Inc. Peripheral operating requirements and behaviors Table 38. I2S/SAI master mode timing in VLPR, VLPW, and VLPS modes (full voltage range) Num. Characteristic Min. Max. Unit Operating voltage 1.71 3.6 V S1 I2S_MCLK cycle time 62.5 -- ns S2 I2S_MCLK pulse width high/low 45% 55% MCLK period S3 I2S_TX_BCLK/I2S_RX_BCLK cycle time (output) 250 -- ns S4 I2S_TX_BCLK/I2S_RX_BCLK pulse width high/low 45% 55% BCLK period S5 I2S_TX_BCLK/I2S_RX_BCLK to I2S_TX_FS/ I2S_RX_FS output valid -- 45 ns S6 I2S_TX_BCLK/I2S_RX_BCLK to I2S_TX_FS/ I2S_RX_FS output invalid 0 -- ns S7 I2S_TX_BCLK to I2S_TXD valid -- 45 ns S8 I2S_TX_BCLK to I2S_TXD invalid 0 -- ns S9 I2S_RXD/I2S_RX_FS input setup before I2S_RX_BCLK 75 -- ns S10 I2S_RXD/I2S_RX_FS input hold after I2S_RX_BCLK 0 -- ns S1 S2 S2 I2S_MCLK (output) S3 I2S_TX_BCLK/ I2S_RX_BCLK (output) S4 S4 S6 S5 I2S_TX_FS/ I2S_RX_FS (output) S10 S9 I2S_TX_FS/ I2S_RX_FS (input) S7 S8 S7 S8 I2S_TXD S9 S10 I2S_RXD Figure 21. I2S/SAI timing -- master modes Table 39. I2S/SAI slave mode timing in VLPR, VLPW, and VLPS modes (full voltage range) Num. S11 Characteristic Min. Max. Unit Operating voltage 1.71 3.6 V I2S_TX_BCLK/I2S_RX_BCLK cycle time (input) 250 -- ns Table continues on the next page... 46 Freescale Semiconductor, Inc. Kinetis KL26 Sub-Family, Rev5 08/2014. Peripheral operating requirements and behaviors Table 39. I2S/SAI slave mode timing in VLPR, VLPW, and VLPS modes (full voltage range) (continued) Num. Characteristic Min. Max. Unit S12 I2S_TX_BCLK/I2S_RX_BCLK pulse width high/low (input) 45% 55% MCLK period S13 I2S_TX_FS/I2S_RX_FS input setup before I2S_TX_BCLK/I2S_RX_BCLK 30 -- ns S14 I2S_TX_FS/I2S_RX_FS input hold after I2S_TX_BCLK/I2S_RX_BCLK 2 -- ns S15 I2S_TX_BCLK to I2S_TXD/I2S_TX_FS output valid -- 87 ns S16 I2S_TX_BCLK to I2S_TXD/I2S_TX_FS output invalid 0 -- ns S17 I2S_RXD setup before I2S_RX_BCLK 30 -- ns S18 I2S_RXD hold after I2S_RX_BCLK 2 -- ns -- 72 ns S19 I2S_TX_FS input assertion to I2S_TXD output valid1 1. Applies to first bit in each frame and only if the TCR4[FSE] bit is clear S11 S12 I2S_TX_BCLK/ I2S_RX_BCLK (input) S12 S15 S16 I2S_TX_FS/ I2S_RX_FS (output) S13 I2S_TX_FS/ I2S_RX_FS (input) S19 S14 S15 S16 S15 S16 I2S_TXD S17 S18 I2S_RXD Figure 22. I2S/SAI timing -- slave modes 3.9 Human-machine interfaces (HMI) 3.9.1 TSI electrical specifications Table 40. TSI electrical specifications Symbol Description Min. Typ. Max. Unit TSI_RUNF Fixed power consumption in run mode -- 100 -- A Table continues on the next page... Kinetis KL26 Sub-Family, Rev5 08/2014. 47 Freescale Semiconductor, Inc. Dimensions Table 40. TSI electrical specifications (continued) Symbol Description Min. Typ. Max. Unit TSI_RUNV Variable power consumption in run mode (depends on oscillator's current selection) 1.0 -- 128 A TSI_EN Power consumption in enable mode -- 100 -- A TSI_DIS Power consumption in disable mode -- 1.2 -- A TSI_TEN TSI analog enable time -- 66 -- s TSI_CREF TSI reference capacitor -- 1.0 -- pF TSI_DVOLT Voltage variation of VP & VM around nominal values 0.19 -- 1.03 V 4 Dimensions 4.1 Obtaining package dimensions Package dimensions are provided in package drawings. To find a package drawing, go to freescale.com and perform a keyword search for the drawing's document number: If you want the drawing for this package Then use this document number 64-pin LQFP 98ASS23234W 64-pin MAPBGA 98ASA00420D 100-pin LQFP 98ASS23308W 121-pin MAPBGA 98ASA00344D 5 Pinout 5.1 KL26 Signal Multiplexing and Pin Assignments The following table shows the signals available on each pin and the locations of these pins on the devices supported by this document. The Port Control Module is responsible for selecting which ALT functionality is available on each pin. 48 Freescale Semiconductor, Inc. Kinetis KL26 Sub-Family, Rev5 08/2014. Pinout 121 100 64 64 BGA LQFP BGA LQFP Pin Name Default ALT0 ALT1 ALT2 ALT3 E4 1 A1 1 PTE0 DISABLED PTE0 SPI1_MISO UART1_TX E3 2 B1 2 PTE1 DISABLED PTE1 SPI1_MOSI UART1_RX E2 3 -- -- PTE2 DISABLED PTE2 SPI1_SCK F4 4 -- -- PTE3 DISABLED PTE3 SPI1_MISO H7 5 -- -- PTE4 DISABLED PTE4 SPI1_PCS0 G4 6 -- -- PTE5 DISABLED PTE5 F3 7 -- -- PTE6 DISABLED PTE6 E6 8 -- 3 VDD VDD VDD G7 9 C4 4 VSS VSS VSS L6 -- -- -- VSS VSS VSS F1 10 E1 5 USB0_DP USB0_DP USB0_DP F2 11 D1 6 USB0_DM USB0_DM USB0_DM G1 12 E2 7 VOUT33 VOUT33 VOUT33 G2 13 D2 8 VREGIN VREGIN VREGIN H1 14 -- -- PTE16 ADC0_DP1/ ADC0_SE1 ADC0_DP1/ ADC0_SE1 H2 15 -- -- PTE17 J1 16 -- -- J2 17 -- K1 18 K2 RTC_ CLKOUT ALT5 I2C1_SDA SPI1_MISO I2C1_SCL I2S0_MCLK audioUSB_ SOF_OUT TPM_ CLKIN0 ADC0_DM1/ ADC0_DM1/ PTE17 ADC0_SE5a ADC0_SE5a SPI0_SCK UART2_RX TPM_ CLKIN1 PTE18 ADC0_DP2/ ADC0_SE2 PTE18 SPI0_MOSI I2C0_SDA SPI0_MISO -- PTE19 ADC0_DM2/ ADC0_DM2/ PTE19 ADC0_SE6a ADC0_SE6a SPI0_MISO I2C0_SCL SPI0_MOSI G1 9 PTE20 ADC0_DP0/ ADC0_SE0 PTE20 TPM1_CH0 UART0_TX 19 F1 10 PTE21 ADC0_DM0/ ADC0_DM0/ PTE21 ADC0_SE4a ADC0_SE4a TPM1_CH1 UART0_RX L1 20 G2 11 PTE22 ADC0_DP3/ ADC0_SE3 PTE22 TPM2_CH0 UART2_TX L2 21 F2 12 PTE23 ADC0_DM3/ ADC0_DM3/ PTE23 ADC0_SE7a ADC0_SE7a TPM2_CH1 UART2_RX F5 22 F4 13 VDDA VDDA VDDA G5 23 G4 14 VREFH VREFH VREFH G6 24 G3 15 VREFL VREFL VREFL F6 25 F3 16 VSSA VSSA VSSA L3 26 H1 17 PTE29 CMP0_IN5/ CMP0_IN5/ PTE29 ADC0_SE4b ADC0_SE4b TPM0_CH2 TPM_ CLKIN0 K5 27 H2 18 PTE30 DAC0_OUT/ DAC0_OUT/ PTE30 ADC0_SE23/ ADC0_SE23/ CMP0_IN4 CMP0_IN4 TPM0_CH3 TPM_ CLKIN1 L4 28 H3 19 PTE31 DISABLED TPM0_CH4 L5 29 -- -- VSS VSS Kinetis KL26 Sub-Family, Rev5 08/2014. ADC0_DP3/ ADC0_SE3 PTE31 ALT7 SPI1_MOSI UART2_TX ADC0_DP0/ ADC0_SE0 ALT6 CMP0_OUT SPI0_PCS0 ADC0_DP2/ ADC0_SE2 PTE16 ALT4 LPTMR0_ ALT3 VSS 49 Freescale Semiconductor, Inc. Pinout 121 100 64 64 BGA LQFP BGA LQFP Pin Name Default ALT0 ALT1 ALT2 ALT3 ALT4 ALT5 ALT6 ALT7 K6 30 -- -- VDD VDD H5 31 H4 20 PTE24 DISABLED PTE24 TPM0_CH0 I2C0_SCL J5 32 H5 21 PTE25 DISABLED PTE25 TPM0_CH1 I2C0_SDA H6 33 -- -- PTE26 DISABLED PTE26 TPM0_CH5 J6 34 D3 22 PTA0 SWD_CLK TSI0_CH1 PTA0 TPM0_CH5 H8 35 D4 23 PTA1 DISABLED TSI0_CH2 PTA1 UART0_RX TPM2_CH0 J7 36 E5 24 PTA2 DISABLED TSI0_CH3 PTA2 UART0_TX TPM2_CH1 H9 37 D5 25 PTA3 SWD_DIO TSI0_CH4 PTA3 I2C1_SCL TPM0_CH0 SWD_DIO J8 38 G5 26 PTA4 NMI_b TSI0_CH5 PTA4 I2C1_SDA TPM0_CH1 NMI_b K7 39 F5 27 PTA5 DISABLED PTA5 USB_CLKIN TPM0_CH2 E5 -- -- -- VDD VDD VDD G3 -- -- -- VSS VSS VSS K3 40 -- -- PTA6 DISABLED PTA6 TPM0_CH3 H4 41 -- -- PTA7 DISABLED PTA7 TPM0_CH4 K8 42 H6 28 PTA12 DISABLED PTA12 TPM1_CH0 I2S0_TXD0 L8 43 G6 29 PTA13 DISABLED PTA13 TPM1_CH1 I2S0_TX_FS K9 44 -- -- PTA14 DISABLED PTA14 SPI0_PCS0 UART0_TX I2S0_RX_ BCLK L9 45 -- -- PTA15 DISABLED PTA15 SPI0_SCK UART0_RX I2S0_RXD0 J10 46 -- -- PTA16 DISABLED PTA16 SPI0_MOSI SPI0_MISO I2S0_RX_FS I2S0_RXD0 H10 47 -- -- PTA17 DISABLED PTA17 SPI0_MISO SPI0_MOSI I2S0_MCLK L10 48 G7 30 VDD VDD VDD K10 49 H7 31 VSS VSS VSS L11 50 H8 32 PTA18 EXTAL0 EXTAL0 PTA18 UART1_RX TPM_ CLKIN0 K11 51 G8 33 PTA19 XTAL0 XTAL0 PTA19 UART1_TX TPM_ CLKIN1 J11 52 F8 34 PTA20 RESET_b G11 53 F7 35 PTB0/ LLWU_P5 ADC0_SE8/ TSI0_CH0 ADC0_SE8/ TSI0_CH0 PTB0/ LLWU_P5 I2C0_SCL TPM1_CH0 G10 54 F6 36 PTB1 ADC0_SE9/ TSI0_CH6 ADC0_SE9/ TSI0_CH6 PTB1 I2C0_SDA TPM1_CH1 G9 55 E7 37 PTB2 ADC0_SE12/ ADC0_SE12/ PTB2 TSI0_CH7 TSI0_CH7 I2C0_SCL TPM2_CH0 G8 56 E8 38 PTB3 ADC0_SE13/ ADC0_SE13/ PTB3 TSI0_CH8 TSI0_CH8 I2C0_SDA TPM2_CH1 E11 57 -- -- PTB7 DISABLED PTB7 D11 58 -- -- PTB8 DISABLED PTB8 SPI1_PCS0 EXTRG_IN E10 59 -- -- PTB9 DISABLED PTB9 SPI1_SCK D10 60 -- -- PTB10 DISABLED PTB10 SPI1_PCS0 50 Freescale Semiconductor, Inc. VDD PTA20 RTC_ CLKOUT USB_CLKIN SWD_CLK I2S0_TX_ BCLK I2S0_TXD0 LPTMR0_ ALT1 RESET_b Kinetis KL26 Sub-Family, Rev5 08/2014. Pinout 121 100 64 64 BGA LQFP BGA LQFP Pin Name Default C10 61 -- -- PTB11 DISABLED B10 62 E6 39 PTB16 TSI0_CH9 E9 63 D7 40 PTB17 D9 64 D6 41 C9 65 C7 F10 66 F9 ALT0 ALT1 ALT2 ALT3 ALT4 ALT5 ALT6 PTB11 SPI1_SCK TSI0_CH9 PTB16 SPI1_MOSI UART0_RX TPM_ CLKIN0 SPI1_MISO TSI0_CH10 TSI0_CH10 PTB17 SPI1_MISO UART0_TX TPM_ CLKIN1 SPI1_MOSI PTB18 TSI0_CH11 TSI0_CH11 PTB18 TPM2_CH0 I2S0_TX_ BCLK 42 PTB19 TSI0_CH12 TSI0_CH12 PTB19 TPM2_CH1 I2S0_TX_FS -- -- PTB20 DISABLED PTB20 67 -- -- PTB21 DISABLED PTB21 F8 68 -- -- PTB22 DISABLED PTB22 E8 69 -- -- PTB23 DISABLED PTB23 B9 70 D8 43 PTC0 ADC0_SE14/ ADC0_SE14/ PTC0 TSI0_CH13 TSI0_CH13 D8 71 C6 44 PTC1/ ADC0_SE15/ ADC0_SE15/ PTC1/ I2C1_SCL LLWU_P6/ TSI0_CH14 TSI0_CH14 LLWU_P6/ RTC_CLKIN RTC_CLKIN TPM0_CH0 I2S0_TXD0 C8 72 B7 45 PTC2 ADC0_SE11/ ADC0_SE11/ PTC2 TSI0_CH15 TSI0_CH15 TPM0_CH1 I2S0_TX_FS B8 73 C8 46 PTC3/ LLWU_P7 DISABLED F7 74 E3 47 VSS VSS VSS E7 75 E4 48 VDD VDD VDD A10 -- -- -- PTC20 DISABLED PTC20 A9 -- -- -- PTC21 DISABLED PTC21 CMP0_OUT EXTRG_IN I2C1_SDA PTC3/ LLWU_P7 audioUSB_ SOF_OUT CMP0_OUT UART1_RX TPM0_CH2 CLKOUT I2S0_MCLK B11 -- -- -- PTC22 DISABLED PTC22 C11 -- -- -- PTC23 DISABLED PTC23 A8 76 B8 49 PTC4/ LLWU_P8 DISABLED PTC4/ LLWU_P8 SPI0_PCS0 UART1_TX TPM0_CH3 D7 77 A8 50 PTC5/ LLWU_P9 DISABLED PTC5/ LLWU_P9 SPI0_SCK LPTMR0_ ALT2 I2S0_RXD0 C7 78 A7 51 PTC6/ LLWU_P10 CMP0_IN0 CMP0_IN0 PTC6/ LLWU_P10 SPI0_MOSI EXTRG_IN I2S0_RX_ BCLK B7 79 B6 52 PTC7 CMP0_IN1 CMP0_IN1 PTC7 SPI0_MISO audioUSB_ SOF_OUT I2S0_RX_FS SPI0_MOSI A7 80 A6 53 PTC8 CMP0_IN2 CMP0_IN2 PTC8 I2C0_SCL TPM0_CH4 I2S0_MCLK D6 81 B5 54 PTC9 CMP0_IN3 CMP0_IN3 PTC9 I2C0_SDA TPM0_CH5 I2S0_RX_ BCLK C6 82 B4 55 PTC10 DISABLED PTC10 I2C1_SCL I2S0_RX_FS C5 83 A5 56 PTC11 DISABLED PTC11 I2C1_SDA I2S0_RXD0 B6 84 -- -- PTC12 DISABLED PTC12 TPM_ CLKIN0 A6 85 -- -- PTC13 DISABLED PTC13 TPM_ CLKIN1 Kinetis KL26 Sub-Family, Rev5 08/2014. ALT7 I2S0_TXD0 I2S0_TX_ BCLK CMP0_OUT SPI0_MISO I2S0_MCLK 51 Freescale Semiconductor, Inc. Pinout 121 100 64 64 BGA LQFP BGA LQFP Pin Name Default ALT0 ALT1 D5 90 -- -- PTC16 DISABLED PTC16 C4 91 -- -- PTC17 DISABLED PTC17 B4 92 -- -- PTC18 DISABLED PTC18 D4 93 C3 57 PTD0 DISABLED PTD0 D3 94 A4 58 PTD1 C3 95 C2 59 B3 96 B3 A3 97 A2 ALT2 ALT3 ALT4 ALT5 SPI0_PCS0 TPM0_CH0 ADC0_SE5b ADC0_SE5b PTD1 SPI0_SCK TPM0_CH1 PTD2 DISABLED PTD2 SPI0_MOSI UART2_RX TPM0_CH2 SPI0_MISO 60 PTD3 DISABLED PTD3 SPI0_MISO UART2_TX TPM0_CH3 SPI0_MOSI A3 61 PTD4/ LLWU_P14 DISABLED PTD4/ LLWU_P14 SPI1_PCS0 UART2_RX TPM0_CH4 98 C1 62 PTD5 ADC0_SE6b ADC0_SE6b PTD5 SPI1_SCK UART2_TX TPM0_CH5 B2 99 B2 63 PTD6/ LLWU_P15 ADC0_SE7b ADC0_SE7b PTD6/ LLWU_P15 SPI1_MOSI UART0_RX SPI1_MISO A1 100 A2 64 PTD7 DISABLED SPI1_MISO UART0_TX SPI1_MOSI A11 86 C5 -- NC NC NC -- 87 -- -- NC NC NC -- 88 -- -- NC NC NC -- 89 -- -- NC NC NC J3 -- -- -- NC NC NC H3 -- -- -- NC NC NC K4 -- -- -- NC NC NC L7 -- -- -- NC NC NC J9 -- -- -- NC NC NC J4 -- -- -- NC NC NC H11 -- -- -- NC NC NC F11 -- -- -- NC NC NC A5 -- -- -- NC NC NC B5 -- -- -- NC NC NC A4 -- -- -- NC NC NC B1 -- -- -- NC NC NC C2 -- -- -- NC NC NC C1 -- -- -- NC NC NC D2 -- -- -- NC NC NC D1 -- -- -- NC NC NC E1 -- -- -- NC NC NC PTD7 ALT6 ALT7 5.2 KL26 pinouts The following figures show the pinout diagrams for the devices supported by this document. Many signals may be multiplexed onto a single pin. To determine what signals can be used on which pin, ssee KL26 Signal Multiplexing and Pin Assignments. 52 Freescale Semiconductor, Inc. Kinetis KL26 Sub-Family, Rev5 08/2014. Pinout 1 2 3 4 5 6 7 8 9 10 11 A PTD7 PTD5 PTD4/ LLWU_P14 NC NC PTC13 PTC8 PTC4/ LLWU_P8 PTC21 PTC20 NC A B NC PTD6/ LLWU_P15 PTD3 PTC18 NC PTC12 PTC7 PTC3/ LLWU_P7 PTC0 PTB16 PTC22 B C NC NC PTD2 PTC17 PTC11 PTC10 PTC6/ LLWU_P10 PTC2 PTB19 PTB11 PTC23 C D NC NC PTD1 PTD0 PTC16 PTC9 PTC5/ LLWU_P9 PTC1/ LLWU_P6/ RTC_CLKIN PTB18 PTB10 PTB8 D E NC PTE2 PTE1 PTE0 VDD VDD VDD PTB23 PTB17 PTB9 PTB7 E F USB0_DP USB0_DM PTE6 PTE3 VDDA VSSA VSS PTB22 PTB21 PTB20 NC F G VOUT33 VREGIN VSS PTE5 VREFH VREFL VSS PTB3 PTB2 PTB1 PTB0/ LLWU_P5 G H PTE16 PTE17 NC PTA7 PTE24 PTE26 PTE4 PTA1 PTA3 PTA17 NC H J PTE18 PTE19 NC NC PTE25 PTA0 PTA2 PTA4 NC PTA16 PTA20 J K PTE20 PTE21 PTA6 NC PTE30 VDD PTA5 PTA12 PTA14 VSS PTA19 K L PTE22 PTE23 PTE29 PTE31 VSS VSS NC PTA13 PTA15 VDD PTA18 L 1 2 3 4 5 6 7 8 9 10 11 Figure 23. KL26 121-pin BGA pinout diagram Kinetis KL26 Sub-Family, Rev5 08/2014. 53 Freescale Semiconductor, Inc. PTC16 NC NC NC NC PTC13 PTC12 PTC11 PTC10 PTC9 PTC8 90 89 88 87 86 85 84 83 82 81 80 PTC4/LLWU_P8 PTC17 91 PTC5/LLWU_P9 PTC18 92 76 PTD0 93 77 PTD1 94 PTC7 PTD2 95 PTC6/LLWU_P10 PTD3 96 78 PTD4/LLWU_P14 97 79 PTD5 98 PTD7 PTD6/LLWU_P15 100 99 Pinout PTE0 1 75 VDD PTE1 2 74 VSS PTE2 3 73 PTC3/LLWU_P7 PTE3 4 72 PTC2 PTE4 5 71 PTC1/LLWU_P6/RTC_CLKIN PTE5 6 70 PTC0 PTE6 7 69 PTB23 VDD 8 68 PTB22 9 67 PTB21 USB0_DP 10 66 PTB20 USB0_DM 11 65 PTB19 VOUT33 12 64 PTB18 VREGIN 13 63 PTB17 PTE16 14 62 PTB16 PTE17 15 61 PTB11 PTE18 16 60 PTB10 PTE19 17 59 PTB9 PTE20 18 58 PTB8 VSS 39 40 41 42 43 44 45 46 47 48 PTA5 PTA6 PTA7 PTA12 PTA13 PTA14 PTA15 PTA16 PTA17 VDD 49 38 PTA4 50 37 PTA3 VSS 36 PTA2 PTA18 35 PTA19 34 PTA20 51 PTA1 52 25 PTA0 24 VSSA 33 VREFL PTE26 PTB0/LLWU_P5 32 53 PTE25 23 31 VREFH PTE24 PTB1 29 54 30 22 VSS PTB2 VDDA VDD 55 28 21 PTE31 PTB3 PTE23 27 PTB7 56 26 57 PTE30 19 20 PTE29 PTE21 PTE22 Figure 24. KL26 100-pin LQFP pinout diagram 54 Freescale Semiconductor, Inc. Kinetis KL26 Sub-Family, Rev5 08/2014. PTD7 PTD6/LLWU_P15 PTD5 PTD4/LLWU_P14 PTD3 PTD2 PTD1 PTD0 PTC11 PTC10 PTC9 PTC8 PTC7 PTC6/LLWU_P10 PTC5/LLWU_P9 PTC4/LLWU_P8 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 Pinout PTE20 9 40 PTB17 PTE21 10 39 PTB16 PTE22 11 38 PTB3 PTE23 12 37 PTB2 VDDA 13 36 PTB1 VREFH 14 35 PTB0/LLWU_P5 VREFL 15 34 PTA20 VSSA 16 33 PTA19 32 PTB18 PTA18 41 31 8 VSS VREGIN 30 PTB19 VDD 42 29 7 PTA13 VOUT33 28 PTC0 PTA12 43 27 6 PTA5 USB0_DM 26 PTC1/LLWU_P6/RTC_CLKIN PTA4 44 25 5 PTA3 USB0_DP 24 PTC2 PTA2 45 23 4 PTA1 VSS 22 PTC3/LLWU_P7 PTA0 46 21 3 PTE25 VDD 20 VSS PTE24 47 19 2 PTE31 PTE1 18 VDD PTE30 48 17 1 PTE29 PTE0 Figure 25. KL26 64-pin LQFP pinout diagram Kinetis KL26 Sub-Family, Rev5 08/2014. 55 Freescale Semiconductor, Inc. Ordering parts 1 2 3 4 5 6 A PTE0 PTD7 PTD4 /LLWU_P14 PTD1 PTC11 PTC8 B PTE1 PTD6 /LLWU_P15 PTD3 PTC10 PTC9 PTC7 C PTD5 PTD2 PTD0 VSS NC D USB0_DM VREGIN PTA0 PTA1 E USB0_DP VOUT33 VSS F PTE21 PTE23 G PTE20 H 7 8 PTC6 PTC5 /LLWU_P10 /LLWU_P9 A PTC2 PTC4 /LLWU_P8 B PTC1 /LLWU_P6 /RTC _CLKIN PTB19 PTC3 /LLWU_P7 C PTA3 PTB18 PTB17 PTC0 D VDD PTA2 PTB16 PTB2 PTB3 E VSSA VDDA PTA5 PTB1 PTB0 /LLWU_P5 PTA20 F PTE22 VREFL VREFH PTA4 PTA13 VDD PTA19 G PTE29 PTE30 PTE31 PTE24 PTE25 PTA12 VSS PTA18 H 1 2 3 4 5 6 7 8 Figure 26. KL26 64-pin MAPBGA pinout diagram 6 Ordering parts 6.1 Determining valid orderable parts Valid orderable part numbers are provided on the web. To determine the orderable part numbers for this device, go to freescale.com and perform a part number search for the following device numbers: PKL26 and MKL26 7 Part identification 56 Freescale Semiconductor, Inc. Kinetis KL26 Sub-Family, Rev5 08/2014. Part identification 7.1 Description Part numbers for the chip have fields that identify the specific part. You can use the values of these fields to determine the specific part you have received. 7.2 Format Part numbers for this device have the following format: Q KL## A FFF R T PP CC N 7.3 Fields This table lists the possible values for each field in the part number (not all combinations are valid): Table 41. Part number fields descriptions Field Description Values Q Qualification status * M = Fully qualified, general market flow * P = Prequalification KL## Kinetis family * KL26 A Key attribute * Z = Cortex-M0+ FFF Program flash memory size * 128 = 128 KB * 256 = 256 KB R Silicon revision * (Blank) = Main * A = Revision after main T Temperature range (C) * V = -40 to 105 PP Package identifier * * * * CC Maximum CPU frequency (MHz) * 4 = 48 MHz N Packaging type * R = Tape and reel LH = 64 LQFP (10 mm x 10 mm) MP = 64 MAPBGA (5 mm x 5 mm) LL = 100 LQFP (14 mm x 14 mm) MC = 121 MAPBGA (8 mm x 8 mm) 7.4 Example This is an example part number: MKL26Z256VLH4 Kinetis KL26 Sub-Family, Rev5 08/2014. 57 Freescale Semiconductor, Inc. Terminology and guidelines 8 Terminology and guidelines 8.1 Definition: Operating requirement An operating requirement is a specified value or range of values for a technical characteristic that you must guarantee during operation to avoid incorrect operation and possibly decreasing the useful life of the chip. 8.1.1 Example This is an example of an operating requirement: Symbol VDD Description 1.0 V core supply voltage Min. 0.9 Max. 1.1 Unit V 8.2 Definition: Operating behavior Unless otherwise specified, an operating behavior is a specified value or range of values for a technical characteristic that are guaranteed during operation if you meet the operating requirements and any other specified conditions. 8.3 Definition: Attribute An attribute is a specified value or range of values for a technical characteristic that are guaranteed, regardless of whether you meet the operating requirements. 8.3.1 Example This is an example of an attribute: Symbol CIN_D Description Input capacitance: digital pins 58 Freescale Semiconductor, Inc. Min. -- Max. 7 Unit pF Kinetis KL26 Sub-Family, Rev5 08/2014. Terminology and guidelines 8.4 Definition: Rating A rating is a minimum or maximum value of a technical characteristic that, if exceeded, may cause permanent chip failure: * Operating ratings apply during operation of the chip. * Handling ratings apply when the chip is not powered. 8.4.1 Example This is an example of an operating rating: Symbol VDD Description 1.0 V core supply voltage Min. -0.3 Max. 1.2 Unit V 8.5 Result of exceeding a rating Failures in time (ppm) 40 30 The likelihood of permanent chip failure increases rapidly as soon as a characteristic begins to exceed one of its operating ratings. 20 10 0 Operating rating Measured characteristic Kinetis KL26 Sub-Family, Rev5 08/2014. 59 Freescale Semiconductor, Inc. Terminology and guidelines 8.6 Relationship between ratings and operating requirements O a gr tin ra pe g tin ( ) in. (m nt me n.) mi t era Op ing e uir req g tin era Op t en em uir q e r ax (m .) rat pe ing g tin ra ax (m .) O Fatal range Degraded operating range Normal operating range Degraded operating range Fatal range Expected permanent failure - No permanent failure - Possible decreased life - Possible incorrect operation - No permanent failure - Correct operation - No permanent failure - Possible decreased life - Possible incorrect operation Expected permanent failure - Operating (power on) dli n Ha ng ng i rat x.) ) in. (m li nd Ha ng i rat a (m ng Fatal range Handling range Fatal range Expected permanent failure No permanent failure Expected permanent failure - Handling (power off) 8.7 Guidelines for ratings and operating requirements Follow these guidelines for ratings and operating requirements: * Never exceed any of the chip's ratings. * During normal operation, don't exceed any of the chip's operating requirements. * If you must exceed an operating requirement at times other than during normal operation (for example, during power sequencing), limit the duration as much as possible. 8.8 Definition: Typical value A typical value is a specified value for a technical characteristic that: * Lies within the range of values specified by the operating behavior * Given the typical manufacturing process, is representative of that characteristic during operation when you meet the typical-value conditions or other specified conditions Typical values are provided as design guidelines and are neither tested nor guaranteed. 60 Freescale Semiconductor, Inc. Kinetis KL26 Sub-Family, Rev5 08/2014. Terminology and guidelines 8.8.1 Example 1 This is an example of an operating behavior that includes a typical value: Symbol Description IWP Digital I/O weak pullup/pulldown current Min. 10 Typ. Max. 70 130 Unit A 8.8.2 Example 2 This is an example of a chart that shows typical values for various voltage and temperature conditions: 5000 4500 4000 TJ IDD_STOP (A) 3500 150 C 3000 105 C 2500 25 C 2000 -40 C 1500 1000 500 0 0.90 0.95 1.00 1.05 1.10 VDD (V) 8.9 Typical value conditions Typical values assume you meet the following conditions (or other conditions as specified): Kinetis KL26 Sub-Family, Rev5 08/2014. 61 Freescale Semiconductor, Inc. Revision history Table 42. Typical value conditions Symbol Description Value Unit TA Ambient temperature 25 C VDD 3.3 V supply voltage 3.3 V 9 Revision history The following table provides a revision history for this document. Table 43. Revision history Rev. No. Date 3 3/2014 Substantial Changes * * * * * * * * * * * Updated the front page and restructured the chapters Updated Voltage and current operating behaviors Updated EMC radiated emissions operating behaviors Updated Power mode transition operating behaviors Updated Capacitance attributes Updated footnote in the Device clock specifications Added thermal attributes of 64-pin MAPBGA in the Thermal attributes Added VREFH and VREFL in the 16-bit ADC electrical characteristics Updated footnote to the VDACR in the 12-bit DAC operating requirements Updated ILOADrun and ILIM in the USB VREG electrical specifications Added Inter-Integrated Circuit Interface (I2C) timing 4 5/2014 * Updated Power consumption operating behaviors * Updated USB electrical specifications * Updated Definition: Operating behavior 5 08/2014 * Updated related source in the front page * Updated Power consumption operating behaviors * Updated the note in USB electrical specifications 62 Freescale Semiconductor, Inc. Kinetis KL26 Sub-Family, Rev5 08/2014. How to Reach Us: Home Page: freescale.com Web Support: freescale.com/support Information in this document is provided solely to enable system and software implementers to use Freescale products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits based on the information in this document. Freescale reserves the right to make changes without further notice to any products herein. Freescale makes no warranty, representation, or guarantee regarding the suitability of its products for any particular purpose, nor does Freescale assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. "Typical" parameters that may be provided in Freescale data sheets and/or specifications can and do vary in different applications, and actual performance may vary over time. All operating parameters, including "typicals," must be validated for each customer application by customer's technical experts. Freescale does not convey any license under its patent rights nor the rights of others. Freescale sells products pursuant to standard terms and conditions of sale, which can be found at the following address: freescale.com/SalesTermsandConditions. Freescale, Freescale logo, Energy Efficient Solutions logo, and Kinetis are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. All other product or service names are the property of their respective owners. ARM and Cortex are registered trademarks of ARM Limited (or its subsidiaries) in the EU and/or elsewhere. All rights reserved. (c) 2012-2014 Freescale Semiconductor, Inc. Document Number KL26P121M48SF4 Revision 5 08/2014