Multilayer Ceramic Capacitor - High Voltage - Multilayer Ceramic Capacitor - High Voltage INTRODUCTION SAMSUNG (Electro-Mechanics) mid/high voltage MLCC products with C0G(NP0) and X7R temperature characteristics are designed for commercial and industrial applications up to DC 3 KV, including power supply and voltage multiplier circuits applications. The specially-designed internal and external structures are capable of enhancing high voltage performance of chips. Various sizes and voltage ratings are available for corresponding capacitance ranges. Please contact and consult the local offices/headquarter of SAMSUNG Electro-Mechanics. FEATURE AND APPLICATION Feature - Miniature Size - Wide Capacitance and Voltage Range - Highly Reliable Performance in High-voltage - Tape & Reel for Surface Mount Assembly - Low ESR Application - Input Signal Filtering Circuit of Modem and LAN Interface - General High Voltage Circuits - Inverter Circuits with a Liquid Backlight -1- Multilayer Ceramic Capacitor - High Voltage STRUCTURE -2- Multilayer Ceramic Capacitor - High Voltage APPEARANCE AND DIMENSION L T W BW CODE DIMENSION ( mm ) EIA CODE L W T (MAX) BW 10 0603 1.6 0.1 0.8 0.1 0.8 0.1 0.3 + 0.2/-0.1 21 0805 2.0 0.1 1.25 0.1 1.25 0.1 0.5 + 0.2/-0.3 31 1206 3.2 0.2 1.6 0.2 1.6 0.2 0.5 + 0.2/-0.3 32 1210 3.2 0.3 2.5 0.2 2.5 0.2 0.6 + 0.2/-0.1 42 1810 4.5 0.4 2.0 0.2 2.0 0.2 0.8 + 0.2/-0.1 43 1812 4.5 0.4 3.2 0.3 2.5 0.2 0.8 + 0.2/-0.1 55 2220 5.7 0.4 3.2 0.4 2.5 0.2 0.8 + 0.2/-0.1 -3- Multilayer Ceramic Capacitor - High Voltage PREVIOUS PART NUMBERING CL 1 42 2 C 3 270 4 J 5 K 6 N 7 E 8 1 SAMSUNG Multilayer Ceramic Capacitor 2 Type(Size) 3 Capacitance Temperature Characteristics 4 Nominal Capacitance 5 Capacitance Tolerance 6 Rated Voltage 7 Thickness Option 8 Packaging Type 3 CAPACITANCE TEMPERATURE CHARACTERISTIC CLASS (Temperature Compensation) Symbol EIA Code Temperature Coefficient(PPM/) Temperature Characteristics Operation Temperature Range C C0G(CH) 0 30 C -55 ~ +125 Temperature Characteristics Temperature below 2.0pF 2.2 ~ 3.9pF above 4.0pF Characteristics C C0G C0G C0G above 10pF C0G CLASS (High Dielectric Constant) Symbol EIA Code Capacitance Change (C : %) Operation Temperature Range B X7R 15 -55 ~ +125 -4- Multilayer Ceramic Capacitor - High Voltage 4 NOMINAL CAPACITANCE The nominal capacitance value is expressed in pico-Farad(pF) and identified by threedigit number, first two digits represent significant figures and last digit specifies the number of zeros to follow. For values below 1pF, the letter "R" is used as the decimal point and the last digit becomes significant. example) 100 : 10 x 10o = 10pF 102 : 10 x 102 = 1000pF 020 : 2 x 10o = 2pF 1R5 : 1.5pF 5 CAPACITANCE TOLERANCE Temperature Characteristics Symbol C (C0G) B(X7R) Tolerance Applicable Capacitance & Range C 0.25pF D 0.5pF J 5% K 10% M 20% J 5% K 10% M 20% 0.5 ~ 10pF E-24 Series for over 10pF E-12 Series Please Consult us for special tolerances. : Option 6 RATED VOLTAGE Symbol Rated Voltage(Vdc) Symbol Rated Voltage(Vdc) C 100Vdc H 630Vdc D 200Vdc I 1000Vdc E 250Vdc J 2000Vdc G 500Vdc K 3000Vdc -5- Multilayer Ceramic Capacitor - High Voltage 7 THICKNESS OPTION Symbol Description of the Code N Standard thickness (please refer to standard thickness table on next page) A Thinner than standard thickness B Thicker than standard thickness Please consult us for other termination type. 8 PACKAGING TYPE Symbol Packaging Symbol Packaging B Bulk D Paper Tape, 13" Reel P Cassette E Embossed Tape, 7" Reel C Paper Tape, 7" Reel F Embossed Tape, 13" Reel STANDARD CAPACITANCE STEP Series Capacitance Step 1.0 E- 3 1.0 E- 6 E-12 E-24 2.2 1.5 4.7 2.2 3.3 4.7 6.8 1.0 1.2 1.5 1.8 2.2 2.7 3.3 3.9 4.7 5.6 6.8 8.2 1.0 1.2 1.5 1.8 2.2 2.7 3.3 3.9 4.7 5.6 6.8 8.2 1.1 1.3 1.6 2.0 2.4 3.0 3.6 4.3 5.1 6.2 7.5 9.1 Standard Capacitance is " Each step x10n " -6- Multilayer Ceramic Capacitor - High Voltage NEW PART NUMBERING CL 1 42 2 C 3 270 4 J 5 K 6 F 7 N 8 N 9 N 10 C 11 1 SAMSUNG Multilayer Ceramic Capacitor 2 Size(mm) 3 Capacitance Temperature Characteristic 4 Nominal Capacitance 5 Capacitance Tolerance 6 Rated Voltage 7 Thickness Option 8 Product & Plating Method 9 Samsung Control Code 10 Reserved For Future Use 11 Packaging Type 1 PRODUCT ABBREVIATION Symbol Product Abbreviation CL SAMSUNG Multilayer Ceramic Capacitor 2 SIZE(mm) Symbol Size(mm) Length Width 10 1.6 0.8 21 2.0 1.2 31 3.2 1.6 32 3.2 2.5 42 4.5 2.0 43 4.5 3.2 55 5.7 5.0 -7- Multilayer Ceramic Capacitor - High Voltage 3 CAPACITANCE TEMPERATURE CHARACTERISTIC Symbol Temperature Temperature Characteristics Range C Class COG C 030(ppm/) -55 ~ +125 B Class X7R X7R 15% -55 ~ +125 Temperature Characteristic Temperature Characteristics Below 2.0pF 2.2 ~ 3.9pF Above 4.0pF Above 10pF C C0G C0G C0G C0G 4 NOMINAL CAPACITANCE Nominal capacitance is identified by 3 digits. The first and second digits identify the first and second significant figures of the capacitance. The third digit identifies the multiplier. 'R' identifies a decimal point. Example Symbol Nominal Capacitance 1R5 1.5pF 103 10,000pF, 10nF, 0.01F 104 100,000pF, 100nF, 0.1F 5 CAPACITANCE TOLERANCE Symbol Tolerance Nominal Capacitance C 0.25pF Less than 10pF D 0.5pF (Including 10pF) J 5% K 10% M 20% More than 10pF -8- Multilayer Ceramic Capacitor - High Voltage 6 RATED VOLTAGE Symbol Rated Voltage Symbol Rated Voltage C 100V H 630V D 200V I 1,000V E 250V J 2,000V G 500V K 3,000V 7 THICKNESS OPTION Type Symbol Thickness(T) Spec 1608 8 0.80 0.10 A 0.65 C 0.85 F 1.25 0.10 C 0.85 0.15 F 1.25 0.15 H 1.6 0.20 F 1.25 H 1.6 I 2.0 J 2.5 F 1.25 H 1.6 F 1.25 H 1.6 I 2.0 J 2.5 F 1.25 H 1.6 I 2.0 J 2.5 2012 3216 3225 4520 4532 5750 0.10 0.20 0.20 0.20 0.20 -9- Multilayer Ceramic Capacitor - High Voltage 8 PRODUCT & PLATING METHOD Symbol Electrode Termination Plating Type A Pd Ag Sn_100% N Ni Cu Sn_100% G Cu Cu Sn_100% 9 SAMSUNG CONTROL CODE Symbol Description of the code Symbol Description of the code A Array (2-element) N Normal B Array (4-element) P Automotive C High - Q W 3 Terminal EMI Filter L LICC 10 RESERVED FOR FUTURE USE Symbol Description of the code N Reserved for future use 11 PACKAGING TYPE Symbol Packaging Type Symbol Packaging Type B Bulk F Embossing 13" (10,000EA) P Bulk Case L Paper 13" (15,000EA) C Paper 7" O Paper 10" D Paper 13" (10,000EA) S Embossing 10" E Embossing 7" - 10 - Multilayer Ceramic Capacitor - High Voltage CAPACITANCE vs CHIP THICKNESS STANDARD Dimension (mm) SL C A P A C I T A N C E R A N G E 3225 Type (1210) 4520 Type (1808) 4532 Type (1812) 5750 Type (2220) 3.2 0.2 3.20.3 4.50.4 4.50.4 5.70.4 1.6 0.2 2.50.2 2.00.2 3.20.3 5.00.4 1608 (0603) 2012 Type (0805) L 1.6 0.1 2.00.1 3.20.15 W 0.8 0.1 1.250.1 1.60.15 T 0.8 0.1 0.65 0.1 0.85 1.25 0.85 1.25 0.1 0.1 0.15 0.15 100V 0.5~ 680 0.5~ 560 620~ 1000 0.5~ 910 1500 1600~ 3600~ 3300 3900 100V 0.5~ 390 0.5~ 390 470~ 1000 0.5~ 820 2200 200V - - 33~ 470 250V - - - 680 - - 2200 500V - - - - - 10~ 560 680~ 1000 630V - - - - - - 820 - 1kV - - - - - 10~ 150 180~ 270 2kV - - - - - - 3kV - - - - - 100V 0.47~ 10 0.22~ 10 15 22~ 68 200V - - 0.22~1 0 250V - - 500V - 630V Description 3216 Type (1206) 560~ 220~ 1000 680 1.6 0.2 1.25 0.2 1.6 0.2 2.0 0.2 2.5 0.2 - - - - 1.25 1.6 0.2 0.2 1.25 0.2 1.6 0.2 2.0 0.2 2.5 0.2 1.6 0.2 2.0 0.2 2.5 0.2 - - - - - - - 10000 ~ 18000 22000 27000~ 33000 15000 - - - - - 2700~ 3900~ 4700~ 8200~ 12000 15000 ~ 3300 6800 6800 10000 18000 - - 820~ 1500~ 3300 1200 2700 - - - - - 10000~ 18000 - - - - - - 12000 - - 22000 3300~ 5600 - - 4700 5600~ 8200 - 6800 - - - - - - - - 2200 - - - - - 4700 - - 10000 - 470~ 560 680 820 - - 470~ 680 820~ 1000 1200 1500~ 1800 - - 2200~ 3600 10~47 47~ 180 220 270~ 330 470 10~ 150 180~ 220 47~ 120 150~ 180 220 270~ 390 - - - - - - - - - 10~ 100 - - 100~ 180 220 270~ 390 - - 470~ 820 1~ 47 68~ 100 150 2.2~ 150 220 - - - - 100~ 330 470 - - 680~ 1000 1500 - - 0.47~ 22 33~ 47 68~ 100 - - - - - - 47~ 100 - - - - - - 1~ 3.3 4.7~1 5 - 22 33~ 47 - - 68 100 - - - - - 150~ 220 - - 330~ 470 - - - - 0.47~ 15 22~ 33 10~ 33 470 - - - - 10~ 47 68 100 - 150 220 - - - - - - - - - - - - - - - - - - - - - 1kV - - - - - 0.47~ 3.3 - 3.3~ 6.8 - - - - - 1.5~ 10 15~ 22 - 33 - 47 68 2kV - - - - - - 0.47~ 0.47~ 1 1 - - - 1 - 1~ 3.3 - - - 3.3~ 10 - - C, TC (Except SL,UJ) - 3900 470~ 1200~ 1000 1500 470~ 1800~ 2700 1500 2200 6800 8200~ 10000 ( ) p F C A P A C I T A N C E R A N G E (X7R) ( ) n F - 11 - Multilayer Ceramic Capacitor - High Voltage PACKAGING CARDBOARD PAPER TAPE Perforated square holes for inserting a chip Feeding round holes D E A F B t P0 P2 W P1 unit : mm Symbol W Type D e m e n s i o n F E P1 P2 P0 D t 10 8.0 0.3 21 3.5 0.05 1.75 0.1 4.0 0.1 2.0 0.05 4.0 0.1 1.5 +0.1/-0 1.1 Max 31 A B 1.1 0.2 1.9 0.2 1.6 0.2 2.4 0.2 2.0 0.2 3.6 0.2 EMBOSSED PLASTIC TAPE Perforated square holes for inserting a chip Feeding round holes D E A F W B t1 P0 t0 P2 P1 unit : mm Symbol Type D i m e n s i o n W F E P1 P2 P0 D t0 t1 21 31 8.0 0.3 3.5 0.05 32 43 (42) 12 0.3 5.6 0.05 1.75 0.1 4.0 0.1 8.0 0.1 2.0 0.05 4.0 0.1 1.5 +0.1/-0 0.6 Max 2.5 max 3.8 max A B 1.45 0.2 2.3 0.2 2.0 0.2 3.6 0.2 2.9 0.2 3.6 0.2 2.5(3.6) 0.2 4.9 0.2 - 12 - Multilayer Ceramic Capacitor - High Voltage TAPING SIZE Empty Section Empty Section Packed Part 45 Pitch Loading Section 50 Pitch 35 Pitch END START unit : pcs Symbol Cardboard Paper Tape Embossed Plastic Tape 7" Reel 4000 2000 13" Reel 15000 - REEL DIMENSION E C B R D W t A unit : mm Symbol A B 7" Reel 1782.0 min.50 13" Reel 3302.0 min.70 C D E W t R 130.5 210.8 2.00.5 101.5 0.80.2 1.0 - 13 - Multilayer Ceramic Capacitor - High Voltage BULK CASE PACKAGING - Bulk case packaging can reduce the stock space and transportation costs. - The bulk feeding system can increase the productivity. - It can eliminate the components loss. A B T C D E F W G H L I Symbol A B T C D E Dimension 6.80.1 8.80.1 120.1 1.5+0.1/-0 2+0/-0.1 4.70.1 Symbol F W G H L I Dimension 31.5+0.2/-0 36+0/-0.2 190.35 70.35 1100.7 50.35 QUANTITY Size 05(0402) 10(0603) Quantity 80,000 10,000~15,000 21(0805) T0.85mm T1.0mm 10,000 5,000 - 14 - Multilayer Ceramic Capacitor - High Voltage CHARACTERISTIC MAP CLASS Temperature Characteristics Size Voltage 10 (0603) 100V Capacitance Range () 0.5 10 100 1000 200V 680 6800 200V 220 2700 250V 2200 10 1000 630V 820 1000V 10 2000V 10 270 47 100V 18000 4700 200V 8200 3300 250V 32 (1210) 6800 470 500V 1500 630V C0G 2200 1000V 470 2000V 42 (1808) 820 47 2000V 10 3000V 10 470 220 100 100V 10000 200V 10000 33000 18000 12000 250V 43 (1812) 500V 470 5600 630V 4700 1000V 2000V 3000V 470 47 1800 390 390 100 22000 250V 500V 55 (2220) 6800 630V 10000 10000 1000V 3000V 100000000 1000 33 100V 500V 1000000 10000000 1000 250V 31 (1206) 100000 390 100V 21 (0805) 10000 2200 470 3600 820 - 15 - Multilayer Ceramic Capacitor - High Voltage CLASS , B(X7R) Temperature Characteristics Capacitance Range () Size Voltage 10 10 (0603) 21 (0805) 100V 1000 10000 470 100V 220 200V 220 10000 100V 1000 15000 150000 470 100000 250V 500V 470 1000V 470 2000V 470 33000 3300 1000 2200 220000 68000 500V 42(1808) 3300 6800 1000 470 2000V 1000 100V 100000 200V 43 (1812) 100000 470000 10000 1000V 2000V 47000 22000 250V B(X7R) 250V 150000 500V 10000 1000V 1500 2000V 1000 220000 100000 33000 3300 680000 250V 330000 500V 150000 47000 1000V 2000V 330000 100000 47000 100V 55 (2220) 1000000 10000000 100000000 68000 1000 100V 32 (1210) 100000 10000 250V 200V 31 (1206) 100 3300 1500000 470000 220000 68000 10000 - 16 - Multilayer Ceramic Capacitor - High Voltage RELIABILITY TEST DATA NO ITEM PERFORMANCE 1 APPEARANCE NO ABNORMAL EXTERIOR APPEARANCE 10,000 OR 500* PRODUCT 2 INSULATION WHICHEVER IS SMALLER RESISTANCE (RATED VOLTAGE IS BELOW 16V : 10,000 OR 100*) 3 WITHSTANDING VOLTAGE NO DIELECTRIC BREAKDOWN OR MECHANICAL BREAKDOWN TEST CONDITION THROUGH MICROSCOPE(x10) RATED VOLTAGE SHALL BE APPLIED. MEASUREMENT TIME IS 60 ~ 120sec RATED VOLTAGE TIME 60 SEC. Rated voltage Applied Vr<500Vdc 200% 500VdcVr<1000Vdc 150% 1000VdcVr 120% VOLTAGE APPLIED in 1~5 sec CURRENT APPLIED CLASS WITHIN THE SPECIFIED 4 TOLERANCE CAPACITANCE CLASS 5 Q CLASS LESS THAN 30: Q 400 +20C ( C : CAPACITANCE ) 6 FREQUENCY VOLTAGE 1,000 AND BELOW 110% 0.5 ~ 5 Vrms MORE THAN 1,000 110% 1.00.2Vrms TOLERANCE OVER 30 : Q 1,000 : 50mA BELOW CAPACITANCE WITHIN THE SPECIFIED voltage of Vr of Vr of Vr FREQUENCY VOLTAGE 110% 1.00.2Vrms CAPACITANCE FREQUENCY 1,000 AND BELOW 110% MORE THAN 1,000 110% VOLTAGE 0.5 ~ 5 Vrms Tan CLASS B : 2.5% Max (0.025 Max) FREQUENCY VOLTAGE (DF) C : 0.1% MAx (0.001Max) 1kHz10% 1.00.2Vrms THE TEMPERATURE COEFFICIENT IS CALCULATED IN ppm/ FOR GIVEN TEMPERATURE(T1=25 ,T1=85) TEST STEP Step 7 TEMP. TEMPERATURE() 1 252 COEFFICIENT 2 MIN. OPERATING TEMP.2 CHARACTERISTICS 3 252 4 MAX. OPERATING TEMP.2 5 252 TEMPERATURE C COEFFICIENT 030(ppm/) * MEASURE THE CAPACITANCE IN EACH STEP B CAPACITANCE AT THERMAL EQUILIBRIUM 15% CHANGE A 500g.f PRESSURE SHALL BE NO INDICATION OF PEELING 8 ADHESIVE STRENGTH OF TERMINATION APPLIED FOR 101 SECONDS. OCCUR ON THE TERMINAL ELECTRODE. 500g.f - 17 - Multilayer Ceramic Capacitor - High Voltage ITEM NO PERFORMANCE APPEARANCE TEST CONDITION NO MECHANICAL DAMAGE SHALL BENDING SHALL BE APPLIED TO OCCUR. THE LIMIT(1mm) WITH 0.3mm/SEC. 20 CHANGE OF CHARACTER 9 R=340 CAPACITANCE BENDING 50 WITHIN 5% OR STRENGTH CAPACITANCE 0.5 pF C(C0G) BENDING WHICHEVER IS 451 LARGER LIMIT WITHIN 12.5% B(X7R) MORE THAN 75% OF THE TERMINAL SURFACE IS TO BE SOLDERED NEWLY. THERE MAY BE PINHOLES, SPOTS. BUT THESE MUST NOT BE AT ONE POINT 10 451 SOLDER TEMPERATURE : 2305 IMMERSED DEPTH : 10 ~15 mm SOLDER FLUX : H63A : ROSIN *PB-FREE SOLDER TEMPERATURE : 2605 SOLDERABILITY SOLDER : Sn96.5-3Ag-0.5Cu Flux : RMA TYPE IN PB--FREE PART, MORE THAN 95% OF THE TERMINAL SURFACE IS TO DIP TIME : 30.1Sec PRE-HEATING : AT 80~120 FOR 10~30SEC. BE SOLDERED NEWLY APPEARANCE NO MECHANICAL DAMAGE DIP : SOLDER TEMPERATURE OF 2705 SHALL OCCUR CHARACTERISTIC CAP. CHANGE DIP TIME : 101 SEC. EACH TERMINATION SHALL BE FULLY CLASS WITHIN 2.5% OR IMMERSED AND PREHEATED 0.25 AS FOLLOWING: WHICHEVER IS CAPACITANCE LARGER RESISTANCE 11 WITHIN 7.5% F WITHIN 20% CLASS TO SOLDERING HEAT B Q CLASS Tan CLASS TIME STEP TEMP.() 1 80~100 60 2 150~180 60 (SEC.) 30 AND OVER : Q 1000 LESS THAN 30 : Q 400+20xC TO SATISFY THE SPECIFIED MEASURE AT ROOM TEMP. AFTER INITIAL VALUE COOLING FOR CLASS : 24 2 HOURS INSULATION TO SATISFY THE SPECIFIED RESISTANCE INITIAL VALUE WITHSTANDING VOLTAGE CLASS : 48 4 HOURS TO SATISFY THE SPECIFIED INITIAL VALUE - 18 - Multilayer Ceramic Capacitor - High Voltage NO ITEM PERFORMANCE APPEARANCE CONDITION NO MECHANICAL DAMAGE SHALL OCCUR. THE CAPACITOR SHALL BE CHARACTERISTIC SUBJECTED TO A HARMONIC CAP. CHANGE WITHIN 2.5% OR CAPACITANCE TEST CLASS 0.25 WHICHEVER MOTION HAVING A TOTAL AMPLITUDE OF 1.5mm. IS LARGER CLASS 12 WITHIN 5% THE ENTIRE FREQUENCY RANGE, FROM 10 TO 55Hz AND RETURN VIBRATION Q TEST CLASS Tan CLASS 30 AND OVER : Q 1000 TO 10Hz, SHALL BE TRAVERSED LESS THAN 30 : Q 400+20xC IN 1 MINUTE. TO SATISFY THE SPECIFIED INITIAL VALUE THIS CYCLE SHALL BE PERFORMED 2 HOURS IN EACH THERE INSULATION TO SATISFY THE SPECIFIED MUTUALLY PERPENDICULAR RESISTANCE INITIAL VALUE DIRECTION, FOR TOTAL PERIOD OF 6 HOURS. APPEARANCE NO MECHANICAL DAMAGE SHALL OCCUR CHARACTERISTIC CAPACITANCE CLASS CLASS CAPACITANCE CHANGE WITHIN 5% OR TEMPERATURE 0.5 WHICHEVER RELATIVE HUMIDITY : 90~95 %RH IS LARGER TEST TIME WITHIN 12.5% HUMIDITY 13 (STEADY Q STATE) CLASS 30 AND OVER : Q 350 10 ~30 : Q 275 + 2.5xC LESS THAN 10pF : Q 200 + 10xC Tan B : 5% MAX ( 0.05 MAX) CLASS C : 0.1 MAX (0.001 MAX) INSULATION RESISTANCE : 402 : 500 +12/-0 Hr. MEASURE AT ROOM TEMPERATURE AFTER COOLING FOR CLASS : 242 Hr. CLASS : 484 Hr. MINIMUM INSULATION RESISTANCE: 1,000 OR 50* PRODUCT WHICHEVER IS SMALLER * THE INITIAL VALUE OF HIGH DIELECTRIC CONSTANT SERIES SHALL BE MEASURED AFTER THE HEAT TREATMENT OF 150 +0/-10, 1Hr AND SITTING OF 484hr AT ROOM TEMPERATURE & ROOM HUMIDITY. - 19 - Multilayer Ceramic Capacitor - High Voltage NO ITEM PERFORMANCE APPEARANCE TEST CONDITION NO MECHANICAL DAMAGE SHALL 1KV TO 3KV PRODUCTS ARE NOT OCCUR APPLIED TO THIS TEST WITHOUT CHARACTERIST CAPACITANCE IC CHANGE COATING THE TESTED SAMPLES WITH EPOXY FOR INSULATION WITHIN 7.5% OR CAPACITANCE CLASS 0.75 WHICHEVER IS LARGER CLASS Q CLASS 14 MOISTURE WITHIN 12.5% 30 AND OVER : Q 200 30 AND BELOW : Q 100 + 10/3xC Tan B : 5% MAX ( 0.05 MAX) CLASS C : 0.1 MAX (0.001 MAX) RESISTANCE APPLIED VOLTAGE : RATED VOLTAGE TEMPERATURE : 402 RELATIVE HUMIDITY:90~95%RH TEST TIME : 500 +12/-0 Hr. CURRENT APPLIED : 50 MAX. <INITIAL MEASUREMENT> CLASS SHOULD BE MEASURED INITIAL VALUE AFTER BE HEAT-TREATED FOR 1 HR IN 150 +0/-10 AND BE LEFT FOR 484HR AT ROOM TEMPERATURE. <LATTER MEASUREMENT> INSULATION RESISTANCE MINIMUM INSULATION RESISTANCE: CLASS SHOULD BE MEASURED AFTER 500 OR 25* PRODUCT, LEFT FOR 242 HRS IN ROOM WHICHEVER IS SMALLER. TEMPERATURE AND HUMIDITY. CLASS SHOULD BE MEASURED LATTER VALUE AFTER BE HEAT-TREATED FOR 1 HR IN 150 +0/-10 AND BE LEFT FOR 484HR AT ROOM TEMPERATURE. APPLIED VOLTAGE : APPEARANCE NO MECHANICAL DAMAGE SHALL for Vr<500Vdc,200% OF Vr OCCUR for 500VdcVr<1000Vdc,120% OF Vr for 1000VdcVr, Vr CHARACTERIST IC CAP. CHANGE CURRENT APPLIED : 50 MAX. WITHIN 3% OR CAPACITANCE CLASS 15 TEMP: MAX OPERATING TEMP2 0.3, WHICHEVER IS LARGER HIGH TEST TIME : 1000 +48/-0 Hr. <INITIAL MEASUREMENT> CLASS SHOULD BE MEASURED TEMPERATURE CLASS RESISTANCE WITHIN 12.5% INITIAL VALUE AFTER BE HEAT-TREATED FOR 1 HR IN 150 Q CLASS Tan CLASS INSULATION RESISTANCE 30 AND OVER : Q 350 10 ~ 30 : Q 275 + 2.5xC LESS THAN 10 :Q 200 + 10xC B : 5% MAX (0.05 MAX) C : 0.1% MAX (0.001 MAX) MINIMUM INSULATION RESISTANCE: 1,000 OR 50* PRODUCT WHICHEVER IS SMALLER +0/-10 AND BE LEFT FOR 484HR AT ROOM TEMPERATURE. <LATTER MEASUREMENT> CLASS SHOULD BE MEASURED AFTER LEFT FOR 242 HRS IN ROOM TEMPERATURE AND HUMIDITY. CLASS SHOULD BE MEASURED LATTER VALUE AFTER BE HEAT-TREATED FOR 1 HR IN 150 +0/-10 AND BE LEFT FOR 484HR AT ROOM TEMPERATURE. - 20 - Multilayer Ceramic Capacitor - High Voltage NO ITEM PERFORMANCE APPEARANCE TEST CONDITION NO MECHANICAL DAMAGE SHALL CAPACITORS SHALL BE SUBJECTED OCCUR TO FIVE CYCLES OF THE CHARACTERISTIC CAP. CHANGE WITHIN 2.5% CLASS CAPACITANCE TEMPERATURE CYCLE AS FOLLOWING OR 0.25 WHICHEVER IS STEP TEMP.() LARGER TIME (MIN) MIN. CLASS WITHIN 7.5% 1 RATED TEMP. 30 +0/-3 16 TEMPERATURE Q CYCLE CLASS 30 AND OVER : Q 1000 LESS THAN 30:Q 400 +20xC 2 25 3 RATED TEMP. 2~3 MAX. Tan CLASS TO SATISFY THE SPECIFIED 30 +3/-0 INITIAL VALUE 4 25 2~3 MEASURE AT ROOM TEMPERATURE INSULATION TO SATISFY THE SPECIFIED RESISTANCE INITIAL VALUE AFTER COOLING FOR CLASS : 242 Hr. CLASS : 484 Hr. - 21 - Multilayer Ceramic Capacitor - High Voltage CHARACTERISTIC GRAPH ELECTRICAL CHARACTERISTICS CAPACITANCE - TEMPERATURE CHARACTERISTICS 10 20 C X7R 0 5 % -5 -10 -60 -20 0 20 60 100 -20 C C0G RH SH TH UJ 0 -40 % -60 Y5V -80 -60 140 -20 Temperature() 0 20 40 80 120 Temperature() CAPACITANCE - DC VOLTAGE CHARACTERISTICS CAPACITANCE CHANGE - AGING 40 10 20 C0G 50V 0 C % 0 C0G -10 X7R -20 Y5V X7R -20 C 50V -40 % -60 -80 Y5V -100 50V 0 5 10 15 20 25 30 35 -30 0 40 50 100 1000 DC V o l t a g e (V d c ) 10000 Time(Hr) IMPEDANCE - FREQUENCY CHARACTERISTICS C0G Ohm Ohm 100 100 10 10 X7R/Y5V 0.001 0.01 0.1 1 1 10pF 100pF 0.1 0.1 1000pF 0.01 1.E+06 1MHz 1.E+07 10MHz 1.E+08 100MHz 1.E+09 1GHz 1.E+10 10GHz 0.01 1.E+06 1MHz 1.E+07 10MHz 1.E+08 100MHz 1.E+09 1GHz - 22 - Multilayer Ceramic Capacitor - High Voltage APPLICATION MANUAL Storage Condition Storage Environment The electrical characteristics of MLCCs were degraded by the environment of high temperature or humidity. Therefore, the MLCCs shall be stored in the ambient temperature and the relative humidity of less than 40 and 70%, respectively. Guaranteed storage period is within 6 months from the outgoing date of delivery. Corrosive Gases Since the solderability of the end termination in MLCC was degraded by a chemical atmosphere such as chlorine, acid or sulfide gases, MLCCs must be avoid from these gases. Temperature Fluctuations Since dew condensation may occur by the differences in temperature when the MLCCs are taken out of storage, it is important to maintain the temperature-controlled environment. Design of Land Pattern When designing printed circuit boards, the shape and size of the lands must allow for the proper amount of solder on the capacitor. The amount of solder at the end terminations has a direct effect on the crack. The crack in MLCC will be easily occurred by the tensile stress which was due to too much amount of solder. In contrast, if too little solder is applied, the termination strength will be insufficiently. Use the following illustrations as guidelines for proper land design. Recommendation of Land Shape and Size Solder Resist Solder Resist T W Solder Land b a 2/3W < b < W 2/3T < a < T Adhesives When flow soldering the MLCCs, apply the adhesive in accordance with the following conditions. Requirements for Adhesives They must have enough adhesion, so that, the chips will not fall off or move during the handling of the circuit board. They must maintain their adhesive strength when exposed to soldering temperature. They should not spread or run when applied to the circuit board. They should harden quickly. They should not corrode the circuit board or chip material. - 23 - Multilayer Ceramic Capacitor - High Voltage They should be a good insulator. They should be non-toxic, and not produce harmful gases, nor be harmful when touched. Application Method It is important to use the proper amount of adhesive. Too little and much adhesive will cause poor adhesion and overflow into the land, respectively. Adhesive hardening Characteristics To prevent oxidation of the terminations, the adhesive must harden at 160 or less, within 2 minutes or less. Mounting Mounting Head Pressure Excessive pressure will cause crack to MLCCs. The pressure of nozzle will be 300g maximum during mounting. Bending Stress When double-sided circuit boards are used, MLCCs first are mounted and soldered onto one side of the board. When the MLCCs are mounted onto the other side, it is important to support the board as shown in the illustration. If the circuit board is not supported, the crack occur to the ready-installed MLCCs by the bending stress. nozzle force support pin Flux Although the solderability increased by the highly-activated flux, increase of activity in flux may also degrade the insulation of the chip capacitors. To avoid such degradation, it is recommended that a mildly activated rosin flux(less than 0.2% chlorine) be used. - 24 - Multilayer Ceramic Capacitor - High Voltage Soldering Since a multilayer ceramic chip capacitor comes into direct contact with melted solder during soldering, it is exposed to potentially mechanical stress caused by the sudden temperature change. The capacitor may also be subject to silver migration, and to contamination by the flux. Because of these factors, soldering technique is critical. Soldering Methods Method Classification - Overall heating - Infrared rays - Hot plate - VPS(vapor phase) - Local heating - Air heater - Laser - Light beam Reflow soldering - Single wave - Double wave Flow soldering - * We recommend the reflow soldering method. Soldering Profile To avoid crack problem by sudden temperature change, follow the temperature profile in the adjacent graph. preheating soldering cooling 300 300 250 250 200 200 150 150 100 100 50 50 preheating soldering cooling T150 60~120sec 10~20sec Reflow Soldering 60~120sec 3~4sec Flow Soldering Manual Soldering Manual soldering can pose a great risk of creating thermal cracks in chip capacitors. The hot soldering iron tip comes into direct contact with the end terminations, and operator's carelessness may cause the tip of the soldering iron to come into direct contact with the ceramic body of the capacitor. Therefore the soldering iron must be handled carefully, and close attention must be paid to the selection of the soldering iron tip and to temperature control of the tip. - 25 - Multilayer Ceramic Capacitor - High Voltage Amount of Solder Too much Solder Cracks tend to occur due to large stress Weak holding force may Not enough cause bad connections or Solder detaching of the capacitor Good Cooling Natural cooling using air is recommended. If the chips are dipped into solvent for cleaning, the temperature difference(T) must be less than 100 6-6. Cleaning If rosin flux is used, cleaning usually is unnecessary. When strongly activated flux is used, chlorine in the flux may dissolve into some types of cleaning fluids, thereby affecting the chip capacitors. This means that the cleaning fluid must be carefully selected, and should always be new. Notes for Separating Multiple, Shared PC Boards. A multi-PC board is separated into many individual circuit boards after soldering has been completed. If the board is bent or distorted at the time of separation, cracks may occur in the chip capacitors. Carefully choose a separation method that minimizes the bending of the circuit board. - 26 - Multilayer Ceramic Capacitor - High Voltage CROSS REFERENCE P/N COMPANY COMPANY SIZE (EIA/JIS) MODEL(MLCC) TAIYO SAMSUNG AVX JOHANSON KEMET KYOCERA MURATA NOVACAP PANASONIC ROHM TDK VITRAMON CL - - C CM GRM - ECJ MCH MK C VJ - YUDEN 0201(0603) 03 - - - 03 33 - Z - 063 0603 - 0402(1005) 05 0402 R07 0402 05 36 0402 0 15 105 1005 0402 0603(1608) 10 0603 R14 0603 105 39 0603 1 18 107 1608 0603 0805(2012) 21 0805 R15 0805 21 40 0805 2 21 212 2012 0805 1206(3216) 31 1206 R18 1206 316 42-6 1206 3 31 316 3216 1206 1210(3225) 32 1210 S41 1210 32 42-2 1210 4 32 325 3225 1210 1808(4520) 42 1808 R29 1808 42 - 1808 - - - 4520 1808 1812(4532) 43 1812 S43 1812 43 43-2 1812 - 43 432 4532 1812 2220(5750) 55 - - 2220 55 44-1 2221 - - 550 5650 - COG(NPO) C A N G CG COG/CH N C A C COG/CH A P2H(N150) P S - - P P2H - P - P PH - R2H(N220) R 1 - - R R2H - R - R RH - S2H(N330) S 3 - - S S2H - S - S SH - T2H(N470) T O - - T T2H - T - T TH - U2J(N750) U Z - - U U2J - U UJ U UJ - S2L L Y - - SL SL - G SL SL SL - X7R B C W R(X) X7R X7R B B C BJ X7R(B) Y(X) Z5U E E Z U - Z5U Z - E - Z5U U Y5V F G Y V Y5V Y5V Y F F F Y5V - TEMPERATURE CHARACTERISTIC NOMINAL CAPACITANCE EX) 103=10,000 CAPACITANCE TOLERANCE RATED VOLTAGE B:0.1 C:0.25 221=220 D:0.5 225=2,200,000=2.2 F:1% G:2% J:5% 1R5=1.5 K:10% 010=1 M:20% Z:-20~+80% 6.3V Q 6 - 9 06 6.3 - 0J - J 0J - 10 V P Z 100 8 10 10 - 1A 4 L 1A - 16 V O Y 160 4 16 16 160 1C 3 E 1C J 25 V A 3 250 3 25 25 250 1E 2 T 1E X 50 V B 5 500 5 50 50 500 1H 5 U 1H A 100 V C 1 101 1 100 100 101 2A 1 - 2A B 200V D 2 201 2 200 200 201 2D - - - C 250V E V - - 250 250 251 - - - 2E - 500V G 7 501 - 500 500 501 - - - - E 630V H - - - 630 630 - - - - 2J - 1000V I A 102 - 1000 1K 102 - - - 3A G 2000V J G 202 - 2000 2K 202 - - - 3D - 3000V K H 302 - 3000 3K 302 - - - 3F H 4000V - J - 4000 - 402 - - - - - NICKEL BARRIER N T V C A (GRM) N - (MCH) - - X Ag/Pd P 1 - - B (GR) P - (MC) - - F TERMINATION BULK(VINYL) B 9 (NONE) - B PB * X - B B B PAPER TAPING C 2, 4 T, R - T, L PT T E,V,W K, L T T C, P PLASTIC TAPING E 1, 3 E, U - H, N PT - F, Y P, Q T - T, R BULK CASE P 7 - - C PC - C C - - G PACKAGE - 27 - Multilayer Ceramic Capacitor - High Voltage SAMSUNG : CL10B104KA8NNNC CL 10 Series Size Dielectric Capacitance Tolerance = = = = = = = = C P R S T U L B A F 2 significant figures + number of zeros Use "R" for decimal point A = 0.05pF B = 0.1pF C = 0.25pF D = 0.5pF F = 1% G = 2% J = 5% K = 10% M = 20% 03 05 10 21 31 32 43 55 B 0201 0402 0603 0805 1206 1210 1812 2220 = = = = = = = = = = 104 C0G P2H R2H S2H T2H U2H S2L X7R X5R Y5V K A Z = +80,-20% 8 N Voltage Thickness Q = 6.3V P = 10V O = 16V A = 25V B = 50V C = 100V D = 200V E = 250V G = 500V H = 630V I = 1000V 3 = 0.30 5 = 0.50 8 = 0.80 A = 0.65 C = 0.85 H = 1.60 I = 2.00 J = 2.50 L = 3.20 Electrode/ Termination/ Plating A = Pd/Ag/ Sn 100% N = Ni/Cu/ Sn 100% G = Cu/Cu/ Sn 100% N N C Products Special Packaging A = Array Various (2-element) B = Array (4-element) C = High - Q L = LICC N = Normal P = Automotive W = 3 terminal chip B P C D = = = = Bulk Cassette Paper 7" Paper 13" (10,000EA) E = Embossing 7" F = Embossing 13" L = Paper 13" (15,000EA) O = Paper 10" S = Embossing 10" AVX : 06033C104KAT2A 0603 3 C Size Voltage 0201 4 = 4V 6 = 6.3V Z = 10V Y = 16V 3 = 25V B = 50V C = 100V D = 200V E = 250V G = 500V I = 1000V 0402 0603 0805 1206 1210 1812 2220 2225 104 K A T Dielectric Capacitance Tolerance Failure Rate A C D E G 2 significant figures + number of zeros Use "R" for decimal point B = 0.1pF C = 0.25pF D = 0.5pF F = 1% G = 2% J = 5% K = 10% M = 20% A = N/A = = = = = C0G X7R X5R Z5U Y5V 2 A Packaging Termination 2 4 7 9 T = Sn 100% 7 = Gold Plated 1 = Pd/Ag = = = = 7" Reel 13" Reel Cassette Bulk Special A T S R = = = = Standard 0.66mm 0.56mm 0.46mm Z = +80, -20% P = GMV,+100,-0% JOHANSON : 250R14W104KV6T 250 R14 Voltage 2 significant figures + number of zeros Size Dielectric R07 = 0402 R14 R15 R18 S41 S43 S47 S48 S49 S54 = = = = = = = = = W 0603 0805 1206 1210 1812 2220 2225 1825 3640 N = C0G W = X7R X = X5R Z = Z5U Y = Y5V 104 K V Capacitance Tolerance Termination 2 significant figures + number of zeros Use "R" for decimal point B = 0.1pF C = 0.25pF D = 0.5pF F = 1% G = 2% J = 5% K = 10% M = 20% 6 T Marking V = Ni Barrier Packaging 4 = No Mark 6 = Marking E = 7" Reel Plastic T = 7" Reel Paper R = 13" Reel Paper U = 13" Reel Plastic None = Bulk A Z = +80, -20% P = GMV,+100,-0% KEMET : C0603C104K3RAC C Series 0603 Size 0402 0603 0805 1206 1210 1812 2220 2225 C Specification C = Standard A = GR900 P = Mil-C-55681 CDR01-CDR06 N = Mil-C-55681 CDR31-CDR35 Z = Mil-C-123 E = Mil Equivalent (Group A Only) 104 K 3 R Capacitance Tolerance Voltage Dielectric Failure Rate 2 significant figures + number of zeros Use "R" for decimal point B = 0.1pF C = 0.25pF D = 0.5pF F = 1% G = 2% J = 5% K = 10% M = 20% G R P U X V A M P R S 9 8 4 3 5 1 2 = = = = = = = 6.3V 10V 16V 25V 50V 100V 200V = = = = = = C0G X7R X5R Z5U BX(Mil) Y5V = = = = = Standard 1.0 (Mil) 0.1 (Mil) 0.01 (Mil) 0.001 (Mil) C Termination C H T G = = = = Ni w/Tin Plate Ni w/Solder Silver Gold Plated Z = +80, -20% P = +100, 0% - 28 - Multilayer Ceramic Capacitor - High Voltage KYOCERA : CM105X7R104K25AT CM 105 X7R 104 Series K 25 Size Dielectric Capacitance Tolerance 03 = 0201 05 = 0402 105 = 0603 21 = 0805 316 = 1206 32 = 1210 42 = 1808 43 = 1812 55 = 2220 CG X8R X7R X5R Z5U Y5V Y5U 2 significant figures + number of zeros Use "R" for decimal point B = 0.1pF C = 0.25pF D = 0.5pF F = 1% G = 2% J = 5% K = 10% M = 20% A Voltage Z = +80, -20% P = +100, 0% T Termination 04 = 4V 06 = 6.3V 10 = 10V 16 = 16V 25 = 25V 50 = 50V 100 = 100V 250 = 250V 500 = 500V 1000 = 1000V Packaging A = Ni Barrier T L H N B C = = = = = = 7" Reel (4mm Pitch) 13" Reel (4mm Pitch) 7" Reel (2mm Pitch) 13" Reel (2mm Pitch) Bulk (Vinyl Bags) Bulk Cassette MURATA : GRM188R71E104KA01D GRM 18 8 R7 1E 104 K A01 Series Size Thickness Dielectric Voltage Capacitance Tolerance Ni Barrier 03 = 0201 3 = 0.3mm 5 = 0.5mm 8 = 0.8mm A = 1.0mm B = 1.25mm C = 1.6mm D = 2.0mm E = 2.5mm F = 3.2mm 2 significant figures + number of zeros Use "R" for decimal point B = 0.1pF C = 0.25pF D = 0.5pF F = 1% G = 2% J = 5% K = 10% M = 20% Individual Specification Code 15 18 21 31 32 42 43 55 = = = = = = = = 0402 0603 0805 1206 1210 1808 1812 2220 5C R7 R6 E4 F5 = = = = = C0G X7R X5R Z5U Y5V 0J = 6.3V 1A = 10V 1C = 16V 1E = 25V 1H = 50V 2A = 100V 2E = 250V 2H = 500V 3A = 1000V D Packaging D = 7" Reel Paper L = 7" Reel Plastic J = 13" Reel Paper K = 13" Reel Plastic B = Bulk C = Bulk Cassette T = Bulk Tray Z = +80,-20% P = +100, 0% NOVACAP : 0603B104K250N_TM 1206 B 104 K 250 N Size Dielectric Capacitance Tolerance Voltage Termination Thickness 0402 0603 0805 1005 1206 1210 1808 1812 2220 N B X Z Y 2 significant figures + number of zeros Use "R" for decimal point B = 0.1pF C = 0.25pF D = 0.5pF F = 1% G = 2% J = 5% K = 10% M = 20% 2 significant figures + number of zeros P = Pd/Ag N = Ni Barrier (Sn 100%) Y = Ni Barrier (Sn/Pb) Per Specified = = = = = C0G X7R BX Z5U Y5V - T Packaging M Marking T = Reel None = Bulk W = Waffle Pack Z = +80,-20% P = +100, 0% PANASONIC : ECJ1EB1E104K ECJ 1 Series Size Z 0 1 2 3 4 = = = = = = 0201 0402 0603 0805 1206 1210 E Packaging X = Bulk E = Paper 2mm V = Paper 4mm F, Y = Plastic 4mm W = Large Reels 2mm Z = Large Reels 4mm C = Bulk Cassette B Dielectric C = C0G B = X7R, X5R F = Y5V 1E 104 K Voltage Capacitance Tolerance 0J = 6.3V 1A = 10V 1C = 16V 1E = 25V 1H = 50V 2A = 100V 2D = 200V 2 significant figures + number of zeros Use "R" for decimal point C = 0.25pF D = 0.5pF F = 1% J = 5% K = 10% M = 20% Z = +80, -20% - 29 - Multilayer Ceramic Capacitor - High Voltage ROHM : MCH182C104KKN MCH 18 2 Series Size Voltag e 15 18 21 31 32 43 = = = = = = 0402 0603 0805 1206 1210 1812 4 3 2 5 = = = = C 10V 16V 25V 50V 104 K K Dielectric Capacitance Tolerance A = C0G C = X7R F = Y5V 2 significant figures + number of zeros Use "R" for decimal point B = 0.1pF C = 0.25pF D = 0.5pF F = 1% G = 2% J = 5% K = 10% M = 20% N Packaging Marking/Thickness K = 7" Reel Paper P = 7" Reel Plastic L = 13" Reel Paper Q = 13" Reel Plastic B = Bulk C = Bulk Cassette N = Marked Special Thickness Z = +80,-20% P = +100, 0% TAIYO-YUDEN : TMK107BJ104K_T T M K 107 Voltage Type Termination Size A = 4V J = 6.3V L = 10V E = 16V T = 25V U = 50V M = Multilayer V = Hi Q K = Ni Barrier 105 107 212 316 325 432 550 = = = = = = = BJ 0402 0603 0805 1206 1210 1812 2220 104 K - T Dielectric Capacitance Tolerance Special Packaging CG = C0G CH = C0H CJ = C0J CK = C0K BJ = X5R, X7R F = Y5V 2 significant figures + number of zeros Use "R" for decimal point C = 0.25pF D = 0.5pF F = 1% G = 2% J = 5% K = 10% M = 20% Various T = Reel B = Bulk Z = +80,-20% TDK : C1608X7R1E104KT C Series 1608 X7R 1E 104 Size Dielectric Voltage Capacitance Tolerance Packaging CG X7R Z5U Y5V 0J = 6.3V 1A = 10V 1C = 16V 1E = 25V 1H = 50V 2 significant figures + number of zeros Use "R" for decimal point C = 0.25pF D = 0.5pF F = 1% G = 2% J = 5% K = 10% M = 20% T = Reel B = Bulk 0603 1005 1608 2012 3216 3225 4532 5650 = = = = = = = = 0201 0402 0603 0805 1206 1210 1812 2220 K T Z = +80, -20% VITRAMON : VJ0603Y104KXXMC VJ 0603 Y Series Size Dielectric Capacitance Tolerance 0402 0603 0805 1206 1210 1812 2225 X = A,N Y = U = H = 2 significant figures + number of zeros Use "R" for decimal point B = 0.1pF C = 0.25pF D = 0.5pF F = 1% G = 2% J = 5% K = 10% M = 20% BX = C0G X7R Z5U X8R 104 K X Termination X = Silver, Ni Barrier Tin Plated X M Voltage Marking J = 16V X = 25V A = 50V B = 100V C = 200V M = Marking A = No Marking C Packaging C T P R B = = = = = 7" Reel Paper 7" Reel Plastic 13" Reel Paper 13" Reel Plastic Bulk Z = +80, -20% P = +100, 0% - 30 -