RP131x SERIES LOW ON RESISTANCE / LOW VOLTAGE 1A LDO NO.EA-174-180711 OUTLINE The RP131x Series are voltage-regulators with a built-in low ON-resistance transistor and output current is 1A capability. These ICs are capable of the low input voltage (Min.1.6V) and also the minimum output voltage can be set from 0.8V. (The output voltage is fixed in the IC.) Each of these ICs consists of a voltage reference unit, an error amplifier, a resistor net for setting output voltage, a chip enable circuit, current limit circuits for over-current and short, and a thermal-shutdown circuit. A standby mode with ultra low supply current can be realized with the chip enable function. The packages for these ICs are DFN1616-6B and DFN(PLP)1820-6 which are suitable for high density mounting of the ICs on boards. SOT-89-5, HSOP-6J and TO-252-5-P2 with high power dissipation are also available. FEATURES Output Current ............................................................ Min. 1A Supply Current ............................................................. Typ. 65A Standby Current ......................................................... Typ. 0.15A Input Voltage Range ................................................... 1.6V to 6.5V Output Voltage Range .................................................. 0.8V to 5.5V (1)(0.1V steps) Dropout Voltage............................................................ Typ. 0.5V (VOUT2.8V, IOUT1A) Ripple Rejection ........................................................... Typ. 70dB (f1kHz, VOUT2.8V) Output Voltage Accuracy .............................................. 1.0% Temperature-Drift Coefficient of Output Voltage .......... Typ. 100ppm/C Line Regulation ............................................................ Typ. 0.05%/V Load Regulation ......................................................... Typ. 20mV at IOUT300mA, Typ. 80mV at IOUT1A Packages ................................................................... DFN1616-6B, DFN(PLP)1820-6, SOT-89-5, HSOP-6J, TO-252-5-P2 Built-in Inrush current limit circuit ............................... Typ. 500mA Built-in Fold-Back Protection Circuit ........................... Typ. 250mA (Current at short mode) Built-in Thermal Shutdown Circuit .............................. Thermal Shutdown Temperature ; Typ. 165C Released Temperature ; Typ. 135C Built-in Auto Discharge Function ................................ D version Ceramic capacitors are recommended to be used with this IC .... 2.2F or more (VOUT3.6V) 4.7F or more (VOUT3.6V) APPLICATIONS (1) Power source for battery-powered equipment. Power source for portable communication equipment. Power source for electrical appliances such as cameras, VCRs and camcorders. Power source for Notebook PC. Power source for home appliances. For other voltages, please refer to MARK INFORMATIONS. 1 RP131x NO.EA-174-180711 SELECTION GUIDE The output voltage, auto discharge function, package for the ICs can be selected at the user's request. Product Name Package Quantity per Reel Pb Free Halogen Free RP131Lxx1-TR DFN1616-6B 5,000 pcs Yes Yes RP131Kxx1-TR DFN(PLP)1820-6 5,000 pcs Yes Yes RP131Hxx1-T1-FE SOT-89-5 1,000 pcs Yes Yes RP131Sxx1-E2-FE HSOP-6J 1,000 pcs Yes Yes RP131Jxx1-T1-FE TO-252-5-P2 3,000 pcs Yes Yes xx : The output voltage can be designated in the range from 0.8V(08) to 5.5V(55) in 0.1V steps. (For other voltages, please refer to MARK INFORMATIONS.) : The auto discharge function at off state are options as follows.(1) (B) without auto discharge function at off state (D) with auto discharge function at off state BLOCK DIAGRAMS RP131xxx1B VDD RP131xxx1D VOUT VDD Vref Vref Current Limit Thermal Shutdown CE (1) 2 VOUT Current Limit Thermal Shutdown GND CE GND Auto-discharge function quickly lowers the output voltage to 0V, when the chip enable signal is switched from the active mode to the standby mode, by releasing the electrical charge accumulated in the external capacitor. RP131x NO.EA-174-180711 PIN DESCRIPTIONS Top View 6 5 Top View Bottom View 4 4 5 6 6 5 Bottom View 4 4 2 3 3 2 1 1 2 DFN1616-6B 5 1 2 6 2 1 1 5 3 3 DFN(PLP)1820-6 4 6 5 4 3 1 2 3 1 SOT-89-5 HSOP-6J 2 3 4 5 TO-252-5-P2 Tab is GND level. (They are connected to the reverse side of this IC.) The tab is better to be connected to the GND, but leaving it open is also acceptable. RP131L (DFN1616-6B) Pin Description Pin No. Symbol Pin Description (1) 1 VOUT Output Pin 2 VOUt Output Pin 3 GND Ground Pin 4 CE 5 VDD Input Pin 6 VDD Input Pin Chip Enable Pin ("H" Active) (1) When you use this IC, please make sure be wired with 1pin with 2pin and 5pin with 6pin. 3 RP131x NO.EA-174-180711 RP131K (DFN(PLP)1820-6) Pin Description Pin No. Symbol Pin Description (1) 1 VOUT Output Pin 2 VOUT Output Pin 3 GND Ground Pin 4 CE 5 VDD Input Pin 6 VDD Input Pin Chip Enable Pin ("H" Active) RP131H (SOT-89-5) Pin Description Pin No. Symbol 1 NC 2 GND 3 CE 4 VDD 5 VOUT Pin Description No Connection Ground Pin Chip Enable Pin ("H" Active) Input Pin Output Pin RP131S (HSOP-6J) Pin Description Pin No. Symbol Pin Description 1 VOUT Output Pin 2 GND Ground Pin(2) 3 NC No Connection 4 CE Chip Enable Pin ("H" Active) 5 GND Ground Pin 6 VDD Input Pin RP131J (TO-252-5-P2) Pin Description Pin No. Symbol Pin Description 1 VOUT Output Pin 2 GND Ground Pin(3) 3 GND Ground Pin 4 CE Chip Enable Pin ("H" Active) 5 VDD Input Pin (1) When you use this IC, please make sure be wired with 1pin with 2pin and 5pin with 6pin. When you use this IC, please make sure be wired with 2pin and 5pin. (3) When you use this IC, please make sure be wired with 2pin and 3pin. (2) 4 RP131x NO.EA-174-180711 ABSOLUTE MAXIMUM RATINGS Symbol Item VIN Input Voltage VCE Input Voltage (CE Pin) VOUT Output Voltage PD Power Dissipation (1) Rating Unit 7.0 V 0.3 to 7.0 V 0.3 to VIN0.3 V DFN1616-6B, JEDEC STD.51-7 2400 DFN(PLP)1820-6, JEDEC STD.51-7 2200 SOT-89-5, JEDEC STD.51-7 2600 HSOP-6J, JEDEC STD.51-7 2700 TO-252-5-P2, JEDEC STD.51-7 3800 mW Tj Junction Temperature Range 40 to 125 C Tstg Storage Temperature Range 55 to 125 C ABSOLUTE MAXIMUM RATINGS Electronic and mechanical stress momentarily exceeded absolute maximum ratings may cause the permanent damages and may degrade the life time and safety for both device and system using the device in the field. The functional operation at or over these absolute maximum ratings is not assured. RECOMMENDED OPERATING CONDITIONS Symbol VIN Ta Item Input Voltage Operating Temperature Range Rating 1.6 to 6.5 -40 to 85 Unit V C RECOMMENDED OPERATING CONDITIONS All of electronic equipment should be designed that the mounted semiconductor devices operate within the recommended operating conditions. The semiconductor devices cannot operate normally over the recommended operating conditions, even if when they are used over such ratings by momentary electronic noise or surge. And the semiconductor devices may receive serious damage when they continue to operate over the recommended operating conditions. (1) Refer to POWER DISSIPATION for detailed information. 5 RP131x NO.EA-174-180711 ELECTRICAL CHARACTERISTICS VINSet VOUT1V, IOUT1mA The specification in is checked and guaranteed by design engineering at -40CTa85C, unless otherwise noted. RP131xxx1B/D Symbol (Ta 25C) Item Conditions Ta 25C VOUT Output Voltage 40C Ta t 85C Max. Unit VOUT>1.5V 0.99 1.01 V VOUT1.5V 15 15 mV VOUT>1.5V 0.974 1.018 V VOUT1.5V 40 27 mV 20 40 0.1mA IOUT 1A 80 120 65 90 A VCE0V, VIN6.5V 0.15 0.60 A Line Regulation Set VOUT0.5V VIN 6.5V However, VIN 1.6V 0.05 0.1 %/V Ripple Rejection f1kHz Ripple 0.2Vp-p IOUT100mA Load Regulation VDIF Dropout Voltage ISS Supply Current IOUT0mA (VIN6.5V) Istandby Standby Current VOUT/ VIN VIN Input Voltage ILIM Output Current Limit VOUT/ Ta Typ. 0.1mA IOUT 300mA VOUT/ IOUT RR Min. mV Refer to the following table VOUT3.3V 70 dB VOUT>3.3V 60 1.6 6.5 V A 1 Output Voltage Temperature Coefficient 40CTa85C 100 ppm /C ISC Short Current Limit VOUT0V 250 mA IPD CE Pull-down Current 0.3 A VCEH CE Input Voltage "H" VCEL CE Input Voltage "L" en TTSD TTSR RLOW Output Noise Thermal Shutdown Temperature Thermal Shutdown Released Temperature Low Output Nch Tr. ON Resistance (of D version) V 1.0 0.4 V BW10Hz to 100kHz, IOUT1mA 45 Vrms Junction Temperature 165 C Junction Temperature 135 C VIN4.0V, VCE0V 30 All test items listed under Electrical Characteristics are done under the pulse load condition (TjTa = 25C) except for Output Noise, Ripple Rejection, Output Voltage Temperature Coefficient, Dropout Voltage at 1A Output Current and Thermal Shutdown items. 6 RP131x NO.EA-174-180711 The specification in otherwise noted. is checked and guaranteed by design engineering at -40C Ta 85C, unless Dropout Voltage Output Voltage VOUT (V) (Ta 25C) Dropout Voltage VDIF (V) Typ. Max. Typ. Max. 0.8 VOUT < 0.9 0.600 0.780 1.100 1.650 0.9 VOUT < 1.0 0.550 0.690 1.050 1.500 1.0 VOUT < 1.1 0.450 0.610 1.000 1.450 0.340 0.540 0.930 1.420 0.290 0.500 0.900 1.380 1.5 VOUT < 2.6 0.230 0.310 0.700 1.100 2.6 VOUT < 3.3 0.150 0.180 0.500 0.750 3.3 VOUT 5.5 0.140 0.170 0.450 0.650 1.1 VOUT < 1.2 1.2 VOUT < 1.5 Condition IOUT300mA Condition IOUT1A 7 RP131x NO.EA-174-180711 APPLICATION INFORMATION Typical Application Circuits VOUT VDD VOUT RP131x Series CIN CE COUT GND CE Control Recommendation value of the external capacitors Capacitors VOUT VOUT 3.6V VOUT > 3.6V CIN COUT CIN COUT Kyocera 2.2F (size:1005) Kyocera 2.2F (size:1608) Kyocera 2.2F (size:1608) Kyocera 4.7F (size:1608) [CM05X5R225M06AB] [CM105X5R225K06AB] [CM105X5R225K06AB] [CM105X5R475M06AB] Technical Notes on the External Components When using this IC, consider following points: Phase Compensation In these ICs, phase compensation is made for securing stable operation even if the load current is varied. For this purpose, use a capacitor COUT with good frequency characteristics and ESR (Equivalent Series Resistance). If a tantalum capacitor is used, and its ESR of COUT is large, the loop oscillation may result. Because of this, select COUT carefully considering its frequency characteristics. PCB Layout Make VDD and GND lines sufficient. If their impedance is high, noise pickup or unstable operation may result. Connect a capacitor CIN between VDD and GND pin with a capacitance value as "Recommendation value of the external capacitors" above or more, and as close as possible to the pins. Set external components, especially the output capacitor COUT, as close as possible to the ICs, and make wiring as short as possible. 8 RP131x NO.EA-174-180711 TEST CIRCUITS VDD VOUT RP131x Series CIN CE COUT V VOUT IOUT GND CE Control Basic Test Circuit VOUT VDD VOUT A RP131x Series CIN ISS CE COUT GND CE Control Test Circuit for Supply Current Pulse Generator VDD VOUT RP131x Series P.G. CE CE Control COUT IOUT GND Test Circuit for Ripple Rejection VOUT VDD VOUT RP131x Series CIN CE COUT GND CE Control IOUTa IOUTb Test Circuit for Load Transient Response 9 RP131x NO.EA-174-180711 TYPICAL CHARACTERISTICS Typical Characteristics are intended to be used as reference data; they are not guaranteed. 1) Output Voltage vs. Output Current (Ta 25C) RP131x081x RP131x151x 1.6 Output Voltage VOUT (V) Output Voltage VOUT (V) 0.9 0.8 0.7 0.6 0.5 0.4 VIN=1.4V VIN=1.6V VIN=2.0V VIN=2.5V VIN=2.8V 0.3 0.2 0.1 0 0 0.5 1.0 1.5 Output Current IOUT (A) 1.4 1.2 VIN=2.0V VIN=2.5V VIN=3.5V 1.0 0.8 0.6 0.4 0.2 0 0 2.0 0.5 1.0 1.5 Output Current IOUT (A) RP131x331x RP131x501x Output Voltage VOUT (V) Output Voltage VOUT (V) 3.5 3.0 2.5 VIN=3.6V VIN=4.3V VIN=5.0V 2.0 1.5 1.0 0.5 0 0 2.0 0.5 1.0 1.5 Output Current IOUT (A) 5.5 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0 VIN=5.3V VIN=6.0V 0 2.0 0.5 1.0 1.5 Output Current IOUT (A) 2.0 2) Output Voltage vs. Input Voltage (Ta25C) IOUT=1mA IOUT=50mA IOUT=100mA IOUT=300mA 1.5 1.2 0.9 IOUT=1mA IOUT=50mA IOUT=100mA IOUT=300mA 0.6 0.3 0 0 10 RP131x151x 1.8 Output Voltage VOUT (V) Output Voltage VOUT (V) RP131x081x 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 1 2 3 4 5 Input Voltage VIN (V) 6 0 1 2 3 4 5 Input Voltage VIN (V) 6 RP131x NO.EA-174-180711 RP131x331x RP131x501x 6 3.0 2.5 2.0 1.5 IOUT=1mA IOUT=50mA IOUT=100mA IOUT=300mA 1.0 0.5 Output Voltage VOUT (V) Output Voltage VOUT (V) 3.5 0 5 4 3 IOUT=1mA IOUT=50mA IOUT=100mA IOUT=300mA 2 1 0 0 1 2 3 4 5 Input Voltage VIN (V) 6 0 1 2 3 4 5 Input Voltage VIN (V) 6 3) Supply Current vs. Input Voltage (Ta25C) RP131x151x 70 60 60 Supply Current ISS (A) Supply Current ISS (A) RP131x081x 70 50 40 30 20 10 0 50 40 30 20 10 0 0 1 2 3 4 5 Input Voltage VIN (V) 6 0 1 6 RP131x501x 70 70 60 60 Supply Current ISS (A) Supply Current ISS (A) RP131x331x 2 3 4 5 Input Voltage VIN (V) 50 40 30 20 10 0 50 40 30 20 10 0 0 1 2 3 4 5 Input Voltage VIN (V) 6 0 1 2 3 4 5 Input Voltage VIN (V) 6 11 RP131x NO.EA-174-180711 4) Output Voltage vs. Temperature RP131x281x 0.83 1.53 0.82 1.52 Output Voltage VOUT (V) Output Voltage VOUT (V) RP131x081x 0.81 0.80 0.79 0.78 0.77 0.76 -40 -25 0 25 50 Temperature Topt (C) 1.51 1.50 1.49 1.48 1.47 1.46 -40 -25 75 85 5.06 3.34 5.04 3.32 3.30 3.28 3.26 3.24 3.22 3.20 -40 -25 0 25 50 Temperature Topt (C) 75 85 RP131x501x 3.36 Output Voltage VOUT (V) Output Voltage VOUT (V) RP131x331x 0 25 50 Temperature Topt (C) 5.02 5.00 4.98 4.96 4.94 4.92 4.90 -40 -25 75 85 0 25 50 Temperature Topt (C) 75 85 5) Supply Current vs. Temperature 80 80 70 60 50 40 30 20 10 0 -40 -25 12 RP131x151x 90 Supply Current ISS (A) Supply Current ISS (A) RP131x081x 90 0 25 50 Temperature Topt (C) 75 85 70 60 50 40 30 20 10 0 -40 -25 0 25 50 Temperature Topt (C) 75 85 RP131x NO.EA-174-180711 RP131x501x 90 90 80 80 Supply Current ISS (A) Supply Current ISS (A) RP131x331x 70 60 50 40 30 20 10 0 -40 -25 0 25 50 Temperature Topt (C) 70 60 50 40 30 20 10 0 -40 -25 75 85 0 25 50 Temperature Topt (C) 75 85 6) Dropout Voltage vs. Output Current RP131x081x RP131x151x 1.4 1.2 1.0 1.4 85C 25C - 40C 0.8 0.6 0.4 0.2 Dropout Voltage VDIF (V) Dropout Voltage VDIF (V) 1.6 0 1.2 1.0 0.8 0.6 0.4 0.2 0 0 100 200 300 400 500 600 700 800 900 1000 Output Current IOUT (mA) 0 100 200 300 400 500 600 700 800 900 1000 Output Current IOUT (mA) RP131x331x RP131x501x 1.0 1.4 85C 25C - 40C 0.8 0.6 0.4 0.2 0 Dropout Voltage VDIF (V) Dropout Voltage VDIF (V) 1.4 1.2 85C 25C - 40C 1.2 1.0 85C 25C - 40C 0.8 0.6 0.4 0.2 0 0 100 200 300 400 500 600 700 800 900 1000 Output Current IOUT (mA) 0 100 200 300 400 500 600 700 800 900 1000 Output Current IOUT (mA) 13 RP131x NO.EA-174-180711 Dropout Voltage VDIF (V) 7) Dropout Voltage vs. Set Output Voltage 1.2 1.1 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 0.5 IOUT=1A IOUT=800mA IOUT=600mA IOUT=400mA IOUT=200mA IOUT=100mA IOUT=50mA IOUT=10mA IOUT=1mA IOUT=0mA 1.5 2.5 3.5 4.5 Set Output Voltage VREG (V) 5.5 8) Ripple Rejection vs. Input Bias Voltage (C1none, C2Ceramic 1.0F, Ripple0.2Vp-p, Ta25C) RP131x331x RP131x331x IOUT=30mA 80 80 70 70 Ripple Rejection RR (dB) Ripple Rejection RR (dB) IOUT=1mA 60 50 40 30 f=0.2kHz f=1kHz f=10kHz f=100kHz 20 10 0 3.0 3.5 4.0 4.5 5.0 5.5 6.0 Input Voltage VIN (V) 60 50 40 30 10 0 3.0 6.5 RP131x331x 70 80 14 Ripple Rejection RR (dB) Ripple Rejection RR (dB) 90 60 50 40 30 0 3.0 f=0.2kHz f=1kHz f=10kHz f=100kHz 3.5 4.0 4.5 5.0 5.5 6.0 Input Voltage VIN (V) 6.5 IOUT=1mA 80 10 3.5 RP131x501x IOUT=50mA 20 f=0.2kHz f=1kHz f=10kHz f=100kHz 20 4.0 4.5 5.0 5.5 6.0 Input Voltage VIN (V) 6.5 70 60 50 40 30 20 10 0 4.5 f=0.2kHz f=1kHz f=10kHz f=100kHz 5.0 5.5 6.0 Input Voltage VIN (V) 6.5 RP131x NO.EA-174-180711 RP131x501x RP131x501x IOUT=100mA 90 80 80 Ripple Rejection RR (dB) Ripple Rejection RR (dB) IOUT=10mA 90 70 60 50 40 30 f=0.2kHz f=1kHz f=10kHz f=100kHz 20 10 0 4.5 5.0 5.5 6.0 Input Voltage VIN (V) 70 60 50 40 30 10 0 4.5 6.5 f=0.2kHz f=1kHz f=10kHz f=100kHz 20 5.0 5.5 6.0 Input Voltage VIN (V) 6.5 9) Ripple Rejection vs. Frequency (C1none, C2Ceramic 4.7F, Ta25C) 100 90 80 70 60 50 40 30 20 10 0 0.1 RP131x151x VIN=1.8VDC+0.2Vp-p Ripple Rejection RR (dB) Ripple Rejection RR (dB) RP131x081x IOUT=1mA IOUT=30mA IOUT=100mA 1 10 100 Frequency f (kHz) 1000 100 90 80 70 60 50 40 30 20 10 0 0.1 VIN=2.5VDC+0.2Vp-p IOUT=1mA IOUT=30mA IOUT=100mA 1 100 90 80 70 60 50 40 30 20 10 0 0.1 IOUT=1mA IOUT=30mA IOUT=100mA 1 10 100 Frequency f (kHz) 1000 RP131x501x VIN=4.3VDC+0.2Vp-p Ripple Rejection RR (dB) Ripple Rejection RR (dB) RP131x331x 10 100 Frequency f (kHz) 1000 100 90 80 70 60 50 40 30 20 10 0 0.1 VIN=6.0VDC+0.2Vp-p IOUT=1mA IOUT=30mA IOUT=100mA 1 10 100 Frequency f (kHz) 1000 15 RP131x NO.EA-174-180711 10) Input Transient Response (IOUT100mA, trtf5s, C1none, Ta25C) RP131x081x RP131x151x C2=Ceramic2.2F C2=Ceramic2.2F 2 1 0.81 Output Voltage 0.80 0.79 3 Input Voltage 2 1.51 Output Voltage 1.50 1.49 0 10 20 30 40 50 60 70 80 90 Time t (s) 0 10 20 30 40 50 60 70 80 90 Time t (s) RP131x331x RP131x501x C2=Ceramic2.2F C2=Ceramic4.7F 3.31 Output Voltage 3.30 Input Voltage 6 5 5.005 Output Voltage 5.000 Input Voltage VIN (V) 4 Output Voltage VOUT (V) 5 Input Voltage 7 Input Voltage VIN (V) 6 Output Voltage VOUT (V) Input Voltage VIN (V) Input Voltage Output Voltage VOUT (V) 4 Input Voltage VIN (V) Output Voltage VOUT (V) 3 4.995 3.29 0 10 20 30 40 50 60 70 80 90 Time t (s) 0 10 20 30 40 50 60 70 80 90 Time t (s) 11) Load Transient Response (trtf0.5s, C1Ceramic 2.2F, VINVOUT+1.0V, Topt25C) RP131x081x RP131x151x C2=Ceramic2.2F C2=Ceramic2.2F 50 0.81 0.80 0.79 Output Voltage 0.78 70 50 1.52 1.50 1.48 Output Voltage 1.46 0 20 40 60 80 100 120 140 160 180 Time t (s) 16 90 Output Current 50mA 100mA 0 20 40 60 80 100 120 140 160 180 Time t (s) Output Current IOUT (mA) 70 Output Voltage VOUT (V) 90 Output Current 50mA 100mA 110 Output Current IOUT (mA) Output Voltage VOUT (V) 110 RP131x NO.EA-174-180711 RP131x331x RP131x501x 50 5.02 5.01 5.00 4.99 4.98 Output Voltage 4.97 0 20 40 60 80 100 120 140 160 180 Time t (s) 0 20 40 60 80 100 120 140 160 180 Time t (s) RP131x081x RP131x151x C2=Ceramic2.2F C2=Ceramic2.2F 0 0.82 0.80 Output Voltage Output Voltage VOUT (V) 20 Output Current IOUT (mA) Output Voltage VOUT (V) Output Current 0mA 30mA Output Current 0mA 30mA 0 1.52 1.50 1.48 Output Voltage 1.46 0.76 0 20 40 60 80 100 120 140 160 180 Time t (s) 0 20 40 60 80 100 120 140 160 180 Time t (s) RP131x331x RP131x501x C2=Ceramic4.7F C2=Ceramic4.7F 40 20 0 3.32 3.30 Output Voltage 3.26 Output Voltage VOUT (V) Output Current 0mA 30mA Output Current IOUT (mA) Output Voltage VOUT (V) 40 3.28 20 Output Current IOUT (mA) 40 40 0.78 70 Output Current IOUT (mA) Output Voltage Output Current 50mA 100mA 90 Output Current 0mA 30mA 20 0 5.01 5.00 4.99 4.98 Output Voltage Output Current IOUT (mA) 3.33 3.32 3.31 3.30 3.29 3.28 3.27 110 Output Voltage VOUT (V) Output Current 50mA 100mA C2=Ceramic4.7F 110 90 70 50 Output Current IOUT (mA) Output Voltage VOUT (V) C2=Ceramic4.7F 4.97 0 20 40 60 80 100 120 140 160 180 Time t (s) 0 20 40 60 80 100 120 140 160 180 Time t (s) 17 RP131x NO.EA-174-180711 RP131x081x RP131x151x C2=Ceramic2.2F C2=Ceramic2.2F 0 1.0 0.8 Output Voltage 0.4 200 0 1.7 1.5 1.3 Output Voltage 1.1 0 20 40 60 80 100 120 140 160 180 Time t (s) 0 20 40 60 80 100 120 140 160 180 Time t (s) RP131x331x RP131x501x C2=Ceramic4.7F C2=Ceramic4.7F 600 200 0 3.5 3.3 3.1 2.9 Output Voltage Output Voltage VOUT (V) 400 Output Current 100mA 500mA Output Current IOUT (mA) Output Voltage VOUT (V) 600 2.7 400 Output Current 100mA 500mA 200 0 5.2 5.0 4.8 Output Voltage Output Current IOUT (mA) 0.6 400 Output Current 100mA 500mA Output Current IOUT (mA) 200 Output Voltage VOUT (V) 400 Output Current 100mA 500mA 600 Output Current IOUT (mA) Output Voltage VOUT (V) 600 4.6 0 20 40 60 80 100 120 140 160 180 Time t (s) 0 20 40 60 80 100 120 140 160 180 Time t (s) 12) Turn On Speed with CE pin (C1Ceramic 2.2F, C2Ceramic 4.7F, Topt25C) RP131x081x RP131x501x 0 Output Voltage 0.8 IOUT=0mA IOUT=100mA 3 0 6 Output Voltage 4 2 IOUT=0mA IOUT=100mA 0 0 0 50 100 150 200 250 300 350 400 450 Time t (s) 18 6 0 50 100 150 200 250 300 350 400 450 Time t (s) CE Input Voltage VCE (V) 2 1 0.4 9 CE Input Voltage Output Voltage VOUT (V) CE Input Voltage VIN=6.0V 3 CE Input Voltage VCE (V) Output Voltage VOUT (V) VIN=1.8V RP131x NO.EA-174-180711 13) Turn Off Speed with CE pin (D Version) (C1Ceramic 2.2F, C2Ceramic 4.7F, Ta25C) RP131x501D 1 0 Output Voltage IOUT=0mA IOUT=100mA 0.4 Output Voltage VOUT (V) 2 CE Input Voltage 0.8 VIN=6.0V 3 CE Input Voltage VCE (V) Output Voltage VOUT (V) VIN=1.8V 0 9 6 CE Input Voltage 3 0 6 Output Voltage 4 IOUT=0mA IOUT=100mA 2 CE Input Voltage VCE (V) RP131x081D 0 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 Time t (ms) 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 Time t (ms) 14) Inrush Current at turning on (C1Ceramic 2.2F, C2Ceramic 4.7F, Topt25C) RP131x501x VIN=6.5V 8 3.0 600 7 CE Input Voltage 2.5 500 2.0 400 1.5 300 Output Voltage 1.0 200 100 0.5 Inrush Current 0 0 40 80 120 160 200 240 280 320 Time t (s) 0 CE Input Voltage VCE (V) Output Voltage VOUT (V) 700 Inrush Current (mA) CE Input Voltage VCE (V) Output Voltage VOUT (V) VIN=2.3V 3.5 CE Input Voltage 6 Output Voltage 800 700 600 5 500 4 400 3 300 2 Inrush Current 100 1 0 200 Inrush Current (mA) RP131x081x 0 0 40 80 120 160 200 240 280 320 Time t (s) 15) Minimum Operating Voltage Input Voltage VIN (V) RP131x081x 2.3 2.2 2.1 2.0 1.9 1.8 1.7 1.6 1.5 1.4 1.3 1.2 1.1 1.0 Hatched area is available for 0.8V output. 0 200 400 600 800 Output Current IOUT (mA) 1000 19 RP131x NO.EA-174-180711 ESR vs. Output Current When using these ICs, consider the following points: The relations between IOUT (Output Current) and ESR of an output capacitor are shown below. The conditions when the white noise level is under 40V (Avg.) are marked as the hatched area in the graph. Measurement conditions Frequency Band : 10Hz to 3MHz Temperature : 40C to 85C C1 : 2.2F (Kyocera, CM05X5R225M04AD) C2 : 2.2F (Kyocera, CM105X5R225K06AE) 4.7F (Kyocera, CM105X5R475M06AB) RP131x081x RP131x151x VIN=1.6V to 6.0V C1=Ceramic 2.2F, C2=Ceramic 2.2F VIN=1.6V to 6.0V C1=Ceramic 2.2F, C2=Ceramic 2.2F 100 100 Topt=85C Topt=85C 10 Topt=-40C ESR () ESR () 10 1 0.1 1 0.1 0.01 0.01 0 100 200 300 400 500 600 700 800 900 1000 Output Current IOUT (mA) 0 100 200 300 400 500 600 700 800 900 1000 Output Current IOUT (mA) RP131x331x RP131x501x VIN=3.3V to 6.0V C1=Ceramic 2.2F, C2=Ceramic 2.2F VIN=5.0V to 6.0V C1=Ceramic 2.2F, C2=Ceramic 4.7F 100 100 Topt=85C Topt=85C Topt=-40C 10 ESR () ESR () 10 1 0.1 Topt=-40C 1 0.1 0.01 0.01 0 100 200 300 400 500 600 700 800 900 1000 Output Current IOUT (mA) 20 Topt=-40C 0 100 200 300 400 500 600 700 800 900 1000 Output Current IOUT (mA) POWER DISSIPATION DFN1616-6B Ver. A The power dissipation of the package is dependent on PCB material, layout, and environmental conditions. The following measurement conditions are based on JEDEC STD. 51-7. Measurement Conditions Item Measurement Conditions Environment Mounting on Board (Wind Velocity = 0 m/s) Board Material Glass Cloth Epoxy Plastic (Four-Layer Board) Board Dimensions 76.2 mm x 114.3 mm x 0.8 mm Copper Ratio Outer Layer (First Layer): Less than 95% of 50 mm Square Inner Layers (Second and Third Layers): Approx. 100% of 50 mm Square Outer Layer (Fourth Layer): Approx. 100% of 50 mm Square Through-holes I 0.2 mm x 15 pcs Measurement Result (Ta = 25C, Tjmax = 125C) Item Measurement Result Power Dissipation 2400 mW Thermal Resistance (Tja) Tja = 41C/W Thermal Characterization Parameter (jt) jt = 11C/W Tja: Junction-to-Ambient Thermal Resistance jt: Junction-to-Top Thermal Characterization Parameter 4000 Power Dissipation (mW) 3500 3000 2500 2400 2000 1500 1000 500 0 85 Ambient Temperature (rC) Power Dissipation vs. Ambient Temperature Measurement Board Pattern The above graph shows the power dissipation of the package at Tjmax = 125C and Tjmax = 150C. Operating the device in the hatched range might have a negative influence on its lifetime. The total hours of use and the total years of use must be limited as follows: Total Hours of Use 13,000 hours Total Years of Use (4 hours/day) 9 years i DFN1616-6B PACKAGE DIMENSIONS Ver. A 1.30r0.05 (3X0.15) B 6 0.70r0.05 X4 4 1.60 0.05 0.25r0.05 1.60 A INDEX 0.4max. 0.1r0.05 3 0.5 0.20r0.05 1 0.05 M AB Bottom View S 0.05 S DFN1616-6B Package Dimensions (Unit: mm) * The tab on the bottom of the package shown by blue circle is a substrate potential (GND). It is recommended that this tab be connected to the ground plane pin on the board but it is possible to leave the tab floating. i POWER DISSIPATION DFN(PLP)1820-6 Ver. A The power dissipation of the package is dependent on PCB material, layout, and environmental conditions. The following measurement conditions are based on JEDEC STD. 51-7. Measurement Conditions Item Environment Board Material Board Dimensions Copper Ratio Through-holes Measurement Conditions Mounting on Board (Wind Velocity = 0 m/s) Glass Cloth Epoxy Plastic (Four-Layer Board) 76.2 mm x 114.3 mm x 0.8 mm Outer Layer (First Layer): Less than 95% of 50 mm Square Inner Layers (Second and Third Layers): Approx. 100% of 50 mm Square Outer Layer (Fourth Layer): Approx. 100% of 50 mm Square I 0.2 mm x 34 pcs Measurement Result (Ta = 25C, Tjmax = 125C) Item Measurement Result Power Dissipation Thermal Resistance (Tja) Thermal Characterization Parameter (jt) 2200 mW Tja = 45C/W MW C/W Tja: Junction-to-Ambient Thermal Resistance jt: Junction-to-Top Thermal Characterization Parameter Power Dissipation (mW) 3000 2700 2500 2700 27 700 00 2000 2200 1500 1000 500 0 85 Ambient Temperature (C) Power Dissipation vs. Ambient Temperature Measurement Board Pattern The above graph shows the power dissipation of the package at Tjmax = 125C and Tjmax = 150C. Operating the device in the hatched range might have a negative influence on its lifetime. The total hours of use and the total years of use must be limited as follows: Total Hours of Use Total Years of Use (4 hours/day) 13,000 hours 9 years i PACKAGE DIMENSIONS DFN(PLP)1820-6 Ver. A 1.6r0.1 A 1.80 0.20r0.1 B 5 4 6 2.00 1.0r0.1 INDEX 0.6MAX. 3 0.05 S 0.05min S 0.25r0.1 0.25r0.1 X4 0.05 0.05 M AB 0.5 2 1 0.1NOM. 0.3r0.1 Bottom View DFN(PLP)1820-6 Package Dimensions (Unit: mm) * The tab on the bottom of the package is substrate level (GN'). It is recommended that the tab be connected to the ground plane on the board, or otherwise be left floating. i 627 PACKAGE DIMENSIONS Ver. A 4.50.1 1.50.1 0.40.3 2 5 4.350.1 1.0 1 4 4 2.50.1 1.000.2 5 0.40.1 0.30.2 0.420.1 0.1 S 3 0.40.1 3 2 1 0.30.2 1.60.2 S 0.420.1 0.420.1 0.470.1 1.50.1 1.50.1 627 Package Dimensions i POWER DISSIPATION SOT-89-5 Ver. A The power dissipation of the package is dependent on PCB material, layout, and environmental conditions. The following measurement conditions are based on JEDEC STD. 51-7. Measurement Conditions Item Environment Board Material Board Dimensions Copper Ratio Through-holes Measurement Conditions Mounting on Board (Wind Velocity = 0 m/s) Glass Cloth Epoxy Plastic (Four-Layer Board) 76.2 mm x 114.3 mm x 0.8 mm Outer Layer (First Layer): Less than 95% of 50 mm Square Inner Layers (Second and Third Layers): Approx. 100% of 50 mm Square Outer Layer (Fourth Layer): Approx. 100% of 50 mm Square I 0.3 mm x 13 pcs Measurement Result (Ta = 25C, Tjmax = 125C) Item Measurement Result Power Dissipation Thermal Resistance (Tja) Thermal Characterization Parameter (jt) 2600 mW Tja = 38C/W jt = 13C/W Tja: Junction-to-Ambient Thermal Resistance jt: Junction-to-Top Thermal Characterization Parameter 4000 Power Dissipation (mW) 3500 3200 3000 2200 22 2 220 200 00 2500 2600 2000 1500 1000 500 0 85 Ambient Temperature (C) Power Dissipation vs. Ambient Temperature Measurement Board Pattern The above graph shows the power dissipation of the package at Tjmax = 125C and Tjmax = 150C. Operating the device in the hatched range might have a negative influence on its lifetime. The total hours of use and the total years of use must be limited as follows: Total Hours of Use Total Years of Use (4 hours/day) 13,000 hours 9 years i POWER DISSIPATION HSOP-6J Ver. A The power dissipation of the package is dependent on PCB material, layout, and environmental conditions. The following measurement conditions are based on JEDEC STD. 51-7. Measurement Conditions Item Environment Board Material Board Dimensions Copper Ratio Through-holes Measurement Conditions Mounting on Board (Wind Velocity = 0 m/s) Glass Cloth Epoxy Plastic (Four-Layer Board) 76.2 mm x 114.3 mm x 0.8 mm Outer Layer (First Layer): Less than 95% of 50 mm Square Inner Layers (Second and Third Layers): Approx. 100% of 50 mm Square Outer Layer (Fourth Layer): Approx. 100% of 50 mm Square I 0.3 mm x 28 pcs Measurement Result (Ta = 25C, Tjmax = 125C) Item Measurement Result Power Dissipation Thermal Resistance (Tja) Thermal Characterization Parameter (jt) 2700 mW Tja = 37C/W jt = 7C/W Tja: Junction-to-Ambient Thermal Resistance jt: Junction-to-Top Thermal Characterization Parameter 4000 3400 Power Dissipation (mW) 3500 3000 2500 2700 2000 1500 1000 500 0 85 Ambient Temperature (C) Power Dissipation vs. Ambient Temperature Measurement Board Pattern The above graph shows the power dissipation of the package at Tjmax = 125C and Tjmax = 150C. Operating the device in the hatched range might have a negative influence on its lifetime. The total hours of use and the total years of use must be limited as follows: Total Hours of Use Total Years of Use (4 hours/day) 13,000 hours 9 years i +623- PACKAGE DIMENSIONS Ver. A +623- Package Dimensions i POWER DISSIPATION T2--5 Ver. A The power dissipation of the package is dependent on PCB material, layout, and environmental conditions. The following measurement conditions are based on JEDEC STD. 51-7. Measurement Conditions Item Environment Measurement Conditions Mounting on Board (Wind Velocity = 0 m/s) Board Material Board Dimensions Glass Cloth Epoxy Plastic (Four-Layer Board) 76.2 mm x 114.3 mm x 0.8 mm Outer Layer (First Layer): Less than 95% of 50 mm Square Inner Layers (Second and Third Layers): Approx. 100% of 50 mm Square Outer Layer (Fourth Layer): Approx. 100% of 50 mm Square I 0.3 mm x 21 pcs Copper Ratio Through-holes Measurement Result Item (Ta = 25C, Tjmax = 125C) Measurement Result Power Dissipation Thermal Resistance (Tja) 3800 mW Tja = 26C/W Thermal Characterization Parameter (jt) jt = 7C/W Tja: Junction-to-Ambient Thermal Resistance jt: Junction-to-Top Thermal Characterization Parameter 4800 Power Dissipation (mW) 5000 4000 3800 3000 2000 1000 0 85 Ambient Temperature (C) Power Dissipation vs. Ambient Temperature Measurement Board Pattern The above graph shows the power dissipation of the package at Tjmax = 125C and Tjmax = 150C. Operating the device in the hatched range might have a negative influence on its lifetime. The total hours of use and the total years of use must be limited as follows: Total Hours of Use Total Years of Use (4 hours/day) 13,000 hours 9 years i PACKAGE DIMENSIONS 723 Ver. A 723 Package Dimensions The tab on the bottom of the package shown by blue circle is a substrate potential (GND). It is recommended thatthis tab be connected to the ground plane on the board but it is possible to leave the tab floating. i 1. The products and the product specifications described in this document are subject to change or discontinuation of production without notice for reasons such as improvement. Therefore, before deciding to use the products, please refer to Ricoh sales representatives for the latest information thereon. 2. The materials in this document may not be copied or otherwise reproduced in whole or in part without prior written consent of Ricoh. 3. Please be sure to take any necessary formalities under relevant laws or regulations before exporting or otherwise taking out of your country the products or the technical information described herein. 4. The technical information described in this document shows typical characteristics of and example application circuits for the products. The release of such information is not to be construed as a warranty of or a grant of license under Ricoh's or any third party's intellectual property rights or any other rights. 5. The products listed in this document are intended and designed for use as general electronic components in standard applications (office equipment, telecommunication equipment, measuring instruments, consumer electronic products, amusement equipment etc.). Those customers intending to use a product in an application requiring extreme quality and reliability, for example, in a highly specific application where the failure or misoperation of the product could result in human injury or death (aircraft, spacevehicle, nuclear reactor control system, traffic control system, automotive and transportation equipment, combustion equipment, safety devices, life support system etc.) should first contact us. 6. We are making our continuous effort to improve the quality and reliability of our products, but semiconductor products are likely to fail with certain probability. In order to prevent any injury to persons or damages to property resulting from such failure, customers should be careful enough to incorporate safety measures in their design, such as redundancy feature, fire containment feature and fail-safe feature. We do not assume any liability or responsibility for any loss or damage arising from misuse or inappropriate use of the products. 7. Anti-radiation design is not implemented in the products described in this document. 8. The X-ray exposure can influence functions and characteristics of the products. Confirm the product functions and characteristics in the evaluation stage. 9. WLCSP products should be used in light shielded environments. The light exposure can influence functions and characteristics of the products under operation or storage. 10. There can be variation in the marking when different AOI (Automated Optical Inspection) equipment is used. In the case of recognizing the marking characteristic with AOI, please contact Ricoh sales or our distributor before attempting to use AOI. 11. Please contact Ricoh sales representatives should you have any questions or comments concerning the products or the technical information. Halogen Free Ricoh is committed to reducing the environmental loading materials in electrical devices with a view to contributing to the protection of human health and the environment. Ricoh has been providing RoHS compliant products since April 1, 2006 and Halogen-free products since April 1, 2012. https://www.e-devices.ricoh.co.jp/en/ Sales & Support Offices Ricoh Electronic Devices Co., Ltd. Shin-Yokohama Office (International Sales) 2-3, Shin-Yokohama 3-chome, Kohoku-ku, Yokohama-shi, Kanagawa, 222-8530, Japan Phone: +81-50-3814-7687 Fax: +81-45-474-0074 Ricoh Americas Holdings, Inc. 675 Campbell Technology Parkway, Suite 200 Campbell, CA 95008, U.S.A. Phone: +1-408-610-3105 Ricoh Europe (Netherlands) B.V. Semiconductor Support Centre Prof. W.H. Keesomlaan 1, 1183 DJ Amstelveen, The Netherlands Phone: +31-20-5474-309 Ricoh International B.V. - German Branch Semiconductor Sales and Support Centre Oberrather Strasse 6, 40472 Dusseldorf, Germany Phone: +49-211-6546-0 Ricoh Electronic Devices Korea Co., Ltd. 3F, Haesung Bldg, 504, Teheran-ro, Gangnam-gu, Seoul, 135-725, Korea Phone: +82-2-2135-5700 Fax: +82-2-2051-5713 Ricoh Electronic Devices Shanghai Co., Ltd. Room 403, No.2 Building, No.690 Bibo Road, Pu Dong New District, Shanghai 201203, People's Republic of China Phone: +86-21-5027-3200 Fax: +86-21-5027-3299 Ricoh Electronic Devices Shanghai Co., Ltd. Shenzhen Branch 1205, Block D(Jinlong Building), Kingkey 100, Hongbao Road, Luohu District, Shenzhen, China Phone: +86-755-8348-7600 Ext 225 Ricoh Electronic Devices Co., Ltd. Taipei office Room 109, 10F-1, No.51, Hengyang Rd., Taipei City, Taiwan Phone: +886-2-2313-1621/1622 Fax: +886-2-2313-1623