RP131x SERIES
LOW ON RESISTANCE / LOW VOLTAGE 1A LDO
NO.EA-174-180711
1
OUTLINE
The RP131x Series are voltage-regulators with a built-in low ON-resistance transistor and output current is 1A
capability. These ICs are capable of the low input voltage (Min.1.6V) and also the minimum output voltage can be
set from 0.8V. (The output voltage is fixed in the IC.)
Each of these ICs consists of a voltage reference unit, an error amplifier, a resistor net for setting output voltage,
a chip enable circuit, current limit circuits for over-current and short, and a thermal-shutdown circuit.
A standby mode with ultra low supply current can be realized with the chip enable function.
The packages for these ICs are DFN1616-6B and DFN(PLP)1820-6 which are suitable for high density mounting
of the ICs on boards. SOT-89-5, HSOP-6J and TO-252-5-P2 with high power dissipation are also available.
FEATURES
Output Current ............................................................ Min. 1A
Supply Current ............................................................. Typ. 65A
Standby Current ......................................................... Typ. 0.15A
Input Voltage Range ................................................... 1.6V to 6.5V
Output Voltage Range .................................................. 0.8V to 5.5V (1)(0.1V steps)
Dropout Voltage ............................................................ Typ. 0.5V (VOUT2.8V, IOUT1A)
Ripple Rejection ........................................................... Typ. 70dB (f1kHz, VOUT2.8V)
Output Voltage Accuracy .............................................. 1.0%
Temperature-Drift Coefficient of Output Voltage .......... Typ. 100ppm/C
Line Regulation ............................................................ Typ. 0.05%/V
Load Regulation ......................................................... Typ. 20mV at IOUT300mA, Typ. 80mV at IOUT1A
Packages ................................................................... DFN1616-6B, DFN(PLP)1820-6, SOT-89-5, HSOP-6J,
TO-252-5-P2
Built-in Inrush current limit circuit ............................... Typ. 500mA
Built-in Fold-Back Protection Circuit ........................... Typ. 250mA (Current at short mode)
Built-in Thermal Shutdown Circuit .............................. Thermal Shutdown Temperature ; Typ. 165C
Released Temperature ; Typ. 135C
Built-in Auto Discharge Function ................................ D version
Ceramic capacitors are recommended to be used with this IC .... 2.2F or more (VOUT≤3.6V)
4.7F or more (VOUT
3.6V)
APPLICATIONS
Power source for battery-powered equipment.
Power source for portable communication equipment.
Power source for electrical appliances such as cameras, VCRs and camcorders.
Power source for Notebook PC.
Power source for home appliances.
(1) For other voltages, please refer to MARK INFORMATIONS.
RP131x
NO.EA-174-180711
2
SELECTION GUIDE
The output voltage, auto discharge function, package for the ICs can be selected at the user’s request.
Product Name Package Quantity per Reel Pb Free Halogen Free
RP131Lxx1-TR DFN1616-6B 5,000 pcs Yes Yes
RP131Kxx1-TR DFN(PLP)1820-6 5,000 pcs Yes Yes
RP131Hxx1-T1-FE SOT-89-5 1,000 pcs Yes Yes
RP131Sxx1-E2-FE HSOP-6J 1,000 pcs Yes Yes
RP131Jxx1-T1-FE TO-252-5-P2 3,000 pcs Yes Yes
xx :
:
The output voltage can be designated in the range from 0.8V(08) to 5.5V(55) in 0.1V steps.
(For other voltages, please refer to MARK INFORMATIONS.)
The auto discharge function at off state are options as follows.(1)
(B) without auto discharge function at off state
(D) with auto discharge function at off state
BLOCK DIAGRAMS
RP131xxx1B RP131xxx1D
V
DD
GND
V
OUT
CE
Vref
Current Limit
Thermal Shutdown
V
DD
GND
V
OUT
CE
Vref
Current Limit
Thermal Shutdown
(1) Auto-discharge function quickly lowers the output voltage to 0V, when the chip enable signal is switched from the active
mode to the standby mode, by releasing the electrical charge accumulated in the external capacitor.
RP131x
NO.EA-174-180711
3
PIN DESCRIPTIONS
Top View
3
4
2
5
1
6
Bottom View
1
6
2
5
3
4
Top View
654
123
Bottom View
4 5 6
3 2 1
DFN1616-6B DFN(PLP)1820-6
1 3
5 4
2
13
64
2
5
1 2 3 4 5
SOT-89-5 HSOP-6J TO-252-5-P2
Tab is GND level. (They are connected to the reverse side of this IC.) The tab is better to be connected to the GND, but
leaving it open is also acceptable.
RP131L (DFN1616-6B) Pin Description
Pin No. Symbol Pin Description
1 VOUT Output Pin(1)
2 VOUt Output Pin
3 GND Ground Pin
4 CE Chip Enable Pin ("H" Active)
5 VDD Input Pin
6 VDD Input Pin
(1) When you use this IC, please make sure be wired with 1pin with 2pin and 5pin with 6pin.
RP131x
NO.EA-174-180711
4
RP131K (DFN(PLP)1820-6) Pin Description
Pin No. Symbol Pin Description
1 VOUT Output Pin(1)
2 VOUT Output Pin
3 GND Ground Pin
4 CE Chip Enable Pin ("H" Active)
5 VDD Input Pin
6 VDD Input Pin

RP131H (SOT-89-5) Pin Description
Pin No. Symbol Pin Description
1 NC No Connection
2 GND Ground Pin
3 CE Chip Enable Pin ("H" Active)
4 VDD Input Pin
5 VOUT Output Pin
RP131S (HSOP-6J) Pin Description
Pin No. Symbol Pin Description
1 VOUT Output Pin
2 GND Ground Pin(2)
3 NC No Connection
4 CE Chip Enable Pin ("H" Active)
5 GND Ground Pin
6 VDD Input Pin
RP131J (TO-252-5-P2) Pin Description
Pin No. Symbol Pin Description
1 VOUT Output Pin
2 GND Ground Pin(3)
3 GND Ground Pin
4 CE Chip Enable Pin ("H" Active)
5 VDD Input Pin
(1) When you use this IC, please make sure be wired with 1pin with 2pin and 5pin with 6pin.
(2) When you use this IC, please make sure be wired with 2pin and 5pin.
(3) When you use this IC, please make sure be wired with 2pin and 3pin.
RP131x
NO.EA-174-180711
5
ABSOLUTE MAXIMUM RATINGS
Symbol Item Rating Unit
VIN Input Voltage 7.0 V
VCE Input Voltage (CE Pin) 0.3 to 7.0 V
VOUT Output Voltage 0.3 to VIN0.3 V
PD Power Dissipation(1)
DFN1616-6B, JEDEC STD.51-7 2400
mW
DFN(PLP)1820-6, JEDEC STD.51-7 2200
SOT-89-5, JEDEC STD.51-7 2600
HSOP-6J, JEDEC STD.51-7 2700
TO-252-5-P2, JEDEC STD.51-7 3800
Tj Junction Temperature Range 40 to 125 C
Tstg Storage Temperature Range 55 to 125 C
ABSOLUTE MAXIMUM RATINGS
Electronic and mechanical stress momentarily exceeded absolute maximum ratings may cause the permanent damages
and may degrade the life time and safety for both device and system using the device in the field.
The functional operation at or over these absolute maximum ratings is not assured.
RECOMMENDED OPERATING CONDITIONS
Symbol Item Rating Unit
VIN Input Voltage 1.6 to 6.5 V
Ta Operating Temperature Range −40 to 85 °C
RECOMMENDED OPERATING CONDITIONS
All of electronic equipment should be designed that the mounted semiconductor devices operate within the
recommended operating conditions. The semiconductor devices cannot operate normally over the recommended
operating conditions, even if when they are used over such ratings by momentary electronic noise or surge. And the
semiconductor devices may receive serious damage when they continue to operate over the recommended operating
conditions.
(1) Refer to POWER DISSIPATION for detailed information.
RP131x
NO.EA-174-180711
6
ELECTRICAL CHARACTERISTICS
VINSet VOUT1V, IOUT1mA
The specification in is checked and guaranteed by design engineering at −40C≤Ta≤85C, unless
otherwise noted.
RP131xxx1B/D (Ta 25C)
Symbol Item Conditions Min. Typ. Max. Unit
VOUT Output Voltage
Ta 25C VOUT>1.5V
0.99 1.01
V
VOUT≤1.5V
15 15
mV
40C ≤ Ta t≤ 85C VOUT>1.5V 0.974 1.018 V
VOUT≤1.5V 40 27
mV
VOUT/
IOUT Load Regulation 0.1mA ≤ IOUT ≤ 300mA 20 40 mV
0.1mA ≤ IOUT ≤ 1A 80 120
VDIF Dropout Voltage Refer to the following table
ISS Supply Current IOUT0mA (VIN6.5V) 65
90 A
Istandby Standby Current VCE0V, VIN6.5V 0.15 0.60 A
VOUT/
VIN Line Regulation Set VOUT
0.5V ≤ VIN ≤ 6.5V
However, VIN ≥ 1.6V 0.05
0.1 %/V
RR Ripple Rejection
f1kHz
Ripple 0.2Vp-p
IOUT100mA
VOUT≤3.3V 70
dB
VOUT>3.3V 60
VIN Input Voltage 1.6 6.5 V
ILIM Output Current Limit 1 A
VOUT/
Ta
Output Voltage
Temperature Coefficient 40C≤Ta≤85C 100 ppm
/C
ISC Short Current Limit VOUT0V 250 mA
IPD CE Pull-down Current 0.3 A
VCEH CE Input Voltage "H" 1.0 V
VCEL CE Input Voltage "L"
0.4 V
en Output Noise BW10Hz to 100kHz, IOUT1mA 45
Vrms
TTSD Thermal Shutdown
Temperature Junction Temperature 165 C
TTSR Thermal Shutdown
Released Temperature Junction Temperature 135 C
RLOW Low Output Nch Tr. ON
Resistance (of D version) VIN4.0V, VCE0V 30

All test items listed under Electrical Characteristics are done under the pulse load condition (Tj≈Ta = 25°C) except for Output
Noise, Ripple Rejection, Output Voltage Temperature Coefficient, Dropout Voltage at 1A Output Current and Thermal Shutdown
items.
RP131x
NO.EA-174-180711
7
The specification in is checked and guaranteed by design engineering at −40C ≤ Ta ≤ 85C, unless
otherwise noted.
Dropout Voltage (
Ta 25°C)
Output Voltage
VOUT (V)
Dropout Voltage VDIF (V)
Condition Typ. Max. Condition Typ. Max.
0.8 ≤ VOUT < 0.9
IOUT300mA
0.600 0.780
IOUT1A
1.100 1.650
0.9 ≤ VOUT < 1.0 0.550 0.690 1.050 1.500
1.0 ≤ VOUT < 1.1 0.450 0.610 1.000 1.450
1.1 ≤ VOUT < 1.2 0.340 0.540 0.930 1.420
1.2 ≤ VOUT < 1.5 0.290 0.500 0.900 1.380
1.5 ≤ VOUT < 2.6 0.230 0.310 0.700 1.100
2.6 ≤ VOUT < 3.3 0.150 0.180 0.500 0.750
3.3 ≤ VOUT ≤ 5.5 0.140 0.170 0.450 0.650
RP131x
NO.EA-174-180711
8
APPLICATION INFORMATION
Typical Application Circuits
CIN RP131x
Series
VDD VOU
T
CE GND
COUT
V
OUT
CE Control
Recommendation value of the external capacitors
VOUT Capacitors
VOUT ≤ 3.6V CIN Kyocera 2.2F (size:1005) [CM05X5R225M06AB]
COUT Kyocera 2.2F (size:1608) [CM105X5R225K06AB]
VOUT > 3.6V CIN Kyocera 2.2F (size:1608) [CM105X5R225K06AB]
COUT Kyocera 4.7F (size:1608) [CM105X5R475M06AB]
Technical Notes on the External Components
When using this IC, consider following points:
Phase Compensation
In these ICs, phase compensation is made for securing stable operation even if the load current is varied. For
this purpose, use a capacitor COUT with good frequency characteristics and ESR (Equivalent Series Resistance).
If a tantalum capacitor is used, and its ESR of COUT is large, the loop oscillation may result. Because of this,
select COUT carefully considering its frequency characteristics.
PCB Layout
Make VDD and GND lines sufficient. If their impedance is high, noise pickup or unstable operation may result.
Connect a capacitor CIN between VDD and GND pin with a capacitance value as "Recommendation value of the
external capacitors" above or more, and as close as possible to the pins.
Set external components, especially the output capacitor COUT, as close as possible to the ICs, and make wiring
as short as possible.
RP131x
NO.EA-174-180711
9
TEST CIRCUITS
C
IN
RP131x
Series
VDD VOU
T
CE GND
V
C
OUT
V
OUT
I
OUT
CE Control
Basic Test Circuit
C
IN
VDD VOU
CE GND
C
OUT
A I
SS
V
OUT
RP131x
Series
CE Control
Test Circuit for Supply Current
RP131x
Series
VDD VOUT
CE GND
C
OUT
Pulse
Generator
I
OUT
P. G.
CE Control
Test Circuit for Ripple Rejection
I
OUTa
I
OUTb
C
IN
RP131x
Series
VDD VOUT
CE GND
C
OUT
V
OUT
CE Control
Test Circuit for Load Transient Response
RP131x
NO.EA-174-180711
10
TYPICAL CHARACTERISTICS
Typical Characteristics are intended to be used as reference data; they are not guaranteed.
1) Output Voltage vs. Output Current (Ta 25C)
RP131x081x RP131x151x
RP131x331x RP131x501x
2) Output Voltage vs. Input Voltage (Ta25C)
RP131x081x RP131x151x
0 1.51.00.5 2.0
Output Current I
OUT
(A)
Output Voltage V
OUT
(V)
0
0.9
0.5
0.4
0.3
0.6
0.7
0.8
0.2
0.1
V
IN
=1.4V
V
IN
=1.6V
V
IN
=2.0V
V
IN
=2.5V
V
IN
=2.8V
0 1.51.00.5 2.0
Output Current I
OUT
(A)
Output Voltage V
OUT
(V)
0
1.6
1.0
0.8
0.6
1.2
1.4
0.4
0.2
V
IN
=2.0V
V
IN
=2.5V
V
IN
=3.5V
0 1.51.00.5 2.0
Output Current IOUT (A)
Output Voltage VOUT (V)
0
3.5
2.5
2.0
1.5
3.0
1.0
0.5
VIN=3.6V
VIN=4.3V
VIN=5.0V
0 1.51.00.5 2.0
Output Current I
OUT
(A)
Output Voltage V
OUT
(V)
0
5.5
3.5
2.5
1.5
4.5
4.0
3.0
2.0
5.0
1.0
0.5
V
IN
=5.3V
V
IN
=6.0V
0453216
Input Voltage V
IN
(V)
Output Voltage V
OUT
(V)
0
1.0
0.6
0.4
0.3
0.8
0.7
0.5
0.9
0.2
0.1
I
OUT
=1mA
I
OUT
=50mA
I
OUT
=100mA
I
OUT
=300mA
0453216
Input Voltage V
IN
(V)
Output Voltage V
OUT
(V)
0
1.8
1.2
0.9
1.5
0.6
0.3
I
OUT
=1mA
I
OUT
=50mA
I
OUT
=100mA
I
OUT
=300mA
RP131x
NO.EA-174-180711
11
RP131x331x RP131x501x
3) Supply Current vs. Input Voltage (Ta25C)
RP131x081x RP131x151x
RP131x331x RP131x501x
0453216
Input Voltage V
IN
(V)
Output Voltage V
OUT
(V)
0
3.5
2.0
1.5
2.5
3.0
1.0
0.5
I
OUT
=1mA
I
OUT
=50mA
I
OUT
=100mA
I
OUT
=300mA
0453216
Input Voltage V
IN
(V)
Output Voltage V
OUT
(V)
0
6
4
3
5
2
1
I
OUT
=1mA
I
OUT
=50mA
I
OUT
=100mA
I
OUT
=300mA
0453216
Input Voltage V
IN
(V)
Supply Current I
SS
(μA)
0
70
50
30
60
40
20
10
0453216
Input Voltage V
IN
(V)
Supply Current I
SS
(μA)
0
70
50
30
60
40
20
10
0453216
Input Voltage V
IN
(V)
Supply Current I
SS
(μA)
0
70
50
30
60
40
20
10
0453216
Input Voltage V
IN
(V)
Supply Current I
SS
(μA)
0
70
50
30
60
40
20
10
RP131x
NO.EA-174-180711
12
4) Output Voltage vs. Temperature
RP131x081x RP131x281x
RP131x331x RP131x501x
5) Supply Current vs. Temperature
RP131x081x RP131x151x
0.76
0.83
0.77
0.78
0.80
0.82
0.79
0.81
-40 7550025-25 85
Temperature Topt (°C)
Output Voltage V
OUT
(V)
1.46
1.53
1.47
1.48
1.50
1.52
1.49
1.51
-40 7550025-25 85
Temperature Topt (°C)
Output Voltage V
OUT
(V)
3.20
3.36
3.22
3.24
3.28
3.32
3.34
3.26
3.30
-40 7550025-25 85
Temperature Topt (°C)
Output Voltage V
OUT
(V)
4.90
5.06
4.92
4.94
4.98
5.02
5.04
4.96
5.00
-40 7550025-25 85
Temperature Topt (°C)
Output Voltage V
OUT
(V)
0
90
10
20
40
70
30
50
80
60
-40 7550025-25 85
Temperature Topt (°C)
Supply Current I
SS
(μA)
0
90
10
20
40
70
30
50
80
60
-40 7550025-25 85
Temperature Topt (°C)
Supply Current I
SS
(μA)
RP131x
NO.EA-174-180711
13
RP131x331x RP131x501x
6) Dropout Voltage vs. Output Current
RP131x081x RP131x151x
RP131x331x RP131x501x
0
90
10
20
40
70
30
50
80
60
-40 7550025-25 85
Temperature Topt (°C)
Supply Current I
SS
(μA)
0
90
10
20
40
70
30
50
80
60
-40 7550025-25 85
Temperature Topt (°C)
Supply Current I
SS
(μA)
0
1.6
1.4
1.0
0.6
1.2
0.8
0.4
0.2
Output Current I
OUT
(mA)
Dropout Voltage V
DIF
(V)
85°C
25°C
-40°C
0
800200 400 600 900300 500 700100 1000
0
1.4
1.0
0.6
1.2
0.8
0.4
0.2
0
800200 400 600 900300 500 700100 1000
Output Current I
OUT
(mA)
Dropout Voltage V
DIF
(V)
85°C
25°C
-40°C
0
1.4
1.0
0.6
1.2
0.8
0.4
0.2
0
800200 400 600 900300 500 700100 1000
Output Current I
OUT
(mA)
Dropout Voltage V
DIF
(V)
85°C
25°C
-40°C
0
1.4
1.0
0.6
1.2
0.8
0.4
0.2
0
800200 400 600 900300 500 700100 1000
Output Current I
OUT
(mA)
Dropout Voltage V
DIF
(V)
85°C
25°C
-40°C
RP131x
NO.EA-174-180711
14
7) Dropout Voltage vs. Set Output Voltage
8) Ripple Rejection vs. Input Bias Voltage (
C1
none, C2
Ceramic 1.0
F, Ripple
0.2V
p-p
, T
a
25
C
)
RP131x331x RP131x331x
RP131x331x RP131x501x
1.2
0.6
1.0
0.8
0.4
0.2
0
0.7
1.1
0.9
0.5
0.3
0.1
0.5 5.53.5 4.51.5 2.5
Set Output Voltage V
REG
(V)
Dropout Voltage V
DIF
(V)
I
OUT
=50mA
I
OUT
=10mA
I
OUT
=1mA
I
OUT
=0mA
I
OUT
=600mA
I
OUT
=400mA
I
OUT
=200mA
I
OUT
=100mA
I
OUT
=1A
I
OUT
=800mA
3.0 4.0 6.05.03.5 5.54.5 6.5
Input Voltage V
IN
(V)
0
10
40
30
20
60
50
70
80
Ripple Rejection RR (dB)
I
OUT
=1mA
f=0.2kHz
f=1kHz
f=10kHz
f=100kHz
3.0 4.0 6.05.03.5 5.54.5 6.5
Input Voltage V
IN
(V)
0
10
40
30
20
60
50
70
80
Ripple Rejection RR (dB)
I
OUT
=30mA
f=0.2kHz
f=1kHz
f=10kHz
f=100kHz
3.0 4.0 6.05.03.5 5.54.5 6.5
Input Voltage V
IN
(V)
0
10
40
30
20
60
50
70
80
Ripple Rejection RR (dB)
I
OUT
=50mA
f=0.2kHz
f=1kHz
f=10kHz
f=100kHz
4.5 6.05.0 5.5 6.5
Input Voltage V
IN
(V)
0
10
40
30
20
60
50
70
80
90
Ripple Rejection RR (dB)
I
OUT
=1mA
f=0.2kHz
f=1kHz
f=10kHz
f=100kHz
RP131x
NO.EA-174-180711
15
RP131x501x RP131x501x
9) Ripple Rejection vs. Frequency (C1none, C2Ceramic 4.7F, Ta25C)
RP131x081x RP131x151x
RP131x331x RP131x501x
4.5 6.05.0 5.5 6.5
Input Voltage V
IN
(V)
0
10
40
30
20
60
50
70
80
90
Ripple Rejection RR (dB)
I
OUT
=10mA
f=0.2kHz
f=1kHz
f=10kHz
f=100kHz
4.5 6.05.0 5.5 6.5
Input Voltage V
IN
(V)
0
10
40
30
20
60
50
70
80
90
Ripple Rejection RR (dB)
I
OUT
=100mA
f=0.2kHz
f=1kHz
f=10kHz
f=100kHz
I
OUT
=1mA
I
OUT
=30mA
I
OUT
=100mA
0
10
20
30
100
60
40
80
70
90
50
V
IN
=1.8VDC+0.2Vp-p
Frequency f (kHz)
Ripple Rejection RR (dB)
0.1 10 1001 1000
I
OUT
=1mA
I
OUT
=30mA
I
OUT
=100mA
0
10
20
30
100
60
40
80
70
90
50
V
IN
=2.5VDC+0.2Vp-p
Frequency f (kHz)
Ripple Rejection RR (dB)
0.1 10 1001 1000
IOUT=1mA
IOUT=30mA
IOUT=100mA
0
10
20
30
100
60
40
80
70
90
50
VIN=4.3VDC+0.2Vp-p
Frequency f (kHz)
Ripple Rejection RR (dB)
0.1 10 1001 1000
IOUT=1mA
IOUT=30mA
IOUT=100mA
0
10
20
30
100
60
40
80
70
90
50
VIN=6.0VDC+0.2Vp-p
Frequency f (kHz)
Ripple Rejection RR (dB)
0.1 10 1001 1000
RP131x
NO.EA-174-180711
16
10) Input Transient Response (IOUT100mA, trtf5s, C1none, Ta25C)
RP131x081x RP131x151x
RP131x331x RP131x501x
11) Load Transient Response (trtf0.5s, C1Ceramic 2.2F, VINVOUT+1.0V, Topt25C)
RP131x081x RP131x151x
40 60201008050 7030 90
Output Voltage V
OUT
(V)
Output Voltage
Input Voltage
1
2
0.79
0.80
0.81
Input Voltage V
IN
(V)
3
Time t (μs)
C2=Ceramic2.2μF
40 60201008050 7030 90
Output Voltage V
OUT
(V)
Output Voltage
Input Voltage
2
3
1.49
1.50
1.51
Input Voltage V
IN
(V)
4
Time t (μs)
C2=Ceramic2.2μF
40 60201008050 7030 90
Output Voltage V
OUT
(V)
Output Voltage
Input Voltage
4
5
3.29
3.30
3.31
Input Voltage V
IN
(V)
6
Time t (μs)
C2=Ceramic2.2μF
40 60201008050 7030 90
Output Voltage V
OUT
(V)
Output Voltage
Input Voltage
5
6
4.995
5.000
5.005
Input Voltage V
IN
(V)
7
Time t (μs)
C2=Ceramic4.7μF
90
50
70
Output Voltage V
OUT
(V)
Output Voltage
0.78
0.80
0.81
0.79
110
Time t (μs)
Output Current
Output Current I
OUT
(mA)
50mA 100mA
C2=Ceramic2.2μF
0
18060 10020 140 16080 12040
90
50
70
0
18060 10020 140 16080 12040
Output Voltage V
OUT
(V)
Output Voltage
1.46
1.50
1.52
1.48
110
Time t (μs)
Output Current
Output Current I
OUT
(mA)
50mA 100mA
C2=Ceramic2.2μF
RP131x
NO.EA-174-180711
17
RP131x331x RP131x501x
RP131x081x RP131x151x
RP131x331x RP131x501x
90
50
70
0
18060 10020 140 16080 12040
Output Voltage V
OUT
(V)
Output Voltage
3.27
3.29
3.30
3.31
3.32
3.33
3.28
110
Time t (μs)
Output Current
Output Current I
OUT
(mA)
50mA 100mA
C2=Ceramic4.7μF
90
50
70
0
18060 10020 140 16080 12040
Output Voltage V
OUT
(V)
Output Voltage
4.97
4.99
5.00
5.01
5.02
4.98
110
Time t (μs)
Output Current
Output Current I
OUT
(mA)
50mA 100mA
C2=Ceramic4.7μF
0
20
0
18060 10020 140 16080 12040
Output Voltage V
OUT
(V)
Output Voltage
0.76
0.78
0.80
0.82
40
Time t (μs)
Output Current
Output Current I
OUT
(mA)
0mA 30mA
C2=Ceramic2.2μF
0
20
0
18060 10020 140 16080 12040
Output Voltage V
OUT
(V)
Output Voltage
1.46
1.48
1.50
1.52
40
Time t (μs)
Output Current
Output Current I
OUT
(mA)
0mA 30mA
C2=Ceramic2.2μF
0
20
0
18060 10020 140 16080 12040
Output Voltage V
OUT
(V)
Output Voltage
3.26
3.28
3.30
3.32
40
Time t (μs)
Output Current
Output Current I
OUT
(mA)
0mA 30mA
C2=Ceramic4.7μF
0
20
0
18060 10020 140 16080 12040
Output Voltage V
OUT
(V)
Output Voltage
4.97
4.98
4.99
5.00
5.01
40
Time t (μs)
Output Current
Output Current I
OUT
(mA)
0mA 30mA
C2=Ceramic4.7μF
RP131x
NO.EA-174-180711
18
RP131x081x RP131x151x
RP131x331x RP131x501x
12) Turn On Speed with CE pin (C1Ceramic 2.2F, C2Ceramic 4.7F, Topt25C)
RP131x081x RP131x501x
200
0
400
0
18060 10020 140 16080 12040
Output Voltage V
OUT
(V)
Output Voltage
0.4
0.6
0.8
1.0
600
Time t (μs)
Output Current
Output Current I
OUT
(mA)
100mA 500mA
C2=Ceramic2.2μF
200
0
400
0
18060 10020 140 16080 12040
Output Voltage V
OUT
(V)
Output Voltage
1.1
1.3
1.5
1.7
600
Time t (μs)
Output Current
Output Current I
OUT
(mA)
100mA 500mA
C2=Ceramic2.2μF
200
0
400
0
18060 10020 140 16080 12040
Output Voltage V
OUT
(V)
Output Voltage
2.7
2.9
3.1
3.3
3.5
600
Time t (μs)
Output Current
Output Current I
OUT
(mA)
100mA 500mA
C2=Ceramic4.7μF
200
0
400
0
18060 10020 140 16080 12040
Output Voltage V
OUT
(V)
Output Voltage
4.6
4.8
5.0
5.2
600
Time t (μs)
Output Current
Output Current I
OUT
(mA)
100mA 500mA
C2=Ceramic4.7μF
2
1
0
Output Voltage V
OUT
(V)
Output Voltage
CE Input Voltage
0
0.8
0.4
3
Time t (μs)
CE Input Voltage V
CE
(V)
V
IN
=1.8V
I
OUT
=0mA
I
OUT
=100mA
0
450150 25050 350 400200 300100
6
3
0
0
450150 25050 350 400200 300100
Output Voltage V
OUT
(V)
Output Voltage
CE Input Voltage
0
4
6
2
9
Time t (μs)
CE Input Voltage V
CE
(V)
V
IN
=6.0V
I
OUT
=0mA
I
OUT
=100mA
RP131x
NO.EA-174-180711
19
13) Turn Off Speed with CE pin (D Version) (C1Ceramic 2.2F, C2Ceramic 4.7F, Ta25C)
RP131x081D RP131x501D
14) Inrush Current at turning on (C1Ceramic 2.2F, C2Ceramic 4.7F, Topt25C)
RP131x081x RP131x501x
15) Minimum Operating Voltage
RP131x081x
2
1
0
Output Voltage V
OUT
(V)
Output Voltage
CE Input Voltage
0
0.8
0.4
3
Time t (ms)
CE Input Voltage V
CE
(V)
V
IN
=1.8V
I
OUT
=0mA
I
OUT
=100mA
0
1.80.6 1.00.2 1.4 1.60.8 1.20.4
6
3
0
Output Voltage V
OUT
(V)
Output Voltage
CE Input Voltage
0
4
6
2
9
Time t (ms)
CE Input Voltage V
CE
(V)
V
IN
=6.0V
I
OUT
=0mA
I
OUT
=100mA
0
1.80.6 1.00.2 1.4 1.60.8 1.20.4
600
500
400
300
200
100
0
CE Input Voltage VCE
(V)
Output Voltage V
OUT
(V)
Output Voltage
Inrush Current
CE Input Voltage
0
1.0
1.5
2.0
2.5
3.0
3.5
0.5
700
Time t (μs)
Inrush Current
(mA)
VIN=2.3V
32080 1600 240 280120 20040
600
700
500
400
300
200
100
0
Output Voltage
Inrush Current
CE Input Voltage
0
2
3
4
5
7
6
8
1
800
Time t (μs)
Inrush Current
(mA)
V
IN
=6.5V
32080 1600 240 280120 20040
CE Input Voltage V
CE
(V)
Output Voltage V
OUT
(V)
0 200 800400 600 1000
Output Current I
OUT
(mA)
Input Voltage V
IN
(V)
1.0
2.3
1.9
1.6
1.2
2.0
2.1
2.2
1.7
1.3
1.4
1.8
1.5
1.1
Hatched area is available
for 0.8V output.
RP131x
NO.EA-174-180711
20
ESR vs. Output Current
When using these ICs, consider the following points:
The relations between IOUT (Output Current) and ESR of an output capacitor are shown below.
The conditions when the white noise level is under 40V (Avg.) are marked as the hatched area in the graph.
Measurement conditions
Frequency Band : 10Hz to 3MHz
Temperature : 40C to 85C
C1 : 2.2F (Kyocera, CM05X5R225M04AD)
C2 : 2.2F (Kyocera, CM105X5R225K06AE)
4.7F (Kyocera, CM105X5R475M06AB)
RP131x081x RP131x151x
RP131x331x RP131x501x
改 訂 履 歴
0
100 800600200 400 900700300 500 1000
Output Current I
OUT
(mA)
ESR (Ω)
V
IN
=1.6V to 6.0V
C1=Ceramic 2.2μF, C2=Ceramic 2.2μF
0.01
100
10
1
0.1
Topt=-40°C
Topt=85°C
0
100 800600200 400 900700300 500 1000
Output Current I
OUT
(mA)
ESR (Ω)
V
IN
=1.6V to 6.0V
C1=Ceramic 2.2μF, C2=Ceramic 2.2μF
0.01
100
10
1
0.1
Topt=-40°C
Topt=85°C
0
100 800600200 400 900700300 500 1000
Output Current I
OUT
(mA)
ESR (Ω)
V
IN
=3.3V to 6.0V
C1=Ceramic 2.2μF, C2=Ceramic 2.2μF
0.01
100
10
1
0.1
Topt=-40°C
Topt=85°C
0
100 800600200 400 900700300 500 1000
Output Current I
OUT
(mA)
ESR (Ω)
V
IN
=5.0V to 6.0V
C1=Ceramic 2.2μF, C2=Ceramic 4.7μF
0.01
100
10
1
0.1
Topt=-40°C
Topt=85°C
POWER DISSIPATION DFN1616-6B
Ver. A
i
The power dissipation of the package is dependent on PCB material, layout, and environmental conditions.
The following measurement conditions are based on JEDEC STD. 51-7.
Measurement Conditions
Item Measurement Conditions
Environment Mounting on Board (Wind Velocity = 0 m/s)
Board Material Glass Cloth Epoxy Plastic (Four-Layer Board)
Board Dimensions 76.2 mm × 114.3 mm × 0.8 mm
Copper Ratio
Outer Layer (First Layer): Less than 95% of 50 mm Square
Inner Layers (Second and Third Layers): Approx. 100% of 50 mm Square
Outer Layer (Fourth Layer): Approx. 100% of 50 mm Square
Through-holes I0.2 mm × 15 pcs
Measurement Result (Ta = 25°C, Tjmax = 125°C)
Item Measurement Result
Power Dissipation 2400 mW
Thermal Resistance (Tja) Tja = 41°C/W
Thermal Characterization Parameter (ȥjt) ȥjt = 11°C/W
Tja: Junction-to-Ambient Thermal Resistance
ȥjt: Junction-to-Top Thermal Characterization Parameter
Power Dissipation vs. Ambient Temperature Measurement Board Pattern
The above graph shows the power dissipation of the package at Tjmax = 125°C and Tjmax = 150°C.
Operating the device in the hatched range might have a negative influence on its lifetime. The total hours of
use and the total years of use must be limited as follows:
Total Hours of Use Total Years of Use (4 hours/day)
13,000 hours 9 years
0
500
1000
1500
2000
2500
3000
3500
4000
㻜 㻞㻡㻡㻜㻣㻡㻝㻜㻜㻝㻞㻡㻝㻡㻜
Power Dissipation (mW)
Ambient Temperature (rC)
85
2400
PACKAGE DIMENSIONS DFN1616-6B
Ver. A
i
INDEX
1.60
1.60
A B
0.05
X4
0.5
0.70r0.05
1.30r0.05
1
3
4 6
0.05
M
AB
0.20r0.05
0.05 S
S
0.4max.
0.25r0.05
(3X0.15)
Bottom View
0.1r0.05
DFN1616-6B Package Dimensions (Unit: mm)
*
The tab on the bottom of the package shown by blue circle is a substrate potential (GND). It is recommended that this
tab be connected to the ground plane pin on the board but it is possible to leave the tab floating.
POWER DISSIPATION DFN
(
PLP
)
1820-6
Ver. A
i
The power dissipation of the package is dependent on PCB material, layout, and environmental conditions.
The following measurement conditions are based on JEDEC STD. 51-7.
Measurement Conditions
Item Measurement Conditions
Environment Mounting on Board (Wind Velocity = 0 m/s)
Board Material Glass Cloth Epoxy Plastic (Four-Layer Board)
Board Dimensions 76.2 mm × 114.3 mm × 0.8 mm
Copper Ratio
Outer Layer (First Layer): Less than 95% of 50 mm Square
Inner Layers (Second and Third Layers): Approx. 100% of 50 mm Square
Outer Layer (Fourth Layer): Approx. 100% of 50 mm Square
Through-holes I0.2 mm × 34 pcs
Measurement Result (Ta = 25°C, Tjmax = 125°C)
Item Measurement Result
Power Dissipation 2200 mW
Thermal Resistance (Tja) T
j
a = 45°C/W
Thermal Characterization Parameter (ȥjt)
ȥM
W °C/W
Tja: Junction-to-Ambient Thermal Resistance
ȥjt: Junction-to-Top Thermal Characterization Parameter
Power Dissipation vs. Ambient Temperature Measurement Board Pattern
The above graph shows the power dissipation of the package at Tjmax = 125°C and Tjmax = 150°C.
Operating the device in the hatched range might have a negative influence on its lifetime. The total hours of
use and the total years of use must be limited as follows:
0
500
1000
1500
2000
2500
3000
㻜 㻞㻡㻡㻜㻣㻡㻝㻜㻜㻝㻞㻡㻝㻡㻜
Power Dissipation (mW)
Ambient Temperature (°C)
85
2200
2700
2700
Total Hours of Use Total Years of Use (4 hours/day)
13,000 hours 9years
27
27
7
7
0
0
00
00
0
0
2727
77
0
0
0000
0
0
0
PACKAGE DIMENSIONS DFN
(
PLP
)
1820-6
Ver. A
i
2.00
1.80
0.25r0.1
0.25r0.1
0.1NOM.
0.3r0.1
0.5
0.6MAX.
A B
0.05
X4
0.05 M AB
INDEX
S
0.05min
1 2
3
4 5 6
1.6r0.1
1.0r0.1
0.20r0.1
0.05 S
Bottom View
DFN(PLP)1820-6 Package Dimensions (Unit: mm)
*
The tab on the bottom of the package is substrate level (GN'). It is recommended that the tab be connected to the
ground plane on the board, or otherwise be left floating.
PACKAGE DIMENSIONS 627
Ver. A
i
627 Package Dimensions
1.5±0.11.5±0.1
0.47±0.1
0.42±0.1 0.42±0.1
1.5±0.1
0.4±0.1
0.4±0.1
0.1 S
S
0.3±0.2 0.3±0.2
4 5
33 2 1
0.42±0.1
4.5±0.1
1.6±0.2
4.35±0.1
2.5±0.1 0.4±0.3
5 4
123
ȭ1.0
1.00±0.2
POWER DISSIPATION SOT-89-5
Ver. A
i
The power dissipation of the package is dependent on PCB material, layout, and environmental conditions.
The following measurement conditions are based on JEDEC STD. 51-7.
Measurement Conditions
Item Measurement Conditions
Environment Mounting on Board (Wind Velocity = 0 m/s)
Board Material Glass Cloth Epoxy Plastic (Four-Layer Board)
Board Dimensions 76.2 mm × 114.3 mm × 0.8 mm
Copper Ratio
Outer Layer (First Layer): Less than 95% of 50 mm Square
Inner Layers (Second and Third Layers): Approx. 100% of 50 mm Square
Outer Layer (Fourth Layer): Approx. 100% of 50 mm Square
Through-holes I0.3 mm × 13 pcs
Measurement Result (Ta = 25°C, Tjmax = 125°C)
Item Measurement Result
Power Dissipation 2600 mW
Thermal Resistance (Tja) T
j
a = 38°C/W
Thermal Characterization Parameter (ȥjt)
ȥj
t=13°C/W
Tja: Junction-to-Ambient Thermal Resistance
ȥjt: Junction-to-Top Thermal Characterization Parameter
Power Dissipation vs. Ambient Temperature Measurement Board Pattern
The above graph shows the power dissipation of the package at Tjmax = 125°C and Tjmax = 150°C.
Operating the device in the hatched range might have a negative influence on its lifetime. The total hours of
use and the total years of use must be limited as follows:
0
500
1000
1500
2000
2500
3000
3500
4000
㻜 㻞㻡㻡㻜㻣㻡㻝㻜㻜㻝㻞㻡㻝㻡㻜
Power Dissipation (mW)
Ambient Temperature (°C)
85
2200
2600
3200
Total Hours of Use Total Years of Use (4 hours/day)
13,000 hours 9years
22
2
22
22
22
0
0
0
0000
00
0
000
0
0
22
2222
0
0
0000
0
0
0
0
POWER DISSIPATION HSOP-6J
Ver. A
i
The power dissipation of the package is dependent on PCB material, layout, and environmental conditions.
The following measurement conditions are based on JEDEC STD. 51-7.
Measurement Conditions
Item Measurement Conditions
Environment Mounting on Board (Wind Velocity = 0 m/s)
Board Material Glass Cloth Epoxy Plastic (Four-Layer Board)
Board Dimensions 76.2 mm × 114.3 mm × 0.8 mm
Copper Ratio
Outer Layer (First Layer): Less than 95% of 50 mm Square
Inner Layers (Second and Third Layers): Approx. 100% of 50 mm Square
Outer Layer (Fourth Layer): Approx. 100% of 50 mm Square
Through-holes I0.3 mm × 28 pcs
Measurement Result (Ta = 25°C, Tjmax = 125°C)
Item Measurement Result
Power Dissipation 2700 mW
Thermal Resistance (Tja) T
j
a = 37°C/W
Thermal Characterization Parameter (ȥjt)
ȥj
t=7°C/W
Tja: Junction-to-Ambient Thermal Resistance
ȥjt: Junction-to-Top Thermal Characterization Parameter
Power Dissipation vs. Ambient Temperature Measurement Board Pattern
The above graph shows the power dissipation of the package at Tjmax = 125°C and Tjmax = 150°C.
Operating the device in the hatched range might have a negative influence on its lifetime. The total hours of
use and the total years of use must be limited as follows:
0
500
1000
1500
2000
2500
3000
3500
4000
㻜 㻞㻡㻡㻜㻣㻡㻝㻜㻜㻝㻞㻡㻝㻡㻜
Power Dissipation (mW)
Ambient Temperature (°C)
85
2700
3400
Total Hours of Use Total Years of Use (4 hours/day)
13,000 hours 9years
PACKAGE DIMENSIONS +623-
Ver. A
i
+623- Package Dimensions
POWER DISSIPATION T2--5
Ver. A
i
The power dissipation of the package is dependent on PCB material, layout, and environmental conditions.
The following measurement conditions are based on JEDEC STD. 51-7.
Measurement Conditions
Item Measurement Conditions
Environment Mounting on Board (Wind Velocity = 0 m/s)
Board Material Glass Cloth Epoxy Plastic (Four-Layer Board)
Board Dimensions 76.2 mm × 114.3 mm × 0.8 mm
Copper Ratio
Outer Layer (First Layer): Less than 95% of 50 mm Square
Inner Layers (Second and Third Layers): Approx. 100% of 50 mm Square
Outer Layer (Fourth Layer): Approx. 100% of 50 mm Square
Through-holes I0.3 mm × 21 pcs
Measurement Result (Ta = 25°C, Tjmax = 125°C)
Item Measurement Result
Power Dissipation 3800 mW
Thermal Resistance (Tja) Tja = 26°C/W
Thermal Characterization Parameter (ȥjt) ȥjt = 7°C/W
Tja: Junction-to-Ambient Thermal Resistance
ȥjt: Junction-to-Top Thermal Characterization Parameter
Power Dissipation vs. Ambient Temperature Measurement Board Pattern
The above graph shows the power dissipation of the package at Tjmax = 125°C and Tjmax = 150°C.
Operating the device in the hatched range might have a negative influence on its lifetime. The total hours of
use and the total years of use must be limited as follows:
0
1000
2000
3000
4000
5000
㻜 㻞㻡㻡㻜㻣㻡㻝㻜㻜㻝㻞㻡㻝㻡㻜
Power Dissipation (mW)
Ambient Temperature (°C)
85
4800
3800
Total Hours of Use Total Years of Use (4 hours/day)
13,000 hours 9years
PACKAGE DIMENSIONS 723
Ver. A
i
723 Package Dimensions
The tab on the bottom of the package shown by blue circle is a substrate potential (GND). It is recommended thatthis
tab be connected to the ground plane on the board but it is possible to leave the tab floating.
Ricoh is committed to reducing the environmental loading materials in electrical devices
with a view to contributing to the protection of human health and the environment.
Ricoh has been providing RoHS compliant products since April 1, 2006 and Halogen-free products since
April 1, 2012.
Halogen Free
https://www.e-devices.ricoh.co.jp/en/
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3F,HaesungBldg,504,Teheran-ro,Gangnam-gu,Seoul,135-725,Korea
Phone:+82-2-2135-5700Fax:+82-2-2051-5713
RicohElectronicDevicesShanghaiCo.,Ltd.
Room403,No.2Building,No.690BiboRoad,PuDongNewDistrict,Shanghai201203,
People'sRepublicofChina
Phone:+86-21-5027-3200Fax:+86-21-5027-3299
RicohElectronicDevicesShanghaiCo.,Ltd.
ShenzhenBranch
1205,BlockD(JinlongBuilding),Kingkey100,HongbaoRoad,LuohuDistrict,
Shenzhen,China
Phone:+86-755-8348-7600Ext225
RicohElectronicDevicesCo.,Ltd.
Taipeioffice
Room109,10F-1,No.51,HengyangRd.,TaipeiCity,Taiwan
Phone:+886-2-2313-1621/1622Fax:+886-2-2313-1623
1.The productsandthe productspecificationsdescribed inthisdocument aresubjectto changeordiscontinuation of
productionwithout noticefor reasons
suchas improvement.Therefore, beforedeciding to use the products, please
refertoRicohsalesrepresentativesforthelatestinformationthereon.
2.The materialsin thisdocument may notbe copiedor otherwise reproducedin wholeor in part without priorwritten
consentofRicoh.
3.Please be sure to take any necessary formalities under relevant laws or regulations before exporting or otherwise
takingoutofyourcountrytheproductsorthetechnicalinformationdescribedherein.
4.Thetechnicalinformationdescribedinthisdocumentshowstypicalcharacteristicsofandexampleapplicationcircuits
fortheproducts.Thereleaseofsuchinformationisnottobeconstruedasawarrantyoforagrantoflicenseunder
Ricoh'soranythirdparty'sintellectualpropertyrightsoranyotherrights.
5.Theproductslistedinthisdocumentareintendedanddesignedforuseasgeneralelectroniccomponentsinstandard
applications (office equipment, telecommunication equipment, measuring instruments, consumer electronic products,
amusementequipmentetc.). Thosecustomersintending tousea product inan application requiringextreme quality
andreliability,forexample,inahighlyspecificapplicationwherethefailureormisoperationoftheproductcouldresult
inhumaninjuryordeath(aircraft,spacevehicle,nuclearreactorcontrolsystem,trafficcontrolsystem,automotiveand
transportationequipment,combustionequipment,safetydevices,lifesupportsystemetc.)shouldfirstcontactus.
6.Wearemakingourcontinuousefforttoimprovethequalityandreliabilityofourproducts,butsemiconductorproducts
arelikelytofailwithcertainprobability.Inordertopreventanyinjurytopersonsordamagestopropertyresultingfrom
suchfailure,customersshouldbecarefulenoughtoincorporatesafetymeasuresintheirdesign,suchasredundancy
feature,firecontainmentfeatureandfail-safefeature.Wedonotassumeanyliability
orresponsibilityforanylossor
damagearisingfrommisuseorinappropriateuseoftheproducts.
7.Anti-radiationdesignisnotimplementedintheproductsdescribedinthisdocument.
8.The X-ray exposure can influence functions and characteristics of the products. Confirm the product functions and
characteristicsintheevaluationstage.
9.WLCSP products should be used in light shielded environments. The light exposure can influence functions and
characteristicsoftheproductsunderoperationorstorage.
10.There can be variation in the marking when different AOI (Automated Optical Inspection) equipment is used. In the
caseofrecognizingthemarkingcharacteristicwithAOI,pleasecontactRicohsalesorourdistributorbeforeattempting
touseAOI.
11.
PleasecontactRicohsalesrepresentativesshouldyouhaveanyquestionsorcommentsconcerningtheproductsor
thetechnicalinformation.