HLMP-132x T-1 (3 mm) High Intensity LED Lamps Data Sheet HLMP-132x Series, HLMP-142x Series, HLMP-152x Series Description Features This family of T-1 lamps is specially designed for applications requiring higher on-axis intensity than is achievable with a standard lamp. The light generated is focused to a narrow beam to achieve this effect. * High intensity * Choice of 3 bright colors High Efficiency Red Yellow High Performance Green * Popular T-1 diameter package * Selected minimum intensities * Narrow viewing angle * General purpose leads * Reliable and rugged * Available on tape and reel * For more information, please refer to Tape and Reel Option data sheet Package Dimensions Selection Guide Part Number HLMP-1320-G00xx HLMP-1320 GH0xx HLMP-1321 HLMP-1321-G00xx Package Description Untinted, Nondiffused Tinted, Nondiffused Color High Efficiency Red HLMP-1321-HI0xx HLMP-1420 HLMP-1420-F00xx Microtinted, Nondiffused HLMP-1421 HLMP-1421-F00xx Yellow Tinted, Nondiffused HLMP-1421-FG0xx HLMP-1520 HLMP-1520-E00xx Microtinted, Nondiffused HLMP-1521 HLMP-1521-E00xx HLMP-1521-EF0xx Green Tinted, Nondiffused Luminous Intensity Iv (mcd) @ 10 mA Min. Max. 8.6 - 8.6 27.6 8.6 - 8.6 - 13.8 44.0 9.2 - 9.2 - 9.2 - 9.2 - 9.2 29.4 6.7 - 6.7 - 6.7 - 6.7 - 6.7 21.2 Part Numbering System HLMP - 1 x xx - x x x xx Mechanical Option 00: Bulk 01: Tape & Reel, Crimped Leads 02: Tape & Reel, Straight Leads A1: Right Angle Housing, Uneven Leads A2: Right Angle Housing, Even Leads Color Bin Options 0: Full Color Bin Distribution Maximum Iv Bin Options 0: Open (no max. limit) Others: Please refer to the Iv Bin Table Minimum Iv Bin Options Please refer to the Iv Bin Table Lens Options 20: Untinted or Microtinted, Non-diffused 21: Tinted, Non-diffused Color Options 3: GaP HER 4: GaP Yellow 5: GaP Green Package Options 1: T-1 (3 mm) Absolute Maximum Ratings at TA = 25C Parameter Red Yellow Green Units Peak Forward Current 90 60 90 mA Average Forward Current[1] 25 20 25 mA DC Current[2] 30 20 30 mA Power Dissipation[3] 135 85 135 mW Reverse Voltage (IR = 100 A) 5 5 5 V Transient Forward Current[4] (10 sec Pulse) 500 500 500 mA LED Junction Temperature 110 110 110 C Operating Temperature Range -55 to +100 -55 to +100 -20 to +100 C Storage Temperature Range -55 to +100 Notes: 1. See Figure 5 (Red), 10 (Yellow), or 15 (Green) to establish pulsed operating conditions. 2. For Red and Green series derate linearly from 50C at 0.5 mA/C. For Yellow series derate linearly from 50C at 0.2 mA/C. 3. For Red and Green series derate power linearly from 25C at 1.8 mW/C. For Yellow series derate power linearly from 50C at 1.6 mW/C. 4. The transient peak current is the maximum non-recurring peak current that can be applied to the device without damaging the LED die and wirebond. It is not recommended that the device be operated at peak currents beyond the peak forward current listed in the Absolute Maximum Ratings. 2 Electrical Characteristics at TA = 25C Symbol Description IV Luminous Intensity Device HLMP- Min. Typ. Units Test Conditions 1320 1321 8.6 8.6 30 30 mcd IF = 10 mA (Figure 3) 1420 1421 9.2 9.2 15 15 mcd IF = 10 mA (Figure 8) 1520 1521 6.7 6.7 22 22 mcd IF = 10 mA (Figure 3) Max. 2q1/2 Including Angle Between Half Luminous Intensity Points All 45 Deg. IF = 10 mA See Note 1 (Figures 6, 11, 16, 21) lPEAK Peak Wavelength 132x 635 nm 142X 152X 583 565 Measurement at Peak (Figure 1) 132x 40 142X 152X 36 28 132x 626 142X 152X 585 569 132x 90 142X 152X 90 500 132x 11 142X 152X 15 18 Dl1/2 ld ts C Spectral Line Halfwidth Dominant Wavelength Speed of Response Capacitance nm nm ns RqJ-PIN Thermal Resistance All 290 VF Forward Voltage 132x 1.9 2.4 142X 152X 2.0 2.1 2.4 2.7 VR Reverse Breakdown Voltage All hV Luminous Efficacy 132x 5.0 145 142X 152X 500 595 See Note 2 (Figure 1) pF VF = 0; f = 1 MHz C/W Junction to Cathode Lead V IF = 10 mA V IR = 100 A lumens See Note 3 watt Notes: 1. q1/2 is the off-axis angle at which the luminous intensity is half the axial luminous intensity. 2. The dominant wavelength, ld, is derived from the CIE chromaticity diagram and represents the single wavelength which defines the color of the device. 3. Radiant intensity, Ie, in watts/steradian, may be found from the equation Ie = l v/hv, where lv is the luminous intensity in candelas and hv is the luminous efficacy in lumens/watt. 3 Figure 1. Relative intensity vs. wavelength. T-1 High Efficiency Red Non-Diffused Figure 2. Forward current vs. forward voltage characteristics. Figure 3. Relative luminous intensity vs. DC forward current. Figure 5. Maximum tolerable peak current vs. pulse duration. (IDC MAX as per MAX ratings). Figure 6. Relative luminous intensity vs. angular displacement. 4 Figure 4. Relative efficiency (luminous intensity per unit current) vs. peak LED current. T-1 Yellow Non-Diffused Figure 7. Forward current vs. forward voltage characteristics. Figure 8. Relative luminous intensity vs. forward current. Figure 10. Maximum tolerable peak current vs. pulse duration. (IDCMAX as per MAX ratings). Figure 11. Relative luminous intensity vs. angular displacement. 5 Figure 9. Relative efficiency (luminous intensity per unit current) vs. peak current. T-1 Green Non-Diffused Figure 12. Forward current vs. forward voltage characteristics. Figure 13. Relative luminous intensity vs. forward current. Figure 15. Maximum tolerable peak current vs. pulse duration. (IDCMAX as per MAX ratings). Figure 16. Relative luminous intensity vs. angular displacement. 6 Figure 14. Relative efficiency (luminous intensity per unit current) vs. peak LED current. Intensity Bin Limits Color Red Yellow 7 Intensity Bin Limits Bin Intensity Range (mcd) Min. Max. Bin Intensity Range (mcd) Min. Max. G 9.7 15.5 E 7.6 12.0 H 15.5 24.8 F 12.0 19.1 I 24.8 39.6 G 19.1 30.7 J 39.6 63.4 H 30.7 49.1 K 63.4 101.5 I 49.1 78.5 L 101.5 162.4 J 78.5 125.7 M 162.4 234.6 K 125.7 201.1 N 234.6 340.0 O 340.0 540.0 L 201.1 289.0 P 540.0 850.0 M 289.0 417.0 Q 850.0 1200.0 N 417.0 680.0 R 1200.0 1700.0 O 680.0 1100.0 S 1700.0 2400.0 P 1100.0 1800.0 T 2400.0 3400.0 Q 1800.0 2700.0 U 3400.0 4900.0 R 2700.0 4300.0 V 4900.0 7100.0 S 4300.0 6800.0 W 7100.0 10200.0 T 6800.0 10800.0 X 10200.0 14800.0 U 10800.0 16000.0 Y 14800.0 21400.0 V 16000.0 25000.0 Z 21400.0 30900.0 W 25000.0 40000.0 F 10.3 16.6 G 16.6 26.5 H 26.5 42.3 I 42.3 67.7 J 67.7 108.2 K 108.2 173.2 L 173.2 250.0 M 250.0 360.0 N 360.0 510.0 O 510.0 800.0 P 800.0 1250.0 Q 1250.0 1800.0 R 1800.0 2900.0 S 2900.0 4700.0 T 4700.0 7200.0 U 7200.0 11700.0 V 11700.0 18000.0 W 18000.0 27000.0 Color Green Maximum tolerance for each bin limit is 18%. Color Categories Lambda (nm) Color Green Yellow Category # Min. Max. 6 561.5 564.5 5 564.5 567.5 4 567.5 570.5 3 570.5 573.5 2 573.5 576.5 1 582.0 584.5 3 584.5 587.0 2 587.0 589.5 4 589.5 592.0 5 592.0 593.0 Maximum tolerance for each bin limit is 0.5 nm. Mechanical Option Matrix Mechanical Option Code Definition 00 Bulk Packaging, minimum increment 500 pcs/bag 01 Tape & Reel, crimped leads, minimum increment 1800 pcs/bag 02 Tape & Reel, straight leads, minimum increment 1800 pcs/bag A1 Right Angle Housing, uneven leads, minimum increment 500 pcs/bag A2 Right Angle Housing, even leads, minimum increment 500 pcs/bag Note: All categories are established for classification of products. Products may not be available in all categories. Please contact your local Avago representative for further clarification/information. 8 Precautions: Lead Forming * The leads of an LED lamp may be preformed or cut to length prior to insertion and soldering into PC board. * If lead forming is required before soldering, care must be taken to avoid any excessive mechanical stress induced to LED package. Otherwise, cut the leads of LED to length after soldering process at room temperature. The solder joint formed will absorb the mechanical stress of the lead cutting from traveling to the LED chip die attach and wirebond. * It is recommended that tooling made to precisely form and cut the leads to length rather than rely upon hand operation. Soldering Conditions * Care must be taken during PCB assembly and soldering process to prevent damage to LED component. * Wave soldering parameter must be set and maintained according to recommended temperature and dwell time in the solder wave. Customer is advised to periodically check on the soldering profile to ensure the soldering profile used is always conforming to recommended soldering condition. * If necessary, use fixture to hold the LED component in proper orientation with respect to the PCB during soldering process. * Proper handling is imperative to avoid excessive thermal stresses to LED components when heated. Therefore, the soldered PCB must be allowed to cool to room temperature, 25C, before handling. * Special attention must be given to board fabrication, solder masking, surface plating and lead holes size and component orientation to assure solderability. * Recommended PC board plated through hole sizes for LED component leads: * The closest LED is allowed to solder on board is 1.59 mm below the body (encapsulant epoxy) for those parts without standoff. * Recommended soldering conditions: Wave Soldering Manual Solder Dipping Pre-heat Temperature Pre-heat Time 105 C Max. 30 sec Max. - - Peak Temperature Dwell Time 250 C Max. 3 sec Max. 260 C Max. 5 sec Max. TEMPERATURE - C Plated Through Hole Diameter 0.457 x 0.457 mm (0.018 x 0.018 inch) 0.508 x 0.508 mm (0.020 x 0.020 inch) 0.646 mm (0.025 inch) 0.718 mm (0.028 inch) 0.976 to 1.078 mm (0.038 to 0.042 inch) 1.049 to 1.150 mm (0.041 to 0.045 inch) BOTTOM SIDE OF PC BOARD TOP SIDE OF PC BOARD 200 CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN) PREHEAT SETTING = 150C (100C PCB) SOLDER WAVE TEMPERATURE = 245C AIR KNIFE AIR TEMPERATURE = 390C AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.) AIR KNIFE ANGLE = 40 SOLDER: SN63; FLUX: RMA 150 FLUXING 100 50 30 0 NOTE: ALLOW FOR BOARDS TO BE SUFFICIENTLY COOLED BEFORE EXERTING MECHANICAL FORCE. PREHEAT 10 20 30 40 50 60 70 80 TIME - SECONDS Figure 17. Recommended wave soldering profile. 9 Diagonal Note: Refer to application note AN1027 for more information on soldering LED components. LAMINAR WAVE HOT AIR KNIFE TURBULENT WAVE 250 LED Component Lead Size 90 100 For product information and a complete list of distributors, please go to our website: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries. Data subject to change. Copyright (c) 2006 Avago Technologies Limited. All rights reserved. Obsoletes 5989-2809EN 5989-4253EN May 31, 2006