Features
• High intensity
• Choice of 3 bright colors
High Efficiency Red
Yellow
High Performance Green
• Popular T-1 diameter package
• Selected minimum intensities
• Narrow viewing angle
• General purpose leads
• Reliable and rugged
• Available on tape and reel
• For more information, please refer to Tape and Reel
Option data sheet
Description
This family of T-1 lamps is specially designed for
applications requiring higher on-axis intensity than is
achievable with a standard lamp. The light generated is
focused to a narrow beam to achieve this effect.
HLMP-132x Series, HLMP-142x Series,
HLMP-152x Series
Package Dimensions
Selection Guide
Luminous Intensity
Package Iv (mcd) @ 10 mA
Part Number Description Color Min. Max.
HLMP-1320-G00xx Untinted, 8.6 –
HLMP-1320 GH0xx Nondiffused High 8.6 27.6
HLMP-1321 Tinted,
Efficiency 8.6 –
HLMP-1321-G00xx Nondiffused
Red 8.6 –
HLMP-1321-HI0xx 13.8 44.0
HLMP-1420 Microtinted, 9.2 –
HLMP-1420-F00xx Nondiffused 9.2 –
HLMP-1421 Yellow 9.2 –
HLMP-1421-F00xx Tinted, 9.2 –
HLMP-1421-FG0xx
Nondiffused
9.2 29.4
HLMP-1520 Microtinted, 6.7 –
HLMP-1520-E00xx Nondiffused 6.7 –
HLMP-1521 Green 6.7 –
HLMP-1521-E00xx Tinted, 6.7 –
HLMP-1521-EF0xx
Nondiffused
6.7 21.2
HLMP-132x
T-1 (3 mm) High Intensity LED Lamps
Data Sheet
2
Absolute Maximum Ratings at TA = 25°C
Parameter Red Yellow Green Units
Peak Forward Current 90 60 90 mA
Average Forward Current[1] 25 20 25 mA
DC Current[2] 30 20 30 mA
Power Dissipation[3] 135 85 135 mW
Reverse Voltage (IR = 100 µA) 5 55V
Transient Forward Current[4] (10 µsec Pulse) 500 500 500 mA
LED Junction Temperature 110 110 110 °C
Operating Temperature Range -55 to +100 -55 to +100 -20 to +100 °C
Storage Temperature Range -55 to +100
Notes:
1. See Figure 5 (Red), 10 (Yellow), or 15 (Green) to establish pulsed operating conditions.
2. For Red and Green series derate linearly from 50°C at 0.5 mA/°C. For Yellow series derate linearly from 50°C at 0.2 mA/°C.
3. For Red and Green series derate power linearly from 25°C at 1.8 mW/°C. For Yellow series derate power linearly from 50°C at
1.6 mW/°C.
4. The transient peak current is the maximum non-recurring peak current that can be applied to the device without damaging the LED die and
wirebond. It is not recommended that the device be operated at peak currents beyond the peak forward current listed in the Absolute Maximum
Ratings.
Part Numbering System
HLMP - 1 x xx - x x x xx
Mechanical Option
00: Bulk
01: Tape & Reel, Crimped Leads
02: Tape & Reel, Straight Leads
A1: Right Angle Housing, Uneven Leads
A2: Right Angle Housing, Even Leads
Color Bin Options
0: Full Color Bin Distribution
Maximum Iv Bin Options
0: Open (no max. limit)
Others: Please refer to the Iv Bin Table
Minimum Iv Bin Options
Please refer to the Iv Bin Table
Lens Options
20: Untinted or Microtinted, Non-diffused
21: Tinted, Non-diffused
Color Options
3: GaP HER
4: GaP Yellow
5: GaP Green
Package Options
1: T-1 (3 mm)
3
Electrical Characteristics at TA = 25°C
Device
Symbol Description HLMP- Min. Typ. Max. Units Test Conditions
IVLuminous Intensity 1320 8.6 30 mcd IF = 10 mA
1321 8.6 30 (Figure 3)
1420 9.2 15 mcd IF = 10 mA
1421 9.2 15 (Figure 8)
1520 6.7 22 mcd IF = 10 mA
1521 6.7 22 (Figure 3)
2q1/2Including Angle Between All 45 Deg. IF = 10 mA
Half Luminous Intensity See Note 1
Points (Figures 6, 11, 16, 21)
lPEAK Peak Wavelength 132x 635 nm Measurement
142X 583 at Peak (Figure 1)
152X 565
Dl1/2 Spectral Line Halfwidth 132x 40 nm
142X 36
152X 28
ldDominant Wavelength 132x 626 nm See Note 2 (Figure 1)
142X 585
152X 569
tsSpeed of Response 132x 90 ns
142X 90
152X 500
C Capacitance 132x 11 pF VF = 0; f = 1 MHz
142X 15
152X 18
RqJ-PIN Thermal Resistance All 290 °C/W Junction to
Cathode Lead
VFForward Voltage 132x 1.9 2.4 V IF = 10 mA
142X 2.0 2.4
152X 2.1 2.7
VRReverse Breakdown Voltage All 5.0 V IR = 100 µA
hVLuminous Efficacy 132x 145 lumens See Note 3
142X 500 watt
152X 595
Notes:
1. q1/2 is the off-axis angle at which the luminous intensity is half the axial luminous intensity.
2. The dominant wavelength, ld, is derived from the CIE chromaticity diagram and represents the single wavelength which defines the color of the
device.
3. Radiant intensity, Ie, in watts/steradian, may be found from the equation Ie = lv/hv, where lv is the luminous intensity in candelas and hv is the
luminous efficacy in lumens/watt.
4
Figure 3. Relative luminous intensity vs. DC
forward current.
Figure 2. Forward current vs. forward voltage
characteristics.
Figure 4. Relative efficiency (luminous
intensity per unit current) vs. peak LED
current.
Figure 5. Maximum tolerable peak current vs.
pulse duration. (IDC MAX as per MAX
ratings).
Figure 6. Relative luminous intensity vs. angular displacement.
Figure 1. Relative intensity vs. wavelength.
T-1 High Efficiency Red Non-Diffused
5
T-1 Yellow Non-Diffused
Figure 10. Maximum tolerable peak current
vs. pulse duration. (IDCMAX as per MAX
ratings).
Figure 11. Relative luminous intensity vs. angular displacement.
Figure 8. Relative luminous intensity vs.
forward current.
Figure 7. Forward current vs. forward voltage
characteristics.
Figure 9. Relative efficiency (luminous
intensity per unit current) vs. peak current.
6
T-1 Green Non-Diffused
Figure 13. Relative luminous intensity vs.
forward current.
Figure 12. Forward current vs. forward
voltage characteristics.
Figure 14. Relative efficiency (luminous
intensity per unit current) vs. peak LED
current.
Figure 15. Maximum tolerable peak current
vs. pulse duration. (IDCMAX as per MAX
ratings).
Figure 16. Relative luminous intensity vs. angular displacement.
7
Intensity Bin Limits
Intensity Range (mcd)
Color Bin Min. Max.
E 7.6 12.0
F 12.0 19.1
G 19.1 30.7
H 30.7 49.1
I 49.1 78.5
J 78.5 125.7
K 125.7 201.1
L 201.1 289.0
Green M 289.0 417.0
N 417.0 680.0
O 680.0 1100.0
P 1100.0 1800.0
Q 1800.0 2700.0
R 2700.0 4300.0
S 4300.0 6800.0
T 6800.0 10800.0
U 10800.0 16000.0
V 16000.0 25000.0
W 25000.0 40000.0
Maximum tolerance for each bin limit is ±18%.
Intensity Bin Limits
Intensity Range (mcd)
Color Bin Min. Max.
G 9.7 15.5
H 15.5 24.8
I 24.8 39.6
J 39.6 63.4
K 63.4 101.5
L 101.5 162.4
M 162.4 234.6
N 234.6 340.0
O 340.0 540.0
Red P 540.0 850.0
Q 850.0 1200.0
R 1200.0 1700.0
S 1700.0 2400.0
T 2400.0 3400.0
U 3400.0 4900.0
V 4900.0 7100.0
W 7100.0 10200.0
X 10200.0 14800.0
Y 14800.0 21400.0
Z 21400.0 30900.0
F 10.3 16.6
G 16.6 26.5
H 26.5 42.3
I 42.3 67.7
J 67.7 108.2
K 108.2 173.2
L 173.2 250.0
Yellow M 250.0 360.0
N 360.0 510.0
O 510.0 800.0
P 800.0 1250.0
Q 1250.0 1800.0
R 1800.0 2900.0
S 2900.0 4700.0
T 4700.0 7200.0
U 7200.0 11700.0
V 11700.0 18000.0
W 18000.0 27000.0
8
Color Categories
Lambda (nm)
Color Category # Min. Max.
6 561.5 564.5
5 564.5 567.5
Green 4 567.5 570.5
3 570.5 573.5
2 573.5 576.5
1 582.0 584.5
3 584.5 587.0
Yellow 2 587.0 589.5
4 589.5 592.0
5 592.0 593.0
Maximum tolerance for each bin limit is ±0.5 nm.
Mechanical Option Matrix
Mechanical Option Code Definition
00 Bulk Packaging, minimum increment 500 pcs/bag
01 Tape & Reel, crimped leads, minimum increment 1800 pcs/bag
02 Tape & Reel, straight leads, minimum increment 1800 pcs/bag
A1 Right Angle Housing, uneven leads, minimum increment 500 pcs/bag
A2 Right Angle Housing, even leads, minimum increment 500 pcs/bag
Note:
All categories are established for classification of products. Products may not be available in all categories. Please contact your local Avago
representative for further clarification/information.
9
Precautions:
Lead Forming
• The leads of an LED lamp may be preformed or cut to
length prior to insertion and soldering into PC board.
• If lead forming is required before soldering, care must
be taken to avoid any excessive mechanical stress
induced to LED package. Otherwise, cut the leads of
LED to length after soldering process at room
temperature. The solder joint formed will absorb the
mechanical stress of the lead cutting from traveling to
the LED chip die attach and wirebond.
• It is recommended that tooling made to precisely
form and cut the leads to length rather than rely upon
hand operation.
Soldering Conditions
• Care must be taken during PCB assembly and
soldering process to prevent damage to LED
component.
• The closest LED is allowed to solder on board is 1.59
mm below the body (encapsulant epoxy) for those
parts without standoff.
• Recommended soldering conditions:
• Wave soldering parameter must be set and
maintained according to recommended temperature
and dwell time in the solder wave. Customer is
advised to periodically check on the soldering profile
to ensure the soldering profile used is always
conforming to recommended soldering condition.
• If necessary, use fixture to hold the LED component
in proper orientation with respect to the PCB during
soldering process.
• Proper handling is imperative to avoid excessive
thermal stresses to LED components when heated.
Therefore, the soldered PCB must be allowed to cool
to room temperature, 25°C, before handling.
• Special attention must be given to board fabrication,
solder masking, surface plating and lead holes size
and component orientation to assure solderability.
• Recommended PC board plated through hole sizes for
LED component leads:
Manual Solder
Wave Soldering Dipping
Pre-heat Temperature 105 °C Max. –
Pre-heat Time 30 sec Max. –
Peak Temperature 250 °C Max. 260 °C Max.
Dwell Time 3 sec Max. 5 sec Max.
LED Component Plated Through
Lead Size Diagonal Hole Diameter
0.457 x 0.457 mm 0.646 mm 0.976 to 1.078 mm
(0.018 x 0.018 inch) (0.025 inch) (0.038 to 0.042 inch)
0.508 x 0.508 mm 0.718 mm 1.049 to 1.150 mm
(0.020 x 0.020 inch) (0.028 inch) (0.041 to 0.045 inch)
Note: Refer to application note AN1027 for more
information on soldering LED components.
Figure 17. Recommended wave soldering profile.
LAMINAR WAVE BOTTOM SIDE
OF PC BOARD
HOT AIR KNIFE
TURBULENT WAVE
FLUXING
PREHEAT
01020
30
50
100
150
200
250
30 40 50
TIME – SECONDS
TEMPERATURE – °C
60 70 80 90 100
TOP SIDE OF
PC BOARD
CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN)
PREHEAT SETTING = 150°C (100°C PCB)
SOLDER WAVE TEMPERATURE = 245°C
AIR KNIFE AIR TEMPERATURE = 390°C
AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.)
AIR KNIFE ANGLE = 40°
SOLDER: SN63; FLUX: RMA
NOTE: ALLOW FOR BOARDS TO BE
SUFFICIENTLY COOLED BEFORE EXERTING
MECHANICAL FORCE.
For product information and a complete list of distributors, please go to our website: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries.
Data subject to change. Copyright © 2006 Avago Technologies Limited. All rights reserved. Obsoletes 5989-2809EN
5989-4253EN May 31, 2006
