PACKAGING INFORMATION
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
74AVCB164245GRDR ACTIVE BGA MI
CROSTA
R JUNI
OR
GRD 54 1000 TBD SNPB Level-1-240C-UNLIM
74AVCB164245GRE4 ACTIVE TSSOP DGG 48 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
74AVCB164245GRG4 ACTIVE TSSOP DGG 48 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
74AVCB164245VRE4 ACTIVE TVSOP DGV 48 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
74AVCB164245VRG4 ACTIVE TVSOP DGV 48 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
74AVCB164245ZQLR ACTIVE BGA MI
CROSTA
R JUNI
OR
ZQL 56 1000 Green (RoHS &
no Sb/Br) SNAGCU Level-1-260C-UNLIM
74AVCB164245ZRDR ACTIVE BGA MI
CROSTA
R JUNI
OR
ZRD 54 1000 Green (RoHS &
no Sb/Br) SNAGCU Level-1-260C-UNLIM
SN74AVCB164245GR ACTIVE TSSOP DGG 48 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74AVCB164245KR NRND BGA MI
CROSTA
R JUNI
OR
GQL 56 1000 TBD SNPB Level-1-240C-UNLIM
SN74AVCB164245VR ACTIVE TVSOP DGV 48 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
PACKAGE OPTION ADDENDUM
www.ti.com 14-Aug-2008
Addendum-Page 1