M7A3P1000-1FG484FG484 - Microsemi Corp.

ProASIC®3 Handbook

ProASIC3 Handbook

Table of Contents

Low-Power Flash Device Handbooks Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .i

Section I – ProASIC3 Datasheet

ProASIC3 Flash Family FPGAs. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I

ProASIC3 Device Family Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1-1

ProASIC3 DC and Switching Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2-1

Package Pin Assignments. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-1

Section II – Core Architecture

Low-Power Flash Technology and Flash*Freeze Mode

Core Architecture of IGLOO and ProASIC3 Devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1-1

Low-Power Modes in Actel ProASIC3/E FPGAs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2-1

Global Resources and Clock Conditioning

Global Resources in Actel Low-Power Flash Devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-1

Clock Conditioning Circuits in IGLOO and ProASIC3 Devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4-1

Embedded Memories

FlashROM in Actel’s Low-Power Flash Devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5-1

SRAM and FIFO Memories in Actel's Low-Power Flash Devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6-1

I/O Descriptions and Usage

I/O Structures in IGLOO and ProASIC3 Devices. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7-1

I/O Software Control in Low-Power Flash Devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8-1

DDR for Actel’s Low-Power Flash Devices. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9-1

Packaging and Pin Descriptions

Pin Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10-1

Packaging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11-1

Design Migration

Migrating Designs in ProASIC3 Devices from Higher-Density to Mid-Density Devices . . . . . . . . . . .12-1

Migrating Designs from A3P250 to Lower-Logic-Density Devices . . . . . . . . . . . . . . . . . . . . . . . . . . .13-1

Table of Contents

Programming and Security

Programming Flash Devices. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14-1

Security in Low-Power Flash Devices. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15-1

In-System Programming (ISP) of Actel’s Low-Power Flash Devices Using FlashPro3 . . . . . . . . . . . . .16-1

Microprocessor Programming of Actel’s Low-Power Flash Devices . . . . . . . . . . . . . . . . . . . . . . . . . .17-1

Boundary Scan and UJTAG

Boundary Scan in Low-Power Flash Devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18-1

UJTAG Applications in Actel’s Low-Power Flash Devices. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19-1

Board-Level Requirements

Power-Up/-Down Behavior of ProASIC3/E Devices. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20-1

ProASIC3/E SSO and Pin Placement Guidelines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .21-1

Metastability Characterization Report for Actel Flash FPGAs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22-1

v1.0 i

Low-Power Flash Device Handbooks Introduction

Device Handbooks contain all the information available to help designers understand and use

Actel's devices. Handbook chapters are grouped into sections on the website to simplify

navigation. Each chapter of the handbook can be viewed as an individual PDF file.

At the top of the handbook web page, you will see a zip file for each product family. This file

contains the complete device handbook. Please register for product updates to be notified when a

section of the handbook changes.

Versions

Device handbook chapters may have different version numbers. Actel’s goal is to provide customers

with the latest information in a timely matter. As a result, the handbook chapters will be updated

independently of the handbook.

Categories

In order to provide the latest information to designers, some datasheets are published before data

has been fully characterized. Datasheets are designated as “Product Brief,” “Advanced,” and

“Production”. The definition of these categories are as follows:

Product Brief

The product brief is a summarized version of a datasheet (advanced or production) and contains

general product information. This document gives an overview of specific device and family

information.

Advanced

This version contains initial estimated information based on simulation, other products, devices, or

speed grades. This information can be used as estimates, but not for production. This label only

applies to the DC and Switching Characteristics chapter of the datasheet and will only be used

when the data has not been fully characterized.

Unmarked (production)

This version contains information that is considered to be final.

Export Administration Regulations (EAR)

The products described in this document are subject to the Export Administration Regulations

(EAR). They could require an approved export license prior to export from the United States. An

export includes release of product or disclosure of technology to a foreign national inside or

outside the United States.

Part Number and Revision Date

Part Number 51700094-001-0

Revised January 2008

Section I – ProASIC3 Datasheet

February 2008 I

ProASIC3 Flash Family FPGAs

with Optional Soft ARM® Support

Features and Benefits

High Capacity

• 15 k to 1 M System Gates

• Up to 144 kbits of True Dual-Port SRAM

• Up to 300 User I/Os

Reprogrammable Flash Technology

• 130-nm, 7-Layer Metal (6 Copper), Flash-Based CMOS Process

• Live at Power-Up (LAPU) Level 0 Support

• Single-Chip Solution

• Retains Programmed Design when Powered Off

High Performance

• 350 MHz System Performance

• 3.3 V, 66 MHz 64-Bit PCI†

In-System Programming (ISP) and Security

• Secure ISP Using On-Chip 128-Bit Advanced Encryption

Standard (AES) Decryption (except ARM®-enabled

ProASIC®3 devices) via JTAG (IEEE 1532–compliant)†

•FlashLock

® to Secure FPGA Contents

Low Power

• Core Voltage for Low Power

• Support for 1.5 V-Only Systems

• Low-Impedance Flash Switches

High-Performance Routing Hierarchy

• Segmented, Hierarchical Routing and Clock Structure

Advanced I/O

• 700 Mbps DDR, LVDS-Capable I/Os (A3P250 and above)

• 1.5 V, 1.8 V, 2.5 V, and 3.3 V Mixed-Voltage Operation

• Bank-Selectable I/O Voltages—up to 4 Banks per Chip

• Single-Ended I/O Standards: LVTTL, LVCMOS 3.3 V /

2.5 V / 1.8 V / 1.5 V, 3.3 V PCI / 3.3 V PCI-X† and LVCMOS

2.5 V / 5.0 V Input

• Differential I/O Standards: LVPECL, LVDS, BLVDS, and M-LVDS

(A3P250 and above)

• I/O Registers on Input, Output, and Enable Paths

• Hot-Swappable and Cold Sparing I/Os‡

• Programmable Output Slew Rate† and Drive Strength

• Weak Pull-Up/-Down

• IEEE 1149.1 (JTAG) Boundary Scan Test

• Pin-Compatible Packages across the ProASIC3 Family

Clock Conditioning Circuit (CCC) and PLL†

• Six CCC Blocks, One with an Integrated PLL

• Configurable Phase-Shift, Multiply/Divide, Delay

Capabilities and External Feedback

• Wide Input Frequency Range (1.5 MHz to 350 MHz)

Embedded Memory†

• 1 kbit of FlashROM User Nonvolatile Memory

• SRAMs and FIFOs with Variable-Aspect-Ratio 4,608-Bit RAM

Blocks (×1, ×2, ×4, ×9, and ×18 organizations)†

• True Dual-Port SRAM (except ×18)

ARM Processor Support in ProASIC3 FPGAs

• M1 and M7 ProASIC3 Devices—Cortex-M1 and CoreMP7 Soft

Processor Available with or without Debug

† A3P015 and A3P030 devices do not support this feature. ‡ Supported only by A3P015 and A3P030 devices.

ProASIC3 Product Family

ProASIC3 Devices A3P015 A3P030 A3P060 A3P125 A3P250 A3P400 A3P600 A3P1000

ARM7 Devices1M7A3P1000

Cortex-M1 Devices1M1A3P250 M1A3P400 M1A3P600 M1A3P1000

System Gates 15 k 30 k 60 k 125 k 250 k 400 k 600 k 1 M

Typical Equivalent Macrocells 128 256 512 1,024 – – – –

VersaTiles (D-flip-flops) 384 768 1,536 3,072 6,144 9,216 13,824 24,576

RAM kbits (1,024 bits) – – 18 36 36 54 108 144

4,608-Bit Blocks ––488122432

FlashROM Bits 1 k 1 k 1 k 1 k 1 k 1 k 1 k 1 k

Secure (AES) ISP2– – Yes Yes Yes Yes Yes Yes

Integrated PLL in CCCs ––11 1 1 1 1

VersaNet Globals36 6 18 18 18 18 18 18

I/O Banks 2222 4 4 4 4

Maximum User I/Os 49 81 96 133 157 194 235 300

Package Pins

QFN

VQFP

TQFP

PQFP

FBGA

QN68 QN132

VQ100 QN132

VQ100

TQ144

FG144

QN132

VQ100

TQ144

PQ208

FG144

QN1325

VQ100

PQ208

FG144/2565PQ208

FG144/256/

484

PQ208

FG144/256/

484

PQ208

FG144/256/

484

Notes:

1. Refer to the CoreMP7 datasheet or Cortex-M1 product brief for more information.

2. AES is not available for ARM-enabled ProASIC3 devices.

3. Six chip (main) and three quadrant global networks are available for A3P060 and above.

4. For higher densities and support of additional features, refer to the ProASIC3E Flash Family FPGAs with Optional ARM Support

handbook.

5. The M1A3P250 device does not support this package.

v1.0

ProASIC3 Flash Family FPGAs

II v1.0

I/Os Per Package1

ProASIC3

Devices A3P015 A3P030 A3P060 A3P125 A3P250 3A3P400 3A3P600 A3P1000

ARM7 Devices M7A3P1000

Cortex-M1

Devices M1A3P250 3,6 M1A3P400 3M1A3P600 M1A3P1000

Package

I/O Type

Single-Ended I/O

Single-Ended I/O2

Differential I/O Pairs

Single-Ended I/O2

Differential I/O Pairs

Single-Ended I/O2

Differential I/O Pairs

Single-Ended I/O2

Differential I/O Pairs

QN68 49 – – – – – –– –––

QN132 – 8180848719–– –––

VQ100 – 77 71 71 68 13 – – – – –

TQ144 – – 91 100 – – ––––––

PQ208 – – – 133 151 34 151 34 154 35 154 35

FG144 – – 96 97 97 24 97 25 97 25 97 25

FG256 – – – – 157 38 178 38 177 43 177 44

FG484 – – – – – – 194 38 235 60 300 74

Notes:

1. When considering migrating your design to a lower- or higher-density device, refer to the ProASIC3 Flash Family FPGAs

handbook to ensure complying with design and board migration requirements.

2. Each used differential I/O pair reduces the number of single-ended I/Os available by two.

3. For A3P250 and A3P400 devices, the maximum number of LVPECL pairs in east and west banks cannot exceed 15. Refer

to the ProASIC3 Flash Family FPGAs t handbook for position assignments of the 15 LVPECL pairs.

4. FG256 and FG484 are footprint-compatible packages.

5. "G" indicates RoHS-compliant packages. Refer to "ProASIC3 Ordering Information" on page III for the location of the

"G" in the part number.

6. The M1A3P250 device does not support FG256 or QN132 packages.

Table 1-1 • ProASIC3 FPGAs Package Sizes Dimensions

Package QN68 QN132 VQ100 TQ144 PQ208 FG144 FG256 FG484

Length × Width

(mm\mm)

8 × 8 8 × 8 14 × 14 20 × 20 28 × 28 13 × 13 17 × 17 23 × 23

Nominal Area

(mm2)

64 64 196 400 784 169 289 529

Pitch (mm) 0.40.50.50.50.51.01.01.0

Height (mm) 0.90 0.75 1.00 1.40 3.40 1.45 1.60 2.23

ProASIC3 Flash Family FPGAs

v1.0 III

ProASIC3 Ordering Information

*The DC and switching characteristics for the –F speed grade targets are based only on simulation.

The characteristics provided for the –F speed grade are subject to change after establishing FPGA specifications. Some

restrictions might be added and will be reflected in future revisions of this document. The –F speed grade is only supported in

the commercial temperature range.

Speed Grade

Blank = Standard

1 = 15% Faster than Standard

2 = 25% Faster than Standard

F = 20% Slower than Standard*

A3P1000 FG

Part Number

ProASIC3 Devices

ProASIC3 Devices with ARM7

Package Type

VQ =Very Thin Quad Flat Pack (0.5 mm pitch)

QN =Quad Flat Pack No Leads (0.4 mm and 0.5 mm pitches)

TQ =Thin Quad Flat Pack (0.5 mm pitch)

144 I

Package Lead Count

Lead-Free Packaging

Application (Temperature Range)

Blank = Commercial (0°C to +70°C Ambient Temperature)

I = Industrial (–40°C to +85°C Ambient Temperature)

Blank = Standard Packaging

G= RoHS-Compliant (Green) Packaging

PP = Pre-Production

ES = Engineering Sample (Room Temperature Only)

30,000 System Gates

A3P030 =

15,000 System Gates

A3P015 =

60,000 System Gates

A3P060 =

125,000 System Gates

A3P125 =

250,000 System Gates

A3P250 =

400,000 System Gates

A3P400 =

600,000 System Gates

A3P600 =

1,000,000 System Gates

A3P1000 =

ProASIC3 Devices with Cortex-M1

250,000 System Gates

M1A3P250 =

400,000 System Gates

M1A3P400 =

600,000 System Gates

M1A3P600 =

1,000,000 System Gates

M1A3P1000 =

1,000,000 System Gates

M7A3P1000 =

PQ =Plastic Quad Flat Pack (0.5 mm pitch)

FG =Fine Pitch Ball Grid Array (1.0 mm pitch)

ProASIC3 Flash Family FPGAs

IV v1.0

Temperature Grade Offerings

Speed Grade and Temperature Grade Matrix

References made to ProASIC3 devices also apply to ARM-enabled ProASIC3 devices. The ARM-enabled part numbers start

with M7 (CoreMP7) and M1 (Cortex-M1).

Contact your local Actel representative for device availability: http://www.actel.com/contact/default.aspx.

A3P015 and A3P030

The A3P015 and A3P030 are architecturally compatible; there are no RAM or PLL features.

Package A3P015 A3P030 A3P060 A3P125 A3P250 A3P400 A3P600 A3P1000

ARM7 Devices M7A3P1000

Cortex-M1 Devices M1A3P250 M1A3P400 M1A3P600 M1A3P1000

QN68 C, I–––––– –

QN132 – C, I C, I C, I C, I – – –

VQ100 – C, I C, I C, I C, I – – –

TQ144 – – C, I C, I – – – –

PQ208 – – – C, I C, I C, I C, I C, I

FG144 – – C, I C, I C, I C, I C, I C, I

FG256 – – – – C, I C, I C, I C, I

FG484 – – – – – C, I C, I C, I

Notes:

1. C = Commercial temperature range: 0°C to 70°C ambient temperature

2. I = Industrial temperature range: –40°C to 85°C ambient temperature

Temperature Grade –F 1Std. –1 –2

C2✓✓✓✓

I3–✓✓✓

Notes:

1. The DC and switching characteristics for the –F speed grade targets are based only on simulation.

The characteristics provided for the –F speed grade are subject to change after establishing FPGA specifications. Some

restrictions might be added and will be reflected in future revisions of this document. The –F speed grade is only

supported in the commercial temperature range.

2. C = Commercial temperature range: 0°C to 70°C ambient temperature

3. I = Industrial temperature range: –40°C to 85°C ambient temperature

v1.0 1-1

1 – ProASIC3 Device Family Overview

General Description

ProASIC3, the third-generation family of Actel flash FPGAs, offers performance, density, and

features beyond those of the ProASICPLUS® family. Nonvolatile flash technology gives ProASIC3

devices the advantage of being a secure, low-power, single-chip solution that is live at power-up

(LAPU). ProASIC3 is reprogrammable and offers time-to-market benefits at an ASIC-level unit cost.

These features enable designers to create high-density systems using existing ASIC or FPGA design

flows and tools.

ProASIC3 devices offer 1 kbit of on-chip, reprogrammable, nonvolatile FlashROM storage as well as

clock conditioning circuitry based on an integrated phase-locked loop (PLL). The A3P015 and

A3P030 devices have no PLL or RAM support. ProASIC3 devices have up to 1 million system gates,

supported with up to 144 kbits of true dual-port SRAM and up to 300 user I/Os.

ProASIC3 devices support the ARM7 soft IP core and Cortex-M1 devices. The ARM-enabled devices

have Actel ordering numbers that begin with M7A3P (CoreMP7) and M1A3P (Cortex-M1) and do

not support AES decryption.

Flash Advantages

Reduced Cost of Ownership

Advantages to the designer extend beyond low unit cost, performance, and ease of use. Unlike

SRAM-based FPGAs, flash-based ProASIC3 devices allow all functionality to be live at power-up; no

external boot PROM is required. On-board security mechanisms prevent access to all the

programming information and enable secure remote updates of the FPGA logic. Designers can

perform secure remote in-system reprogramming to support future design iterations and field

upgrades with confidence that valuable intellectual property (IP) cannot be compromised or

copied. Secure ISP can be performed using the industry-standard AES algorithm. The ProASIC3

family device architecture mitigates the need for ASIC migration at higher user volumes. This

makes the ProASIC3 family a cost-effective ASIC replacement solution, especially for applications in

the consumer, networking/ communications, computing, and avionics markets.

Security

The nonvolatile, flash-based ProASIC3 devices do not require a boot PROM, so there is no

vulnerable external bitstream that can be easily copied. ProASIC3 devices incorporate FlashLock,

which provides a unique combination of reprogrammability and design security without external

overhead, advantages that only an FPGA with nonvolatile flash programming can offer.

ProASIC3 devices utilize a 128-bit flash-based lock and a separate AES key to secure programmed

intellectual property and configuration data. In addition, all FlashROM data in ProASIC3 devices

can be encrypted prior to loading, using the industry-leading AES-128 (FIPS192) bit block cipher

encryption standard. The AES standard was adopted by the National Institute of Standards and

Technology (NIST) in 2000 and replaces the 1977 DES standard. ProASIC3 devices have a built-in AES

decryption engine and a flash-based AES key that make them the most comprehensive

programmable logic device security solution available today. ProASIC3 devices with AES-based

security allow for secure, remote field updates over public networks such as the Internet, and

ensure that valuable IP remains out of the hands of system overbuilders, system cloners, and IP

thieves. The contents of a programmed ProASIC3 device cannot be read back, although secure

design verification is possible.

ARM-enabled ProASIC3 devices do not support user-controlled AES security mechanisms. Since the

ARM core must be protected at all times, AES encryption is always on for the core logic, so

bitstreams are always encrypted. There is no user access to encryption for the FlashROM

programming data.

ProASIC3 Device Family Overview

1-2 v1.0

Security, built into the FPGA fabric, is an inherent component of the ProASIC3 family. The flash cells

are located beneath seven metal layers, and many device design and layout techniques have been

used to make invasive attacks extremely difficult. The ProASIC3 family, with FlashLock and AES

security, is unique in being highly resistant to both invasive and noninvasive attacks. Your valuable

IP is protected and secure, making remote ISP possible. An ProASIC3 device provides the most

impenetrable security for programmable logic designs.

Single Chip

Flash-based FPGAs store their configuration information in on-chip flash cells. Once programmed,

the configuration data is an inherent part of the FPGA structure, and no external configuration

data needs to be loaded at system power-up (unlike SRAM-based FPGAs). Therefore, flash-based

ProASIC3 FPGAs do not require system configuration components such as EEPROMs or

microcontrollers to load device configuration data. This reduces bill-of-materials costs and PCB

area, and increases security and system reliability.

Live at Power-Up

The Actel flash-based ProASIC3 devices support Level 0 of the LAPU classification standard. This

feature helps in system component initialization, execution of critical tasks before the processor

wakes up, setup and configuration of memory blocks, clock generation, and bus activity

management. The LAPU feature of flash-based ProASIC3 devices greatly simplifies total system

design and reduces total system cost, often eliminating the need for CPLDs and clock generation

PLLs that are used for these purposes in a system. In addition, glitches and brownouts in system

power will not corrupt the ProASIC3 device's flash configuration, and unlike SRAM-based FPGAs,

the device will not have to be reloaded when system power is restored. This enables the reduction

or complete removal of the configuration PROM, expensive voltage monitor, brownout detection,

and clock generator devices from the PCB design. Flash-based ProASIC3 devices simplify total

system design and reduce cost and design risk while increasing system reliability and improving

system initialization time.

Firm Errors

Firm errors occur most commonly when high-energy neutrons, generated in the upper atmosphere,

strike a configuration cell of an SRAM FPGA. The energy of the collision can change the state of the

configuration cell and thus change the logic, routing, or I/O behavior in an unpredictable way.

These errors are impossible to prevent in SRAM FPGAs. The consequence of this type of error can be

a complete system failure. Firm errors do not exist in the configuration memory of ProASIC3 flash-

based FPGAs. Once it is programmed, the flash cell configuration element of ProASIC3 FPGAs

cannot be altered by high-energy neutrons and is therefore immune to them. Recoverable (or soft)

errors occur in the user data SRAM of all FPGA devices. These can easily be mitigated by using error

detection and correction (EDAC) circuitry built into the FPGA fabric.

Low Power

Flash-based ProASIC3 devices exhibit power characteristics similar to an ASIC, making them an ideal

choice for power-sensitive applications. ProASIC3 devices have only a very limited power-on current

surge and no high-current transition period, both of which occur on many FPGAs.

ProASIC3 devices also have low dynamic power consumption to further maximize power savings.

ProASIC3 Device Family Overview

v1.0 1-3

Advanced Flash Technology

The ProASIC3 family offers many benefits, including nonvolatility and reprogrammability through

an advanced flash-based, 130-nm LVCMOS process with seven layers of metal. Standard CMOS

design techniques are used to implement logic and control functions. The combination of fine

granularity, enhanced flexible routing resources, and abundant flash switches allows for very high

logic utilization without compromising device routability or performance. Logic functions within

the device are interconnected through a four-level routing hierarchy.

Advanced Architecture

The proprietary ProASIC3 architecture provides granularity comparable to standard-cell ASICs. The

ProASIC3 device consists of five distinct and programmable architectural features (Figure 1-1 and

Figure 1-2 on page 1-4):

• FPGA VersaTiles

• Dedicated FlashROM

• Dedicated SRAM/FIFO memory†

• Extensive CCCs and PLLs†

• Advanced I/O structure

† The A3P015 and A3P030 do not support PLL or SRAM.

*Not supported by A3P015 and A3P030 devices

Figure 1-1 • ProASIC3 Device Architecture Overview with Two I/O Banks (A3P015, A3P030, A3P060, and

A3P125)

RAM Block

4,608-Bit Dual-Port

SRAM or FIFO Block*

VersaTile

CCC

I/Os

ISP AES

Decryption*

User Nonvolatile

FlashROM Charge Pumps

Bank 0

Bank 1Bank 1

Bank 0Bank 0

Bank 1

ProASIC3 Device Family Overview

1-4 v1.0

The FPGA core consists of a sea of VersaTiles. Each VersaTile can be configured as a three-input

logic function, a D-flip-flop (with or without enable), or a latch by programming the appropriate

flash switch interconnections. The versatility of the ProASIC3 core tile as either a three-input

lookup table (LUT) equivalent or as a D-flip-flop/latch with enable allows for efficient use of the

FPGA fabric. The VersaTile capability is unique to the Actel ProASIC family of third-generation

architecture flash FPGAs. VersaTiles are connected with any of the four levels of routing hierarchy.

Flash switches are distributed throughout the device to provide nonvolatile, reconfigurable

interconnect programming. Maximum core utilization is possible for virtually any design.

In addition, extensive on-chip programming circuitry allows for rapid, single-voltage (3.3 V)

programming of ProASIC3 devices via an IEEE 1532 JTAG interface.

VersaTiles

The ProASIC3 core consists of VersaTiles, which have been enhanced beyond the ProASICPLUS® core

tiles. The ProASIC3 VersaTile supports the following:

• All 3-input logic functions—LUT-3 equivalent

• Latch with clear or set

• D-flip-flop with clear or set

• Enable D-flip-flop with clear or set

Figure 1-2 • ProASIC3 Device Architecture Overview with Four I/O Banks (A3P250, A3P600, and A3P1000)

RAM Block

4,608-Bit Dual-Port

SRAM or FIFO Block

(A3P600 and A3P1000)

RAM Block

4,608-Bit Dual-Port

SRAM or FIFO Block

VersaTile

CCC

I/Os

ISP AES

Decryption

User Nonvolatile

FlashROM Charge Pumps

Bank 0

Bank 3Bank 3

Bank 1Bank 1

Bank 2

ProASIC3 Device Family Overview

v1.0 1-5

Refer to Figure 1-3 for VersaTile configurations.

User Nonvolatile FlashROM

Actel ProASIC3 devices have 1 kbit of on-chip, user-accessible, nonvolatile FlashROM. The FlashROM

can be used in diverse system applications:

• Internet protocol addressing (wireless or fixed)

• System calibration settings

• Device serialization and/or inventory control

• Subscription-based business models (for example, set-top boxes)

• Secure key storage for secure communications algorithms

• Asset management/tracking

• Date stamping

• Version management

The FlashROM is written using the standard ProASIC3 IEEE 1532 JTAG programming interface. The

core can be individually programmed (erased and written), and on-chip AES decryption can be used

selectively to securely load data over public networks (except in the A3P015 and A3P030 devices),

as in security keys stored in the FlashROM for a user design.

The FlashROM can be programmed via the JTAG programming interface, and its contents can be

read back either through the JTAG programming interface or via direct FPGA core addressing. Note

that the FlashROM can only be programmed from the JTAG interface and cannot be programmed

from the internal logic array.

The FlashROM is programmed as 8 banks of 128 bits; however, reading is performed on a byte-by-

byte basis using a synchronous interface. A 7-bit address from the FPGA core defines which of the 8

banks and which of the 16 bytes within that bank are being read. The three most significant bits

(MSBs) of the FlashROM address determine the bank, and the four least significant bits (LSBs) of

the FlashROM address define the byte.

The Actel ProASIC3 development software solutions, Libero® Integrated Design Environment (IDE)

and Designer, have extensive support for the FlashROM. One such feature is auto-generation of

sequential programming files for applications requiring a unique serial number in each part.

Another feature allows the inclusion of static data for system version control. Data for the

FlashROM can be generated quickly and easily using Actel Libero IDE and Designer software tools.

Comprehensive programming file support is also included to allow for easy programming of large

numbers of parts with differing FlashROM contents.

SRAM and FIFO

ProASIC3 devices (except the A3P015 and A3P030 devices) have embedded SRAM blocks along their

north and south sides. Each variable-aspect-ratio SRAM block is 4,608 bits in size. Available memory

configurations are 256×18, 512×9, 1k×4, 2k×2, and 4k×1 bits. The individual blocks have

independent read and write ports that can be configured with different bit widths on each port.

For example, data can be sent through a 4-bit port and read as a single bitstream. The embedded

SRAM blocks can be initialized via the device JTAG port (ROM emulation mode) using the UJTAG

macro (except in A3P015 and A3P030 devices).

Figure 1-3 • VersaTile Configurations

LUT-3

Data Y

CLK

Enable

CLR

D-FF

Data Y

CLK

CLR D-FF

LUT-3 Equivalent D-Flip-Flop with Clear or Set Enable D-Flip-Flop with Clear or Set

ProASIC3 Device Family Overview

1-6 v1.0

In addition, every SRAM block has an embedded FIFO control unit. The control unit allows the

SRAM block to be configured as a synchronous FIFO without using additional core VersaTiles. The

FIFO width and depth are programmable. The FIFO also features programmable Almost Empty

(AEMPTY) and Almost Full (AFULL) flags in addition to the normal Empty and Full flags. The

embedded FIFO control unit contains the counters necessary for generation of the read and write

address pointers. The embedded SRAM/FIFO blocks can be cascaded to create larger configurations.

PLL and CCC

ProASIC3 devices provide designers with very flexible clock conditioning capabilities. Each member

of the ProASIC3 family contains six CCCs. One CCC (center west side) has a PLL. The A3P015 and

A3P030 devices do not have a PLL.

The six CCC blocks are located at the four corners and the centers of the east and west sides.

All six CCC blocks are usable; the four corner CCCs and the east CCC allow simple clock delay

operations as well as clock spine access.

The inputs of the six CCC blocks are accessible from the FPGA core or from one of several inputs

located near the CCC that have dedicated connections to the CCC block.

The CCC block has these key features:

• Wide input frequency range (fIN_CCC) = 1.5 MHz to 350 MHz

• Output frequency range (fOUT_CCC) = 0.75 MHz to 350 MHz

• Clock delay adjustment via programmable and fixed delays from –7.56 ns to +11.12 ns

• 2 programmable delay types for clock skew minimization

• Clock frequency synthesis (for PLL only)

Additional CCC specifications:

• Internal phase shift = 0°, 90°, 180°, and 270°. Output phase shift depends on the output

divider configuration (for PLL only).

• Output duty cycle = 50% ± 1.5% or better (for PLL only)

• Low output jitter: worst case < 2.5% × clock period peak-to-peak period jitter when single

global network used (for PLL only)

• Maximum acquisition time = 300 µs (for PLL only)

• Low power consumption of 5 mW

• Exceptional tolerance to input period jitter— allowable input jitter is up to 1.5 ns (for PLL

only)

• Four precise phases; maximum misalignment between adjacent phases of 40 ps × (350 MHz /

fOUT_CCC) (for PLL only)

Global Clocking

ProASIC3 devices have extensive support for multiple clocking domains. In addition to the CCC and

PLL support described above, there is a comprehensive global clock distribution network.

Each VersaTile input and output port has access to nine VersaNets: six chip (main) and three

quadrant global networks. The VersaNets can be driven by the CCC or directly accessed from the

core via multiplexers (MUXes). The VersaNets can be used to distribute low-skew clock signals or for

rapid distribution of high fanout nets.

ProASIC3 Device Family Overview

v1.0 1-7

I/Os with Advanced I/O Standards

The ProASIC3 family of FPGAs features a flexible I/O structure, supporting a range of voltages

(1.5 V, 1.8 V, 2.5 V, and 3.3 V). ProASIC3 FPGAs support many different I/O standards—single-ended

and differential.

The I/Os are organized into banks, with two or four banks per device. The configuration of these

banks determines the I/O standards supported.

Each I/O module contains several input, output, and enable registers. These registers allow the

implementation of the following:

• Single-Data-Rate applications

• Double-Data-Rate applications—DDR LVDS, BLVDS, and M-LVDS I/Os for point-to-point

communications

ProASIC3 banks for the A3P250 device and above support LVPECL, LVDS, BLVDS and M-LVDS. BLVDS

and M-LVDS can support up to 20 loads.

Part Number and Revision Date

Part Number 51700097-001-1

Revised February 2008

List of Changes

The following table lists critical changes that were made in the current version of the document.

Previous Version Changes in Current Version (v1.0) Page

51700097-001-1 This document was divided into two sections and given a version number,

starting at v1.0. The first section of the document includes features, benefits,

ordering information, and temperature and speed grade offerings. The second

section is a device family overview.

51700097-001-0

(January 2008)

This document was updated to include A3P015 device information. QN68 is a

new package that was added because it is offered in the A3P015. The following

sections were updated:

"Features and Benefits"

"ProASIC3 Ordering Information"

"Temperature Grade Offerings"

"ProASIC3 Product Family"

"A3P015 and A3P030" note

"Introduction and Overview"

N/A

The "ProASIC3 FPGAs Package Sizes Dimensions" table is new. II

In the "ProASIC3 Ordering Information", the QN package measurements were

updated to include both 0.4 mm and 0.5 mm.

III

In the "General Description" section, the number of I/Os was updated from 288

to 300.

1-1

v2.2

(July 2007)

This document was previously in datasheet v2.2. As a result of moving to the

handbook format, Actel has restarted the version numbers. The new version

number is 51700097-001-0.

N/A

ProASIC3 Device Family Overview

1-8 v1.0

v2.1

(May 2007)

The M7 and M1 device part numbers have been updated in Table 1 • ProASIC3

Product Family, "I/Os Per Package", "Automotive ProASIC3 Ordering

Information", "Temperature Grade Offerings", and "Speed Grade and

Temperature Grade Matrix".

i, ii, iii,

iii, iv

The words "ambient temperature" were added to the temperature range in

the "Automotive ProASIC3 Ordering Information", "Temperature Grade

Offerings", and "Speed Grade and Temperature Grade Matrix"sections.

iii, iii, iv

v2.0

(April 2007)

In the "Clock Conditioning Circuit (CCC) and PLL" section, the Wide Input

Frequency Range (1.5 MHz to 200 MHz) was changed to (1.5 MHz to 350 MHz).

The "Clock Conditioning Circuit (CCC) and PLL" section was updated. i

In the "I/Os Per Package" section, the A3P030, A3P060, A3P125, ACP250, and

A3P600 device I/Os were updated.

Advanced v0.7

(January 2007)

In the "Packaging Tables", Ambient was deleted. ii

Ambient was deleted from the "Speed Grade and Temperature Grade Matrix". iv

Advanced v0.6

(April 2006)

In the "I/Os Per Package" table, the I/O numbers were added for A3P060,

A3P125, and A3P250. The A3P030-VQ100 I/O was changed from 79 to 77.

Advanced v0.5

(January 2006)

BLVDS and M-LDVS are new I/O standards added to the datasheet. N/A

The term flow-through was changed to pass-through. N/A

Table 1 was updated to include the QN132. ii

The "I/Os Per Package" table was updated with the QN132. The footnotes were

also updated. The A3P400-FG144 I/O count was updated.

"Automotive ProASIC3 Ordering Information" was updated with the QN132. iii

"Temperature Grade Offerings" was updated with the QN132. iii

Advanced v0.4

(November 2005)

The "I/Os Per Package" table was updated for the following devices and

packages:

Device Package

A3P250/M7ACP250 VQ100

A3P250/M7ACP250 FG144

A3P1000 FG256

Advanced v0.3 M7 device information is new. N/A

The I/O counts in the "I/Os Per Package" table were updated. ii

Advanced v0.2 The "I/Os Per Package" table was updated. ii

Previous Version Changes in Current Version (v1.0) Page

v1.1 2-1

ProASIC3 DC and Switching Characteristics

2 – ProASIC3 DC and Switching Characteristics

General Specifications

DC and switching characteristics for –F speed grade targets are based only on simulation.

The characteristics provided for the –F speed grade are subject to change after establishing FPGA

specifications. Some restrictions might be added and will be reflected in future revisions of this

document. The –F speed grade is only supported in the commercial temperature range.

Operating Conditions

Stresses beyond those listed in Table 2-1 may cause permanent damage to the device.

Exposure to absolute maximum rating conditions for extended periods may affect device reliability.

Absolute Maximum Ratings are stress ratings only; functional operation of the device at these or

any other conditions beyond those listed under the Recommended Operating Conditions specified

in Table 2-2 on page 2-2 is not implied.

Table 2-1 • Absolute Maximum Ratings

Symbol Parameter Limits Units

VCC DC core supply voltage –0.3 to 1.65 V

VJTAG JTAG DC voltage –0.3 to 3.75 V

VPUMP Programming voltage –0.3 to 3.75 V

VCCPLL Analog power supply (PLL) –0.3 to 1.65 V

VCCI DC I/O output buffer supply voltage –0.3 to 3.75 V

VMV DC I/O input buffer supply voltage –0.3 to 3.75 V

VI I/O input voltage –0.3 V to 3.6 V

(when I/O hot insertion mode is enabled)

–0.3 V to (VCCI + 1 V) or 3.6 V, whichever voltage is lower

(when I/O hot-insertion mode is disabled)

TSTG 2Storage temperature –65 to +150 °C

TJ2Junction temperature +125 °C

Notes:

1. The device should be operated within the limits specified by the datasheet. During transitions, the input

signal may undershoot or overshoot according to the limits shown in Table 2-4 on page 2-3.

2. For flash programming and retention maximum limits, refer to Table 2-3 on page 2-2, and for

recommended operating limits, refer to Table 2-2 on page 2-2.

ProASIC3 DC and Switching Characteristics

2-2 v1.1

Table 2-2 • Recommended Operating Conditions

Symbol Parameter Commercial Industrial Units

TAAmbient temperature 0 to +70 4,6 –40 to +85 5,6 °C

VCC 1.5 V DC core supply voltage 1.425 to 1.575 1.425 to 1.575 V

VJTAG JTAG DC voltage 1.4 to 3.6 1.4 to 3.6 V

VPUMP Programming voltage Programming Mode 3.15 to 3.45 3.15 to 3.45 V

Operation30 to 3.6 0 to 3.6 V

VCCPLL Analog power supply (PLL) 1.4 to 1.6 1.4 to 1.6 V

VCCI and VMV 1.5 V DC supply voltage 1.425 to 1.575 1.425 to 1.575 V

1.8 V DC supply voltage 1.7 to 1.9 1.7 to 1.9 V

2.5 V DC supply voltage 2.3 to 2.7 2.3 to 2.7 V

3.3 V DC supply voltage 3.0 to 3.6 3.0 to 3.6 V

LVDS/BLVDS/M-LVDS differential I/O 2.375 to 2.625 2.375 to 2.625 V

LVPECL differential I/O 3.0 to 3.6 3.0 to 3.6 V

Notes:

1. The ranges given here are for power supplies only. The recommended input voltage ranges specific to each

I/O standard are given in Table 2-14 on page 2-17. VMV and VCCI should be at the same voltage within a

given I/O bank.

2. All parameters representing voltages are measured with respect to GND unless otherwise specified.

3. VPUMP can be left floating during operation (not programming mode).

4. Maximum TJ = 85°C.

5. Maximum TJ = 100°C.

6. To ensure targeted reliability standards are met across ambient and junction operating temperatures, Actel

recommends that the user follow best design practices using Actel’s timing and power simulation tools.

Table 2-3 • Flash Programming Limits – Retention, Storage and Operating Temperature1

Product Grade

Programming

Cycles

Program Retention

(biased/unbiased)

Maximum Storage

Temperature TSTG (°C) 2

Maximum Operating

Junction Temperature TJ (°C) 2

Commercial 500 20 years 110 100

Industrial 500 20 years 110 100

Notes:

1. This is a stress rating only; functional operation at any condition other than those indicated is not implied.

2. These limits apply for program/data retention only. Refer to Table 2-1 on page 2-1 and Table 2-2 for device

operating conditions and absolute limits.

ProASIC3 DC and Switching Characteristics

v1.1 2-3

I/O Power-Up and Supply Voltage Thresholds for Power-On Reset

(Commercial and Industrial)

Sophisticated power-up management circuitry is designed into every ProASIC3 device. These

circuits ensure easy transition from the powered-off state to the powered-up state of the device.

The many different supplies can power up in any sequence with minimized current spikes or surges.

In addition, the I/O will be in a known state through the power-up sequence. The basic principle is

shown in Figure 2-1 on page 2-4.

There are five regions to consider during power-up.

ProASIC3 I/Os are activated only if ALL of the following three conditions are met:

1. VCC and VCCI are above the minimum specified trip points (Figure 2-1 on page 2-4).

2. VCCI > VCC – 0.75 V (typical)

3. Chip is in the operating mode.

VCCI Trip Point:

Ramping up: 0.6 V < trip_point_up < 1.2 V

Ramping down: 0.5 V < trip_point_down < 1.1 V

VCC Trip Point:

Ramping up: 0.6 V < trip_point_up < 1.1 V

Ramping down: 0.5 V < trip_point_down < 1 V

VCC and VCCI ramp-up trip points are about 100 mV higher than ramp-down trip points. This

specifically built-in hysteresis prevents undesirable power-up oscillations and current surges. Note

the following:

• During programming, I/Os become tristated and weakly pulled up to VCCI.

• JTAG supply, PLL power supplies, and charge pump VPUMP supply have no influence on I/O

behavior.

PLL Behavior at Brownout Condition

Actel recommends using monotonic power supplies or voltage regulators to ensure proper power-

up behavior. Power ramp-up should be monotonic at least until VCC and VCCPLLX exceed brownout

activation levels. The VCC activation level is specified as 1.1 V worst-case (see Figure 2-1 on page 2-4

for more details).

Table 2-4 • Overshoot and Undershoot Limits (as measured on quiet I/Os)1

VCCI and VMV

Average VCCI–GND Overshoot or Undershoot

Duration as a Percentage of Clock Cycle2Maximum Overshoot/

Undershoot2

2.7 V or less 10% 1.4 V

5% 1.49 V

3 V 10% 1.1 V

5% 1.19 V

3.3 V 10% 0.79 V

5% 0.88 V

3.6 V 10% 0.45 V

5% 0.54 V

Notes:

1. Based on reliability requirements at 85°C.

2. The duration is allowed at one out of six clock cycles (estimated SSO density over cycles). If the

overshoot/undershoot occurs at one out of two cycles, the maximum overshoot/undershoot has to be

reduced by 0.15 V.

3. This table refers only to overshoot/undershoot limits for simultaneous switching I/Os and does not provide

PCI overshoot/undershoot limits.

ProASIC3 DC and Switching Characteristics

2-4 v1.1

When PLL power supply voltage and/or VCC levels drop below the VCC brownout levels (0.75 V ±

0.25 V), the PLL output lock signal goes low and/or the output clock is lost. Refer to the Power-Up

Behavior of ProASIC3/E Devices chapter of the handbook for information on clock and lock

recovery.

Internal Power-Up Activation Sequence

1. Core

2. Input buffers

Output buffers, after 200 ns delay from input buffer activation

Figure 2-1 • I/O State as a Function of VCCI and VCC Voltage Levels

Region 1: I/O buffers are OFF

Region 2: I/O buffers are ON.

I/Os are functional (except differential inputs)

but slower because VCCI/VCC are below

specification. For the same reason, input

buffers do not meet VIH/VIL levels, and

output buffers do not meet VOH/VOL levels.

Min VCCI datasheet specification

voltage at a selected I/O

standard; i.e., 1.425 V or 1.7 V

or 2.3 V or 3.0 V

VCC

VCC = 1.425 V

Region 1: I/O Buffers are OFF

Activation trip point:

Va = 0.85 V ± 0.25 V

Deactivation trip point:

Vd = 0.75 V ± 0.25 V

Activation trip point:

Va = 0.9 V ± 0.3 V

Deactivation trip point:

Vd = 0.8 V ± 0.3 V

VCC = 1.575 V

Region 5: I/O buffers are ON

and power supplies are within

specification.

I/Os meet the entire datasheet

and timer specifications for

speed, VIH/VIL , VOH/VOL , etc.

Region 4: I/O

buffers are ON.

I/Os are functional

(except differential

but slower because VCCI is

below specification. For the

same reason, input buffers do not

meet VIH/VIL levels, and output

buffers do not meet VOH/VOL levels.

Region 4: I/O

buffers are ON.

I/Os are functional

(except differential inputs)

where VT can be from 0.58 V to 0.9 V (typically 0.75 V)

VCCI

Region 3: I/O buffers are ON.

I/Os are functional; I/O DC

specifications are met,

but I/Os are slower because

the VCC is below specification.

VCC = VCCI + VT

ProASIC3 DC and Switching Characteristics

v1.1 2-5

Thermal Characteristics

Introduction

The temperature variable in the Actel Designer software refers to the junction temperature, not

the ambient temperature. This is an important distinction because dynamic and static power

consumption cause the chip junction to be higher than the ambient temperature.

EQ 2-1 can be used to calculate junction temperature.

TJ = Junction Temperature = ΔT + TA

EQ 2-1

where:

TA = Ambient Temperature

ΔT = Temperature gradient between junction (silicon) and ambient ΔT = θja * P

θja = Junction-to-ambient of the package. θja numbers are located in Table 2-5.

P = Power dissipation

Package Thermal Characteristics

The device junction-to-case thermal resistivity is θjc and the junction-to-ambient air thermal

resistivity is θja. The thermal characteristics for θja are shown for two air flow rates. The absolute

maximum junction temperature is 110°C. EQ 2-2 shows a sample calculation of the absolute

maximum power dissipation allowed for a 484-pin FBGA package at commercial temperature and

in still air.

EQ 2-2

Maximum Power Allowed Max. junction temp. (°C) Max. ambient temp. (°C)–

θja(°C/W)

--------------------------------------------------------------------------------------------------------------------------------------- 110°C70°C–

20.5°C/W

------------------------------------ 1 . 9 5 1 W

===

Table 2-5 • Package Thermal Resistivities

Package Type Device Pin Count θjc

θja

UnitsStill Air 200 ft./min. 500 ft./min.

Quad Flat No Lead A3P030 132 0.4 21.4 16.8 15.3 C/W

A3P060 132 0.3 21.2 16.6 15.0 C/W

A3P125 132 0.2 21.1 16.5 14.9 C/W

A3P250 132 0.1 21.0 16.4 14.8 C/W

Very Thin Quad Flat Pack (VQFP) All devices 100 10.0 35.3 29.4 27.1 C/W

Thin Quad Flat Pack (TQFP) All devices 144 11.0 33.5 28.0 25.7 C/W

Plastic Quad Flat Pack (PQFP) All devices 208 8.0 26.1 22.5 20.8 C/W

PQFP with embedded heatspreader All devices 208 3.8 16.2 13.3 11.9 C/W

Fine Pitch Ball Grid Array (FBGA) See note* 144 3.8 26.9 22.9 21.5 C/W

See note* 256 3.8 26.6 22.8 21.5 C/W

See note* 484 3.2 20.5 17.0 15.9 C/W

A3P1000 144 6.3 31.6 26.2 24.2 C/W

A3P1000 256 6.6 28.1 24.4 22.7 C/W

A3P1000 484 8.0 23.3 19.0 16.7 C/W

*This information applies to all ProASIC3 devices except the A3P1000. Detailed device/package thermal

information will be available in future revisions of the datasheet.

ProASIC3 DC and Switching Characteristics

2-6 v1.1

Temperature and Voltage Derating Factors

Calculating Power Dissipation

Quiescent Supply Current

Table 2-6 • Temperature and Voltage Derating Factors for Timing Delays

(normalized to TJ = 70°C, VCC = 1.425 V)

Array Voltage VCC (V)

Junction Temperature (°C)

–40°C 0°C 25°C 70°C 85°C 110°C

1.425 0.87 0.92 0.95 1.00 1.02 1.05

1.500 0.83 0.88 0.90 0.95 0.97 0.99

1.575 0.80 0.85 0.87 0.92 0.93 0.96

Table 2-7 • Quiescent Supply Current Characteristics

A3P030 A3P060 A3P125 A3P250 A3P400 A3P600 A3P1000

Typical (25°C) 2 mA 2 mA 2 mA 3 mA 3 mA 5 mA 8 mA

Maximum (Commercial) 10 mA 10 mA 10 mA 20 mA 20 mA 30 mA 50 mA

Maximum (Industrial) 15 mA 15 mA 15 mA 30 mA 30 mA 45 mA 75 mA

Notes:

1. IDD Includes VCC, VPUMP, VCCI, and VMV currents. Values do not include I/O static contribution,

which is shown in Table 2-8 and Table 2-9 on page 2-7.

2. –F speed grade devices may experience higher standby IDD of up to five times the standard IDD

and higher I/O leakage.

ProASIC3 DC and Switching Characteristics

v1.1 2-7

Power per I/O Pin

Table 2-8 • Summary of I/O Input Buffer Power (per pin) – Default I/O Software Settings1

Applicable to Advanced I/O Banks

CLOAD (pF) VCCI (V)

Static Power

PDC3 (mW)2Dynamic Power

PAC10 (µW/MHz)3

Single-Ended

3.3 V LVTTL /

3.3 V LVCMOS

35 3.3 – 468.67

2.5 V LVCMOS 35 2.5 – 267.48

1.8 V LVCMOS 35 1.8 – 149.46

1.5 V LVCMOS

(JESD8-11)

35 1.5 – 103.12

3.3 V PCI 10 3.3 – 201.02

3.3 V PCI-X 10 3.3 – 201.02

Differential

LVDS – 2.5 7.74 88.92

LVPECL – 3.3 19.54 166.52

Notes:

1. Dynamic power consumption is given for standard load and software default drive strength

and output slew.

2. PDC3 is the static power (where applicable) measured on VMV.

3. PAC10 is the total dynamic power measured on VCC and VMV.

Table 2-9 • Summary of I/O Input Buffer Power (Per Pin) – Default I/O Software Settings1

Applicable to Standard Plus I/O Banks

CLOAD (pF) VCCI (V)

Static Power

PDC3 (mW)2Dynamic Power

PAC10 (µW/MHz)3

Single-Ended

3.3 V LVTTL /

3.3 V LVCMOS

35 3.3 – 452.67

2.5 V LVCMOS 35 2.5 – 258.32

1.8 V LVCMOS 35 1.8 – 133.59

1.5 V LVCMOS

(JESD8-11)

35 1.5 – 92.84

3.3 V PCI 10 3.3 – 184.92

3.3 V PCI-X 10 3.3 – 184.92

Notes:

1. Dynamic power consumption is given for standard load and software default drive strength

and output slew.

2. PDC3 is the static power (where applicable) measured on VMV.

3. PAC10 is the total dynamic power measured on VCC and VMV.

ProASIC3 DC and Switching Characteristics

2-8 v1.1

Table 2-10 • Summary of I/O Output Buffer Power (Per Pin) – Default I/O Software Settings1

Applicable to Standard I/O Banks

CLOAD (pF) VCCI (V)

Static Power

PDC3 (mW)2Dynamic Power

PAC10 (µW/MHz)3

Single-Ended

3.3 V LVTTL /

3.3 V LVCMOS

35 3.3 – 431.08

2.5 V LVCMOS 35 2.5 – 247.36

1.8 V LVCMOS 35 1.8 – 128.46

1.5 V LVCMOS

(JESD8-11)

35 1.5 – 89.46

Notes:

1. Dynamic power consumption is given for standard load and software default drive strength

and output slew.

2. PDC3 is the static power (where applicable) measured on VCCI.

3. PAC10 is the total dynamic power measured on VCC and VCCI.

ProASIC3 DC and Switching Characteristics

v1.1 2-9

Power Consumption of Various Internal Resources

Table 2-11 • Different Components Contributing to Dynamic Power Consumption in ProASIC3 Devices

Parameter Definition

Device Specific Dynamic Power

(µW/MHz)

A3P1000

A3P600

A3P400

A3P250

A3P125

A3P060

A3P030

PAC1 Clock contribution of a Global Rib 14.50 12.80 12.80 11.00 11.00 9.30 9.30

PAC2 Clock contribution of a Global Spine 2.48 1.85 1.35 1.58 0.81 0.81 0.41

PAC3 Clock contribution of a VersaTile row 0.81

PAC4 Clock contribution of a VersaTile used as a

sequential module

0.12

PAC5 First contribution of a VersaTile used as a

sequential module

0.07

PAC6 Second contribution of a VersaTile used as a

sequential module

0.29

PAC7 Contribution of a VersaTile used as a combinatorial

Module

0.29

PAC8 Average contribution of a routing net 0.70

PAC9 Contribution of an I/O input pin (standard-

dependent)

See Table 2-8 on page 2-7.

PAC10 Contribution of an I/O output pin (standard-

dependent)

See Table 2-8 on page 2-7 and Table 2-9 on

page 2-7.

PAC11 Average contribution of a RAM block during a

read operation

25.00

PAC12 Average contribution of a RAM block during a

write operation

30.00

PAC13 Static PLL contribution 2.55 mW

PAC14 Dynamic contribution for PLL 2.60

*For a different output load, drive strength, or slew rate, Actel recommends using the Actel power spreadsheet

calculator or SmartPower tool in Actel Libero® Integrated Design Environment (IDE).

ProASIC3 DC and Switching Characteristics

2-10 v1.1

Power Calculation Methodology

This section describes a simplified method to estimate power consumption of an application. For

more accurate and detailed power estimations, use the SmartPower tool in Actel Libero IDE

software.

The power calculation methodology described below uses the following variables:

• The number of PLLs as well as the number and the frequency of each output clock

generated

• The number of combinatorial and sequential cells used in the design

•The internal clock frequencies

• The number and the standard of I/O pins used in the design

• The number of RAM blocks used in the design

• Toggle rates of I/O pins as well as VersaTiles—guidelines are provided in Table 2-12 on

page 2-12.

• Enable rates of output buffers—guidelines are provided for typical applications in

Table 2-13 on page 2-12.

• Read rate and write rate to the memory—guidelines are provided for typical applications in

Table 2-13 on page 2-12. The calculation should be repeated for each clock domain defined

in the design.

Methodology

Total Power Consumption—PTOTAL

PTOTAL = PSTAT + PDYN

PSTAT is the total static power consumption.

PDYN is the total dynamic power consumption.

Total Static Power Consumption—PSTAT

PSTAT = PDC1 + NINPUTS* PDC2 + NOUTPUTS* PDC3

NINPUTS is the number of I/O input buffers used in the design.

NOUTPUTS is the number of I/O output buffers used in the design.

Total Dynamic Power Consumption—PDYN

PDYN = PCLOCK + PS-CELL + PC-CELL + PNET + PINPUTS + POUTPUTS + PMEMORY + PPLL

Global Clock Contribution—PCLOCK

PCLOCK = (PAC1 + NSPINE*PAC2 + NROW*PAC3 + NS-CELL* PAC4) * FCLK

NSPINE is the number of global spines used in the user design—guidelines are provided in

Table 2-12 on page 2-12.

NROW is the number of VersaTile rows used in the design—guidelines are provided in Table 2-12

on page 2-12.

FCLK is the global clock signal frequency.

NS-CELL is the number of VersaTiles used as sequential modules in the design.

PAC1, PAC2, PAC3, and PAC4 are device-dependent.

Sequential Cells Contribution—PS-CELL

PS-CELL = NS-CELL * (PAC5 + α1 / 2 * PAC6) * FCLK

NS-CELL is the number of VersaTiles used as sequential modules in the design. When a multi-tile

sequential cell is used, it should be accounted for as 1.

α1 is the toggle rate of VersaTile outputs—guidelines are provided in Table 2-12 on page 2-12.

FCLK is the global clock signal frequency.

ProASIC3 DC and Switching Characteristics

v1.1 2-11

Combinatorial Cells Contribution—PC-CELL

PC-CELL = NC-CELL* α1 / 2 * PAC7 * FCLK

NC-CELL is the number of VersaTiles used as combinatorial modules in the design.

α1 is the toggle rate of VersaTile outputs—guidelines are provided in Table 2-12 on page 2-12.

FCLK is the global clock signal frequency.

Routing Net Contribution—PNET

PNET = (NS-CELL + NC-CELL) * α1 / 2 * PAC8 * FCLK

NS-CELL is the number of VersaTiles used as sequential modules in the design.

NC-CELL is the number of VersaTiles used as combinatorial modules in the design.

α1 is the toggle rate of VersaTile outputs—guidelines are provided in Table 2-12 on page 2-12.

FCLK is the global clock signal frequency.

I/O Input Buffer Contribution—PINPUTS

PINPUTS = NINPUTS * α2 / 2 * PAC9 * FCLK

NINPUTS is the number of I/O input buffers used in the design.

α2 is the I/O buffer toggle rate—guidelines are provided in Table 2-12 on page 2-12.

FCLK is the global clock signal frequency.

I/O Output Buffer Contribution—POUTPUTS

POUTPUTS = NOUTPUTS * α2 / 2 * β1 * PAC10 * FCLK

NOUTPUTS is the number of I/O output buffers used in the design.

α2 is the I/O buffer toggle rate—guidelines are provided in Table 2-12 on page 2-12.

β1 is the I/O buffer enable rate—guidelines are provided in Table 2-13 on page 2-12.

FCLK is the global clock signal frequency.

RAM Contribution—PMEMORY

PMEMORY = PAC11 * NBLOCKS * FREAD-CLOCK * β2 + PAC12 * NBLOCK * FWRITE-CLOCK * β3

NBLOCKS is the number of RAM blocks used in the design.

FREAD-CLOCK is the memory read clock frequency.

β2 is the RAM enable rate for read operations.

FWRITE-CLOCK is the memory write clock frequency.

β3 is the RAM enable rate for write operations—guidelines are provided in Table 2-13 on

page 2-12.

PLL Contribution—PPLL

PPLL = PAC13 + PAC14 *FCLKOUT

FCLKOUT is the output clock frequency.1

1. The PLL dynamic contribution depends on the input clock frequency, the number of output clock signals generated

by the PLL, and the frequency of each output clock. If a PLL is used to generate more than one output clock, include

each output clock in the formula by adding its corresponding contribution (PAC14 * FCLKOUT product) to the total PLL

contribution.

ProASIC3 DC and Switching Characteristics

2-12 v1.1

Guidelines

Toggle Rate Definition

A toggle rate defines the frequency of a net or logic element relative to a clock. It is a percentage.

If the toggle rate of a net is 100%, this means that this net switches at half the clock frequency.

Below are some examples:

• The average toggle rate of a shift register is 100% because all flip-flop outputs toggle at

half of the clock frequency.

• The average toggle rate of an 8-bit counter is 25%:

– Bit 0 (LSB) = 100%

– Bit 1 = 50%

– Bit 2 = 25%

–…

– Bit 7 (MSB) = 0.78125%

– Average toggle rate = (100% + 50% + 25% + 12.5% + . . . + 0.78125%) / 8

Enable Rate Definition

Output enable rate is the average percentage of time during which tristate outputs are enabled.

When nontristate output buffers are used, the enable rate should be 100%.

Table 2-12 • Toggle Rate Guidelines Recommended for Power Calculation

Component Definition Guideline

α1Toggle rate of VersaTile outputs 10%

α2I/O buffer toggle rate 10%

Table 2-13 • Enable Rate Guidelines Recommended for Power Calculation

Component Definition Guideline

β1I/O output buffer enable rate 100%

β2RAM enable rate for read operations 12.5%

β3RAM enable rate for write operations 12.5%

ProASIC3 DC and Switching Characteristics

v1.1 2-13

User I/O Characteristics

Timing Model

Figure 2-2 • Timing Model

Operating Conditions: –2 Speed, Commercial Temperature Range (TJ = 70°C), Worst Case

VCC =1.425V

DQ DQ

Combinational Cell

I/O Module

(Registered)

I/O Module

(Non-Registered)

I/O Module

(Registered)

I/O Module

(Non-Registered)

LVPECL (Applicable to

Advanced I/O Banks Only)L

LVPECL

(Applicable

to Advanced

I/O Banks only)

LVDS,

BLVDS,

M-LVDS

(Applicable for

Advanced I/O

Banks only)

LVTTL 3.3 V Output drive

strength = 12 mA High slew rate

Combinational Cell

I/O Module

(Non-Registered)

LVTTL Output drive strength = 8 mA

High slew rate

I/O Module

(Non-Registered)

LVCMOS 1.5 V Output drive strength = 4 mA

High slew rate

LVTTL Output drive strength = 12 mA

High slew rate

I/O Module

(Non-Registered)

Input LVTTL

Clock

Input LVTTL

Clock

Input LVTTL

Clock

tPD = 0.56 ns tPD = 0.49 ns

tDP = 1.34 ns

tPD = 0.87 ns tDP = 2.64 ns (Advanced I/O Banks)

tPD = 0.47 ns

tDP = 3.66 ns (Advanced I/O Banks)

tPD = 0.47 ns tDP = 3.97 ns (Advanced I/O Banks)

tPD = 0.47 ns

tPY = 0.76 ns

(Advanced I/O Banks)

tCLKQ = 0.55 ns tOCLKQ = 0.59 ns

tSUD = 0.43 ns tOSUD = 0.31 ns

tDP = 2.64 ns

(Advanced I/O Banks)

tPY = 0.76 ns (Advanced I/O Banks)

tPY = 1.20 ns

tCLKQ = 0.55 ns

tSUD = 0.43 ns

tPY = 0.76 ns

(Advanced I/O Banks)

tICLKQ = 0.24 ns

tISUD = 0.26 ns

tPY = 1.05 ns

ProASIC3 DC and Switching Characteristics

2-14 v1.1

Figure 2-3 • Input Buffer Timing Model and Delays (example)

tPY

(R)

PAD

Vtrip

GND tPY

(F)

Vtrip

50%

VIH

VCC

VIL

tDOUT

(R)

DIN

GND tDOUT

(F)

50%50%

VCC

PAD Y

tPY

CLK

I/O Interface

DIN

tDIN

To Array

tPY = MAX(tPY(R), tPY(F))

tDIN = MAX(tDIN(R), tDIN(F))

ProASIC3 DC and Switching Characteristics

v1.1 2-15

Figure 2-4 • Output Buffer Model and Delays (example)

tDP

(R)

PAD VOL

tDP

(F)

Vtrip

VOH

VCC

D50% 50%

VCC

0 V

DOUT 50% 50% 0 V

tDOUT

(R)

tDOUT

(F)

From Array

PAD

tDP

Std

Load

CLK

I/O Interface

DOUT

tDOUT

tDP = MAX(tDP(R), tDP(F))

tDOUT = MAX(tDOUT(R), tDOUT(F))

ProASIC3 DC and Switching Characteristics

2-16 v1.1

Figure 2-5 • Tristate Output Buffer Timing Model and Delays (example)

CLK

10% V

CCI

trip

50%

90% V

CCI

trip

50% 50% t

50%

EOUT

PAD

E50%

EOUT (R)

50%

EOUT (F)

PAD

DOUT

EOUT

I/O Interface

EOUT

ZLS

trip

50%

ZHS

trip

50%

EOUT

PAD

E50% 50%

EOUT (R)

EOUT (F)

50%

CCI

, t

ZLS

, t

ZHS

EOUT

= MAX(t

EOUT

(r), t

EOUT

(f))

ProASIC3 DC and Switching Characteristics

v1.1 2-17

Overview of I/O Performance

Summary of I/O DC Input and Output Levels – Default I/O Software

Settings

Table 2-14 • Summary of Maximum and Minimum DC Input and Output Levels Applicable to Commercial and

Industrial Conditions—Software Default Settings

Applicable to Advanced I/O Banks

I/O Standard

Drive

Strength

Slew

Rate

VIL VIH VOL VOH IOL IOH

Min, V Max, V Min, V Max, V Max, V Min, V mA mA

3.3 V LVTTL /

3.3 V LVCMOS

12 mA High –0.3 0.8 2 3.6 0.4 2.4 12 12

2.5 V LVCMOS 12 mA High –0.3 0.7 1.7 3.6 0.7 1.7 12 12

1.8 V LVCMOS 12 mA High –0.3 0.35 * VCCI 0.65 * VCCI 3.6 0.45 VCCI – 0.45 12 12

1.5 V LVCMOS 12 mA High –0.3 0.30 * VCCI 0.7 * VCCI 3.6 0.25 * VCCI 0.75 * VCCI 12 12

3.3 V PCI Per PCI specifications

3.3 V PCI-X Per PCI-X specifications

Note: Currents are measured at 85°C junction temperature.

Table 2-15 • Summary of Maximum and Minimum DC Input and Output Levels Applicable to Commercial and

Industrial Conditions—Software Default Settings

Applicable to Standard Plus I/O Banks

I/O Standard

Drive

Strength

Slew

Rate

VIL VIH VOL VOH IOL IOH

Min, V Max, V Min, V Max, V Max, V Min, V mA mA

3.3 V LVTTL /

3.3 V LVCMOS

12 mA High –0.3 0.8 2 3.6 0.4 2.4 12 12

2.5 V LVCMOS 12 mA High –0.3 0.7 1.7 3.6 0.7 1.7 12 12

1.8 V LVCMOS 8 mA High –0.3 0.35 * VCCI 0.65 * VCCI 3.6 0.45 VCCI – 0.45 8 8

1.5 V LVCMOS 4 mA High –0.3 0.30 * VCCI 0.7 * VCCI 3.6 0.25 * VCCI 0.75 * VCCI 4 4

3.3 V PCI Per PCI specifications

3.3 V PCI-X Per PCI-X specifications

Note: Currents are measured at 85°C junction temperature.

Table 2-16 • Summary of Maximum and Minimum DC Input and Output Levels Applicable to Commercial and

Industrial Conditions—Software Default Settings

Applicable to Standard I/O Banks

I/O Standard

Drive

Strength

Slew

Rate

VIL VIH VOL VOH IOL IOH

Min, V Max, V Min, V Max, V Max, V Min, V mA mA

3.3 V LVTTL /

3.3 V LVCMOS

8 mA High –0.3 0.8 2 3.6 0.4 2.4 8 8

2.5 V LVCMOS 8 mA High –0.3 0.7 1.7 3.6 0.7 1.7 8 8

1.8 V LVCMOS 4 mA High –0.3 0.35 * VCCI 0.65 * VCCI 3.6 0.45 VCCI – 0.45 4 4

1.5 V LVCMOS 2 mA High –0.3 0.30 * VCCI 0.7 * VCCI 3.6 0.25 * VCCI 0.75 * VCCI 22

Note: Currents are measured at 85°C junction temperature.

ProASIC3 DC and Switching Characteristics

2-18 v1.1

Summary of I/O Timing Characteristics – Default I/O Software Settings

Table 2-17 • Summary of Maximum and Minimum DC Input Levels

Applicable to Commercial and Industrial Conditions

DC I/O Standards

Commercial1Industrial2

IIL IIH IIL IIH

µA µA µA µA

3.3 V LVTTL / 3.3 V LVCMOS 10 10 15 15

2.5 V LVCMOS 10 10 15 15

1.8 V LVCMOS 10 10 15 15

1.5 V LVCMOS 10 10 15 15

3.3 V PCI 10 10 15 15

3.3 V PCI-X 10 10 15 15

Notes:

1. Commercial range (0°C < TA < 70°C)

2. Industrial range (–40°C < TA < 85°C)

Table 2-18 • Summary of AC Measuring Points

Standard Measuring Trip Point (Vtrip)

3.3 V LVTTL / 3.3 V LVCMOS 1.4 V

2.5 V LVCMOS 1.2 V

1.8 V LVCMOS 0.90 V

1.5 V LVCMOS 0.75 V

3.3 V PCI 0.285 * VCCI (RR)

0.615 * VCCI (FF)

3.3 V PCI-X 0.285 * VCCI (RR)

0.615 * VCCI (FF)

Table 2-19 • I/O AC Parameter Definitions

Parameter Parameter Definition

tDP Data to Pad delay through the Output Buffer

tPY Pad to Data delay through the Input Buffer

tDOUT Data to Output Buffer delay through the I/O interface

tEOUT Enable to Output Buffer Tristate Control delay through the I/O interface

tDIN Input Buffer to Data delay through the I/O interface

tHZ Enable to Pad delay through the Output Buffer—HIGH to Z

tZH Enable to Pad delay through the Output Buffer—Z to HIGH

tLZ Enable to Pad delay through the Output Buffer—LOW to Z

tZL Enable to Pad delay through the Output Buffer—Z to LOW

tZHS Enable to Pad delay through the Output Buffer with delayed enable—Z to HIGH

tZLS Enable to Pad delay through the Output Buffer with delayed enable—Z to LOW

ProASIC3 DC and Switching Characteristics

v1.1 2-19

Table 2-20 • Summary of I/O Timing Characteristics—Software Default Settings

–2 Speed Grade, Commercial-Case Conditions: TJ = 70°C, Worst Case VCC = 1.425 V,

Worst Case VCCI = 3.0 V

Advanced I/O Banks

I/O Standard

Drive Strength (mA)

Slew Rate

Capacitive Load (pF)

External Resistor (Ω)

tDOUT (ns)

tDP (ns)

tDIN (ns)

tPY (ns)

tEOUT (ns)

tZL (ns)

tZH (ns)

tLZ (ns)

tHZ (ns)

tZLS (ns)

tZHS (ns)

Units

3.3 V LVTTL /

3.3 V LVCMOS

12 High 35 – 0.492.640.030.760.322.692.112.402.684.363.78 ns

2.5 V LVCMOS 12 High 35 – 0.492.660.030.980.322.712.562.472.574.384.23 ns

1.8 V LVCMOS 12 High 35 – 0.492.640.030.910.322.692.272.763.054.363.94 ns

1.5 V LVCMOS 12 High 35 – 0.493.050.031.070.323.102.672.953.144.774.34 ns

3.3 V PCI Per PCI spec. High 10 25 20.49 2.00 0.03 0.65 0.32 2.04 1.46 2.40 2.68 3.71 3.13 ns

3.3 V PCI-X Per PCI-X spec. High 10 25 20.49 2.00 0.03 0.65 0.32 2.04 1.46 2.40 2.68 3.71 3.13 ns

LVDS 24 High––0.491.370.031.20–––––––ns

LVPECL 24 High––0.491.340.031.05–––––––ns

Notes:

1. For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating

values.

2. Resistance is used to measure I/O propagation delays as defined in PCI specifications. See Figure 2-10 on

page 2-54 for connectivity. This resistor is not required during normal operation.

ProASIC3 DC and Switching Characteristics

2-20 v1.1

Table 2-21 • Summary of I/O Timing Characteristics—Software Default Settings

–2 Speed Grade, Commercial-Case Conditions: TJ = 70°C, Worst Case VCC = 1.425 V, Worst Case

VCCI =3.0V

Standard Plus I/O Banks

I/O Standard

Drive Strength (mA)

Slew Rate

Capacitive Load (pF)

External Resistor

tDOUT (ns)

tDP (ns)

tDIN (ns)

tPY (ns)

tEOUT (ns)

tZL (ns)

tZH (ns)

tLZ (ns)

tHZ (ns)

tZLS (ns)

tZHS (ns)

Units

3.3 V LVTTL /

3.3 V LVCMOS

12 mA High 35 pF – 0.49 2.36 0.03 0.75 0.32 2.40 1.93 2.08 2.41 4.07 3.60 ns

2.5 V LVCMOS 12 mA High 35 pF – 0.49 2.39 0.03 0.970.322.442.352.112.324.114.02 ns

1.8 V LVCMOS 8 mA High 35 pF – 0.49 3.03 0.03 0.900.322.873.032.192.324.544.70 ns

1.5 V LVCMOS 4 mA High 35 pF – 0.49 3.61 0.03 1.060.323.353.612.262.345.025.28 ns

3.3 V PCI Per PCI spec. High 10 pF 25 20.49 1.72 0.03 0.64 0.32 1.76 1.27 2.08 2.41 3.42 2.94 ns

3.3 V PCI-X Per PCI-X spec. High 10 pF 25 20.49 1.72 0.03 0.64 0.32 1.76 1.27 2.08 2.41 3.42 2.94 ns

Notes:

1. For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating

values.

2. Resistance is used to measure I/O propagation delays as defined in PCI specifications. See Figure 2-10 on

page 2-54 for connectivity. This resistor is not required during normal operation.

Table 2-22 • Summary of I/O Timing Characteristics—Software Default Settings

–2 Speed Grade, Commercial-Case Conditions: TJ = 70°C, Worst Case VCC = 1.425 V,

Worst Case VCCI = 3.0 V

Standard I/O Banks

I/O Standard

Drive Strength (mA)

Slew Rate

Capacitive Load (pF)

External Resistor

tDOUT (ns)

tDP (ns)

tDIN (ns)

tPY (ns)

tEOUT (ns)

tZL (ns)

tZH (ns)

tLZ (ns)

tHZ (ns)

Units

3.3 V LVTTL /

3.3 V LVCMOS

8 mA High 35 pF – 0.49 3.29 0.03 0.75 0.32 3.36 2.80 1.79 2.01 ns

2.5 V LVCMOS 8 mA High 35 pF – 0.49 3.56 0.03 0.96 0.32 3.40 3.56 1.78 1.91 ns

1.8 V LVCMOS 4 mA High 35 pF – 0.49 4.74 0.03 0.90 0.32 4.02 4.74 1.80 1.85 ns

1.5 V LVCMOS 2 mA High 35 pF – 0.49 5.71 0.03 1.06 0.32 4.71 5.71 1.83 1.83 ns

Notes:

1. For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating

values.

2. Resistance is used to measure I/O propagation delays as defined in PCI specifications. See Figure 2-10 on

page 2-54 for connectivity. This resistor is not required during normal operation.

ProASIC3 DC and Switching Characteristics

v1.1 2-21

Detailed I/O DC Characteristics

Table 2-23 • Input Capacitance

Symbol Definition Conditions Min. Max. Units

CIN Input capacitance VIN = 0, f = 1.0 MHz 8 pF

CINCLK Input capacitance on the clock pin VIN = 0, f = 1.0 MHz 8 pF

Table 2-24 • I/O Output Buffer Maximum Resistances1

Applicable to Advanced I/O Banks

Standard Drive Strength

RPULL-DOWN

(Ω)2RPULL-UP

(Ω)3

3.3 V LVTTL / 3.3 V LVCMOS 2 mA 100 300

4 mA 100 300

6 mA 50 150

8 mA 50 150

12 mA 25 75

16 mA 17 50

24 mA 11 33

2.5 V LVCMOS 2 mA 100 200

4 mA 100 200

6 mA 50 100

8 mA 50 100

12 mA 25 50

16 mA 20 40

24 mA 11 22

1.8 V LVCMOS 2 mA 200 225

4 mA 100 112

6 mA 50 56

8 mA 50 56

12 mA 20 22

16 mA 20 22

1.5 V LVCMOS 2 mA 200 224

4 mA 100 112

6 mA 67 75

8 mA 33 37

12 mA 33 37

3.3 V PCI/PCI-X Per PCI/PCI-X specification 25 75

Notes:

1. These maximum values are provided for informational reasons only. Minimum output buffer

resistance values depend on VCCI, drive strength selection, temperature, and process. For

board design considerations and detailed output buffer resistances, use the corresponding

IBIS models located on the Actel website at http://www.actel.com/download/ibis/default.aspx.

2. R(PULL-DOWN-MAX) = (VOLspec) / IOLspec

3. R(PULL-UP-MAX) = (VCCImax – VOHspec) / IOHspec

ProASIC3 DC and Switching Characteristics

2-22 v1.1

Table 2-25 • I/O Output Buffer Maximum Resistances1

Applicable to Standard Plus I/O Banks

Standard Drive Strength

RPULL-DOWN

(Ω)2RPULL-UP

(Ω)3

3.3 V LVTTL / 3.3 V LVCMOS 2 mA 100 300

4 mA 100 300

6 mA 50 150

8 mA 50 150

12 mA 25 75

16 mA 25 75

2.5 V LVCMOS 2 mA 100 200

4 mA 100 200

6 mA 50 100

8 mA 50 100

12 mA 25 50

1.8 V LVCMOS 2 mA 200 225

4 mA 100 112

6 mA 50 56

8 mA 50 56

1.5 V LVCMOS 2 mA 200 224

4 mA 100 112

3.3 V PCI/PCI-X Per PCI/PCI-X specification 0 0

Notes:

1. These maximum values are provided for informational reasons only. Minimum output buffer

resistance values depend on VCCI, drive strength selection, temperature, and process. For

board design considerations and detailed output buffer resistances, use the corresponding

IBIS models located on the Actel website at http://www.actel.com/download/ibis/default.aspx.

2. R(PULL-DOWN-MAX) = (VOLspec) / IOLspec

3. R(PULL-UP-MAX) = (VCCImax – VOHspec) / IOHspec

ProASIC3 DC and Switching Characteristics

v1.1 2-23

Table 2-26 • I/O Output Buffer Maximum Resistances1

Applicable to Standard I/O Banks

Standard Drive Strength

RPULL-DOWN

(Ω)2RPULL-UP

(Ω)3

3.3 V LVTTL / 3.3 V LVCMOS 2 mA 100 300

4 mA 100 300

6 mA 50 150

8 mA 50 150

2.5 V LVCMOS 2 mA 100 200

4 mA 100 200

6 mA 50 100

8 mA 50 100

1.8 V LVCMOS 2 mA 200 225

4 mA 100 112

1.5 V LVCMOS 2 mA 200 224

Notes:

1. These maximum values are provided for informational reasons only. Minimum output buffer

resistance values depend on VCCI, drive strength selection, temperature, and process. For

board design considerations and detailed output buffer resistances, use the corresponding

IBIS models located on the Actel website at http://www.actel.com/download/ibis/default.aspx.

2. R(PULL-DOWN-MAX) = (VOLspec) / IOLspec

3. R(PULL-UP-MAX) = (VCCImax – VOHspec) / IOHspec

Table 2-27 • I/O Weak Pull-Up/Pull-Down Resistances

Minimum and Maximum Weak Pull-Up/Pull-Down Resistance Values

VCCI

R(WEAK PULL-UP)1

(Ω)

R(WEAK PULL-DOWN)2

(Ω)

Min. Max. Min. Max.

3.3 V 10 k 45 k 10 k 45 k

2.5 V 11 k 55 k 12 k 74 k

1.8 V 18 k 70 k 17 k 110 k

1.5 V 19 k 90 k 19 k 140 k

Notes:

1. R(WEAK PULL-UP-MAX) = (VOLspec) / I(WEAK PULL-UP-MIN)

2. R(WEAK PULL-UP-MAX) = (VCCImax – VOHspec) / I(WEAK PULL-UP-MIN)

ProASIC3 DC and Switching Characteristics

2-24 v1.1

Table 2-28 • I/O Short Currents IOSH/IOSL

Applicable to Advanced I/O Banks

Drive Strength IOSL (mA)* IOSH (mA)*

3.3 V LVTTL / 3.3 V LVCMOS 2 mA 27 25

4 mA 27 25

6 mA 54 51

8 mA 54 51

12 mA 109 103

16 mA 127 132

24 mA 181 268

3.3 V LVCMOS 2 mA 27 25

4 mA 27 25

6 mA 54 51

8 mA 54 51

12 mA 109 103

16 mA 127 132

24 mA 181 268

2.5 V LVCMOS 2 mA 18 16

4 mA 18 16

6 mA 37 32

8 mA 37 32

12 mA 74 65

16 mA 87 83

24 mA 124 169

1.8 V LVCMOS 2 mA 11 9

4 mA 22 17

6 mA 44 35

8 mA 51 45

12 mA 74 91

16 mA 74 91

1.5 V LVCMOS 2 mA 16 13

4 mA 33 25

6 mA 39 32

8 mA 55 66

12 mA 55 66

3.3 V PCI/PCI-X Per PCI/PCI-X specification 109 103

*TJ = 100°C

ProASIC3 DC and Switching Characteristics

v1.1 2-25

Table 2-29 • I/O Short Currents IOSH/IOSL

Applicable to Standard Plus I/O Banks

Drive Strength IOSL (mA)* IOSH (mA)*

3.3 V LVTTL / 3.3 V LVCMOS 2 mA 27 25

4 mA 27 25

6 mA 54 51

8 mA 54 51

12 mA 109 103

16 mA 109 103

2.5 V LVCMOS 2 mA 18 16

4 mA 18 16

6 mA 37 32

8 mA 37 32

12 mA 74 65

1.8 V LVCMOS 2 mA 11 9

4 mA 22 17

6 mA 44 35

8 mA 44 35

1.5 V LVCMOS 2 mA 16 13

4 mA 33 25

3.3 V PCI/PCI-X Per PCI/PCI-X specification 109 103

*TJ = 100°C

Table 2-30 • I/O Short Currents IOSH/IOSL

Applicable to Standard I/O Banks

Drive Strength IOSL (mA)* IOSH (mA)*

3.3 V LVTTL / 3.3 V LVCMOS 2 mA 27 25

4 mA 27 25

6 mA 54 51

8 mA 54 51

2.5 V LVCMOS 2 mA 18 16

4 mA 18 16

6 mA 37 32

8 mA 37 32

1.8 V LVCMOS 2 mA 11 9

4 mA 22 17

1.5 V LVCMOS 2 mA 16 13

*TJ = 100°C

ProASIC3 DC and Switching Characteristics

2-26 v1.1

The length of time an I/O can withstand IOSH/IOSL events depends on the junction temperature. The

reliability data below is based on a 3.3 V, 12 mA I/O setting, which is the worst case for this type of

analysis.

For example, at 110°C, the short current condition would have to be sustained for more than three

months to cause a reliability concern. The I/O design does not contain any short circuit protection,

but such protection would only be needed in extremely prolonged stress conditions.

Table 2-31 • Short Current Event Duration before Failure

Temperature Time before Failure

–40°C > 20 years

0°C > 20 years

25°C > 20 years

70°C 5 years

85°C 2 years

100°C 6 months

110°C 3 months

Table 2-32 • I/O Input Rise Time, Fall Time, and Related I/O Reliability

Input Buffer Input Rise/Fall Time (min.) Input Rise/Fall Time (max.) Reliability

LVTTL/LVCMOS No requirement 10 ns * 20 years (110°C)

LVDS/BLVDS/

M-LVDS/LVPECL

No requirement 10 ns * 10 years (100°C)

*The maximum input rise/fall time is related to the noise induced into the input buffer trace. If the

noise is low, then the rise time and fall time of input buffers can be increased beyond the

maximum value. The longer the rise/fall times, the more susceptible the input signal is to the

board noise. Actel recommends signal integrity evaluation/characterization of the system to

ensure that there is no excessive noise coupling into input signals.

ProASIC3 DC and Switching Characteristics

v1.1 2-27

Single-Ended I/O Characteristics

3.3 V LVTTL / 3.3 V LVCMOS

Low-Voltage Transistor–Transistor Logic (LVTTL) is a general-purpose standard (EIA/JESD) for 3.3 V

applications. It uses an LVTTL input buffer and push-pull output buffer.

Table 2-33 • Minimum and Maximum DC Input and Output Levels

Applicable to Advanced I/O Banks

3.3 V LVTTL /

3.3 V LVCMOS VIL VIH VOL VOH IOL IOH IOSL IOSH IIL IIH

Drive Strength Min., V Max., V Min., V Max., V Max., V Min., V mA mA Max., mA1Max., mA1µA2µA2

2 mA –0.3 0.8 2 3.6 0.4 2.4 2 2 27 25 10 10

4 mA –0.3 0.8 2 3.6 0.4 2.4 4 4 27 25 10 10

6 mA –0.3 0.8 2 3.6 0.4 2.4 6 6 54 51 10 10

8 mA –0.3 0.8 2 3.6 0.4 2.4 8 8 54 51 10 10

12 mA –0.3 0.8 23.6 0.4 2.4 12 12 109 103 10 10

16 mA –0.3 0.8 2 3.6 0.4 2.4 16 16 127 132 10 10

24 mA –0.3 0.8 2 3.6 0.4 2.4 24 24 181 268 10 10

Notes:

1. Currents are measured at high temperature (100°C junction temperature) and maximum voltage.

2. Currents are measured at 85°C junction temperature.

3. Software default selection highlighted in gray.

Table 2-34 • Minimum and Maximum DC Input and Output Levels

Applicable to Standard Plus I/O Banks

3.3 V LVTTL /

3.3 V LVCMOS VIL VIH VOL VOH IOL IOH IOSL IOSH IIL IIH

Drive Strength Min., V Max., V Min., V Max., V Max., V Min., V mA mA Max., mA1Max., mA1µA2µA2

2 mA –0.3 0.8 2 3.6 0.4 2.4 2 2 27 25 10 10

4 mA –0.3 0.8 2 3.6 0.4 2.4 4 4 27 25 10 10

6 mA –0.3 0.8 2 3.6 0.4 2.4 6 6 54 51 10 10

8 mA –0.3 0.8 2 3.6 0.4 2.4 8 8 54 51 10 10

12 mA –0.3 0.8 23.6 0.4 2.4 12 12 109 103 10 10

16 mA –0.3 0.8 2 3.6 0.4 2.4 16 16 109 103 10 10

Notes:

1. Currents are measured at high temperature (100°C junction temperature) and maximum voltage.

2. Currents are measured at 85°C junction temperature.

3. Software default selection highlighted in gray.

ProASIC3 DC and Switching Characteristics

2-28 v1.1

Table 2-35 • Minimum and Maximum DC Input and Output Levels

Applicable to Standard I/O Banks

3.3 V LVTTL /

3.3 V LVCMOS VIL VIH VOL VOH IOL IOH IOSL IOSH IIL IIH

Drive Strength Min., V Max., V Min., V Max., V Max., V Min., V mA mA Max., mA1Max., mA1µA2µA2

2 mA –0.3 0.8 2 3.6 0.4 2.4 2 2 25 27 10 10

4 mA –0.3 0.8 2 3.6 0.4 2.4 4 4 25 27 10 10

6 mA –0.3 0.8 2 3.6 0.4 2.4 6 6 51 54 10 10

8 mA –0.3 0.8 2 3.6 0.4 2.4 8 8 51 54 10 10

Notes:

1. Currents are measured at high temperature (100°C junction temperature) and maximum voltage.

2. Currents are measured at 85°C junction temperature.

3. Software default selection highlighted in gray.

Figure 2-6 • AC Loading

Table 2-36 • AC Waveforms, Measuring Points, and Capacitive Loads

Input LOW (V) Input HIGH (V) Measuring Point* (V) CLOAD (pF)

03.31.435

*Measuring point = Vtrip. See Table 2-18 on page 2-18 for a complete table of trip points.

Test Point Test Point

Enable Path

Datapath 35 pF

R = 1 k R to VCCI for tLZ/tZL/tZLS

R to GND for tHZ/tZH/tZHS

35 pF for tZH/tZHS/tZL/tZLS

5 pF for tHZ/tLZ

ProASIC3 DC and Switching Characteristics

v1.1 2-29

Timing Characteristics

Table 2-37 • 3.3 V LVTTL / 3.3 V LVCMOS High Slew

Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V, Worst-Case VCCI = 3.0 V

Applicable to Advanced I/O Banks

Drive

Strength

Speed

Grade tDOUT tDP tDIN tPY tEOUT tZL tZH tLZ tHZ tZLS tZHS Units

4 mA –F 0.79 9.20 0.05 1.22 0.51 9.37 7.91 3.18 3.14 12.05 10.60 ns

Std. 0.66 7.66 0.04 1.02 0.43 7.80 6.59 2.65 2.61 10.03 8.82 ns

–1 0.56 6.51 0.04 0.86 0.36 6.63 5.60 2.25 2.22 8.54 7.51 ns

–2 0.49 5.72 0.03 0.76 0.32 5.82 4.92 1.98 1.95 7.49 6.59 ns

6 mA –F 0.79 5.89 0.05 1.22 0.51 6.00 4.89 3.59 3.85 8.69 7.57 ns

Std. 0.66 4.91 0.04 1.02 0.43 5.00 4.07 2.99 3.20 7.23 6.31 ns

–1 0.56 4.17 0.04 0.86 0.36 4.25 3.46 2.54 2.73 6.15 5.36 ns

–2 0.49 3.66 0.03 0.76 0.32 3.73 3.04 2.23 2.39 5.40 4.71 ns

8 mA –F 0.79 5.89 0.05 1.22 0.51 6.00 4.89 3.59 3.85 8.69 7.57 ns

Std. 0.66 4.91 0.04 1.02 0.43 5.00 4.07 2.99 3.20 7.23 6.31 ns

–1 0.56 4.17 0.04 0.86 0.36 4.25 3.46 2.54 2.73 6.15 5.36 ns

–2 0.49 3.66 0.03 0.76 0.32 3.73 3.04 2.23 2.39 5.40 4.71 ns

12 mA –F 0.79 4.24 0.05 1.22 0.51 4.32 3.39 3.86 4.30 7.01 6.08 ns

Std. 0.66 3.53 0.04 1.02 0.43 3.60 2.82 3.21 3.58 5.83 5.06 ns

–1 0.56 3.00 0.04 0.86 0.36 3.06 2.40 2.73 3.05 4.96 4.30 ns

–2 0.49 2.64 0.03 0.76 0.32 2.69 2.11 2.40 2.68 4.36 3.78 ns

16 mA –F 0.79 4.00 0.05 1.22 0.51 4.08 3.08 3.92 4.42 6.76 5.77 ns

Std. 0.66 3.33 0.04 1.02 0.43 3.39 2.56 3.26 3.68 5.63 4.80 ns

–1 0.56 2.83 0.04 0.86 0.36 2.89 2.18 2.77 3.13 4.79 4.08 ns

–2 0.49 2.49 0.03 0.76 0.32 2.53 1.91 2.44 2.75 4.20 3.58 ns

24 mA –F 0.79 3.69 0.05 1.22 0.51 3.76 2.54 3.99 4.88 6.45 5.23 ns

Std. 0.66 3.08 0.04 1.02 0.43 3.13 2.12 3.32 4.06 5.37 4.35 ns

–1 0.56 2.62 0.04 0.86 0.36 2.66 1.80 2.83 3.45 4.57 3.70 ns

–2 0.49 2.30 0.03 0.76 0.32 2.34 1.58 2.48 3.03 4.01 3.25 ns

Notes:

1. Software default selection highlighted in gray.

2. For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating

values.

ProASIC3 DC and Switching Characteristics

2-30 v1.1

Table 2-38 • 3.3 V LVTTL / 3.3 V LVCMOS Low Slew

Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V, Worst-Case VCCI = 3.0 V

Applicable to Advanced I/O Banks

Drive

Strength

Speed

Grade tDOUT tDP tDIN tPY tEOUT tZL tZH tLZ tHZ tZLS tZHS Units

4 mA –F 0.79 12.32 0.05 1.22 0.51 12.55 10.69 3.18 2.95 15.23 13.37 ns

Std. 0.66 10.26 0.04 1.02 0.43 10.45 8.90 2.64 2.46 12.68 11.13 ns

–1 0.56 8.72 0.04 0.86 0.36 8.89 7.57 2.25 2.09 10.79 9.47 ns

–2 0.49 7.66 0.03 0.76 0.32 7.80 6.64 1.98 1.83 9.47 8.31 ns

6 mA –F 0.79 8.74 0.05 1.22 0.51 8.90 7.55 3.58 3.65 11.59 10.23 ns

Std. 0.66 7.27 0.04 1.02 0.43 7.41 6.28 2.98 3.04 9.65 8.52 ns

–1 0.56 6.19 0.04 0.86 0.36 6.30 5.35 2.54 2.59 8.20 7.25 ns

–2 0.49 5.43 0.03 0.76 0.32 5.53 4.69 2.23 2.27 7.20 6.36 ns

8 mA –F 0.79 8.74 0.05 1.22 0.51 8.90 7.55 3.58 3.65 11.59 10.23 ns

Std. 0.66 7.27 0.04 1.02 0.43 7.41 6.28 2.98 3.04 9.65 8.52 ns

–1 0.56 6.19 0.04 0.86 0.36 6.30 5.35 2.54 2.59 8.20 7.25 ns

–2 0.49 5.43 0.03 0.76 0.32 5.53 4.69 2.23 2.27 7.20 6.36 ns

12 mA –F 0.79 6.70 0.05 1.22 0.51 6.83 5.85 3.85 4.10 9.51 8.54 ns

Std. 0.66 5.58 0.04 1.02 0.43 5.68 4.87 3.21 3.42 7.92 7.11 ns

–1 0.56 4.75 0.04 0.86 0.36 4.84 4.14 2.73 2.91 6.74 6.05 ns

–2 0.49 4.17 0.03 0.76 0.32 4.24 3.64 2.39 2.55 5.91 5.31 ns

16 mA –F 0.79 6.25 0.05 1.22 0.51 6.37 5.48 3.91 4.22 9.06 8.17 ns

Std. 0.66 5.21 0.04 1.02 0.43 5.30 4.56 3.26 3.51 7.54 6.80 ns

–1 0.56 4.43 0.04 0.86 0.36 4.51 3.88 2.77 2.99 6.41 5.79 ns

–2 0.49 3.89 0.03 0.76 0.32 3.96 3.41 2.43 2.62 5.63 5.08 ns

24 mA –F 0.79 5.83 0.05 1.22 0.51 5.93 5.46 3.98 4.67 8.62 8.15 ns

Std. 0.66 4.85 0.04 1.02 0.43 4.94 4.54 3.32 3.88 7.18 6.78 ns

–1 0.56 4.13 0.04 0.86 0.36 4.20 3.87 2.82 3.30 6.10 5.77 ns

–2 0.49 3.62 0.03 0.76 0.32 3.69 3.39 2.48 2.90 5.36 5.06 ns

Note: For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating

values.

ProASIC3 DC and Switching Characteristics

v1.1 2-31

Table 2-39 • 3.3 V LVTTL / 3.3 V LVCMOS High Slew

Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V, Worst-Case VCCI = 3.0 V

Applicable to Standard Plus I/O Banks

Drive

Strength

Speed

Grade tDOUT tDP tDIN tPY tEOUT tZL tZH tLZ tHZ tZLS tZHS Units

4 mA –F 0.79 8.65 0.05 1.20 0.51 8.81 7.55 2.73 2.81 11.50 10.24 ns

Std. 0.66 7.20 0.04 1.00 0.43 7.34 6.29 2.27 2.34 9.57 8.52 ns

–1 0.56 6.13 0.04 0.85 0.36 6.24 5.35 1.93 1.99 8.14 7.25 ns

–2 0.49 5.38 0.03 0.75 0.32 5.48 4.69 1.70 1.75 7.15 6.36 ns

6 mA –F 0.79 5.41 0.05 1.20 0.51 5.51 4.58 3.10 3.45 8.19 7.27 ns

Std. 0.66 4.50 0.04 1.00 0.43 4.58 3.82 2.58 2.88 6.82 6.05 ns

–1 0.56 3.83 0.04 0.85 0.36 3.90 3.25 2.19 2.45 5.80 5.15 ns

–2 0.49 3.36 0.03 0.75 0.32 3.42 2.85 1.92 2.15 5.09 4.52 ns

8 mA –F 0.79 5.41 0.05 1.20 0.51 5.51 4.58 3.10 3.45 8.19 7.27 ns

Std. 0.66 4.50 0.04 1.00 0.43 4.58 3.82 2.58 2.88 6.82 6.05 ns

–1 0.56 3.83 0.04 0.85 0.36 3.90 3.25 2.19 2.45 5.80 5.15 ns

–2 0.49 3.36 0.03 0.75 0.32 3.42 2.85 1.92 2.15 5.09 4.52 ns

12 mA –F 0.79 3.80 0.05 1.20 0.51 3.87 3.10 3.35 3.87 6.55 5.79 ns

Std. 0.66 3.16 0.04 1.00 0.43 3.22 2.58 2.79 3.22 5.45 4.82 ns

–1 0.56 2.69 0.04 0.85 0.36 2.74 2.20 2.37 2.74 4.64 4.10 ns

–2 0.49 2.36 0.03 0.75 0.32 2.40 1.93 2.08 2.41 4.07 3.60 ns

16 mA –F 0.79 3.80 0.05 1.20 0.51 3.87 3.10 3.35 3.87 6.55 5.79 ns

Std. 0.66 3.16 0.04 1.00 0.43 3.22 2.58 2.79 3.22 5.45 4.82 ns

–1 0.56 2.69 0.04 0.85 0.36 2.74 2.20 2.37 2.74 4.64 4.10 ns

–2 0.49 2.36 0.03 0.75 0.32 2.40 1.93 2.08 2.41 4.07 3.60 ns

Notes:

1. Software default selection highlighted in gray.

1. For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating

values.

ProASIC3 DC and Switching Characteristics

2-32 v1.1

Table 2-40 • 3.3 V LVTTL / 3.3 V LVCMOS Low Slew

Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V, Worst-Case VCCI = 3.0 V

Applicable to Standard Plus I/O Banks

Drive

Strength

Speed

Grade tDOUT tDP tDIN tPY tEOUT tZL tZH tLZ tHZ tZLS tZHS Units

4 mA –F 0.79 11.63 0.05 1.20 0.51 11.84 10.12 2.74 2.65 14.53 12.81 ns

Std. 0.66 9.68 0.04 1.00 0.43 9.86 8.42 2.28 2.21 12.09 10.66 ns

–1 0.56 8.23 0.04 0.85 0.36 8.39 7.17 1.94 1.88 10.29 9.07 ns

–2 0.49 7.23 0.03 0.75 0.32 7.36 6.29 1.70 1.65 9.03 7.96 ns

6 mA –F 0.79 8.05 0.05 1.20 0.51 8.20 7.07 3.10 3.29 10.88 9.76 ns

Std. 0.66 6.70 0.04 1.00 0.43 6.82 5.89 2.58 2.74 9.06 8.12 ns

–1 0.56 5.70 0.04 0.85 0.36 5.80 5.01 2.20 2.33 7.71 6.91 ns

–2 0.49 5.00 0.03 0.75 0.32 5.10 4.40 1.93 2.05 6.76 6.06 ns

8 mA –F 0.79 8.05 0.05 1.20 0.51 8.20 7.07 3.10 3.29 10.88 9.76 ns

Std. 0.66 6.70 0.04 1.00 0.43 6.82 5.89 2.58 2.74 9.06 8.12 ns

–1 0.56 5.70 0.04 0.85 0.36 5.80 5.01 2.20 2.33 7.71 6.91 ns

–2 0.49 5.00 0.03 0.75 0.32 5.10 4.40 1.93 2.05 6.76 6.06 ns

12 mA –F 0.79 6.06 0.05 1.20 0.51 6.18 5.42 3.35 3.70 8.86 8.10 ns

Std. 0.66 5.05 0.04 1.00 0.43 5.14 4.51 2.79 3.08 7.38 6.75 ns

–1 0.56 4.29 0.04 0.85 0.36 4.37 3.84 2.38 2.62 6.28 5.74 ns

–2 0.49 3.77 0.03 0.75 0.32 3.84 3.37 2.09 2.30 5.51 5.04 ns

16 mA –F 0.79 6.06 0.05 1.20 0.51 6.18 5.42 3.35 3.70 8.86 8.10 ns

Std. 0.66 5.05 0.04 1.00 0.43 5.14 4.51 2.79 3.08 7.38 6.75 ns

–1 0.56 4.29 0.04 0.85 0.36 4.37 3.84 2.38 2.62 6.28 5.74 ns

–2 0.49 3.77 0.03 0.75 0.32 3.84 3.37 2.09 2.30 5.51 5.04

Note: For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating

values.

ProASIC3 DC and Switching Characteristics

v1.1 2-33

Table 2-41 • 3.3 V LVTTL / 3.3 V LVCMOS High Slew

Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V, Worst-Case VCCI = 3.0 V

Applicable to Standard I/O Banks

Drive

Strength

Speed

Grade tDOUT tDP tDIN tPY tEOUT tZL tZH tLZ tHZ Units

2 mA –F 0.79 8.49 0.05 1.20 0.51 8.65 7.48 2.49 2.58 ns

Std. 0.66 7.07 0.04 1.00 0.43 7.20 6.23 2.07 2.15 ns

–1 0.56 6.01 0.04 0.85 0.36 6.12 5.30 1.76 1.83 ns

–2 0.49 5.28 0.03 0.75 0.32 5.37 4.65 1.55 1.60 ns

4 mA –F 0.79 8.49 0.05 1.20 0.51 8.65 7.48 2.49 2.58 ns

Std. 0.66 7.07 0.04 1.00 0.43 7.20 6.23 2.07 2.15 ns

–1 0.56 6.01 0.04 0.85 0.36 6.12 5.30 1.76 1.83 ns

–2 0.49 5.28 0.03 0.75 0.32 5.37 4.65 1.55 1.60 ns

6 mA –F 0.79 5.30 0.05 1.20 0.51 5.40 4.51 2.88 3.23 ns

Std. 0.66 4.41 0.04 1.00 0.43 4.49 3.75 2.39 2.69 ns

–1 0.56 3.75 0.04 0.85 0.36 3.82 3.19 2.04 2.29 ns

–2 0.49 3.29 0.03 0.75 0.32 3.36 2.80 1.79 2.01 ns

8 mA –F 0.79 5.30 0.05 1.20 0.51 5.40 4.51 2.88 3.23 ns

Std. 0.66 4.41 0.04 1.00 0.43 4.49 3.75 2.39 2.69 ns

–1 0.56 3.75 0.04 0.85 0.36 3.82 3.19 2.04 2.29 ns

–2 0.49 3.29 0.03 0.75 0.32 3.36 2.80 1.79 2.01 ns

Notes:

1. Software default selection highlighted in gray.

2. For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating

values.

ProASIC3 DC and Switching Characteristics

2-34 v1.1

Table 2-42 • 3.3 V LVTTL / 3.3 V LVCMOS Low Slew

Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V, Worst-Case VCCI = 3.0 V

Applicable to Standard I/O Banks

Drive

Strength

Speed

Grade tDOUT tDP tDIN tPY tEOUT tZL tZH tLZ tHZ Units

2 mA –F 0.79 11.37 0.05 1.20 0.51 11.58 10.26 2.49 2.45 ns

Std. 0.66 9.46 0.04 1.00 0.43 9.64 8.54 2.07 2.04 ns

–1 0.56 8.05 0.04 0.85 0.36 8.20 7.27 1.76 1.73 ns

–2 0.49 7.07 0.03 0.75 0.32 7.20 6.38 1.55 1.52 ns

4 mA –F 0.79 11.37 0.05 1.20 0.51 11.58 10.26 2.49 2.45 ns

Std. 0.66 9.46 0.04 1.00 0.43 9.64 8.54 2.07 2.04 ns

–1 0.56 8.05 0.04 0.85 0.36 8.20 7.27 1.76 1.73 ns

–2 0.49 7.07 0.03 0.75 0.32 7.20 6.38 1.55 1.52 ns

6 mA –F 0.79 7.89 0.05 1.20 0.51 8.04 7.19 2.88 3.09 ns

Std. 0.66 6.57 0.04 1.00 0.43 6.69 5.98 2.40 2.57 ns

–1 0.56 5.59 0.04 0.85 0.36 5.69 5.09 2.04 2.19 ns

–2 0.49 4.91 0.03 0.75 0.32 5.00 4.47 1.79 1.92 ns

8 mA –F 0.79 7.89 0.05 1.20 0.51 8.04 7.19 2.88 3.09 ns

Std. 0.66 6.57 0.04 1.00 0.43 6.69 5.98 2.40 2.57 ns

–1 0.56 5.59 0.04 0.85 0.36 5.69 5.09 2.04 2.19 ns

–2 0.49 4.91 0.03 0.75 0.32 5.00 4.47 1.79 1.92 ns

Note: For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating

values.

ProASIC3 DC and Switching Characteristics

v1.1 2-35

2.5 V LVCMOS

Low-Voltage CMOS for 2.5 V is an extension of the LVCMOS standard (JESD8-5) used for general-

purpose 2.5 V applications. It uses a 5 V–tolerant input buffer and push-pull output buffer.

Table 2-43 • Minimum and Maximum DC Input and Output Levels

Applicable to Advanced I/O Banks

2.5 V LVCMOS VIL VIH VOL VOH IOL IOH IOSL IOSH IIL IIH

Drive Strength Min., V Max., V Min., V Max., V Max., V Min., V mA mA Max., mA1Max., mA1µA2µA2

2 mA –0.3 0.7 1.7 3.6 0.7 1.7 2 2 18 16 10 10

4 mA –0.3 0.7 1.7 3.6 0.7 1.7 4 4 18 16 10 10

6 mA –0.3 0.7 1.7 3.6 0.7 1.7 6 6 37 32 10 10

8 mA –0.3 0.7 1.7 3.6 0.7 1.7 8 8 37 32 10 10

12 mA –0.3 0.7 1.7 3.6 0.7 1.7 12 12 74 65 10 10

16 mA –0.3 0.7 1.7 3.6 0.7 1.7 16 16 87 83 10 10

24 mA –0.3 0.7 1.7 3.6 0.7 1.7 24 24 124 169 10 10

Notes:

1. Currents are measured at high temperature (100°C junction temperature) and maximum voltage.

2. Currents are measured at 85°C junction temperature.

3. Software default selection highlighted in gray.

Table 2-44 • Minimum and Maximum DC Input and Output Levels

Applicable to Standard Plus I/O Banks

2.5 V LVCMOS VIL VIH VOL VOH IOL IOH IOSL IOSH IIL IIH

Drive Strength Min., V Max., V Min., V Max., V Max., V Min., V mA mA Max., mA1Max., mA1µA2µA2

2 mA –0.3 0.7 1.7 3.6 0.7 1.7 2 2 18 16 10 10

4 mA –0.3 0.7 1.7 3.6 0.7 1.7 4 4 18 16 10 10

6 mA –0.3 0.7 1.7 3.6 0.7 1.7 6 6 37 32 10 10

8 mA –0.3 0.7 1.7 3.6 0.7 1.7 8 8 37 32 10 10

12 mA –0.3 0.7 1.7 3.6 0.7 1.7 12 12 74 65 10 10

Notes:

1. Currents are measured at high temperature (100°C junction temperature) and maximum voltage.

2. Currents are measured at 85°C junction temperature.

3. Software default selection highlighted in gray.

ProASIC3 DC and Switching Characteristics

2-36 v1.1

Table 2-45 • Minimum and Maximum DC Input and Output Levels

Applicable to Standard I/O Banks

2.5 V LVCMOS VIL VIH VOL VOH IOL IOH IOSL IOSH IIL IIH

Drive Strength Min., V Max., V Min., V Max., V Max., V Min., V mA mA Max., mA1Max., mA1µA2µA2

2 mA –0.3 0.7 1.7 3.6 0.7 1.7 2 2 16 18 10 10

4 mA –0.3 0.7 1.7 3.6 0.7 1.7 4 4 16 18 10 10

6 mA –0.3 0.7 1.7 3.6 0.7 1.7 6 6 32 37 10 10

8 mA –0.3 0.7 1.7 3.6 0.7 1.7 8 8 32 37 10 10

Notes:

1. Currents are measured at high temperature (100°C junction temperature) and maximum voltage.

2. Currents are measured at 85°C junction temperature.

3. Software default selection highlighted in gray.

Figure 2-7 • AC Loading

Table 2-46 • AC Waveforms, Measuring Points, and Capacitive Loads

Input LOW (V) Input HIGH (V) Measuring Point* (V) CLOAD (pF)

02.51.235

*Measuring point = Vtrip. See Table 2-18 on page 2-18 for a complete table of trip points.

Test Point Test Point

Enable Path

Datapath 35 pF

R = 1 k R to VCCI for tLZ/tZL/tZLS

R to GND for tHZ/tZH/tZHS

35 pF for tZH/tZHS/tZL/tZLS

5 pF for tHZ/tLZ

ProASIC3 DC and Switching Characteristics

v1.1 2-37

Timing Characteristics

Table 2-47 • 2.5 V LVCMOS High Slew

Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V, Worst-Case VCCI = 2.3 V

Applicable to Advanced I/O Banks

Drive

Strength

Speed

Grade tDOUT tDP tDIN tPY tEOUT tZL tZH tLZ tHZ tZLS tZHS Units

4 mA –F 0.72 10.41 0.05 1.57 0.51 9.41 10.41 3.22 2.77 12.09 13.09 ns

Std. 0.60 8.66 0.04 1.31 0.43 7.83 8.66 2.68 2.30 10.07 10.90 ns

–1 0.51 7.37 0.04 1.11 0.36 6.66 7.37 2.28 1.96 8.56 9.27 ns

–2 0.45 6.47 0.03 0.98 0.32 5.85 6.47 2.00 1.72 7.52 8.14 ns

6 mA –F 0.72 6.21 0.05 1.57 0.51 6.05 6.21 3.66 3.60 8.74 8.89 ns

Std. 0.60 5.17 0.04 1.31 0.43 5.04 5.17 3.05 3.00 7.27 7.40 ns

–1 0.51 4.39 0.04 1.11 0.36 4.28 4.39 2.59 2.55 6.19 6.30 ns

–2 0.45 3.86 0.03 0.98 0.32 3.76 3.86 2.28 2.24 5.43 5.53 ns

8 mA –F 0.72 6.21 0.05 1.57 0.51 6.05 6.21 3.66 3.60 8.74 8.89 ns

Std. 0.60 5.17 0.04 1.31 0.43 5.04 5.17 3.05 3.00 7.27 7.40 ns

–1 0.51 4.39 0.04 1.11 0.36 4.28 4.39 2.59 2.55 6.19 6.30 ns

–2 0.45 3.86 0.03 0.98 0.32 3.76 3.86 2.28 2.24 5.43 5.53 ns

12 mA –F 0.72 4.28 0.05 1.57 0.51 4.36 4.12 3.97 4.13 7.04 6.81 ns

Std. 0.60 3.56 0.04 1.31 0.43 3.63 3.43 3.30 3.44 5.86 5.67 ns

–1 0.51 3.03 0.04 1.11 0.36 3.08 2.92 2.81 2.92 4.99 4.82 ns

–2 0.45 2.66 0.03 0.98 0.32 2.71 2.56 2.47 2.57 4.38 4.23 ns

16 mA –F 0.72 4.03 0.05 1.57 0.51 4.10 3.68 4.04 4.26 6.79 6.36 ns

Std. 0.60 3.35 0.04 1.31 0.43 3.41 3.06 3.36 3.55 5.65 5.30 ns

–1 0.51 2.85 0.04 1.11 0.36 2.90 2.60 2.86 3.02 4.81 4.51 ns

–2 0.45 2.50 0.03 0.98 0.32 2.55 2.29 2.51 2.65 4.22 3.96 ns

24 mA –F 0.72 3.71 0.05 1.57 0.51 3.78 2.93 4.13 4.80 6.47 5.62 ns

Std. 0.60 3.09 0.04 1.31 0.43 3.15 2.44 3.44 4.00 5.38 4.68 ns

–1 0.51 2.63 0.04 1.11 0.36 2.68 2.08 2.92 3.40 4.58 3.98 ns

–2 0.45 2.31 0.03 0.98 0.32 2.35 1.82 2.57 2.98 4.02 3.49 ns

Notes:

1. Software default selection highlighted in gray.

2. For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating

values.

ProASIC3 DC and Switching Characteristics

2-38 v1.1

Table 2-48 • 2.5 V LVCMOS Low Slew

Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V, Worst-Case VCCI = 2.3 V

Applicable to Advanced I/O Banks

Drive

Strength

Speed

Grade tDOUT tDP tDIN tPY tEOUT tZL tZH tLZ tHZ tZLS tZHS Units

4 mA –F 0.72 13.69 0.05 1.57 0.51 13.48 13.69 3.22 2.65 16.16 16.38 ns

Std. 0.60 11.40 0.04 1.31 0.43 11.22 11.40 2.68 2.20 13.45 13.63 ns

–1 0.51 9.69 0.04 1.11 0.36 9.54 9.69 2.28 1.88 11.44 11.60 ns

–2 0.45 8.51 0.03 0.98 0.32 8.38 8.51 2.00 1.65 10.05 10.18 ns

6 mA –F 0.72 9.56 0.05 1.57 0.51 9.74 9.39 3.66 3.47 12.43 12.07 ns

Std. 0.60 7.96 0.04 1.31 0.43 8.11 7.81 3.05 2.89 10.34 10.05 ns

–1 0.51 6.77 0.04 1.11 0.36 6.90 6.65 2.59 2.46 8.80 8.55 ns

–2 0.45 5.94 0.03 0.98 0.32 6.05 5.84 2.28 2.16 7.72 7.50 ns

8 mA –F 0.72 9.56 0.05 1.57 0.51 9.74 9.39 3.66 3.47 12.43 12.07 ns

Std. 0.60 7.96 0.04 1.31 0.43 8.11 7.81 3.05 2.89 10.34 10.05 ns

–1 0.51 6.77 0.04 1.11 0.36 6.90 6.65 2.59 2.46 8.80 8.55 ns

–2 0.45 5.94 0.03 0.98 0.32 6.05 5.84 2.28 2.16 7.72 7.50 ns

12 mA –F 0.72 7.42 0.05 1.57 0.51 7.56 7.11 3.97 3.99 10.25 9.80 ns

Std. 0.60 6.18 0.04 1.31 0.43 6.29 5.92 3.30 3.32 8.53 8.15 ns

–1 0.51 5.26 0.04 1.11 0.36 5.35 5.03 2.81 2.83 7.26 6.94 ns

–2 0.45 4.61 0.03 0.98 0.32 4.70 4.42 2.47 2.48 6.37 6.09 ns

16 mA –F 0.72 6.92 0.05 1.57 0.51 7.05 6.64 4.04 4.13 9.74 9.32 ns

Std. 0.60 5.76 0.04 1.31 0.43 5.87 5.53 3.36 3.44 8.11 7.76 ns

–1 0.51 4.90 0.04 1.11 0.36 4.99 4.70 2.86 2.92 6.90 6.60 ns

–2 0.45 4.30 0.03 0.98 0.32 4.38 4.13 2.51 2.57 6.05 5.80 ns

24 mA –F 0.72 6.61 0.05 1.57 0.51 6.61 6.61 4.13 4.65 9.30 9.30 ns

Std. 0.60 5.51 0.04 1.31 0.43 5.50 5.51 3.43 3.87 7.74 7.74 ns

–1 0.51 4.68 0.04 1.11 0.36 4.68 4.68 2.92 3.29 6.58 6.59 ns

–2 0.45 4.11 0.03 0.98 0.32 4.11 4.11 2.56 2.89 5.78 5.78 ns

Note: For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating

values.

ProASIC3 DC and Switching Characteristics

v1.1 2-39

Table 2-49 • 2.5 V LVCMOS High Slew

Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V, Worst-Case VCCI = 2.3 V

Applicable to Standard Plus I/O Banks

Drive

Strength

Speed

Grade tDOUT tDP tDIN tPY tEOUT tZL tZH tLZ tHZ tZLS tZHS Units

4 mA –F 0.79 9.94 0.05 1.56 0.51 8.90 9.94 2.70 2.49 11.58 12.63 ns

Std. 0.66 8.28 0.04 1.30 0.43 7.41 8.28 2.25 2.07 9.64 10.51 ns

–1 0.56 7.04 0.04 1.10 0.36 6.30 7.04 1.92 1.76 8.20 8.94 ns

–2 0.49 6.18 0.03 0.97 0.32 5.53 6.18 1.68 1.55 7.20 7.85 ns

6 mA –F 0.79 5.83 0.05 1.56 0.51 5.58 5.83 3.11 3.26 8.27 8.52 ns

Std. 0.66 4.85 0.04 1.30 0.43 4.65 4.85 2.59 2.71 6.88 7.09 ns

–1 0.56 4.13 0.04 1.10 0.36 3.95 4.13 2.20 2.31 5.85 6.03 ns

–2 0.49 3.62 0.03 0.97 0.32 3.47 3.62 1.93 2.02 5.14 5.29 ns

8 mA –F 0.79 5.83 0.05 1.56 0.51 5.58 5.83 3.11 3.26 8.27 8.52 ns

Std. 0.66 4.85 0.04 1.30 0.43 4.65 4.85 2.59 2.71 6.88 7.09 ns

–1 0.56 4.13 0.04 1.10 0.36 3.95 4.13 2.20 2.31 5.85 6.03 ns

–2 0.49 3.62 0.03 0.97 0.32 3.47 3.62 1.93 2.02 5.14 5.29 ns

12 mA –F 0.79 3.85 0.05 1.56 0.51 3.92 3.77 3.39 3.74 6.61 6.46 ns

Std. 0.66 3.21 0.04 1.30 0.43 3.27 3.14 2.82 3.11 5.50 5.38 ns

–1 0.56 2.73 0.04 1.10 0.36 2.78 2.67 2.40 2.65 4.68 4.57 ns

–2 0.49 2.39 0.03 0.97 0.32 2.44 2.35 2.11 2.32 4.11 4.02 ns

Notes:

1. Software default selection highlighted in gray.

2. For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating

values.

ProASIC3 DC and Switching Characteristics

2-40 v1.1

Table 2-50 • 2.5 V LVCMOS Low Slew

Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V, Worst-Case VCCI = 2.3 V

Applicable to Standard Plus I/O Banks

Drive

Strength

Speed

Grade tDOUT tDP tDIN tPY tEOUT tZL tZH tLZ tHZ tZLS tZHS Units

4 mA –F 0.79 13.02 0.05 1.56 0.51 12.78 13.02 2.71 2.39 15.46 15.71 ns

Std. 0.66 10.84 0.04 1.30 0.43 10.64 10.84 2.26 1.99 12.87 13.08 ns

–1 0.56 9.22 0.04 1.10 0.36 9.05 9.22 1.92 1.69 10.95 11.12 ns

–2 0.49 8.10 0.03 0.97 0.32 7.94 8.10 1.68 1.49 9.61 9.77 ns

6 mA –F 0.79 8.85 0.05 1.56 0.51 9.01 8.84 3.11 3.14 11.70 11.53 ns

Std. 0.66 7.37 0.04 1.30 0.43 7.50 7.36 2.59 2.61 9.74 9.60 ns

–1 0.56 6.27 0.04 1.10 0.36 6.38 6.26 2.20 2.22 8.29 8.16 ns

–2 0.49 5.50 0.03 0.97 0.32 5.60 5.50 1.93 1.95 7.27 7.17 ns

8 mA –F 0.79 8.85 0.05 1.56 0.51 9.01 8.84 3.11 3.14 11.70 11.53 ns

Std. 0.66 7.37 0.04 1.30 0.43 7.50 7.36 2.59 2.61 9.74 9.60 ns

–1 0.56 6.27 0.04 1.10 0.36 6.38 6.26 2.20 2.22 8.29 8.16 ns

–2 0.49 5.50 0.03 0.97 0.32 5.60 5.50 1.93 1.95 7.27 7.17 ns

12 mA –F 0.79 6.76 0.05 1.56 0.51 6.89 6.61 3.40 3.62 9.57 9.30 ns

Std. 0.66 5.63 0.04 1.30 0.43 5.73 5.51 2.83 3.01 7.97 7.74 ns

–1 0.56 4.79 0.04 1.10 0.36 4.88 4.68 2.41 2.56 6.78 6.59 ns

–2 0.49 4.20 0.03 0.97 0.32 4.28 4.11 2.11 2.25 5.95 5.78 ns

Note: For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating

values.

ProASIC3 DC and Switching Characteristics

v1.1 2-41

Table 2-51 • 2.5 V LVCMOS High Slew

Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V, Worst-Case VCCI = 3.0 V

Applicable to Standard I/O Banks

Drive

Strength

Speed

Grade tDOUT tDP tDIN tPY tEOUT tZL tZH tLZ tHZ Units

2 mA –F 0.79 9.86 0.05 1.55 0.51 8.70 9.86 2.44 2.29 ns

Std. 0.66 8.20 0.04 1.29 0.43 7.24 8.20 2.03 1.91 ns

–1 0.56 6.98 0.04 1.10 0.36 6.16 6.98 1.73 1.62 ns

–2 0.49 6.13 0.03 0.96 0.32 5.41 6.13 1.52 1.43 ns

4 mA –F 0.79 9.86 0.05 1.55 0.51 8.70 9.86 2.44 2.29 ns

Std. 0.66 8.20 0.04 1.29 0.43 7.24 8.20 2.03 1.91 ns

–1 0.56 6.98 0.04 1.10 0.36 6.16 6.98 1.73 1.62 ns

–2 0.49 6.13 0.03 0.96 0.32 5.41 6.13 1.52 1.43 ns

6 mA –F 0.79 5.72 0.05 1.55 0.51 5.47 5.72 2.86 3.07 ns

Std. 0.66 4.77 0.04 1.29 0.43 4.55 4.77 2.38 2.55 ns

–1 0.56 4.05 0.04 1.10 0.36 3.87 4.05 2.03 2.17 ns

–2 0.49 3.56 0.03 0.96 0.32 3.40 3.56 1.78 1.91 ns

8 mA –F 0.79 5.72 0.05 1.55 0.51 5.47 5.72 2.86 3.07 ns

Std. 0.66 4.77 0.04 1.29 0.43 4.55 4.77 2.38 2.55 ns

–1 0.56 4.05 0.04 1.10 0.36 3.87 4.05 2.03 2.17 ns

–2 0.49 3.56 0.03 0.96 0.32 3.40 3.56 1.78 1.91 ns

Notes:

1. Software default selection highlighted in gray.

2. For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating

values.

ProASIC3 DC and Switching Characteristics

2-42 v1.1

Table 2-52 • 2.5 V LVCMOS Low Slew

Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V, Worst-Case VCCI = 3.0 V

Applicable to Standard I/O Banks

Drive

Strength

Speed

Grade tDOUT tDP tDIN tPY tEOUT tZL tZH tLZ tHZ Units

2 mA –F 0.79 13.21 0.05 1.55 0.51 12.46 13.21 2.44 2.20 ns

Std. 0.66 11.00 0.04 1.29 0.43 10.37 11.00 2.03 1.83 ns

–1 0.56 9.35 0.04 1.10 0.36 8.83 9.35 1.73 1.56 ns

–2 0.49 8.21 0.03 0.96 0.32 7.75 8.21 1.52 1.37 ns

4 mA –F 0.79 13.21 0.05 1.55 0.51 12.46 13.21 2.44 2.20 ns

Std. 0.66 11.00 0.04 1.29 0.43 10.37 11.00 2.03 1.83 ns

–1 0.56 9.35 0.04 1.10 0.36 8.83 9.35 1.73 1.56 ns

–2 0.49 8.21 0.03 0.96 0.32 7.75 8.21 1.52 1.37 ns

6 mA –F 0.79 9.01 0.05 1.55 0.51 8.84 9.01 2.87 2.96 ns

Std. 0.66 7.50 0.04 1.29 0.43 7.36 7.50 2.39 2.46 ns

–1 0.56 6.38 0.04 1.10 0.36 6.26 6.38 2.03 2.10 ns

–2 0.49 5.60 0.03 0.96 0.32 5.49 5.60 1.78 1.84 ns

8 mA –F 0.79 9.01 0.05 1.55 0.51 8.84 9.01 2.87 2.96 ns

Std. 0.66 7.50 0.04 1.29 0.43 7.36 7.50 2.39 2.46 ns

–1 0.56 6.38 0.04 1.10 0.36 6.26 6.38 2.03 2.10 ns

–2 0.49 5.60 0.03 0.96 0.32 5.49 5.60 1.78 1.84 ns

Note: For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating

values.

ProASIC3 DC and Switching Characteristics

v1.1 2-43

1.8 V LVCMOS

Low-voltage CMOS for 1.8 V is an extension of the LVCMOS standard (JESD8-5) used for general-

purpose 1.8 V applications. It uses a 1.8 V input buffer and a push-pull output buffer.

Table 2-53 • Minimum and Maximum DC Input and Output Levels

Applicable to Advanced I/O Banks

1.8 V

LVCMOS VIL VIH VOL VOH IOL IOH IOSL IOSH IIL IIH

Drive

Strength Min., V Max., V Min., V Max., V Max., V Min., V mA mA Max., mA1Max., mA1µA2µA2

2 mA –0.3 0.35 * VCCI 0.65 * VCCI 3.6 0.45 VCCI – 0.45 2 2 11 9 10 10

4 mA –0.3 0.35 * VCCI 0.65 * VCCI 3.6 0.45 VCCI – 0.45 4 4 22 17 10 10

6 mA –0.3 0.35 * VCCI 0.65 * VCCI 3.6 0.45 VCCI – 0.45 6 6 44 35 10 10

8 mA –0.3 0.35 * VCCI 0.65 * VCCI 3.6 0.45 VCCI – 0.45 8 8 51 45 10 10

12 mA –0.3 0.35 * VCCI 0.65 * VCCI 3.6 0.45 VCCI – 0.45 12 12 74 91 10 10

16 mA –0.3 0.35 * VCCI 0.65 * VCCI 3.6 0.45 VCCI – 0.45 16 16 74 91 10 10

Notes:

1. Currents are measured at high temperature (100°C junction temperature) and maximum voltage.

2. Currents are measured at 85°C junction temperature.

3. Software default selection highlighted in gray.

Table 2-54 • Minimum and Maximum DC Input and Output Levels

Applicable to Standard Plus I/O I/O Banks

1.8 V

LVCMOS VIL VIH VOL VOH IOL IOH IOSL IOSH IIL IIH

Drive

Strength Min., V Max., V Min., V Max., V Max., V Min., V mA mA

Max.,

mA1Max.,

mA1µA2µA2

2 mA –0.3 0.35 * VCCI 0.65 * VCCI 3.6 0.45 VCCI – 0.45 2 2 11 9 10 10

4 mA –0.3 0.35 * VCCI 0.65 * VCCI 3.6 0.45 VCCI – 0.45 4 4 22 17 10 10

6 mA –0.3 0.35 * VCCI 0.65 * VCCI 3.6 0.45 VCCI – 0.45 6 6 44 35 10 10

8 mA –0.3 0.35 * VCCI 0.65 * VCCI 3.6 0.45 VCCI – 0.45 8 8 44 35 10 10

Notes:

1. Currents are measured at high temperature (100°C junction temperature) and maximum voltage.

2. Currents are measured at 85°C junction temperature.

3. Software default selection highlighted in gray.

ProASIC3 DC and Switching Characteristics

2-44 v1.1

Table 2-55 • Minimum and Maximum DC Input and Output Levels

Applicable to Standard I/O Banks

1.8 V

LVCMOS VIL VIH VOL VOH IOL IOH IOSL IOSH IIL IIH

Drive

Strength Min., V Max., V Min., V Max., V Max., V Min., V mA mA

Max.,

mA1Max.,

mA1µA2µA2

2 mA –0.3 0.35 * VCCI 0.65 * VCCI 3.6 0.45 VCCI – 0.45 2 2 9 11 10 10

4 mA –0.3 0.35 * VCCI 0.65 * VCCI 3.6 0.45 VCCI – 0.45 4 4 17 22 10 10

Notes:

1. Currents are measured at high temperature (100°C junction temperature) and maximum voltage.

2. Currents are measured at 85°C junction temperature.

3. Software default selection highlighted in gray.

Figure 2-8 • AC Loading

Table 2-56 • AC Waveforms, Measuring Points, and Capacitive Loads

Input LOW (V) Input HIGH (V) Measuring Point* (V) CLOAD (pF)

01.80.935

*Measuring point = Vtrip. See Table 2-18 on page 2-18 for a complete table of trip points.

Test Point Test Point

Enable Path

Datapath 35 pF

R = 1 k R to VCCI for tLZ/tZL/tZLS

R to GND for tHZ/tZH/tZHS

35 pF for tZH/tZHS/tZL/tZLS

5 pF for tHZ/tLZ

ProASIC3 DC and Switching Characteristics

v1.1 2-45

Timing Characteristics

Table 2-57 • 1.8 V LVCMOS High Slew

Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V, Worst-Case VCCI = 1.7 V

Applicable to Advanced I/O Banks

Drive

Strength

Speed

Grade tDOUT tDP tDIN tPY tEOUT tZL tZH tLZ tHZ tZLS tZHS Units

2 mA –F 0.79 14.25 0.05 1.46 0.51 10.97 14.25 3.33 1.99 13.66 16.94 ns

Std. 0.66 11.86 0.04 1.22 0.43 9.14 11.86 2.77 1.66 11.37 14.10 ns

–1 0.56 10.09 0.04 1.04 0.36 7.77 10.09 2.36 1.41 9.67 11.99 ns

–2 0.49 8.86 0.03 0.91 0.32 6.82 8.86 2.07 1.24 8.49 10.53 ns

4 mA –F 0.79 8.31 0.05 1.46 0.51 7.04 8.31 3.87 3.41 9.73 10.99 ns

Std. 0.66 6.91 0.04 1.22 0.43 5.86 6.91 3.22 2.84 8.10 9.15 ns

–1 0.56 5.88 0.04 1.04 0.36 4.99 5.88 2.74 2.41 6.89 7.78 ns

–2 0.49 5.16 0.03 0.91 0.32 4.38 5.16 2.41 2.12 6.05 6.83 ns

6 mA –F 0.79 5.34 0.05 1.46 0.51 5.02 5.34 4.24 4.06 7.71 8.03 ns

Std. 0.66 4.45 0.04 1.22 0.43 4.18 4.45 3.53 3.38 6.42 6.68 ns

–1 0.56 3.78 0.04 1.04 0.36 3.56 3.78 3.00 2.88 5.46 5.69 ns

–2 0.49 3.32 0.03 0.91 0.32 3.12 3.32 2.64 2.53 4.79 4.99 ns

8 mA –F 0.79 4.71 0.05 1.46 0.51 4.72 4.71 4.32 4.23 7.40 7.40 ns

Std. 0.66 3.92 0.04 1.22 0.43 3.93 3.92 3.60 3.52 6.16 6.16 ns

–1 0.56 3.34 0.04 1.04 0.36 3.34 3.34 3.06 3.00 5.24 5.24 ns

–2 0.49 2.93 0.03 0.91 0.32 2.93 2.93 2.69 2.63 4.60 4.60 ns

12 mA –F 0.79 4.24 0.05 1.46 0.51 4.32 3.65 4.45 4.90 7.01 6.34 ns

Std. 0.66 3.53 0.04 1.22 0.43 3.60 3.04 3.70 4.08 5.84 5.28 ns

–1 0.56 3.01 0.04 1.04 0.36 3.06 2.59 3.15 3.47 4.96 4.49 ns

–2 0.49 2.64 0.03 0.91 0.32 2.69 2.27 2.76 3.05 4.36 3.94 ns

16 mA –F 0.79 4.24 0.05 1.46 0.51 4.32 3.65 4.45 4.90 7.01 6.34 ns

Std. 0.66 3.53 0.04 1.22 0.43 3.60 3.04 3.70 4.08 5.84 5.28 ns

–1 0.56 3.01 0.04 1.04 0.36 3.06 2.59 3.15 3.47 4.96 4.49 ns

–2 0.49 2.64 0.03 0.91 0.32 2.69 2.27 2.76 3.05 4.36 3.94 ns

Notes:

1. Software default selection highlighted in gray.

2. For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating

values.

ProASIC3 DC and Switching Characteristics

2-46 v1.1

Table 2-58 • 1.8 V LVCMOS Low Slew

Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V, Worst-Case VCCI = 1.7 V

Applicable to Advanced I/O Banks

Drive

Strength

Speed

Grade tDOUT tDP tDIN tPY tEOUT tZL tZH tLZ tHZ tZLS tZHS Units

2 mA –F 0.79 18.66 0.05 1.46 0.51 16.95 18.66 3.34 1.92 19.64 21.34 ns

Std. 0.66 15.53 0.04 1.22 0.43 14.11 15.53 2.78 1.60 16.35 17.77 ns

–1 0.56 13.21 0.04 1.04 0.36 12.01 13.21 2.36 1.36 13.91 15.11 ns

–2 0.49 11.60 0.03 0.91 0.32 10.54 11.60 2.07 1.19 12.21 13.27 ns

4 mA –F 0.79 12.58 0.05 1.46 0.51 12.51 12.58 3.88 3.28 15.19 15.27 ns

Std. 0.66 10.48 0.04 1.22 0.43 10.41 10.48 3.23 2.73 12.65 12.71 ns

–1 0.56 8.91 0.04 1.04 0.36 8.86 8.91 2.75 2.33 10.76 10.81 ns

–2 0.49 7.82 0.03 0.91 0.32 7.77 7.82 2.41 2.04 9.44 9.49 ns

6 mA –F 0.79 9.67 0.05 1.46 0.51 9.85 9.42 4.25 3.93 12.53 12.11 ns

Std. 0.66 8.05 0.04 1.22 0.43 8.20 7.84 3.54 3.27 10.43 10.08 ns

–1 0.56 6.85 0.04 1.04 0.36 6.97 6.67 3.01 2.78 8.88 8.57 ns

–2 0.49 6.01 0.03 0.91 0.32 6.12 5.86 2.64 2.44 7.79 7.53 ns

8 mA –F 0.79 9.01 0.05 1.46 0.51 9.18 8.77 4.33 4.10 11.87 11.45 ns

Std. 0.66 7.50 0.04 1.22 0.43 7.64 7.30 3.61 3.41 9.88 9.53 ns

–1 0.56 6.38 0.04 1.04 0.36 6.50 6.21 3.07 2.90 8.40 8.11 ns

–2 0.49 5.60 0.03 0.91 0.32 5.71 5.45 2.69 2.55 7.38 7.12 ns

12 mA –F 0.79 8.76 0.05 1.46 0.51 8.69 8.76 4.45 4.74 11.38 11.45 ns

Std. 0.66 7.29 0.04 1.22 0.43 7.23 7.29 3.71 3.95 9.47 9.53 ns

–1 0.56 6.20 0.04 1.04 0.36 6.15 6.20 3.15 3.36 8.06 8.11 ns

–2 0.49 5.45 0.03 0.91 0.32 5.40 5.45 2.77 2.95 7.07 7.12 ns

16 mA –F 0.79 8.76 0.05 1.46 0.51 8.69 8.76 4.45 4.74 11.38 11.45 ns

Std. 0.66 7.29 0.04 1.22 0.43 7.23 7.29 3.71 3.95 9.47 9.53 ns

–1 0.56 6.20 0.04 1.04 0.36 6.15 6.20 3.15 3.36 8.06 8.11 ns

–2 0.49 5.45 0.03 0.91 0.32 5.40 5.45 2.77 2.95 7.07 7.12 ns

Note: For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating

values.

ProASIC3 DC and Switching Characteristics

v1.1 2-47

Table 2-59 • 1.8 V LVCMOS High Slew

Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V, Worst-Case VCCI = 1.7 V

Applicable to Standard Plus I/O Banks

Drive

Strength

Speed

Grade tDOUT tDP tDIN tPY tEOUT tZL tZH tLZ tHZ tZLS tZHS Units

2 mA –F 0.79 13.61 0.05 1.44 0.51 10.48 13.61 2.70 1.83 13.17 16.30 ns

Std. 0.66 11.33 0.04 1.20 0.43 8.72 11.33 2.24 1.52 10.96 13.57 ns

–1 0.56 9.64 0.04 1.02 0.36 7.42 9.64 1.91 1.29 9.32 11.54 ns

–2 0.49 8.46 0.03 0.90 0.32 6.51 8.46 1.68 1.14 8.18 10.13 ns

4 mA –F 0.79 7.79 0.05 1.44 0.51 6.58 7.79 3.18 3.13 9.27 10.47 ns

Std. 0.66 6.48 0.04 1.20 0.43 5.48 6.48 2.65 2.60 7.72 8.72 ns

–1 0.56 5.51 0.04 1.02 0.36 4.66 5.51 2.25 2.21 6.56 7.42 ns

–2 0.49 4.84 0.03 0.90 0.32 4.09 4.84 1.98 1.94 5.76 6.51 ns

6 mA –F 0.79 4.88 0.05 1.44 0.51 4.61 4.88 3.52 3.73 7.30 7.56 ns

Std. 0.66 4.06 0.04 1.20 0.43 3.84 4.06 2.93 3.10 6.07 6.30 ns

–1 0.56 3.45 0.04 1.02 0.36 3.27 3.45 2.49 2.64 5.17 5.36 ns

–2 0.49 3.03 0.03 0.90 0.32 2.87 3.03 2.19 2.32 4.54 4.70 ns

8 mA –F 0.79 4.88 0.05 1.44 0.51 4.61 4.88 3.52 3.73 7.30 7.56 ns

Std. 0.66 4.06 0.04 1.20 0.43 3.84 4.06 2.93 3.10 6.07 6.30 ns

–1 0.56 3.45 0.04 1.02 0.36 3.27 3.45 2.49 2.64 5.17 5.36 ns

–2 0.49 3.03 0.03 0.90 0.32 2.87 3.03 2.19 2.32 4.54 4.70 ns

Notes:

1. Software default selection highlighted in gray.

2. For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating

values.

ProASIC3 DC and Switching Characteristics

2-48 v1.1

Table 2-60 • 1.8 V LVCMOS Low Slew

Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V, Worst-Case VCCI = 1.7 V

Applicable to Standard Plus I/O Banks

Drive

Strength

Speed

Grade tDOUT tDP tDIN tPY tEOUT tZL tZH tLZ tHZ tZLS tZHS Units

2 mA –F 0.79 17.78 0.05 1.44 0.51 16.21 17.78 2.70 1.76 18.90 20.47 ns

Std. 0.66 14.80 0.04 1.20 0.43 13.49 14.80 2.25 1.46 15.73 17.04 ns

–1 0.56 12.59 0.04 1.02 0.36 11.48 12.59 1.91 1.25 13.38 14.49 ns

–2 0.49 11.05 0.03 0.90 0.32 10.08 11.05 1.68 1.09 11.75 12.72 ns

4 mA –F 0.79 11.89 0.05 1.44 0.51 11.69 11.89 3.19 3.00 14.38 14.58 ns

Std. 0.66 9.90 0.04 1.20 0.43 9.73 9.90 2.65 2.50 11.97 12.13 ns

–1 0.56 8.42 0.04 1.02 0.36 8.28 8.42 2.26 2.12 10.18 10.32 ns

–2 0.49 7.39 0.03 0.90 0.32 7.27 7.39 1.98 1.86 8.94 9.06 ns

6 mA –F 0.79 8.93 0.05 1.44 0.51 9.10 8.79 3.53 3.59 11.79 11.48 ns

Std. 0.66 7.44 0.04 1.20 0.43 7.58 7.32 2.94 2.99 9.81 9.56 ns

–1 0.56 6.33 0.04 1.02 0.36 6.44 6.23 2.50 2.54 8.35 8.13 ns

–2 0.49 5.55 0.03 0.90 0.32 5.66 5.47 2.19 2.23 7.33 7.14 ns

8 mA –F 0.79 8.93 0.05 1.44 0.51 9.10 8.79 3.53 3.59 11.79 11.48 ns

Std. 0.66 7.44 0.04 1.20 0.43 7.58 7.32 2.94 2.99 9.81 9.56 ns

–1 0.56 6.33 0.04 1.02 0.36 6.44 6.23 2.50 2.54 8.35 8.13 ns

–2 0.49 5.55 0.03 0.90 0.32 5.66 5.47 2.19 2.23 7.33 7.14 ns

Note: For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating

values.

Table 2-61 • 1.8 V LVCMOS High Slew

Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V, Worst-Case VCCI = 3.0 V

Applicable to Standard I/O Banks

Drive

Strength

Speed

Grade tDOUT tDP tDIN tPY tEOUT tZL tZH tLZ tHZ Units

2 mA –F 0.79 13.47 0.05 1.44 0.51 10.25 13.47 2.39 1.45 ns

Std. 0.66 11.21 0.04 1.20 0.43 8.53 11.21 1.99 1.21 ns

–1 0.56 9.54 0.04 1.02 0.36 7.26 9.54 1.69 1.03 ns

–2 0.49 8.37 0.03 0.90 0.32 6.37 8.37 1.49 0.90 ns

4 mA –F 0.79 7.62 0.05 1.44 0.51 6.46 7.62 2.89 2.98 ns

Std. 0.66 6.34 0.04 1.20 0.43 5.38 6.34 2.41 2.48 ns

–1 0.56 5.40 0.04 1.02 0.36 4.58 5.40 2.05 2.11 ns

–2 0.49 4.74 0.03 0.90 0.32 4.02 4.74 1.80 1.85 ns

Notes:

1. Software default selection highlighted in gray.

2. For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating

values.

ProASIC3 DC and Switching Characteristics

v1.1 2-49

1.5 V LVCMOS (JESD8-11)

Low-Voltage CMOS for 1.5 V is an extension of the LVCMOS standard (JESD8-5) used for general-

purpose 1.5 V applications. It uses a 1.5 V input buffer and a push-pull output buffer.

Table 2-62 • 1.8 V LVCMOS Low Slew

Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V, Worst-Case VCCI = 3.0 V

Applicable to Standard I/O Banks

Drive

Strength

Speed

Grade tDOUT tDP tDIN tPY tEOUT tZL tZH tLZ tHZ Units

2 mA –F 0.79 18.03 0.05 1.44 0.51 15.80 18.03 2.40 2.40 ns

Std. 0.66 15.01 0.04 1.20 0.43 13.15 15.01 1.99 1.99 ns

–1 0.56 12.77 0.04 1.02 0.36 11.19 12.77 1.70 1.70 ns

–2 0.49 11.21 0.03 0.90 0.32 9.82 11.21 1.49 1.49 ns

4 mA –F 0.79 12.13 0.05 1.44 0.51 11.48 12.13 2.90 2.85 ns

Std. 0.66 10.10 0.04 1.20 0.43 9.55 10.10 2.41 2.37 ns

–1 0.56 8.59 0.04 1.02 0.36 8.13 8.59 2.05 2.02 ns

–2 0.49 7.54 0.03 0.90 0.32 7.13 7.54 1.80 1.77 ns

Note: For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating

values.

Table 2-63 • Minimum and Maximum DC Input and Output Levels

Applicable to Advanced I/O Banks

1.5 V

LVCMOS VIL VIH VOL VOH IOL IOH IOSL IOSH IIL IIH

Drive

Strength Min., V Max., V Min., V Max., V Max., V Min., V mA mA Max., mA1Max., mA1µA2µA2

2 mA –0.3 0.30 * VCCI 0.7 * VCCI 3.6 0.25 * VCCI 0.75 * VCCI 2 2 16 13 10 10

4 mA –0.3 0.30 * VCCI 0.7 * VCCI 3.6 0.25 * VCCI 0.75 * VCCI 4 4 33 25 10 10

6 mA –0.3 0.30 * VCCI 0.7 * VCCI 3.6 0.25 * VCCI 0.75 * VCCI 6 6 39 32 10 10

8 mA –0.3 0.30 * VCCI 0.7 * VCCI 3.6 0.25 * VCCI 0.75 * VCCI 8 8 55 66 10 10

12 mA –0.3 0.30 * VCCI 0.7 * VCCI 3.6 0.25 * VCCI 0.75 * VCCI 12 12 55 66 10 10

Notes:

1. Currents are measured at high temperature (100°C junction temperature) and maximum voltage.

2. Currents are measured at 85°C junction temperature.

3. Software default selection highlighted in gray.

ProASIC3 DC and Switching Characteristics

2-50 v1.1

Table 2-64 • Minimum and Maximum DC Input and Output Levels

Applicable to Standard Plus I/O Banks

1.5 V

LVCMOS VIL VIH VOL VOH IOL IOH IOSL IOSH IIL IIH

Drive

Strength Min., V Max., V Min., V Max., V Max., V Min., V mA mA Max., mA1Max., mA1µA2µA2

2 mA –0.3 0.30 * VCCI 0.7 * VCCI 3.6 0.25 * VCCI 0.75 * VCCI 22 0 0 1010

4 mA –0.3 0.30 * VCCI 0.7 * VCCI 3.6 0.25 * VCCI 0.75 * VCCI 4 4 0 0 10 10

Notes:

1. Currents are measured at high temperature (100°C junction temperature) and maximum voltage.

2. Currents are measured at 85°C junction temperature.

3. Software default selection highlighted in gray.

Table 2-65 • Minimum and Maximum DC Input and Output Levels

Applicable to Standard I/O Banks

1.5 V

LVCMOS VIL VIH VOL VOH IOL IOH IOSL IOSH IIL IIH

Drive

Strength Min., V Max., V Min., V Max., V Max., V Min., V mA mA

Max.,

mA1Max.,

mA1µA2µA2

2 mA –0.3 0.30 * VCCI 0.7 * VCCI 3.6 0.25 * VCCI 0.75 * VCCI 2 2 13 16 10 10

Notes:

1. Currents are measured at high temperature (100°C junction temperature) and maximum voltage.

2. Currents are measured at 85°C junction temperature.

3. Software default selection highlighted in gray.

Figure 2-9 • AC Loading

Table 2-66 • AC Waveforms, Measuring Points, and Capacitive Loads

Input LOW (V) Input HIGH (V) Measuring Point* (V) CLOAD (pF)

0 1.5 0.75 35

*Measuring point = Vtrip. See Table 2-18 on page 2-18 for a complete table of trip points.

Test Point Test Point

Enable Path

Datapath 35 pF

R = 1 k R to VCCI for tLZ/tZL/tZLS

R to GND for tHZ/tZH/tZHS

35 pF for tZH/tZHS/tZL/tZLS

5 pF for tHZ/tLZ

ProASIC3 DC and Switching Characteristics

v1.1 2-51

Timing Characteristics

Table 2-67 • 1.5 V LVCMOS High Slew

Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V, Worst-Case VCCI = 1.4 V

Applicable to Advanced I/O Banks

Drive

Strength

Speed

Grade tDOUT tDP tDIN tPY tEOUT tZL tZH tLZ tHZ tZLS tZHS Units

2 mA –F 0.79 10.05 0.05 1.73 0.51 8.20 10.05 4.07 3.32 10.88 12.73 ns

Std. 0.66 8.36 0.04 1.44 0.43 6.82 8.36 3.39 2.77 9.06 10.60 ns

–1 0.56 7.11 0.04 1.22 0.36 5.80 7.11 2.88 2.35 7.71 9.02 ns

–2 0.49 6.24 0.03 1.07 0.32 5.10 6.24 2.53 2.06 6.76 7.91 ns

4 mA –F 0.79 6.38 0.05 1.73 0.51 5.83 6.38 4.49 4.09 8.51 9.07 ns

Std. 0.66 5.31 0.04 1.44 0.43 4.85 5.31 3.74 3.40 7.09 7.55 ns

–1 0.56 4.52 0.04 1.22 0.36 4.13 4.52 3.18 2.89 6.03 6.42 ns

–2 0.49 3.97 0.03 1.07 0.32 3.62 3.97 2.79 2.54 5.29 5.64 ns

6 mA –F 0.79 5.61 0.05 1.73 0.51 5.46 5.61 4.59 4.28 8.15 8.29 ns

Std. 0.66 4.67 0.04 1.44 0.43 4.55 4.67 3.82 3.56 6.78 6.90 ns

–1 0.56 3.97 0.04 1.22 0.36 3.87 3.97 3.25 3.03 5.77 5.87 ns

–2 0.49 3.49 0.03 1.07 0.32 3.40 3.49 2.85 2.66 5.07 5.16 ns

8 mA –F 0.79 4.90 0.05 1.73 0.51 4.99 4.30 4.74 5.05 7.68 6.98 ns

Std. 0.66 4.08 0.04 1.44 0.43 4.15 3.58 3.94 4.20 6.39 5.81 ns

–1 0.56 3.47 0.04 1.22 0.36 3.53 3.04 3.36 3.58 5.44 4.95 ns

–2 0.49 3.05 0.03 1.07 0.32 3.10 2.67 2.95 3.14 4.77 4.34 ns

12 mA –F 0.79 4.90 0.05 1.73 0.51 4.99 4.30 4.74 5.05 7.68 6.98 ns

Std. 0.66 4.08 0.04 1.44 0.43 4.15 3.58 3.94 4.20 6.39 5.81 ns

–1 0.56 3.47 0.04 1.22 0.36 3.53 3.04 3.36 3.58 5.44 4.95 ns

–2 0.49 3.05 0.03 1.07 0.32 3.10 2.67 2.95 3.14 4.77 4.34 ns

Notes:

1. Software default selection highlighted in gray.

2. For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating

values.

ProASIC3 DC and Switching Characteristics

2-52 v1.1

Table 2-68 • 1.5 V LVCMOS Low Slew

Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V, Worst-Case VCCI = 1.4 V

Applicable to Advanced I/O Banks

Drive

Strength

Speed

Grade tDOUT tDP tDIN tPY tEOUT tZL tZH tLZ tHZ tZLS tZHS Units

2 mA –F 0.79 15.36 0.05 1.73 0.51 15.39 15.36 4.08 3.18 18.07 18.04 ns

Std. 0.66 12.78 0.04 1.44 0.43 12.81 12.78 3.40 2.64 15.05 15.02 ns

–1 0.56 10.87 0.04 1.22 0.36 10.90 10.87 2.89 2.25 12.80 12.78 ns

–2 0.49 9.55 0.03 1.07 0.32 9.57 9.55 2.54 1.97 11.24 11.22 ns

4 mA –F 0.79 12.02 0.05 1.73 0.51 12.25 11.47 4.50 3.93 14.93 14.15 ns

Std. 0.66 10.01 0.04 1.44 0.43 10.19 9.55 3.75 3.27 12.43 11.78 ns

–1 0.56 8.51 0.04 1.22 0.36 8.67 8.12 3.19 2.78 10.57 10.02 ns

–2 0.49 7.47 0.03 1.07 0.32 7.61 7.13 2.80 2.44 9.28 8.80 ns

6 mA –F 0.79 11.21 0.05 1.73 0.51 11.42 10.68 4.60 4.12 14.11 13.37 ns

Std. 0.66 9.33 0.04 1.44 0.43 9.51 8.89 3.83 3.43 11.74 11.13 ns

–1 0.56 7.94 0.04 1.22 0.36 8.09 7.56 3.26 2.92 9.99 9.47 ns

–2 0.49 6.97 0.03 1.07 0.32 7.10 6.64 2.86 2.56 8.77 8.31 ns

8 mA –F 0.79 10.70 0.05 1.73 0.51 10.90 10.68 4.75 4.86 13.59 13.37 ns

Std. 0.66 8.91 0.04 1.44 0.43 9.07 8.89 3.95 4.05 11.31 11.13 ns

–1 0.56 7.58 0.04 1.22 0.36 7.72 7.57 3.36 3.44 9.62 9.47 ns

–2 0.49 6.65 0.03 1.07 0.32 6.78 6.64 2.95 3.02 8.45 8.31 ns

12 mA –F 0.79 10.70 0.05 1.73 0.51 10.90 10.68 4.75 4.86 13.59 13.37 ns

Std. 0.66 8.91 0.04 1.44 0.43 9.07 8.89 3.95 4.05 11.31 11.13 ns

–1 0.56 7.58 0.04 1.22 0.36 7.72 7.57 3.36 3.44 9.62 9.47 ns

–2 0.49 6.65 0.03 1.07 0.32 6.78 6.64 2.95 3.02 8.45 8.31 ns

Note: For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating

values.

ProASIC3 DC and Switching Characteristics

v1.1 2-53

Table 2-69 • 1.5 V LVCMOS High Slew

Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V, Worst-Case VCCI = 1.4 V

Applicable to Standard Plus I/O Banks

Drive

Strength

Speed

Grade tDOUT tDP tDIN tPY tEOUT tZL tZH tLZ tHZ tZLS tZHS Units

2 mA –F 0.79 9.41 0.05 1.71 0.51 7.71 9.41 3.25 3.06 10.40 12.09 ns

Std. 0.66 7.83 0.04 1.42 0.43 6.42 7.83 2.71 2.55 8.65 10.07 ns

–1 0.56 6.66 0.04 1.21 0.36 5.46 6.66 2.31 2.17 7.36 8.56 ns

–2 0.49 5.85 0.03 1.06 0.32 4.79 5.85 2.02 1.90 6.46 7.52 ns

4 mA –F 0.79 5.81 0.05 1.71 0.51 5.39 5.81 3.64 3.76 8.08 8.50 ns

Std. 0.66 4.84 0.04 1.42 0.43 4.49 4.84 3.03 3.13 6.72 7.08 ns

–1 0.56 4.12 0.04 1.21 0.36 3.82 4.12 2.58 2.66 5.72 6.02 ns

–2 0.49 3.61 0.03 1.06 0.32 3.35 3.61 2.26 2.34 5.02 5.28 ns

Notes:

1. Software default selection highlighted in gray.

2. For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating

values.

Table 2-70 • 1.5 V LVCMOS Low Slew

Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V, Worst-Case VCCI = 1.4 V

Applicable to Standard Plus I/O Banks

Drive

Strength

Speed

Grade tDOUT tDP tDIN tPY tEOUT tZL tZH tLZ tHZ tZLS tZHS Units

2 mA –F 0.79 14.51 0.05 1.71 0.51 14.42 14.51 3.26 2.91 17.11 17.20 ns

Std. 0.66 12.08 0.04 1.42 0.43 12.01 12.08 2.72 2.43 14.24 14.31 ns

–1 0.56 10.27 0.04 1.21 0.36 10.21 10.27 2.31 2.06 12.12 12.18 ns

–2 0.49 9.02 0.03 1.06 0.32 8.97 9.02 2.03 1.81 10.64 10.69 ns

4 mA –F 0.79 11.15 0.05 1.71 0.51 11.35 10.71 3.65 3.60 14.04 13.40 ns

Std. 0.66 9.28 0.04 1.42 0.43 9.45 8.91 3.04 3.00 11.69 11.15 ns

–1 0.56 7.89 0.04 1.21 0.36 8.04 7.58 2.58 2.55 9.94 9.49 ns

–2 0.49 6.93 0.03 1.06 0.32 7.06 6.66 2.27 2.24 8.73 8.33 ns

Note: For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating

values.

ProASIC3 DC and Switching Characteristics

2-54 v1.1

3.3 V PCI, 3.3 V PCI-X

Peripheral Component Interface for 3.3 V standard specifies support for 33 MHz and 66 MHz PCI

Bus applications.

AC loadings are defined per the PCI/PCI-X specifications for the datapath; Actel loadings for enable

path characterization are described in Figure 2-10.

Table 2-71 • 1.5 V LVCMOS High Slew

Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V, Worst-Case VCCI = 3.0 V

Applicable to Standard I/O Banks

Drive

Strength

Speed

Grade tDOUT tDP tDIN tPY tEOUT tZL tZH tLZ tHZ Units

2 mA –F 0.79 9.18 0.05 1.70 0.51 7.58 9.18 2.94 2.94 ns

Std. 0.66 7.65 0.04 1.42 0.43 6.31 7.65 2.45 2.45 ns

–1 0.56 6.50 0.04 1.21 0.36 5.37 6.50 2.08 2.08 ns

–2 0.49 5.71 0.03 1.06 0.32 4.71 5.71 1.83 1.83 ns

Notes:

1. Software default selection highlighted in gray.

2. For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating

values.

Table 2-72 • 1.5 V LVCMOS Low Slew

Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V, Worst-Case VCCI = 3.0 V

Applicable to Standard I/O Banks

Drive

Strength

Speed

Grade tDOUT tDP tDIN tPY tEOUT tZL tZH tLZ tHZ Units

2 mA –F 0.79 14.81 0.05 1.70 0.51 14.17 14.81 2.94 2.79 ns

Std. 0.66 12.33 0.04 1.42 0.43 11.79 12.33 2.45 2.32 ns

–1 0.56 10.49 0.04 1.21 0.36 10.03 10.49 2.08 1.98 ns

–2 0.49 9.21 0.03 1.06 0.32 8.81 9.21 1.83 1.73 ns

Note: For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating

values.

Table 2-73 • Minimum and Maximum DC Input and Output Levels

3.3 V PCI/PCI-X VIL VIH VOL VOH IOL IOH IOSL IOSH IIL IIH

Drive Strength Min, V Max, V Min, V Max, V Max, V Min, V mA mA Max, mA1Max, mA1µA2µA2

Per PCI specification Per PCI curves 10 10

Notes:

1. Currents are measured at high temperature (100°C junction temperature) and maximum voltage.

2. Currents are measured at 85°C junction temperature.

Figure 2-10 • AC Loading

Test Point

Enable Path

R to V for t /t /t

CCI LZ ZL ZLS

10 pF for t /t /t /t

ZH ZHS ZLSZL

5 pF for tHZ /tLZ

R to GND for t /t /t

HZ ZH ZH

R = 1 k

Test Point

Datapath

R = 25 R to VCCI for tDP (F)

R to GND for tDP (R)

ProASIC3 DC and Switching Characteristics

v1.1 2-55

AC loadings are defined per PCI/PCI-X specifications for the datapath; Actel loading for tristate is

described in Table 2-74.

Timing Characteristics

Table 2-74 • AC Waveforms, Measuring Points, and Capacitive Loads

Input LOW (V) Input HIGH (V) Measuring Point* (V) CLOAD (pF)

0 3.3 0.285 * VCCI for tDP(R)

0.615 * VCCI for tDP(F)

*Measuring point = Vtrip. See Table 2-18 on page 2-18 for a complete table of trip points.

Table 2-75 • 3.3 V PCI/PCI-X

Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V, Worst-Case VCCI = 3.0 V

Applicable to Advanced I/O Banks

Speed Grade tDOUT tDP tDIN tPY tEOUT tZL tZH tLZ tHZ tZLS tZHS Units

–F 0.79 3.22 0.05 1.04 0.51 3.28 2.34 3.86 4.30 5.97 5.03 ns

Std. 0.66 2.68 0.04 0.86 0.43 2.73 1.95 3.21 3.58 4.97 4.19 ns

–1 0.56 2.28 0.04 0.73 0.36 2.32 1.66 2.73 3.05 4.22 3.56 ns

–2 0.49 2.00 0.03 0.65 0.32 2.04 1.46 2.40 2.68 3.71 3.13 ns

Note: For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating

values.

Table 2-76 • 3.3 V PCI/PCI-X

Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V, Worst-Case VCCI = 3.0 V

Applicable to Standard Plus I/O Banks

Speed Grade tDOUT tDP tDIN tPY tEOUT tZL tZH tLZ tHZ tZLS tZHS Units

–F 0.79 2.77 0.05 1.02 0.51 2.82 2.05 3.35 3.87 5.51 4.73 ns

Std. 0.66 2.31 0.04 0.85 0.43 2.35 1.70 2.79 3.22 4.59 3.94 ns

–1 0.56 1.96 0.04 0.72 0.36 2.00 1.45 2.37 2.74 3.90 3.35 ns

–2 0.49 1.72 0.03 0.64 0.32 1.76 1.27 2.08 2.41 3.42 2.94 ns

Note: For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating

values.

ProASIC3 DC and Switching Characteristics

2-56 v1.1

Differential I/O Characteristics

Physical Implementation

Configuration of the I/O modules as a differential pair is handled by Actel Designer software when

the user instantiates a differential I/O macro in the design.

Differential I/Os can also be used in conjunction with the embedded Input Register (InReg), Output

support for bidirectional I/Os or tristates with the LVPECL standards.

LVDS

Low-Voltage Differential Signaling (ANSI/TIA/EIA-644) is a high-speed, differential I/O standard. It

requires that one data bit be carried through two signal lines, so two pins are needed. It also

requires external resistor termination.

The full implementation of the LVDS transmitter and receiver is shown in an example in

Figure 2-11. The building blocks of the LVDS transmitter-receiver are one transmitter macro, one

receiver macro, three board resistors at the transmitter end, and one resistor at the receiver end.

The values for the three driver resistors are different from those used in the LVPECL

implementation because the output standard specifications are different.

Along with LVDS I/O, ProASIC3 also supports Bus LVDS structure and Multipoint LVDS (M-LVDS)

configuration (up to 40 nodes).

Figure 2-11 • LVDS Circuit Diagram and Board-Level Implementation

Table 2-77 • Minimum and Maximum DC Input and Output Levels

DC Parameter Description Min. Typ. Max. Units

VCCI Supply Voltage 2.375 2.5 2.625 V

VOL Output LOW Voltage 0.9 1.075 1.25 V

VOH Output HIGH Voltage 1.25 1.425 1.6 V

VIInput Voltage 0 – 2.925 V

VODIFF Differential Output Voltage 250 350 450 mV

VOCM Output Common-Mode Voltage 1.125 1.25 1.375 V

VICM Input Common-Mode Voltage 0.05 1.25 2.35 V

VIDIFF Input Differential Voltage 100 350 – mV

Notes:

1. ± 5%

2. Differential input voltage = ±350 mV

140 Ω100 Ω

Z0 = 50 Ω

165 Ω

–

INBUF_LVDS

OUTBUF_LVDS

FPGA FPGA

Bourns Part Number: CAT16-LV4F12

ProASIC3 DC and Switching Characteristics

v1.1 2-57

Timing Characteristics

BLVDS/M-LVDS

Bus LVDS (BLVDS) and Multipoint LVDS (M-LVDS) specifications extend the existing LVDS standard

to high-performance multipoint bus applications. Multidrop and multipoint bus configurations

may contain any combination of drivers, receivers, and transceivers. Actel LVDS drivers provide the

higher drive current required by BLVDS and M-LVDS to accommodate the loading. The drivers

require series terminations for better signal quality and to control voltage swing. Termination is

also required at both ends of the bus since the driver can be located anywhere on the bus. These

configurations can be implemented using the TRIBUF_LVDS and BIBUF_LVDS macros along with

appropriate terminations. Multipoint designs using Actel LVDS macros can achieve up to 200 MHz

with a maximum of 20 loads. A sample application is given in Figure 2-12. The input and output

buffer delays are available in the LVDS section in Table 2-79.

Example: For a bus consisting of 20 equidistant loads, the following terminations provide the

required differential voltage, in worst-case Industrial operating conditions, at the farthest receiver:

RS=60Ω and RT=70Ω, given Z0=50Ω (2") and Zstub =50Ω (~1.5").

Table 2-78 • AC Waveforms, Measuring Points, and Capacitive Loads

Input LOW (V) Input HIGH (V) Measuring Point* (V)

1.075 1.325 Cross point

*Measuring point = Vtrip. See Table 2-18 on page 2-18 for a complete table of trip points.

Table 2-79 • LVDS

Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V, Worst-Case VCCI = 2.3 V

Speed Grade tDOUT tDP tDIN tPY Units

–F 0.79 2.20 0.05 1.92 ns

Std. 0.66 1.83 0.04 1.60 ns

–1 0.56 1.56 0.04 1.36 ns

–2 0.49 1.37 0.03 1.20 ns

Note: For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating

values.

Figure 2-12 • BLVDS/M-LVDS Multipoint Application Using LVDS I/O Buffers

...

RTRT

BIBUF_LVDS

EN EN EN EN EN

Receiver Transceiver Receiver TransceiverDriver

stub

ProASIC3 DC and Switching Characteristics

2-58 v1.1

LVPECL

Low-Voltage Positive Emitter-Coupled Logic (LVPECL) is another differential I/O standard. It

requires that one data bit be carried through two signal lines. Like LVDS, two pins are needed. It

also requires external resistor termination.

The full implementation of the LVDS transmitter and receiver is shown in an example in

Figure 2-13. The building blocks of the LVPECL transmitter-receiver are one transmitter macro, one

receiver macro, three board resistors at the transmitter end, and one resistor at the receiver end.

The values for the three driver resistors are different from those used in the LVDS implementation

because the output standard specifications are different.

Timing Characteristics

Figure 2-13 • LVPECL Circuit Diagram and Board-Level Implementation

Table 2-80 • Minimum and Maximum DC Input and Output Levels

DC Parameter Description Min. Max. Min. Max. Min. Max. Units

VCCI Supply Voltage 3.0 3.3 3.6 V

VOL Output LOW Voltage 0.96 1.27 1.06 1.43 1.30 1.57 V

VOH Output HIGH Voltage 1.8 2.11 1.92 2.28 2.13 2.41 V

VIL, VIH Input LOW, Input HIGH Voltages 0 3.3 0 3.6 0 3.9 V

VODIFF Differential Output Voltage 0.625 0.97 0.625 0.97 0.625 0.97 V

VOCM Output Common-Mode Voltage 1.762 1.98 1.762 1.98 1.762 1.98 V

VICM Input Common-Mode Voltage 1.01 2.57 1.01 2.57 1.01 2.57 V

VIDIFF Input Differential Voltage 300 300 300 mV

Table 2-81 • AC Waveforms, Measuring Points, and Capacitive Loads

Input LOW (V) Input HIGH (V) Measuring Point* (V)

1.64 1.94 Cross point

*Measuring point = Vtrip. See Table 2-18 on page 2-18 for a complete table of trip points.

187 W 100 Ω

Z0 = 50 Ω

100 Ω

–

INBUF_LVPECL

OUTBUF_LVPECL

FPGA FPGA

Bourns Part Number: CAT16-PC4F12

Table 2-82 • LVPECL

Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V, Worst-Case VCCI = 3.0 V

Speed Grade tDOUT tDP tDIN tPY Units

–F 0.79 2.16 0.05 1.69 ns

Std. 0.66 1.80 0.04 1.40 ns

–1 0.56 1.53 0.04 1.19 ns

–2 0.49 1.34 0.03 1.05 ns

Note: For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating

values.

ProASIC3 DC and Switching Characteristics

v1.1 2-59

I/O Register Specifications

Fully Registered I/O Buffers with Synchronous Enable and Asynchronous

Preset

Figure 2-14 • Timing Model of Registered I/O Buffers with Synchronous Enable and Asynchronous Preset

INBUF

INBUF INBUF

TRIBUF

CLKBUF

INBUF

CLKBUF

Data Input I/O Register with:

Active High Enable

Active High Preset

Positive-Edge Triggered

Data Output Register and

Enable Output Register with:

Active High Enable

Active High Preset

Postive-Edge Triggered

Pad Out

CLK

Enable

Preset

Data_out

Data

EOUT

DOUT

Enable

CLK

DFN1E1P1

PRE

DFN1E1P1

PRE

DFN1E1P1

PRE

D_Enable

Core

Array

ProASIC3 DC and Switching Characteristics

2-60 v1.1

Table 2-83 • Parameter Definition and Measuring Nodes

Parameter Name Parameter Definition

Measuring Nodes

(from, to)*

tOCLKQ Clock-to-Q of the Output Data Register H, DOUT

tOSUD Data Setup Time for the Output Data Register F, H

tOHD Data Hold Time for the Output Data Register F, H

tOSUE Enable Setup Time for the Output Data Register G, H

tOHE Enable Hold Time for the Output Data Register G, H

tOPRE2Q Asynchronous Preset-to-Q of the Output Data Register L, DOUT

tOREMPRE Asynchronous Preset Removal Time for the Output Data Register L, H

tORECPRE Asynchronous Preset Recovery Time for the Output Data Register L, H

tOECLKQ Clock-to-Q of the Output Enable Register H, EOUT

tOESUD Data Setup Time for the Output Enable Register J, H

tOEHD Data Hold Time for the Output Enable Register J, H

tOESUE Enable Setup Time for the Output Enable Register K, H

tOEHE Enable Hold Time for the Output Enable Register K, H

tOEPRE2Q Asynchronous Preset-to-Q of the Output Enable Register I, EOUT

tOEREMPRE Asynchronous Preset Removal Time for the Output Enable Register I, H

tOERECPRE Asynchronous Preset Recovery Time for the Output Enable Register I, H

tICLKQ Clock-to-Q of the Input Data Register A, E

tISUD Data Setup Time for the Input Data Register C, A

tIHD Data Hold Time for the Input Data Register C, A

tISUE Enable Setup Time for the Input Data Register B, A

tIHE Enable Hold Time for the Input Data Register B, A

tIPRE2Q Asynchronous Preset-to-Q of the Input Data Register D, E

tIREMPRE Asynchronous Preset Removal Time for the Input Data Register D, A

tIRECPRE Asynchronous Preset Recovery Time for the Input Data Register D, A

*See Figure 2-14 on page 2-59 for more information.

ProASIC3 DC and Switching Characteristics

v1.1 2-61

Fully Registered I/O Buffers with Synchronous Enable and Asynchronous

Clear

Figure 2-15 • Timing Model of the Registered I/O Buffers with Synchronous Enable and Asynchronous Clear

Enable

CLK

Pad Out

CLK

Enable

CLR

Data_out

Data

EOUT

DOUT

Core

Array

DFN1E1C1

CLR

DFN1E1C1

CLR

DFN1E1C1

CLR

D_Enable

CLKBUF

INBUF

TRIBUF

INBUF INBUF CLKBUF

INBUF

Data Input I/O Register with

Active High Enable

Active High Clear

Positive-Edge Triggered Data Output Register and

Enable Output Register with

Active High Enable

Active High Clear

Positive-Edge Triggered

ProASIC3 DC and Switching Characteristics

2-62 v1.1

Table 2-84 • Parameter Definition and Measuring Nodes

Parameter Name Parameter Definition

Measuring Nodes

(from, to)*

tOCLKQ Clock-to-Q of the Output Data Register HH, DOUT

tOSUD Data Setup Time for the Output Data Register FF, HH

tOHD Data Hold Time for the Output Data Register FF, HH

tOSUE Enable Setup Time for the Output Data Register GG, HH

tOHE Enable Hold Time for the Output Data Register GG, HH

tOCLR2Q Asynchronous Clear-to-Q of the Output Data Register LL, DOUT

tOREMCLR Asynchronous Clear Removal Time for the Output Data Register LL, HH

tORECCLR Asynchronous Clear Recovery Time for the Output Data Register LL, HH

tOECLKQ Clock-to-Q of the Output Enable Register HH, EOUT

tOESUD Data Setup Time for the Output Enable Register JJ, HH

tOEHD Data Hold Time for the Output Enable Register JJ, HH

tOESUE Enable Setup Time for the Output Enable Register KK, HH

tOEHE Enable Hold Time for the Output Enable Register KK, HH

tOECLR2Q Asynchronous Clear-to-Q of the Output Enable Register II, EOUT

tOEREMCLR Asynchronous Clear Removal Time for the Output Enable Register II, HH

tOERECCLR Asynchronous Clear Recovery Time for the Output Enable Register II, HH

tICLKQ Clock-to-Q of the Input Data Register AA, EE

tISUD Data Setup Time for the Input Data Register CC, AA

tIHD Data Hold Time for the Input Data Register CC, AA

tISUE Enable Setup Time for the Input Data Register BB, AA

tIHE Enable Hold Time for the Input Data Register BB, AA

tICLR2Q Asynchronous Clear-to-Q of the Input Data Register DD, EE

tIREMCLR Asynchronous Clear Removal Time for the Input Data Register DD, AA

tIRECCLR Asynchronous Clear Recovery Time for the Input Data Register DD, AA

*See Figure 2-15 on page 2-61 for more information.

ProASIC3 DC and Switching Characteristics

v1.1 2-63

Input Register

Timing Characteristics

Figure 2-16 • Input Register Timing Diagram

50%

Preset

Clear

Out_1

CLK

Data

Enable

tISUE

50%

tISUD

tIHD

50% 50%

tICLKQ

tIHE

tIRECPRE tIREMPRE

tIRECCLR tIREMCLR

tIWCLR

tIWPRE

tIPRE2Q

tICLR2Q

tICKMPWH tICKMPWL

50% 50%

50% 50% 50%

50% 50%

50% 50% 50% 50% 50% 50%

50%

Table 2-85 • Input Data Register Propagation Delays

Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V

Parameter Description –2 –1 Std. –F Units

tICLKQ Clock-to-Q of the Input Data Register 0.24 0.27 0.32 0.38 ns

tISUD Data Setup Time for the Input Data Register 0.26 0.30 0.35 0.42 ns

tIHD Data Hold Time for the Input Data Register 0.00 0.00 0.00 0.00 ns

tISUE Enable Setup Time for the Input Data Register 0.37 0.42 0.50 0.60 ns

tIHE Enable Hold Time for the Input Data Register 0.00 0.00 0.00 0.00 ns

tICLR2Q Asynchronous Clear-to-Q of the Input Data Register 0.45 0.52 0.61 0.73 ns

tIPRE2Q Asynchronous Preset-to-Q of the Input Data Register 0.45 0.52 0.61 0.73 ns

tIREMCLR Asynchronous Clear Removal Time for the Input Data Register 0.00 0.00 0.00 0.00 ns

tIRECCLR Asynchronous Clear Recovery Time for the Input Data Register 0.22 0.25 0.30 0.36 ns

tIREMPRE Asynchronous Preset Removal Time for the Input Data Register 0.00 0.00 0.00 0.00 ns

tIRECPRE Asynchronous Preset Recovery Time for the Input Data Register 0.22 0.25 0.30 0.36 ns

tIWCLR Asynchronous Clear Minimum Pulse Width for the Input Data Register 0.22 0.25 0.30 0.36 ns

tIWPRE Asynchronous Preset Minimum Pulse Width for the Input Data Register 0.22 0.25 0.30 0.36 ns

tICKMPWH Clock Minimum Pulse Width HIGH for the Input Data Register 0.36 0.41 0.48 0.57 ns

tICKMPWL Clock Minimum Pulse Width LOW for the Input Data Register 0.32 0.37 0.43 0.52 ns

Note: For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating

values.

ProASIC3 DC and Switching Characteristics

2-64 v1.1

Output Register

Timing Characteristics

Figure 2-17 • Output Register Timing Diagram

Preset

Clear

DOUT

CLK

Data_out

Enable

OSUE

50%

OSUD

OHD

50% 50%

OCLKQ

OHE

ORECPRE

OREMPRE

ORECCLR

OREMCLR

OWCLR

OWPRE

OPRE2Q

OCLR2Q

OCKMPWH

OCKMPWL

50% 50%

50% 50% 50%

50% 50%

50% 50% 50% 50% 50% 50%

50%

Table 2-86 • Output Data Register Propagation Delays

Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V

Parameter Description –2 –1 Std. –F Units

tOCLKQ Clock-to-Q of the Output Data Register 0.59 0.67 0.79 0.95 ns

tOSUD Data Setup Time for the Output Data Register 0.31 0.36 0.42 0.50 ns

tOHD Data Hold Time for the Output Data Register 0.00 0.00 0.00 0.00 ns

tOSUE Enable Setup Time for the Output Data Register 0.44 0.50 0.59 0.70 ns

tOHE Enable Hold Time for the Output Data Register 0.00 0.00 0.00 0.00 ns

tOCLR2Q Asynchronous Clear-to-Q of the Output Data Register 0.80 0.91 1.07 1.29 ns

tOPRE2Q Asynchronous Preset-to-Q of the Output Data Register 0.80 0.91 1.07 1.29 ns

tOREMCLR Asynchronous Clear Removal Time for the Output Data Register 0.00 0.00 0.00 0.00 ns

tORECCLR Asynchronous Clear Recovery Time for the Output Data Register 0.22 0.25 0.30 0.36 ns

tOREMPRE Asynchronous Preset Removal Time for the Output Data Register 0.00 0.00 0.00 0.00 ns

tORECPRE Asynchronous Preset Recovery Time for the Output Data Register 0.22 0.25 0.30 0.36 ns

tOWCLR Asynchronous Clear Minimum Pulse Width for the Output Data

0.22 0.25 0.30 0.36 ns

tOWPRE Asynchronous Preset Minimum Pulse Width for the Output Data

0.22 0.25 0.30 0.36 ns

tOCKMPWH Clock Minimum Pulse Width HIGH for the Output Data Register 0.36 0.41 0.48 0.57 ns

tOCKMPWL Clock Minimum Pulse Width LOW for the Output Data Register 0.32 0.37 0.43 0.52 ns

Note: For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating

values.

ProASIC3 DC and Switching Characteristics

v1.1 2-65

Output Enable Register

Figure 2-18 • Output Enable Register Timing Diagram

50%

Preset

Clear

EOUT

CLK

D_Enable

Enable

tOESUE

50%

tOESUD tOEHD

50% 50%

tOECLKQ

tOEHE

tOERECPRE

tOEREMPRE

tOERECCLR tOEREMCLR

tOEWCLR

tOEWPRE

tOEPRE2Q tOECLR2Q

tOECKMPWH tOECKMPWL

50% 50%

50% 50% 50%

50% 50%

50% 50% 50% 50% 50% 50%

50%

ProASIC3 DC and Switching Characteristics

2-66 v1.1

Timing Characteristics

Table 2-87 • Output Enable Register Propagation Delays

Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V

Parameter Description –2 –1 Std. –F Units

tOECLKQ Clock-to-Q of the Output Enable Register 0.59 0.67 0.79 0.95 ns

tOESUD Data Setup Time for the Output Enable Register 0.31 0.36 0.42 0.50 ns

tOEHD Data Hold Time for the Output Enable Register 0.00 0.00 0.00 0.00 ns

tOESUE Enable Setup Time for the Output Enable Register 0.44 0.50 0.58 0.70 ns

tOEHE Enable Hold Time for the Output Enable Register 0.00 0.00 0.00 0.00 ns

tOECLR2Q Asynchronous Clear-to-Q of the Output Enable Register 0.67 0.76 0.89 1.07 ns

tOEPRE2Q Asynchronous Preset-to-Q of the Output Enable Register 0.67 0.76 0.89 1.07 ns

tOEREMCLR Asynchronous Clear Removal Time for the Output Enable Register 0.00 0.00 0.00 0.00 ns

tOERECCLR Asynchronous Clear Recovery Time for the Output Enable Register 0.22 0.25 0.30 0.36 ns

tOEREMPRE Asynchronous Preset Removal Time for the Output Enable Register 0.00 0.00 0.00 0.00 ns

tOERECPRE Asynchronous Preset Recovery Time for the Output Enable Register 0.22 0.25 0.30 0.36 ns

tOEWCLR Asynchronous Clear Minimum Pulse Width for the Output Enable

0.22 0.25 0.30 0.36 ns

tOEWPRE Asynchronous Preset Minimum Pulse Width for the Output Enable

0.22 0.25 0.30 0.36 ns

tOECKMPWH Clock Minimum Pulse Width HIGH for the Output Enable Register 0.36 0.41 0.48 0.57 ns

tOECKMPWL Clock Minimum Pulse Width LOW for the Output Enable Register 0.32 0.37 0.43 0.52 ns

Note: For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating

values.

ProASIC3 DC and Switching Characteristics

v1.1 2-67

DDR Module Specifications

Input DDR Module

Figure 2-19 • Input DDR Timing Model

Table 2-88 • Parameter Definitions

Parameter Name Parameter Definition Measuring Nodes (from, to)

tDDRICLKQ1 Clock-to-Out Out_QR B, D

tDDRICLKQ2 Clock-to-Out Out_QF B, E

tDDRISUD Data Setup Time of DDR input A, B

tDDRIHD Data Hold Time of DDR input A, B

tDDRICLR2Q1 Clear-to-Out Out_QR C, D

tDDRICLR2Q2 Clear-to-Out Out_QF C, E

tDDRIREMCLR Clear Removal C, B

tDDRIRECCLR Clear Recovery C, B

Input DDR

Data

CLK

CLKBUF

INBUF

Out_QF

(to core)

FF2

FF1

INBUF

CLR

DDR_IN

Out_QR

(to core)

ProASIC3 DC and Switching Characteristics

2-68 v1.1

Timing Characteristics

Figure 2-20 • Input DDR Timing Diagram

tDDRICLR2Q2

tDDRIREMCLR

tDDRIRECCLR

tDDRICLR2Q1

12 3 4 5 6 7 8 9

CLK

Data

CLR

Out_QR

Out_QF

tDDRICLKQ1

246

357

tDDRIHD

tDDRISUD

tDDRICLKQ2

Table 2-89 • Input DDR Propagation Delays

Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V

Parameter Description –2 –1 Std. –F Units

tDDRICLKQ1 Clock-to-Out Out_QR for Input DDR 0.39 0.44 0.52 0.62 ns

tDDRICLKQ2 Clock-to-Out Out_QF for Input DDR 0.27 0.31 0.37 0.44 ns

tDDRISUD Data Setup for Input DDR 0.28 0.32 0.38 0.45 ns

tDDRIHD Data Hold for Input DDR 0.00 0.00 0.00 0.00 ns

tDDRICLR2Q1 Asynchronous Clear-to-Out Out_QR for Input DDR 0.57 0.65 0.76 0.92 ns

tDDRICLR2Q2 Asynchronous Clear-to-Out Out_QF for Input DDR 0.46 0.53 0.62 0.74 ns

tDDRIREMCLR Asynchronous Clear Removal Time for Input DDR 0.00 0.00 0.00 0.00 ns

tDDRIRECCLR Asynchronous Clear Recovery Time for Input DDR 0.22 0.25 0.30 0.36 ns

tDDRIWCLR Asynchronous Clear Minimum Pulse Width for Input DDR 0.22 0.25 0.30 0.36 ns

tDDRICKMPWH Clock Minimum Pulse Width HIGH for Input DDR 0.36 0.41 0.48 0.57 ns

tDDRICKMPWL Clock Minimum Pulse Width LOW for Input DDR 0.32 0.37 0.43 0.52 ns

FDDRIMAX Maximum Frequency for Input DDR TBD TBD TBD TBD MHz

Note: For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating

values.

ProASIC3 DC and Switching Characteristics

v1.1 2-69

Output DDR Module

Figure 2-21 • Output DDR Timing Model

Table 2-90 • Parameter Definitions

Parameter Name Parameter Definition Measuring Nodes (from, to)

tDDROCLKQ Clock-to-Out B, E

tDDROCLR2Q Asynchronous Clear-to-Out C, E

tDDROREMCLR Clear Removal C, B

tDDRORECCLR Clear Recovery C, B

tDDROSUD1 Data Setup Data_F A, B

tDDROSUD2 Data Setup Data_R D, B

tDDROHD1 Data Hold Data_F A, B

tDDROHD2 Data Hold Data_R D, B

Data_F

(from core)

CLK

CLKBUF

Out

FF2

INBUF

CLR

DDR_OUT

Output DDR

FF1

OUTBUF

Data_R

(from core)

ProASIC3 DC and Switching Characteristics

2-70 v1.1

Timing Characteristics

Figure 2-22 • Output DDR Timing Diagram

116

910

28 3 9

tDDROREMCLR

tDDROHD1

tDDROREMCLR

tDDROHD2

tDDROSUD2

tDDROCLKQ

tDDRORECCLR

CLK

Data_R

Data_F

CLR

Out

tDDROCLR2Q

7104

Table 2-91 • Output DDR Propagation Delays

Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V

Parameter Description –2 –1 Std. –F Units

tDDROCLKQ Clock-to-Out of DDR for Output DDR 0.70 0.80 0.94 1.13 ns

tDDROSUD1 Data_F Data Setup for Output DDR 0.38 0.43 0.51 0.61 ns

tDDROSUD2 Data_R Data Setup for Output DDR 0.38 0.43 0.51 0.61 ns

tDDROHD1 Data_F Data Hold for Output DDR 0.00 0.00 0.00 0.00 ns

tDDROHD2 Data_R Data Hold for Output DDR 0.00 0.00 0.00 0.00 ns

tDDROCLR2Q Asynchronous Clear-to-Out for Output DDR 0.80 0.91 1.07 1.29 ns

tDDROREMCLR Asynchronous Clear Removal Time for Output DDR 0.00 0.00 0.00 0.00 ns

tDDRORECCLR Asynchronous Clear Recovery Time for Output DDR 0.22 0.25 0.30 0.36 ns

tDDROWCLR1 Asynchronous Clear Minimum Pulse Width for Output DDR 0.22 0.25 0.30 0.36 ns

tDDROCKMPWH Clock Minimum Pulse Width HIGH for the Output DDR 0.36 0.41 0.48 0.57 ns

tDDROCKMPWL Clock Minimum Pulse Width LOW for the Output DDR 0.32 0.37 0.43 0.52 ns

FDDOMAX Maximum Frequency for the Output DDR TBD TBD TBD TBD MHz

Note: For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating

values.

ProASIC3 DC and Switching Characteristics

v1.1 2-71

VersaTile Characteristics

VersaTile Specifications as a Combinatorial Module

The ProASIC3 library offers all combinations of LUT-3 combinatorial functions. In this section,

timing characteristics are presented for a sample of the library. For more details, refer to the

Fusion, IGLOO/e, and ProASIC3/E Macro Library Guide.

Figure 2-23 • Sample of Combinatorial Cells

MAJ3

MUX2

AXOR2 Y

NOR2

YOR2

INV

AND2

NAND3

XOR3

NAND2

ProASIC3 DC and Switching Characteristics

2-72 v1.1

Figure 2-24 • Timing Model and Waveforms

tPD

tPD = MAX(tPD(RR), tPD(RF),

tPD(FF), tPD(FR)) where edges are

applicable for the particular

combinatorial cell

NAND2 or

Any Combinatorial

Logic

tPD

50%

VCC

50%

GND

A, B, C

50% 50%

50%

(RR)

(RF) GND

OUT

GND

50%

(FF)

(FR)

tPD

ProASIC3 DC and Switching Characteristics

v1.1 2-73

Timing Characteristics

VersaTile Specifications as a Sequential Module

The ProASIC3 library offers a wide variety of sequential cells, including flip-flops and latches. Each

has a data input and optional enable, clear, or preset. In this section, timing characteristics are

presented for a representative sample from the library. For more details, refer to the Fusion,

IGLOO/e, and ProASIC3/E Macro Library Guide.

Table 2-92 • Combinatorial Cell Propagation Delays

Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V

Combinatorial Cell Equation Parameter –2 –1 Std. –F Units

INV Y = !A tPD 0.40 0.46 0.54 0.65 ns

AND2 Y = A · B tPD 0.47 0.54 0.63 0.76 ns

NAND2 Y = !(A · B) tPD 0.47 0.54 0.63 0.76 ns

OR2 Y = A + B tPD 0.49 0.55 0.65 0.78 ns

NOR2 Y = !(A + B) tPD 0.49 0.55 0.65 0.78 ns

XOR2 Y = A ⊕ Bt

PD 0.74 0.84 0.99 1.19 ns

MAJ3 Y = MAJ(A , B, C) tPD 0.70 0.79 0.93 1.12 ns

XOR3 Y = A ⊕ B ⊕ Ct

PD 0.87 1.00 1.17 1.41 ns

MUX2 Y = A !S + B S tPD 0.51 0.58 0.68 0.81 ns

AND3 Y = A · B · C tPD 0.56 0.64 0.75 0.90 ns

Note: For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating

values.

Figure 2-25 • Sample of Sequential Cells

DFN1

Data

CLK

Out

DFN1C1

Data

CLK

Out

CLR

DFI1E1P1

Data

CLK

Out

PRE

DFN1E1

Data

CLK

Out

ProASIC3 DC and Switching Characteristics

2-74 v1.1

Timing Characteristics

Figure 2-26 • Timing Model and Waveforms

PRE

CLR

Out

CLK

Data

tSUE

50%

tSUD

tHD

50% 50%

tCLKQ

tHE

tRECPRE tREMPRE

tRECCLR tREMCLRtWCLR

tWPRE

tPRE2Q tCLR2Q

tCKMPWH tCKMPWL

50% 50%

50% 50% 50%

50% 50%

50% 50% 50% 50% 50% 50%

50%

Table 2-93 • Register Delays

Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V

Parameter Description –2 –1 Std. –F Units

tCLKQ Clock-to-Q of the Core Register 0.55 0.63 0.74 0.89 ns

tSUD Data Setup Time for the Core Register 0.43 0.49 0.57 0.69 ns

tHD Data Hold Time for the Core Register 0.00 0.00 0.00 0.00 ns

tSUE Enable Setup Time for the Core Register 0.45 0.52 0.61 0.73 ns

tHE Enable Hold Time for the Core Register 0.00 0.00 0.00 0.00 ns

tCLR2Q Asynchronous Clear-to-Q of the Core Register 0.40 0.45 0.53 0.64 ns

tPRE2Q Asynchronous Preset-to-Q of the Core Register 0.40 0.45 0.53 0.64 ns

tREMCLR Asynchronous Clear Removal Time for the Core Register 0.00 0.00 0.00 0.00 ns

tRECCLR Asynchronous Clear Recovery Time for the Core Register 0.22 0.25 0.30 0.36 ns

tREMPRE Asynchronous Preset Removal Time for the Core Register 0.00 0.00 0.00 0.00 ns

tRECPRE Asynchronous Preset Recovery Time for the Core Register 0.22 0.25 0.30 0.36 ns

tWCLR Asynchronous Clear Minimum Pulse Width for the Core Register 0.22 0.25 0.30 0.36 ns

tWPRE Asynchronous Preset Minimum Pulse Width for the Core Register 0.22 0.25 0.30 0.36 ns

tCKMPWH Clock Minimum Pulse Width HIGH for the Core Register 0.32 0.37 0.43 0.52 ns

tCKMPWL Clock Minimum Pulse Width LOW for the Core Register 0.36 0.41 0.48 0.57 ns

Note: For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating

values.

ProASIC3 DC and Switching Characteristics

v1.1 2-75

Global Resource Characteristics

A3P250 Clock Tree Topology

Clock delays are device-specific. Figure 2-27 is an example of a global tree used for clock routing.

The global tree presented in Figure 2-27 is driven by a CCC located on the west side of the A3P250

device. It is used to drive all D-flip-flops in the device.

Figure 2-27 • Example of Global Tree Use in an A3P250 Device for Clock Routing

Central

Global Rib

VersaTile

Rows

Global Spine

CCC

ProASIC3 DC and Switching Characteristics

2-76 v1.1

Global Tree Timing Characteristics

Global clock delays include the central rib delay, the spine delay, and the row delay. Delays do not

include I/O input buffer clock delays, as these are I/O standard–dependent, and the clock may be

driven and conditioned internally by the CCC module. For more details on clock conditioning

capabilities, refer to the "Clock Conditioning Circuits" section on page 2-80. Table 2-94 to

Table 2-100 on page 2-79 present minimum and maximum global clock delays within each device.

Minimum and maximum delays are measured with minimum and maximum loading.

Timing Characteristics

Table 2-94 • A3P030 Global Resource

Commercial-Case Conditions: TJ = 70°C, VCC = 1.425 V

Parameter Description

–2 –1 Std. –F

UnitsMin.1Max.2Min.1Max.2Min.1Max.2Min.1Max.2

tRCKL Input LOW Delay for Global Clock 0.67 0.81 0.76 0.92 0.89 1.09 1.07 1.31 ns

tRCKH Input HIGH Delay for Global Clock 0.680.850.770.970.911.141.091.37 ns

tRCKMPWH Minimum Pulse Width HIGH for Global Clock ns

tRCKMPWL Minimum Pulse Width LOW for Global Clock ns

tRCKSW Maximum Skew for Global Clock 0.18 0.21 0.24 0.29 ns

FRMAX Maximum Frequency for Global Clock MHz

Notes:

1. Value reflects minimum load. The delay is measured from the CCC output to the clock pin of a sequential

element, located in a lightly loaded row (single element is connected to the global net).

2. Value reflects maximum load. The delay is measured on the clock pin of the farthest sequential element,

located in a fully loaded row (all available flip-flops are connected to the global net in the row).

3. For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating

values.

Table 2-95 • A3P060 Global Resource

Commercial-Case Conditions: TJ = 70°C, VCC = 1.425 V

Parameter Description

–2 –1 Std. –F

UnitsMin.1Max.2Min.1Max.2Min.1Max.2Min.1Max.2

tRCKL Input LOW Delay for Global Clock 0.71 0.93 0.81 1.05 0.95 1.24 1.14 1.49 ns

tRCKH Input HIGH Delay for Global Clock 0.700.960.801.090.941.281.131.54 ns

tRCKMPWH Minimum Pulse Width HIGH for Global Clock ns

tRCKMPWL Minimum Pulse Width LOW for Global Clock ns

tRCKSW Maximum Skew for Global Clock 0.26 0.29 0.34 0.41 ns

FRMAX Maximum Frequency for Global Clock MHz

Notes:

1. Value reflects minimum load. The delay is measured from the CCC output to the clock pin of a sequential

element, located in a lightly loaded row (single element is connected to the global net).

2. Value reflects maximum load. The delay is measured on the clock pin of the farthest sequential element,

located in a fully loaded row (all available flip-flops are connected to the global net in the row).

3. For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating

values.

ProASIC3 DC and Switching Characteristics

v1.1 2-77

Table 2-96 • A3P125 Global Resource

Commercial-Case Conditions: TJ = 70°C, VCC = 1.425 V

Parameter Description

–2 –1 Std. –F

UnitsMin.1Max.2Min.1Max.2Min.1Max.2Min.1Max.2

tRCKL Input LOW Delay for Global Clock 0.77 0.99 0.87 1.12 1.03 1.32 1.24 1.58 ns

tRCKH Input HIGH Delay for Global Clock 0.761.020.871.161.021.371.231.64 ns

tRCKMPWH Minimum Pulse Width HIGH for Global Clock ns

tRCKMPWL Minimum Pulse Width LOW for Global Clock ns

tRCKSW Maximum Skew for Global Clock 0.26 0.29 0.34 0.41 ns

FRMAX Maximum Frequency for Global Clock MHz

Notes:

1. Value reflects minimum load. The delay is measured from the CCC output to the clock pin of a sequential

element, located in a lightly loaded row (single element is connected to the global net).

2. Value reflects maximum load. The delay is measured on the clock pin of the farthest sequential element,

located in a fully loaded row (all available flip-flops are connected to the global net in the row).

3. For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating

values.

Table 2-97 • A3P250 Global Resource

Commercial-Case Conditions: TJ = 70°C, VCC = 1.425 V

Parameter Description

–2 –1 Std. –F

UnitsMin.1Max.2Min.1Max.2Min.1Max.2Min.1Max.2

tRCKL Input LOW Delay for Global Clock 0.80 1.01 0.91 1.15 1.07 1.36 1.28 1.63 ns

tRCKH Input HIGH Delay for Global Clock 0.781.040.891.181.041.391.251.66 ns

tRCKMPWH Minimum Pulse Width HIGH for Global Clock ns

tRCKMPWL Minimum Pulse Width LOW for Global Clock ns

tRCKSW Maximum Skew for Global Clock 0.26 0.29 0.34 0.41 ns

FRMAX Maximum Frequency for Global Clock MHz

Notes:

1. Value reflects minimum load. The delay is measured from the CCC output to the clock pin of a sequential

element, located in a lightly loaded row (single element is connected to the global net).

2. Value reflects maximum load. The delay is measured on the clock pin of the farthest sequential element,

located in a fully loaded row (all available flip-flops are connected to the global net in the row).

3. For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating

values.

ProASIC3 DC and Switching Characteristics

2-78 v1.1

Table 2-98 • A3P400 Global Resource

Commercial-Case Conditions: TJ = 70°C, VCC = 1.425 V

Parameter Description

–2 –1 Std. –F

UnitsMin.1Max.2Min.1Max.2Min.1Max.2Min.1Max.2

tRCKL Input LOW Delay for Global Clock 0.87 1.09 0.99 1.24 1.17 1.46 1.40 1.75 ns

tRCKH Input HIGH Delay for Global Clock 0.861.110.981.271.151.491.381.79 ns

tRCKMPWH Minimum Pulse Width HIGH for Global Clock ns

tRCKMPWL Minimum Pulse Width LOW for Global Clock ns

tRCKSW Maximum Skew for Global Clock 0.26 0.29 0.34 0.41 ns

FRMAX Maximum Frequency for Global Clock Mhz

Notes:

1. Value reflects minimum load. The delay is measured from the CCC output to the clock pin of a sequential

element, located in a lightly loaded row (single element is connected to the global net).

2. Value reflects maximum load. The delay is measured on the clock pin of the farthest sequential element,

located in a fully loaded row (all available flip-flops are connected to the global net in the row).

3. For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating

values.

Table 2-99 • A3P600 Global Resource

Commercial-Case Conditions: TJ = 70°C, VCC = 1.425 V

Parameter Description

–2 –1 Std. –F

UnitsMin.1Max.2Min.1Max.2Min.1Max.2Min.1Max.2

tRCKL Input LOW Delay for Global Clock 0.87 1.09 0.99 1.24 1.17 1.46 1.40 1.75 ns

tRCKH Input HIGH Delay for Global Clock 0.861.110.981.271.151.491.381.79 ns

tRCKMPWH Minimum Pulse Width HIGH for Global Clock ns

tRCKMPWL Minimum Pulse Width LOW for Global Clock ns

tRCKSW Maximum Skew for Global Clock 0.26 0.29 0.34 0.41 ns

FRMAX Maximum Frequency for Global Clock MHz

Notes:

1. Value reflects minimum load. The delay is measured from the CCC output to the clock pin of a sequential

element, located in a lightly loaded row (single element is connected to the global net).

2. Value reflects maximum load. The delay is measured on the clock pin of the farthest sequential element,

located in a fully loaded row (all available flip-flops are connected to the global net in the row).

3. For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating

values.

ProASIC3 DC and Switching Characteristics

v1.1 2-79

Table 2-100 • A3P1000 Global Resource

Commercial-Case Conditions: TJ = 70°C, VCC = 1.425 V

Parameter Description

–2 –1 Std. –F

UnitsMin.1Max.2Min.1Max.2Min.1Max.2Min.1Max.2

tRCKL Input LOW Delay for Global Clock 0.94 1.16 1.07 1.32 1.26 1.55 1.51 1.86 ns

tRCKH Input HIGH Delay for Global Clock 0.931.191.061.351.241.591.491.91 ns

tRCKMPWH Minimum Pulse Width HIGH for Global Clock ns

tRCKMPWL Minimum Pulse Width LOW for Global Clock ns

tRCKSW Maximum Skew for Global Clock 0.26 0.29 0.35 0.41 ns

FRMAX Maximum Frequency for Global Clock MHz

Notes:

1. Value reflects minimum load. The delay is measured from the CCC output to the clock pin of a sequential

element, located in a lightly loaded row (single element is connected to the global net).

2. Value reflects maximum load. The delay is measured on the clock pin of the farthest sequential element,

located in a fully loaded row (all available flip-flops are connected to the global net in the row).

3. For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating

values.

ProASIC3 DC and Switching Characteristics

2-80 v1.1

Clock Conditioning Circuits

CCC Electrical Specifications

Timing Characteristics

Table 2-101 • ProASIC3 CCC/PLL Specification

Parameter Minimum Typical Maximum Units

Clock Conditioning Circuitry Input Frequency fIN_CCC 1.5 350 MHz

Clock Conditioning Circuitry Output Frequency fOUT_CCC 0.75 350 MHz

Serial Clock (SCLK) for Dynamic PLL1125 MHz

Delay Increments in Programmable Delay Blocks2, 3 160 ps

Number of Programmable Values in Each Programmable

Delay Block

Input Period Jitter 1.5 ns

CCC Output Peak-to-Peak Period Jitter FCCC_OUT Max Peak-to-Peak Period Jitter

1 Global

Network

Used

3 Global

Networks

Used

0.75 MHz to 24 MHz 0.50% 0.70%

24 MHz to 100 MHz 1.00% 1.20%

100 MHz to 250 MHz 1.75% 2.00%

250 MHz to 350 MHz 2.50% 5.60%

Acquisition Time

(A3P250 and A3P1000 only) LockControl = 0 300 µs

LockControl = 1 300 µs

(all other dies) LockControl = 0 300 µs

LockControl = 1 6.0 ms

Tracking Jitter5

(A3P250 and A3P1000 only) LockControl = 0 1.6 ns

LockControl = 1 1.6 ns

(all other dies) LockControl = 0 1.6 ns

LockControl = 1 0.8 ns

Output Duty Cycle 48.5 51.5 %

Delay Range in Block: Programmable Delay 12, 3 0.6 5.56 ns

Delay Range in Block: Programmable Delay 22, 3 0.025 5.56 ns

Delay Range in Block: Fixed Delay2, 3 2.2 ns

Notes:

1. Maximum value obtained for a –2 speed-grade device in worst-case commercial conditions. For specific

junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating values.

2. This delay is a function of voltage and temperature. See Table 2-6 on page 2-6 for deratings.

3. TJ = 25°C, VCC = 1.5 V

4. The A3P030 device does not contain a PLL.

5. Tracking jitter is defined as the variation in clock edge position of PLL outputs with reference to the PLL

input clock edge. Tracking jitter does not measure the variation in PLL output period, which is covered by

the period jitter parameter.

ProASIC3 DC and Switching Characteristics

v1.1 2-81

Note: Peak-to-peak jitter measurements are defined by Tpeak-to-peak = Tperiod_max – Tperiod_min.

Figure 2-28 • Peak-to-Peak Jitter Definition

period_max

period_min

Output Signal

ProASIC3 DC and Switching Characteristics

2-82 v1.1

Embedded SRAM and FIFO Characteristics

SRAM

Figure 2-29 • RAM Models

ADDRA11 DOUTA8

DOUTA7

DOUTA0

DOUTB8

DOUTB7

DOUTB0

ADDRA10

ADDRA0

DINA8

DINA7

DINA0

WIDTHA1

WIDTHA0

PIPEA

WMODEA

BLKA

WENA

CLKA

ADDRB11

ADDRB10

ADDRB0

DINB8

DINB7

DINB0

WIDTHB1

WIDTHB0

PIPEB

WMODEB

BLKB

WENB

CLKB

RAM4K9

RADDR8 RD17

RADDR7 RD16

RADDR0 RD0

WD17

WD16

WD0

WW1

WW0

RW1

RW0

PIPE

REN

RCLK

RAM512X18

WADDR8

WADDR7

WADDR0

WEN

WCLK

RESET

ProASIC3 DC and Switching Characteristics

v1.1 2-83

Timing Waveforms

Figure 2-30 • RAM Read for Pass-Through Output

Figure 2-31 • RAM Read for Pipelined Output

CLK

ADD

BLK_B

WEN_B

CYC

CKH

CKL

BKS

ENS

ENH

DOH1

BKH

CKQ1

CLK

ADD

BLK_B

WEN_B

A0A1A2

D0D1

tCYC

tCKH tCKL

tAS tAH

tBKS

tENS tENH

tDOH2

tCKQ2

tBKH

ProASIC3 DC and Switching Characteristics

2-84 v1.1

Figure 2-32 • RAM Write, Output Retained (WMODE = 0)

Figure 2-33 • RAM Write, Output as Write Data (WMODE = 1)

tCYC

tCKH tCKL

A0A1A2

DI0DI1

tAS tAH

tBKS

tENS tENH

tDS tDH

CLK

BLK_B

WEN_B

ADD

tBKH

tCYC

tCKH tCKL

A0A1A2

DI0DI1

tAS tAH

tBKS

tENS

tDS tDH

CLK

BLK_B

WEN_B

ADD

tBKH

(pass-through) DI1

DnDI0

(pipelined) DI0DI1

DI2

ProASIC3 DC and Switching Characteristics

v1.1 2-85

Figure 2-34 • Write Access after Write onto Same Address

CLK1

CLK2

WEN_B1

WEN_B2

ADD1

ADD2

DI1

DI2

DO2

(pass-through)

DO2

(pipelined)

CCKH

CKQ1

CKQ2

DnD0

A0A4

ProASIC3 DC and Switching Characteristics

2-86 v1.1

Figure 2-35 • Read Access after Write onto Same Address

CLK1

CLK2

WEN_B1

WEN_B2

ADD1

ADD2

DI1

DO2

(pass-through)

DO2

(pipelined)

WRO

CKQ1

CKQ2

A0A1A4

DnD0

D0D1

ProASIC3 DC and Switching Characteristics

v1.1 2-87

Figure 2-36 • Write Access after Read onto Same Address

Figure 2-37 • RAM Reset

CKQ1

CKQ2

CCKH

CLK1

ADD1

WEN_B1

DO1

(pass-through)

DO1

(pipelined)

CLK2

ADD2

DI2

WEN_B2

D0D1

CLK

RESET_B

DO D

CYC

CKH

CKL

RSTBQ

ProASIC3 DC and Switching Characteristics

2-88 v1.1

Timing Characteristics

Table 2-102 • RAM4K9

Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V

Parameter Description –2 –1 Std. –F Units

tAS Address setup time 0.25 0.28 0.33 0.40 ns

tAH Address hold time 0.00 0.00 0.00 0.00 ns

tENS REN_B, WEN_B setup time 0.14 0.16 0.19 0.23 ns

tENH REN_B, WEN_B hold time 0.10 0.11 0.13 0.16 ns

tBKS BLK_B setup time 0.23 0.27 0.31 0.37 ns

tBKH BLK_B hold time 0.02 0.02 0.02 0.03 ns

tDS Input data (DI) setup time 0.18 0.21 0.25 0.29 ns

tDH Input data (DI) hold time 0.00 0.00 0.00 0.00 ns

tCKQ1 Clock HIGH to new data valid on DO (output retained, WMODE = 0) 2.36 2.68 3.15 3.79 ns

Clock HIGH to new data valid on DO (flow-through, WMODE = 1) 1.79 2.03 2.39 2.87 ns

tCKQ2 Clock HIGH to new data valid on DO (pipelined) 0.89 1.02 1.20 1.44 ns

tWRO Address collision clk-to-clk delay for reliable read access after write

on same address

TBDTBDTBDTBD ns

tCCKH Address collision clk-to-clk delay for reliable write access after

write/read on same address

TBDTBDTBDTBD ns

tRSTBQ RESET_B LOW to data out LOW on DO (flow-through) 0.92 1.05 1.23 1.48 ns

RESET_B LOW to Data Out LOW on DO (pipelined) 0.92 1.05 1.23 1.48 ns

tREMRSTB RESET_B removal 0.29 0.33 0.38 0.46 ns

tRECRSTB RESET_B recovery 1.50 1.71 2.01 2.41 ns

tMPWRSTB RESET_B minimum pulse width 0.21 0.24 0.29 0.34 ns

tCYC Clock cycle time 3.23 3.68 4.32 5.19 ns

FMAX Maximum frequency 310 272 231 193 MHz

Note: For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating

values.

ProASIC3 DC and Switching Characteristics

v1.1 2-89

Table 2-103 • RAM512X18

Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V

Parameter Description –2 –1 Std. –F Units

tAS Address setup time 0.25 0.28 0.33 0.40 ns

tAH Address hold time 0.00 0.00 0.00 0.00 ns

tENS REN_B, WEN_B setup time 0.13 0.15 0.17 0.21 ns

tENH REN_B, WEN_B hold time 0.10 0.11 0.13 0.16 ns

tDS Input data (DI) setup time 0.18 0.21 0.25 0.29 ns

tDH Input data (DI) hold time 0.00 0.00 0.00 0.00 ns

tCKQ1 Clock HIGH to new data valid on DO (output retained, WMODE = 0) 2.16 2.46 2.89 3.47 ns

tCKQ2 Clock HIGH to new data valid on DO (pipelined) 0.90 1.02 1.20 1.44 ns

tWRO Address collision clk-to-clk delay for reliable read access after write

on same address

TBDTBDTBDTBD ns

tCCKH Address collision clk-to-clk delay for reliable write access after

write/read on same address

TBDTBDTBDTBD ns

tRSTBQ RESET_B LOW to data out LOW on DO (flow-through) 0.92 1.05 1.23 1.48 ns

RESET_B LOW to data out LOW on DO (pipelined) 0.92 1.05 1.23 1.48 ns

tREMRSTB RESET_B removal 0.29 0.33 0.38 0.46 ns

tRECRSTB RESET_B recovery 1.50 1.71 2.01 2.41 ns

tMPWRSTB RESET_B minimum pulse width 0.21 0.24 0.29 0.34 ns

tCYC Clock cycle time 3.23 3.68 4.32 5.19 ns

FMAX Maximum frequency 310 272 231 193 MHz

Note: For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating

values.

ProASIC3 DC and Switching Characteristics

2-90 v1.1

FIFO

Figure 2-38 • FIFO Model

FIFO4K18

RW2

RD17

RW1

RD16

RW0

WW2

WW1

WW0 RD0

ESTOP

FSTOP

FULL

AFULL

EMPTY

AFVAL11

AEMPTY

AFVAL10

AFVAL0

AEVAL11

AEVAL10

AEVAL0

REN

RBLK

RCLK

WEN

WBLK

WCLK

RPIPE

WD17

WD16

WD0

RESET

ProASIC3 DC and Switching Characteristics

v1.1 2-91

Timing Waveforms

Figure 2-39 • FIFO Reset

Figure 2-40 • FIFO EMPTY Flag and AEMPTY Flag Assertion

MATCH (A

)

MPWRSTB

RSTFG

RSTCK

RSTAF

RCLK/

WCLK

RESET_B

EMPTY

AEMPTY

WA/RA

(Address Counter)

RSTFG

RSTAF

FULL

AFULL

RCLK

NO MATCH NO MATCH Dist = AEF_TH MATCH (EMPTY)

tCKAF

tRCKEF

EMPTY

AEMPTY

tCYC

WA/RA

(Address Counter)

ProASIC3 DC and Switching Characteristics

2-92 v1.1

Figure 2-41 • FIFO FULL Flag and AFULL Flag Assertion

Figure 2-42 • FIFO EMPTY Flag and AEMPTY Flag Deassertion

Figure 2-43 • FIFO FULL Flag and AFULL Flag Deassertion

NO MATCH NO MATCH Dist = AFF_TH MATCH (FULL)

tCKAF

tWCKFF

tCYC

WCLK

FULL

AFULL

WA/RA

(Address Counter)

WCLK

WA/RA

(Address Counter) MATCH

(EMPTY) NO MATCH NO MATCH NO MATCH Dist = AEF_TH + 1

NO MATCH

RCLK

EMPTY

1st Rising

Edge

After 1st

Write

2nd Rising

Edge

After 1st

Write

tRCKEF

tCKAF

AEMPTY

Dist = AFF_TH – 1

MATCH (FULL) NO MATCH NO MATCH NO MATCH NO MATCH

tWCKF

tCKAF

1st Rising

Edge

After 1st

Read

1st Rising

Edge

After 2nd

Read

RCLK

WA/RA

(Address Counter)

WCLK

FULL

AFULL

ProASIC3 DC and Switching Characteristics

v1.1 2-93

Timing Characteristics

Table 2-104 • FIFO (for all dies except A3P250)

Worst Commercial-Case Conditions: TJ = 70°C, VCC = 1.425 V

Parameter Description –2 –1 Std. –F Units

tENS REN_B, WEN_B Setup Time 1.34 1.52 1.79 2.15 ns

tENH REN_B, WEN_B Hold Time 0.00 0.00 0.00 0.00 ns

tBKS BLK_B Setup Time 0.19 0.22 0.26 0.31 ns

tBKH BLK_B Hold Time 0.00 0.00 0.00 0.00 ns

tDS Input Data (DI) Setup Time 0.18 0.21 0.25 0.29 ns

tDH Input Data (DI) Hold Time 0.00 0.00 0.00 0.00 ns

tCKQ1 Clock HIGH to New Data Valid on DO (flow-through) 2.17 2.47 2.90 3.48 ns

tCKQ2 Clock HIGH to New Data Valid on DO (pipelined) 0.94 1.07 1.26 1.52 ns

tRCKEF RCLK HIGH to Empty Flag Valid 1.72 1.96 2.30 2.76 ns

tWCKFF WCLK HIGH to Full Flag Valid 1.63 1.86 2.18 2.62 ns

tCKAF Clock HIGH to Almost Empty/Full Flag Valid 6.19 7.05 8.29 9.96 ns

tRSTFG RESET_B LOW to Empty/Full Flag Valid 1.69 1.93 2.27 2.72 ns

tRSTAF RESET_B LOW to Almost Empty/Full Flag Valid 6.13 6.98 8.20 9.85 ns

tRSTBQ RESET_B LOW to Data Out LOW on DO (flow-through) 0.921.051.231.48 ns

RESET_B LOW to Data Out LOW on DO (pipelined) 0.92 1.05 1.23 1.48 ns

tREMRSTB RESET_B Removal 0.29 0.33 0.38 0.46 ns

tRECRSTB RESET_B Recovery 1.50 1.71 2.01 2.41 ns

tMPWRSTB RESET_B Minimum Pulse Width 0.21 0.24 0.29 0.34 ns

tCYC Clock Cycle Time 3.23 3.68 4.32 5.19 ns

FMAX Maximum Frequency for FIFO 310 272 231 193 MHz

Note: For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating

values.

ProASIC3 DC and Switching Characteristics

2-94 v1.1

Table 2-105 • FIFO (for A3P250 only, aspect-ratio-dependent)

Worst Commercial-Case Conditions: TJ = 70°C, VCC = 1.425 V

Parameter Description –2 –1 Std. –F Units

tENS REN_B, WEN_B Setup Time 3.26 3.71 4.36 5.24 ns

tENH REN_B, WEN_B Hold Time 0.00 0.00 0.00 0.00 ns

tBKS BLK_B Setup Time 0.19 0.22 0.26 0.31 ns

tBKH BLK_B Hold Time 0.00 0.00 0.00 0.00 ns

tDS Input Data (DI) Setup Time 0.18 0.21 0.25 0.29 ns

tDH Input Data (DI) Hold Time 0.00 0.00 0.00 0.00 ns

tCKQ1 Clock HIGH to New Data Valid on DO (flow-through) 2.17 2.47 2.90 3.48 ns

tCKQ2 Clock HIGH to New Data Valid on DO (pipelined) 0.94 1.07 1.26 1.52 ns

tRCKEF RCLK HIGH to Empty Flag Valid 1.72 1.96 2.30 2.76 ns

tWCKFF WCLK HIGH to Full Flag Valid 1.63 1.86 2.18 2.62 ns

tCKAF Clock HIGH to Almost Empty/Full Flag Valid 6.19 7.05 8.29 9.96 ns

tRSTFG RESET_B LOW to Empty/Full Flag Valid 1.69 1.93 2.27 2.72 ns

tRSTAF RESET_B LOW to Almost Empty/Full Flag Valid 6.13 6.98 8.20 9.85 ns

tRSTBQ RESET_B LOW to Data Out LOW on DO (flow-through) 0.921.051.231.48 ns

RESET_B LOW to Data Out LOW on DO (pipelined) 0.92 1.05 1.23 1.48 ns

tREMRSTB RESET_B Removal 0.29 0.33 0.38 0.46 ns

tRECRSTB RESET_B Recovery 1.50 1.71 2.01 2.41 ns

tMPWRSTB RESET_B Minimum Pulse Width 0.21 0.24 0.29 0.34 ns

tCYC Clock Cycle Time 3.23 3.68 4.32 5.19 ns

FMAX Maximum Frequency for FIFO 310 272 231 193 MHz

ProASIC3 DC and Switching Characteristics

v1.1 2-95

Table 2-106 • A3P250 FIFO 512×8

Worst Commercial-Case Conditions: TJ = 70°C, VCC = 1.425 V

Parameter Description –2 –1 Std. –F Units

tENS REN_B, WEN_B Setup Time 3.75 4.27 5.02 6.04 ns

tENH REN_B, WEN_B Hold Time 0.00 0.00 0.00 0.00 ns

tBKS BLK_B Setup Time 0.19 0.22 0.26 0.31 ns

tBKH BLK_B Hold Time 0.00 0.00 0.00 0.00 ns

tDS Input Data (DI) Setup Time 0.18 0.21 0.25 0.29 ns

tDH Input Data (DI) Hold Time 0.00 0.00 0.00 0.00 ns

tCKQ1 Clock HIGH to New Data Valid on DO (flow-through) 2.17 2.47 2.90 3.48 ns

tCKQ2 Clock HIGH to New Data Valid on DO (pipelined) 0.94 1.07 1.26 1.52 ns

tRCKEF RCLK HIGH to Empty Flag Valid 1.72 1.96 2.30 2.76 ns

tWCKFF WCLK HIGH to Full Flag Valid 1.63 1.86 2.18 2.62 ns

tCKAF Clock HIGH to Almost Empty/Full Flag Valid 6.19 7.05 8.29 9.96 ns

tRSTFG RESET_B LOW to Empty/Full Flag Valid 1.69 1.93 2.27 2.72 ns

tRSTAF RESET_B LOW to Almost Empty/Full Flag Valid 6.13 6.98 8.20 9.85 ns

tRSTBQ RESET_B LOW to Data Out LOW on DO (flow-through) 0.921.051.231.48 ns

RESET_B LOW to Data Out LOW on DO (pipelined) 0.92 1.05 1.23 1.48 ns

tREMRSTB RESET_B Removal 0.29 0.33 0.38 0.46 ns

tRECRSTB RESET_B Recovery 1.50 1.71 2.01 2.41 ns

tMPWRSTB RESET_B Minimum Pulse Width 0.21 0.24 0.29 0.34 ns

tCYC Clock Cycle Time 3.23 3.68 4.32 5.19 ns

FMAX Maximum Frequency for FIFO 310 272 231 193 MHz

ProASIC3 DC and Switching Characteristics

2-96 v1.1

Table 2-107 • A3P250 FIFO 1k×4

Worst Commercial-Case Conditions: TJ = 70°C, VCC = 1.425 V

Parameter Description –2 –1 Std. –F Units

tENS REN_B, WEN_B Setup Time 4.05 4.61 5.42 6.52 ns

tENH REN_B, WEN_B Hold Time 0.00 0.00 0.00 0.00 ns

tBKS BLK_B Setup Time 0.19 0.22 0.26 0.31 ns

tBKH BLK_B Hold Time 0.00 0.00 0.00 0.00 ns

tDS Input Data (DI) Setup Time 0.18 0.21 0.25 0.29 ns

tDH Input Data (DI) Hold Time 0.00 0.00 0.00 0.00 ns

tCKQ1 Clock HIGH to New Data Valid on DO (flow-through) 2.36 2.68 3.15 3.79 ns

tCKQ2 Clock HIGH to New Data Valid on DO (pipelined) 0.89 1.02 1.20 1.44 ns

tRCKEF RCLK HIGH to Empty Flag Valid 1.72 1.96 2.30 2.76 ns

tWCKFF WCLK HIGH to Full Flag Valid 1.63 1.86 2.18 2.62 ns

tCKAF Clock HIGH to Almost Empty/Full Flag Valid 6.19 7.05 8.29 9.96 ns

tRSTFG RESET_B LOW to Empty/Full Flag Valid 1.69 1.93 2.27 2.72 ns

tRSTAF RESET_B LOW to Almost Empty/Full Flag Valid 6.13 6.98 8.20 9.85 ns

tRSTBQ RESET_B LOW to Data Out LOW on DO (flow-through) 0.92 1.05 1.23 1.48 ns

RESET_B LOW to Data Out LOW on DO (pipelined) 0.92 1.05 1.23 1.48 ns

tREMRSTB RESET_B Removal 0.29 0.33 0.38 0.46 ns

tRECRSTB RESET_B Recovery 1.50 1.71 2.01 2.41 ns

tMPWRSTB RESET_B Minimum Pulse Width 0.21 0.24 0.29 0.34 ns

tCYC Clock Cycle Time 3.23 3.68 4.32 5.19 ns

FMAX Maximum Frequency for FIFO 310 272 231 193 MHz

ProASIC3 DC and Switching Characteristics

v1.1 2-97

Table 2-108 • A3P250 FIFO 2k×2

Worst Commercial-Case Conditions: TJ = 70°C, VCC = 1.425 V

Parameter Description –2 –1 Std. –F Units

tENS REN_B, WEN_B Setup Time 4.39 5.00 5.88 7.06 ns

tENH REN_B, WEN_B Hold Time 0.00 0.00 0.00 0.00 ns

tBKS BLK_B Setup Time 0.19 0.22 0.26 0.31 ns

tBKH BLK_B Hold Time 0.00 0.00 0.00 0.00 ns

tDS Input Data (DI) Setup Time 0.18 0.21 0.25 0.29 ns

tDH Input Data (DI) Hold Time 0.00 0.00 0.00 0.00 ns

tCKQ1 Clock HIGH to New Data Valid on DO (flow-through) 2.36 2.68 3.15 3.79 ns

tCKQ2 Clock HIGH to New Data Valid on DO (pipelined) 0.89 1.02 1.20 1.44 ns

tRCKEF RCLK HIGH to Empty Flag Valid 1.72 1.96 2.30 2.76 ns

tWCKFF WCLK HIGH to Full Flag Valid 1.63 1.86 2.18 2.62 ns

tCKAF Clock HIGH to Almost Empty/Full Flag Valid 6.19 7.05 8.29 9.96 ns

tRSTFG RESET_B LOW to Empty/Full Flag Valid 1.69 1.93 2.27 2.72 ns

tRSTAF RESET_B LOW to Almost Empty/Full Flag Valid 6.13 6.98 8.20 9.85 ns

tRSTBQ RESET_B LOW to Data Out LOW on DO (flow-through) 0.92 1.05 1.23 1.48 ns

RESET_B LOW to Data Out LOW on DO (pipelined) 0.92 1.05 1.23 1.48 ns

tREMRSTB RESET_B Removal 0.29 0.33 0.38 0.46 ns

tRECRSTB RESET_B Recovery 1.50 1.71 2.01 2.41 ns

tMPWRSTB RESET_B Minimum Pulse Width 0.21 0.24 0.29 0.34 ns

tCYC Clock Cycle Time 3.23 3.68 4.32 5.19 ns

FMAX Maximum Frequency for FIFO 310 272 231 193 MHz

ProASIC3 DC and Switching Characteristics

2-98 v1.1

Table 2-109 • A3P250 FIFO 4k×1

Worst Commercial-Case Conditions: TJ = 70°C, VCC = 1.425 V

Parameter Description –2 –1 Std. –F Units

tENS REN_B, WEN_B Setup Time 4.86 5.53 6.50 7.81 ns

tENH REN_B, WEN_B Hold Time 0.00 0.00 0.00 0.00 ns

tBKS BLK_B Setup Time 0.19 0.22 0.26 0.31 ns

tBKH BLK_B Hold Time 0.00 0.00 0.00 0.00 ns

tDS Input Data (DI) Setup Time 0.18 0.21 0.25 0.29 ns

tDH Input Data (DI) Hold Time 0.00 0.00 0.00 0.00 ns

tCKQ1 Clock HIGH to New Data Valid on DO (flow-through) 2.36 2.68 3.15 3.79 ns

tCKQ2 Clock HIGH to New Data Valid on DO (pipelined) 0.89 1.02 1.20 1.44 ns

tRCKEF RCLK HIGH to Empty Flag Valid 1.72 1.96 2.30 2.76 ns

tWCKFF WCLK HIGH to Full Flag Valid 1.63 1.86 2.18 2.62 ns

tCKAF Clock HIGH to Almost Empty/Full Flag Valid 6.19 7.05 8.29 9.96 ns

tRSTFG RESET_B LOW to Empty/Full Flag Valid 1.69 1.93 2.27 2.72 ns

tRSTAF RESET_B LOW to Almost Empty/Full Flag Valid 6.13 6.98 8.20 9.85 ns

tRSTBQ RESET_B LOW to Data Out LOW on DO (pass-through) 0.92 1.05 1.23 1.48 ns

RESET_B LOW to Data Out LOW on DO (pipelined) 0.92 1.05 1.23 1.48 ns

tREMRSTB RESET_B Removal 0.29 0.33 0.38 0.46 ns

tRECRSTB RESET_B Recovery 1.50 1.71 2.01 2.41 ns

tMPWRSTB RESET_B Minimum Pulse Width 0.21 0.24 0.29 0.34 ns

tCYC Clock Cycle Time 3.23 3.68 4.32 5.19 ns

FMAX Maximum Frequency 310 272 231 193 MHz

ProASIC3 DC and Switching Characteristics

v1.1 2-99

Embedded FlashROM Characteristics

Timing Characteristics

Figure 2-44 • Timing Diagram

HOLD

CKQ2

CLK

Address

Data D

Table 2-110 • Embedded FlashROM Access Time

Parameter Description –2 –1 Std. Units

tSU Address Setup Time 0.53 0.61 0.71 ns

tHOLD Address Hold Time 0.00 0.00 0.00 ns

tCK2Q Clock to Out 21.42 24.40 28.68 ns

FMAX Maximum Clock Frequency 15 15 15 MHz

ProASIC3 DC and Switching Characteristics

2-100 v1.1

JTAG 1532 Characteristics

JTAG timing delays do not include JTAG I/Os. To obtain complete JTAG timing, add I/O buffer delays

to the corresponding standard selected; refer to the I/O timing characteristics in the "User I/O

Characteristics" section on page 2-13 for more details.

Timing Characteristics

Table 2-111 • JTAG 1532

Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V

Parameter Description –2 –1 Std. Units

tDISU Test Data Input Setup Time 0.50 0.57 0.67 ns

tDIHD Test Data Input Hold Time 1.00 1.13 1.33 ns

tTMSSU Test Mode Select Setup Time 0.50 0.57 0.67 ns

tTMDHD Test Mode Select Hold Time 1.00 1.13 1.33 ns

tTCK2Q Clock to Q (data out) 6.00 6.80 8.00 ns

tRSTB2Q Reset to Q (data out) 20.00 22.67 26.67 ns

FTCKMAX TCK Maximum Frequency 25.00 22.00 19.00 MHz

tTRSTREM ResetB Removal Time 0.00 0.00 0.00 ns

tTRSTREC ResetB Recovery Time 0.20 0.23 0.27 ns

tTRSTMPW ResetB Minimum Pulse TBD TBD TBD ns

Note: For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6

for derating values.

ProASIC3 DC and Switching Characteristics

v1.1 2-101

Part Number and Revision Date

Part Number 51700097-002-1

Revised January 2008

List of Changes

The following table lists critical changes that were made in the current version of the chapter.

Previous Version Changes in Current Version (v1.1) Page

v1.0

(January 2008)

In Table 2-2 · Recommended Operating Conditions, TJ was listed in the symbol

column and was incorrect. It was corrected and changed to TA.

2-2

In Table 2-3 · Flash Programming Limits – Retention, Storage and Operating

Temperature1, Maximum Operating Junction Temperature was changed from

110°C to 100°C for both commercial and industrial grades.

2-2

The "PLL Behavior at Brownout Condition" section is new. 2-3

In the "PLL Contribution—PPLL" section, the following was deleted:

FCLKIN is the input clock frequency.

2-11

In Table 2-17 · Summary of Maximum and Minimum DC Input Levels, the note

was incorrect. It previously said TJ and it was corrected and changed to TA.

2-18

In Table 2-101 · ProASIC3 CCC/PLL Specification, the SCLK parameter and note 1

are new.

2-80

Table 2-111 · JTAG 1532 was populated with the parameter data, which was not

in the previous version of the document.

2-100

v2.2

(July 2007)

This document was previously in datasheet v2.2. As a result of moving to the

handbook format, Actel restarted the version numbers so the new version

number is v1.0.

N/A

v2.1

(May 2007)

The TJ parameter in Table 3-2 • Recommended Operating Conditions was

changed to TA, ambient temperature, and table notes 4–6 were added.

3-2

v2.0

(April 2007)

Table 3-5 • Package Thermal Resistivities was updated with A3P1000

information. The note below the table is also new.

3-5

The timing characteristics tables were updated. N/A

The "PLL Macro" section was updated to add information on the VCO and PLL

outputs during power-up.

2-15

Advanced v0.7

(January 2007)

The "PLL Macro" section was updated to include power-up information. 2-15

Table 2-11 • ProASIC3 CCC/PLL Specification was updated. 2-29

Figure 2-19 • Peak-to-Peak Jitter Definition is new. 2-18

The "SRAM and FIFO" section was updated with operation and timing

requirement information.

2-21

The "RESET" section was updated with read and write information. 2-25

The"Introduction" in the "Advanced I/Os" section was updated to include

information on input and output buffers being disabled.

2-28

PCI-X 3.3 V was added to Table 2-11 • VCCI Voltages and Compatible Standards. 2-29

In the Table 2-15 • Levels of Hot-Swap Support, the ProASIC3 compliance

descriptions were updated for levels 3 and 4.

2-34

ProASIC3 DC and Switching Characteristics

2-102 v1.1

Advanced v0.7

(continued)

Table 2-43 • I/O Hot-Swap and 5 V Input Tolerance Capabilities in ProASIC3

Devices was updated.

2-64

Notes 3, 4, and 5 were added to Table 2-17 • Comparison Table for 5 V–

Compliant Receiver Scheme. 5 x 52.72 was changed to 52.7 and the Maximum

current was updated from 4 x 52.7 to 5 x 52.7.

2-40

The "VCCPLF PLL Supply Voltage" section was updated. 2-50

The "VPUMP Programming Supply Voltage" section was updated. 2-50

The "GL Globals" section was updated to include information about direct input

into quadrant clocks.

2-51

VJTAG was deleted from the "TCK Test Clock" section. 2-51

In Table 2-22 • Recommended Tie-Off Values for the TCK and TRST Pins, TSK

was changed to TCK in note 2. Note 3 was also updated.

2-51

Ambient was deleted from Table 3-2 • Recommended Operating Conditions.

VPUMP programming mode was changed from "3.0 to 3.6" to "3.15 to 3.45".

3-2

Note 3 is new in Table 3-4 • Overshoot and Undershoot Limits (as measured on

quiet I/Os)1.

3-2

In EQ 3-2, 150 was changed to 110 and the result changed from 3.9 to 1.951. 3-5

Table 3-6 • Temperature and Voltage Derating Factors for Timing Delays was

updated.

3-6

Table 3-5 • Package Thermal Resistivities was updated. 3-5

Table 3-14 • Summary of Maximum and Minimum DC Input and Output Levels

Applicable to Commercial and Industrial Conditions—Software Default Settings

(Advanced) and Table 3-17 • Summary of Maximum and Minimum DC Input

Levels Applicable to Commercial and Industrial Conditions (Standard Plus) were

updated.

3-17 to

3-17

Table 3-20 • Summary of I/O Timing Characteristics—Software Default Settings

(Advanced) and Table 3-21 • Summary of I/O Timing Characteristics—Software

Default Settings (Standard Plus) were updated.

3-20 to

3-20

Table 3-11 • Different Components Contributing to Dynamic Power

Consumption in ProASIC3 Devices was updated.

3-9

Table 3-24 • I/O Output Buffer Maximum Resistances1 (Advanced) and Table 3-

25 • I/O Output Buffer Maximum Resistances1 (Standard Plus) were updated.

3-22 to

3-22

Table 3-17 • Summary of Maximum and Minimum DC Input Levels Applicable to

Commercial and Industrial Conditions was updated.

3-18

Table 3-28 • I/O Short Currents IOSH/IOSL (Advanced) and Table 3-29 • I/O

Short Currents IOSH/IOSL (Standard Plus) were updated.

3-24 to

3-26

The note in Table 3-32 • I/O Input Rise Time, Fall Time, and Related I/O

Reliability was updated.

3-27

Figure 3-33 • Write Access After Write onto Same Address, Figure 3-34 • Read

Access After Write onto Same Address, and Figure 3-35 • Write Access After

Read onto Same Address are new.

3-82 to

3-84

Figure 3-43 • Timing Diagram was updated. 3-96

Previous Version Changes in Current Version (v1.1) Page

ProASIC3 DC and Switching Characteristics

v1.1 2-103

Advanced v0.5

(January 2006)

BLVDS and M-LDVS are new I/O standards added to the datasheet. N/A

The term flow-through was changed to pass-through. N/A

Figure 2-7 • Efficient Long-Line Resources was updated. 2-7

The footnotes in Figure 2-15 • Clock Input Sources Including CLKBUF,

CLKBUF_LVDS/LVPECL, and CLKINT were updated.

2-16

The Delay Increments in the Programmable Delay Blocks specification in Figure

2-24 • ProASIC3E CCC Options.

2-24

The "SRAM and FIFO" section was updated. 2-21

The "RESET" section was updated. 2-25

The "WCLK and RCLK" section was updated. 2-25

The "RESET" section was updated. 2-25

The "RESET" section was updated. 2-27

The "Introduction" of the "Advanced I/Os" section was updated. 2-28

The "I/O Banks" section is new. This section explains the following types of I/Os:

Advanced

Standard+

Standard

Table 2-12 • Automotive ProASIC3 Bank Types Definition and Differences is

new. This table describes the standards listed above.

2-29

PCI-X 3.3 V was added to the Compatible Standards for 3.3 V in Table 2-

11 • VCCI Voltages and Compatible Standards

2-29

Table 2-13 • ProASIC3 I/O Features was updated. 2-30

The "Double Data Rate (DDR) Support" section was updated to include

information concerning implementation of the feature.

2-32

The "Electrostatic Discharge (ESD) Protection" section was updated to include

testing information.

2-35

Level 3 and 4 descriptions were updated in Table 2-43 • I/O Hot-Swap and 5 V

Input Tolerance Capabilities in ProASIC3 Devices.

2-64

The notes in Table 2-43 • I/O Hot-Swap and 5 V Input Tolerance Capabilities in

ProASIC3 Devices were updated.

2-64

The "Simultaneous Switching Outputs (SSOs) and Printed Circuit Board Layout"

section is new.

2-41

A footnote was added to Table 2-14 • Maximum I/O Frequency for Single-Ended

and Differential I/Os in All Banks in Automotive ProASIC3 Devices (maximum

drive strength and high slew selected).

2-30

Table 2-18 • Automotive ProASIC3 I/O Attributes vs. I/O Standard Applications 2-45

Previous Version Changes in Current Version (v1.1) Page

ProASIC3 DC and Switching Characteristics

2-104 v1.1

Advanced v0.5

(January 2006)

(continued)

Table 2-50 • ProASIC3 Output Drive (OUT_DRIVE) for Standard I/O Bank Type

(A3P030 device)

2-83

Table 2-51 • ProASIC3 Output Drive for Standard+ I/O Bank Type was updated. 2-84

Table 2-54 • ProASIC3 Output Drive for Advanced I/O Bank Type was updated. 2-84

The "x" was updated in the "User I/O Naming Convention" section. 2-48

The "VCC Core Supply Voltage" pin description was updated. 2-50

The "VMVx I/O Supply Voltage (quiet)" pin description was updated to include

information concerning leaving the pin unconnected.

2-50

The "VJTAG JTAG Supply Voltage" pin description was updated. 2-50

The "VPUMP Programming Supply Voltage" pin description was updated to

include information on what happens when the pin is tied to ground.

2-50

The "I/O User Input/Output" pin description was updated to include information

on what happens when the pin is unused.

2-50

The "JTAG Pins" section was updated to include information on what happens

when the pin is unused.

2-51

The "Programming" section was updated to include information concerning

serialization.

2-53

The "JTAG 1532" section was updated to include SAMPLE/PRELOAD

information.

2-54

"DC and Switching Characteristics" chapter was updated with new information. Starting

on page

3-1

Advanced v0.3 M7 device information is new. N/A

Table 2-4 • ProASIC3 Globals/Spines/Rows by Device was updated to include the

number or rows in each top or bottom spine.

2-16

EXTFB was removed from Figure 2-24 • ProASIC3E CCC Options. 2-24

The "PLL Macro" section was updated. EXTFB information was removed from

this section.

2-15

The CCC Output Peak-to-Peak Period Jitter FCCC_OUT was updated in Table 2-

11 • ProASIC3 CCC/PLL Specification

2-29

EXTFB was removed from Figure 2-27 • CCC/PLL Macro. 2-28

Table 2-13 • ProASIC3 I/O Features was updated. 2-30

The "Hot-Swap Support" section was updated. 2-33

The "Cold-Sparing Support" section was updated. 2-34

"Electrostatic Discharge (ESD) Protection" section was updated. 2-35

The LVPECL specification in Table 2-43 • I/O Hot-Swap and 5 V Input Tolerance

Capabilities in ProASIC3 Devices was updated.

2-64

In the Bank 1 area of Figure 2-72, VMV2 was changed to VMV1 and VCCIB2 was

changed to VCCIB1.

2-97

The VJTAG and I/O pin descriptions were updated in the "Pin Descriptions"

section.

2-50

The "JTAG Pins" section was updated. 2-51

Previous Version Changes in Current Version (v1.1) Page

ProASIC3 DC and Switching Characteristics

v1.1 2-105

Advanced v0.3

(continued)

"128-Bit AES Decryption" section was updated to include M7 device

information.

2-53

Table 3-6 was updated. 3-6

Table 3-7 was updated. 3-6

In Table 3-11, PAC4 was updated. 3-93-8

Table 3-20 was updated. 3-20

The note in Table 3-32 was updated. 3-27

All Timing Characteristics tables were updated from LVTTL to Register Delays 3-31 to

3-73

The Timing Characteristics for RAM4K9, RAM512X18, and FIFO were updated. 3-85 to

3-90

FTCKMAX was updated in Table 3-110. 3-97

Advanced v0.2 Figure 2-11 was updated. 2-9

The "Clock Resources (VersaNets)" section was updated. 2-9

The "VersaNet Global Networks and Spine Access" section was updated. 2-9

The "PLL Macro" section was updated. 2-15

Figure 2-27 was updated. 2-28

Figure 2-20 was updated. 2-19

Table 2-5 was updated. 2-25

Table 2-6 was updated. 2-25

The "FIFO Flag Usage Considerations" section was updated. 2-27

Table 2-13 was updated. 2-30

Figure 2-24 was updated. 2-31

The "Cold-Sparing Support" section is new. 2-34

Table 2-43 was updated. 2-64

Table 2-18 was updated. 2-45

Pin descriptions in the "JTAG Pins" section were updated. 2-51

The "User I/O Naming Convention" section was updated. 2-48

Table 3-7 was updated. 3-6

The "Methodology" section was updated. 3-10

Table 3-40 and Table 3-39 were updated. 3-33,

3-32

Previous Version Changes in Current Version (v1.1) Page

ProASIC3 DC and Switching Characteristics

2-106 v1.1

Actel Safety Critical, Life Support, and High-Reliability

Applications Policy

The Actel products described in this advanced status datasheet may not have completed Actel’s

qualification process. Actel may amend or enhance products during the product introduction and

qualification process, resulting in changes in device functionality or performance. It is the

responsibility of each customer to ensure the fitness of any Actel product (but especially a new

product) for a particular purpose, including appropriateness for safety-critical, life-support, and

other high-reliability applications. Consult Actel’s Terms and Conditions for specific liability

exclusions relating to life-support applications. A reliability report covering all of Actel’s products is

available on the Actel website at http://www.actel.com/documents/ORT_Report.pdf. Actel also

offers a variety of enhanced qualification and lot acceptance screening procedures. Contact your

local Actel sales office for additional reliability information.

v1.3 3-1

ProASIC3 Packaging

3 – Package Pin Assignments

68-Pin QFN

Note

For Package Manufacturing and Environmental information, visit the Resource Center at

http://www.actel.com/products/solutions/package/docs.aspx.

Notes:

1. This is the bottom view of the package.

2. The die attach paddle center of the package is tied to ground (GND).

Pin A1 Mark

Package Pin Assignments

3-2 v1.3

68-Pin QFN

Pin Number A3P015 Function

1 IO82RSB1

2 IO80RSB1

3 IO78RSB1

4 IO76RSB1

5 GEC0/IO73RSB1

6 GEA0/IO72RSB1

7 GEB0/IO71RSB1

9 GND

10 VCCIB1

11 IO68RSB1

12 IO67RSB1

13 IO66RSB1

14 IO65RSB1

15 IO64RSB1

16 IO63RSB1

17 IO62RSB1

18 IO60RSB1

19 IO58RSB1

20 IO56RSB1

21 IO54RSB1

22 IO52RSB1

23 IO51RSB1

24 VCC

25 GND

26 VCCIB1

27 IO50RSB1

28 IO48RSB1

29 IO46RSB1

30 IO44RSB1

31 IO42RSB1

32 TCK

33 TDI

34 TMS

35 VPUMP

36 TDO

37 TRST

38 VJTAG

39 IO40RSB0

40 IO37RSB0

41 GDB0/IO34RSB0

42 GDA0/IO33RSB0

43 GDC0/IO32RSB0

44 VCCIB0

45 GND

46 VCC

47 IO31RSB0

48 IO29RSB0

49 IO28RSB0

50 IO27RSB0

51 IO25RSB0

52 IO24RSB0

53 IO22RSB0

54 IO21RSB0

55 IO19RSB0

56 IO17RSB0

57 IO15RSB0

58 IO14RSB0

59 VCCIB0

60 GND

61 VCC

62 IO12RSB0

63 IO10RSB0

64 IO08RSB0

65 IO06RSB0

66 IO04RSB0

67 IO02RSB0

68 IO00RSB0

68-Pin QFN

Pin Number A3P015 Function

ProASIC3 Packaging

v1.3 3-3

132-Pin QFN

Note

For Package Manufacturing and Environmental information, visit the Resource Center at

http://www.actel.com/products/solutions/package/docs.aspx.

Notes:

1. This is the bottom view of the package.

2. The die attach paddle center of the package is tied to ground (GND).

A37

A12

A36

A25

A48

A24 A13

B34

B11

B44

B22 B12

C31

C10

B33

B23

C30

C21

C40

C20 C11

Optional

Corner Pad (4x)

Pin A1Mark

Package Pin Assignments

3-4 v1.3

132-Pin QFN

Pin Number A3P030 Function

A1 IO01RSB1

A2 IO81RSB1

A3 NC

A4 IO80RSB1

A5 GEC0/IO77RSB1

A6 NC

A7 GEB0/IO75RSB1

A8 IO73RSB1

A9 NC

A10 VCC

A11 IO71RSB1

A12 IO68RSB1

A13 IO63RSB1

A14 IO60RSB1

A15 NC

A16 IO59RSB1

A17 IO57RSB1

A18 VCC

A19 IO54RSB1

A20 IO52RSB1

A21 IO49RSB1

A22 IO48RSB1

A23 IO47RSB1

A24 TDI

A25 TRST

A26 IO44RSB0

A27 NC

A28 IO43RSB0

A29 IO42RSB0

A30 IO40RSB0

A31 IO39RSB0

A32 GDC0/IO36RSB0

A33 NC

A34 VCC

A35 IO34RSB0

A36 IO31RSB0

A37 IO26RSB0

A38 IO23RSB0

A39 NC

A40 IO22RSB0

A41 IO20RSB0

A42 IO18RSB0

A43 VCC

A44 IO15RSB0

A45 IO12RSB0

A46 IO10RSB0

A47 IO09RSB0

A48 IO06RSB0

B1 IO02RSB1

B2 IO82RSB1

B3 GND

B4 IO79RSB1

B5 NC

B6 GND

B7 IO74RSB1

B8 NC

B9 GND

B10 IO70RSB1

B11 IO67RSB1

B12 IO64RSB1

B13 IO61RSB1

B14 GND

B15 IO58RSB1

B16 IO56RSB1

B17 GND

B18 IO53RSB1

B19 IO50RSB1

B20 GND

B21 IO46RSB1

B22 TMS

B23 TDO

B24 IO45RSB0

132-Pin QFN

Pin Number A3P030 Function

B25 GND

B26 NC

B27 IO41RSB0

B28 GND

B29 GDA0/IO37RSB0

B30 NC

B31 GND

B32 IO33RSB0

B33 IO30RSB0

B34 IO27RSB0

B35 IO24RSB0

B36 GND

B37 IO21RSB0

B38 IO19RSB0

B39 GND

B40 IO16RSB0

B41 IO13RSB0

B42 GND

B43 IO08RSB0

B44 IO05RSB0

C1 IO03RSB1

C2 IO00RSB1

C3 NC

C4 IO78RSB1

C5 GEA0/IO76RSB1

C6 NC

C7 NC

C8 VCCIB1

C9 IO69RSB1

C10 IO66RSB1

C11 IO65RSB1

C12 IO62RSB1

C13 NC

C14 NC

C15 IO55RSB1

C16 VCCIB1

132-Pin QFN

Pin Number A3P030 Function

ProASIC3 Packaging

v1.3 3-5

C17 IO51RSB1

C18 NC

C19 TCK

C20 NC

C21 VPUMP

C22 VJTAG

C23 NC

C24 NC

C25 NC

C26 GDB0/IO38RSB0

C27 NC

C28 VCCIB0

C29 IO32RSB0

C30 IO29RSB0

C31 IO28RSB0

C32 IO25RSB0

C33 NC

C34 NC

C35 VCCIB0

C36 IO17RSB0

C37 IO14RSB0

C38 IO11RSB0

C39 IO07RSB0

C40 IO04RSB0

D1 GND

D2 GND

D3 GND

D4 GND

132-Pin QFN

Pin Number A3P030 Function

Package Pin Assignments

3-6 v1.3

132-Pin QFN

Pin Number A3P060 Function

A1 GAB2/IO00RSB1

A2 IO93RSB1

A3 VCCIB1

A4 GFC1/IO89RSB1

A5 GFB0/IO86RSB1

A6 VCCPLF

A7 GFA1/IO84RSB1

A8 GFC2/IO81RSB1

A9 IO78RSB1

A10 VCC

A11 GEB1/IO75RSB1

A12 GEA0/IO72RSB1

A13 GEC2/IO69RSB1

A14 IO65RSB1

A15 VCC

A16 IO64RSB1

A17 IO63RSB1

A18 IO62RSB1

A19 IO61RSB1

A20 IO58RSB1

A21 GDB2/IO55RSB1

A22 NC

A23 GDA2/IO54RSB1

A24 TDI

A25 TRST

A26 GDC1/IO48RSB0

A27 VCC

A28 IO47RSB0

A29 GCC2/IO46RSB0

A30 GCA2/IO44RSB0

A31 GCA0/IO43RSB0

A32 GCB1/IO40RSB0

A33 IO36RSB0

A34 VCC

A35 IO31RSB0

A36 GBA2/IO28RSB0

A37 GBB1/IO25RSB0

A38 GBC0/IO22RSB0

A39 VCCIB0

A40 IO21RSB0

A41 IO18RSB0

A42 IO15RSB0

A43 IO14RSB0

A44 IO11RSB0

A45 GAB1/IO08RSB0

A46 NC

A47 GAB0/IO07RSB0

A48 IO04RSB0

B1 IO01RSB1

B2 GAC2/IO94RSB1

B3 GND

B4 GFC0/IO88RSB1

B5 VCOMPLF

B6 GND

B7 GFB2/IO82RSB1

B8 IO79RSB1

B9 GND

B10 GEB0/IO74RSB1

B11 VMV1

B12 GEB2/IO70RSB1

B13 IO67RSB1

B14 GND

B15 NC

B16 NC

B17 GND

B18 IO59RSB1

B19 GDC2/IO56RSB1

B20 GND

B21 GNDQ

B22 TMS

B23 TDO

B24 GDC0/IO49RSB0

132-Pin QFN

Pin Number A3P060 Function

B25 GND

B26 NC

B27 GCB2/IO45RSB0

B28 GND

B29 GCB0/IO41RSB0

B30 GCC1/IO38RSB0

B31 GND

B32 GBB2/IO30RSB0

B33 VMV0

B34 GBA0/IO26RSB0

B35 GBC1/IO23RSB0

B36 GND

B37 IO20RSB0

B38 IO17RSB0

B39 GND

B40 IO12RSB0

B41 GAC0/IO09RSB0

B42 GND

B43 GAA1/IO06RSB0

B44 GNDQ

C1 GAA2/IO02RSB1

C2 IO95RSB1

C3 VCC

C4 GFB1/IO87RSB1

C5 GFA0/IO85RSB1

C6 GFA2/IO83RSB1

C7 IO80RSB1

C8 VCCIB1

C9 GEA1/IO73RSB1

C10 GNDQ

C11 GEA2/IO71RSB1

C12 IO68RSB1

C13 VCCIB1

C14 NC

C15 NC

C16 IO60RSB1

132-Pin QFN

Pin Number A3P060 Function

ProASIC3 Packaging

v1.3 3-7

C17 IO57RSB1

C18 NC

C19 TCK

C20 VMV1

C21 VPUMP

C22 VJTAG

C23 VCCIB0

C24 NC

C25 NC

C26 GCA1/IO42RSB0

C27 GCC0/IO39RSB0

C28 VCCIB0

C29 IO29RSB0

C30 GNDQ

C31 GBA1/IO27RSB0

C32 GBB0/IO24RSB0

C33 VCC

C34 IO19RSB0

C35 IO16RSB0

C36 IO13RSB0

C37 GAC1/IO10RSB0

C38 NC

C39 GAA0/IO05RSB0

C40 VMV0

D1 GND

D2 GND

D3 GND

D4 GND

132-Pin QFN

Pin Number A3P060 Function

Package Pin Assignments

3-8 v1.3

132-Pin QFN

Pin Number A3P125 Function

A1 GAB2/IO69RSB1

A2 IO130RSB1

A3 VCCIB1

A4 GFC1/IO126RSB1

A5 GFB0/IO123RSB1

A6 VCCPLF

A7 GFA1/IO121RSB1

A8 GFC2/IO118RSB1

A9 IO115RSB1

A10 VCC

A11 GEB1/IO110RSB1

A12 GEA0/IO107RSB1

A13 GEC2/IO104RSB1

A14 IO100RSB1

A15 VCC

A16 IO99RSB1

A17 IO96RSB1

A18 IO94RSB1

A19 IO91RSB1

A20 IO85RSB1

A21 IO79RSB1

A22 VCC

A23 GDB2/IO71RSB1

A24 TDI

A25 TRST

A26 GDC1/IO61RSB0

A27 VCC

A28 IO60RSB0

A29 GCC2/IO59RSB0

A30 GCA2/IO57RSB0

A31 GCA0/IO56RSB0

A32 GCB1/IO53RSB0

A33 IO49RSB0

A34 VCC

A35 IO44RSB0

A36 GBA2/IO41RSB0

A37 GBB1/IO38RSB0

A38 GBC0/IO35RSB0

A39 VCCIB0

A40 IO28RSB0

A41 IO22RSB0

A42 IO18RSB0

A43 IO14RSB0

A44 IO11RSB0

A45 IO07RSB0

A46 VCC

A47 GAC1/IO05RSB0

A48 GAB0/IO02RSB0

B1 IO68RSB1

B2 GAC2/IO131RSB1

B3 GND

B4 GFC0/IO125RSB1

B5 VCOMPLF

B6 GND

B7 GFB2/IO119RSB1

B8 IO116RSB1

B9 GND

B10 GEB0/IO109RSB1

B11 VMV1

B12 GEB2/IO105RSB1

B13 IO101RSB1

B14 GND

B15 IO98RSB1

B16 IO95RSB1

B17 GND

B18 IO87RSB1

B19 IO81RSB1

B20 GND

B21 GNDQ

B22 TMS

B23 TDO

B24 GDC0/IO62RSB0

132-Pin QFN

Pin Number A3P125 Function

B25 GND

B26 NC

B27 GCB2/IO58RSB0

B28 GND

B29 GCB0/IO54RSB0

B30 GCC1/IO51RSB0

B31 GND

B32 GBB2/IO43RSB0

B33 VMV0

B34 GBA0/IO39RSB0

B35 GBC1/IO36RSB0

B36 GND

B37 IO26RSB0

B38 IO21RSB0

B39 GND

B40 IO13RSB0

B41 IO08RSB0

B42 GND

B43 GAC0/IO04RSB0

B44 GNDQ

C1 GAA2/IO67RSB1

C2 IO132RSB1

C3 VCC

C4 GFB1/IO124RSB1

C5 GFA0/IO122RSB1

C6 GFA2/IO120RSB1

C7 IO117RSB1

C8 VCCIB1

C9 GEA1/IO108RSB1

C10 GNDQ

C11 GEA2/IO106RSB1

C12 IO103RSB1

C13 VCCIB1

C14 IO97RSB1

C15 IO93RSB1

C16 IO89RSB1

132-Pin QFN

Pin Number A3P125 Function

ProASIC3 Packaging

v1.3 3-9

C17 IO83RSB1

C18 VCCIB1

C19 TCK

C20 VMV1

C21 VPUMP

C22 VJTAG

C23 VCCIB0

C24 NC

C25 NC

C26 GCA1/IO55RSB0

C27 GCC0/IO52RSB0

C28 VCCIB0

C29 IO42RSB0

C30 GNDQ

C31 GBA1/IO40RSB0

C32 GBB0/IO37RSB0

C33 VCC

C34 IO24RSB0

C35 IO19RSB0

C36 IO16RSB0

C37 IO10RSB0

C38 VCCIB0

C39 GAB1/IO03RSB0

C40 VMV0

D1 GND

D2 GND

D3 GND

D4 GND

132-Pin QFN

Pin Number A3P125 Function

Package Pin Assignments

3-10 v1.3

132-Pin QFN

Pin Number A3P250 Function

A1 GAB2/IO117UPB3

A2 IO117VPB3

A3 VCCIB3

A4 GFC1/IO110PDB3

A5 GFB0/IO109NPB3

A6 VCCPLF

A7 GFA1/IO108PPB3

A8 GFC2/IO105PPB3

A9 IO103NDB3

A10 VCC

A11 GEA1/IO98PPB3

A12 GEA0/IO98NPB3

A13 GEC2/IO95RSB2

A14 IO91RSB2

A15 VCC

A16 IO90RSB2

A17 IO87RSB2

A18 IO85RSB2

A19 IO82RSB2

A20 IO76RSB2

A21 IO70RSB2

A22 VCC

A23 GDB2/IO62RSB2

A24 TDI

A25 TRST

A26 GDC1/IO58UDB1

A27 VCC

A28 IO54NDB1

A29 IO52NDB1

A30 GCA2/IO51PPB1

A31 GCA0/IO50NPB1

A32 GCB1/IO49PDB1

A33 IO47NSB1

A34 VCC

A35 IO41NPB1

A36 GBA2/IO41PPB1

A37 GBB1/IO38RSB0

A38 GBC0/IO35RSB0

A39 VCCIB0

A40 IO28RSB0

A41 IO22RSB0

A42 IO18RSB0

A43 IO14RSB0

A44 IO11RSB0

A45 IO07RSB0

A46 VCC

A47 GAC1/IO05RSB0

A48 GAB0/IO02RSB0

B1 IO118VDB3

B2 GAC2/IO116UDB3

B3 GND

B4 GFC0/IO110NDB3

B5 VCOMPLF

B6 GND

B7 GFB2/IO106PSB3

B8 IO103PDB3

B9 GND

B10 GEB0/IO99NDB3

B11 VMV3

B12 GEB2/IO96RSB2

B13 IO92RSB2

B14 GND

B15 IO89RSB2

B16 IO86RSB2

B17 GND

B18 IO78RSB2

B19 IO72RSB2

B20 GND

B21 GNDQ

B22 TMS

B23 TDO

B24 GDC0/IO58VDB1

132-Pin QFN

Pin Number A3P250 Function

B25 GND

B26 IO54PDB1

B27 GCB2/IO52PDB1

B28 GND

B29 GCB0/IO49NDB1

B30 GCC1/IO48PDB1

B31 GND

B32 GBB2/IO42PDB1

B33 VMV1

B34 GBA0/IO39RSB0

B35 GBC1/IO36RSB0

B36 GND

B37 IO26RSB0

B38 IO21RSB0

B39 GND

B40 IO13RSB0

B41 IO08RSB0

B42 GND

B43 GAC0/IO04RSB0

B44 GNDQ

C1 GAA2/IO118UDB3

C2 IO116VDB3

C3 VCC

C4 GFB1/IO109PPB3

C5 GFA0/IO108NPB3

C6 GFA2/IO107PSB3

C7 IO105NPB3

C8 VCCIB3

C9 GEB1/IO99PDB3

C10 GNDQ

C11 GEA2/IO97RSB2

C12 IO94RSB2

C13 VCCIB2

C14 IO88RSB2

C15 IO84RSB2

C16 IO80RSB2

132-Pin QFN

Pin Number A3P250 Function

ProASIC3 Packaging

v1.3 3-11

C17 IO74RSB2

C18 VCCIB2

C19 TCK

C20 VMV2

C21 VPUMP

C22 VJTAG

C23 VCCIB1

C24 IO53NSB1

C25 IO51NPB1

C26 GCA1/IO50PPB1

C27 GCC0/IO48NDB1

C28 VCCIB1

C29 IO42NDB1

C30 GNDQ

C31 GBA1/IO40RSB0

C32 GBB0/IO37RSB0

C33 VCC

C34 IO24RSB0

C35 IO19RSB0

C36 IO16RSB0

C37 IO10RSB0

C38 VCCIB0

C39 GAB1/IO03RSB0

C40 VMV0

D1 GND

D2 GND

D3 GND

D4 GND

132-Pin QFN

Pin Number A3P250 Function

Package Pin Assignments

3-12 v1.3

100-Pin VQFP

Note

For Package Manufacturing and Environmental information, visit the Resource Center at

http://www.actel.com/products/solutions/package/docs.aspx.

Note: This is the top view of the package.

100-Pin

VQFP

100

ProASIC3 Packaging

v1.3 3-13

100-Pin VQFP

Pin Number A3P030 Function

1GND

2 IO82RSB1

3 IO81RSB1

4 IO80RSB1

5 IO79RSB1

6 IO78RSB1

7 IO77RSB1

8 IO76RSB1

9GND

10 IO75RSB1

11 IO74RSB1

12 GEC0/IO73RSB1

13 GEA0/IO72RSB1

14 GEB0/IO71RSB1

15 IO70RSB1

16 IO69RSB1

17 VCC

18 VCCIB1

19 IO68RSB1

20 IO67RSB1

21 IO66RSB1

22 IO65RSB1

23 IO64RSB1

24 IO63RSB1

25 IO62RSB1

26 IO61RSB1

27 IO60RSB1

28 IO59RSB1

29 IO58RSB1

30 IO57RSB1

31 IO56RSB1

32 IO55RSB1

33 IO54RSB1

34 IO53RSB1

35 IO52RSB1

36 IO51RSB1

37 VCC

38 GND

39 VCCIB1

40 IO49RSB1

41 IO47RSB1

42 IO46RSB1

43 IO45RSB1

44 IO44RSB1

45 IO43RSB1

46 IO42RSB1

47 TCK

48 TDI

49 TMS

50 NC

51 GND

52 VPUMP

53 NC

54 TDO

55 TRST

56 VJTAG

57 IO41RSB0

58 IO40RSB0

59 IO39RSB0

60 IO38RSB0

61 IO37RSB0

62 IO36RSB0

63 GDB0/IO34RSB0

64 GDA0/IO33RSB0

65 GDC0/IO32RSB0

66 VCCIB0

67 GND

68 VCC

69 IO31RSB0

70 IO30RSB0

71 IO29RSB0

72 IO28RSB0

100-Pin VQFP

Pin Number A3P030 Function

73 IO27RSB0

74 IO26RSB0

75 IO25RSB0

76 IO24RSB0

77 IO23RSB0

78 IO22RSB0

79 IO21RSB0

80 IO20RSB0

81 IO19RSB0

82 IO18RSB0

83 IO17RSB0

84 IO16RSB0

85 IO15RSB0

86 IO14RSB0

87 VCCIB0

88 GND

89 VCC

90 IO12RSB0

91 IO10RSB0

92 IO08RSB0

93 IO07RSB0

94 IO06RSB0

95 IO05RSB0

96 IO04RSB0

97 IO03RSB0

98 IO02RSB0

99 IO01RSB0

100 IO00RSB0

100-Pin VQFP

Pin Number A3P030 Function

Package Pin Assignments

3-14 v1.3

100-Pin VQFP

Pin Number A3P060 Function

1GND

2 GAA2/IO51RSB1

3 IO52RSB1

4 GAB2/IO53RSB1

5 IO95RSB1

6 GAC2/IO94RSB1

7 IO93RSB1

8 IO92RSB1

9GND

10 GFB1/IO87RSB1

11 GFB0/IO86RSB1

12 VCOMPLF

13 GFA0/IO85RSB1

14 VCCPLF

15 GFA1/IO84RSB1

16 GFA2/IO83RSB1

17 VCC

18 VCCIB1

19 GEC1/IO77RSB1

20 GEB1/IO75RSB1

21 GEB0/IO74RSB1

22 GEA1/IO73RSB1

23 GEA0/IO72RSB1

24 VMV1

25 GNDQ

26 GEA2/IO71RSB1

27 GEB2/IO70RSB1

28 GEC2/IO69RSB1

29 IO68RSB1

30 IO67RSB1

31 IO66RSB1

32 IO65RSB1

33 IO64RSB1

34 IO63RSB1

35 IO62RSB1

36 IO61RSB1

37 VCC

38 GND

39 VCCIB1

40 IO60RSB1

41 IO59RSB1

42 IO58RSB1

43 IO57RSB1

44 GDC2/IO56RSB1

45 GDB2/IO55RSB1

46 GDA2/IO54RSB1

47 TCK

48 TDI

49 TMS

50 VMV1

51 GND

52 VPUMP

53 NC

54 TDO

55 TRST

56 VJTAG

57 GDA1/IO49RSB0

58 GDC0/IO46RSB0

59 GDC1/IO45RSB0

60 GCC2/IO43RSB0

61 GCB2/IO42RSB0

62 GCA0/IO40RSB0

63 GCA1/IO39RSB0

64 GCC0/IO36RSB0

65 GCC1/IO35RSB0

66 VCCIB0

67 GND

68 VCC

69 IO31RSB0

70 GBC2/IO29RSB0

71 GBB2/IO27RSB0

72 IO26RSB0

100-Pin VQFP

Pin Number A3P060 Function

73 GBA2/IO25RSB0

74 VMV0

75 GNDQ

76 GBA1/IO24RSB0

77 GBA0/IO23RSB0

78 GBB1/IO22RSB0

79 GBB0/IO21RSB0

80 GBC1/IO20RSB0

81 GBC0/IO19RSB0

82 IO18RSB0

83 IO17RSB0

84 IO15RSB0

85 IO13RSB0

86 IO11RSB0

87 VCCIB0

88 GND

89 VCC

90 IO10RSB0

91 IO09RSB0

92 IO08RSB0

93 GAC1/IO07RSB0

94 GAC0/IO06RSB0

95 GAB1/IO05RSB0

96 GAB0/IO04RSB0

97 GAA1/IO03RSB0

98 GAA0/IO02RSB0

99 IO01RSB0

100 IO00RSB0

100-Pin VQFP

Pin Number A3P060 Function

ProASIC3 Packaging

v1.3 3-15

100-Pin VQFP

Pin Number A3P125 Function

1GND

2 GAA2/IO67RSB1

3 IO68RSB1

4 GAB2/IO69RSB1

5IO132RSB1

6 GAC2/IO131RSB1

7IO130RSB1

8IO129RSB1

9GND

10 GFB1/IO124RSB1

11 GFB0/IO123RSB1

12 VCOMPLF

13 GFA0/IO122RSB1

14 VCCPLF

15 GFA1/IO121RSB1

16 GFA2/IO120RSB1

17 VCC

18 VCCIB1

19 GEC0/IO111RSB1

20 GEB1/IO110RSB1

21 GEB0/IO109RSB1

22 GEA1/IO108RSB1

23 GEA0/IO107RSB1

24 VMV1

25 GNDQ

26 GEA2/IO106RSB1

27 GEB2/IO105RSB1

28 GEC2/IO104RSB1

29 IO102RSB1

30 IO100RSB1

31 IO99RSB1

32 IO97RSB1

33 IO96RSB1

34 IO95RSB1

35 IO94RSB1

36 IO93RSB1

37 VCC

38 GND

39 VCCIB1

40 IO87RSB1

41 IO84RSB1

42 IO81RSB1

43 IO75RSB1

44 GDC2/IO72RSB1

45 GDB2/IO71RSB1

46 GDA2/IO70RSB1

47 TCK

48 TDI

49 TMS

50 VMV1

51 GND

52 VPUMP

53 NC

54 TDO

55 TRST

56 VJTAG

57 GDA1/IO65RSB0

58 GDC0/IO62RSB0

59 GDC1/IO61RSB0

60 GCC2/IO59RSB0

61 GCB2/IO58RSB0

62 GCA0/IO56RSB0

63 GCA1/IO55RSB0

64 GCC0/IO52RSB0

65 GCC1/IO51RSB0

66 VCCIB0

67 GND

68 VCC

69 IO47RSB0

70 GBC2/IO45RSB0

71 GBB2/IO43RSB0

72 IO42RSB0

100-Pin VQFP

Pin Number A3P125 Function

73 GBA2/IO41RSB0

74 VMV0

75 GNDQ

76 GBA1/IO40RSB0

77 GBA0/IO39RSB0

78 GBB1/IO38RSB0

79 GBB0/IO37RSB0

80 GBC1/IO36RSB0

81 GBC0/IO35RSB0

82 IO32RSB0

83 IO28RSB0

84 IO25RSB0

85 IO22RSB0

86 IO19RSB0

87 VCCIB0

88 GND

89 VCC

90 IO15RSB0

91 IO13RSB0

92 IO11RSB0

93 IO09RSB0

94 IO07RSB0

95 GAC1/IO05RSB0

96 GAC0/IO04RSB0

97 GAB1/IO03RSB0

98 GAB0/IO02RSB0

99 GAA1/IO01RSB0

100 GAA0/IO00RSB0

100-Pin VQFP

Pin Number A3P125 Function

Package Pin Assignments

3-16 v1.3

100-Pin VQFP

Pin Number A3P250 Function

1 GND

2 GAA2/IO118UDB3

3IO118VDB3

4 GAB2/IO117UDB3

5IO117VDB3

6 GAC2/IO116UDB3

7IO116VDB3

8 IO112PSB3

9 GND

10 GFB1/IO109PDB3

11 GFB0/IO109NDB3

12 VCOMPLF

13 GFA0/IO108NPB3

14 VCCPLF

15 GFA1/IO108PPB3

16 GFA2/IO107PSB3

17 VCC

18 VCCIB3

19 GFC2/IO105PSB3

20 GEC1/IO100PDB3

21 GEC0/IO100NDB3

22 GEA1/IO98PDB3

23 GEA0/IO98NDB3

24 VMV3

25 GNDQ

26 GEA2/IO97RSB2

27 GEB2/IO96RSB2

28 GEC2/IO95RSB2

29 IO93RSB2

30 IO92RSB2

31 IO91RSB2

32 IO90RSB2

33 IO88RSB2

34 IO86RSB2

35 IO85RSB2

36 IO84RSB2

37 VCC

38 GND

39 VCCIB2

40 IO77RSB2

41 IO74RSB2

42 IO71RSB2

43 GDC2/IO63RSB2

44 GDB2/IO62RSB2

45 GDA2/IO61RSB2

46 GNDQ

47 TCK

48 TDI

49 TMS

50 VMV2

51 GND

52 VPUMP

53 NC

54 TDO

55 TRST

56 VJTAG

57 GDA1/IO60USB1

58 GDC0/IO58VDB1

59 GDC1/IO58UDB1

60 IO52NDB1

61 GCB2/IO52PDB1

62 GCA1/IO50PDB1

63 GCA0/IO50NDB1

64 GCC0/IO48NDB1

65 GCC1/IO48PDB1

66 VCCIB1

67 GND

68 VCC

69 IO43NDB1

70 GBC2/IO43PDB1

71 GBB2/IO42PSB1

72 IO41NDB1

100-Pin VQFP

Pin Number A3P250 Function

73 GBA2/IO41PDB1

74 VMV1

75 GNDQ

76 GBA1/IO40RSB0

77 GBA0/IO39RSB0

78 GBB1/IO38RSB0

79 GBB0/IO37RSB0

80 GBC1/IO36RSB0

81 GBC0/IO35RSB0

82 IO29RSB0

83 IO27RSB0

84 IO25RSB0

85 IO23RSB0

86 IO21RSB0

87 VCCIB0

88 GND

89 VCC

90 IO15RSB0

91 IO13RSB0

92 IO11RSB0

93 GAC1/IO05RSB0

94 GAC0/IO04RSB0

95 GAB1/IO03RSB0

96 GAB0/IO02RSB0

97 GAA1/IO01RSB0

98 GAA0/IO00RSB0

99 GNDQ

100 VMV0

100-Pin VQFP

Pin Number A3P250 Function

ProASIC3 Packaging

v1.3 3-17

144-Pin TQFP

Note

For Package Manufacturing and Environmental information, visit the Resource Center at

http://www.actel.com/products/solutions/package/docs.aspx.

Note: This is the top view of the package.

144

144-Pin

TQFP

Package Pin Assignments

3-18 v1.3

144-Pin TQFP

Pin Number A3P060 Function

1 GAA2/IO51RSB1

2 IO52RSB1

3 GAB2/IO53RSB1

4 IO95RSB1

5 GAC2/IO94RSB1

6 IO93RSB1

7 IO92RSB1

8 IO91RSB1

10 GND

11 VCCIB1

12 IO90RSB1

13 GFC1/IO89RSB1

14 GFC0/IO88RSB1

15 GFB1/IO87RSB1

16 GFB0/IO86RSB1

17 VCOMPLF

18 GFA0/IO85RSB1

19 VCCPLF

20 GFA1/IO84RSB1

21 GFA2/IO83RSB1

22 GFB2/IO82RSB1

23 GFC2/IO81RSB1

24 IO80RSB1

25 IO79RSB1

26 IO78RSB1

27 GND

28 VCCIB1

29 GEC1/IO77RSB1

30 GEC0/IO76RSB1

31 GEB1/IO75RSB1

32 GEB0/IO74RSB1

33 GEA1/IO73RSB1

34 GEA0/IO72RSB1

35 VMV1

36 GNDQ

37 NC

38 GEA2/IO71RSB1

39 GEB2/IO70RSB1

40 GEC2/IO69RSB1

41 IO68RSB1

42 IO67RSB1

43 IO66RSB1

44 IO65RSB1

45 VCC

46 GND

47 VCCIB1

48 NC

49 IO64RSB1

50 NC

51 IO63RSB1

52 NC

53 IO62RSB1

54 NC

55 IO61RSB1

56 NC

57 NC

58 IO60RSB1

59 IO59RSB1

60 IO58RSB1

61 IO57RSB1

62 NC

63 GND

64 NC

65 GDC2/IO56RSB1

66 GDB2/IO55RSB1

67 GDA2/IO54RSB1

68 GNDQ

69 TCK

70 TDI

71 TMS

72 VMV1

144-Pin TQFP

Pin Number A3P060 Function

73 VPUMP

74 NC

75 TDO

76 TRST

77 VJTAG

78 GDA0/IO50RSB0

79 GDB0/IO48RSB0

80 GDB1/IO47RSB0

81 VCCIB0

82 GND

83 IO44RSB0

84 GCC2/IO43RSB0

85 GCB2/IO42RSB0

86 GCA2/IO41RSB0

87 GCA0/IO40RSB0

88 GCA1/IO39RSB0

89 GCB0/IO38RSB0

90 GCB1/IO37RSB0

91 GCC0/IO36RSB0

92 GCC1/IO35RSB0

93 IO34RSB0

94 IO33RSB0

95 NC

96 NC

97 NC

98 VCCIB0

99 GND

100 VCC

101 IO30RSB0

102 GBC2/IO29RSB0

103 IO28RSB0

104 GBB2/IO27RSB0

105 IO26RSB0

106 GBA2/IO25RSB0

107 VMV0

108 GNDQ

144-Pin TQFP

Pin Number A3P060 Function

ProASIC3 Packaging

v1.3 3-19

109 NC

110 NC

111 GBA1/IO24RSB0

112 GBA0/IO23RSB0

113 GBB1/IO22RSB0

114 GBB0/IO21RSB0

115 GBC1/IO20RSB0

116 GBC0/IO19RSB0

117 VCCIB0

118 GND

119 VCC

120 IO18RSB0

121 IO17RSB0

122 IO16RSB0

123 IO15RSB0

124 IO14RSB0

125 IO13RSB0

126 IO12RSB0

127 IO11RSB0

128 NC

129 IO10RSB0

130 IO09RSB0

131 IO08RSB0

132 GAC1/IO07RSB0

133 GAC0/IO06RSB0

134 NC

135 GND

136 NC

137 GAB1/IO05RSB0

138 GAB0/IO04RSB0

139 GAA1/IO03RSB0

140 GAA0/IO02RSB0

141 IO01RSB0

142 IO00RSB0

143 GNDQ

144 VMV0

144-Pin TQFP

Pin Number A3P060 Function

Package Pin Assignments

3-20 v1.3

144-Pin TQFP

Pin Number A3P125 Function

1 GAA2/IO67RSB1

2 IO68RSB1

3 GAB2/IO69RSB1

4IO132RSB1

5 GAC2/IO131RSB1

6IO130RSB1

7IO129RSB1

8IO128RSB1

10 GND

11 VCCIB1

12 IO127RSB1

13 GFC1/IO126RSB1

14 GFC0/IO125RSB1

15 GFB1/IO124RSB1

16 GFB0/IO123RSB1

17 VCOMPLF

18 GFA0/IO122RSB1

19 VCCPLF

20 GFA1/IO121RSB1

21 GFA2/IO120RSB1

22 GFB2/IO119RSB1

23 GFC2/IO118RSB1

24 IO117RSB1

25 IO116RSB1

26 IO115RSB1

27 GND

28 VCCIB1

29 GEC1/IO112RSB1

30 GEC0/IO111RSB1

31 GEB1/IO110RSB1

32 GEB0/IO109RSB1

33 GEA1/IO108RSB1

34 GEA0/IO107RSB1

35 VMV1

36 GNDQ

37 NC

38 GEA2/IO106RSB1

39 GEB2/IO105RSB1

40 GEC2/IO104RSB1

41 IO103RSB1

42 IO102RSB1

43 IO101RSB1

44 IO100RSB1

45 VCC

46 GND

47 VCCIB1

48 IO99RSB1

49 IO97RSB1

50 IO95RSB1

51 IO93RSB1

52 IO92RSB1

53 IO90RSB1

54 IO88RSB1

55 IO86RSB1

56 IO84RSB1

57 IO83RSB1

58 IO82RSB1

59 IO81RSB1

60 IO80RSB1

61 IO79RSB1

62 VCC

63 GND

64 VCCIB1

65 GDC2/IO72RSB1

66 GDB2/IO71RSB1

67 GDA2/IO70RSB1

68 GNDQ

69 TCK

70 TDI

71 TMS

72 VMV1

144-Pin TQFP

Pin Number A3P125 Function

73 VPUMP

74 NC

75 TDO

76 TRST

77 VJTAG

78 GDA0/IO66RSB0

79 GDB0/IO64RSB0

80 GDB1/IO63RSB0

81 VCCIB0

82 GND

83 IO60RSB0

84 GCC2/IO59RSB0

85 GCB2/IO58RSB0

86 GCA2/IO57RSB0

87 GCA0/IO56RSB0

88 GCA1/IO55RSB0

89 GCB0/IO54RSB0

90 GCB1/IO53RSB0

91 GCC0/IO52RSB0

92 GCC1/IO51RSB0

93 IO50RSB0

94 IO49RSB0

95 NC

96 NC

97 NC

98 VCCIB0

99 GND

100 VCC

101 IO47RSB0

102 GBC2/IO45RSB0

103 IO44RSB0

104 GBB2/IO43RSB0

105 IO42RSB0

106 GBA2/IO41RSB0

107 VMV0

108 GNDQ

144-Pin TQFP

Pin Number A3P125 Function

ProASIC3 Packaging

v1.3 3-21

109 GBA1/IO40RSB0

110 GBA0/IO39RSB0

111 GBB1/IO38RSB0

112 GBB0/IO37RSB0

113 GBC1/IO36RSB0

114 GBC0/IO35RSB0

115 IO34RSB0

116 IO33RSB0

117 VCCIB0

118 GND

119 VCC

120 IO29RSB0

121 IO28RSB0

122 IO27RSB0

123 IO25RSB0

124 IO23RSB0

125 IO21RSB0

126 IO19RSB0

127 IO17RSB0

128 IO16RSB0

129 IO14RSB0

130 IO12RSB0

131 IO10RSB0

132 IO08RSB0

133 IO06RSB0

134 VCCIB0

135 GND

136 VCC

137 GAC1/IO05RSB0

138 GAC0/IO04RSB0

139 GAB1/IO03RSB0

140 GAB0/IO02RSB0

141 GAA1/IO01RSB0

142 GAA0/IO00RSB0

143 GNDQ

144 VMV0

144-Pin TQFP

Pin Number A3P125 Function

Package Pin Assignments

3-22 v1.3

208-Pin PQFP

Note

For Package Manufacturing and Environmental information, visit the Resource Center at

http://www.actel.com/products/solutions/package/docs.aspx.

Note: This is the top view of the package.

208-Pin PQFP

1208

ProASIC3 Packaging

v1.3 3-23

208-Pin PQFP

Pin Number A3P125 Function

1GND

2 GAA2/IO67RSB1

3 IO68RSB1

4 GAB2/IO69RSB1

5IO132RSB1

6 GAC2/IO131RSB1

7NC

8NC

9IO130RSB1

10 IO129RSB1

11 NC

12 IO128RSB1

13 NC

14 NC

15 NC

16 VCC

17 GND

18 VCCIB1

19 IO127RSB1

20 NC

21 GFC1/IO126RSB1

22 GFC0/IO125RSB1

23 GFB1/IO124RSB1

24 GFB0/IO123RSB1

25 VCOMPLF

26 GFA0/IO122RSB1

27 VCCPLF

28 GFA1/IO121RSB1

29 GND

30 GFA2/IO120RSB1

31 NC

32 GFB2/IO119RSB1

33 NC

34 GFC2/IO118RSB1

35 IO117RSB1

36 NC

37 IO116RSB1

38 IO115RSB1

39 NC

40 VCCIB1

41 GND

42 IO114RSB1

43 IO113RSB1

44 GEC1/IO112RSB1

45 GEC0/IO111RSB1

46 GEB1/IO110RSB1

47 GEB0/IO109RSB1

48 GEA1/IO108RSB1

49 GEA0/IO107RSB1

50 VMV1

51 GNDQ

52 GND

53 NC

54 NC

55 GEA2/IO106RSB1

56 GEB2/IO105RSB1

57 GEC2/IO104RSB1

58 IO103RSB1

59 IO102RSB1

60 IO101RSB1

61 IO100RSB1

62 VCCIB1

63 IO99RSB1

64 IO98RSB1

65 GND

66 IO97RSB1

67 IO96RSB1

68 IO95RSB1

69 IO94RSB1

70 IO93RSB1

71 VCC

72 VCCIB1

208-Pin PQFP

Pin Number A3P125 Function

73 IO92RSB1

74 IO91RSB1

75 IO90RSB1

76 IO89RSB1

77 IO88RSB1

78 IO87RSB1

79 IO86RSB1

80 IO85RSB1

81 GND

82 IO84RSB1

83 IO83RSB1

84 IO82RSB1

85 IO81RSB1

86 IO80RSB1

87 IO79RSB1

88 VCC

89 VCCIB1

90 IO78RSB1

91 IO77RSB1

92 IO76RSB1

93 IO75RSB1

94 IO74RSB1

95 IO73RSB1

96 GDC2/IO72RSB1

97 GND

98 GDB2/IO71RSB1

99 GDA2/IO70RSB1

100 GNDQ

101 TCK

102 TDI

103 TMS

104 VMV1

105 GND

106 VPUMP

107 NC

108 TDO

208-Pin PQFP

Pin Number A3P125 Function

Package Pin Assignments

3-24 v1.3

109 TRST

110 VJTAG

111 GDA0/IO66RSB0

112 GDA1/IO65RSB0

113 GDB0/IO64RSB0

114 GDB1/IO63RSB0

115 GDC0/IO62RSB0

116 GDC1/IO61RSB0

117 NC

118 NC

119 NC

120 NC

121 NC

122 GND

123 VCCIB0

124 NC

125 NC

126 VCC

127 IO60RSB0

128 GCC2/IO59RSB0

129 GCB2/IO58RSB0

130 GND

131 GCA2/IO57RSB0

132 GCA0/IO56RSB0

133 GCA1/IO55RSB0

134 GCB0/IO54RSB0

135 GCB1/IO53RSB0

136 GCC0/IO52RSB0

137 GCC1/IO51RSB0

138 IO50RSB0

139 IO49RSB0

140 VCCIB0

141 GND

142 VCC

143 IO48RSB0

144 IO47RSB0

208-Pin PQFP

Pin Number A3P125 Function

145 IO46RSB0

146 NC

147 NC

148 NC

149 GBC2/IO45RSB0

150 IO44RSB0

151 GBB2/IO43RSB0

152 IO42RSB0

153 GBA2/IO41RSB0

154 VMV0

155 GNDQ

156 GND

157 NC

158 GBA1/IO40RSB0

159 GBA0/IO39RSB0

160 GBB1/IO38RSB0

161 GBB0/IO37RSB0

162 GND

163 GBC1/IO36RSB0

164 GBC0/IO35RSB0

165 IO34RSB0

166 IO33RSB0

167 IO32RSB0

168 IO31RSB0

169 IO30RSB0

170 VCCIB0

171 VCC

172 IO29RSB0

173 IO28RSB0

174 IO27RSB0

175 IO26RSB0

176 IO25RSB0

177 IO24RSB0

178 GND

179 IO23RSB0

180 IO22RSB0

208-Pin PQFP

Pin Number A3P125 Function

181 IO21RSB0

182 IO20RSB0

183 IO19RSB0

184 IO18RSB0

185 IO17RSB0

186 VCCIB0

187 VCC

188 IO16RSB0

189 IO15RSB0

190 IO14RSB0

191 IO13RSB0

192 IO12RSB0

193 IO11RSB0

194 IO10RSB0

195 GND

196 IO09RSB0

197 IO08RSB0

198 IO07RSB0

199 IO06RSB0

200 VCCIB0

201 GAC1/IO05RSB0

202 GAC0/IO04RSB0

203 GAB1/IO03RSB0

204 GAB0/IO02RSB0

205 GAA1/IO01RSB0

206 GAA0/IO00RSB0

207 GNDQ

208 VMV0

208-Pin PQFP

Pin Number A3P125 Function

ProASIC3 Packaging

v1.3 3-25

208-Pin PQFP

Pin Number A3P250 Function

1GND

2 GAA2/IO118UDB3

3 IO118VDB3

4 GAB2/IO117UDB3

5 IO117VDB3

6 GAC2/IO116UDB3

7 IO116VDB3

8 IO115UDB3

9 IO115VDB3

10 IO114UDB3

11 IO114VDB3

12 IO113PDB3

13 IO113NDB3

14 IO112PDB3

15 IO112NDB3

16 VCC

17 GND

18 VCCIB3

19 IO111PDB3

20 IO111NDB3

21 GFC1/IO110PDB3

22 GFC0/IO110NDB3

23 GFB1/IO109PDB3

24 GFB0/IO109NDB3

25 VCOMPLF

26 GFA0/IO108NPB3

27 VCCPLF

28 GFA1/IO108PPB3

29 GND

30 GFA2/IO107PDB3

31 IO107NDB3

32 GFB2/IO106PDB3

33 IO106NDB3

34 GFC2/IO105PDB3

35 IO105NDB3

36 NC

37 IO104PDB3

38 IO104NDB3

39 IO103PSB3

40 VCCIB3

41 GND

42 IO101PDB3

43 IO101NDB3

44 GEC1/IO100PDB3

45 GEC0/IO100NDB3

46 GEB1/IO99PDB3

47 GEB0/IO99NDB3

48 GEA1/IO98PDB3

49 GEA0/IO98NDB3

50 VMV3

51 GNDQ

52 GND

53 NC

54 NC

55 GEA2/IO97RSB2

56 GEB2/IO96RSB2

57 GEC2/IO95RSB2

58 IO94RSB2

59 IO93RSB2

60 IO92RSB2

61 IO91RSB2

62 VCCIB2

63 IO90RSB2

64 IO89RSB2

65 GND

66 IO88RSB2

67 IO87RSB2

68 IO86RSB2

69 IO85RSB2

70 IO84RSB2

71 VCC

72 VCCIB2

208-Pin PQFP

Pin Number A3P250 Function

73 IO83RSB2

74 IO82RSB2

75 IO81RSB2

76 IO80RSB2

77 IO79RSB2

78 IO78RSB2

79 IO77RSB2

80 IO76RSB2

81 GND

82 IO75RSB2

83 IO74RSB2

84 IO73RSB2

85 IO72RSB2

86 IO71RSB2

87 IO70RSB2

88 VCC

89 VCCIB2

90 IO69RSB2

91 IO68RSB2

92 IO67RSB2

93 IO66RSB2

94 IO65RSB2

95 IO64RSB2

96 GDC2/IO63RSB2

97 GND

98 GDB2/IO62RSB2

99 GDA2/IO61RSB2

100 GNDQ

101 TCK

102 TDI

103 TMS

104 VMV2

105 GND

106 VPUMP

107 NC

108 TDO

208-Pin PQFP

Pin Number A3P250 Function

Package Pin Assignments

3-26 v1.3

109 TRST

110 VJTAG

111 GDA0/IO60VDB1

112 GDA1/IO60UDB1

113 GDB0/IO59VDB1

114 GDB1/IO59UDB1

115 GDC0/IO58VDB1

116 GDC1/IO58UDB1

117 IO57VDB1

118 IO57UDB1

119 IO56NDB1

120 IO56PDB1

121 IO55RSB1

122 GND

123 VCCIB1

124 NC

125 NC

126 VCC

127 IO53NDB1

128 GCC2/IO53PDB1

129 GCB2/IO52PSB1

130 GND

131 GCA2/IO51PSB1

132 GCA1/IO50PDB1

133 GCA0/IO50NDB1

134 GCB0/IO49NDB1

135 GCB1/IO49PDB1

136 GCC0/IO48NDB1

137 GCC1/IO48PDB1

138 IO47NDB1

139 IO47PDB1

140 VCCIB1

141 GND

142 VCC

143 IO46RSB1

144 IO45NDB1

208-Pin PQFP

Pin Number A3P250 Function

145 IO45PDB1

146 IO44NDB1

147 IO44PDB1

148 IO43NDB1

149 GBC2/IO43PDB1

150 IO42NDB1

151 GBB2/IO42PDB1

152 IO41NDB1

153 GBA2/IO41PDB1

154 VMV1

155 GNDQ

156 GND

157 NC

158 GBA1/IO40RSB0

159 GBA0/IO39RSB0

160 GBB1/IO38RSB0

161 GBB0/IO37RSB0

162 GND

163 GBC1/IO36RSB0

164 GBC0/IO35RSB0

165 IO34RSB0

166 IO33RSB0

167 IO32RSB0

168 IO31RSB0

169 IO30RSB0

170 VCCIB0

171 VCC

172 IO29RSB0

173 IO28RSB0

174 IO27RSB0

175 IO26RSB0

176 IO25RSB0

177 IO24RSB0

178 GND

179 IO23RSB0

180 IO22RSB0

208-Pin PQFP

Pin Number A3P250 Function

181 IO21RSB0

182 IO20RSB0

183 IO19RSB0

184 IO18RSB0

185 IO17RSB0

186 VCCIB0

187 VCC

188 IO16RSB0

189 IO15RSB0

190 IO14RSB0

191 IO13RSB0

192 IO12RSB0

193 IO11RSB0

194 IO10RSB0

195 GND

196 IO09RSB0

197 IO08RSB0

198 IO07RSB0

199 IO06RSB0

200 VCCIB0

201 GAC1/IO05RSB0

202 GAC0/IO04RSB0

203 GAB1/IO03RSB0

204 GAB0/IO02RSB0

205 GAA1/IO01RSB0

206 GAA0/IO00RSB0

207 GNDQ

208 VMV0

208-Pin PQFP

Pin Number A3P250 Function

ProASIC3 Packaging

v1.3 3-27

208-Pin PQFP

Pin Number A3P400 Function

1GND

2 GAA2/IO155UDB3

3 IO155VDB3

4 GAB2/IO154UDB3

5 IO154VDB3

6 GAC2/IO153UDB3

7 IO153VDB3

8 IO152UDB3

9 IO152VDB3

10 IO151UDB3

11 IO151VDB3

12 IO150PDB3

13 IO150NDB3

14 IO149PDB3

15 IO149NDB3

16 VCC

17 GND

18 VCCIB3

19 IO148PDB3

20 IO148NDB3

21 GFC1/IO147PDB3

22 GFC0/IO147NDB3

23 GFB1/IO146PDB3

24 GFB0/IO146NDB3

25 VCOMPLF

26 GFA0/IO145NPB3

27 VCCPLF

28 GFA1/IO145PPB3

29 GND

30 GFA2/IO144PDB3

31 IO144NDB3

32 GFB2/IO143PDB3

33 IO143NDB3

34 GFC2/IO142PDB3

35 IO142NDB3

36 NC

37 IO141PSB3

38 IO140PDB3

39 IO140NDB3

40 VCCIB3

41 GND

42 IO138PDB3

43 IO138NDB3

44 GEC1/IO137PDB3

45 GEC0/IO137NDB3

46 GEB1/IO136PDB3

47 GEB0/IO136NDB3

48 GEA1/IO135PDB3

49 GEA0/IO135NDB3

50 VMV3

51 GNDQ

52 GND

53 VMV2

54 NC

55 GEA2/IO134RSB2

56 GEB2/IO133RSB2

57 GEC2/IO132RSB2

58 IO131RSB2

59 IO130RSB2

60 IO129RSB2

61 IO128RSB2

62 VCCIB2

63 IO125RSB2

64 IO123RSB2

65 GND

66 IO121RSB2

67 IO119RSB2

68 IO117RSB2

69 IO115RSB2

70 IO113RSB2

71 VCC

72 VCCIB2

208-Pin PQFP

Pin Number A3P400 Function

73 IO112RSB2

74 IO111RSB2

75 IO110RSB2

76 IO109RSB2

77 IO108RSB2

78 IO107RSB2

79 IO106RSB2

80 IO104RSB2

81 GND

82 IO102RSB2

83 IO101RSB2

84 IO100RSB2

85 IO99RSB2

86 IO98RSB2

87 IO97RSB2

88 VCC

89 VCCIB2

90 IO94RSB2

91 IO92RSB2

92 IO90RSB2

93 IO88RSB2

94 IO86RSB2

95 IO84RSB2

96 GDC2/IO82RSB2

97 GND

98 GDB2/IO81RSB2

99 GDA2/IO80RSB2

100 GNDQ

101 TCK

102 TDI

103 TMS

104 VMV2

105 GND

106 VPUMP

107 NC

108 TDO

208-Pin PQFP

Pin Number A3P400 Function

Package Pin Assignments

3-28 v1.3

109 TRST

110 VJTAG

111 GDA0/IO79VDB1

112 GDA1/IO79UDB1

113 GDB0/IO78VDB1

114 GDB1/IO78UDB1

115 GDC0/IO77VDB1

116 GDC1/IO77UDB1

117 IO76VDB1

118 IO76UDB1

119 IO75NDB1

120 IO75PDB1

121 IO74RSB1

122 GND

123 VCCIB1

124 NC

125 NC

126 VCC

127 IO72NDB1

128 GCC2/IO72PDB1

129 GCB2/IO71PSB1

130 GND

131 GCA2/IO70PSB1

132 GCA1/IO69PDB1

133 GCA0/IO69NDB1

134 GCB0/IO68NDB1

135 GCB1/IO68PDB1

136 GCC0/IO67NDB1

137 GCC1/IO67PDB1

138 IO66NDB1

139 IO66PDB1

140 VCCIB1

141 GND

142 VCC

143 IO65RSB1

144 IO64NDB1

208-Pin PQFP

Pin Number A3P400 Function

145 IO64PDB1

146 IO63NDB1

147 IO63PDB1

148 IO62NDB1

149 GBC2/IO62PDB1

150 IO61NDB1

151 GBB2/IO61PDB1

152 IO60NDB1

153 GBA2/IO60PDB1

154 VMV1

155 GNDQ

156 GND

157 VMV0

158 GBA1/IO59RSB0

159 GBA0/IO58RSB0

160 GBB1/IO57RSB0

161 GBB0/IO56RSB0

162 GND

163 GBC1/IO55RSB0

164 GBC0/IO54RSB0

165 IO52RSB0

166 IO49RSB0

167 IO46RSB0

168 IO43RSB0

169 IO40RSB0

170 VCCIB0

171 VCC

172 IO36RSB0

173 IO35RSB0

174 IO34RSB0

175 IO33RSB0

176 IO32RSB0

177 IO31RSB0

178 GND

179 IO29RSB0

180 IO28RSB0

208-Pin PQFP

Pin Number A3P400 Function

181 IO27RSB0

182 IO26RSB0

183 IO25RSB0

184 IO24RSB0

185 IO23RSB0

186 VCCIB0

187 VCC

188 IO21RSB0

189 IO20RSB0

190 IO19RSB0

191 IO18RSB0

192 IO17RSB0

193 IO16RSB0

194 IO15RSB0

195 GND

196 IO13RSB0

197 IO11RSB0

198 IO09RSB0

199 IO07RSB0

200 VCCIB0

201 GAC1/IO05RSB0

202 GAC0/IO04RSB0

203 GAB1/IO03RSB0

204 GAB0/IO02RSB0

205 GAA1/IO01RSB0

206 GAA0/IO00RSB0

207 GNDQ

208 VMV0

208-Pin PQFP

Pin Number A3P400 Function

ProASIC3 Packaging

v1.3 3-29

208-Pin PQFP

Pin Number A3P600 Function

1 GND

2 GAA2/IO174PDB3

3 IO174NDB3

4 GAB2/IO173PDB3

5 IO173NDB3

6 GAC2/IO172PDB3

7 IO172NDB3

8 IO171PDB3

9 IO171NDB3

10 IO170PDB3

11 IO170NDB3

12 IO169PDB3

13 IO169NDB3

14 IO168PDB3

15 IO168NDB3

16 VCC

17 GND

18 VCCIB3

19 IO166PDB3

20 IO166NDB3

21 GFC1/IO164PDB3

22 GFC0/IO164NDB3

23 GFB1/IO163PDB3

24 GFB0/IO163NDB3

25 VCOMPLF

26 GFA0/IO162NPB3

27 VCCPLF

28 GFA1/IO162PPB3

29 GND

30 GFA2/IO161PDB3

31 IO161NDB3

32 GFB2/IO160PDB3

33 IO160NDB3

34 GFC2/IO159PDB3

35 IO159NDB3

36 VCC

37 IO152PDB3

38 IO152NDB3

39 IO150PSB3

40 VCCIB3

41 GND

42 IO147PDB3

43 IO147NDB3

44 GEC1/IO146PDB3

45 GEC0/IO146NDB3

46 GEB1/IO145PDB3

47 GEB0/IO145NDB3

48 GEA1/IO144PDB3

49 GEA0/IO144NDB3

50 VMV3

51 GNDQ

52 GND

53 VMV2

54 GEA2/IO143RSB2

55 GEB2/IO142RSB2

56 GEC2/IO141RSB2

57 IO140RSB2

58 IO139RSB2

59 IO138RSB2

60 IO137RSB2

61 IO136RSB2

62 VCCIB2

63 IO135RSB2

64 IO133RSB2

65 GND

66 IO131RSB2

67 IO129RSB2

68 IO127RSB2

69 IO125RSB2

70 IO123RSB2

71 VCC

72 VCCIB2

208-Pin PQFP

Pin Number A3P600 Function

73 IO120RSB2

74 IO119RSB2

75 IO118RSB2

76 IO117RSB2

77 IO116RSB2

78 IO115RSB2

79 IO114RSB2

80 IO112RSB2

81 GND

82 IO111RSB2

83 IO110RSB2

84 IO109RSB2

85 IO108RSB2

86 IO107RSB2

87 IO106RSB2

88 VCC

89 VCCIB2

90 IO104RSB2

91 IO102RSB2

92 IO100RSB2

93 IO98RSB2

94 IO96RSB2

95 IO92RSB2

96 GDC2/IO91RSB2

97 GND

98 GDB2/IO90RSB2

99 GDA2/IO89RSB2

100 GNDQ

101 TCK

102 TDI

103 TMS

104 VMV2

105 GND

106 VPUMP

107 GNDQ

108 TDO

208-Pin PQFP

Pin Number A3P600 Function

Package Pin Assignments

3-30 v1.3

109 TRST

110 VJTAG

111 GDA0/IO88NDB1

112 GDA1/IO88PDB1

113 GDB0/IO87NDB1

114 GDB1/IO87PDB1

115 GDC0/IO86NDB1

116 GDC1/IO86PDB1

117 IO84NDB1

118 IO84PDB1

119 IO82NDB1

120 IO82PDB1

121 IO81PSB1

122 GND

123 VCCIB1

124 IO77NDB1

125 IO77PDB1

126 NC

127 IO74NDB1

128 GCC2/IO74PDB1

129 GCB2/IO73PSB1

130 GND

131 GCA2/IO72PSB1

132 GCA1/IO71PDB1

133 GCA0/IO71NDB1

134 GCB0/IO70NDB1

135 GCB1/IO70PDB1

136 GCC0/IO69NDB1

137 GCC1/IO69PDB1

138 IO67NDB1

139 IO67PDB1

140 VCCIB1

141 GND

142 VCC

143 IO65PSB1

144 IO64NDB1

208-Pin PQFP

Pin Number A3P600 Function

145 IO64PDB1

146 IO63NDB1

147 IO63PDB1

148 IO62NDB1

149 GBC2/IO62PDB1

150 IO61NDB1

151 GBB2/IO61PDB1

152 IO60NDB1

153 GBA2/IO60PDB1

154 VMV1

155 GNDQ

156 GND

157 VMV0

158 GBA1/IO59RSB0

159 GBA0/IO58RSB0

160 GBB1/IO57RSB0

161 GBB0/IO56RSB0

162 GND

163 GBC1/IO55RSB0

164 GBC0/IO54RSB0

165 IO52RSB0

166 IO50RSB0

167 IO48RSB0

168 IO46RSB0

169 IO44RSB0

170 VCCIB0

171 VCC

172 IO36RSB0

173 IO35RSB0

174 IO34RSB0

175 IO33RSB0

176 IO32RSB0

177 IO31RSB0

178 GND

179 IO29RSB0

180 IO28RSB0

208-Pin PQFP

Pin Number A3P600 Function

181 IO27RSB0

182 IO26RSB0

183 IO25RSB0

184 IO24RSB0

185 IO23RSB0

186 VCCIB0

187 VCC

188 IO20RSB0

189 IO19RSB0

190 IO18RSB0

191 IO17RSB0

192 IO16RSB0

193 IO14RSB0

194 IO12RSB0

195 GND

196 IO10RSB0

197 IO09RSB0

198 IO08RSB0

199 IO07RSB0

200 VCCIB0

201 GAC1/IO05RSB0

202 GAC0/IO04RSB0

203 GAB1/IO03RSB0

204 GAB0/IO02RSB0

205 GAA1/IO01RSB0

206 GAA0/IO00RSB0

207 GNDQ

208 VMV0

208-Pin PQFP

Pin Number A3P600 Function

ProASIC3 Packaging

v1.3 3-31

208-Pin PQFP

Pin Number A3P1000 Function

1 GND

2 GAA2/IO225PDB3

3 IO225NDB3

4 GAB2/IO224PDB3

5 IO224NDB3

6 GAC2/IO223PDB3

7 IO223NDB3

8 IO222PDB3

9 IO222NDB3

10 IO220PDB3

11 IO220NDB3

12 IO218PDB3

13 IO218NDB3

14 IO216PDB3

15 IO216NDB3

16 VCC

17 GND

18 VCCIB3

19 IO212PDB3

20 IO212NDB3

21 GFC1/IO209PDB3

22 GFC0/IO209NDB3

23 GFB1/IO208PDB3

24 GFB0/IO208NDB3

25 VCOMPLF

26 GFA0/IO207NPB3

27 VCCPLF

28 GFA1/IO207PPB3

29 GND

30 GFA2/IO206PDB3

31 IO206NDB3

32 GFB2/IO205PDB3

33 IO205NDB3

34 GFC2/IO204PDB3

35 IO204NDB3

36 VCC

37 IO199PDB3

38 IO199NDB3

39 IO197PSB3

40 VCCIB3

41 GND

42 IO191PDB3

43 IO191NDB3

44 GEC1/IO190PDB3

45 GEC0/IO190NDB3

46 GEB1/IO189PDB3

47 GEB0/IO189NDB3

48 GEA1/IO188PDB3

49 GEA0/IO188NDB3

50 VMV3

51 GNDQ

52 GND

53 VMV2

54 GEA2/IO187RSB2

55 GEB2/IO186RSB2

56 GEC2/IO185RSB2

57 IO184RSB2

58 IO183RSB2

59 IO182RSB2

60 IO181RSB2

61 IO180RSB2

62 VCCIB2

63 IO178RSB2

64 IO176RSB2

65 GND

66 IO174RSB2

67 IO172RSB2

68 IO170RSB2

69 IO168RSB2

70 IO166RSB2

71 VCC

72 VCCIB2

208-Pin PQFP

Pin Number A3P1000 Function

73 IO162RSB2

74 IO160RSB2

75 IO158RSB2

76 IO156RSB2

77 IO154RSB2

78 IO152RSB2

79 IO150RSB2

80 IO148RSB2

81 GND

82 IO143RSB2

83 IO141RSB2

84 IO139RSB2

85 IO137RSB2

86 IO135RSB2

87 IO133RSB2

88 VCC

89 VCCIB2

90 IO128RSB2

91 IO126RSB2

92 IO124RSB2

93 IO122RSB2

94 IO120RSB2

95 IO118RSB2

96 GDC2/IO116RSB2

97 GND

98 GDB2/IO115RSB2

99 GDA2/IO114RSB2

100 GNDQ

101 TCK

102 TDI

103 TMS

104 VMV2

105 GND

106 VPUMP

107 GNDQ

108 TDO

208-Pin PQFP

Pin Number A3P1000 Function

Package Pin Assignments

3-32 v1.3

109 TRST

110 VJTAG

111 GDA0/IO113NDB1

112 GDA1/IO113PDB1

113 GDB0/IO112NDB1

114 GDB1/IO112PDB1

115 GDC0/IO111NDB1

116 GDC1/IO111PDB1

117 IO109NDB1

118 IO109PDB1

119 IO106NDB1

120 IO106PDB1

121 IO104PSB1

122 GND

123 VCCIB1

124 IO99NDB1

125 IO99PDB1

126 NC

127 IO96NDB1

128 GCC2/IO96PDB1

129 GCB2/IO95PSB1

130 GND

131 GCA2/IO94PSB1

132 GCA1/IO93PDB1

133 GCA0/IO93NDB1

134 GCB0/IO92NDB1

135 GCB1/IO92PDB1

136 GCC0/IO91NDB1

137 GCC1/IO91PDB1

138 IO88NDB1

139 IO88PDB1

140 VCCIB1

141 GND

142 VCC

143 IO86PSB1

144 IO84NDB1

208-Pin PQFP

Pin Number A3P1000 Function

145 IO84PDB1

146 IO82NDB1

147 IO82PDB1

148 IO80NDB1

149 GBC2/IO80PDB1

150 IO79NDB1

151 GBB2/IO79PDB1

152 IO78NDB1

153 GBA2/IO78PDB1

154 VMV1

155 GNDQ

156 GND

157 VMV0

158 GBA1/IO77RSB0

159 GBA0/IO76RSB0

160 GBB1/IO75RSB0

161 GBB0/IO74RSB0

162 GND

163 GBC1/IO73RSB0

164 GBC0/IO72RSB0

165 IO70RSB0

166 IO67RSB0

167 IO63RSB0

168 IO60RSB0

169 IO57RSB0

170 VCCIB0

171 VCC

172 IO54RSB0

173 IO51RSB0

174 IO48RSB0

175 IO45RSB0

176 IO42RSB0

177 IO40RSB0

178 GND

179 IO38RSB0

180 IO35RSB0

208-Pin PQFP

Pin Number A3P1000 Function

181 IO33RSB0

182 IO31RSB0

183 IO29RSB0

184 IO27RSB0

185 IO25RSB0

186 VCCIB0

187 VCC

188 IO22RSB0

189 IO20RSB0

190 IO18RSB0

191 IO16RSB0

192 IO15RSB0

193 IO14RSB0

194 IO13RSB0

195 GND

196 IO12RSB0

197 IO11RSB0

198 IO10RSB0

199 IO09RSB0

200 VCCIB0

201 GAC1/IO05RSB0

202 GAC0/IO04RSB0

203 GAB1/IO03RSB0

204 GAB0/IO02RSB0

205 GAA1/IO01RSB0

206 GAA0/IO00RSB0

207 GNDQ

208 VMV0

208-Pin PQFP

Pin Number A3P1000 Function

ProASIC3 Packaging

v1.3 3-33

144-Pin FBGA

Note

For Package Manufacturing and Environmental information, visit the Resource Center at

http://www.actel.com/products/solutions/package/docs.aspx.

Note: This is the bottom view of the package.

34567

101112

A1 Ball Pad Corner

Package Pin Assignments

3-34 v1.3

144-Pin FBGA

Pin Number A3P060 Function

A1 GNDQ

A2 VMV0

A3 GAB0/IO04RSB0

A4 GAB1/IO05RSB0

A5 IO08RSB0

A6 GND

A7 IO11RSB0

A8 VCC

A9 IO16RSB0

A10 GBA0/IO23RSB0

A11 GBA1/IO24RSB0

A12 GNDQ

B1 GAB2/IO53RSB1

B2 GND

B3 GAA0/IO02RSB0

B4 GAA1/IO03RSB0

B5 IO00RSB0

B6 IO10RSB0

B7 IO12RSB0

B8 IO14RSB0

B9 GBB0/IO21RSB0

B10 GBB1/IO22RSB0

B11 GND

B12 VMV0

C1 IO95RSB1

C2 GFA2/IO83RSB1

C3 GAC2/IO94RSB1

C4 VCC

C5 IO01RSB0

C6 IO09RSB0

C7 IO13RSB0

C8 IO15RSB0

C9 IO17RSB0

C10 GBA2/IO25RSB0

C11 IO26RSB0

C12 GBC2/IO29RSB0

D1 IO91RSB1

D2 IO92RSB1

D3 IO93RSB1

D4 GAA2/IO51RSB1

D5 GAC0/IO06RSB0

D6 GAC1/IO07RSB0

D7 GBC0/IO19RSB0

D8 GBC1/IO20RSB0

D9 GBB2/IO27RSB0

D10 IO18RSB0

D11 IO28RSB0

D12 GCB1/IO37RSB0

E1 VCC

E2 GFC0/IO88RSB1

E3 GFC1/IO89RSB1

E4 VCCIB1

E5 IO52RSB1

E6 VCCIB0

E7 VCCIB0

E8 GCC1/IO35RSB0

E9 VCCIB0

E10 VCC

E11 GCA0/IO40RSB0

E12 IO30RSB0

F1 GFB0/IO86RSB1

F2 VCOMPLF

F3 GFB1/IO87RSB1

F4 IO90RSB1

F5 GND

F6 GND

F7 GND

F8 GCC0/IO36RSB0

F9 GCB0/IO38RSB0

F10 GND

F11 GCA1/IO39RSB0

F12 GCA2/IO41RSB0

144-Pin FBGA

Pin Number A3P060 Function

G1 GFA1/IO84RSB1

G2 GND

G3 VCCPLF

G4 GFA0/IO85RSB1

G5 GND

G6 GND

G7 GND

G8 GDC1/IO45RSB0

G9 IO32RSB0

G10 GCC2/IO43RSB0

G11 IO31RSB0

G12 GCB2/IO42RSB0

H1 VCC

H2 GFB2/IO82RSB1

H3 GFC2/IO81RSB1

H4 GEC1/IO77RSB1

H5 VCC

H6 IO34RSB0

H7 IO44RSB0

H8 GDB2/IO55RSB1

H9 GDC0/IO46RSB0

H10 VCCIB0

H11 IO33RSB0

H12 VCC

J1 GEB1/IO75RSB1

J2 IO78RSB1

J3 VCCIB1

J4 GEC0/IO76RSB1

J5 IO79RSB1

J6 IO80RSB1

J7 VCC

J8 TCK

J9 GDA2/IO54RSB1

J10 TDO

J11 GDA1/IO49RSB0

J12 GDB1/IO47RSB0

144-Pin FBGA

Pin Number A3P060 Function

ProASIC3 Packaging

v1.3 3-35

K1 GEB0/IO74RSB1

K2 GEA1/IO73RSB1

K3 GEA0/IO72RSB1

K4 GEA2/IO71RSB1

K5 IO65RSB1

K6 IO64RSB1

K7 GND

K8 IO57RSB1

K9 GDC2/IO56RSB1

K10 GND

K11 GDA0/IO50RSB0

K12 GDB0/IO48RSB0

L1 GND

L2 VMV1

L3 GEB2/IO70RSB1

L4 IO67RSB1

L5 VCCIB1

L6 IO62RSB1

L7 IO59RSB1

L8 IO58RSB1

L9 TMS

L10 VJTAG

L11 VMV1

L12 TRST

M1 GNDQ

M2 GEC2/IO69RSB1

M3 IO68RSB1

M4 IO66RSB1

M5 IO63RSB1

M6 IO61RSB1

M7 IO60RSB1

M8 NC

M9 TDI

M10 VCCIB1

M11 VPUMP

M12 GNDQ

144-Pin FBGA

Pin Number A3P060 Function

Package Pin Assignments

3-36 v1.3

144-Pin FBGA

Pin Number A3P125 Function

A1 GNDQ

A2 VMV0

A3 GAB0/IO02RSB0

A4 GAB1/IO03RSB0

A5 IO11RSB0

A6 GND

A7 IO18RSB0

A8 VCC

A9 IO25RSB0

A10 GBA0/IO39RSB0

A11 GBA1/IO40RSB0

A12 GNDQ

B1 GAB2/IO69RSB1

B2 GND

B3 GAA0/IO00RSB0

B4 GAA1/IO01RSB0

B5 IO08RSB0

B6 IO14RSB0

B7 IO19RSB0

B8 IO22RSB0

B9 GBB0/IO37RSB0

B10 GBB1/IO38RSB0

B11 GND

B12 VMV0

C1 IO132RSB1

C2 GFA2/IO120RSB1

C3 GAC2/IO131RSB1

C4 VCC

C5 IO10RSB0

C6 IO12RSB0

C7 IO21RSB0

C8 IO24RSB0

C9 IO27RSB0

C10 GBA2/IO41RSB0

C11 IO42RSB0

C12 GBC2/IO45RSB0

D1 IO128RSB1

D2 IO129RSB1

D3 IO130RSB1

D4 GAA2/IO67RSB1

D5 GAC0/IO04RSB0

D6 GAC1/IO05RSB0

D7 GBC0/IO35RSB0

D8 GBC1/IO36RSB0

D9 GBB2/IO43RSB0

D10 IO28RSB0

D11 IO44RSB0

D12 GCB1/IO53RSB0

E1 VCC

E2 GFC0/IO125RSB1

E3 GFC1/IO126RSB1

E4 VCCIB1

E5 IO68RSB1

E6 VCCIB0

E7 VCCIB0

E8 GCC1/IO51RSB0

E9 VCCIB0

E10 VCC

E11 GCA0/IO56RSB0

E12 IO46RSB0

F1 GFB0/IO123RSB1

F2 VCOMPLF

F3 GFB1/IO124RSB1

F4 IO127RSB1

F5 GND

F6 GND

F7 GND

F8 GCC0/IO52RSB0

F9 GCB0/IO54RSB0

F10 GND

F11 GCA1/IO55RSB0

F12 GCA2/IO57RSB0

144-Pin FBGA

Pin Number A3P125 Function

G1 GFA1/IO121RSB1

G2 GND

G3 VCCPLF

G4 GFA0/IO122RSB1

G5 GND

G6 GND

G7 GND

G8 GDC1/IO61RSB0

G9 IO48RSB0

G10 GCC2/IO59RSB0

G11 IO47RSB0

G12 GCB2/IO58RSB0

H1 VCC

H2 GFB2/IO119RSB1

H3 GFC2/IO118RSB1

H4 GEC1/IO112RSB1

H5 VCC

H6 IO50RSB0

H7 IO60RSB0

H8 GDB2/IO71RSB1

H9 GDC0/IO62RSB0

H10 VCCIB0

H11 IO49RSB0

H12 VCC

J1 GEB1/IO110RSB1

J2 IO115RSB1

J3 VCCIB1

J4 GEC0/IO111RSB1

J5 IO116RSB1

J6 IO117RSB1

J7 VCC

J8 TCK

J9 GDA2/IO70RSB1

J10 TDO

J11 GDA1/IO65RSB0

J12 GDB1/IO63RSB0

144-Pin FBGA

Pin Number A3P125 Function

ProASIC3 Packaging

v1.3 3-37

K1 GEB0/IO109RSB1

K2 GEA1/IO108RSB1

K3 GEA0/IO107RSB1

K4 GEA2/IO106RSB1

K5 IO100RSB1

K6 IO98RSB1

K7 GND

K8 IO73RSB1

K9 GDC2/IO72RSB1

K10 GND

K11 GDA0/IO66RSB0

K12 GDB0/IO64RSB0

L1 GND

L2 VMV1

L3 GEB2/IO105RSB1

L4 IO102RSB1

L5 VCCIB1

L6 IO95RSB1

L7 IO85RSB1

L8 IO74RSB1

L9 TMS

L10 VJTAG

L11 VMV1

L12 TRST

M1 GNDQ

M2 GEC2/IO104RSB1

M3 IO103RSB1

M4 IO101RSB1

M5 IO97RSB1

M6 IO94RSB1

M7 IO86RSB1

M8 IO75RSB1

M9 TDI

M10 VCCIB1

M11 VPUMP

M12 GNDQ

144-Pin FBGA

Pin Number A3P125 Function

Package Pin Assignments

3-38 v1.3

144-Pin FBGA

Pin Number A3P250 Function

A1 GNDQ

A2 VMV0

A3 GAB0/IO02RSB0

A4 GAB1/IO03RSB0

A5 IO16RSB0

A6 GND

A7 IO29RSB0

A8 VCC

A9 IO33RSB0

A10 GBA0/IO39RSB0

A11 GBA1/IO40RSB0

A12 GNDQ

B1 GAB2/IO117UDB3

B2 GND

B3 GAA0/IO00RSB0

B4 GAA1/IO01RSB0

B5 IO14RSB0

B6 IO19RSB0

B7 IO22RSB0

B8 IO30RSB0

B9 GBB0/IO37RSB0

B10 GBB1/IO38RSB0

B11 GND

B12 VMV1

C1 IO117VDB3

C2 GFA2/IO107PPB3

C3 GAC2/IO116UDB3

C4 VCC

C5 IO12RSB0

C6 IO17RSB0

C7 IO24RSB0

C8 IO31RSB0

C9 IO34RSB0

C10 GBA2/IO41PDB1

C11 IO41NDB1

C12 GBC2/IO43PPB1

D1 IO112NDB3

D2 IO112PDB3

D3 IO116VDB3

D4 GAA2/IO118UPB3

D5 GAC0/IO04RSB0

D6 GAC1/IO05RSB0

D7 GBC0/IO35RSB0

D8 GBC1/IO36RSB0

D9 GBB2/IO42PDB1

D10 IO42NDB1

D11 IO43NPB1

D12 GCB1/IO49PPB1

E1 VCC

E2 GFC0/IO110NDB3

E3 GFC1/IO110PDB3

E4 VCCIB3

E5 IO118VPB3

E6 VCCIB0

E7 VCCIB0

E8 GCC1/IO48PDB1

E9 VCCIB1

E10 VCC

E11 GCA0/IO50NDB1

E12 IO51NDB1

F1 GFB0/IO109NPB3

F2 VCOMPLF

F3 GFB1/IO109PPB3

F4 IO107NPB3

F5 GND

F6 GND

F7 GND

F8 GCC0/IO48NDB1

F9 GCB0/IO49NPB1

F10 GND

F11 GCA1/IO50PDB1

F12 GCA2/IO51PDB1

144-Pin FBGA

Pin Number A3P250 Function

G1 GFA1/IO108PPB3

G2 GND

G3 VCCPLF

G4 GFA0/IO108NPB3

G5 GND

G6 GND

G7 GND

G8 GDC1/IO58UPB1

G9 IO53NDB1

G10 GCC2/IO53PDB1

G11 IO52NDB1

G12 GCB2/IO52PDB1

H1 VCC

H2 GFB2/IO106PDB3

H3 GFC2/IO105PSB3

H4 GEC1/IO100PDB3

H5 VCC

H6 IO79RSB2

H7 IO65RSB2

H8 GDB2/IO62RSB2

H9 GDC0/IO58VPB1

H10 VCCIB1

H11 IO54PSB1

H12 VCC

J1 GEB1/IO99PDB3

J2 IO106NDB3

J3 VCCIB3

J4 GEC0/IO100NDB3

J5 IO88RSB2

J6 IO81RSB2

J7 VCC

J8 TCK

J9 GDA2/IO61RSB2

J10 TDO

J11 GDA1/IO60UDB1

J12 GDB1/IO59UDB1

144-Pin FBGA

Pin Number A3P250 Function

ProASIC3 Packaging

v1.3 3-39

K1 GEB0/IO99NDB3

K2 GEA1/IO98PDB3

K3 GEA0/IO98NDB3

K4 GEA2/IO97RSB2

K5 IO90RSB2

K6 IO84RSB2

K7 GND

K8 IO66RSB2

K9 GDC2/IO63RSB2

K10 GND

K11 GDA0/IO60VDB1

K12 GDB0/IO59VDB1

L1 GND

L2 VMV3

L3 GEB2/IO96RSB2

L4 IO91RSB2

L5 VCCIB2

L6 IO82RSB2

L7 IO80RSB2

L8 IO72RSB2

L9 TMS

L10 VJTAG

L11 VMV2

L12 TRST

M1 GNDQ

M2 GEC2/IO95RSB2

M3 IO92RSB2

M4 IO89RSB2

M5 IO87RSB2

M6 IO85RSB2

M7 IO78RSB2

M8 IO76RSB2

M9 TDI

M10 VCCIB2

M11 VPUMP

M12 GNDQ

144-Pin FBGA

Pin Number A3P250 Function

Package Pin Assignments

3-40 v1.3

144-Pin FBGA

Pin Number A3P400 Function

A1 GNDQ

A2 VMV0

A3 GAB0/IO02RSB0

A4 GAB1/IO03RSB0

A5 IO16RSB0

A6 GND

A7 IO30RSB0

A8 VCC

A9 IO34RSB0

A10 GBA0/IO58RSB0

A11 GBA1/IO59RSB0

A12 GNDQ

B1 GAB2/IO154UDB3

B2 GND

B3 GAA0/IO00RSB0

B4 GAA1/IO01RSB0

B5 IO14RSB0

B6 IO19RSB0

B7 IO23RSB0

B8 IO31RSB0

B9 GBB0/IO56RSB0

B10 GBB1/IO57RSB0

B11 GND

B12 VMV1

C1 IO154VDB3

C2 GFA2/IO144PPB3

C3 GAC2/IO153UDB3

C4 VCC

C5 IO12RSB0

C6 IO17RSB0

C7 IO25RSB0

C8 IO32RSB0

C9 IO53RSB0

C10 GBA2/IO60PDB1

C11 IO60NDB1

C12 GBC2/IO62PPB1

D1 IO149NDB3

D2 IO149PDB3

D3 IO153VDB3

D4 GAA2/IO155UPB3

D5 GAC0/IO04RSB0

D6 GAC1/IO05RSB0

D7 GBC0/IO54RSB0

D8 GBC1/IO55RSB0

D9 GBB2/IO61PDB1

D10 IO61NDB1

D11 IO62NPB1

D12 GCB1/IO68PPB1

E1 VCC

E2 GFC0/IO147NDB3

E3 GFC1/IO147PDB3

E4 VCCIB3

E5 IO155VPB3

E6 VCCIB0

E7 VCCIB0

E8 GCC1/IO67PDB1

E9 VCCIB1

E10 VCC

E11 GCA0/IO69NDB1

E12 IO70NDB1

F1 GFB0/IO146NPB3

F2 VCOMPLF

F3 GFB1/IO146PPB3

F4 IO144NPB3

F5 GND

F6 GND

F7 GND

F8 GCC0/IO67NDB1

F9 GCB0/IO68NPB1

F10 GND

F11 GCA1/IO69PDB1

F12 GCA2/IO70PDB1

144-Pin FBGA

Pin Number A3P400 Function

G1 GFA1/IO145PPB3

G2 GND

G3 VCCPLF

G4 GFA0/IO145NPB3

G5 GND

G6 GND

G7 GND

G8 GDC1/IO77UPB1

G9 IO72NDB1

G10 GCC2/IO72PDB1

G11 IO71NDB1

G12 GCB2/IO71PDB1

H1 VCC

H2 GFB2/IO143PDB3

H3 GFC2/IO142PSB3

H4 GEC1/IO137PDB3

H5 VCC

H6 IO75PDB1

H7 IO75NDB1

H8 GDB2/IO81RSB2

H9 GDC0/IO77VPB1

H10 VCCIB1

H11 IO73PSB1

H12 VCC

J1 GEB1/IO136PDB3

J2 IO143NDB3

J3 VCCIB3

J4 GEC0/IO137NDB3

J5 IO125RSB2

J6 IO116RSB2

J7 VCC

J8 TCK

J9 GDA2/IO80RSB2

J10 TDO

J11 GDA1/IO79UDB1

J12 GDB1/IO78UDB1

144-Pin FBGA

Pin Number A3P400 Function

ProASIC3 Packaging

v1.3 3-41

K1 GEB0/IO136NDB3

K2 GEA1/IO135PDB3

K3 GEA0/IO135NDB3

K4 GEA2/IO134RSB2

K5 IO127RSB2

K6 IO121RSB2

K7 GND

K8 IO104RSB2

K9 GDC2/IO82RSB2

K10 GND

K11 GDA0/IO79VDB1

K12 GDB0/IO78VDB1

L1 GND

L2 VMV3

L3 GEB2/IO133RSB2

L4 IO128RSB2

L5 VCCIB2

L6 IO119RSB2

L7 IO114RSB2

L8 IO110RSB2

L9 TMS

L10 VJTAG

L11 VMV2

L12 TRST

M1 GNDQ

M2 GEC2/IO132RSB2

M3 IO129RSB2

M4 IO126RSB2

M5 IO124RSB2

M6 IO122RSB2

M7 IO117RSB2

M8 IO115RSB2

M9 TDI

M10 VCCIB2

M11 VPUMP

M12 GNDQ

144-Pin FBGA

Pin Number A3P400 Function

Package Pin Assignments

3-42 v1.3

144-Pin FBGA

Pin Number A3P600 Function

A1 GNDQ

A2 VMV0

A3 GAB0/IO02RSB0

A4 GAB1/IO03RSB0

A5 IO10RSB0

A6 GND

A7 IO34RSB0

A8 VCC

A9 IO50RSB0

A10 GBA0/IO58RSB0

A11 GBA1/IO59RSB0

A12 GNDQ

B1 GAB2/IO173PDB3

B2 GND

B3 GAA0/IO00RSB0

B4 GAA1/IO01RSB0

B5 IO13RSB0

B6 IO19RSB0

B7 IO31RSB0

B8 IO39RSB0

B9 GBB0/IO56RSB0

B10 GBB1/IO57RSB0

B11 GND

B12 VMV1

C1 IO173NDB3

C2 GFA2/IO161PPB3

C3 GAC2/IO172PDB3

C4 VCC

C5 IO16RSB0

C6 IO25RSB0

C7 IO28RSB0

C8 IO42RSB0

C9 IO45RSB0

C10 GBA2/IO60PDB1

C11 IO60NDB1

C12 GBC2/IO62PPB1

D1 IO169PDB3

D2 IO169NDB3

D3 IO172NDB3

D4 GAA2/IO174PPB3

D5 GAC0/IO04RSB0

D6 GAC1/IO05RSB0

D7 GBC0/IO54RSB0

D8 GBC1/IO55RSB0

D9 GBB2/IO61PDB1

D10 IO61NDB1

D11 IO62NPB1

D12 GCB1/IO70PPB1

E1 VCC

E2 GFC0/IO164NDB3

E3 GFC1/IO164PDB3

E4 VCCIB3

E5 IO174NPB3

E6 VCCIB0

E7 VCCIB0

E8 GCC1/IO69PDB1

E9 VCCIB1

E10 VCC

E11 GCA0/IO71NDB1

E12 IO72NDB1

F1 GFB0/IO163NPB3

F2 VCOMPLF

F3 GFB1/IO163PPB3

F4 IO161NPB3

F5 GND

F6 GND

F7 GND

F8 GCC0/IO69NDB1

F9 GCB0/IO70NPB1

F10 GND

F11 GCA1/IO71PDB1

F12 GCA2/IO72PDB1

144-Pin FBGA

Pin Number A3P600 Function

G1 GFA1/IO162PPB3

G2 GND

G3 VCCPLF

G4 GFA0/IO162NPB3

G5 GND

G6 GND

G7 GND

G8 GDC1/IO86PPB1

G9 IO74NDB1

G10 GCC2/IO74PDB1

G11 IO73NDB1

G12 GCB2/IO73PDB1

H1 VCC

H2 GFB2/IO160PDB3

H3 GFC2/IO159PSB3

H4 GEC1/IO146PDB3

H5 VCC

H6 IO80PDB1

H7 IO80NDB1

H8 GDB2/IO90RSB2

H9 GDC0/IO86NPB1

H10 VCCIB1

H11 IO84PSB1

H12 VCC

J1 GEB1/IO145PDB3

J2 IO160NDB3

J3 VCCIB3

J4 GEC0/IO146NDB3

J5 IO129RSB2

J6 IO131RSB2

J7 VCC

J8 TCK

J9 GDA2/IO89RSB2

J10 TDO

J11 GDA1/IO88PDB1

J12 GDB1/IO87PDB1

144-Pin FBGA

Pin Number A3P600 Function

ProASIC3 Packaging

v1.3 3-43

K1 GEB0/IO145NDB3

K2 GEA1/IO144PDB3

K3 GEA0/IO144NDB3

K4 GEA2/IO143RSB2

K5 IO119RSB2

K6 IO111RSB2

K7 GND

K8 IO94RSB2

K9 GDC2/IO91RSB2

K10 GND

K11 GDA0/IO88NDB1

K12 GDB0/IO87NDB1

L1 GND

L2 VMV3

L3 GEB2/IO142RSB2

L4 IO136RSB2

L5 VCCIB2

L6 IO115RSB2

L7 IO103RSB2

L8 IO97RSB2

L9 TMS

L10 VJTAG

L11 VMV2

L12 TRST

M1 GNDQ

M2 GEC2/IO141RSB2

M3 IO138RSB2

M4 IO123RSB2

M5 IO126RSB2

M6 IO134RSB2

M7 IO108RSB2

M8 IO99RSB2

M9 TDI

M10 VCCIB2

M11 VPUMP

M12 GNDQ

144-Pin FBGA

Pin Number A3P600 Function

Package Pin Assignments

3-44 v1.3

144-Pin FBGA

Pin Number A3P1000 Function

A1 GNDQ

A2 VMV0

A3 GAB0/IO02RSB0

A4 GAB1/IO03RSB0

A5 IO10RSB0

A6 GND

A7 IO44RSB0

A8 VCC

A9 IO69RSB0

A10 GBA0/IO76RSB0

A11 GBA1/IO77RSB0

A12 GNDQ

B1 GAB2/IO224PDB3

B2 GND

B3 GAA0/IO00RSB0

B4 GAA1/IO01RSB0

B5 IO13RSB0

B6 IO26RSB0

B7 IO35RSB0

B8 IO60RSB0

B9 GBB0/IO74RSB0

B10 GBB1/IO75RSB0

B11 GND

B12 VMV1

C1 IO224NDB3

C2 GFA2/IO206PPB3

C3 GAC2/IO223PDB3

C4 VCC

C5 IO16RSB0

C6 IO29RSB0

C7 IO32RSB0

C8 IO63RSB0

C9 IO66RSB0

C10 GBA2/IO78PDB1

C11 IO78NDB1

C12 GBC2/IO80PPB1

D1 IO213PDB3

D2 IO213NDB3

D3 IO223NDB3

D4 GAA2/IO225PPB3

D5 GAC0/IO04RSB0

D6 GAC1/IO05RSB0

D7 GBC0/IO72RSB0

D8 GBC1/IO73RSB0

D9 GBB2/IO79PDB1

D10 IO79NDB1

D11 IO80NPB1

D12 GCB1/IO92PPB1

E1 VCC

E2 GFC0/IO209NDB3

E3 GFC1/IO209PDB3

E4 VCCIB3

E5 IO225NPB3

E6 VCCIB0

E7 VCCIB0

E8 GCC1/IO91PDB1

E9 VCCIB1

E10 VCC

E11 GCA0/IO93NDB1

E12 IO94NDB1

F1 GFB0/IO208NPB3

F2 VCOMPLF

F3 GFB1/IO208PPB3

F4 IO206NPB3

F5 GND

F6 GND

F7 GND

F8 GCC0/IO91NDB1

F9 GCB0/IO92NPB1

F10 GND

F11 GCA1/IO93PDB1

F12 GCA2/IO94PDB1

144-Pin FBGA

Pin Number A3P1000 Function

G1 GFA1/IO207PPB3

G2 GND

G3 VCCPLF

G4 GFA0/IO207NPB3

G5 GND

G6 GND

G7 GND

G8 GDC1/IO111PPB1

G9 IO96NDB1

G10 GCC2/IO96PDB1

G11 IO95NDB1

G12 GCB2/IO95PDB1

H1 VCC

H2 GFB2/IO205PDB3

H3 GFC2/IO204PSB3

H4 GEC1/IO190PDB3

H5 VCC

H6 IO105PDB1

H7 IO105NDB1

H8 GDB2/IO115RSB2

H9 GDC0/IO111NPB1

H10 VCCIB1

H11 IO101PSB1

H12 VCC

J1 GEB1/IO189PDB3

J2 IO205NDB3

J3 VCCIB3

J4 GEC0/IO190NDB3

J5 IO160RSB2

J6 IO157RSB2

J7 VCC

J8 TCK

J9 GDA2/IO114RSB2

J10 TDO

J11 GDA1/IO113PDB1

J12 GDB1/IO112PDB1

144-Pin FBGA

Pin Number A3P1000 Function

ProASIC3 Packaging

v1.3 3-45

K1 GEB0/IO189NDB3

K2 GEA1/IO188PDB3

K3 GEA0/IO188NDB3

K4 GEA2/IO187RSB2

K5 IO169RSB2

K6 IO152RSB2

K7 GND

K8 IO117RSB2

K9 GDC2/IO116RSB2

K10 GND

K11 GDA0/IO113NDB1

K12 GDB0/IO112NDB1

L1 GND

L2 VMV3

L3 GEB2/IO186RSB2

L4 IO172RSB2

L5 VCCIB2

L6 IO153RSB2

L7 IO144RSB2

L8 IO140RSB2

L9 TMS

L10 VJTAG

L11 VMV2

L12 TRST

M1 GNDQ

M2 GEC2/IO185RSB2

M3 IO173RSB2

M4 IO168RSB2

M5 IO161RSB2

M6 IO156RSB2

M7 IO145RSB2

M8 IO141RSB2

M9 TDI

M10 VCCIB2

M11 VPUMP

M12 GNDQ

144-Pin FBGA

Pin Number A3P1000 Function

Package Pin Assignments

3-46 v1.3

256-Pin FBGA

Note

For Package Manufacturing and Environmental information, visit the Resource Center at

http://www.actel.com/products/solutions/package/docs.aspx.

Note: This is the bottom view of the package.

791113

15 246

101214

A1 Ball Pad Corner

ProASIC3 Packaging

v1.3 3-47

256-Pin FBGA

Pin Number A3P250 Function

A1 GND

A2 GAA0/IO00RSB0

A3 GAA1/IO01RSB0

A4 GAB0/IO02RSB0

A5 IO07RSB0

A6 IO10RSB0

A7 IO11RSB0

A8 IO15RSB0

A9 IO20RSB0

A10 IO25RSB0

A11 IO29RSB0

A12 IO33RSB0

A13 GBB1/IO38RSB0

A14 GBA0/IO39RSB0

A15 GBA1/IO40RSB0

A16 GND

B1 GAB2/IO117UDB3

B2 GAA2/IO118UDB3

B3 NC

B4 GAB1/IO03RSB0

B5 IO06RSB0

B6 IO09RSB0

B7 IO12RSB0

B8 IO16RSB0

B9 IO21RSB0

B10 IO26RSB0

B11 IO30RSB0

B12 GBC1/IO36RSB0

B13 GBB0/IO37RSB0

B14 NC

B15 GBA2/IO41PDB1

B16 IO41NDB1

C1 IO117VDB3

C2 IO118VDB3

C3 NC

C4 NC

C5 GAC0/IO04RSB0

C6 GAC1/IO05RSB0

C7 IO13RSB0

C8 IO17RSB0

C9 IO22RSB0

C10 IO27RSB0

C11 IO31RSB0

C12 GBC0/IO35RSB0

C13 IO34RSB0

C14 NC

C15 IO42NPB1

C16 IO44PDB1

D1 IO114VDB3

D2 IO114UDB3

D3 GAC2/IO116UDB3

D4 NC

D5 GNDQ

D6 IO08RSB0

D7 IO14RSB0

D8 IO18RSB0

D9 IO23RSB0

D10 IO28RSB0

D11 IO32RSB0

D12 GNDQ

D13 NC

D14 GBB2/IO42PPB1

D15 NC

D16 IO44NDB1

E1 IO113PDB3

E2 NC

E3 IO116VDB3

E4 IO115UDB3

E5 VMV0

E6 VCCIB0

E7 VCCIB0

E8 IO19RSB0

256-Pin FBGA

Pin Number A3P250 Function

E9 IO24RSB0

E10 VCCIB0

E11 VCCIB0

E12 VMV1

E13 GBC2/IO43PDB1

E14 IO46RSB1

E15 NC

E16 IO45PDB1

F1 IO113NDB3

F2 IO112PPB3

F3 NC

F4 IO115VDB3

F5 VCCIB3

F6 GND

F7 VCC

F8 VCC

F9 VCC

F10 VCC

F11 GND

F12 VCCIB1

F13 IO43NDB1

F14 NC

F15 IO47PPB1

F16 IO45NDB1

G1 IO111NDB3

G2 IO111PDB3

G3 IO112NPB3

G4 GFC1/IO110PPB3

G5 VCCIB3

G6 VCC

G7 GND

G8 GND

G9 GND

G10 GND

G11 VCC

G12 VCCIB1

256-Pin FBGA

Pin Number A3P250 Function

Package Pin Assignments

3-48 v1.3

G13 GCC1/IO48PPB1

G14 IO47NPB1

G15 IO54PDB1

G16 IO54NDB1

H1 GFB0/IO109NPB3

H2 GFA0/IO108NDB3

H3 GFB1/IO109PPB3

H4 VCOMPLF

H5 GFC0/IO110NPB3

H6 VCC

H7 GND

H8 GND

H9 GND

H10 GND

H11 VCC

H12 GCC0/IO48NPB1

H13 GCB1/IO49PPB1

H14 GCA0/IO50NPB1

H15 NC

H16 GCB0/IO49NPB1

J1 GFA2/IO107PPB3

J2 GFA1/IO108PDB3

J3 VCCPLF

J4 IO106NDB3

J5 GFB2/IO106PDB3

J6 VCC

J7 GND

J8 GND

J9 GND

J10 GND

J11 VCC

J12 GCB2/IO52PPB1

J13 GCA1/IO50PPB1

J14 GCC2/IO53PPB1

J15 NC

J16 GCA2/IO51PDB1

256-Pin FBGA

Pin Number A3P250 Function

K1 GFC2/IO105PDB3

K2 IO107NPB3

K3 IO104PPB3

K4 NC

K5 VCCIB3

K6 VCC

K7 GND

K8 GND

K9 GND

K10 GND

K11 VCC

K12 VCCIB1

K13 IO52NPB1

K14 IO55RSB1

K15 IO53NPB1

K16 IO51NDB1

L1 IO105NDB3

L2 IO104NPB3

L3 NC

L4 IO102RSB3

L5 VCCIB3

L6 GND

L7 VCC

L8 VCC

L9 VCC

L10 VCC

L11 GND

L12 VCCIB1

L13 GDB0/IO59VPB1

L14 IO57VDB1

L15 IO57UDB1

L16 IO56PDB1

M1 IO103PDB3

M2 NC

M3 IO101NPB3

M4 GEC0/IO100NPB3

256-Pin FBGA

Pin Number A3P250 Function

M5 VMV3

M6 VCCIB2

M7 VCCIB2

M8 NC

M9 IO74RSB2

M10 VCCIB2

M11 VCCIB2

M12 VMV2

M13 NC

M14 GDB1/IO59UPB1

M15 GDC1/IO58UDB1

M16 IO56NDB1

N1 IO103NDB3

N2 IO101PPB3

N3 GEC1/IO100PPB3

N4 NC

N5 GNDQ

N6 GEA2/IO97RSB2

N7 IO86RSB2

N8 IO82RSB2

N9 IO75RSB2

N10 IO69RSB2

N11 IO64RSB2

N12 GNDQ

N13 NC

N14 VJTAG

N15 GDC0/IO58VDB1

N16 GDA1/IO60UDB1

P1 GEB1/IO99PDB3

P2 GEB0/IO99NDB3

P3 NC

P4 NC

P5 IO92RSB2

P6 IO89RSB2

P7 IO85RSB2

P8 IO81RSB2

256-Pin FBGA

Pin Number A3P250 Function

ProASIC3 Packaging

v1.3 3-49

P9 IO76RSB2

P10 IO71RSB2

P11 IO66RSB2

P12 NC

P13 TCK

P14 VPUMP

P15 TRST

P16 GDA0/IO60VDB1

R1 GEA1/IO98PDB3

R2 GEA0/IO98NDB3

R3 NC

R4 GEC2/IO95RSB2

R5 IO91RSB2

R6 IO88RSB2

R7 IO84RSB2

R8 IO80RSB2

R9 IO77RSB2

R10 IO72RSB2

R11 IO68RSB2

R12 IO65RSB2

R13 GDB2/IO62RSB2

R14 TDI

R15 NC

R16 TDO

T1 GND

T2 IO94RSB2

T3 GEB2/IO96RSB2

T4 IO93RSB2

T5 IO90RSB2

T6 IO87RSB2

T7 IO83RSB2

T8 IO79RSB2

T9 IO78RSB2

T10 IO73RSB2

T11 IO70RSB2

T12 GDC2/IO63RSB2

256-Pin FBGA

Pin Number A3P250 Function

T13 IO67RSB2

T14 GDA2/IO61RSB2

T15 TMS

T16 GND

256-Pin FBGA

Pin Number A3P250 Function

Package Pin Assignments

3-50 v1.3

256-Pin FBGA

Pin Number A3P400 Function

A1 GND

A2 GAA0/IO00RSB0

A3 GAA1/IO01RSB0

A4 GAB0/IO02RSB0

A5 IO16RSB0

A6 IO17RSB0

A7 IO22RSB0

A8 IO28RSB0

A9 IO34RSB0

A10 IO37RSB0

A11 IO41RSB0

A12 IO43RSB0

A13 GBB1/IO57RSB0

A14 GBA0/IO58RSB0

A15 GBA1/IO59RSB0

A16 GND

B1 GAB2/IO154UDB3

B2 GAA2/IO155UDB3

B3 IO12RSB0

B4 GAB1/IO03RSB0

B5 IO13RSB0

B6 IO14RSB0

B7 IO21RSB0

B8 IO27RSB0

B9 IO32RSB0

B10 IO38RSB0

B11 IO42RSB0

B12 GBC1/IO55RSB0

B13 GBB0/IO56RSB0

B14 IO44RSB0

B15 GBA2/IO60PDB1

B16 IO60NDB1

C1 IO154VDB3

C2 IO155VDB3

C3 IO11RSB0

C4 IO07RSB0

C5 GAC0/IO04RSB0

C6 GAC1/IO05RSB0

C7 IO20RSB0

C8 IO24RSB0

C9 IO33RSB0

C10 IO39RSB0

C11 IO45RSB0

C12 GBC0/IO54RSB0

C13 IO48RSB0

C14 VMV0

C15 IO61NPB1

C16 IO63PDB1

D1 IO151VDB3

D2 IO151UDB3

D3 GAC2/IO153UDB3

D4 IO06RSB0

D5 GNDQ

D6 IO10RSB0

D7 IO19RSB0

D8 IO26RSB0

D9 IO30RSB0

D10 IO40RSB0

D11 IO46RSB0

D12 GNDQ

D13 IO47RSB0

D14 GBB2/IO61PPB1

D15 IO53RSB0

D16 IO63NDB1

E1 IO150PDB3

E2 IO08RSB0

E3 IO153VDB3

E4 IO152VDB3

E5 VMV0

E6 VCCIB0

E7 VCCIB0

E8 IO25RSB0

256-Pin FBGA

Pin Number A3P400 Function

E9 IO31RSB0

E10 VCCIB0

E11 VCCIB0

E12 VMV1

E13 GBC2/IO62PDB1

E14 IO65RSB1

E15 IO52RSB0

E16 IO66PDB1

F1 IO150NDB3

F2 IO149NPB3

F3 IO09RSB0

F4 IO152UDB3

F5 VCCIB3

F6 GND

F7 VCC

F8 VCC

F9 VCC

F10 VCC

F11 GND

F12 VCCIB1

F13 IO62NDB1

F14 IO49RSB0

F15 IO64PPB1

F16 IO66NDB1

G1 IO148NDB3

G2 IO148PDB3

G3 IO149PPB3

G4 GFC1/IO147PPB3

G5 VCCIB3

G6 VCC

G7 GND

G8 GND

G9 GND

G10 GND

G11 VCC

G12 VCCIB1

256-Pin FBGA

Pin Number A3P400 Function

ProASIC3 Packaging

v1.3 3-51

G13 GCC1/IO67PPB1

G14 IO64NPB1

G15 IO73PDB1

G16 IO73NDB1

H1 GFB0/IO146NPB3

H2 GFA0/IO145NDB3

H3 GFB1/IO146PPB3

H4 VCOMPLF

H5 GFC0/IO147NPB3

H6 VCC

H7 GND

H8 GND

H9 GND

H10 GND

H11 VCC

H12 GCC0/IO67NPB1

H13 GCB1/IO68PPB1

H14 GCA0/IO69NPB1

H15 NC

H16 GCB0/IO68NPB1

J1 GFA2/IO144PPB3

J2 GFA1/IO145PDB3

J3 VCCPLF

J4 IO143NDB3

J5 GFB2/IO143PDB3

J6 VCC

J7 GND

J8 GND

J9 GND

J10 GND

J11 VCC

J12 GCB2/IO71PPB1

J13 GCA1/IO69PPB1

J14 GCC2/IO72PPB1

J15 NC

J16 GCA2/IO70PDB1

256-Pin FBGA

Pin Number A3P400 Function

K1 GFC2/IO142PDB3

K2 IO144NPB3

K3 IO141PPB3

K4 IO120RSB2

K5 VCCIB3

K6 VCC

K7 GND

K8 GND

K9 GND

K10 GND

K11 VCC

K12 VCCIB1

K13 IO71NPB1

K14 IO74RSB1

K15 IO72NPB1

K16 IO70NDB1

L1 IO142NDB3

L2 IO141NPB3

L3 IO125RSB2

L4 IO139RSB3

L5 VCCIB3

L6 GND

L7 VCC

L8 VCC

L9 VCC

L10 VCC

L11 GND

L12 VCCIB1

L13 GDB0/IO78VPB1

L14 IO76VDB1

L15 IO76UDB1

L16 IO75PDB1

M1 IO140PDB3

M2 IO130RSB2

M3 IO138NPB3

M4 GEC0/IO137NPB3

256-Pin FBGA

Pin Number A3P400 Function

M5 VMV3

M6 VCCIB2

M7 VCCIB2

M8 IO108RSB2

M9 IO101RSB2

M10 VCCIB2

M11 VCCIB2

M12 VMV2

M13 IO83RSB2

M14 GDB1/IO78UPB1

M15 GDC1/IO77UDB1

M16 IO75NDB1

N1 IO140NDB3

N2 IO138PPB3

N3 GEC1/IO137PPB3

N4 IO131RSB2

N5 GNDQ

N6 GEA2/IO134RSB2

N7 IO117RSB2

N8 IO111RSB2

N9 IO99RSB2

N10 IO94RSB2

N11 IO87RSB2

N12 GNDQ

N13 IO93RSB2

N14 VJTAG

N15 GDC0/IO77VDB1

N16 GDA1/IO79UDB1

P1 GEB1/IO136PDB3

P2 GEB0/IO136NDB3

P3 VMV2

P4 IO129RSB2

P5 IO128RSB2

P6 IO122RSB2

P7 IO115RSB2

P8 IO110RSB2

256-Pin FBGA

Pin Number A3P400 Function

Package Pin Assignments

3-52 v1.3

P9 IO98RSB2

P10 IO95RSB2

P11 IO88RSB2

P12 IO84RSB2

P13 TCK

P14 VPUMP

P15 TRST

P16 GDA0/IO79VDB1

R1 GEA1/IO135PDB3

R2 GEA0/IO135NDB3

R3 IO127RSB2

R4 GEC2/IO132RSB2

R5 IO123RSB2

R6 IO118RSB2

R7 IO112RSB2

R8 IO106RSB2

R9 IO100RSB2

R10 IO96RSB2

R11 IO89RSB2

R12 IO85RSB2

R13 GDB2/IO81RSB2

R14 TDI

R15 NC

R16 TDO

T1 GND

T2 IO126RSB2

T3 GEB2/IO133RSB2

T4 IO124RSB2

T5 IO116RSB2

T6 IO113RSB2

T7 IO107RSB2

T8 IO105RSB2

T9 IO102RSB2

T10 IO97RSB2

T11 IO92RSB2

T12 GDC2/IO82RSB2

256-Pin FBGA

Pin Number A3P400 Function

T13 IO86RSB2

T14 GDA2/IO80RSB2

T15 TMS

T16 GND

256-Pin FBGA

Pin Number A3P400 Function

ProASIC3 Packaging

v1.3 3-53

256-Pin FBGA

Pin Number A3P600 Function

A1 GND

A2 GAA0/IO00RSB0

A3 GAA1/IO01RSB0

A4 GAB0/IO02RSB0

A5 IO11RSB0

A6 IO16RSB0

A7 IO18RSB0

A8 IO28RSB0

A9 IO34RSB0

A10 IO37RSB0

A11 IO41RSB0

A12 IO43RSB0

A13 GBB1/IO57RSB0

A14 GBA0/IO58RSB0

A15 GBA1/IO59RSB0

A16 GND

B1 GAB2/IO173PDB3

B2 GAA2/IO174PDB3

B3 GNDQ

B4 GAB1/IO03RSB0

B5 IO13RSB0

B6 IO14RSB0

B7 IO21RSB0

B8 IO27RSB0

B9 IO32RSB0

B10 IO38RSB0

B11 IO42RSB0

B12 GBC1/IO55RSB0

B13 GBB0/IO56RSB0

B14 IO52RSB0

B15 GBA2/IO60PDB1

B16 IO60NDB1

C1 IO173NDB3

C2 IO174NDB3

C3 VMV3

C4 IO07RSB0

C5 GAC0/IO04RSB0

C6 GAC1/IO05RSB0

C7 IO20RSB0

C8 IO24RSB0

C9 IO33RSB0

C10 IO39RSB0

C11 IO44RSB0

C12 GBC0/IO54RSB0

C13 IO51RSB0

C14 VMV0

C15 IO61NPB1

C16 IO63PDB1

D1 IO171NDB3

D2 IO171PDB3

D3 GAC2/IO172PDB3

D4 IO06RSB0

D5 GNDQ

D6 IO10RSB0

D7 IO19RSB0

D8 IO26RSB0

D9 IO30RSB0

D10 IO40RSB0

D11 IO45RSB0

D12 GNDQ

D13 IO50RSB0

D14 GBB2/IO61PPB1

D15 IO53RSB0

D16 IO63NDB1

E1 IO166PDB3

E2 IO167NPB3

E3 IO172NDB3

E4 IO169NDB3

E5 VMV0

E6 VCCIB0

E7 VCCIB0

E8 IO25RSB0

256-Pin FBGA

Pin Number A3P600 Function

E9 IO31RSB0

E10 VCCIB0

E11 VCCIB0

E12 VMV1

E13 GBC2/IO62PDB1

E14 IO67PPB1

E15 IO64PPB1

E16 IO66PDB1

F1 IO166NDB3

F2 IO168NPB3

F3 IO167PPB3

F4 IO169PDB3

F5 VCCIB3

F6 GND

F7 VCC

F8 VCC

F9 VCC

F10 VCC

F11 GND

F12 VCCIB1

F13 IO62NDB1

F14 IO64NPB1

F15 IO65PPB1

F16 IO66NDB1

G1 IO165NDB3

G2 IO165PDB3

G3 IO168PPB3

G4 GFC1/IO164PPB3

G5 VCCIB3

G6 VCC

G7 GND

G8 GND

G9 GND

G10 GND

G11 VCC

G12 VCCIB1

256-Pin FBGA

Pin Number A3P600 Function

Package Pin Assignments

3-54 v1.3

G13 GCC1/IO69PPB1

G14 IO65NPB1

G15 IO75PDB1

G16 IO75NDB1

H1 GFB0/IO163NPB3

H2 GFA0/IO162NDB3

H3 GFB1/IO163PPB3

H4 VCOMPLF

H5 GFC0/IO164NPB3

H6 VCC

H7 GND

H8 GND

H9 GND

H10 GND

H11 VCC

H12 GCC0/IO69NPB1

H13 GCB1/IO70PPB1

H14 GCA0/IO71NPB1

H15 IO67NPB1

H16 GCB0/IO70NPB1

J1 GFA2/IO161PPB3

J2 GFA1/IO162PDB3

J3 VCCPLF

J4 IO160NDB3

J5 GFB2/IO160PDB3

J6 VCC

J7 GND

J8 GND

J9 GND

J10 GND

J11 VCC

J12 GCB2/IO73PPB1

J13 GCA1/IO71PPB1

J14 GCC2/IO74PPB1

J15 IO80PPB1

J16 GCA2/IO72PDB1

256-Pin FBGA

Pin Number A3P600 Function

K1 GFC2/IO159PDB3

K2 IO161NPB3

K3 IO156PPB3

K4 IO129RSB2

K5 VCCIB3

K6 VCC

K7 GND

K8 GND

K9 GND

K10 GND

K11 VCC

K12 VCCIB1

K13 IO73NPB1

K14 IO80NPB1

K15 IO74NPB1

K16 IO72NDB1

L1 IO159NDB3

L2 IO156NPB3

L3 IO151PPB3

L4 IO158PSB3

L5 VCCIB3

L6 GND

L7 VCC

L8 VCC

L9 VCC

L10 VCC

L11 GND

L12 VCCIB1

L13 GDB0/IO87NPB1

L14 IO85NDB1

L15 IO85PDB1

L16 IO84PDB1

M1 IO150PDB3

M2 IO151NPB3

M3 IO147NPB3

M4 GEC0/IO146NPB3

256-Pin FBGA

Pin Number A3P600 Function

M5 VMV3

M6 VCCIB2

M7 VCCIB2

M8 IO117RSB2

M9 IO110RSB2

M10 VCCIB2

M11 VCCIB2

M12 VMV2

M13 IO94RSB2

M14 GDB1/IO87PPB1

M15 GDC1/IO86PDB1

M16 IO84NDB1

N1 IO150NDB3

N2 IO147PPB3

N3 GEC1/IO146PPB3

N4 IO140RSB2

N5 GNDQ

N6 GEA2/IO143RSB2

N7 IO126RSB2

N8 IO120RSB2

N9 IO108RSB2

N10 IO103RSB2

N11 IO99RSB2

N12 GNDQ

N13 IO92RSB2

N14 VJTAG

N15 GDC0/IO86NDB1

N16 GDA1/IO88PDB1

P1 GEB1/IO145PDB3

P2 GEB0/IO145NDB3

P3 VMV2

P4 IO138RSB2

P5 IO136RSB2

P6 IO131RSB2

P7 IO124RSB2

P8 IO119RSB2

256-Pin FBGA

Pin Number A3P600 Function

ProASIC3 Packaging

v1.3 3-55

P9 IO107RSB2

P10 IO104RSB2

P11 IO97RSB2

P12 VMV1

P13 TCK

P14 VPUMP

P15 TRST

P16 GDA0/IO88NDB1

R1 GEA1/IO144PDB3

R2 GEA0/IO144NDB3

R3 IO139RSB2

R4 GEC2/IO141RSB2

R5 IO132RSB2

R6 IO127RSB2

R7 IO121RSB2

R8 IO114RSB2

R9 IO109RSB2

R10 IO105RSB2

R11 IO98RSB2

R12 IO96RSB2

R13 GDB2/IO90RSB2

R14 TDI

R15 GNDQ

R16 TDO

T1 GND

T2 IO137RSB2

T3 GEB2/IO142RSB2

T4 IO134RSB2

T5 IO125RSB2

T6 IO123RSB2

T7 IO118RSB2

T8 IO115RSB2

T9 IO111RSB2

T10 IO106RSB2

T11 IO102RSB2

T12 GDC2/IO91RSB2

256-Pin FBGA

Pin Number A3P600 Function

T13 IO93RSB2

T14 GDA2/IO89RSB2

T15 TMS

T16 GND

256-Pin FBGA

Pin Number A3P600 Function

Package Pin Assignments

3-56 v1.3

256-Pin FBGA

Pin Number A3P1000 Function

A1 GND

A2 GAA0/IO00RSB0

A3 GAA1/IO01RSB0

A4 GAB0/IO02RSB0

A5 IO16RSB0

A6 IO22RSB0

A7 IO28RSB0

A8 IO35RSB0

A9 IO45RSB0

A10 IO50RSB0

A11 IO55RSB0

A12 IO61RSB0

A13 GBB1/IO75RSB0

A14 GBA0/IO76RSB0

A15 GBA1/IO77RSB0

A16 GND

B1 GAB2/IO224PDB3

B2 GAA2/IO225PDB3

B3 GNDQ

B4 GAB1/IO03RSB0

B5 IO17RSB0

B6 IO21RSB0

B7 IO27RSB0

B8 IO34RSB0

B9 IO44RSB0

B10 IO51RSB0

B11 IO57RSB0

B12 GBC1/IO73RSB0

B13 GBB0/IO74RSB0

B14 IO71RSB0

B15 GBA2/IO78PDB1

B16 IO81PDB1

C1 IO224NDB3

C2 IO225NDB3

C3 VMV3

C4 IO11RSB0

C5 GAC0/IO04RSB0

C6 GAC1/IO05RSB0

C7 IO25RSB0

C8 IO36RSB0

C9 IO42RSB0

C10 IO49RSB0

C11 IO56RSB0

C12 GBC0/IO72RSB0

C13 IO62RSB0

C14 VMV0

C15 IO78NDB1

C16 IO81NDB1

D1 IO222NDB3

D2 IO222PDB3

D3 GAC2/IO223PDB3

D4 IO223NDB3

D5 GNDQ

D6 IO23RSB0

D7 IO29RSB0

D8 IO33RSB0

D9 IO46RSB0

D10 IO52RSB0

D11 IO60RSB0

D12 GNDQ

D13 IO80NDB1

D14 GBB2/IO79PDB1

D15 IO79NDB1

D16 IO82NSB1

E1 IO217PDB3

E2 IO218PDB3

E3 IO221NDB3

E4 IO221PDB3

E5 VMV0

E6 VCCIB0

E7 VCCIB0

E8 IO38RSB0

E9 IO47RSB0

E10 VCCIB0

E11 VCCIB0

E12 VMV1

256-Pin FBGA

Pin Number A3P1000 Function

E13 GBC2/IO80PDB1

E14 IO83PPB1

E15 IO86PPB1

E16 IO87PDB1

F1 IO217NDB3

F2 IO218NDB3

F3 IO216PDB3

F4 IO216NDB3

F5 VCCIB3

F6 GND

F7 VCC

F8 VCC

F9 VCC

F10 VCC

F11 GND

F12 VCCIB1

F13 IO83NPB1

F14 IO86NPB1

F15 IO90PPB1

F16 IO87NDB1

G1 IO210PSB3

G2 IO213NDB3

G3 IO213PDB3

G4 GFC1/IO209PPB3

G5 VCCIB3

G6 VCC

G7 GND

G8 GND

G9 GND

G10 GND

G11 VCC

G12 VCCIB1

G13 GCC1/IO91PPB1

G14 IO90NPB1

G15 IO88PDB1

G16 IO88NDB1

H1 GFB0/IO208NPB3

H2 GFA0/IO207NDB3

256-Pin FBGA

Pin Number A3P1000 Function

ProASIC3 Packaging

v1.3 3-57

H3 GFB1/IO208PPB3

H4 VCOMPLF

H5 GFC0/IO209NPB3

H6 VCC

H7 GND

H8 GND

H9 GND

H10 GND

H11 VCC

H12 GCC0/IO91NPB1

H13 GCB1/IO92PPB1

H14 GCA0/IO93NPB1

H15 IO96NPB1

H16 GCB0/IO92NPB1

J1 GFA2/IO206PSB3

J2 GFA1/IO207PDB3

J3 VCCPLF

J4 IO205NDB3

J5 GFB2/IO205PDB3

J6 VCC

J7 GND

J8 GND

J9 GND

J10 GND

J11 VCC

J12 GCB2/IO95PPB1

J13 GCA1/IO93PPB1

J14 GCC2/IO96PPB1

J15 IO100PPB1

J16 GCA2/IO94PSB1

K1 GFC2/IO204PDB3

K2 IO204NDB3

K3 IO203NDB3

K4 IO203PDB3

K5 VCCIB3

K6 VCC

K7 GND

K8 GND

256-Pin FBGA

Pin Number A3P1000 Function

K9 GND

K10 GND

K11 VCC

K12 VCCIB1

K13 IO95NPB1

K14 IO100NPB1

K15 IO102NDB1

K16 IO102PDB1

L1 IO202NDB3

L2 IO202PDB3

L3 IO196PPB3

L4 IO193PPB3

L5 VCCIB3

L6 GND

L7 VCC

L8 VCC

L9 VCC

L10 VCC

L11 GND

L12 VCCIB1

L13 GDB0/IO112NPB1

L14 IO106NDB1

L15 IO106PDB1

L16 IO107PDB1

M1 IO197NSB3

M2 IO196NPB3

M3 IO193NPB3

M4 GEC0/IO190NPB3

M5 VMV3

M6 VCCIB2

M7 VCCIB2

M8 IO147RSB2

M9 IO136RSB2

M10 VCCIB2

M11 VCCIB2

M12 VMV2

M13 IO110NDB1

M14 GDB1/IO112PPB1

256-Pin FBGA

Pin Number A3P1000 Function

M15 GDC1/IO111PDB1

M16 IO107NDB1

N1 IO194PSB3

N2 IO192PPB3

N3 GEC1/IO190PPB3

N4 IO192NPB3

N5 GNDQ

N6 GEA2/IO187RSB2

N7 IO161RSB2

N8 IO155RSB2

N9 IO141RSB2

N10 IO129RSB2

N11 IO124RSB2

N12 GNDQ

N13 IO110PDB1

N14 VJTAG

N15 GDC0/IO111NDB1

N16 GDA1/IO113PDB1

P1 GEB1/IO189PDB3

P2 GEB0/IO189NDB3

P3 VMV2

P4 IO179RSB2

P5 IO171RSB2

P6 IO165RSB2

P7 IO159RSB2

P8 IO151RSB2

P9 IO137RSB2

P10 IO134RSB2

P11 IO128RSB2

P12 VMV1

P13 TCK

P14 VPUMP

P15 TRST

P16 GDA0/IO113NDB1

R1 GEA1/IO188PDB3

R2 GEA0/IO188NDB3

R3 IO184RSB2

R4 GEC2/IO185RSB2

256-Pin FBGA

Pin Number A3P1000 Function

Package Pin Assignments

3-58 v1.3

R5 IO168RSB2

R6 IO163RSB2

R7 IO157RSB2

R8 IO149RSB2

R9 IO143RSB2

R10 IO138RSB2

R11 IO131RSB2

R12 IO125RSB2

R13 GDB2/IO115RSB2

R14 TDI

R15 GNDQ

R16 TDO

T1 GND

T2 IO183RSB2

T3 GEB2/IO186RSB2

T4 IO172RSB2

T5 IO170RSB2

T6 IO164RSB2

T7 IO158RSB2

T8 IO153RSB2

T9 IO142RSB2

T10 IO135RSB2

T11 IO130RSB2

T12 GDC2/IO116RSB2

T13 IO120RSB2

T14 GDA2/IO114RSB2

T15 TMS

T16 GND

256-Pin FBGA

Pin Number A3P1000 Function

ProASIC3 Packaging

v1.3 3-59

484-Pin FBGA

Note

For Package Manufacturing and Environmental information, visit the Resource Center at

http://www.actel.com/products/solutions/package/docs.aspx.

Note: This is the bottom view of the package.

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A1 Ball Pad Corner

Package Pin Assignments

3-60 v1.3

484-Pin FBGA

Pin Number A3P400 Function

A1 GND

A2 GND

A3 VCCIB0

A4 NC

A5 NC

A6 IO15RSB0

A7 IO18RSB0

A8 NC

A9 NC

A10 IO23RSB0

A11 IO29RSB0

A12 IO35RSB0

A13 IO36RSB0

A14 NC

A15 NC

A16 IO50RSB0

A17 IO51RSB0

A18 NC

A19 NC

A20 VCCIB0

A21 GND

A22 GND

B1 GND

B2 VCCIB3

B3 NC

B4 NC

B5 NC

B6 NC

B7 NC

B8 NC

B9 NC

B10 NC

B11 NC

B12 NC

B13 NC

B14 NC

B15 NC

B16 NC

B17 NC

B18 NC

B19 NC

B20 NC

B21 VCCIB1

B22 GND

C1 VCCIB3

C2 NC

C3 NC

C4 NC

C5 GND

C6 NC

C7 NC

C8 VCC

C9 VCC

C10 NC

C11 NC

C12 NC

C13 NC

C14 VCC

C15 VCC

C16 NC

C17 NC

C18 GND

C19 NC

C20 NC

C21 NC

C22 VCCIB1

D1 NC

D2 NC

D3 NC

D4 GND

D5 GAA0/IO00RSB0

D6 GAA1/IO01RSB0

484-Pin FBGA

Pin Number A3P400 Function

D7 GAB0/IO02RSB0

D8 IO16RSB0

D9 IO17RSB0

D10 IO22RSB0

D11 IO28RSB0

D12 IO34RSB0

D13 IO37RSB0

D14 IO41RSB0

D15 IO43RSB0

D16 GBB1/IO57RSB0

D17 GBA0/IO58RSB0

D18 GBA1/IO59RSB0

D19 GND

D20 NC

D21 NC

D22 NC

E1 NC

E2 NC

E3 GND

E4 GAB2/IO154UDB3

E5 GAA2/IO155UDB3

E6 IO12RSB0

E7 GAB1/IO03RSB0

E8 IO13RSB0

E9 IO14RSB0

E10 IO21RSB0

E11 IO27RSB0

E12 IO32RSB0

E13 IO38RSB0

E14 IO42RSB0

E15 GBC1/IO55RSB0

E16 GBB0/IO56RSB0

E17 IO44RSB0

E18 GBA2/IO60PDB1

E19 IO60NDB1

E20 GND

484-Pin FBGA

Pin Number A3P400 Function

ProASIC3 Packaging

v1.3 3-61

E21 NC

E22 NC

F1 NC

F2 NC

F3 NC

F4 IO154VDB3

F5 IO155VDB3

F6 IO11RSB0

F7 IO07RSB0

F8 GAC0/IO04RSB0

F9 GAC1/IO05RSB0

F10 IO20RSB0

F11 IO24RSB0

F12 IO33RSB0

F13 IO39RSB0

F14 IO45RSB0

F15 GBC0/IO54RSB0

F16 IO48RSB0

F17 VMV0

F18 IO61NPB1

F19 IO63PDB1

F20 NC

F21 NC

F22 NC

G1 NC

G2 NC

G3 NC

G4 IO151VDB3

G5 IO151UDB3

G6 GAC2/IO153UDB3

G7 IO06RSB0

G8 GNDQ

G9 IO10RSB0

G10 IO19RSB0

G11 IO26RSB0

G12 IO30RSB0

484-Pin FBGA

Pin Number A3P400 Function

G13 IO40RSB0

G14 IO46RSB0

G15 GNDQ

G16 IO47RSB0

G17 GBB2/IO61PPB1

G18 IO53RSB0

G19 IO63NDB1

G20 NC

G21 NC

G22 NC

H1 NC

H2 NC

H3 VCC

H4 IO150PDB3

H5 IO08RSB0

H6 IO153VDB3

H7 IO152VDB3

H8 VMV0

H9 VCCIB0

H10 VCCIB0

H11 IO25RSB0

H12 IO31RSB0

H13 VCCIB0

H14 VCCIB0

H15 VMV1

H16 GBC2/IO62PDB1

H17 IO65RSB1

H18 IO52RSB0

H19 IO66PDB1

H20 VCC

H21 NC

H22 NC

J1 NC

J2 NC

J3 NC

J4 IO150NDB3

484-Pin FBGA

Pin Number A3P400 Function

J5 IO149NPB3

J6 IO09RSB0

J7 IO152UDB3

J8 VCCIB3

J9 GND

J10 VCC

J11 VCC

J12 VCC

J13 VCC

J14 GND

J15 VCCIB1

J16 IO62NDB1

J17 IO49RSB0

J18 IO64PPB1

J19 IO66NDB1

J20 NC

J21 NC

J22 NC

K1 NC

K2 NC

K3 NC

K4 IO148NDB3

K5 IO148PDB3

K6 IO149PPB3

K7 GFC1/IO147PPB3

K8 VCCIB3

K9 VCC

K10 GND

K11 GND

K12 GND

K13 GND

K14 VCC

K15 VCCIB1

K16 GCC1/IO67PPB1

K17 IO64NPB1

K18 IO73PDB1

484-Pin FBGA

Pin Number A3P400 Function

Package Pin Assignments

3-62 v1.3

K19 IO73NDB1

K20 NC

K21 NC

K22 NC

L1 NC

L2 NC

L3 NC

L4 GFB0/IO146NPB3

L5 GFA0/IO145NDB3

L6 GFB1/IO146PPB3

L7 VCOMPLF

L8 GFC0/IO147NPB3

L9 VCC

L10 GND

L11 GND

L12 GND

L13 GND

L14 VCC

L15 GCC0/IO67NPB1

L16 GCB1/IO68PPB1

L17 GCA0/IO69NPB1

L18 NC

L19 GCB0/IO68NPB1

L20 NC

L21 NC

L22 NC

M1 NC

M2 NC

M3 NC

M4 GFA2/IO144PPB3

M5 GFA1/IO145PDB3

M6 VCCPLF

M7 IO143NDB3

M8 GFB2/IO143PDB3

M9 VCC

M10 GND

484-Pin FBGA

Pin Number A3P400 Function

M11 GND

M12 GND

M13 GND

M14 VCC

M15 GCB2/IO71PPB1

M16 GCA1/IO69PPB1

M17 GCC2/IO72PPB1

M18 NC

M19 GCA2/IO70PDB1

M20 NC

M21 NC

M22 NC

N1 NC

N2 NC

N3 NC

N4 GFC2/IO142PDB3

N5 IO144NPB3

N6 IO141PPB3

N7 IO120RSB2

N8 VCCIB3

N9 VCC

N10 GND

N11 GND

N12 GND

N13 GND

N14 VCC

N15 VCCIB1

N16 IO71NPB1

N17 IO74RSB1

N18 IO72NPB1

N19 IO70NDB1

N20 NC

N21 NC

N22 NC

P1 NC

P2 NC

484-Pin FBGA

Pin Number A3P400 Function

P3 NC

P4 IO142NDB3

P5 IO141NPB3

P6 IO125RSB2

P7 IO139RSB3

P8 VCCIB3

P9 GND

P10 VCC

P11 VCC

P12 VCC

P13 VCC

P14 GND

P15 VCCIB1

P16 GDB0/IO78VPB1

P17 IO76VDB1

P18 IO76UDB1

P19 IO75PDB1

P20 NC

P21 NC

P22 NC

R1 NC

R2 NC

R3 VCC

R4 IO140PDB3

R5 IO130RSB2

R6 IO138NPB3

R7 GEC0/IO137NPB3

R8 VMV3

R9 VCCIB2

R10 VCCIB2

R11 IO108RSB2

R12 IO101RSB2

R13 VCCIB2

R14 VCCIB2

R15 VMV2

R16 IO83RSB2

484-Pin FBGA

Pin Number A3P400 Function

ProASIC3 Packaging

v1.3 3-63

R17 GDB1/IO78UPB1

R18 GDC1/IO77UDB1

R19 IO75NDB1

R20 VCC

R21 NC

R22 NC

T1 NC

T2 NC

T3 NC

T4 IO140NDB3

T5 IO138PPB3

T6 GEC1/IO137PPB3

T7 IO131RSB2

T8 GNDQ

T9 GEA2/IO134RSB2

T10 IO117RSB2

T11 IO111RSB2

T12 IO99RSB2

T13 IO94RSB2

T14 IO87RSB2

T15 GNDQ

T16 IO93RSB2

T17 VJTAG

T18 GDC0/IO77VDB1

T19 GDA1/IO79UDB1

T20 NC

T21 NC

T22 NC

U1 NC

U2 NC

U3 NC

U4 GEB1/IO136PDB3

U5 GEB0/IO136NDB3

U6 VMV2

U7 IO129RSB2

U8 IO128RSB2

484-Pin FBGA

Pin Number A3P400 Function

U9 IO122RSB2

U10 IO115RSB2

U11 IO110RSB2

U12 IO98RSB2

U13 IO95RSB2

U14 IO88RSB2

U15 IO84RSB2

U16 TCK

U17 VPUMP

U18 TRST

U19 GDA0/IO79VDB1

U20 NC

U21 NC

U22 NC

V1 NC

V2 NC

V3 GND

V4 GEA1/IO135PDB3

V5 GEA0/IO135NDB3

V6 IO127RSB2

V7 GEC2/IO132RSB2

V8 IO123RSB2

V9 IO118RSB2

V10 IO112RSB2

V11 IO106RSB2

V12 IO100RSB2

V13 IO96RSB2

V14 IO89RSB2

V15 IO85RSB2

V16 GDB2/IO81RSB2

V17 TDI

V18 NC

V19 TDO

V20 GND

V21 NC

V22 NC

484-Pin FBGA

Pin Number A3P400 Function

W1 NC

W2 NC

W3 NC

W4 GND

W5 IO126RSB2

W6 GEB2/IO133RSB2

W7 IO124RSB2

W8 IO116RSB2

W9 IO113RSB2

W10 IO107RSB2

W11 IO105RSB2

W12 IO102RSB2

W13 IO97RSB2

W14 IO92RSB2

W15 GDC2/IO82RSB2

W16 IO86RSB2

W17 GDA2/IO80RSB2

W18 TMS

W19 GND

W20 NC

W21 NC

W22 NC

Y1 VCCIB3

Y2 NC

Y3 NC

Y4 NC

Y5 GND

Y6 NC

Y7 NC

Y8 VCC

Y9 VCC

Y10 NC

Y11 NC

Y12 NC

Y13 NC

Y14 VCC

484-Pin FBGA

Pin Number A3P400 Function

Package Pin Assignments

3-64 v1.3

Y15 VCC

Y16 NC

Y17 NC

Y18 GND

Y19 NC

Y20 NC

Y21 NC

Y22 VCCIB1

AA1 GND

AA2 VCCIB3

AA3 NC

AA4 NC

AA5 NC

AA6 NC

AA7 NC

AA8 NC

AA9 NC

AA10 NC

AA11 NC

AA12 NC

AA13 NC

AA14 NC

AA15 NC

AA16 NC

AA17 NC

AA18 NC

AA19 NC

AA20 NC

AA21 VCCIB1

AA22 GND

AB1 GND

AB2 GND

AB3 VCCIB2

AB4 NC

AB5 NC

AB6 IO121RSB2

484-Pin FBGA

Pin Number A3P400 Function

AB7 IO119RSB2

AB8 IO114RSB2

AB9 IO109RSB2

AB10 NC

AB11 NC

AB12 IO104RSB2

AB13 IO103RSB2

AB14 NC

AB15 NC

AB16 IO91RSB2

AB17 IO90RSB2

AB18 NC

AB19 NC

AB20 VCCIB2

AB21 GND

AB22 GND

484-Pin FBGA

Pin Number A3P400 Function

ProASIC3 Packaging

v1.3 3-65

484-Pin FBGA

Pin Number A3P600 Function

A1 GND

A2 GND

A3 VCCIB0

A4 NC

A5 NC

A6 IO09RSB0

A7 IO15RSB0

A8 NC

A9 NC

A10 IO22RSB0

A11 IO23RSB0

A12 IO29RSB0

A13 IO35RSB0

A14 NC

A15 NC

A16 IO46RSB0

A17 IO48RSB0

A18 NC

A19 NC

A20 VCCIB0

A21 GND

A22 GND

B1 GND

B2 VCCIB3

B3 NC

B4 NC

B5 NC

B6 IO08RSB0

B7 IO12RSB0

B8 NC

B9 NC

B10 IO17RSB0

B11 NC

B12 NC

B13 IO36RSB0

B14 NC

B15 NC

B16 IO47RSB0

B17 IO49RSB0

B18 NC

B19 NC

B20 NC

B21 VCCIB1

B22 GND

C1 VCCIB3

C2 NC

C3 NC

C4 NC

C5 GND

C6 NC

C7 NC

C8 VCC

C9 VCC

C10 NC

C11 NC

C12 NC

C13 NC

C14 VCC

C15 VCC

C16 NC

C17 NC

C18 GND

C19 NC

C20 NC

C21 NC

C22 VCCIB1

D1 NC

D2 NC

D3 NC

D4 GND

D5 GAA0/IO00RSB0

D6 GAA1/IO01RSB0

484-Pin FBGA

Pin Number A3P600 Function

D7 GAB0/IO02RSB0

D8 IO11RSB0

D9 IO16RSB0

D10 IO18RSB0

D11 IO28RSB0

D12 IO34RSB0

D13 IO37RSB0

D14 IO41RSB0

D15 IO43RSB0

D16 GBB1/IO57RSB0

D17 GBA0/IO58RSB0

D18 GBA1/IO59RSB0

D19 GND

D20 NC

D21 NC

D22 NC

E1 NC

E2 NC

E3 GND

E4 GAB2/IO173PDB3

E5 GAA2/IO174PDB3

E6 GNDQ

E7 GAB1/IO03RSB0

E8 IO13RSB0

E9 IO14RSB0

E10 IO21RSB0

E11 IO27RSB0

E12 IO32RSB0

E13 IO38RSB0

E14 IO42RSB0

E15 GBC1/IO55RSB0

E16 GBB0/IO56RSB0

E17 IO52RSB0

E18 GBA2/IO60PDB1

E19 IO60NDB1

E20 GND

484-Pin FBGA

Pin Number A3P600 Function

Package Pin Assignments

3-66 v1.3

E21 NC

E22 NC

F1 NC

F2 NC

F3 NC

F4 IO173NDB3

F5 IO174NDB3

F6 VMV3

F7 IO07RSB0

F8 GAC0/IO04RSB0

F9 GAC1/IO05RSB0

F10 IO20RSB0

F11 IO24RSB0

F12 IO33RSB0

F13 IO39RSB0

F14 IO44RSB0

F15 GBC0/IO54RSB0

F16 IO51RSB0

F17 VMV0

F18 IO61NPB1

F19 IO63PDB1

F20 NC

F21 NC

F22 NC

G1 IO170NDB3

G2 IO170PDB3

G3 NC

G4 IO171NDB3

G5 IO171PDB3

G6 GAC2/IO172PDB3

G7 IO06RSB0

G8 GNDQ

G9 IO10RSB0

G10 IO19RSB0

G11 IO26RSB0

G12 IO30RSB0

484-Pin FBGA

Pin Number A3P600 Function

G13 IO40RSB0

G14 IO45RSB0

G15 GNDQ

G16 IO50RSB0

G17 GBB2/IO61PPB1

G18 IO53RSB0

G19 IO63NDB1

G20 NC

G21 NC

G22 NC

H1 NC

H2 NC

H3 VCC

H4 IO166PDB3

H5 IO167NPB3

H6 IO172NDB3

H7 IO169NDB3

H8 VMV0

H9 VCCIB0

H10 VCCIB0

H11 IO25RSB0

H12 IO31RSB0

H13 VCCIB0

H14 VCCIB0

H15 VMV1

H16 GBC2/IO62PDB1

H17 IO67PPB1

H18 IO64PPB1

H19 IO66PDB1

H20 VCC

H21 NC

H22 NC

J1 NC

J2 NC

J3 NC

J4 IO166NDB3

484-Pin FBGA

Pin Number A3P600 Function

J5 IO168NPB3

J6 IO167PPB3

J7 IO169PDB3

J8 VCCIB3

J9 GND

J10 VCC

J11 VCC

J12 VCC

J13 VCC

J14 GND

J15 VCCIB1

J16 IO62NDB1

J17 IO64NPB1

J18 IO65PPB1

J19 IO66NDB1

J20 NC

J21 IO68PDB1

J22 IO68NDB1

K1 IO157PDB3

K2 IO157NDB3

K3 NC

K4 IO165NDB3

K5 IO165PDB3

K6 IO168PPB3

K7 GFC1/IO164PPB3

K8 VCCIB3

K9 VCC

K10 GND

K11 GND

K12 GND

K13 GND

K14 VCC

K15 VCCIB1

K16 GCC1/IO69PPB1

K17 IO65NPB1

K18 IO75PDB1

484-Pin FBGA

Pin Number A3P600 Function

ProASIC3 Packaging

v1.3 3-67

K19 IO75NDB1

K20 NC

K21 IO76NDB1

K22 IO76PDB1

L1 NC

L2 IO155PDB3

L3 NC

L4 GFB0/IO163NPB3

L5 GFA0/IO162NDB3

L6 GFB1/IO163PPB3

L7 VCOMPLF

L8 GFC0/IO164NPB3

L9 VCC

L10 GND

L11 GND

L12 GND

L13 GND

L14 VCC

L15 GCC0/IO69NPB1

L16 GCB1/IO70PPB1

L17 GCA0/IO71NPB1

L18 IO67NPB1

L19 GCB0/IO70NPB1

L20 IO77PDB1

L21 IO77NDB1

L22 IO78NPB1

M1 NC

M2 IO155NDB3

M3 IO158NPB3

M4 GFA2/IO161PPB3

M5 GFA1/IO162PDB3

M6 VCCPLF

M7 IO160NDB3

M8 GFB2/IO160PDB3

M9 VCC

M10 GND

484-Pin FBGA

Pin Number A3P600 Function

M11 GND

M12 GND

M13 GND

M14 VCC

M15 GCB2/IO73PPB1

M16 GCA1/IO71PPB1

M17 GCC2/IO74PPB1

M18 IO80PPB1

M19 GCA2/IO72PDB1

M20 IO79PPB1

M21 IO78PPB1

M22 NC

N1 IO154NDB3

N2 IO154PDB3

N3 NC

N4 GFC2/IO159PDB3

N5 IO161NPB3

N6 IO156PPB3

N7 IO129RSB2

N8 VCCIB3

N9 VCC

N10 GND

N11 GND

N12 GND

N13 GND

N14 VCC

N15 VCCIB1

N16 IO73NPB1

N17 IO80NPB1

N18 IO74NPB1

N19 IO72NDB1

N20 NC

N21 IO79NPB1

N22 NC

P1 NC

P2 IO153PDB3

484-Pin FBGA

Pin Number A3P600 Function

P3 IO153NDB3

P4 IO159NDB3

P5 IO156NPB3

P6 IO151PPB3

P7 IO158PPB3

P8 VCCIB3

P9 GND

P10 VCC

P11 VCC

P12 VCC

P13 VCC

P14 GND

P15 VCCIB1

P16 GDB0/IO87NPB1

P17 IO85NDB1

P18 IO85PDB1

P19 IO84PDB1

P20 NC

P21 IO81PDB1

P22 NC

R1 NC

R2 NC

R3 VCC

R4 IO150PDB3

R5 IO151NPB3

R6 IO147NPB3

R7 GEC0/IO146NPB3

R8 VMV3

R9 VCCIB2

R10 VCCIB2

R11 IO117RSB2

R12 IO110RSB2

R13 VCCIB2

R14 VCCIB2

R15 VMV2

R16 IO94RSB2

484-Pin FBGA

Pin Number A3P600 Function

Package Pin Assignments

3-68 v1.3

R17 GDB1/IO87PPB1

R18 GDC1/IO86PDB1

R19 IO84NDB1

R20 VCC

R21 IO81NDB1

R22 IO82PDB1

T1 IO152PDB3

T2 IO152NDB3

T3 NC

T4 IO150NDB3

T5 IO147PPB3

T6 GEC1/IO146PPB3

T7 IO140RSB2

T8 GNDQ

T9 GEA2/IO143RSB2

T10 IO126RSB2

T11 IO120RSB2

T12 IO108RSB2

T13 IO103RSB2

T14 IO99RSB2

T15 GNDQ

T16 IO92RSB2

T17 VJTAG

T18 GDC0/IO86NDB1

T19 GDA1/IO88PDB1

T20 NC

T21 IO83PDB1

T22 IO82NDB1

U1 IO149PDB3

U2 IO149NDB3

U3 NC

U4 GEB1/IO145PDB3

U5 GEB0/IO145NDB3

U6 VMV2

U7 IO138RSB2

U8 IO136RSB2

484-Pin FBGA

Pin Number A3P600 Function

U9 IO131RSB2

U10 IO124RSB2

U11 IO119RSB2

U12 IO107RSB2

U13 IO104RSB2

U14 IO97RSB2

U15 VMV1

U16 TCK

U17 VPUMP

U18 TRST

U19 GDA0/IO88NDB1

U20 NC

U21 IO83NDB1

U22 NC

V1 NC

V2 NC

V3 GND

V4 GEA1/IO144PDB3

V5 GEA0/IO144NDB3

V6 IO139RSB2

V7 GEC2/IO141RSB2

V8 IO132RSB2

V9 IO127RSB2

V10 IO121RSB2

V11 IO114RSB2

V12 IO109RSB2

V13 IO105RSB2

V14 IO98RSB2

V15 IO96RSB2

V16 GDB2/IO90RSB2

V17 TDI

V18 GNDQ

V19 TDO

V20 GND

V21 NC

V22 NC

484-Pin FBGA

Pin Number A3P600 Function

W1 NC

W2 IO148PDB3

W3 NC

W4 GND

W5 IO137RSB2

W6 GEB2/IO142RSB2

W7 IO134RSB2

W8 IO125RSB2

W9 IO123RSB2

W10 IO118RSB2

W11 IO115RSB2

W12 IO111RSB2

W13 IO106RSB2

W14 IO102RSB2

W15 GDC2/IO91RSB2

W16 IO93RSB2

W17 GDA2/IO89RSB2

W18 TMS

W19 GND

W20 NC

W21 NC

W22 NC

Y1 VCCIB3

Y2 IO148NDB3

Y3 NC

Y4 NC

Y5 GND

Y6 NC

Y7 NC

Y8 VCC

Y9 VCC

Y10 NC

Y11 NC

Y12 NC

Y13 NC

Y14 VCC

484-Pin FBGA

Pin Number A3P600 Function

ProASIC3 Packaging

v1.3 3-69

Y15 VCC

Y16 NC

Y17 NC

Y18 GND

Y19 NC

Y20 NC

Y21 NC

Y22 VCCIB1

AA1 GND

AA2 VCCIB3

AA3 NC

AA4 NC

AA5 NC

AA6 IO135RSB2

AA7 IO133RSB2

AA8 NC

AA9 NC

AA10 NC

AA11 NC

AA12 NC

AA13 NC

AA14 NC

AA15 NC

AA16 IO101RSB2

AA17 NC

AA18 NC

AA19 NC

AA20 NC

AA21 VCCIB1

AA22 GND

AB1 GND

AB2 GND

AB3 VCCIB2

AB4 NC

AB5 NC

AB6 IO130RSB2

484-Pin FBGA

Pin Number A3P600 Function

AB7 IO128RSB2

AB8 IO122RSB2

AB9 IO116RSB2

AB10 NC

AB11 NC

AB12 IO113RSB2

AB13 IO112RSB2

AB14 NC

AB15 NC

AB16 IO100RSB2

AB17 IO95RSB2

AB18 NC

AB19 NC

AB20 VCCIB2

AB21 GND

AB22 GND

484-Pin FBGA

Pin Number A3P600 Function

Package Pin Assignments

3-70 v1.3

484-Pin FBGA

Pin Number A3P1000 Function

A1 GND

A2 GND

A3 VCCIB0

A4 IO07RSB0

A5 IO09RSB0

A6 IO13RSB0

A7 IO18RSB0

A8 IO20RSB0

A9 IO26RSB0

A10 IO32RSB0

A11 IO40RSB0

A12 IO41RSB0

A13 IO53RSB0

A14 IO59RSB0

A15 IO64RSB0

A16 IO65RSB0

A17 IO67RSB0

A18 IO69RSB0

A19 NC

A20 VCCIB0

A21 GND

A22 GND

B1 GND

B2 VCCIB3

B3 NC

B4 IO06RSB0

B5 IO08RSB0

B6 IO12RSB0

B7 IO15RSB0

B8 IO19RSB0

B9 IO24RSB0

B10 IO31RSB0

B11 IO39RSB0

B12 IO48RSB0

B13 IO54RSB0

B14 IO58RSB0

B15 IO63RSB0

B16 IO66RSB0

B17 IO68RSB0

B18 IO70RSB0

B19 NC

B20 NC

B21 VCCIB1

B22 GND

C1 VCCIB3

C2 IO220PDB3

C3 NC

C4 NC

C5 GND

C6 IO10RSB0

C7 IO14RSB0

C8 VCC

C9 VCC

C10 IO30RSB0

C11 IO37RSB0

C12 IO43RSB0

C13 NC

C14 VCC

C15 VCC

C16 NC

C17 NC

C18 GND

C19 NC

C20 NC

C21 NC

C22 VCCIB1

D1 IO219PDB3

D2 IO220NDB3

D3 NC

D4 GND

D5 GAA0/IO00RSB0

D6 GAA1/IO01RSB0

484-Pin FBGA

Pin Number A3P1000 Function

D7 GAB0/IO02RSB0

D8 IO16RSB0

D9 IO22RSB0

D10 IO28RSB0

D11 IO35RSB0

D12 IO45RSB0

D13 IO50RSB0

D14 IO55RSB0

D15 IO61RSB0

D16 GBB1/IO75RSB0

D17 GBA0/IO76RSB0

D18 GBA1/IO77RSB0

D19 GND

D20 NC

D21 NC

D22 NC

E1 IO219NDB3

E2 NC

E3 GND

E4 GAB2/IO224PDB3

E5 GAA2/IO225PDB3

E6 GNDQ

E7 GAB1/IO03RSB0

E8 IO17RSB0

E9 IO21RSB0

E10 IO27RSB0

E11 IO34RSB0

E12 IO44RSB0

E13 IO51RSB0

E14 IO57RSB0

E15 GBC1/IO73RSB0

E16 GBB0/IO74RSB0

E17 IO71RSB0

E18 GBA2/IO78PDB1

E19 IO81PDB1

E20 GND

484-Pin FBGA

Pin Number A3P1000 Function

ProASIC3 Packaging

v1.3 3-71

E21 NC

E22 IO84PDB1

F1 NC

F2 IO215PDB3

F3 IO215NDB3

F4 IO224NDB3

F5 IO225NDB3

F6 VMV3

F7 IO11RSB0

F8 GAC0/IO04RSB0

F9 GAC1/IO05RSB0

F10 IO25RSB0

F11 IO36RSB0

F12 IO42RSB0

F13 IO49RSB0

F14 IO56RSB0

F15 GBC0/IO72RSB0

F16 IO62RSB0

F17 VMV0

F18 IO78NDB1

F19 IO81NDB1

F20 IO82PPB1

F21 NC

F22 IO84NDB1

G1 IO214NDB3

G2 IO214PDB3

G3 NC

G4 IO222NDB3

G5 IO222PDB3

G6 GAC2/IO223PDB3

G7 IO223NDB3

G8 GNDQ

G9 IO23RSB0

G10 IO29RSB0

G11 IO33RSB0

G12 IO46RSB0

484-Pin FBGA

Pin Number A3P1000 Function

G13 IO52RSB0

G14 IO60RSB0

G15 GNDQ

G16 IO80NDB1

G17 GBB2/IO79PDB1

G18 IO79NDB1

G19 IO82NPB1

G20 IO85PDB1

G21 IO85NDB1

G22 NC

H1 NC

H2 NC

H3 VCC

H4 IO217PDB3

H5 IO218PDB3

H6 IO221NDB3

H7 IO221PDB3

H8 VMV0

H9 VCCIB0

H10 VCCIB0

H11 IO38RSB0

H12 IO47RSB0

H13 VCCIB0

H14 VCCIB0

H15 VMV1

H16 GBC2/IO80PDB1

H17 IO83PPB1

H18 IO86PPB1

H19 IO87PDB1

H20 VCC

H21 NC

H22 NC

J1 IO212NDB3

J2 IO212PDB3

J3 NC

J4 IO217NDB3

484-Pin FBGA

Pin Number A3P1000 Function

J5 IO218NDB3

J6 IO216PDB3

J7 IO216NDB3

J8 VCCIB3

J9 GND

J10 VCC

J11 VCC

J12 VCC

J13 VCC

J14 GND

J15 VCCIB1

J16 IO83NPB1

J17 IO86NPB1

J18 IO90PPB1

J19 IO87NDB1

J20 NC

J21 IO89PDB1

J22 IO89NDB1

K1 IO211PDB3

K2 IO211NDB3

K3 NC

K4 IO210PPB3

K5 IO213NDB3

K6 IO213PDB3

K7 GFC1/IO209PPB3

K8 VCCIB3

K9 VCC

K10 GND

K11 GND

K12 GND

K13 GND

K14 VCC

K15 VCCIB1

K16 GCC1/IO91PPB1

K17 IO90NPB1

K18 IO88PDB1

484-Pin FBGA

Pin Number A3P1000 Function

Package Pin Assignments

3-72 v1.3

K19 IO88NDB1

K20 IO94NPB1

K21 IO98NDB1

K22 IO98PDB1

L1 NC

L2 IO200PDB3

L3 IO210NPB3

L4 GFB0/IO208NPB3

L5 GFA0/IO207NDB3

L6 GFB1/IO208PPB3

L7 VCOMPLF

L8 GFC0/IO209NPB3

L9 VCC

L10 GND

L11 GND

L12 GND

L13 GND

L14 VCC

L15 GCC0/IO91NPB1

L16 GCB1/IO92PPB1

L17 GCA0/IO93NPB1

L18 IO96NPB1

L19 GCB0/IO92NPB1

L20 IO97PDB1

L21 IO97NDB1

L22 IO99NPB1

M1 NC

M2 IO200NDB3

M3 IO206NDB3

M4 GFA2/IO206PDB3

M5 GFA1/IO207PDB3

M6 VCCPLF

M7 IO205NDB3

M8 GFB2/IO205PDB3

M9 VCC

M10 GND

484-Pin FBGA

Pin Number A3P1000 Function

M11 GND

M12 GND

M13 GND

M14 VCC

M15 GCB2/IO95PPB1

M16 GCA1/IO93PPB1

M17 GCC2/IO96PPB1

M18 IO100PPB1

M19 GCA2/IO94PPB1

M20 IO101PPB1

M21 IO99PPB1

M22 NC

N1 IO201NDB3

N2 IO201PDB3

N3 NC

N4 GFC2/IO204PDB3

N5 IO204NDB3

N6 IO203NDB3

N7 IO203PDB3

N8 VCCIB3

N9 VCC

N10 GND

N11 GND

N12 GND

N13 GND

N14 VCC

N15 VCCIB1

N16 IO95NPB1

N17 IO100NPB1

N18 IO102NDB1

N19 IO102PDB1

N20 NC

N21 IO101NPB1

N22 IO103PDB1

P1 NC

P2 IO199PDB3

484-Pin FBGA

Pin Number A3P1000 Function

P3 IO199NDB3

P4 IO202NDB3

P5 IO202PDB3

P6 IO196PPB3

P7 IO193PPB3

P8 VCCIB3

P9 GND

P10 VCC

P11 VCC

P12 VCC

P13 VCC

P14 GND

P15 VCCIB1

P16 GDB0/IO112NPB1

P17 IO106NDB1

P18 IO106PDB1

P19 IO107PDB1

P20 NC

P21 IO104PDB1

P22 IO103NDB1

R1 NC

R2 IO197PPB3

R3 VCC

R4 IO197NPB3

R5 IO196NPB3

R6 IO193NPB3

R7 GEC0/IO190NPB3

R8 VMV3

R9 VCCIB2

R10 VCCIB2

R11 IO147RSB2

R12 IO136RSB2

R13 VCCIB2

R14 VCCIB2

R15 VMV2

R16 IO110NDB1

484-Pin FBGA

Pin Number A3P1000 Function

ProASIC3 Packaging

v1.3 3-73

R17 GDB1/IO112PPB1

R18 GDC1/IO111PDB1

R19 IO107NDB1

R20 VCC

R21 IO104NDB1

R22 IO105PDB1

T1 IO198PDB3

T2 IO198NDB3

T3 NC

T4 IO194PPB3

T5 IO192PPB3

T6 GEC1/IO190PPB3

T7 IO192NPB3

T8 GNDQ

T9 GEA2/IO187RSB2

T10 IO161RSB2

T11 IO155RSB2

T12 IO141RSB2

T13 IO129RSB2

T14 IO124RSB2

T15 GNDQ

T16 IO110PDB1

T17 VJTAG

T18 GDC0/IO111NDB1

T19 GDA1/IO113PDB1

T20 NC

T21 IO108PDB1

T22 IO105NDB1

U1 IO195PDB3

U2 IO195NDB3

U3 IO194NPB3

U4 GEB1/IO189PDB3

U5 GEB0/IO189NDB3

U6 VMV2

U7 IO179RSB2

U8 IO171RSB2

484-Pin FBGA

Pin Number A3P1000 Function

U9 IO165RSB2

U10 IO159RSB2

U11 IO151RSB2

U12 IO137RSB2

U13 IO134RSB2

U14 IO128RSB2

U15 VMV1

U16 TCK

U17 VPUMP

U18 TRST

U19 GDA0/IO113NDB1

U20 NC

U21 IO108NDB1

U22 IO109PDB1

V1 NC

V2 NC

V3 GND

V4 GEA1/IO188PDB3

V5 GEA0/IO188NDB3

V6 IO184RSB2

V7 GEC2/IO185RSB2

V8 IO168RSB2

V9 IO163RSB2

V10 IO157RSB2

V11 IO149RSB2

V12 IO143RSB2

V13 IO138RSB2

V14 IO131RSB2

V15 IO125RSB2

V16 GDB2/IO115RSB2

V17 TDI

V18 GNDQ

V19 TDO

V20 GND

V21 NC

V22 IO109NDB1

484-Pin FBGA

Pin Number A3P1000 Function

W1 NC

W2 IO191PDB3

W3 NC

W4 GND

W5 IO183RSB2

W6 GEB2/IO186RSB2

W7 IO172RSB2

W8 IO170RSB2

W9 IO164RSB2

W10 IO158RSB2

W11 IO153RSB2

W12 IO142RSB2

W13 IO135RSB2

W14 IO130RSB2

W15 GDC2/IO116RSB2

W16 IO120RSB2

W17 GDA2/IO114RSB2

W18 TMS

W19 GND

W20 NC

W21 NC

W22 NC

Y1 VCCIB3

Y2 IO191NDB3

Y3 NC

Y4 IO182RSB2

Y5 GND

Y6 IO177RSB2

Y7 IO174RSB2

Y8 VCC

Y9 VCC

Y10 IO154RSB2

Y11 IO148RSB2

Y12 IO140RSB2

Y13 NC

Y14 VCC

484-Pin FBGA

Pin Number A3P1000 Function

ProASIC3 Packaging

v1.3 3-74

Y15 VCC

Y16 NC

Y17 NC

Y18 GND

Y19 NC

Y20 NC

Y21 NC

Y22 VCCIB1

AA1 GND

AA2 VCCIB3

AA3 NC

AA4 IO181RSB2

AA5 IO178RSB2

AA6 IO175RSB2

AA7 IO169RSB2

AA8 IO166RSB2

AA9 IO160RSB2

AA10 IO152RSB2

AA11 IO146RSB2

AA12 IO139RSB2

AA13 IO133RSB2

AA14 NC

AA15 NC

AA16 IO122RSB2

AA17 IO119RSB2

AA18 IO117RSB2

AA19 NC

AA20 NC

AA21 VCCIB1

AA22 GND

AB1 GND

AB2 GND

AB3 VCCIB2

AB4 IO180RSB2

AB5 IO176RSB2

AB6 IO173RSB2

484-Pin FBGA

Pin Number A3P1000 Function

AB7 IO167RSB2

AB8 IO162RSB2

AB9 IO156RSB2

AB10 IO150RSB2

AB11 IO145RSB2

AB12 IO144RSB2

AB13 IO132RSB2

AB14 IO127RSB2

AB15 IO126RSB2

AB16 IO123RSB2

AB17 IO121RSB2

AB18 IO118RSB2

AB19 NC

AB20 VCCIB2

AB21 GND

AB22 GND

484-Pin FBGA

Pin Number A3P1000 Function

ProASIC3 Packaging

v1.3 3-75

Part Number and Revision Date

Part Number 51700097-003-3

Revised June 2008

List of Changes

The following table lists critical changes that were made in the current version of the document.

Previous Version Changes in Current Version (v1.3) Page

v1.2

(February 2008)

Pin numbers were added to the "68-Pin QFN" package diagram. Note 2 was

added below the diagram.

3-1

The "132-Pin QFN" package diagram was updated to include D1 to D4. In

addition, note 1 was changed from top view to bottom view, and note 2 is

new.

3-3

v1.1

(January 2008)

The "68-Pin QFN" section is new. 3-1

v1.0

(January 2008)

In the "100-Pin VQFP" A3P030 pin table, the function of pin 63 was incorrect

and changed from IO39RSB0 to GDB0/IO38RSB0.

3-12

v2.2

(July 2007)

This document was previously in datasheet v2.2. As a result of moving to the

handbook format, Actel has restarted the version numbers. The new version

number is v1.0.

N/A

v2.0

(April 2007)

The following pin tables were updated for A3P600: "208-Pin PQFP", "256-Pin

FBGA", and "484-Pin FBGA". The "144-Pin FBGA" table for A3P600 is new.

4-27 – 4-63

Advanced v0.7

(January 2007)

Notes were added to the package diagrams identifying if they were top or

bottom view.

N/A

The A3P030 "132-Pin QFN" table is new. 4-2

The A3P060 "132-Pin QFN" table is new. 4-4

The A3P125 "132-Pin QFN" table is new. 4-6

The A3P250 "132-Pin QFN" table is new. 4-8

The A3P030 "100-Pin VQFP" table is new. 4-11

Advanced v0.5

(January 2006)

The A3P060 "100-Pin VQFP" pin table was updated. 4-13

The A3P125 "100-Pin VQFP" pin table was updated. 4-13

The A3P060 "144-Pin TQFP" pin table was updated. 4-16

The A3P125 "144-Pin TQFP" pin table was updated. 4-18

The A3P125 "208-Pin PQFP" pin table was updated. 4-21

The A3P400 "208-Pin PQFP" pin table was updated. 4-25

The A3P060 "144-Pin FBGA" pin table was updated. 4-32

The A3P125 "144-Pin FBGA" pin table is new. 4-34

The A3P400 "144-Pin FBGA" is new. 4-38

The A3P400 "256-Pin FBGA" was updated. 4-48

The A3P1000 "256-Pin FBGA" was updated. 4-54

The A3P400 "484-Pin FBGA" was updated. 4-58

The A3P1000 "484-Pin FBGA" was updated. 4-68

ProASIC3 Packaging

v1.3 3-76

Advanced v0.2

(continued)

The A3P250 "100-Pin VQFP*" pin table was updated. 4-14

The A3P250 "208-Pin PQFP*" pin table was updated. 4-23

The A3P1000 "208-Pin PQFP*" pin table was updated. 4-29

The A3P250 "144-Pin FBGA*" pin table was updated. 4-36

The A3P1000 "144-Pin FBGA*" pin table was updated. 4-32

The A3P250 "256-Pin FBGA*" pin table was updated. 4-45

The A3P1000 "256-Pin FBGA*" pin table was updated. 4-54

The A3P1000 "484-Pin FBGA*" pin table was updated. 4-68

Previous Version Changes in Current Version (v1.3) Page

ProASIC3 Packaging

v1.3 3-77

Datasheet Categories

Related Documents

Handbook Documents

Global Resources in Actel Low-Power Flash Devices

http://www.actel.com/documents/LPD_Glorbal_HBs.pdf

User’s Guides

Designer User's Guide

http://www.actel.com/documents/designer_ug.pdf

Part Number and Revision Date

This document contains content extracted from the Device Architecture section of the datasheet.

To improve usability for customers, the device architecture information has now been split into

handbook sections, which also include usage information. No technical changes were made to the

content unless explicitly listed.

Part Number 51700094-002-1

Revised March 2008

List of Changes

The following table lists critical changes that were made in the current version of the chapter.

Previous Version Changes in Current Version (v1.1) Page

v1.0

(January 2008)

Table 1-1 · Low-Power Flash Families and the accompanying text was updated

to include the IGLOO PLUS family. The "IGLOO Terminology" section and

"ProASIC3 Terminology" section are new.

1-2

The "Device Overview" section was updated to note that 15 k devices do not

support SRAM or FIFO.

1-3

Figure 1-3 · IGLOO PLUS Device Architecture Overview with Four I/O Banks is

new.

1-4

Table 1-2 · IGLOO and ProASIC3 Array Coordinates was updated to add A3P015

and AGL015.

1-6

Table 1-3 · IGLOO PLUS Array Coordinates is new. 1-6

v1.1 2-1

Low-Power Modes in Actel ProASIC3/E FPGAs

2 – Low-Power Modes in Actel ProASIC3/E FPGAs

Introduction

The demand for low-power systems and semiconductors, combined with the strong growth

observed for value-based FPGAs, is driving growing demand for low-power FPGAs. For portable

and battery-operated applications, power consumption has always been the greatest challenge.

The battery life of a system and on-board devices has a direct impact on the success of the product.

As a result, FPGAs used in these applications should meet low-power consumption requirements.

Actel ProASIC®3/E FPGAs offer low power consumption capability inherited from their nonvolatile

and live-at-power-up (LAPU) flash technology. This application note describes the power

consumption and how to use different power saving modes to further reduce power consumption

for power-conscious electronics design.

Power Consumption Overview

In evaluating the power consumption of FPGA technologies, it is important to consider it from a

system point of view. Generally, the overall power consumption should be based on static, dynamic,

inrush, and configuration power. Few FPGAs implement ways to reduce static power consumption

utilizing sleep modes.

SRAM-based FPGAs use volatile memory for their configuration, so the device must be

reconfigured after each power-up cycle. Moreover, during this initialization state, the logic could

be in an indeterminate state, which might cause inrush current and power spikes. More complex

power supplies are required to eliminate potential system power-up failures, resulting in higher

costs. For portable electronics requiring frequent power-up and -down cycles, this directly affects

battery life, requiring more frequent recharging or replacement.

SRAM-Based FPGA Total Power Consumption = Pstatic + Pdynamic + Pinrush + Pconfig

EQ 2-1

ProASIC3/E Total Power Consumption = Pstatic + Pdynamic

EQ 2-2

Unlike SRAM-based FPGAs, Actel flash-based FPGAs are nonvolatile and do not require power-up

configuration. Additionally, Actel nonvolatile flash FPGAs are live at power-up and do not require

additional support components. Total power consumption is reduced as the inrush current and

configuration power components are eliminated.

Note that the static power component can be reduced in flash FPGAs (such as the ProASIC3/E

devices) by entering User Low Static mode or Sleep mode. This leads to an extremely low static

power component contribution to the total system power consumption.

The following sections describe the usage of Static (Idle) mode to reduce the power component,

User Low Static mode to reduce the static power component, and Sleep mode and Shutdown mode

to achieve a range of power consumption when the FPGA or system is idle. Table 2-1 on page 2-2

summarizes the different low-power modes offered by ProASIC3/E devices.

Low-Power Modes in Actel ProASIC3/E FPGAs

2-2 v1.1

Static (Idle) Mode

In Static (Idle) mode, the clock inputs are not switching and the static power consumption is the

minimum power required to keep the device powered up. In this mode, I/Os are only drawing the

minimum leakage current specified in the datasheet. Also, in Static (Idle) mode, embedded SRAM,

I/Os, and registers retain their values, so the device can enter and exit this mode without any

penalty.

If the embedded PLLs are used as the clock source, Static (Idle) mode can be entered easily by

pulling LOW the PLL POWERDOWN pin (active-low). By pulling the PLL POWERDOWN pin to LOW,

the PLL is turned off. Refer to Figure 2-1 on page 2-3 for more information.

Table 2-1 • ProASIC3/E Low-Power Modes Summary

Mode Power Supplies / Clock Status Needed to Start Up

Active On – All, clock N/A (already active)

Off – None

Static (Idle) On – All Initiate clock source.

Off – No active clock in FPGA No need to initialize volatile

contents.

Optional: Enter User Low Static (Idle) Mode by enabling

ULSICC macro to further reduce power consumption by

powering down FlashROM.

Sleep On – VCCI Need to turn on core.

Off – VCC core voltage Load states from external memory.

LAPU enables immediate operation when power returns. As needed, restore volatile contents

from external memory.

Optional: Save state of volatile contents in external memory.

Shutdown On – None Need to turn on VCC, VCCI.

Off – All power supplies

Applicable to PA3E and A3P030; cold-sparing and hot-

insertion allow the device to be powered down without

bringing down the system. LAPU enables immediate

operation when power returns.

Low-Power Modes in Actel ProASIC3/E FPGAs

v1.1 2-3

User Low Static (Idle) Mode

User Low Static (Idle) mode is an advanced feature supported by ProASIC3/E devices to reduce static

(idle) power consumption. Entering and exiting this mode is made possible using the ULSICC macro

by setting its value to disable/enable the User Low Static (Idle) mode. Under typical operating

conditions, characterization results show up to 25% reduction of the static (idle) power

consumption. The greatest power savings in terms of percentage are seen in the smaller members

of the ProASIC3 family. The active-high control signal for User Low Static (Idle) mode can be

generated by internal or external logic. When the device is operating in User Low Static (Idle)

mode, FlashROM functionality is temporarily disabled to save power. If FlashROM functionality is

needed, the device can exit User Low Static mode temporarily and re-enter the mode once the

functionality is no longer needed.

To utilize User Low Static (Idle) mode, simply instantiate the ULSICC macro (Table 2-2 on page 2-4)

in your design, and connect the input port to either an internal logic signal or a device package

pin, as illustrated in Figure 2-2 on page 2-4 or Figure 2-3 on page 2-5, respectively. The attribute is

used so the Synplify® synthesis tool will not optimize the instance with no output port.

This mode can be used to lower standard static (idle) power consumption when the FlashROM

feature is not needed. Configuring the device to enter User Low Static (Idle) mode is beneficial

when the FPGA enters and exits static mode frequently and lowering power consumption as much

as possible is desired. The device is still functional, and data is retained in this state so the device

can enter and exit this mode quickly, resulting in reduced total power consumption. The device can

also stay in User Low Static mode when the FlashROM feature is not used in the device.

Figure 2-1 • CCC/PLL Macro

CLKA GLA

GLB

GLC

LOCK

POWERDOWN

OADIV[4:0]*

OAMUX[2:0]*

DLYGLA[4:0]*

OBDIV[4:0]*

OBMUX[2:0]*

DLYYB[4:0]*

DLYGLB[4:0]*

OCDIV[4:0]*

OCMUX[2:0]*

DLYYC[4:0]*

DLYGLC[4:0]*

FINDIV[6:0]*

FBDIV[6:0]*

FBDLY[4:0]*

FBSEL[1:0]*

XDLYSEL*

VCOSEL[2:0]*

Low-Power Modes in Actel ProASIC3/E FPGAs

2-4 v1.1

Table 2-2 • Using ULSICC Macro*

VHDL Verilog

COMPONENT ULSICC

port (

LSICC : in STD_ULOGIC);

END COMPONENT;

Example:

COMPONENT ULSICC

port (

LSICC : in STD_ULOGIC);

END COMPONENT;

attribute syn_noprune : boolean;

attribute syn_noprune of u1 : label is true;

u1: ULSICC port map(myInputSignal);

module ULSICC(LSICC);

input LSICC;

endmodule

Example:

ULSICC U1(.LSICC(myInputSignal))

/* synthesis syn_noprune=1 */;

*Supported in Libero IDE v7.2 and newer versions.

Figure 2-2 • User Low Static (Idle) Mode Application—Internal Control Signal

Internal

Signal

ULSICC

Macro FlashROM

Programming

Circuitry

ProASIC3/E Device

Low-Power Modes in Actel ProASIC3/E FPGAs

v1.1 2-5

Sleep Mode

Actel ProASIC3/E FPGAs support Sleep mode when device functionality is not required. In Sleep

mode, the VCC (FPGA core voltage) supply is turned off, either grounded or left floating, resulting

in the FPGA core being turned off to reduce power consumption. While the ProASIC3/E device is in

Sleep mode, the rest of the system is still operating and driving the input buffers of the ProASIC3/E

device. The driven inputs do not pull up power planes, and the current draw is limited to a minimal

leakage current.

Table 2-3 shows the status of the power supplies in Sleep mode. When a power supply is powered

off, the corresponding power pin can be left floating or grounded.

Figure 2-3 • User Low Static (Idle) Mode Application—External Control Signal

ULSICC

Macro

External

Signal

Any User's I/O

FlashROM

Programming

Circuitry

ProASIC3/E Device

Figure 2-4 • User Low Static (Idle) Mode Timing Diagram

Normal OperationUser Low Static Mode

1 μs1 μs

Normal Operation

ULSICC Signal

Table 2-3 • Sleep Mode—Power Supply Requirements for ProASIC3/E Devices

Power Supplies ProASIC3/E

VCC Powered off

VCCI = VMV Powered on

VJTAG Powered on

VPUMP Powered on

Low-Power Modes in Actel ProASIC3/E FPGAs

2-6 v1.1

Table 2-4 shows the current draw in Sleep mode for an A3P250 device with the following test

conditions: VCCI = VMV; VCC = floating or GND; VJTAG = floating or GND; VPUMP = floating or GND.

Table 2-5 shows the current draw in Sleep mode for an A3PE600 device with the following test

conditions: VCCI = VMV; VCC = floating or GND; VJTAG = floating or GND; VPUMP = floating or GND.

ProASIC3/E devices were designed such that before device power-up, all I/Os are in tristate mode.

The I/Os will remain tristated during power-up until the last voltage supply (VCC or VCCI) is powered

to its functional level. After the last supply reaches the functional level, the outputs will exit the

tristate mode and drive the logic at the input of the output buffer. The behavior of user I/Os is

independent of the VCC and VCCI sequence or the state of other FPGA voltage supplies (VPUMP and

VJTAG). During power-down, device I/Os become tristated once the first power supply (VCC or VCCI)

drops below its brownout voltage level. The I/O behavior during power-down is also independent

of voltage supply sequencing.

Figure 2-5 on page 2-7 shows a timing diagram for the FPGA core entering the activation and

deactivation trip points for a typical application when the VCC power supply ramp rate is 100 µs

(ramping from 0 V to 1.5 V). This is, in fact, the timing diagram for the FPGA entering and exiting

Sleep mode, as it is dependent on powering down or powering up VCC. Depending on the ramp

rate of the power supply and board-level configurations, the user can easily calculate how long it

takes for the core to become active or inactive. For more information, refer to the

Power-Up/-Down Behavior of ProASIC3/E Devices application note.

Table 2-4 • A3P250 Current Draw in Sleep Mode

Typical Conditions

A3P250

ICCI (µA) ICCI (µA) per Bank

VCCI = 3.3 V 31.57 7.89

VCCI = 2.5 V 23.96 5.99

VCCI = 1.8 V 17.32 4.33

VCCI = 1.5 V 14.46 3.62

ICC FPGA Core 0.0 0.0

Leakage Current per I/O 0.1 0.1

VPUMP 0.0 0.0

Note: The data in this table were taken under typical conditions and are based on

characterization. The data is not guaranteed.

Table 2-5 • A3PE600 Current Draw in Sleep Mode

Typical Conditions

A3PE600

ICCI (µA) ICCI (µA) per Bank

VCCI = 3.3 V 59.85 7.48

VCCI = 2.5 V 45.50 5.69

VCCI = 1.8 V 32.98 4.12

VCCI = 1.5 V 27.66 3.46

VCCI = 0 V or Floating 0.0 0.0

ICC FPGA Core 0.0 0.0

Leakage Current per I/O 0.1 0.1

IPUMP 0.0 0.0

Note: The data in this table were taken under typical conditions and are based on

characterization. The data is not guaranteed.

Low-Power Modes in Actel ProASIC3/E FPGAs

v1.1 2-7

Shutdown Mode

For ProASIC3E and A3P030, shutdown mode can be entered by turning off all power supplies when

device functionality is not needed. Cold-sparing and hot-insertion features enable the device to be

powered down without turning off the entire system. When power returns, the live at power-up

feature enables immediate operation of the device.

Using Sleep Mode or Shutdown Mode in the System

Depending on the power supply and components used in an application, there are many ways to

turn the power supplies connected to the device on or off. For example, Figure 2-6 shows how a

microprocessor is used to control a power FET. It is recommended that power FETs with low on

resistance be used to perform the switching action.

Figure 2-5 • Entering and Exiting Sleep Mode—Typical Timing Diagram

VCC

VCC = 1.5 V

Sleep Mode

Activation Trip Point

Va = 0.85 ± 0.25 V

Deactivation Trip Point

Vd = 0.75 ± 0.25 V

Figure 2-6 • Controlling Power On/Off State Using Microprocessor and Power FET

Microprocessor

ProASIC3/E

Power On/Off

Control Signal

P-Channel

Power FET

1.5 V Power

Supply

VCC Pin

Low-Power Modes in Actel ProASIC3/E FPGAs

2-8 v1.1

Alternatively, Figure 2-7 shows how a microprocessor can be used with a voltage regulator's

shutdown pin to turn the power supplies connected to the device on or off.

Though Sleep mode or Shutdown mode can be used to save power, the content of the SRAM and

the state of the registers is lost when power is turned off if no other measure is taken. To keep the

original contents of the device, a low-cost external serial EEPROM can be used to save and restore

the device contents when entering and exiting Sleep mode. In the Embedded SRAM Initialization

Using External Serial EEPROM application note, detailed information and a reference design are

provided to initialize the embedded SRAM using an external serial EEPROM. The user can easily

customize the reference design to save and restore the FPGA state when entering and exiting Sleep

mode. The microcontroller will need to manage this activity, so before powering down VCC, the

data must be read from the FPGA and stored externally. Similarly, after the FPGA is powered up,

the microcontroller must allow the FPGA to load the data from external memory and restore its

original state.

Conclusion

Actel ProASIC3/E FPGAs inherit low-power consumption capability from their nonvolatile and live-

at-power-up flash-based technology. Power consumption can be reduced further using the Static

(Idle), User Low Static (Idle), Sleep, or Shutdown power modes. All these features result in a

low-power, cost-effective, single-chip solution designed specifically for power-sensitive electronics

applications.

Figure 2-7 • Controlling Power On/Off State Using Microprocessor and Voltage Regulator

Microprocessor

ProASIC3/E

Showdown

Control Signal

for VCC

Showdown

Control Signal

for VCCI

Voltage

Regulator

VCC Power Pin

Power

Supply

Low-Power Modes in Actel ProASIC3/E FPGAs

v1.1 2-9

Related Documents

Application Notes

Power-Up/Down Behavior of ProASIC3/E Devices

http://www.actel.com/documents/ProASIC3_E_PowerUp_HBs.pdf

Embedded SRAM Initialization Using External Serial EEPROM

http://www.actel.com/documents/EmbeddedSRAMInit_AN.pdf

Handbook Documents

SRAM and FIFO Memories in Actel’s in Actel’s Low-Power Flash Devices

http://www.actel.com/documents/LPD_SRAMFIFO_HBs.pdf

Part Number and Revision Date

This document was previously published as an application note describing features and functions

of the device, and as such has now been incorporated into the device handbook format. No

technical changes have been made to the content

Part Number 51700094-003-1

Revised March 2008

List of Changes

The following table lists critical changes that were made in the current version of the chapter.

Previous Version Changes in Current Version (v1.1) Page

v1.0

(January 2008)

The part number for this document was changed from 51700094-002-0 to

51700094-003-1.

N/A

51900138-2/10.06 The Power Supplies / Clock Status description was updated for Static (Idle) in

Table 2-1 · ProASIC3/E Low-Power Modes Summary.

2-2

Programming information was updated in the "User Low Static (Idle) Mode"

section.

2-3

51900138-1/6.06 The "User Low Static (Idle) Mode" section was updated to include information

about allowing programming in the ULSICC mode.

2-3

Figure 2-2 · User Low Static (Idle) Mode Application—Internal Control Signal

was updated.

2-4

Figure 2-3 · User Low Static (Idle) Mode Application—External Control Signal

was updated.

2-5

51900138-0/6.05 In Table 2-4 · A3P250 Current Draw in Sleep Mode, "VCCI = 1.5 V" was changed

from 3.6158 to 3.62.

2-6

In Table 2-5 · A3PE600 Current Draw in Sleep Mode, "VCCI = 2.5 V" was

changed from 5.6875 to 3.69.

2-6

Global Resources and Clock Conditioning

v1.1 3-1

Global Resources in Actel Low-Power Flash Devices

3 – Global Resources in Actel Low-Power Flash

Devices

Introduction

Actel IGLOO,® Fusion, and ProASIC®3 FPGA devices offer a powerful, low-delay VersaNet global

network scheme and have extensive support for multiple clock domains. In addition to the Clock

Conditioning Circuits (CCCs) and phase-locked loops (PLLs), there is a comprehensive global clock

distribution network called a VersaNet global network. Each logical element (VersaTile) input and

output port has access to these global networks. The VersaNet global networks can be used to

distribute low-skew clock signals or high-fanout nets. In addition, these highly segmented VersaNet

global networks offer users the flexibility to create low-skew local networks using spines. This

document describes VersaNet global networks and discusses how to assign signals to these global

networks and spines in a design flow. Details concerning low-power flash device PLLs are described

in Clock Conditioning Circuits in IGLOO and ProASIC3 Devices. This document describes the

low-power flash devices’ global architecture and uses of these global networks in designs.

Global Architecture

Low-power flash devices offer powerful and flexible control of circuit timing through the use of

analog circuitry. Each chip has up to six CCCs, some with PLLs.

• In IGLOOe, ProASIC3EL, and ProASIC3E devices, all CCCs have PLLs—hence, 6 PLLs per device.

• In IGLOO, IGLOO PLUS, ProASIC3L, and ProASIC3 devices, the west CCC contains a PLL core

(except in 15 k and 30 k devices).

Each PLL includes delay lines, a phase shifter (0°, 90°, 180°, 270°), and clock multipliers/dividers.

Each CCC has all the circuitry needed for the selection and interconnection of inputs to the

VersaNet global network. The east and west CCCs each have access to three VersaNet global lines

on each side of the chip (six global lines total). The CCCs at the four corners each have access to

three quadrant global lines in each quadrant of the chip (except in 15 k gate and 30 k gate

devices).

In 15 k and 30 k gate devices, all six VersaNet global lines are driven from three southern I/Os,

located toward the east and west sides. Each of these tiles can be configured to select a central I/O

on its respective side or an internal routed signal as the input signal. 15 k and 30 k gate devices do

not support any clock conditioning circuitry, nor do they contain the VersaNet global network

concept of top and bottom spines.

The flexible use of the VersaNet global network allows the designer to address several design

requirements. User applications that are clock-resource-intensive can easily route external or gated

internal clocks using VersaNet global routing networks. Designers can also drastically reduce delay

penalties and minimize resource usage by mapping critical, high-fanout nets to the VersaNet global

network.

The following sections give an overview of the VersaNet global network, the structure of the

global network, and the clock aggregation feature that enables a design to have very low clock

skew using spines.

Global Resources in Actel Low-Power Flash Devices

3-2 v1.1

Global Resource Support in Low-Power Devices

The low-power flash families listed in Table 3-1 support the global resources and the functions

described in this document.

Actel's low-power flash devices (listed in Table 3-1) provide a selection of low-power, secure, live-at-

power-up, single-chip solutions. The nonvolatile flash-based devices do not require a boot PROM and

incorporate FlashLock® technology, which provides a unique combination of reprogrammability and

design security without external overhead. Only low-power flash FPGAs can offer these advantages.

Actel IGLOO PLUS FPGAs are the industry-leading 1.2 V ultra-low-power programmable logic

devices (PLDs) and consume 90% less static power and over 50% less dynamic power than PLD

alternatives, while ProASIC3L devices offer a balance of low power and higher performance.

Flash*Freeze technology used in IGLOO, IGLOO PLUS, and ProASIC3L devices enables easy entry to

and exit from the ultra-low power mode, which consumes as little as 5 µW, while retaining SRAM

and register data. IGLOO PLUS also offers the ability to hold I/O state in Flash*Freeze mode.

Flash*Freeze technology simplifies power management through I/O and clock management

without the need to turn off voltages, I/Os, or clocks at the system level. Entering and exiting

Flash*Freeze mode takes less than 1 µs.

The Actel Fusion® family, based on the highly successful ProASIC3 flash FPGA architecture, has been

designed as a high-performance, mixed-signal Programmable System Chip. Fusion supports many

peripherals, including embedded flash memory, analog-to-digital converter (ADC), high-drive

outputs, RC and crystal oscillators, and real-time counter (RTC). The total available on-chip memory,

including the flash array blocks, is greater than that found in SRAM FPGAs.

IGLOO Terminology

In documentation, the term IGLOO families or IGLOO devices refers to all IGLOO families as listed in

Table 3-1. Where the information applies to only one family or limited devices, these exclusions will

be explicitly stated.

ProASIC3 Terminology

In documentation, the term ProASIC3 families or ProASIC3 devices refers to all ProASIC3 families as

listed in Table 3-1. Where the information applies to only one family or limited devices, these

exclusions will be explicitly stated.

Table 3-1 • Low-Power Flash Families

Family1 Description Timing Numbers2

IGLOO Ultra-low-power 1.2 V and 1.5 V FPGAs with Flash*Freeze™

technology

IGLOO DC and Switching

Characteristics

IGLOO PLUS Ultra-low-power 1.2 V and 1.5 V FPGAs with Flash*Freeze

technology and enhanced I/O capabilities

IGLOO PLUS DC and

Switching Characteristics

IGLOOe IGLOO devices enhanced with higher density, five additional PLLs,

and additional I/O standards

IGLOOe DC and Switching

Characteristics

ProASIC3L Low-power, high-performance 1.2 V FPGAs with Flash*Freeze

technology

ProASIC3L DC and Switching

Characteristics

ProASIC3 Low-power, high-performance 1.5 V FPGAs ProASIC3 DC and Switching

Characteristics

ProASIC3E ProASIC3 enhanced with higher density, five additional PLLs, and

additional I/O standards

ProASIC3E DC and Switching

Characteristics

ProASIC3

Automotive

Low-power, high-performance FPGAs qualified for Automotive

applications

Automotive ProASIC3 DC and

Switching Characteristics

Fusion Low-power mixed-signal Programmable System Chip (PSC) Fusion DC and Power

Characteristics

Notes:

1. The family names are linked to the appropriate product brief.

2. The timing number links go to the relevant timing numbers in the datasheet.

Global Resources in Actel Low-Power Flash Devices

v1.1 3-3

VersaNet Global Network Distribution

One of the architectural benefits of low-power flash architecture is the set of powerful, low-delay

VersaNet global networks that can access the VersaTiles, SRAM, and I/O tiles of the device. Each

device offers a chip global network with six global lines that are distributed from the center of the

FPGA array. In addition, each device, (except the 15 k and 30 k gate device), has four quadrant

global networks, each with three regional global line resources. These quadrant global networks

can only drive a signal inside their own quadrant. Each core VersaTile has access to nine global line

resources—three quadrant and six chip-wide (main) global networks—and a total of 18 globals are

available on the device (3 × 4 regional from each quadrant and 6 global).

Figure 3-1 shows simplified device architecture, and Figure 3-2 on page 3-4 shows an overview of

the VersaNet global networks.

The VersaNet global networks are segmented and consist of VersaNet global networks, spines,

global ribs, and global multiplexers (MUXes), as shown in Figure 3-1. The global networks are

driven from the global rib at the center of the die or quadrant global networks at the north or

south side of the die. The global network uses the MUX trees to access the spine, and the spine uses

the clock ribs to access the VersaTile. Access is available to the chip or quadrant global networks

and the spines through the global MUXes. Access to the spine using the global MUXes is explained

in the "Spine Architecture" section on page 3-4.

These VersaNet global networks offer fast, low-skew routing resources for high-fanout nets,

including clock signals. In addition, these highly segmented global networks offer users the

flexibility to create low-skew local networks using spines for up to 252 internal/external clocks or

other high-fanout nets in low-power flash devices. Optimal usage of these low-skew networks can

result in significant improvement in design performance.

Note: Not applicable to 15 k and 30 k gate devices

Figure 3-1 • Overview of VersaNet Global Network and Device Architecture

Pad Ring

I/O Ring

I/ORing

Chip (main)

Global Pads

Global

Pads

High-Performance

Global Network

Global Spine

Global Ribs

Scope of Spine

(shaded area

plus local RAMs

and I/Os)

Spine-Selection

MUX

Embedded

RAM Blocks

Logic Tiles

Top Spine

Bottom Spine

Quadrant Global Pads

Global Resources in Actel Low-Power Flash Devices

3-4 v1.1

Spine Architecture

The low-power flash device architecture allows the VersaNet global networks to be segmented.

Each of these networks contains spines (the vertical branches of the global network tree) and ribs

that can reach all the VersaTiles inside its region. The nine spines available in a vertical column

reside in global networks with two separate regions of scope: the quadrant global network, which

has three spines, and the chip (main) global network, which has six spines. Note that there are

three quadrant spines in each quadrant of the device (except in 15 k and 30 k gate devices). There

are four quadrant global network regions per device. In 15 k and 30 k gate devices, there is no

quadrant clock network, so there are only six spines in each spine tree. The spines are the vertical

branches of the global network tree, shown in Figure 3-2.

Each spine in a vertical column of a chip (main) global network is further divided into two equal-

length spine segments: one in the top and one in the bottom half of the die (except in 15 k and

30 k gate devices).

Top and bottom spine segments radiating from the center of a device have the same height.

However, just as in the ProASIC

PLUS® family, signals assigned only to the top and bottom spine

cannot access the middle two rows of the die. The spines for quadrant clock networks do not cross

the middle of the die and cannot access the middle two rows of the architecture.

Each spine and its associated ribs cover a certain area of the device (the "scope" of the spine; see

Figure 3-2). Each spine is accessed by the dedicated global network MUX tree architecture, which

defines how a particular spine is driven—either by the signal on the global network from a CCC, for

example, or by another net defined by the user. Details of the chip (main) global network spine-

selection MUX are presented in Figure 3-4 on page 3-7. The spine drivers for each spine are located

in the middle of the die.

Quadrant spines can be driven from user I/Os on the north and south sides of the die. The ability to

drive spines in the quadrant global networks can have a significant effect on system performance

for high-fanout inputs to a design. Access to the top quadrant spine regions is from the top of the

die, and access to the bottom quadrant spine regions is from the bottom of the die. The A3PE3000

device has 28 clock trees and each tree has nine spines; this flexible global network architecture

enables users to map up to 252 different internal/external clocks in an A3PE3000 device.

Note: Not applicable to 15 k and 30 k gate devices.

Figure 3-2 • Simplified VersaNet Global Network

North Quadrant Global Network

South Quadrant Global Network

Chip (main)

Global

Network

333

3333

Global Spine Quadrant Global Spine

CCC

CCC CCC

CCC

Global Resources in Actel Low-Power Flash Devices

v1.1 3-5

Spine Access

The physical location of each spine is identified by the letter 'T' (top) or 'B' (bottom) and an

accompanying number (Tn or Bn). The number n indicates the horizontal location of the spine; 1

refers to the first spine on the left side of the die. Since there are six chip spines in each spine tree,

there are up to six spines available for each combination of 'T' (or 'B') and n (for example, six T1

spines). Similarly, there are three quadrant spines available for each combination of 'T' (or 'B') and

n (for example, four T1 spines), as shown in Figure 3-3 on page 3-6.

Table 3-2 • Globals/Spines/Rows for IGLOO and ProASIC3 Devices

ProASIC3/

ProASIC3L

Devices

IGLOO

Devices

Chip

Globals

Quadrant

Globals

(4×3)

Clock

Trees

Globals/

Spines

per

Tree

Total

Spines

per

Device

VersaTiles

in Each

Tree

Total

VersaTile

Rows

Each

Spine

A3P015 AGL015 6 0 1 9 9 384 384 12

A3P030 AGL030 6 0 2 9 18 384 768 12

A3P060 AGL060 6 12 4 9 36 384 1,536 12

A3P125 AGL125 6 12 8 9 72 384 3,072 12

A3P250/L AGL250 6 12 8 9 72 768 6,144 24

A3P400 6 12 12 9 108 768 9,216 24

A3P600/L AGL600 6 12 12 9 108 1,152 13,824 36

A3P1000/L AGL1000 6 12 16 9 144 1,536 24,576 48

A3PE600 AGLE600 6 12 12 9 108 1,120 13,440 35

A3PE1500 6 12 20 9 180 1,888 37,760 59

A3PE3000/L AGLE3000 6 12 28 9 252 2,656 74,368 83

Table 3-3 • Globals/Spines/Rows for IGLOO PLUS Devices

IGLOO PLUS

Devices

Chip

Globals

Quadrant

Globals

(4×3)

Clock

Trees

Globals/

Spines

per Tree

Tot al

Spines

per Device

VersaTiles

in Each Tree

Tot al

VersaTiles

Rows

in Each

Spine

AGLP030 6 0 2 9 18 384* 792 12

AGLP060 6 12 4 9 36 384* 1,584 12

AGLP125 6 12 8 9 72 384* 3,120 12

Note: *Clock trees that are located at far left and far right will support more VersaTiles.

Table 3-4 • Globals/Spines/Rows for Fusion Devices

Fusion

Device

Chip

Globals

Quadrant

Globals

(4×3)

Clock

Trees

Globals/

Spines

per

Tree

Tot al

Spines

per

Device

VersaTiles

Each

Tree

Tot al

VersaTiles

Rows

Each

Spine

AFS090 6 12 6 9 54 384 2,304 12

AFS250 6 12 8 9 72 768 6,144 24

AFS600 6 12 12 9 108 1,152 13,824 36

AFS1500 6 12 20 9 180 1,920 38,400 60

Global Resources in Actel Low-Power Flash Devices

3-6 v1.1

Spines are also called local clocks, and are accessed by the dedicated global MUX architecture.

These MUXes define how a particular spine is driven. Refer to Figure 3-4 on page 3-7 for the global

MUX architecture. The MUXes for each chip global spine are located in the middle of the die.

Access to the top and bottom chip global spine is available from the middle of the die. There is no

control dependency between the top and bottom spines. If a top spine, T1, of a chip global

network is assigned to a net, B1 is not wasted and can be used by the global clock network. The

signal assigned only to the top or bottom spine cannot access the middle two rows of the

architecture. However, if a spine is using the top and bottom at the same time (T1 and B1, for

instance), the previous restriction is lifted.

The MUXes for each quadrant global spine are located in the north and south sides of the die.

Access to the top and bottom quadrant global spines is available from the north and south sides of

the die. Since the MUXes for quadrant spines are located in the north and south sides of the die,

you should not try to drive T1 and B1 quadrant spines from the same signal.

Figure 3-3 • Chip Global Aggregation

Tn Tn+1 Tn+2 Tn+3 Tn+4

Global

Network

Global Resources in Actel Low-Power Flash Devices

v1.1 3-7

Using Clock Aggregation

Clock aggregation allows for multi-spine clock domains to be assigned using hardwired

connections, without adding any extra skew. A MUX tree, shown in Figure 3-4, provides the

necessary flexibility to allow long lines, local resources, or I/Os to access domains of one, two, or

four global spines. Signal access to the clock aggregation system is achieved through long-line

resources in the central rib in the center of the die, and also through local resources in the north

and south ribs, allowing I/Os to feed directly into the clock system. As Figure 3-5 indicates, this

access system is contiguous.

There is no break in the middle of the chip for the north and south I/O VersaNet access. This is

different from the quadrant clocks located in these ribs, which only reach the middle of the rib.

Figure 3-4 • Spine Selection MUX of Global Tree

Figure 3-5 • Clock Aggregation Tree Architecture

Internal/External

Signal

Internal/External

Signal

Internal/External

Signals

Spine

Global Rib

Global Driver MUX

Tree Node MUX

Internal/External

Signals

Tree Node MUX

Global Spine

Global Rib

Global Driver and MUX

I/O Access

Internal Signal Access

I/O Tiles

Global Signal Access

Tree Node MUX

Global Resources in Actel Low-Power Flash Devices

3-8 v1.1

Clock Aggregation Architecture

This clock aggregation feature allows a balanced clock tree, which improves clock skew. The

physical regions for clock aggregation are defined from left to right and shift by one spine. For chip

global networks, there are three types of clock aggregation available, as shown in Figure 3-6:

• Long lines that can drive up to four adjacent spines

• Long lines that can drive up to two adjacent spines

• Long lines that can drive one spine

There are three types of clock aggregation available for the quadrant spines, as shown in

Figure 3-6:

• I/Os or local resources that can drive up to four adjacent spines

• I/Os or local resources that can drive up to two adjacent spines

• I/Os or local resources that can drive one spine

• As an example, A3PE600 and AFS600 devices have twelve spine locations: T1, T2, T3, T4, T5,

T6, B1, B2, B3, B4, B5, and B6. Table 3-5 shows the clock aggregation you can have in

A3PE600 and AFS600.

The clock aggregation for the quadrant spines can cross over from the left to right quadrant, but

not from top to bottom. The quadrant spine assignment T1:T4 is legal, but the quadrant spine

assignment T1:B1 is not legal. Note that this clock aggregation is hardwired. You can always assign

signals to spine T1 and B2 by instantiating a buffer, but this may add skew in the signal.

Figure 3-6 • Four Spines Aggregation

Tn Tn + 1 Tn + 2 Tn + 4

Tn + 3

Table 3-5 • Spine Aggregation in A3PE600 or AFS600

Clock Aggregation Spine

1 spine T1, T2, T3, T4, T5, T6, B1, B2, B3, B4, B5, B6

2 spines T1:T2, T2:T3, T3:T4, T4:T5, T5:T6, B1:B2, B2:B3, B3:B4, B4:B5, B5:B6

4 spines B1:B4, B2:B5, B3:B6, T1:T4, T2:T5, T3:T6

Global Resources in Actel Low-Power Flash Devices

v1.1 3-9

I/O Banks and Global I/Os

The following sections give an overview of naming conventions and other related I/O information.

Naming of Global I/Os

In low-power flash devices, the global I/Os have access to certain clock conditioning circuitry and

have direct access to the global network. Additionally, the global I/Os can be used as regular I/Os,

since they have identical capabilities to those of regular I/Os. Due to the comprehensive and

flexible nature of the I/Os in low-power flash devices, a naming scheme is used to show the details

of the I/O. The global I/O uses the generic name Gmn/IOuxwByVz. Refer to the I/O Structure section

of the handbook for the device that you are using for more information on this naming

convention.

Figure 3-7 represents the global input pins connection to the northwest CCC or northwest

quadrant global networks for a low-power flash device. Each global buffer, as well as the PLL

reference clock, can be driven from one of the following:

• 3 dedicated single-ended I/Os using a hardwired connection

• 2 dedicated differential I/Os using a hardwired connection

• The FPGA core

Since each bank can have a different I/O standard, the user should be careful to choose the correct

global I/O for the design. There are 54 global pins available to access 18 global networks. For the

single-ended and voltage-referenced I/O standards, you can use any of these three available I/Os to

access the global network. For differential I/O standards such as LVDS and LVPECL, the I/O macro

needs to be placed on GAA0 and GAA1 or a similar location. The unassigned global I/Os can be

used as regular I/Os. Note that pin names starting with GF and GC are associated with the chip

global networks, and GA, GB, GD, and GE are used for quadrant global networks.

Figure 3-7 • Global I/O Overview

Source for CCC

(CLKA or CLKB or CLKC)

Each shaded box represents an

INBUF or INBUF_LVDS/LVPECL

macro, as appropriate. To Core

Routed Clock

(from FPGA core)

Sample Pin Names

GAA0/IO0NDB0V01

GAA1/IO00PDB0V01

GAA2/IO13PDB7V11

GAA[0:2]: GA represents global in the northwest corner

of the device. A[0:2]: designates specific A clock source.

Global Resources in Actel Low-Power Flash Devices

3-10 v1.1

Unused Global I/O Configuration

The unused clock inputs behave similarly to the unused Pro I/Os. The Actel Designer software

automatically configures the unused global pins as inputs with pull-up resistors if they are not used

as regular I/O.

I/O Banks and Global I/O Standards

In low-power flash devices, any I/O or internal logic can be used to drive the global network.

However, only the global macro placed at the global pins will use the hardwired connection

between the I/O and global network. Global signal (signal driving a global macro) assignment to

I/O banks is no different from regular I/O assignment to I/O banks with the exception that you are

limited to the pin placement location available. Only global signals compatible with both the VCCI

and VREF standards can be assigned to the same bank.

Design Recommendations

The following sections provide design flow recommendations for using a global network in a

design.

•"Global Macros and I/O Standards"

•"Using Global Macros in Synplicity" on page 3-12

•"Global Promotion and Demotion Using PDC" on page 3-13

•"Spine Assignment" on page 3-14

•"Designer Flow for Global Assignment" on page 3-15

•"Simple Design Example" on page 3-17

•"Global Management in PLL Design" on page 3-19

•"Using Spines of Occupied Global Networks" on page 3-20

Global Macros and I/O Standards

Low-power flash devices have six chip global networks and four quadrant clock networks.

However, the same clock macros are used for assigning signals to chip globals and quadrant

globals. Depending on the clock macro placement or assignment in the Physical Design Constraint

(PDC) file or MultiView Navigator (MVN), the signal will use the chip global network or quadrant

network. Table 3-6 on page 3-11 lists the clock macros available for low-power flash devices. Refer

to the IGLOO, Fusion and ProASIC3 Macro Library Guide for details.

Global Resources in Actel Low-Power Flash Devices

v1.1 3-11

Use these available macros to assign a signal to the global network. In addition to these global

macros, PLL and CLKDLY macros can also drive the global networks. Use I/O–standard–specific clock

macros (CLKBUF_x) to instantiate a specific I/O standard for the global signals. Table 3-7 shows the

list of these I/O–standard–specific macros. Note that if you use these I/O–standard–specific clock

macros, you cannot change the I/O standard later in the design stage. If you use the regular

CLKBUF macro, you can use MVN or the PDC file in Designer to change the I/O standard. The

default I/O standard for CLKBUF is LVTTL in the current Actel Libero® Integrated Design

Environment (IDE) and Designer software.

Table 3-6 • Clock Macros

Macro Name Description Symbol

CLKBUF Input macro for Clock Network

CLKBUF_x Input macro for Clock Network with

specific I/O standard

CLKBUF_LVDS/

LVPECL

LVDS or LVPECL input macro for Clock

Network

CLKINT Internal clock interface

CLKBIBUF Bidirectional macro with input

dedicated to routed Clock Network

PAD

CLKBUF

PAD Y

CLKBUF_X

PADN

PADP

CLKBIBUF_LVPECL Y

PADN

PADP

CLKBIBUF_LVDS Y

CLKINT

EPAD

CLKBIBU

Table 3-7 • I/O Standards within CLKBUF

Name Description

CLKBUF_LVCMOS5 LVCMOS clock buffer with 5.0 V CMOS voltage level

CLKBUF_LVCMOS33 LVCMOS clock buffer with 3.3 V CMOS voltage level

CLKBUF_LVCMOS25 LVCMOS clock buffer with 2.5 V CMOS voltage level1

CLKBUF_LVCMOS18 LVCMOS clock buffer with 1.8 V CMOS voltage level

CLKBUF_LVCMOS15 LVCMOS clock buffer with 1.5 V CMOS voltage level

CLKBUF_LVCMOS12 LVCMOS clock buffer with 1.2 V CMOS voltage level

CLKBUF_PCI PCI clock buffer

CLKBUF_PCIX PCIX clock buffer

CLKBUF_GTL25 GTL clock buffer with 2.5 V CMOS voltage level1

CLKBUF_GTL33 GTL clock buffer with 3.3 V CMOS voltage level1

Notes:

1. Supported in only the IGLOOe and ProASIC3E devices

2. By default, the CLKBUF macro uses the 3.3 V LVTTL I/O technology.

Global Resources in Actel Low-Power Flash Devices

3-12 v1.1

The current synthesis tool libraries only infer the CLKBUF or CLKINT macros in the netlist. All other

global macros must be instantiated manually into your HDL code. The following is an example of

CLKBUF_LVCMOS25 global macro instantiations that you can copy and paste into your code:

VHDL

component clkbuf_lvcmos25

port (pad : in std_logic; y : out std_logic);

end component

begin

-- concurrent statements

u2 : clkbuf_lvcmos25 port map (pad => ext_clk, y => int_clk);

end

Verilog

module design (______);

input _____;

output ______;

clkbuf_lvcmos25 u2 (.y(int_clk), .pad(ext_clk);

endmodule

Using Global Macros in Synplicity

The Synplify® synthesis tool automatically inserts global buffers for nets with high fanout during

synthesis. By default, Synplicity® puts six global macros (CLKBUF or CLKINT) in the netlist, including

any global instantiation or PLL macro. Synplify always honors your global macro instantiation. If

you have a PLL (only primary output is used) in the design, Synplify adds five more global buffers in

the netlist. Synplify uses the following global counting rule to add global macros in the netlist:

1. CLKBUF: 1 global buffer

2. CLKINT: 1 global buffer

3. CLKDLY: 1 global buffer

4. PLL: 1 to 3 global buffers

– GLA, GLB, GLC, YB, and YC are counted as 1 buffer.

– GLB or YB is used or both are counted as 1 buffer.

– GLC or YC is used or both are counted as 1 buffer.

CLKBUF_GTLP25 GTL+ clock buffer with 2.5 V CMOS voltage level1

CLKBUF_GTLP33 GTL+ clock buffer with 3.3 V CMOS voltage level1

CLKBUF_ HSTL _I HSTL Class I clock buffer1

CLKBUF_ HSTL _II HSTL Class II clock buffer1

CLKBUF_SSTL2_I SSTL2 Class I clock buffer1

CLKBUF_SSTL2_II SSTL2 Class II clock buffer1

CLKBUF_SSTL3_I SSTL3 Class I clock buffer1

CLKBUF_SSTL3_II SSTL3 Class II clock buffer1

Table 3-7 • I/O Standards within CLKBUF (continued)

Name Description

Notes:

1. Supported in only the IGLOOe and ProASIC3E devices

2. By default, the CLKBUF macro uses the 3.3 V LVTTL I/O technology.

Global Resources in Actel Low-Power Flash Devices

v1.1 3-13

You can use the syn_global_buffers attribute in Synplify to specify a maximum number of global

macros to be inserted in the netlist. This can also be used to restrict the number of global buffers

inserted. In the Synplicity 8.1 version, a new attribute, syn_global_minfanout, has been added for

low-power flash devices. This enables you to promote only the high-fanout signal to global.

However, be aware that you can only have six signals assigned to chip global networks, and the rest

of the global signals should be assigned to quadrant global networks. So, if the netlist has 18

global macros, the remaining 12 global macros should have fanout that allows the instances driven

by these globals to be placed inside a quadrant.

Global Promotion and Demotion Using PDC

The HDL source file or schematic is the preferred place for defining which signals should be

assigned to a clock network using clock macro instantiation. This method is preferred because it is

guaranteed to be honored by the synthesis tools and Designer software and stop any replication

on this net by the synthesis tool. Note that a signal with fanout may have logic replication if it is

not promoted to global during synthesis. In that case, the user cannot promote that signal to

global using PDC. See Synplicity Help for details on using this attribute. To help you with global

management, Designer allows you to promote a signal to a global network or demote a global

macro to a regular macro from the user netlist using the compile options and/or PDC commands.

The following are the PDC constraints you can use to promote a signal to a global network:

1. PDC syntax to promote a regular net to a chip global clock:

assign_global_clock –net netname

The following will happen during promotion of a regular signal to a global network:

– If the net is external, the net will be driven by a CLKINT inserted automatically by

Compile.

– The I/O macro will not be changed to CLKBUF macros.

– If the net is an internal net, the net will be driven by a CLKINT inserted automatically by

Compile.

2. PDC syntax to promote a net to a quadrant clock:

assign_local_clock –net netname –type quadrant UR|UL|LR|LL

This follows the same rule as the chip global clock network.

The following PDC command demotes the clock nets to regular nets.

unassign_global_clock -net netname

Note: OAVDIVRST exists only in the Fusion PLL.

Figure 3-8 • PLLs in Low-Power Flash Devices

CLKA GLA

EXTFB

POWERDOWN

OADIVRST

LOCK

GLB

GLC

Global Resources in Actel Low-Power Flash Devices

3-14 v1.1

The following will happen during demotion of a global signal to regular nets:

• CLKBUF_x becomes INBUF_x; CLKINT is removed from the netlist.

• The essential global macro, such as the output of the Clock Conditioning Circuit, cannot be

demoted.

• No automatic buffering will happen.

Since no automatic buffering happens when a signal is demoted, this net may have a high delay

due to large fanout. This may have a negative effect on the quality of the results. Actel

recommends that the automatic global demotion only be used on small-fanout nets. Use clock

networks for high-fanout nets to improve timing and routability.

Spine Assignment

The low-power flash device architecture allows the global networks to be segmented and used as

clock spines. These spines, also called local clocks, enable the use of PDC or MVN to assign a signal

to a spine.

PDC syntax to promote a net to a spine/local clock:

assign_local_clock –net netname –type [quadrant|chip] Tn|Bn|Tn:Bm

If the net is driven by a clock macro, Designer automatically demotes the clock net to a regular net

before it is assigned to a spine. Nets driven by a PLL or CLKDLY macro cannot be assigned to a local

clock.

When assigning a signal to a spine or quadrant global network using PDC (pre-compile), the

Designer software will legalize the shared instances. The number of shared instances to be

legalized can be controlled by compile options. If these networks are created in MVN (only

quadrant globals can be created), no legalization is done (as it is post-compile). Designer does not

do legalization between non-clock nets.

As an example, consider two nets, net_clk and net_reset, driving the same flip-flop. The following

PDC constraints are used:

assign_local_clock –net net_clk –type chip T3

assign_local_clock –net net_reset –type chip T1:T2

During Compile, Designer adds a buffer in the reset net and places it in the T1 or T2 region, and

places the flip-flop in the T3 spine region (Figure 3-9).

Figure 3-9 • Adding a Buffer for Shared Instances

CLK

CLR

net_clk

net_reset

T1 T2 T3

CLK

CLR

net_clk

net_reset

assign_local_clock -net net_clk -type chip T3

assi

n_local_clock -net net_reset -t

e chi

T1:T2

Before Compile After Compile

Added

buffer

Global Resources in Actel Low-Power Flash Devices

v1.1 3-15

You can control the maximum number of shared instances allowed for the legalization to take

place using the Compile Option dialog box shown in Figure 3-10. Refer to Libero IDE / Designer

online help for details on the Compile Option dialog box. A large number of shared instances most

likely indicates a floorplanning problem that you should address.

Designer Flow for Global Assignment

To achieve the desired result, pay special attention to global management during synthesis and

place-and-route. The current Synplify tool does not insert more than six global buffers in the netlist

by default. Thus, the default flow will not assign any signal to the quadrant global network.

However, you can use attributes in Synplify and increase the default global macro assignment in

the netlist. Designer v6.2 supports automatic quadrant global assignment, which was not available

in Designer v6.1. Layout will make the choice to assign the correct signals to global. However, you

can also utilize PDC and perform manual global assignment to overwrite any automatic

assignment. The following step-by-step suggestions guide you in the layout of your design and

help you improve timing in Designer:

1. Run Compile and check the Compile report. The Compile report has global information in

the "Device Utilization" section that describes the number of chip and quadrant signals in

the design. A "Net Report" section describes chip global nets, quadrant global nets, local

clock nets, a list of nets listed by fanout, and net candidates for local clock assignment.

Review this information. Note that YB or YC are counted as global only when they are used

in isolation; if you use YB only and not GLB, this net is not shown in the global/quadrant

nets report. Instead, it appears in the Global Utilization report.

2. If some signals have a very high fanout and are candidates for global promotion, promote

those signals to global using the compile options or PDC commands. Figure 3-11 on

page 3-16 shows the Globals Management section of the compile options. Select Promote

regular nets whose fanout is greater than and enter a reasonable value for fanouts.

Figure 3-10 • Shared Instances in the Compile Option Dialog Box

Global Resources in Actel Low-Power Flash Devices

3-16 v1.1

3. Occasionally, the synthesis tool assigns a global macro to clock nets, even though the fanout

is significantly less than other asynchronous signals. Select Demote global nets whose

fanout is less than and enter a reasonable value for fanouts. This frees up some global

networks from the signals that have very low fanouts. This can also be done using PDC.

4. Use local clocks for the signals that do not need to go to the whole chip but should have low

skew. This local clocks assignment can only be done using PDC.

5. Assign the I/O buffer using MVN if you have fixed I/O assignment. As shown in Figure 3-6 on

page 3-8, there are three sets of global pins that have a hardwired connection to each

global network. Do not try to put multiple CLKBUF macros in these three sets of global pins.

For example, do not assign two CLKBUFs to GAA0x and GAA2x pins.

6. You must click Commit at the end of MVN assignment. This runs the pre-layout checker and

checks the validity of global assignment.

7. Always run Compile with the Keep existing physical constraints option on. This uses the

quadrant clock network assignment in the MVN assignment and checks if you have the

desired signals on the global networks.

8. Run Layout and check the timing.

Figure 3-11 • Globals Management GUI in Designer

Global Resources in Actel Low-Power Flash Devices

v1.1 3-17

Simple Design Example

Consider a design consisting of six building blocks (shift registers) and targeted for an A3PE600-

PQ208 (Figure 3-9 on page 3-14). The example design consists of two PLLs (PLL1 has GLA only; PLL2

has both GLA and GLB), a global reset (ACLR), an enable (EN_ALL), and three external clock

domains (QCLK1, QCLK2, and QCLK3) driving the different blocks of the design. Note that the

PQ208 package only has two PLLs (which access the chip global network). Because of fanout, the

global reset and enable signals need to be assigned to the chip global resources. There is only one

free chip global for the remaining global (QCLK1, QCLK2, QCLK3). Place two of these signals on the

quadrant global resource. The design example demonstrates manually assignment of QCLK1 and

QCLK2 to the quadrant global using the PDC command.

Figure 3-12 • Block Diagram of the Global Management Example Design

reg256_behave

REG_PLLCLK2GLA_OUT

REG_QCLK1_OUT

REG_QCLK2_OUT

REG_PLLCLK2GLB_OUT

REG_QCLK3_OUT

REG_PLLCLK1_OUT

REG_PLLCLK2GLA

PDOWN

PLLZ_CLKA

DATA_QCLK1

DATA_PLLCQCLK2

EN_ALL

QCLK1

DATA_QCLK2

QCLK2

ACLR

DATA_QCLK3

DATA_PLLCLK1

PLL1_CLKA

QCLK3

Shhl_In

Adr

Clock

Shhl_out

REG_QCLK1

REG_QCLK2

REG_PLLCLK2GLB

REG_QCLK3

REG_PLLCLK1

PLL1

\$115

POWER-DOWN

CLKA LOCK

GLA

POWER-DOWN

CLKA

LOCK

GLA

GLB

PLL2

\$116

reg256_behave

Shhl_In

Adr

Clock

Shhl_out

reg256_behave

Shhl_In

Adr

Clock

Shhl_out

reg256_behave

Shhl_In

Adr

Clock

Shhl_out

reg256_behave

Shhl_In

Adr

Clock

Shhl_out

reg256_behave

Shhl_In

Adr

Clock

Shhl_out

Global Resources in Actel Low-Power Flash Devices

3-18 v1.1

Step 1

Run Synthesis with default options. The Synplicity log shows the following device utilization:

Step 2

Run Compile with the Promote regular nets whose fanout is greater than option selected in

Designer; you will see the following in the Compile report:

Device utilization report:

==========================

CORE Used: 1536 Total: 13824 (11.11%)

IO (W/ clocks) Used: 19 Total: 147 (12.93%)

Differential IO Used: 0 Total: 65 (0.00%)

GLOBAL Used: 8 Total: 18 (44.44%)

PLL Used: 2 Total: 2 (100.00%)

RAM/FIFO Used: 0 Total: 24 (0.00%)

FlashROM Used: 0 Total: 1 (0.00%)

……………………

The following nets have been assigned to a global resource:

Fanout Type Name

--------------------------

1536 INT_NET Net : EN_ALL_c

Driver: EN_ALL_pad_CLKINT

Source: AUTO PROMOTED

1536 SET/RESET_NET Net : ACLR_c

Driver: ACLR_pad_CLKINT

Source: AUTO PROMOTED

256 CLK_NET Net : QCLK1_c

Driver: QCLK1_pad_CLKINT

Source: AUTO PROMOTED

256 CLK_NET Net : QCLK2_c

Driver: QCLK2_pad_CLKINT

Source: AUTO PROMOTED

256 CLK_NET Net : QCLK3_c

Driver: QCLK3_pad_CLKINT

Source: AUTO PROMOTED

256 CLK_NET Net : $1N14

Driver: $1I5/Core

Source: ESSENTIAL

256 CLK_NET Net : $1N12

Driver: $1I6/Core

Source: ESSENTIAL

256 CLK_NET Net : $1N10

Driver: $1I6/Core

Source: ESSENTIAL

Designer will promote five more signals to global due to high fanout. There are eight signals

assigned to global networks.

Cell usage:

cell count area count*area

DFN1E1C1

BUFF

INBUF

VCC

GND

OUTBUF

CLKBUF

PLL

TOTAL

1536

278

1853

2.0

1.0

0.0

3072.0

278.0

0.0

3350.0

Global Resources in Actel Low-Power Flash Devices

v1.1 3-19

During Layout, Designer will assign two of the signals to quadrant global locations.

Step 3 (optional)

You can also assign the QCLK1_c and QCLK2_c nets to quadrant regions using the following PDC

commands:

assign_local_clock –net QCLK1_c –type quadrant UL

assign_local_clock –net QCLK2_c –type quadrant LL

Step 4

Import this PDC with the netlist and run Compile again. You will see the following in the Compile

report:

The following nets have been assigned to a global resource:

Fanout Type Name

--------------------------

1536 INT_NET Net : EN_ALL_c

Driver: EN_ALL_pad_CLKINT

Source: AUTO PROMOTED

1536 SET/RESET_NET Net : ACLR_c

Driver: ACLR_pad_CLKINT

Source: AUTO PROMOTED

256 CLK_NET Net : QCLK3_c

Driver: QCLK3_pad_CLKINT

Source: AUTO PROMOTED

256 CLK_NET Net : $1N14

Driver: $1I5/Core

Source: ESSENTIAL

256 CLK_NET Net : $1N12

Driver: $1I6/Core

Source: ESSENTIAL

256 CLK_NET Net : $1N10

Driver: $1I6/Core

Source: ESSENTIAL

The following nets have been assigned to a quadrant clock resource using PDC:

Fanout Type Name

--------------------------

256 CLK_NET Net : QCLK1_c

Driver: QCLK1_pad_CLKINT

Region: quadrant_UL

256 CLK_NET Net : QCLK2_c

Driver: QCLK2_pad_CLKINT

Region: quadrant_LL

Step 5

Run Layout.

Global Management in PLL Design

This section describes the legal global network connections to PLLs in the low-power flash devices.

For detailed information on using PLLs, refer to Clock Conditioning Circuits in IGLOO and ProASIC3

Devices. Actel recommends that you use the dedicated global pins to directly drive the reference

clock input of the associated PLL for reduced propagation delays and clock distortion. However,

low-power flash devices offer the flexibility to connect other signals to reference clock inputs. Each

PLL is associated with three global networks (Figure 3-7 on page 3-9). There are some limitations,

such as when trying to use the global and PLL at the same time:

• If you use a PLL with only primary output, you can still use the remaining two free global

networks.

• If you use three globals associated with a PLL location, you cannot use the PLL on that

location.

• If the YB or YC output is used standalone, it will occupy one global, even though this signal

does not go to the global network.

Global Resources in Actel Low-Power Flash Devices

3-20 v1.1

Using Spines of Occupied Global Networks

When a signal is assigned to a global network, the flash switches are programmed to set the MUX

select lines (explained in the "Clock Aggregation Architecture" section on page 3-8) to drive the

spines of that network with the global net. However, if the global net is restricted from reaching

into the scope of a spine, the MUX drivers of that spine are available for other high-fanout or

critical signals (Figure 3-13).

For example, if you want to limit the CLK1_c signal to the left half of the chip and want use the

right side of the same global network for CLK2_c, you can add the following PDC commands:

define_region -name region1 -type inclusive 0 0 34 29

assign_net_macros region1 CLK1_c

assign_local_clock –net CLK2_c –type chip B2

Conclusion

IGLOO, Fusion, and ProASIC3 devices contain 18 global networks: 6 chip global networks and 12

quadrant global networks. These global networks can be segmented into local low-skew networks

called spines. The spines provide low-skew networks for the high-fanout signals of a design. These

allow you up to 252 different internal/external clocks in an A3PE3000 device. This document

describes the architecture for the global network, plus guidelines and methodologies in assigning

signals to globals and spines.

Figure 3-13 • Design Example Using Spines of Occupied Global Networks

Global Resources in Actel Low-Power Flash Devices

v1.1 3-21

Related Documents

Handbook Documents

Clock Conditioning Circuits in IGLOO and ProASIC3 Devices

http://www.actel.com/LPD_CCC_HBs.pdf

I/O Structures in IGLOO PLUS Devices

http://www.actel.com/documents/IGLOOPLUS_IO_HBs.pdf

I/O Structures in IGLOO and ProASIC3 Devices

http://www.actel.com/documents/IGLOO_PA3_IO_HBs.pdf

I/O Structures in IGLOOe and ProASIC3E Devices

http://www.actel.com/documents/IGLOOe_PA3E_IO_HBs.pdf

User’s Guides

IGLOO, Fusion, and ProASIC3 Macro Library Guide

http://www.actel.com/documents/pa3_libguide_ug.pdf

Part Number and Revision Date

This document contains content extracted from the Device Architecture section of the datasheet,

combined with content previously published as an application note describing features and

functions of the device. To improve usability for customers, the device architecture information has

now been combined with usage information, to reduce duplication and possible inconsistencies in

published information. No technical changes were made to the datasheet content unless explicitly

listed. Changes to the application note content were made only to be consistent with existing

datasheet information.

Part Number 51700094-005-1

Revised March 2008

Global Resources in Actel Low-Power Flash Devices

3-22 v1.1

List of Changes

The following table lists critical changes that were made in the current version of the chapter.

Previous Version Changes in Current Version (v1.1) Page

v1.0

(January 2008)

The "Global Architecture" section was updated to include the IGLOO PLUS

family. The bullet was revised to include that the west CCC does not contain

a PLL core in 15 k and 30 k devices. Instances of "A3P030 and AGL030

devices" were replaced with "15 k and 30 k gate devices."

3-1

Table 3-1 · Low-Power Flash Families and the accompanying text was

updated to include the IGLOO PLUS family. The "IGLOO Terminology"

section and "ProASIC3 Terminology" section are new.

3-2

The "VersaNet Global Network Distribution" section, "Spine Architecture"

section, the note in Figure 3-1 · Overview of VersaNet Global Network and

Device Architecture, and the note in Figure 3-2 · Simplified VersaNet Global

Network were updated to include mention of 15 k gate devices.

3-3, 3-4

Table 3-2 · Globals/Spines/Rows for IGLOO and ProASIC3 Devices was

updated to add the A3P015 device, and to revise the values for clock trees,

globals/spines per tree, and globals/spines per device for the A3P030 and

AGL030 devices.

3-5

Table 3-3 · Globals/Spines/Rows for IGLOO PLUS Devices is new. 3-5

CLKBUF_LVCMOS12 was added to Table 3-7 · I/O Standards within CLKBUF.3-11

The "Handbook Documents" section was updated to include the three

different I/O Structures chapters for ProASIC3 and IGLOO device families.

3-21

51900087-1/3.05 Figure 3-2 · Simplified VersaNet Global Network was updated. 3-4

The "Naming of Global I/Os" section was updated. 3-9

The "Using Global Macros in Synplicity" section was updated. 3-12

The "Global Promotion and Demotion Using PDC" section was updated. 3-13

The "Designer Flow for Global Assignment" section was updated. 3-15

The "Simple Design Example" section was updated. 3-17

51900087-0/1.05 Table 3-2 · Globals/Spines/Rows for IGLOO and ProASIC3 Devices was

updated.

3-5

v1.1 4-1

Clock Conditioning Circuits in IGLOO and ProASIC3 Devices

4 – Clock Conditioning Circuits in IGLOO and

ProASIC3 Devices

Introduction

This document outlines the following device information: CCC features, PLL core specifications,

functional descriptions, software configuration information, detailed usage information,

recommended board-level considerations, and other considerations concerning clock conditioning

circuits and global networks in low-power flash devices.

Overview of Clock Conditioning Circuitry

In IGLOO® and ProASIC®3 devices, the CCCs are used to implement frequency division, frequency

multiplication, phase shifting, and delay operations. The CCCs are available in six chip locations—

each of the four chip corners and the middle of the east and west chip sides. For device-specific

variations, refer to the "Device-Specific Layout" section on page 4-13.

The CCC is composed of the following:

• PLL core

• 3 phase selectors

• 6 programmable delays and 1 fixed delay that advances/delays phase

• 5 programmable frequency dividers that provide frequency multiplication/division (not

shown in Figure 4-5 on page 4-8 because they are automatically configured based on the

user's required frequencies)

• 1 dynamic shift register that provides CCC dynamic reconfiguration capability

Figure 4-1 provides a simplified block diagram of the physical implementation of the building

blocks in each of the CCCs.

Each CCC can implement up to three independent global buffers (with or without programmable

delay) or a PLL function (programmable frequency division/multiplication, phase shift, and delays)

Figure 4-1 • Overview of the CCCs Offered in IGLOO and ProASIC3

3 Global I/Os CLKA

CLKB

CLKC

To Global Network A

To Global Network B

To Global Network C

From

Core

CCC

Function Block

(with or without PLL)

Multiplexer

Tree

3 Global I/Os

Core

From

Core

From

Core

Multiple Signals

Single Signals

Clock Conditioning Circuits in IGLOO and ProASIC3 Devices

4-2 v1.1

with up to three global outputs. Unused global outputs of a PLL can be used to implement

independent global buffers, up to a maximum of three global outputs for a given CCC.

CCC Programming

The CCC block is fully configurable, either via flash configuration bits set in the programming

bitstream or through an asynchronous interface. This asynchronous dedicated shift register

interface is dynamically accessible from inside the low-power flash devices to permit parameter

changes, such as PLL divide ratios and delays, during device operation.

To increase the versatility and flexibility of the clock conditioning system, the CCC configuration is

determined either by the user during the design process, with configuration data being stored in

flash memory as part of the device programming procedure, or by writing data into a dedicated

shift register during normal device operation.

This latter mode allows the user to dynamically reconfigure the CCC without the need for core

programming. The shift register is accessed through a simple serial interface. Refer to UJTAG

Applications in Actel’s Low-Power Flash Devices.

Global Resources

Low-power flash devices provide three global routing networks (GLA, GLB, and GLC) for each of

the CCC locations. There are potentially many I/O locations; each global I/O location can be chosen

from only one of three possibilities. This is controlled by the multiplexer tree circuitry in each

global network. Once the I/O location is selected, the user has the option to utilize the CCCs before

the signals are connected to the global networks. The CCC in each location (up to six) has the same

structure, so generating the CCC macros is always done with an identical software GUI. The CCCs in

the corner locations drive the quadrant global networks, and the CCCs in the middle of the east

and west locations drive the chip global networks. The quadrant global networks span only a

quarter of the device, while the chip global networks span the entire device. For more details on

global resources offered in low-power flash devices, refer to Global Resources in Actel Low-Power

Flash Devices.

A global buffer can be placed in any of the three global locations (CLKA-GLA, CLKB-GLB, or

CLKC-GLC) of a given CCC. A PLL macro uses the CLKA CCC input to drive its reference clock. It uses

the GLA and, optionally, the GLB and GLC global outputs to drive the global networks. A PLL macro

can also drive the YB and YC regular core outputs. The GLB (or GLC) global output cannot be

reused if the YB (or YC) output is used. Refer to the "PLL Macro Signal Descriptions" section on

page 4-7 for more information.

Each global buffer, as well as the PLL reference clock, can be driven from one of the following:

• 3 dedicated single-ended I/Os using a hardwired connection

• 2 dedicated differential I/Os using a hardwired connection

• The FPGA core

Clock Conditioning Circuits in IGLOO and ProASIC3 Devices

v1.1 4-3

CCC Support in Low-Power Devices

The low-power flash families listed in Table 4-1 support the CCC feature and the functions

described in this document.

Actel's low-power flash devices (listed in Table 4-1) provide a selection of low-power, secure, live-at-