MIL SPECS |The documentation and process jconversion measures necessary to |comply with this revision shall be | | |completed by 23 May 1994 | QUE D MM 0000125 0034747? 036 MMMILS {INCH POUND | MIL-S-19500/241F 23 February 1994 SUPERSEDING MIL-S-19500/241E 28 December 1987 MILITARY SPECIFICATION SEMICONDUCTOR DEVICE, DIODE, SILICON, LOW LEAKAGE, GENERAL PURPOSE, SWITCHING TYPES 1N3595, IN3595US, 1N3595UR, 1N3595-1, IN3595UR-1, AND 41N3595US-1 JAN, JANTX, JANTXV, JANS, JANHC, and JANKC This specification is approved for use by all Depart- ments and Agencies of the Department of Defense. 1. SCOPE 1.1 Scope. of product assurance are provided for each devi of product assurance are provided for die. This specification covers the detail requirements for silicon, switching diodes. Four levels ce type as specified in MIL-S-19500 (see 6.3.2). Two levels 1.2 Physical dimensions. See 3.5 (similar to DO-35). 1.3. Maximum ratings. | | | | | | | VRum | Ig 1/ | lesn | les | Top and Tstg | | [Ta = +25C [tp = 1s jt, = ps | | Pp p | { | | | | | | | | | | | voOpk) | mA_de | mACpk) | A (pk) | c I | | | | | | | 125 L150 | 500 | 4 [-65 to +175 | 1/ Derate at 1.0 mA dc/C above Tg = +25C. 1.4 Primary electrical characteristics at Ta = #25C, unless otherwise indicated. ri l l | [Limits | Veq | VF2 | Vez | Veg | Ves | VEG | | |ig = 200 mA de |Ip = 100 mA de |Ip = 50 mA de Ip = 10 mA de [Ip = 5 mA de [Ip = 1 mA de | | | | | | i | L | | | | | | | | | Min | 0.83 Vdce | O.79Vde | 0.74 V de | 0.65 Vde | 0.60 Vde| 0.52 V de | | Max | 1.00vde | 0.92 vde [| 0.88 Vde | 0.80 V de | 0.75 Vde | 0.68 V de | i l | l { Limits ; Ip4 | Ip2 | c | trp | | Vp = 125 V de | Vp = 125 V de | Vp = OV de | Ig = 10 mA de | | | { Ta = +#150c =| f= 1 MHz | Vp = 35 V de i | | l | L | | | i | | | Hin | | | | | | Max {| 1.0 nA de [3 pA de | 8.0 pF! 3 us ms [Beneficial comments (recommendations, additions, deletions) and any pertinent data which may be of Commander, Defense Electronics Supply Center, |ATTN: DESC-ELDT, 1507 Wilmington Pike, Dayton, OH 45444-5765, by using the Standardization Document | Improvement Proposal (00 Form 1426) appearing at the end of this document or by letter. juse in improving this document should be addres AMSC N/A DISTRIBUTION STATEMENT A. sed to: i | 1 t | iL FSC 5961 Approved for public release; distribution is unlimited.MIL SPECS 44E D MM 0000125 D0a474a T?e MMNILS MIL-S-19500/241F | Dimensions Notes | | Ltr Inches | Millimeters | [Min | Max 3 Min | Max | | B | .018 | .022 | 046! .056 | L oD -055 | .090 1.40} 3.30 | 4 | | G__| .120 | .200 | 3.30| 7.62 | | L | 1.00 1.500 | 25 .40| 38.10 | | 4 | | .050 ! | 1.27 3 1. Dimensions are in inches. 2. Metric equivalents are given for general information only. 3. Lead diameter not controlled in zones L, to allow for flash, lead finish build-up, and minor irregularities other than heat slugs. 4. Dimension gD shall be measured at the largest diameter. FIGURE 1. Physical dimensions 1N3595_and_1N3595-1.MIL SPECS 44E D MM 0000125 0034749 909 MMMILS MIL-S-19500/241F D-5D Ltr Inches Millimeters Min | Max Min | Max | | 165 | .195 | 4.19 | 4.95 | | A | | | | B_ | .019 | .028 | 0.48 | 0.71 | | c_{ .003 | 0.08 | | | | | o [| .070 | .085 | 1.78 | 2.16 TYPES 1N3595US AND 1N3595US-1 NOTES: 1. Dimensions are in inches. 2. Metric equivalents are given for general information only. FIGURE 2. Physical dimensions, surface mount (US suffix) devices.MIL SPECS WUE D MM 0000225 0034750 b20 MMNILS MIL-S~19500/241F OD _t L_ ey Fj Gy | G 1 | Dimensions | | | | Symbol Inches | Millimeters | | | Min | Max | Min Max L | | | gd 063 | .067 | 1.60 | 1.70 | {+} | _ F 016 | .022 | 0.41 | 0.55 | | | | { ( T t 1 Gc | .130 | .146 | 3.30 | 3.70 | t L } 1 | | .100 ref | 2.54 ref | b | | os | .001 min | 0.03 min | i i \ i NOTES: 4. Dimensions are in inches. 2. Metric equivalents are given for general information only. FIGURE 3. Physical dimensions, surface mount (UR suffix) devices.ALL SPECS WOE D MM 0000125 0034751 St? MEMILS MIL-S-19500/241F A > t $B _ BOA Y | | | Lttr_ | Dimensions _t | [ | | | Inches | Millimeters | | | | | l L.Min | Max L.Min | Max | | | | | LA [...020 [| .022 [.508 [..559 | | | | { LB | .012 [..014 | .305 |_.355 NOTES: 1. Oimensions are in inches. 2. Metric equivalents are given for generat information only. 3. Unless otherwise specified, tolerance is +.001 (0.025 mm). 4. The physical characteristics of the die are: Thickness: .008 (0.20 mm) to .010 (0.30 mm). Top metal: Aluminum 25,000 A minimum, 35,000 A maximum. Back metal: Gold 4,000 A minimum. Back side: Cathode. FIGURE 4. Physical dimensions JANHCA and JANKCA die.MIL SPECS UNE D MM Q000125 0034752 473 MMNMILS MIL-S-19500/241F 2. APPLICABLE DOCUMENTS 2.1 Government documents. 2.1.1 Specifications, standards, and handbooks. The following specifications, standards, and handbooks form a part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are those Listed in the issue of the Department of Defense Index of Specifications and Standards (DODISS) and supplement thereto, cited in the solicitation (see 6.2). SPECIFICATION MILITARY MIL-S-19500 - Semiconductor Devices, General Specification for. STANDARD MILITARY MIL-STD-750 - Test Methods for Semiconductor Devices. (Unless otherwise indicated, copies of federal and military specifications, standards, and handbooks are available from the Standardization Document Order Desk, Building 4D, 700 Robbins Avenue, Philadelphia, PA 19120-5094. ) 2.2 Order of precedence. In the event of a conflict between the text of this document and the references cited herein, the text of this document takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Associated detail specification. The individual item requirements shalt be in accordance with MIL-S-19500, and as specified herein. 3.2 Abbreviations, symbols, and definitions. Abbreviations, symbols, and definitions used herein shall be as specified in MIL-S-19500. 3.3 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-S-19500, and figures 1, 2, 3, and 4 herein. 3.3.1 Lead finish. Lead finish shall be solderable in accordance with MIL-STD-750 and MIL~S-19500. Where a choice of Lead finish is desired, it shalt be specified in the acquisition document. 3.3.2 Dash one construction. Dash one (-1) devices shall be metallurgically bonded double plug construction in accordance with the requirements of category 1, I1, or III (see MIL-S-19500, paragraph 30.14 and subparagraphs). 3.3.3 JANS construction. ALL JANS devices shall be metallurgically bonded-thermally matched non-cavity double plug constructions utilizing only category I metatlurgical bond in accordance with MIL-S-19500. 3.4 Marking. Marking shall be in accordance with MiL-$-19500. 3.4.1 Marking of surface mount (UR_or US) devices. for surface mount devices only, alt marking except the polarity indication may be omitted from the body of the device, but shall remain on the initial container. The polarity shall be indicated with a contrasting color band to denote the cathode end or alternatly with a minimum of three contrasting color dots spaced evenly around the periphery at the cathode end.MIL SPECS UE D MM 0000325 0034753 33T MENMILS MIL-S-19500/241F 4. QUALITY ASSURANCE PROVISIONS 4.1 Sampling and inspection. specified herein. 4.2 Qualification inspection. specified herein. 4.3 Screening (JANS, JANTX, and JANTXV Levels only). MIL-S-19500 and as specified herein. herein. Sampling and inspection shall be in accordance with MIL-S-19500, and as Qualification inspection shall be in accordance with MIL-S-19500, and as Screening shall be in accordance with table IL of The following measurements shall be made in accordance with table I Devices that exceed the Limits of table I herein shall not be acceptable. Measurement Screen (see table II of MIL-S-19500) JANS Level JANTX and JANTXV levels AVeq = 50 mV change from initial value; Alp, = #0.5 nA de maximum value AVe4 s | | | | | | : | { { | 3a {Temperature cycling | Temperature cycling | | | [ | | : | 3c 1/ [Thermal impedance (see 4.5.2) |Thermal impedance (see 4.5.2) | { { t i | | | { | 9 | Ip4 and VE4 | N/A | | | | L | | | | | 11 | Inq; Veqz AVp = #50 mV change from | Ipq and Vp4 | | | initial value | | | | | [ | | | { I | | | | 12 | See 4.3.1 | See 4.3.1 | | t = 96 hours | t = 48 hours i | | | | | 13 2/ | Subgroups 2 and 3 of table I herein; [| Subgroup 2 of table I herein; | [ | i { | | | | | | i | | | | | 450 mV change from initial 4.3.1 4.4 Quality conformance inspection. Thermal impedance may be performed any time after sealing provided temperature cycling is performed +n accordance with MIL-S-19500, screen 3 prior to this thermal test. PDA = 5 percent for screen 13, applies to 4in1,4Vfiand subgroup 2 of table I herein. Thermal impedance (Zojx)is not required in screen 13. Power burn-in conditions. Power burn-in conditons are as follows: Ta = Room ambient as defined in the generat -equtrenents of MIL-STD-750; Ig = 150 mA dc. MIL-S-19500, and as specified herein. 4.4.1 Quality cecfirnan e@ espection shall be in accordance with Group A inspection. Group A inspection 2"at :# -ceducted in accordance with MIL-S-19500, and table I herein. (End-point electrical measuremerts .a.. te :n accordance with the applicable steps of table II herein.) ont aeMIL SPECS WUE D MM 0000125 0034754 276 MEMILS MIL-S-19500/241F 4.4.2 Group B inspection. Group B inspection shall be conducted in accordance with the conditions specified for subgroup testing in table IVa (JANS) and table IVb (JAN, JANTX, and JANTXV) of MIL-S-19500, and as follows. Electrical measurements (end-points) and delta requirements shall be in accordance with the applicable steps of table II herein. 4.4.2.1 Group B inspection, table IVa (JANS) of MIL-S-19500. Subgroup Method Condition B4 1037 Vp = 125 V(pk); Ta = Room ambient as defined in the general requirements of MIL-STD-750; Ig = 150 mA dc; ton = toff = 3 minutes minimum for 2,000 cycles. B5 1027 Ta = 4125C; Ip = 150 mA de; Vp = 125 V(pk). B6 Not applicable. 4.4.2.2 Group B inspection, table IVb (JAN, JANTX, and JANTXV) of MIL-S-19500. Subgroup Method Condition B3 1027 Ig = 150 mA dc; Vp = 125 V (pk); Ta = Room ambient as defined in the general requirements of MIL-STD~750. 4.4.3 Group C inspection. Group C inspection shall be conducted in accordance with the conditions specified for subgroup testing in table V of MIL-S-19500, and as follows. Electrical measurements (end points) and delta requirements shall be in accordance with the applicable steps of table II herein. Subgroup Method Condition c2 2036 Tension: Test condition A; weight = 4 pounds; t = 15 seconds. Lead fatigue: Test condition E, weight = 16 oz. Terminal strength is not applicable to surface mount devices C"UR" or US" suffix). c3 2056 Nonoperating (Not applicable to 1N3595-1). c5 Not applicable. c 1026 Ig = 150 mA dc, Vp = 125 V (pk); Ta = Room ambient as defined in the general requirements of MIL-STD-750. 4.5 Methods of inspection. Methods of inspection shall be as specified in the appropriate tables and as follows. 4.5.1 Pulse measurements. Conditions of pulse measurements shall be specified in section 4 of MIL-STD-750. 4.5.2 Thermal impedance ZeJjx_measurements for screening. The ZeJx measurements shall be performed in accordance with MIL-STD-750, method 3101. The maximum Limit (not to exceed the group A, subgroup 2 Limit) for ZeJx in screening (table 11 of MIL-S-19500) shall be derived by each vendor by means of statistical process control. When the process has exhibited control and capability, the capability data shall be used to establish the fixed screening Limit. In addition to screening, once a fixed limit has been established, monitor all_future sealing lots using a random five piece sample from each lot to be plotted on the applicable X, R chart. If a lot exhibits an out of control condition, the entire lot shall be removed from the Line and held for Engineering evaluation and disposition.MIL SPECS 4uE D Ml OOOOL2S 0034755 102 MEMILS MIL-S-19500/241F TABLE I. Group A inspection. MIL-STD-750 Limits Inspection 1/ Symbol | unit Method Conditions | Min | Max Subgroup 1 Visual and mechanical 2071 inspection Subgroup 2 | [Forward voltage 4011 | Ip = 200 mA de VF4 0.83 {1.00 | V de | Forward voltage 4011 | Ip = 100 mA de Veo 0.79 [0.92 | Vde | | Forward voltage 4011 | Ip = 50 mA de VF3 0.74 |0.88 | V de Forward voltage 4011 | Ig = 10 mA de Veg 0.65 {0.80 | V de | [ | |Forward voltage 4011 | Ip = 5 mA de Ves 0.60 [0.75 | Vde | | |Forward voltage 4011 | Ip = 1 mA de VE6 0.52 {0.68 | V de | |Reverse current 4016 | DC method; Vp = 125 V de Ip4 1.0 nA dc | | Subgroup 3 | |High temperature Ta = +150C | operation: | | Reverse current 4016 | DC method; Vp = 125 V de Ip 3.0 | yA de | |Low temperature [ Ta = -55C | operation: | | | | Breakdown voltage 4021 | Ip = 100 pA de Ver) 150 V de | | | | Subgroup 4 | | | | | | Capacitance 4001 | Vp = OV de; f = 1 MHz c 8.0 | pF | | | | | [Reverse recovery time { 4031 | Condition 4; trp 3 ys | | | | Ip = 10 mA de; | | | | | Vp = 35 V de: | | | | | R = 1,000 a; C = 10 pF | I | | | (for test setup only, recover | | | | | to 100 kilohms) | | | | | | | | | | Subgroup 5 | | | | | | | | | | | | | | | |Not applicable | | | { | | | | | | | | | See footnote at end of table.NIL SPECS W4E D MM 9000225 0034756 049 MMNILS MIL-S-19500/241F TABLE 1. Group A inspection - Continued. | MIL~STD-750 Limits i Inspection | Symbol Unit : Method | Conditions Min | Max | | Subgroup 6 | | | | | | | | | | | | | | | Surge current | 4066 [Ig = 150 mA de; | | Iles = 0.50 A; | | [ten 1 second surges, I | {1 surge/minute | | | { | | | | | | | | | | | Electrical measurements |See table II, steps 1, 2, and 4 Subgroup 7 Not applicable | | | | | 1/ for sampling plan, see MIL-S-19500. 10s HUE D MM 0000125 0034757 Tas MHMILS MIL SPEC MIL-S-19500/241F TABLE Il. Groups A, B, and C electrical measurements. 1/, 2/, 3/ | l I | Step | Inspection { MIL-STD-750 Symbol Limits Unit | | | | | | | | | | Method | Conditions [Min Max | | | | | : | | [ 1. |Forward voltage {| 4011 [Ip = 200 mA de Ve4 |. .83 [7.00 V de [ { | | | | [ | | | 2. [Reverse current | 4016 [DC method; Vp = 125 V de l1p4 | 1.0 [nA de | | { | | | | | | {| 3. [Reverse current | 4016 [DC method; Vp = 125 V de | Igo | 2.0 |nA de | | | | | | | | | [| 4. | Capacitance | 4001 |Vp = OV de; f = 1 MHZ [c | 8.0 | pF | | | | | | | { | 5. |Forward current | 4011 [Ip = 200 mA de [AVe4 | = 50 mV de change | i | | | | | from initial value | | | | | | | | | | | | | | | | | | | 6. |Reverse current | 4016 |DC method, Vp = 125 V de {Alp4 | s 100 percent of | | | | | | { initial value or { | | | | | | 0.4.nA de, whichever | | | | | | | is greater | i i | | | { l | L 41/ The electrical measurements for table IVa (JANS) of MIL-S-19500 are as follows: a. Subgroup 3, see table II herein, steps 1, 2, and 4. b. Subgroup 4, see table II herein, steps 1, 2, 4, 5, and 6, c. Subgroup 5, see table II herein, steps 1, 2, 4, 5, and 6. 2/ The electrical measurements for table IVb (JAN, JANTX, and JANTXV) of MIL-S-19500 are as follows: a. Subgroup 2, see table 11 herein, steps 1, 2, and 4. b. Subgroup 3, see table II herein, steps 1, 3, and 4. c. Subgroup 6, see table II herein, steps 1, 3, and 4. 3/ The electrical measurements for table V of MIL-S-19500 are as follows: a. Subgroup 2, see table II herein, steps 1, 2, and 4. b. Subgroup 3, see table If herein, steps 1, 2, and 4 (JAN, JANTX, and JANTXV). Subgroup 6, and JANTXV). 41 see table II herein, steps 1, 2, 4, 5, and 6 (JANS); steps 1, 3, and 4 (JAN, JANTX,MIL SPECS SHE D MM 0000125 0034756 941 MEMILS MIL-S-19500/241F 5. PACKAGING 5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-S-19500. 6. NOTES (This section contains information of a general or explanatory nature that may be helpful, but is not mandatory.) 6.1 Notes. The notes specified in MIL-S-19500 are applicable to this specification. 6.2 Acquisition requirements. Acquisition documents should specify the following: a. Title, number, and date of the specification. b. Issue of DODISS to be cited in the solicitation, and if required, the specific issue of individual documents referenced (see 2.1). c. Lead finish (see 3.3.1). d. Product assurance level and type designator. e. For die acquisition, the JANHC or JANKC designation shall be specified (see 6.3 and figure 4). 6.3 Suppliers of JANC die. The qualified JANC suppliers with the applicable letter version (example JANHCA1N3595) will be identified on the QPL under the following Part or Identifying Number (PIN). "1 1N3595 JANHCA1N3595 1 6.4 Changes from previous issue. Asterisks are not used in this revision to identify changes with respect to the previous issue due to the extensiveness of the changes. CONCLUDING MATERIAL Custodians: Preparing activity: Army - ER DLA ~ ES Navy - EC Air Force - 17 Review activities: Army - AR, MI, AV (Project 5961-1434) Navy - AS, CG, MC Air Force - 19, 85 12