© Semiconductor Components Industries, LLC, 2017
May, 2019 − Rev. 18
1Publication Order Number:
NCP170/D
NCP170
Ultra‐Low IQ 150 mA
CMOS LDO Regulator
The NCP170 series of CMOS low dropout regulators are designed
specifically for portable battery-powered applications which require
ultra-low quiescent current. The ultra-low consumption of typ. 500 nA
ensures long battery life and dynamic transient boost feature improves
device transient response for wireless communication applications.
The device is available in small 1 ×1 mm XDFN4, SOT-563 and
TSOP-5 packages.
Features
•Operating Input Voltage Range: 2.2 V to 5.5 V
•Output Voltage Range: 1.2 V to 3.6 V (0.1 V Steps)
•Ultra-Low Quiescent Current Typ. 0.5 mA
•Low Dropout: 170 mV Typ. at 150 mA
•High Output Voltage Accuracy ±1%
•Stable with Ceramic Capacitors 1 mF
•Over-Current Protection
•Thermal Shutdown Protection
•NCP170A for Active Discharge Option
•Available in Small 1 ×1 mm XDFN4, SOT−563 and TSOP-5
Packages
•These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
Typical Applications
•Battery Powered Equipments
•Portable Communication Equipments
•Cameras, Image Sensors and Camcorders
Figure 1. Typical Application Schematic
NCP170
IN
EN
OUT
VIN VOUT
1 mF1 mF
COUT
CIN
GND
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XDFN4
MX SUFFIX
CASE 711AJ
MARKING DIAGRAMS
See detailed ordering, marking and shipping information on
page 21 of this data sheet.
ORDERING INFORMATION
SOT−563
XV SUFFIX
CASE 463A
1
XX = Specific Device Code
M = Date Code
*Pb-Free indicator, “G” or microdot “G”,
may or may not be present.
XX M
1
1
6
XX = Specific Device Code
M = Month Code
G= Pb-Free Package
XX MG
1
SOT−563
XDFN4
TSOP−5
SN SUFFIX
CASE 483
1
5
(Note: Microdot may be in either location)
XXX = Specific Device Code
A = Assembly Location
Y = Year
W = Work Week
G= Pb−Free Package
1
5
XXXAYWG
G
TSOP−5
NCP170
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PIN FUNCTION DESCRIPTION
Pin No.
XDFN4
Pin No.
SOT−563
Pin No.
TSOP−5Pin Name Description
4 1 1 IN Power Supply Input Voltage
2 2 2 GND Power Supply Ground
3 6 3 EN Chip Enable Pin (Active “H”)
1 3 5 OUT Output Pin
EPAD − − EPAD Internally Connected to GND
−4 4 NC No Connect
−5−GND Power Supply Ground
ABSOLUTE MAXIMUM RATINGS
Symbol Rating Value Unit
VIN Input Voltage (Note 1) 6.0 V
VOUT Output Voltage −0.3 to VIN + 0.3 V
VCE Chip Enable Input −0.3 to 6.0 V
TJ(MAX) Maximum Junction Temperature 150 °C
TSTG Storage Temperature −55 to 150 °C
ESDHBM ESD Capability, Human Body Model (Note 2) 2000 V
ESDMM ESD Capability, Machine Model (Note 2) 200 V
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area.
2. This device series incorporates ESD protection and is tested by the following methods:
ESD Human Body Model tested per AEC-Q100-002 (EIA/JESD22-A114)
ESD Machine Model tested per AEC-Q100-003 (EIA/JESD22-A115)
Latchup Current Maximum Rating tested per JEDEC standard: JESD78
THERMAL CHARACTERISTICS
Symbol Rating Value Unit
RqJA Thermal Characteristics, Thermal Resistance, Junction-to-Air
XDFN4 1 ×1mm
SOT−563
TSOP−5
250
200
250
°C/W
Figure 2. Simplified Block Diagram
NCP170
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3
ELECTRICAL CHARACTERISTICS − VOLTAGE VERSION 1.2 V
(−40°C ≤ TJ ≤ 85°C; VIN = 2.5 V; IOUT = 1 mA, CIN = COUT = 1.0 mF, unless otherwise noted. Typical values are at TA = +25°C.) (Note 3)
Symbol Parameter Test Conditions Min Typ Max Unit
VIN Operating Input Voltage 2.2 −5.5 V
VOUT Output Voltage TA = +25°C 1.188 1.2 1.212 V
−40°C ≤ TJ ≤ 85°C 1.176 1.2 1.224
LineReg Line Regulation 2.5 V < VIN ≤ 5.5 V, IOUT = 1 mA −0.05 0.20 %/V
LoadReg Load Regulation 0 mA < IOUT ≤ 150 mA, VIN = 2.5 V −20 1 20 mV
VDO Dropout Voltage (Note 4) − − − mV
IOUT Output Current (Note 5) 150 − − mA
ISC Short Circuit Current Limit VOUT = 0 V −225 −mA
IQQuiescent Current IOUT = 0 mA −0.5 0.9 mA
ISTB Standby Current VEN = 0 V, TJ = 25°C−0.1 0.5 mA
VENH EN Pin Threshold Voltage EN Input Voltage “H” 1.2 − − V
VENL EN Pin Threshold Voltage EN Input Voltage “L” − − 0.4 V
IEN EN Pin Current VEN ≤ VIN ≤ 5.5 V (Note 6) −10 −nA
PSRR Power Supply Rejection Ratio f = 1 kHz, VIN = 2.2 V + 200 mVpp Modulation
IOUT = 150 mA
IOUT = 10 mA
−
−
57
63
−
−
dB
VNOISE Output Noise Voltage VIN = 5.5 V, IOUT = 1 mA,
f = 100 Hz to 1 MHz, COUT = 1 mF
−85 −mVrms
RLOW Active Output Discharge
Resistance (A option only)
VIN = 5.5 V, VEN = 0 V (Note 6) −100 −W
TSD Thermal Shutdown Temperature Temperature Increasing from TJ = +25°C
(Note 6)
−175 −°C
TSDH Thermal Shutdown Hysteresis Temperature Falling from TSD (Note 6) −25 −°C
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
3. Performance guaranteed over the indicated operating temperature range by design and/or characterization production tested at
TJ=T
A=25°C. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible.
4. Not Characterized at VIN = 2.2 V, VOUT = 1.2 V, IOUT = 150 mA.
5. Respect SOA.
6. Guaranteed by design and characterization.
NCP170
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ELECTRICAL CHARACTERISTICS − VOLTAGE VERSION 1.5 V
(−40°C ≤ TJ ≤ 85°C; VIN = 2.5 V; IOUT = 1 mA, CIN = COUT = 1.0 mF, unless otherwise noted. Typical values are at TA = +25°C.) (Note 7)
Symbol Parameter Test Conditions Min Typ Max Unit
VIN Operating Input Voltage 2.2 −5.5 V
VOUT Output Voltage TA = +25°C 1.485 1.5 1.515 V
−40°C ≤ TJ ≤ 85°C 1.470 1.5 1.530
LineReg Line Regulation 4.3 V < VIN ≤ 5.5 V, IOUT = 1 mA −0.05 0.20 %/V
LoadReg Load Regulation 0 mA < IOUT ≤ 150 mA, VIN = 4.3 V −20 −20 mV
VDO Dropout Voltage IOUT = 150 mA (Note 8) − − − mV
IOUT Output Current (Note 9) 150 − − mA
ISC Short Circuit Current Limit VOUT = 0 V −225 −mA
IQQuiescent Current IOUT = 0 mA −0.5 0.9 mA
ISTB Standby Current VEN = 0 V, TJ = 25°C−0.1 0.5 mA
VENH EN Pin Threshold Voltage EN Input Voltage “H” 1.2 − − V
VENL EN Pin Threshold Voltage EN Input Voltage “L” − − 0.4 V
IEN EN Pin Current VEN ≤ VIN ≤ 5.5 V (Note 10) −10 −nA
PSRR Power Supply Rejection Ratio f = 1 kHz, VIN = 2.5 V + 200 mVpp Modulation
IOUT = 150 mA −57 −
dB
VNOISE Output Noise Voltage VIN = 5.5 V, IOUT = 1 mA,
f = 100 Hz to 1 MHz, COUT = 1 mF
−90 −mVrms
RLOW Active Output Discharge
Resistance (A option only)
VIN = 5.5 V, VEN = 0 V (Note 10) −100 −W
TSD Thermal Shutdown Temperature Temperature Increasing from TJ = +25°C
(Note 10)
−175 −°C
TSDH Thermal Shutdown Hysteresis Temperature Falling from TSD (Note 10) −25 −°C
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
7. Performance guaranteed over the indicated operating temperature range by design and/or characterization production tested at
TJ=T
A=25°C. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible.
8. Not Characterized at VIN = 2.2 V, VOUT = 1.5 V, IOUT = 150 mA.
9. Respect SOA.
10.Guaranteed by design and characterization.
NCP170
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ELECTRICAL CHARACTERISTICS − VOLTAGE VERSION 1.8 V
(−40°C ≤ TJ ≤ 85°C; VIN = 2.8 V; IOUT = 1 mA, CIN = COUT = 1.0 mF, unless otherwise noted. Typical values are at TA = +25°C.) (Note 11)
Symbol Parameter Test Conditions Min Typ Max Unit
VIN Operating Input Voltage 2.2 −5.5 V
IOUT < 30 mA 2.0 −5.5
VOUT Output Voltage TA = +25°C 1.782 1.8 1.818 V
−40°C ≤ TJ ≤ 85°C 1.764 1.8 1.836
LineReg Line Regulation 2.8 V < VIN ≤ 5.5 V, IOUT = 1 mA −0.05 0.20 %/V
LoadReg Load Regulation 0 mA < IOUT ≤ 150 mA, VIN = 2.8 V −20 1 20 mV
VDO Dropout Voltage IOUT = 150 mA (Note 12) −350 480 mV
IOUT Output Current (Note 13) 150 − − mA
ISC Short Circuit Current Limit VOUT = 0 V −225 −mA
IQQuiescent Current IOUT = 0 mA −0.5 0.9 mA
ISTB Standby Current VEN = 0 V, TJ = 25°C−0.1 0.5 mA
VENH EN Pin Threshold Voltage EN Input Voltage “H” 1.2 − − V
VENL EN Pin Threshold Voltage EN Input Voltage “L” − − 0.4 V
IEN EN Pull Down Current VEN ≤ VIN ≤ 5.5 V (Note 14) −10 −nA
PSRR Power Supply Rejection Ratio f = 1 kHz, VIN = 2.8 V + 200 mVpp Modulation
IOUT = 150 mA
−57 −dB
VNOISE Output Noise Voltage VIN = 5.5 V, IOUT = 1 mA
f = 100 Hz to 1 MHz, COUT = 1 mF
−95 −mVrms
RLOW Active Output Discharge
Resistance (A option only)
VIN = 5.5 V, VEN = 0 V (Note 14) −100 −W
TSD Thermal Shutdown Temperature Temperature Increasing from TJ = +25°C
(Note 14)
−175 −°C
TSDH Thermal Shutdown Hysteresis Temperature Falling from TSD (Note 14) −25 −°C
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
11. Performance guaranteed over the indicated operating temperature range by design and/or characterization production tested at
TJ=T
A=25°C. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible.
12.Characterized when VOUT falls 54 mV below the regulated voltage and only for devices with VOUT = 1.8 V.
13.Respect SOA.
14.Guaranteed by design and characterization.
NCP170
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ELECTRICAL CHARACTERISTICS − VOLTAGE VERSION 2.5 V
(−40°C ≤ TJ ≤ 85°C; VIN = 3.5 V; IOUT = 1 mA, CIN = COUT = 1.0 mF, unless otherwise noted. Typical values are at TA = +25°C.) (Note 15)
Symbol Parameter Test Conditions Min Typ Max Unit
VIN Operating Input Voltage 2.2 −5.5 V
VOUT Output Voltage TA = +25°C 2.475 2.5 2.525 V
−40°C ≤ TJ ≤ 85°C 2.450 2.5 2.550
LineReg Line Regulation 3.5 V < VIN ≤ 5.5 V, IOUT = 1 mA −0.05 0.20 %/V
LoadReg Load Regulation 0 mA < IOUT ≤ 150 mA, VIN = 3.5 V −20 1 20 mV
VDO Dropout Voltage IOUT = 150 mA (Note 16) −240 330 mV
IOUT Output Current (Note 17) 150 − − mA
ISC Short Circuit Current Limit VOUT = 0 V −225 −mA
IQQuiescent Current IOUT = 0 mA −0.5 0.9 mA
ISTB Standby Current VEN = 0 V, TJ = 25°C−0.1 0.5 mA
VENH EN Pin Threshold Voltage EN Input Voltage “H” 1.2 − − V
VENL EN Pin Threshold Voltage EN Input Voltage “L” − − 0.4 V
IEN EN Pull Down Current VEN ≤ VIN ≤ 5.5 V (Note 18) −10 −nA
PSRR Power Supply Rejection Ratio f = 1 kHz, VIN = 3.5 V + 200 mVpp Modulation
IOUT = 150 mA
−57 −dB
VNOISE Output Noise Voltage VIN = 5.5 V, IOUT = 1 mA
f = 100 Hz to 1 MHz, COUT = 1 mF
−125 −mVrms
RLOW Active Output Discharge
Resistance (A option only)
VIN = 5.5 V, VEN = 0 V (Note 18) −100 −W
TSD Thermal Shutdown Temperature Temperature Increasing from TJ = +25°C
(Note 18)
−175 −°C
TSDH Thermal Shutdown Hysteresis Temperature Falling from TSD (Note 18) −25 −°C
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
15.Performance guaranteed over the indicated operating temperature range by design and/or characterization production tested at
TJ=T
A=25°C. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible.
16.Characterized when VOUT falls 75 mV below the regulated voltage and only for devices with VOUT = 2.5 V.
17.Respect SOA.
18.Guaranteed by design and characterization.
NCP170
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ELECTRICAL CHARACTERISTICS − VOLTAGE VERSION 2.8 V
(−40°C ≤ TJ ≤ 85°C; VIN = 3.8 V; IOUT = 1 mA, CIN = COUT = 1.0 mF, unless otherwise noted. Typical values are at TA = +25°C.) (Note 19)
Symbol Parameter Test Conditions Min Typ Max Unit
VIN Operating Input Voltage 2.2 −5.5 V
VOUT Output Voltage TA = +25°C 2.772 2.8 2.828 V
−40°C ≤ TJ ≤ 85°C 2.744 2.8 2.856
LineReg Line Regulation 3.8 V < VIN ≤ 5.5 V, IOUT = 1 mA −0.05 0.20 %/V
LoadReg Load Regulation 0 mA < IOUT ≤ 150 mA, VIN = 3.8 V −20 1 20 mV
VDO Dropout Voltage IOUT = 150 mA (Note 20) −210 300 mV
IOUT Output Current (Note 21) 150 − − mA
ISC Short Circuit Current Limit VOUT = 0 V −195 −mA
IQQuiescent Current IOUT = 0 mA −0.5 0.9 mA
ISTB Standby Current VEN = 0 V, TJ = 25°C−0.1 0.5 mA
VENH EN Pin Threshold Voltage EN Input Voltage “H” 1.2 − − V
VENL EN Pin Threshold Voltage EN Input Voltage “L” − − 0.4 V
IEN EN Pull Down Current VEN ≤ VIN ≤ 5.5 V (Note 22) −10 −nA
PSRR Power Supply Rejection Ratio f = 1 kHz, VIN = 3.8 V + 200 mVpp Modulation
IOUT = 150 mA
−40 −dB
VNOISE Output Noise Voltage VIN = 5.5 V, IOUT = 1 mA
f = 100 Hz to 1 MHz, COUT = 1 mF
−125 −mVrms
RLOW Active Output Discharge
Resistance (A option only)
VIN = 5.5 V, VEN = 0 V (Note 22) −100 −W
TSD Thermal Shutdown Temperature Temperature Increasing from TJ = +25°C
(Note 22)
−175 −°C
TSDH Thermal Shutdown Hysteresis Temperature Falling from TSD (Note 22) −25 −°C
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
19.Performance guaranteed over the indicated operating temperature range by design and/or characterization production tested at
TJ=T
A=25°C. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible.
20.Characterized when VOUT falls 84 mV below the regulated voltage and only for devices with VOUT = 2.8 V.
21.Respect SOA.
22.Guaranteed by design and characterization.
NCP170
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ELECTRICAL CHARACTERISTICS − VOLTAGE VERSION 3.0 V
(−40°C ≤ TJ ≤ 85°C; VIN = 4.0 V; IOUT = 1 mA, CIN = COUT = 1.0 mF, unless otherwise noted. Typical values are at TA = +25°C.) (Note 23)
Symbol Parameter Test Conditions Min Typ Max Unit
VIN Operating Input Voltage 2.2 −5.5 V
VOUT Output Voltage TA = +25°C 2.97 3.0 3.03 V
−40°C ≤ TJ ≤ 85°C 2.94 3.0 3.06
LineReg Line Regulation 4.0 V < VIN ≤ 5.5 V, IOUT = 1 mA −0.05 0.20 %/V
LoadReg Load Regulation 0 mA < IOUT ≤ 150 mA, VIN = 4 V −20 1 20 mV
VDO Dropout Voltage IOUT = 150 mA (Note 24) −190 260 mV
IOUT Output Current (Note 25) 150 − − mA
ISC Short Circuit Current Limit VOUT = 0 V −195 −mA
IQQuiescent Current IOUT = 0 mA −0.5 0.9 mA
ISTB Standby Current VEN = 0 V, TJ = 25°C−0.1 0.5 mA
VENH EN Pin Threshold Voltage EN Input Voltage “H” 1.2 − − V
VENL EN Pin Threshold Voltage EN Input Voltage “L” − − 0.4 V
IEN EN Pull Down Current VEN ≤ VIN ≤ 5.5 V (Note 26) −10 −nA
PSRR Power Supply Rejection Ratio f = 1 kHz, VIN = 4.0 V + 200 mVpp Modulation
IOUT = 150 mA
−47 −dB
VNOISE Output Noise Voltage VIN = 5.5 V, IOUT = 1 mA
f = 100 Hz to 1 MHz, COUT = 1 mF
−120 −mVrms
RLOW Active Output Discharge
Resistance (A option only)
VIN = 5.5 V, VEN = 0 V (Note 26) −100 −W
TSD Thermal Shutdown Temperature Temperature Increasing from TJ = +25°C
(Note 26)
−175 −°C
TSDH Thermal Shutdown Hysteresis Temperature Falling from TSD (Note 26) −25 −°C
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
23.Performance guaranteed over the indicated operating temperature range by design and/or characterization production tested at
TJ=T
A=25°C. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible.
24.Characterized when VOUT falls 90 mV below the regulated voltage and only for devices with VOUT = 3.0 V.
25.Respect SOA.
26.Guaranteed by design and characterization.
NCP170
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ELECTRICAL CHARACTERISTICS − VOLTAGE VERSION 3.3 V
(−40°C ≤ TJ ≤ 85°C; VIN = 4.3 V; IOUT = 1 mA, CIN = COUT = 1.0 mF, unless otherwise noted. Typical values are at TA = +25°C.) (Note 27)
Symbol Parameter Test Conditions Min Typ Max Unit
VIN Operating Input Voltage 2.2 −5.5 V
VOUT Output Voltage TA = +25°C 3.267 3.3 3.333 V
−40°C ≤ TJ ≤ 85°C 3.234 3.3 3.366
LineReg Line Regulation 4.3 V < VIN ≤ 5.5 V, IOUT = 1 mA −0.05 0.20 %/V
LoadReg Load Regulation 0 mA < IOUT ≤ 150 mA, VIN = 4.3 V −20 1 20 mV
VDO Dropout Voltage IOUT = 150 mA (Note 28) −180 250 mV
IOUT Output Current (Note 29) 150 − − mA
ISC Short Circuit Current Limit VOUT = 0 V −195 −mA
IQQuiescent Current IOUT = 0 mA −0.5 0.9 mA
ISTB Standby Current VEN = 0 V, TJ = 25°C−0.1 0.5 mA
VENH EN Pin Threshold Voltage EN Input Voltage “H” 1.2 − − V
VENL EN Pin Threshold Voltage EN Input Voltage “L” − − 0.4 V
IEN EN Pull Down Current VEN ≤ VIN ≤ 5.5 V (Note 30) −10 −nA
PSRR Power Supply Rejection Ratio f = 1 kHz, VIN = 4.3 V + 200 mVpp Modulation
IOUT = 150 mA
−41 −dB
VNOISE Output Noise Voltage VIN = 5.5 V, IOUT = 1 mA
f = 100 Hz to 1 MHz, COUT = 1 mF
−125 −mVrms
RLOW Active Output Discharge
Resistance (A option only)
VIN = 5.5 V, VEN = 0 V (Note 30) −100 −W
TSD Thermal Shutdown Temperature Temperature Increasing from TJ = +25°C
(Note 30)
−175 −°C
TSDH Thermal Shutdown Hysteresis Temperature Falling from TSD (Note 30) −25 −°C
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
27.Performance guaranteed over the indicated operating temperature range by design and/or characterization production tested at
TJ=T
A=25°C. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible.
28.Characterized when VOUT falls 99 mV below the regulated voltage and only for devices with VOUT = 3.3 V.
29.Respect SOA.
30.Guaranteed by design and characterization.
NCP170
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ELECTRICAL CHARACTERISTICS − VOLTAGE VERSION 3.6 V
(−40°C ≤ TJ ≤ 85°C; VIN = 4.6 V; IOUT = 1 mA, CIN = COUT = 1.0 mF, unless otherwise noted. Typical values are at TA = +25°C.) (Note 31)
Symbol Parameter Test Conditions Min Typ Max Unit
VIN Operating Input Voltage 2.2 −5.5 V
VOUT Output Voltage TA = +25°C 3.564 3.6 3.636 V
−40°C ≤ TJ ≤ 85°C 3.528 3.6 3.672
LineReg Line Regulation 4.6 V < VIN ≤ 5.5 V, IOUT = 1 mA −0.05 0.20 %/V
LoadReg Load Regulation 0 mA < IOUT ≤ 150 mA, VIN = 4.6 V −20 1 20 mV
VDO Dropout Voltage IOUT = 150 mA (Note 32) −170 240 mV
IOUT Output Current (Note 33) 150 − − mA
ISC Short Circuit Current Limit VOUT = 0 V −195 −mA
IQQuiescent Current IOUT = 0 mA −0.5 0.9 mA
ISTB Standby Current VEN = 0 V, TJ = 25°C−0.1 0.5 mA
VENH EN Pin Threshold Voltage EN Input Voltage “H” 1.2 − − V
VENL EN Pin Threshold Voltage EN Input Voltage “L” − − 0.4 V
IEN EN Pull Down Current VEN ≤ VIN ≤ 5.5 V (Note 34) −10 −nA
PSRR Power Supply Rejection Ratio f = 1 kHz, VIN = 4.6 V + 200 mVpp Modulation
IOUT = 150 mA
−30 −dB
VNOISE Output Noise Voltage VIN = 5.5 V, IOUT = 1 mA
f = 100 Hz to 1 MHz, COUT = 1 mF
−130 −mVrms
RLOW Active Output Discharge Resis-
tance (A option only)
VIN = 5.5 V, VEN = 0 V (Note 34) −100 −
TSD Thermal Shutdown Temperature Temperature Increasing from TJ = +25°C (Note 34) −175 −°C
TSDH Thermal Shutdown Hysteresis Temperature Falling from TSD (Note 34) −25 −°C
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
31.Performance guaranteed over the indicated operating temperature range by design and/or characterization production tested at TJ = TA =
25°C. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible.
32.Characterized when VOUT falls 108 mV below the regulated voltage and only for devices with VOUT = 3.6 V.
33.Respect SOA.
34.Guaranteed by design and characterization.
NCP170
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TYPICAL CHARACTERISTICS
Figure 3. Output Voltage vs. Temperature,
Vout = 1.2 V
Figure 4. Output Voltage vs. Temperature,
Vout = 1.8 V
TEMPERATURE (°C) TEMPERATURE (°C)
806040200−20−40
1.190
1.192
1.194
1.196
1.198
1.200
1.202
806040200−20−40
1.790
1.792
1.794
1.796
1.798
1.800
1.802
OUTPUT VOLTAGE (V)
OUTPUT VOLTAGE (V)
Vin = 5.5 V
Vin = 3.0 V
Vin = 2.2 V
Vin = 5.5 V
Vin = 3.5 V
Vin = 2.8 V
NCP170xxx120TyG
Cin = Cout = 1 mF
Iout = 1 mA
NCP170xxx180TyG
Cin = Cout = 1 mF
Iout = 1 mA
Figure 5. Output Voltage vs. Temperature,
Vout = 3.0 V
Figure 6. Output Voltage vs. Temperature,
Vout = 3.6 V
TEMPERATURE (°C) TEMPERATURE (°C)
806040200−20−40
2.984
2.988
2.992
2.996
3.000
3.004
3.008
806040200−20−40
3.580
3.584
3.588
3.592
3.596
3.600
3.604
Figure 7. Output Voltage vs. Output Current,
Vout = 1.2 V
Figure 8. Output Voltage vs. Output Current,
Vout = 1.8 V
OUTPUT CURRENT (mA) OUTPUT CURRENT (mA)
140120100806040200
1.194
1.195
1.196
1.197
1.198
1.199
1.200
140120100806040200
1.790
1.792
1.794
1.796
1.798
1.800
1.802
OUTPUT VOLTAGE (V)
OUTPUT VOLTAGE (V)
OUTPUT VOLTAGE (V)
OUTPUT VOLTAGE (V)
Vin = 5.5 V
Vin = 5.0 V
Vin = 3.3 − 4.5 V
NCP170xxx300TyG
Cin = Cout = 1 mF
Iout = 1 mA
Vin = 5.5 V
Vin = 5.0 V
NCP170xxx360TyG
Cin = Cout = 1 mF
Iout = 1 mA
Vin = 3.8 − 4.5 V
Vin = 5.5 V
Vin = 4.0 V
NCP170xxx120TyG
Cin = Cout = 1 mF
TA = 25°C
Vin = 3.0 V
Vin = 2.5 V
Vin = 5.5 V
Vin = 4.5 V
NCP170xxx180TyG
Cin = Cout = 1 mF
TA = 25°C
Vin = 4.0 V
Vin = 2.8 V
NCP170
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12
TYPICAL CHARACTERISTICS
Figure 9. Output Voltage vs. Output Current,
Vout = 3.0 V
Figure 10. Output Voltage vs. Output Current,
Vout = 3.6 V
OUTPUT CURRENT (mA) OUTPUT CURRENT (mA)
140120100806040200
2.996
2.997
2.998
2.999
3.000
3.001
3.002
140120100806040200
3.593
3.594
3.595
3.596
3.597
3.598
3.599
OUTPUT VOLTAGE (V)
OUTPUT VOLTAGE (V)
Vin = 5.5 V
Vin = 5.0 V
NCP170xxx300TyG
Cin = Cout = 1 mF
TA = 25°C
Vin = 4.5 V
Vin = 4.0 V
Vin = 5.5 V
Vin = 5.0 V
NCP170xxx360TyG
Cin = Cout = 1 mF
TA = 25°C
Vin = 4.6 V
Vin = 4.3 V
Figure 11. Dropout Voltage vs. Output Current,
Vout = 1.8 V
Figure 12. Dropout Voltage vs. Output Current,
Vout = 2.5 V
OUTPUT CURRENT (mA) OUTPUT CURRENT (mA)
140120100806040200
0
50
150
200
250
300
400
450
140120100806040200
0
50
100
150
200
250
300
Figure 13. Dropout Voltage vs. Output Current,
Vout = 3.0 V
Figure 14. Dropout Voltage vs. Output Current,
Vout = 3.6 V
OUTPUT CURRENT (mA) OUTPUT CURRENT (mA)
140120100806040200
0
50
100
150
200
250
140120100806040200
0
25
50
75
125
150
175
200
DROPOUT VOLTAGE (mV)
DROPOUT VOLTAGE (mV)
DROPOUT VOLTAGE (mV)
DROPOUT VOLTAGE (mV)
TA = 25°C
NCP170xxx180TyG
Cin = Cout = 1 mFTA = 85°C
TA = −40°C
100
350 TA = 25°C
NCP170xxx250TyG
Cin = Cout = 1 mFTA = 85°C
TA = −40°C
TA = 25°C
NCP170xxx300TyG
Cin = Cout = 1 mF
TA = 85°C
TA = −40°C
TA = 25°C
NCP170xxx360TyG
Cin = Cout = 1 mF
TA = 85°C
TA = −40°C
100
NCP170
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13
TYPICAL CHARACTERISTICS
Figure 15. Quiescent Current vs. Temperature,
Vout = 1.2 V
Figure 16. Quiescent Current vs. Temperature,
Vout = 2.5 V
TEMPERATURE (°C) TEMPERATURE (°C)
806040200−20−40
0.35
0.40
0.45
0.50
0.55
0.60
0.65
806040200−20−40
0.35
0.40
0.45
0.50
0.55
0.60
0.65
QUIESCENT CURRENT (mA)
QUIESCENT CURRENT (mA)
Vin = 5.5 V
Vin = 5.0 V
Vin = 2.5 − 4.0 V
NCP170xxx120TyG
Cin = Cout = 1 mF
Iout = 0
Vout = 1.2 V Vin = 5.5 V
Vin = 5.0 V
Vin = 3.5 − 4.0 V
NCP170xxx250TyG
Cin = Cout = 1 mF
Iout = 0
Vout = 2.5 V
Figure 17. Quiescent Current vs. Temperature,
Vout = 3.6 V
Figure 18. Ground Current vs. Output Current,
Vout = 1.2 V
TEMPERATURE (°C) OUTPUT CURRENT (mA)
806040200−20−40
0.35
0.40
0.45
0.50
0.55
0.60
0.65
1001010.10.01
0
10
20
30
40
50
60
70
Figure 19. Ground Current vs. Output Current,
Vout = 2.5 V
Figure 20. Ground Current vs. Output Current,
Vout = 3.6 V
OUTPUT CURRENT (mA) OUTPUT CURRENT (mA)
1001010.10.01
0
10
20
30
40
50
70
80
1001010.10.01
0
10
20
30
50
60
70
80
QUIESCENT CURRENT (mA)
GROUND CURRENT (mA)
GROUND CURRENT (mA)
GROUND CURRENT (mA)
Vin = 5.5 V
Vin = 5.0 V
NCP170xxx360TyG
Cin = Cout = 1 mF
Iout = 0
Vout = 3.6 V
Vin = 4.0 V
Vin = 5.5 V
Vin = 2.5 V
NCP170xxx120TyG
Cin = Cout = 1 mF
TA = 25°C
Vout = 1.2 V
Vin = 3.5 V
Vin = 5.5 V
Vin = 3.5 V
NCP170xxx250TyG
Cin = Cout = 1 mF
TA = 25°C
Vout = 2.5 V Vin = 4.5 V
60
40
Vin = 5.5 V
Vin = 4.6 V
NCP170xxx360TyG
Cin = Cout = 1 mF
TA = 25°C
Vout = 3.6 V Vin = 5.0 V
NCP170
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14
TYPICAL CHARACTERISTICS
Figure 21. PSRR vs. Frequency, Vout = 1.2 V Figure 22. PSRR vs. Frequency, Vout = 1.8 V
FREQUENCY (Hz) FREQUENCY (Hz)
1M100k10k1k100
0
10
20
30
50
60
70
80
1M100k10k1k100
0
10
20
30
50
60
70
80
PSRR (dB)
PSRR (dB)
Iout = 1 mA
10 mA
150 mA
100 mA
40
NCP170xxx120TyG
Cout = 1 mF
Vin = 2.2 V+ 200 mVpp modulation
TA = 25°C
Vout = 1.2 V
Iout = 1 mA
10 mA
150 mA
100 mA
NCP170xxx180TyG
Cout = 1 mF
Vin = 2.8 V+ 200 mVpp modulation
TA = 25°C
Vout = 1.8 V
40
Figure 23. PSRR vs. Frequency, Vout = 3.0 V Figure 24. PSRR vs. Frequency, Vout = 3.6 V
FREQUENCY (Hz) FREQUENCY (Hz)
1M100k10k1k100
0
10
20
30
40
50
60
70
1M100k10k1k100
0
10
20
30
40
50
60
70
Figure 25. Output Voltage Noise Spectral
Density, Vout = 1.2 V
Figure 26. Output Voltage Noise Spectral
Density, Vout = 1.8 V
FREQUENCY (Hz) FREQUENCY (Hz)
1M100k10k1k10010
0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1M100k10k1k100
0
0.2
0.6
0.8
1.2
1.4
1.6
2.0
PSRR (dB)
PSRR (dB)
OUTPUT VOLTAGE NOISE
SPECTRAL DENSITY (mV/√Hz)
Iout = 1 mA
10 mA
150 mA
100 mA
NCP170xxx300TyG
Cout = 1 mF
Vin = 4.0 V+ 200 mVpp modulation
TA = 25°C
Vout = 3.0 V
Iout = 1 mA
10 mA
150 mA
100 mA
NCP170xxx360TyG
Cout = 1 mF
Vin = 4.6 V+ 200 mVpp modulation
TA = 25°C
Vout = 3.6 V
NCP170xxx120TyG
Cin = Cout = 1 mF
Vin = 5.5 V
Vout = 1.2 V
Iout = 1 mA
TA = 25°C
NCP170xxx180TyG
Cin = Cout = 1 mF
Vin = 5.5 V
Vout = 1.8 V
Iout = 1 mA
TA = 25°C
0.4
1.0
1.8
10
OUTPUT VOLTAGE NOISE
SPECTRAL DENSITY (mV/√Hz)
NCP170
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15
TYPICAL CHARACTERISTICS
Figure 27. Output Voltage Noise Spectral
Density, Vout = 3.0 V
Figure 28. Output Voltage Noise Spectral
Density, Vout = 3.6 V
FREQUENCY (Hz) FREQUENCY (Hz)
1M100k10k1k10010
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
1M100k10k1k10010
0
0.5
1.0
1.5
2.0
3.0
3.5
4.0
OUTPUT VOLTAGE NOISE
SPECTRAL DENSITY (mV/√Hz)
NCP170xxx300TyG
Cin = Cout = 1 mF
Vin = 5.5 V
Vout = 3.0 V
Iout = 1 mA
TA = 25°C
NCP170xxx360TyG
Cin = Cout = 1 mF
Vin = 5.5 V
Vout = 3.6 V
Iout = 1 mA
TA = 25°C
2.5
OUTPUT VOLTAGE NOISE
SPECTRAL DENSITY (mV/√Hz)
NCP170
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16
TYPICAL CHARACTERISTICS
Figure 29. Load Transient Response at Load
Step from 1 mA to 50 mA, Vout = 1.2 V
Figure 30. Load Transient Response at Load
Step from 0.1 mA to 50 mA, Vout = 1.2 V
Figure 31. Load Transient Response at Load
Step from 0.1 mA to 10 mA, Vout = 1.2 V
Figure 32. Load Transient Response at Load
Step from 1 mA to 50 mA, Vout = 2.5 V
Figure 33. Load Transient Response at Load
Step from 0.1 mA to 50 mA, Vout = 2.5 V
Figure 34. Load Transient Response at Load
Step from 0.1 mA to 10 mA, Vout = 2.5 V
Output Voltage
Output Current
NCP170
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17
TYPICAL CHARACTERISTICS
Figure 35. Load Transient Response at Load
Step from 1mA to 50 mA, Vout= 3.0 V
Figure 36. Load Transient Response at Load
Step from 0.1 mA to 50 mA, Vout = 3.0 V
Figure 37. Load Transient Response at Load
Step from 0.1 mA to 10 mA, Vout = 3.0 V
Figure 38. Load Transient Response at Load
Step from 1 mA to 50 mA, Vout = 3.6 V
Figure 39. Load Transient Response at Load
Step from 0.1 mA to 50 mA, Vout = 3.6 V
Figure 40. Load Transient Response at Load
Step from 0.1 mA to 10 mA, Vout = 3.6 V
NCP170
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18
TYPICAL CHARACTERISTICS
Figure 41. Output Voltage with and without
Active Discharge Feature, Vout = 1.2 V
Figure 42. Output Voltage with and without
Active Discharge Feature, Vout = 2.5 V
Figure 43. Output Voltage with and without
Active Discharge Feature, Vout = 3.0 V
Figure 44. Output Voltage with and without
Active Discharge Feature, Vout = 3.6 V
NCP170
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20
APPLICATIONS INFORMATION
General
The NCP170 is a high performance 150 mA Linear
Regulator with Ultra Low IQ. This device delivers low
Noise and high Power Supply Rejection Ratio with excellent
dynamic performance due to employing the Dynamic
Quiescent Current adjustment which assure ultra low IQ
consumption at no – load state. These parameters make this
device very suitable for various battery powered
applications.
Input Decoupling (CIN)
It is recommended to connect at least a 1 mF Ceramic X5R
or X7R capacitor between IN and GND pins of the device.
This capacitor will provide a low impedance path for any
unwanted AC signals or Noise superimposed onto constant
Input Voltage. The good input capacitor will limit the
influence of input trace inductances and source resistance
during sudden load current changes.
Higher capacitance and lower ESR Capacitors will
improve the overall line transient response.
Output Decoupling (COUT)
The NCP170 does not require a minimum Equivalent
Series Resistance (ESR) for the output capacitor. The device
is designed to be stable with standard ceramics capacitors
with values of 1.0 mF or greater up to 10 mF. The X5R and
X7R types have the lowest capacitance variations over
temperature thus they are recommended. There is
recommended connect the output capacitor as close as
possible to the output pin of the regulator.
Enable Operation
The NCP170 uses the EN pin to enable /disable its device
and to activate /deactivate the active discharge function at
devices with this feature. If the EN pin voltage is pulled
below 0.4 V the device is guaranteed to be disable. The
active discharge transistor at the devices with Active
Discharge Feature is activated and the output voltage VOUT
is pulled to GND through an internal circuitry with effective
resistance about 100 ohms.
If the EN pin voltage is higher than 1.2 V the device is
guaranteed to be enabled. The internal active discharge
circuitry is switched off and the desired output voltage is
available at output pin. In case the Enable function is not
required the EN pin should be connected directly to input
pin.
Thermal Shutdown
When the die temperature exceeds the Thermal Shutdown
point (TSD = 175°C typical) the device goes to disabled state
and the output voltage is not delivered until the die
temperature decreases to 150°C. The Thermal Shutdown
feature provides a protection from a catastrophic device
failure at accidental overheating. This protection is not
intended to be used as a substitute for proper heat sinking.
Power Dissipation and Heat sinking
The maximum power dissipation supported by the device
is dependent upon board design and layout. Mounting pad
configuration on the PCB, the board material, and the
ambient temperature affect the rate of junction temperature
rise for the part. For reliable operation, junction temperature
should be limited to +125°C. The maximum power
dissipation the NCP170 device can handle is given by:
PD(MAX) +ƪTJ(MAX) *TAƫ
RqJA
(eq. 1)
The power dissipated by the NCP170 device for given
application conditions can be calculated from the following
equations:
PD[VINǒIGND(IOUT)Ǔ)IOUTǒVIN *VOUTǓ(eq. 2)
or
VIN(MAX) [
PD(MAX) )ǒVOUT IOUTǓ
IOUT )IGND
(eq. 3)
Hints
VIN and GND printed circuit board traces should be as
wide as possible. When the impedance of these traces is
high, there is a chance to pick up noise or cause the regulator
to malfunction. Place external components, especially the
output capacitor, as close as possible to the NCP170, and
make traces as short as possible.
NCP170
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21
ORDERING INFORMATION
Device
Nominal
Output Voltage Marking
Active
Discharge Package Shipping†
NCP170AMX120TCG 1.2 AC
Yes
XDFN4 1.0 × 1.0
(Pb-Free) 3000 / Tape & Reel
NCP170AMX135TCG 1.35 AP
NCP170AMX150TCG 1.5 AJ
NCP170AMX170TCG 1.7 AT
NCP170AMX180TAG 1.8 AD
NCP170AMX180TCG 1.8 AD
NCP170AMX190TCG 1.9 AL
NCP170AMX250TCG 2.5 AE
NCP170AMX280TAG 2.8 AF
NCP170AMX280TCG 2.8 AF
NCP170AMX285TCG 2.85 AK
NCP170AMX300TAG 3.0 AA
NCP170AMX300TCG 3.0 AA
NCP170AMX310TCG 3.1 AN
NCP170AMX320TCG 3.2 AQ
NCP170AMX330TAG 3.3 AG
NCP170AMX330TCG 3.3 AG
NCP170AMX360TCG 3.6 AM
NCP170BMX120TCG 1.2 2C
No
NCP170BMX135TCG 1.35 2P
NCP170BMX150TCG 1.5 2J
NCP170BMX170TCG 1.7 2T
NCP170BMX180TCG 1.8 2D
NCP170BMX190TCG 1.9 2L
NCP170BMX250TCG 2.5 2E
NCP170BMX280TCG 2.8 2F
NCP170BMX285TCG 2.85 2K
NCP170BMX300TCG 3.0 2A
NCP170BMX310TCG 3.1 2N
NCP170BMX320TCG 3.2 2Q
NCP170BMX330TCG 3.3 2G
NCP170BMX360TCG 3.6 2M
NCP170
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22
ORDERING INFORMATION
Device Shipping†
Package
Active
Discharge
Marking
Nominal
Output Voltage
NCP170AXV120T2G 1.2 AC
Yes
SOT−563
(Pb-Free)
4000 / Tape & Reel
(Available Soon)
NCP170AXV135T2G 1.35 AL
NCP170AXV150T2G 1.5 AJ
NCP170AXV180T2G 1.8 AD
NCP170AXV190T2G 1.9 AM
NCP170AXV210T2G 2.1 AK
NCP170AXV250T2G 2.5 AE
NCP170AXV280T2G 2.8 AF
NCP170AXV300T2G 3.0 AA
NCP170AXV310T2G 3.1 AN
NCP170AXV330T2G 3.3 AH
NCP170BXV120T2G 1.2 2C
No
NCP170BXV135T2G 1.35 2L
NCP170BXV150T2G 1.5 2J
NCP170BXV180T2G 1.8 2D
NCP170BXV190T2G 1.9 2M
NCP170BXV250T2G 2.5 2E
NCP170BXV280T2G 2.8 2F
NCP170BXV300T2G 3.0 2A
NCP170BXV310T2G 3.1 2N
NCP170BXV330T2G 3.3 2H
NCP170ASN120T2G 1.2 GCG
Yes TSOP−5
(Pb-Free)
3000 / Tape & Reel
(Available Soon)
NCP170ASN150T2G 1.5 GCH
NCP170ASN180T2G 1.8 GCF
NCP170ASN250T2G 2.5 GCE
NCP170ASN280T2G 2.8 GCA
NCP170ASN300T2G 3.0 GCC
NCP170ASN330T2G 3.3 GCD
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
NCP170
www.onsemi.com
23
PACKAGE DIMENSIONS
XDFN4 1.0x1.0, 0.65P
MX SUFFIX
CASE 711AJ
ISSUE A
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.20 mm FROM THE TERMINAL TIPS.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
ÉÉ
ÉÉ
A
B
E
D
D2
BOTTOM VIEW
b
e
4X
NOTE 3
2X 0.05 C
PIN ONE
REFERENCE
TOP VIEW
2X 0.05 C
A
A1
(A3)
0.05 C
0.05 C
CSEATING
PLANE
SIDE VIEW
L
4X
12
DIM MIN MAX
MILLIMETERS
A0.33 0.43
A1 0.00 0.05
A3 0.10 REF
b0.15 0.25
D1.00 BSC
D2 0.43 0.53
E1.00 BSC
e0.65 BSC
L0.20 0.30
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
MOUNTING FOOTPRINT*
1.20
0.26
0.24 4X
DIMENSIONS: MILLIMETERS
0.39
RECOMMENDED
PACKAGE
OUTLINE
NOTE 4
e/2
D2
45 5
A
M
0.05 BC
43
0.65
PITCH
DETAIL A
4X
b2 0.02 0.12
L2 0.07 0.17
4X
0.52
2X
0.11
4X
L24X
DETAIL A
b24X
NCP170
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24
PACKAGE DIMENSIONS
HE
DIM MIN NOM MAX
MILLIMETERS
A0.50 0.55 0.60
b0.17 0.22 0.27
C
D1.50 1.60 1.70
E1.10 1.20 1.30
e0.5 BSC
L0.10 0.20 0.30
1.50 1.60 1.70
0.020 0.021 0.023
0.007 0.009 0.011
0.059 0.062 0.066
0.043 0.047 0.051
0.02 BSC
0.004 0.008 0.012
0.059 0.062 0.066
MIN NOM MAX
INCHES
SOT−563, 6 LEAD
XV SUFFIX
CASE 463A
ISSUE G
eM
0.08 (0.003) X
b6 5 PL
A
C
−X−
−Y−
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETERS
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH THICKNESS. MINIMUM LEAD THICKNESS
IS THE MINIMUM THICKNESS OF BASE MATERIAL.
D
E
Y
12 3
45
L
6
1.35
0.0531
0.5
0.0197
ǒmm
inchesǓ
SCALE 20:1
0.5
0.0197
1.0
0.0394
0.45
0.0177
0.3
0.0118
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
HE
0.08 0.12 0.18 0.003 0.005 0.007
NCP170
www.onsemi.com
25
PACKAGE DIMENSIONS
TSOP−5
CASE 483
ISSUE M
0.7
0.028
1.0
0.039
ǒmm
inchesǓ
SCALE 10:1
0.95
0.037
2.4
0.094
1.9
0.074
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH
THICKNESS. MINIMUM LEAD THICKNESS IS THE
MINIMUM THICKNESS OF BASE MATERIAL.
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR GATE BURRS. MOLD
FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT
EXCEED 0.15 PER SIDE. DIMENSION A.
5. OPTIONAL CONSTRUCTION: AN ADDITIONAL
TRIMMED LEAD IS ALLOWED IN THIS LOCATION.
TRIMMED LEAD NOT TO EXTEND MORE THAN 0.2
FROM BODY.
DIM MIN MAX
MILLIMETERS
A
B
C0.90 1.10
D0.25 0.50
G0.95 BSC
H0.01 0.10
J0.10 0.26
K0.20 0.60
M0 10
S2.50 3.00
123
54 S
A
G
B
D
H
C
J
__
0.20
5X
CAB
T0.10
2X
2X T0.20
NOTE 5
CSEATING
PLANE
0.05
K
M
DETAIL Z
DETAIL Z
TOP VIEW
SIDE VIEW
A
B
END VIEW
1.35 1.65
2.85 3.15
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PUBLICATION ORDERING INFORMATION
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Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
NCP170/D
LITERATURE FULFILLMENT:
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