LM2742 www.ti.com SNVS266C - MARCH 2004 - REVISED MARCH 2013 LM2742 N-Channel FET Synchronous Buck Regulator Controller for Low Output Voltages Check for Samples: LM2742 FEATURES DESCRIPTION * * * The LM2742 is a high-speed, synchronous, switching regulator controller. It is intended to control currents of 0.7A to 20A with up to 95% conversion efficiencies. Power up and down sequencing is achieved with the power-good flag, adjustable soft-start and output enable features. The LM2742 operates from a lowcurrent 5V bias and can convert from a 1V to 16V power rail. The part utilizes a fixed-frequency, voltage-mode, PWM control architecture and the switching frequency is adjustable from 50kHz to 2MHz by setting the value of an external resistor. Current limit is achieved by monitoring the voltage drop across the on-resistance of the low-side MOSFET, which enables on-times on the order of 40ns, one of the best in the industry. The wide range of operating frequencies gives the power supply designer the flexibility to fine-tune component size, cost, noise and efficiency. The adaptive, nonoverlapping MOSFET gate-drivers and high-side bootstrap structure helps to further maximize efficiency. The high-side power FET drain voltage can be from 1V to 16V and the output voltage is adjustable down to 0.6V. 1 2 * * * * * * Input Power from 1V to 16V Output Voltage Adjustable down to 0.6V Power Good Flag, Adjustable Soft-start and Output Enable for Easy Power Sequencing Reference Accuracy: 1.5% (0C-125C) Current Limit Without Sense Resistor Soft Start Switching Frequency from 50 kHz to 2 MHz 40ns Typical Minimum On-time TSSOP-14 Package APPLICATIONS * * * * * * POL Power Supply Modules Cable Modems Set-Top Boxes/ Home Gateways DDR Core Power High-Efficiency Distributed Power Local Regulation of Core Power TYPICAL APPLICATION +5V 0.1P RIN 10: CIN 2.2 PF RFADJ Q1 VCC HG SD BOOT LM2742 CSS 12n LG SS PGND SGND PGND EAO 2.2k CIN1,2 10 PF 6.3V Si4884DY 1.5 PH 6.1A, 9.6 m: RCS ISEN PWGD FREQ 63.4k VIN = 3.3V CBOOT D1 Q2 VO = 1.2V@5A L1 Si4884DY Rfb2 10k + CO1,2 2200 PF 6.3V, 2.8A FB Rfb1 10k CC1 CC2 180p 2.2p RC1 392k Figure 1. Typical Application Circuit 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright (c) 2004-2013, Texas Instruments Incorporated LM2742 SNVS266C - MARCH 2004 - REVISED MARCH 2013 www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. CONNECTION DIAGRAM 1 2 4 5 6 7 HG LG PGND SGND VCC PWGD ISEN PGND LM2742 3 BOOT SD FREQ FB SS EAO 14 13 12 11 10 9 8 Figure 2. 14-Lead Plastic TSSOP JA = 155C/W PIN DESCRIPTIONS BOOT (Pin 1) - Supply rail for the N-channel MOSFET gate drive. The voltage should be at least one gate threshold above the regulator input voltage to properly turn on the high-side N-FET. LG (Pin 2) - Gate drive for the low-side N-channel MOSFET. This signal is interlocked with HG to avoid shootthrough problems PGND (Pins 3, 13) - Ground for FET drive circuitry. It should be connected to system ground. SGND (Pin 4) - Ground for signal level circuitry. It should be connected to system ground. VCC (Pin 5) - Supply rail for the controller. PWGD (Pin 6) - Power Good. This is an open drain output. The pin is pulled low when the chip is in UVP, OVP, or UVLO mode. During normal operation, this pin is connected to VCC or other voltage source through a pull-up resistor. ISEN (Pin 7) - Current limit threshold setting. This sources a fixed 50A current. A resistor of appropriate value should be connected between this pin and the drain of the low-side FET. EAO (Pin 8) - Output of the error amplifier. The voltage level on this pin is compared with an internally generated ramp signal to determine the duty cycle. This pin is necessary for compensating the control loop. SS (Pin 9) - Soft start pin. A capacitor connected between this pin and ground sets the speed at which the output voltage ramps up. Larger capacitor value results in slower output voltage ramp but also lower inrush current. FB (Pin 10) - This is the inverting input of the error amplifier, which is used for sensing the output voltage and compensating the control loop. FREQ (Pin 11) - The switching frequency is set by connecting a resistor between this pin and ground. SD (Pin 12) - IC Logic Shutdown. When this pin is pulled low the chip turns off both the high side and low side switches. While this pin is low, the IC will not start up. An internal 20A pull-up connects this pin to VCC. For a device which turns on the low side switch during shutdown, see the pin compatible LM2737. HG (Pin 14) - Gate drive for the high-side N-channel MOSFET. This signal is interlocked with LG to avoid shootthrough problems. 2 Submit Documentation Feedback Copyright (c) 2004-2013, Texas Instruments Incorporated Product Folder Links: LM2742 LM2742 www.ti.com SNVS266C - MARCH 2004 - REVISED MARCH 2013 ABSOLUTE MAXIMUM RATINGS (1) If Military/Aerospace specified devices are required, contact the Texas Instruments Semiconductor Sales Office/ Distributors for availability and specifications. VCC 7V BOOTV LG and HG to GND 21V (2) -2V to 21V Junction Temperature 150C Storage Temperature -65C to 150C Soldering Information Lead Temperature (soldering, 10sec) 260C Infrared or Convection (20sec) 235C ESD Rating (1) (2) 2 kV Absolute maximum ratings indicate limits beyond which damage to the device may occur. Operating ratings indicate conditions for which the device operates correctly. Operating Ratings do not imply ensured performance limits. The LG and HG pin can have -2V to -0.5V applied for a maximum duty cycle of 10% with a maximum period of 1 second. There is no duty cycle or maximum period limitation for a LG and HG pin voltage range of -0.5V to 21V. RECOMMENDED OPERATING CONDITIONS Supply Voltage (VCC) 4.5V to 5.5V -40C to +125C Junction Temperature Range Thermal Resistance (JA) 155C/W Submit Documentation Feedback Copyright (c) 2004-2013, Texas Instruments Incorporated Product Folder Links: LM2742 3 LM2742 SNVS266C - MARCH 2004 - REVISED MARCH 2013 www.ti.com ELECTRICAL CHARACTERISTICS VCC = 5V unless otherwise indicated. Typicals and limits appearing in plain type apply for TA=TJ=+25C. Limits appearing in boldface type apply over full Operating Temperature Range. Datasheet min/max specification limits are specified by design, test, or statistical analysis. Symbol VFB_ADJ VON Parameter FB Pin Voltage UVLO Thresholds Min Typ Max VCC = 4.5V, 0C to +125C Conditions 0.591 0.6 0.609 VCC = 5V, 0C to +125C 0.591 0.6 0.609 VCC = 5.5V, 0C to +125C 0.591 0.6 0.609 VCC = 4.5V, -40C to +125C 0.589 0.6 0.609 VCC = 5V, -40C to +125C 0.589 0.6 0.609 VCC = 5.5V, -40C to +125C 0.589 0.6 0.609 Rising Falling 4.2 3.6 Units V V SD = 5V, FB = 0.55V Fsw = 600kHz 1 1.5 2 SD = 5V, FB = 0.65V Fsw = 600kHz 0.8 1.7 2.2 Shutdown VCC Current SD = 0V 0.15 0.4 0.7 tPWGD1 PWGD Pin Response Time FB Voltage Going Up 6 tPWGD2 PWGD Pin Response Time FB Voltage Going Down 6 s 20 A IQ-V5 ISD ISS-ON ISS-OC ISEN-TH Operating VCC Current mA SD Pin Internal Pull-up Current SS Pin Source Current SS Voltage = 2.5V 0C to +125C -40C to +125C SS Pin Sink Current During Over Current SS Voltage = 2.5V ISEN Pin Source Current Trip Point 0C to +125C -40C to +125C 8 5 11 11 s 15 15 95 35 28 50 50 mA A A 65 65 A ERROR AMPLIFIER GBW G Error Amplifier Unity Gain Bandwidth 5 MHz Error Amplifier DC Gain 60 dB SR Error Amplifier Slew Rate IFB FB Pin Bias Current FB = 0.55V FB = 0.65V 6 IEAO EAO Pin Current Sourcing and Sinking VEAO = 2.5, FB = 0.55V VEAO = 2.5, FB = 0.65V 2.8 0.8 mA VEA Error Amplifier Maximum Swing Minimum Maximum 1.2 3.2 V BOOT Pin Quiescent Current BOOT = 12V, EN = 0 0C to +125C -40C to +125C 95 95 0 0 15 30 V/A 100 155 nA GATE DRIVE IQ-BOOT 4 160 215 A RDS1 Top FET Driver Pull-Up ON resistance BOOT-SW = 5V at 350mA 3 RDS2 Top FET Driver Pull-Down ON resistance BOOT-SW = 5V at 350mA 2 RDS3 Bottom FET Driver Pull-Up ON resistance BOOT-SW = 5V at 350mA 3 RDS4 Bottom FET Driver Pull-Down ON resistance BOOT-SW = 5V at 350mA 2 Submit Documentation Feedback Copyright (c) 2004-2013, Texas Instruments Incorporated Product Folder Links: LM2742 LM2742 www.ti.com SNVS266C - MARCH 2004 - REVISED MARCH 2013 ELECTRICAL CHARACTERISTICS (continued) VCC = 5V unless otherwise indicated. Typicals and limits appearing in plain type apply for TA=TJ=+25C. Limits appearing in boldface type apply over full Operating Temperature Range. Datasheet min/max specification limits are specified by design, test, or statistical analysis. Symbol Parameter Conditions Min Typ Max Units OSCILLATOR RFADJ = 590k 50 RFADJ = 88.7k fOSC D ton-min PWM Frequency Max Duty Cycle 300 RFADJ = 42.2k, 0C to +125C 500 600 700 RFADJ = 42.2k, -40C to +125C 490 600 700 kHz RFADJ = 17.4k 1400 RFADJ = 11.3k 2000 fPWM = 300kHz fPWM = 600kHz 90 88 % 40 ns Minimum on-time LOGIC INPUTS AND OUTPUTS VSD-IH SD Pin Logic High Trip Point VSD-IL SD Pin Logic Low Trip Point 0C to +125C -40C to +125C 1.3 1.25 1.6 1.6 PWGD Pin Trip Points FB Voltage Going Down 0C to +125C -40C to +125C 0.413 0.410 0.430 0.430 0.446 0.446 V FB Voltage Going Up 0C to +125C -40C to +125C 0.691 0.688 0.710 0.710 0.734 0.734 V VPWGD-TH-LO VPWGD-TH-HI VPWGD-HYS PWGD Pin Trip Points PWGD Hysteresis 2.6 FB Voltage Going Down FB Voltage Going Up 3.5 V 35 110 Submit Documentation Feedback Copyright (c) 2004-2013, Texas Instruments Incorporated Product Folder Links: LM2742 V mV 5 LM2742 SNVS266C - MARCH 2004 - REVISED MARCH 2013 www.ti.com TYPICAL PERFORMANCE CHARACTERISTICS Efficiency (VO = 1.5V) FSW = 300kHz, TA = 25C Efficiency (VO = 3.3V) FSW = 300kHz, TA = 25C 100 100 Vin = 5V Vin = 3.3V 90 90 EFFICIENCY (%) EFFICIENCY (%) 80 Vin = 5V 70 60 50 Vin = 12V 40 80 70 50 40 30 30 0.1 20 0.2 1 3 5 9 7 0.5 2 4 6 8 10 OUTPUT CURRENT (A) OUTPUT CURRENT (A) Figure 3. Figure 4. VCC Operating Current vs Temperature FSW = 600kHz, No-Load Bootpin Current vs Temperature for BOOTV = 12V FSW = 600kHz, Si4826DY FET, No-Load 30.3 1.64 1.62 30.1 Without Bootstrap (Vboot = 12V) 1.6 BOOT PIN CURRENT (mA) OPEARTING CURRENT(mA) Vin = 12V 60 1.58 1.56 With Bootstrap (Vboot = 5V) 1.54 1.52 1.5 29.9 29.7 29.5 29.3 29.1 1.48 28.9 1.46 0 20 35 55 75 95 115 AMBIENT TEMPERATURE ( C) Figure 6. Bootpin Current vs Temperature with 5V Bootstrap FSW = 600kHz, Si4826DY FET, No-Load PWM Frequency vs Temperature for RFADJ = 43.2k 8.6 630 8.4 628 8.2 626 PWM FREQUENCY (kHz) BOOT PIN CURRENT (mA) Figure 5. 8 7.8 7.6 7.4 7.2 624 622 620 618 616 614 7 612 0 10 20 25 35 45 55 65 75 85 95 105115125 0 10 20 25 35 45 55 65 75 85 95 105115 125 o AMBIENT TEMPERATURE ( C) AMBIENT TEMPERATURE (oC) Figure 7. 6 0 10 20 25 35 45 55 65 75 85 95105115 125 AMBIENT TEMPERATURE (oC) o Figure 8. Submit Documentation Feedback Copyright (c) 2004-2013, Texas Instruments Incorporated Product Folder Links: LM2742 LM2742 www.ti.com SNVS266C - MARCH 2004 - REVISED MARCH 2013 TYPICAL PERFORMANCE CHARACTERISTICS (continued) RFADJ vs PWM Frequency (in 100 to 800kHz range), TA = 25C RFADJ vs PWM Frequency (in 900 to 2000kHz range), TA = 25C 500 30 400 RF-ADJ (k:) RF-ADJ (k:) 25 300 200 20 15 100 0 100 150 200 250 300 350 400450 500 600 700 800 PWM FREQUENCY (kHz) 10 9001000110012001300140015001600170018001900 PWM FREQUENCY (kHz) Figure 9. Figure 10. VCC Operating Current Plus Boot Current vs PWM Frequency (Si4826DY FET, TA = 25C) Switch Waveforms (HG Falling) VIN = 5V, VO = 1.8V IO = 3A, CSS = 10nF, FSW = 600kHz 40 VCC PLUS BOOT CURRENT 35 30 25 20 15 10 5 0 100 300 500 700 9001100 13001500 17001900 PWM FREQUENCY (kHz) Figure 11. Figure 12. Switch Waveforms (HG Rising) VIN = 5V, VO = 1.8V IO = 3A, FSW = 600kHz Start-Up (No-Load) VIN = 10V, VO = 1.2V CSS = 10nF, FSW = 300kHz Figure 13. Figure 14. Submit Documentation Feedback Copyright (c) 2004-2013, Texas Instruments Incorporated Product Folder Links: LM2742 7 LM2742 SNVS266C - MARCH 2004 - REVISED MARCH 2013 www.ti.com TYPICAL PERFORMANCE CHARACTERISTICS (continued) Start-Up (Full-Load) VIN = 10V, VO = 1.2V IO = 10A, CSS = 10nF, FSW = 300kHz Start Up (No-Load, 10x CSS) VIN = 10V, VO = 1.2V CSS = 100nF, FSW = 300kHz Figure 15. Figure 16. Start Up (Full Load, 10x CSS) VIN = 10V, VO = 1.2V IO = 10A, CSS = 100nF, FSW = 300kHz Start Up (Into 1.2V Pre-Bias) VIN = 12V, VO = 2.5V No Load, No Soft Start Capacitor, FSW = 300kHz VO = 2.5 VO Pre-bias = 1.2V 2.0V VCSS 2A/div IIN VSD 5.0V 20 Ps/DIV Figure 17. Figure 18. Start Up (Into 1.2V Pre-Bias) VIN = 12V, VO = 2.5V No Load, CSS = 10nF, FSW = 300kHz Shutdown VIN = 12V, VO = 1.2V IO = 10A, CSS = 10nF, FSW = 300kHz VO VO Pre-bias = 1.2V 500 mV VCSS 2.0V VCSS 2.0V IIN 500 mA/div 1A/div IIN VSD 5.0V 5.0V VSD 8 400 Ps/DIV 40 Ps/DIV Figure 19. Figure 20. Submit Documentation Feedback Copyright (c) 2004-2013, Texas Instruments Incorporated Product Folder Links: LM2742 LM2742 www.ti.com SNVS266C - MARCH 2004 - REVISED MARCH 2013 TYPICAL PERFORMANCE CHARACTERISTICS (continued) Shutdown (No Load) VIN = 12V, VO = 1.2V IO = 10A, CSS = 10nF FSW = 300kHz Load Transient Response (IO = 0 to 4A) VIN = 12V, VO = 1.2V FSW = 300kHz VO 500 mV VCSS 2.0V IIN 1A/div VSD 5.0V 40 Ps/DIV Figure 21. Figure 22. Load Transient Response (IO = 4 to 0A) VIN = 12V, VO = 1.2V FSW = 300kHz Line Transient Response (VIN =5V to 12V) VO = 1.2V, IO = 5A FSW = 300kHz Figure 23. Figure 24. Line Transient Response (VIN =12V to 5V) VO = 1.2V, IO = 5A FSW = 300kHz Line Transient Response VO = 1.2V, IO = 5A FSW = 300kHz Figure 25. Figure 26. Submit Documentation Feedback Copyright (c) 2004-2013, Texas Instruments Incorporated Product Folder Links: LM2742 9 LM2742 SNVS266C - MARCH 2004 - REVISED MARCH 2013 www.ti.com TYPICAL PERFORMANCE CHARACTERISTICS (continued) VIN Peak Current During Current Limit = 12V, VO = 3.3V, ILIM = 4A, FSW = 300kHz, L = 15 H Peak Current During Current Limit VIN = 12V, VO = 3.3V, ILIM = 4A, FSW = 300kHz, L = 15 H 2V/DIV VO VO 2V/DIV 2A/DIV IL 2A/DIV 2V/DIV IL 2V/DIV VCSS VCSS 10V/DIV 10V/DIV VSW VSW 10 4 Ps/DIV 200 Ps/DIV Figure 27. Figure 28. Submit Documentation Feedback Copyright (c) 2004-2013, Texas Instruments Incorporated Product Folder Links: LM2742 LM2742 www.ti.com SNVS266C - MARCH 2004 - REVISED MARCH 2013 BLOCK DIAGRAM FREQ VCC CLOCK & RAMP UVLO SD PGND PGND SGND 20 PA off LOGIC BOOT 10 Ps DELAY HG PWGD off SYNCHRONOUS DRIVER LOGIC 3.05V 10 PA HIGH LOW LG 0.708V tol.=+/-2% 0.42V tol.=+/-2% hyst.=12% S OUTPUT CLAMP HI: 3.25V LO: 1.25V SS 3.25V 1.25V oc 95 PA R R>S SS CMP PWM 50 PA BG = 0.6V ISEN ILIM EA oc FB EAO Submit Documentation Feedback Copyright (c) 2004-2013, Texas Instruments Incorporated Product Folder Links: LM2742 11 LM2742 SNVS266C - MARCH 2004 - REVISED MARCH 2013 www.ti.com APPLICATION INFORMATION THEORY OF OPERATION The LM2742 is a voltage-mode, high-speed synchronous buck regulator with a PWM control scheme. It is designed for use in set-top boxes, thin clients, DSL/Cable modems, and other applications that require high efficiency buck converters. It has power good (PWRGD), and output shutdown (SD). Current limit is achieved by sensing the voltage VDS across the low side FET. During current limit the high side gate is turned off and the low side gate turned on. The soft start capacitor is discharged by a 95A source (reducing the maximum duty cycle) until the current is under control. START UP When VCC exceeds 4.2V and the shutdown pin SD sees a logic high the soft start capacitor begins charging through an internal fixed 10A source. During this time the output of the error amplifier is allowed to rise with the voltage of the soft start capacitor. This capacitor, CSS, determines soft start time, and can be determined approximately by: Css t ss 2.5 u 105 (1) An application for a microprocessor might need a delay of 3ms, in which case CSS would be 12nF. For a different device, a 100ms delay might be more appropriate, in which case CSS would be 400nF. (390 10%) During soft start the PWRGD flag is forced low and is released when the voltage reaches a set value. At this point this chip enters normal operation mode and the Power Good flag is released. Since the output is floating when the LM2742 is turned off, it is possible that the output capacitor may be precharged to some positive value. During start-up, the LM2742 operates fully synchronous and will discharge the output capacitor to some extent depending on the output voltage, soft start capacitance, and the size of the output capacitor. NORMAL OPERATION While in normal operation mode, the LM2742 regulates the output voltage by controlling the duty cycle of the high side and low side FETs. The equation governing output voltage is: VO = 0.6 x (RFB1 + RFB2) / RFB1 (2) The PWM frequency is adjustable between 50kHz and 2MHz and is set by an external resistor, RFADJ, between the FREQ pin and ground. The resistance needed for a desired frequency is approximately: 1.0526 RFADJ 20500 * freq kHz 1/4 (c) k: (3) MOSFET GATE DRIVERS The LM2742 has two gate drivers designed for driving N-channel MOSFETs in a synchronous mode. Power for the drivers is supplied through the BOOT pin. For the high side gate (HG) to fully turn on the top FET, the BOOT voltage must be at least one VGS(th) greater than Vin. (BOOT 2*Vin) This voltage can be supplied by a separate, higher voltage source, or supplied from a local charge pump structure. In a system such as a desktop computer, both 5V and 12V are usually available. Hence if Vin was 5V, the 12V supply could be used for BOOT. 12V is more than 2*Vin, so the HG would operate correctly. For a BOOT of 12V, the initial gate charging current is 2A, and the initial gate discharging current is typically 6A. 12 Submit Documentation Feedback Copyright (c) 2004-2013, Texas Instruments Incorporated Product Folder Links: LM2742 LM2742 www.ti.com SNVS266C - MARCH 2004 - REVISED MARCH 2013 D1 5V + VCC BOOT CBOOT HG LM2742 + LG Figure 29. BOOT Supplied by Charge Pump In a system without a separate, higher voltage, a charge pump (bootstrap) can be built using a diode and small capacitor, Figure 29. The capacitor serves to maintain enough voltage between the top FET gate and source to control the device even when the top FET is on and its source has risen up to the input voltage level. The LM2742 gate drives use a BiCMOS design. Unlike some other bipolar control ICs, the gate drivers have railto-rail swing, ensuring no spurious turn-on due to capacitive coupling. POWER GOOD SIGNAL The power good signal is the or-gated flag representing over-voltage and under-voltage protection. If the output voltage is 18% over it's nominal value, VFB = 0.7V, or falls 30% below that value, VFB = 0.41V, the power good flag goes low. It will return to a logic high whenever the feedback pin voltage is between 70% and 118% of 0.6V. The power good pin is an open drain output that can be pulled up to logic voltages of 5V or less with a 10k resistor. UVLO The 4.2V turn-on threshold on VCC has a built in hysteresis of 0.6V. Therefore, if VCC drops below 3.6V, the chip enters UVLO mode. UVLO consists of turning off the top FET, turning off the bottom FET, and remaining in that condition until VCC rises above 4.2V. As with shutdown, the soft start capacitor is discharged through a FET, ensuring that the next start-up will be smooth. CURRENT LIMIT Current limit is realized by sensing the voltage across the low side FET while it is on. The RDSON of the FET is a known value, hence the current through the FET can be determined as: VDS = I * RDSON (4) The current through the low side FET while it is on is also the falling portion of the triangle wave inductor current. The current limit threshold is determined by an external resistor, RCS, connected between the switch node and the ISEN pin. A constant current of 50 A is forced through RCS, causing a fixed voltage drop. This fixed voltage is compared against VDS and if the latter is higher, the current limit of the chip has been reached. RCS can be found by using the following equation: RCS = RDSON(LOW) * ILIM/50A (5) For example, a conservative 15A current limit in a 10A design with a minimum RDSON of 10m would require a 3.3k resistor. Because current sensing is done across the low side FET, no minimum high side on-time is necessary. In the current limit mode the LM2727/37 will turn the high side off and the keep low side on for as long as necessary. The LM2727/37 enters current limit mode if the inductor current exceeds the current limit threshold at the point where the high side FET turns off and the low side FET turns on. (The point of peak inductor current. See Figure 30.) Note that in normal operation mode the high side FET always turns on at the Submit Documentation Feedback Copyright (c) 2004-2013, Texas Instruments Incorporated Product Folder Links: LM2742 13 LM2742 SNVS266C - MARCH 2004 - REVISED MARCH 2013 www.ti.com beginning of a clock cycle. In current limit mode, by contrast, the high side FET on pulse is skipped. This causes inductor current to fall. Unlike a normal operation switching cycle, however, in a current limit mode switching cycle the high side FET will turn on as soon as inductor current has fallen to the current limit threshold. The LM2727/37 will continue to skip high side FET pulses until the inductor current peak is below the current limit threshold, at which point the system resumes normal operation. Normal Operation Current Limit ILIM IL D Figure 30. Current Limit Threshold Unlike a high side FET current sensing scheme, which limits the peaks of inductor current, low side current sensing is only allowed to limit the current during the converter off-time, when inductor current is falling. Therefore in a typical current limit plot the valleys are normally well defined, but the peaks are variable, according to the duty cycle. The PWM error amplifier and comparator control the off pulse of the high side FET, even during current limit mode, meaning that peak inductor current can exceed the current limit threshold. Assuming that the output inductor does not saturate, the maximum peak inductor current during current limit mode can be calculated with the following equation: IPK-CL ILIM TOSC 200 ns VIN VO L (6) Where TOSC is the inverse of switching frequency fOSC. The 200ns term represents the minimum off-time of the duty cycle, which ensures enough time for correct operation of the current sensing circuitry. See the plots entitled Peak Current During Current Limit in the Typical Performance Characteristics section. In order to minimize the time period in which peak inductor current exceeds the current limit threshold, the IC also discharges the soft start capacitor through a fixed 95 A source. The output of the LM2727/37 internal error amplifier is limited by the voltage on the soft start capacitor. Hence, discharging the soft start capacitor reduces the maximum duty cycle D of the controller. During severe current limit this reduction in duty cycle will reduce the output voltage if the current limit conditions last for an extended time. Output inductor current will be reduced in turn to a flat level equal to the current limit threshold. The third benefit of the soft start capacitor discharge is a smooth, controlled ramp of output voltage when the current limit condition is cleared. During the first few nanoseconds after the low side gate turns on, the low side FET body diode conducts. This causes an additional 0.7V drop in VDS. The range of VDS is normally much lower. For example, if RDSON were 10m and the current through the FET was 10A, VDS would be 0.1V. The current limit would see 0.7V as a 70A current and enter current limit immediately. Hence current limit is masked during the time it takes for the high side switch to turn off and the low side switch to turn on. SHUT DOWN If the shutdown pin SD is pulled low, the LM2742 discharges the soft start capacitor through a MOSFET switch. The high side and low side switches are turned off. The LM2742 remains in this state until SD is released. 14 Submit Documentation Feedback Copyright (c) 2004-2013, Texas Instruments Incorporated Product Folder Links: LM2742 LM2742 www.ti.com SNVS266C - MARCH 2004 - REVISED MARCH 2013 DESIGN CONSIDERATIONS The following is a design procedure for all the components needed to create the circuit shown in Figure 32 in the Example Circuits section, a 5V in to 1.2V out converter, capable of delivering 10A with an efficiency of 85%. The switching frequency is 300kHz. The same procedures can be followed to create many other designs with varying input voltages, output voltages, and output currents. Input Capacitor The input capacitors in a Buck switching converter are subjected to high stress due to the input current waveform, which is a square wave. Hence input caps are selected for their ripple current capability and their ability to withstand the heat generated as that ripple current runs through their ESR. Input rms ripple current is approximately: png (7) The power dissipated by each input capacitor is: PD 2 Irms ESR rip n 2 (8) Here, n is the number of capacitors, and indicates that power loss in each cap decreases rapidly as the number of input caps increase. The worst-case ripple for a Buck converter occurs during full load, when the duty cycle D = 50%. In the 5V to 1.2V case, D = 1.2/5 = 0.24. With a 10A maximum load the ripple current is 4.3A. The Sanyo 10MV5600AX aluminum electrolytic capacitor has a ripple current rating of 2.35A, up to 105C. Two such capacitors make a conservative design that allows for unequal current sharing between individual caps. Each capacitor has a maximum ESR of 18m at 100 kHz. Power loss in each device is then 0.05W, and total loss is 0.1W. Other possibilities for input and output capacitors include MLCC, tantalum, OSCON, SP, and POSCAPS. Input Inductor The input inductor serves two basic purposes. First, in high power applications, the input inductor helps insulate the input power supply from switching noise. This is especially important if other switching converters draw current from the same supply. Noise at high frequency, such as that developed by the LM2742 at 1MHz operation, could pass through the input stage of a slower converter, contaminating and possibly interfering with its operation. An input inductor also helps shield the LM2742 from high frequency noise generated by other switching converters. The second purpose of the input inductor is to limit the input current slew rate. During a change from no-load to full-load, the input inductor sees the highest voltage change across it, equal to the full load current times the input capacitor ESR. This value divided by the maximum allowable input current slew rate gives the minimum input inductance: Lin 'V di * dt (c) max (9) In the case of a desktop computer system, the input current slew rate is the system power supply or "silver box" output current slew rate, which is typically about 0.1A/s. Total input capacitor ESR is 9m, hence V is 10*0.009 = 90 mV, and the minimum inductance required is 0.9H. The input inductor should be rated to handle the DC input current, which is approximated by: I IN DC IO D K (10) In this case IIN-DC is about 2.8A. One possible choice is the TDK SLF12575T-1R2N8R2, a 1.2H device that can handle 8.2Arms, and has a DCR of 7m. Submit Documentation Feedback Copyright (c) 2004-2013, Texas Instruments Incorporated Product Folder Links: LM2742 15 LM2742 SNVS266C - MARCH 2004 - REVISED MARCH 2013 www.ti.com Output Inductor The output inductor forms the first half of the power stage in a Buck converter. It is responsible for smoothing the square wave created by the switching action and for controlling the output current ripple. (Io) The inductance is chosen by selecting between tradeoffs in output ripple, efficiency, and response time. The smaller the output inductor, the more quickly the converter can respond to transients in the load current. If the inductor value is increased, the ripple through the output capacitor is reduced and thus the output ripple is reduced. As shown in the efficiency calculations, a smaller inductor requires a higher switching frequency to maintain the same level of output current ripple. An increase in frequency can mean increasing loss in the FETs due to the charging and discharging of the gates. Generally the switching frequency is chosen so that conduction loss outweighs switching loss. The equation for output inductor selection is: (11) A good range for Io is 25 to 50% of the output current. In the past, 30% was considered a maximum value for output currents higher than about 2Amps, but as output capacitor technology improves the ripple current can be allowed to increase. Plugging in the values for output current ripple, input voltage, output voltage, switching frequency, and assuming a 40% peak-to-peak output current ripple yields an inductance of 1.5H. The output inductor must be rated to handle the peak current (also equal to the peak switch current), which is (Io + 0.5*Io). This is 12A for a 10A design. The Coilcraft D05022-152HC is 1.5H, is rated to 15Arms, and has a DCR of 4m. Output Capacitor The output capacitor forms the second half of the power stage of a Buck switching converter. It is used to control the output voltage ripple (Vo) and to supply load current during fast load transients. In this example the output current is 10A and the expected type of capacitor is an aluminum electrolytic, as with the input capacitors. (Other possibilities include ceramic, tantalum, and solid electrolyte capacitors, however the ceramic type often do not have the large capacitance needed to supply current for load transients, and tantalums tend to be more expensive than aluminum electrolytic.) Aluminum capacitors tend to have very high capacitance and fairly low ESR, meaning that the ESR zero, which affects system stability, will be much lower than the switching frequency. The large capacitance means that at switching frequency, the ESR is dominant, hence the type and number of output capacitors is selected on the basis of ESR. One simple formula to find the maximum ESR based on the desired output voltage ripple, Vo and the designed output current ripple, Io, is: ESRMAX 'Vo 'Io (12) In this example, in order to maintain a 2% peak-to-peak output voltage ripple and a 40% peak-to-peak inductor current ripple, the required maximum ESR is 6m. Three Sanyo 10MV5600AX capacitors in parallel will give an equivalent ESR of 6m. The total bulk capacitance of 16.8mF is enough to supply even severe load transients. Using the same capacitors for both input and output also keeps the bill of materials simple. MOSFETS MOSFETS are a critical part of any switching controller and have a direct impact on the system efficiency. In this case the target efficiency is 85% and this is the variable that will determine which devices are acceptable. Loss from the capacitors, inductors, and the LM2742 is detailed in the Efficiency section, and come to about 0.54W. To meet the target efficiency, this leaves 1.45W for the FET conduction loss, gate charging loss, and switching loss. Switching loss is particularly difficult to estimate because it depends on many factors. When the load current is more than about 1 or 2 amps, conduction losses outweigh the switching and gate charging losses. This allows FET selection based on the RDSON of the FET. Adding the FET switching and gate-charging losses to the equation leaves 1.2W for conduction losses. The equation for conduction loss is: PCnd = D(I2o * RDSON *k) + (1-D)(I2o * RDSON *k) (13) The factor k is a constant which is added to account for the increasing RDSON of a FET due to heating. Here, k = 1.3. The Si4442DY has a typical RDSON of 4.1m. When plugged into the equation for PCND the result is a loss of 0.533W. If this design were for a 5V to 2.5V circuit, an equal number of FETs on the high and low sides would be the best solution. With the duty cycle D = 0.24, it becomes apparent that the low side FET carries the load current 76% of the time. Adding a second FET in parallel to the bottom FET could improve the efficiency by lowering the effective RDSON. The lower the duty cycle, the more effective a second or even third FET can be. For a minimal increase in gate charging loss (0.054W) the decrease in conduction loss is 0.15W. What was an 85% design improves to 86% for the added cost of one SO-8 MOSFET. 16 Submit Documentation Feedback Copyright (c) 2004-2013, Texas Instruments Incorporated Product Folder Links: LM2742 LM2742 www.ti.com SNVS266C - MARCH 2004 - REVISED MARCH 2013 Control Loop Components The circuit is this design example and the others shown in the Example Circuits section have been compensated to improve their DC gain and bandwidth. The result of this compensation is better line and load transient responses. For the LM2742, the top feedback divider resistor, Rfb2, is also a part of the compensation. For the 10A, 5V to 1.2V design, the values are: Cc1 = 4.7pF 10%, Cc2 = 1nF 10%, Rc = 229k 1%. These values give a phase margin of 63 and a bandwidth of 29.3kHz. Support Capacitors and Resistors The Cinx capacitors are high frequency bypass devices, designed to filter harmonics of the switching frequency and input noise. Two 1F ceramic capacitors with a sufficient voltage rating (10V for the Circuit of Figure 32) will work well in almost any case. RIN and CIN are standard filter components designed to ensure smooth DC voltage for the chip supply. Depending on noise, RIN should be 10 to 100, and CIN should be between 0.1 and 2.2 F. CBOOT is the bootstrap capacitor, and should be 0.1F. (In the case of a separate, higher supply to the BOOT pin, this 0.1F cap can be used to bypass the supply.) Using a Schottky device for the bootstrap diode allows the minimum drop for both high and low side drivers. The On Semiconductor BAT54 or MBR0520 work well. Rp is a standard pull-up resistor for the open-drain power good signal, and should be 10k. If this feature is not necessary, it can be omitted. RCS is the resistor used to set the current limit. Since the design calls for a peak current magnitude (Io + 0.5 * Io) of 12A, a safe setting would be 15A. (This is well below the saturation current of the output inductor, which is 25A.) Following the equation from the Current Limit section, use a 3.3k resistor. RFADJ is used to set the switching frequency of the chip. Following the equation in the Theory of Operation section, the closest 1% tolerance resistor to obtain fSW = 300kHz is 88.7k. CSS depends on the users requirements. Based on the equation for CSS in the Theory of Operation section, for a 3ms delay, a 12nF capacitor will suffice. EFFICIENCY CALCULATIONS A reasonable estimation of the efficiency of a switching controller can be obtained by adding together the loss is each current carrying element and using the equation: K Po Po Ptotal (14) loss The following shows an efficiency calculation to complement the Circuit of Figure 32. Output power for this circuit is 1.2V x 10A = 12W. Chip Operating Loss PIQ = IQ-VCC *VCC (15) 2mA x 5V = 0.01W FET Gate Charging Loss PGC = n * VCC * QGS * fOSC (16) The value n is the total number of FETs used. The Si4442DY has a typical total gate charge, QGS, of 36nC and an rds-on of 4.1m. For a single FET on top and bottom: 2*5*36E-9*300,000 = 0.108W FET Switching Loss PSW = 0.5 * Vin * IO * (tr + tf)* fOSC (17) The Si4442DY has a typical rise time tr and fall time tf of 11 and 47ns, respectively. 0.5*5*10*58E-9*300,000 = 0.435W FET Conduction Loss PCn = 0.533W (18) Input Capacitor Loss Submit Documentation Feedback Copyright (c) 2004-2013, Texas Instruments Incorporated Product Folder Links: LM2742 17 LM2742 SNVS266C - MARCH 2004 - REVISED MARCH 2013 PCin I INrms 2 Irms rip www.ti.com ESR n rip IO (19) D 1 D (20) 4.282*0.018/2 = 0.164W Input Inductor Loss PLin = I2in * DCRinput-L I D IIN O Kest ' d (21) (22) 2 2.82 *0.007 = 0.055W Output Inductor Loss PLout = I2o * DCRoutput-L (23) 2 10 *0.004 = 0.4W System Efficiency 12 22 1.7 87.5% (24) Example Circuits +5V RIN 10 CIN 2.2P RFADJ 0.1P CINX 1 PF, 25V Q1 VCC HG SD BOOT 2.7 PH 14.4A, 4.5 m: RCS ISEN PWGD LM2742 FREQ 88.7k 1.2 PH 8.2A, 6.9 m: CBOOT D1 SS LG Vo = 3.3V@10A L1 1.8k Q2 Rfb2 PGND 49.9k CSS 12n SGND PGND EAO VIN = 12V LIN + CIN1,2 2 x 10 PF 25V, 3.3A Rc2 + Co1-4 4 x 100 PF 10V, 55 m: Cc3 FB 8.45k Cc1 Cc2 270p 6.8p 470p Rfb1 11k Rc1 143.3k Figure 31. 5V-16V to 3.3V, 10A, 300kHz This circuit and the one featured on the front page have been designed to deliver high current and high efficiency in a small package, both in area and in height The tallest component in this circuit is the inductor L1, which is 6mm tall. The compensation has been designed to tolerate input voltages from 5 to 16V. 18 Submit Documentation Feedback Copyright (c) 2004-2013, Texas Instruments Incorporated Product Folder Links: LM2742 LM2742 www.ti.com SNVS266C - MARCH 2004 - REVISED MARCH 2013 1.2 PH 8.2A, 6.9 m: CBOOT D1 RIN 10 VIN = 5V LIN CINx1, 2 + CIN1,2 2x1 PF 2 x 5600 PF 10V 10V, 2.35A 0.1P Q1 CIN VCC 2.2P SD HG BOOT PWGD RFADJ ISEN LM2742 FREQ 88.7k CSS 12n 1.5 PH 15A, 4 m: RCS LG SS PGND SGND PGND EAO Vo = 1.2V@10A L1 1.5k Q2 + Co1-3 3 x 5600 PF 10V, 3.1A 18 m: Rfb2 4.99k FB Rfb1 4.99k Cc1 Cc2 Rc1 4.7p 229k 270p Figure 32. 5V to 1.2V, 10A, 300kHz This circuit design, detailed in the Design Considerations section, uses inexpensive aluminum capacitors and offthe-shelf inductors. It can deliver 10A at better than 85% efficiency. Large bulk capacitance on input and output ensure stable operation. +12V VIN = 5V Cc 0.1P RIN 10 CIN VCC 2.2P SD RFADJ HG BOOT LM2742 FREQ 43.2k Css 12n Rcs ISEN PWGD LG SS PGND SGND PGND EAO + Q1/Q2 2.7k CIN1 100 PF 10V, 1.9A 2.2 PH 6.1A, 12 m: Vo = 1.8V@3A L1 Rfb2 4.99k + Co1 1 x 220 PF 4V, 55 m: FB Rfb1 Cc1 Cc2 560p 10p 2.49k RC1 51.1k Figure 33. 5V to 1.8V, 3A, 600kHz The example circuit of Figure 33 has been designed for minimum component count and overall solution size. A switching frequency of 600kHz allows the use of small input/output capacitors and a small inductor. The availability of separate 5V and 12V supplies (such as those available from desk-top computer supplies) and the low current further reduce component count. Using the 12V supply to power the MOSFET drivers eliminates the bootstrap diode, D1. At low currents, smaller FETs or dual FETs are often the most efficient solutions. Here, the Si4826DY, an asymmetric dual FET in an SO-8 package, yields 92% efficiency at a load of 2A. Submit Documentation Feedback Copyright (c) 2004-2013, Texas Instruments Incorporated Product Folder Links: LM2742 19 LM2742 SNVS266C - MARCH 2004 - REVISED MARCH 2013 www.ti.com +5V 1 PH 4.5A, 7.5 m: CBOOT D1 VIN = 3.3V RIN 10 LIN 0.1P CIN VCC 2.2P SD BOOT PWGD RFADJ Q1 HG Rcs 1 PH 11A, 3.7 m: 3.3k L1 ISEN FREQ LG Css 12n SS PGND SGND PGND EAO + CIN1 1 x 5600 PF 10V, 2.35A Vo = 0.8V@5A + Co1,2 2 x 4700 PF 16V, 2.8A Rfb2 Q2 49.9k CINx 1 PF 10V 4.99k FB Rfb1 Cc1 14.9k Cc2 Rc1 4.7p 147k 680p Figure 34. 3.3V to 0.8V, 5A, 500kHz The circuit of Figure 34 demonstrates the LM2742 delivering a low output voltage at high efficiency (87%). A separate 5V supply is required to run the chip, however the input voltage can be as low as 2.2 +5V D1 1 PH 6.4A, 7.3 m: CBOOT RIN 10 0.1P HG VCC CIN 2.2P SD BOOT PWGD RFADJ LG SS PGND SGND PGND EAO Vo = 1.8V@1A Rfb2 10k Rc2 66.5 Cc1 Cc2 1 x 15 PF 25V, 3.3A L1 1.5k FB Css + Q1/Q2 3.3 PH 4.1A, 17.4 m: ISEN LM2742 FREQ 17.4k Rcs VIN = 5 to 15V LIN Cc3 680p + Co1 1 x 15 PF 25V, 3.1 m: Rfb1 4.99k Rc1 22p 39n 680p 10.7k 1 PF 6.4A, 7.3 m: +5V CBOOT D1 RIN 10 CIN 2.2P VIN = 5 to 15V LIN + CIN1 1 x 15 PF 25V, 3.3A 0.1P SD BOOT PWGD RFADJ LM2742 FREQ 17.4k Q1/Q2 4.7 PF 3.4A, 26 m: HG VCC ISEN LG SS PGND SGND PGND EAO Rcs Rfb2 10k Rc2 FB 54.9 Cc1 Cc2 1n 27p Vo = 3.3V@1A L1 1.5k + Co1 1 x 15 PF 25V, 3.1 m: Cc3 820p Rfb1 2.21k Rc1 12.1k Figure 35. 1.8V and 3.3V, 1A, 1.4MHz, Simultaneous 20 Submit Documentation Feedback Copyright (c) 2004-2013, Texas Instruments Incorporated Product Folder Links: LM2742 LM2742 www.ti.com SNVS266C - MARCH 2004 - REVISED MARCH 2013 The circuits in Figure 35 are intended for ADSL applications, where the high switching frequency keeps noise out of the data transmission range. In this design, the 1.8 and 3.3V outputs come up simultaneously by using the same softstart capacitor. Because two current sources now charge the same capacitor, the capacitance must be doubled to achieve the same softstart time. (Here, 40nF is used to achieve a 5ms softstart time.) A common softstart capacitor means that, should one circuit enter current limit, the other circuit will also enter current limit. The additional compensation components Rc2 and Cc3 are needed for the low ESR, all ceramic output capacitors, and the wide (3x) range of Vin. To 2nd LM27x7 VIN = 11 to 13V +5V LM78L05 1 PH, 6.4A 7.3 m: CBOOT D1 0.1P CIN VCC 2.2P SD LM2742 FREQ 32.5k Css 12n Rcs 680 PF 16V, 1.54A Vo = 3.3V@3A ISEN PWGD RFADJ + CIN1 CINx 10 PF 16V Q1/Q2 4.2 PH, 5.5A 15 m: HG BOOT 2k LG SS PGND SGND PGND EAO VIN = 11 to 13V LIN + Co1,2 2 x 680 PF 16V, 1.54A Rfb2 10k RC2 CC3 Cox 10 PF 25V FB 2.37k CC1 CC2 Rfb1 4.7n 2.21k RC1 8.2p 52.3k 1n Figure 36. 12V Unregulated to 3.3V, 3A, 750kHz This circuit shows the LM2742 paired with a cost effective solution to provide the 5V chip power supply, using no extra components other than the LM78L05 regulator itself. The input voltage comes from a 'brick' power supply which does not regulate the 12V line tightly. Additional, inexpensive 10uF ceramic capacitors (Cinx and Cox) help isolate devices with sensitive databands, such as DSL and cable modems, from switching noise and harmonics. +5V (low current source) CBOOT D1 VIN = 12V 0.1P CIN 2.2P RFADJ HG VCC SD BOOT PWGD ISEN LM2742 FREQ 267k CSS 12n PGND SGND PGND EAO Vo = 5V@1.8A L1 LG SS CINX + CIN1 680 PF 10 PF 16V 16V 1.54A Q1 47 PH, 2.7A 53 m: D2 RFB2 10k RC2 CC3 + Co1,2 2 x 680 PF 16V 26 m: Cox 10 PF 6.3V FB 750 CC1 CC2 3.9n 56p 22n RFB1 1.37k RC1 61.9k Figure 37. 12V to 5V, 1.8A, 100kHz In situations where low cost is very important, the LM2742 can also be used as an asynchronous controller, as shown in the above circuit. Although a a schottky diode in place of the bottom FET will not be as efficient, it will cost much less than the FET. The 5V at low current needed to run the LM2742 could come from a zener diode or inexpensive regulator, such as the one shown in Figure 36. Because the LM2742 senses current in the low side MOSFET, the current limit feature will not function in an asynchronous design. The ISEN pin should be left open in this case. Submit Documentation Feedback Copyright (c) 2004-2013, Texas Instruments Incorporated Product Folder Links: LM2742 21 LM2742 SNVS266C - MARCH 2004 - REVISED MARCH 2013 www.ti.com Table 1. Bill of Materials for Typical Application Circuit (Figure 1) ID U1 Part Number Type Synchronous Controller LM2742 Q1, Q2 Si4884DY L1 RLF7030T-1R5N6R1 N-MOSFET Cin1, Cin2 C2012X5R1J106M MLCC Capacitor Cinx C3216X7R1E105K Co1, Co2 6MV2200WG Cboot VJ1206X104XXA Inductor Size Parameters Qty. Vendor TSSOP-14 TSSOP-14 1 NSC SO-8 30V, 13m, 15nC 1 Vishay 7.1x7.1x3.2mm 1.5H, 6.1A 9.6m 1 TDK 0805 10F 6.3V 2 TDK 1206 1F, 25V 1 TDK 10mm D 20mm H 2200F 6.3V125m 2 Sanyo Capacitor 1206 0.1F, 25V 1 Vishay AL-E Cin C3216X7R1E225K Capacitor 1206 2.2F, 25V 1 TDK Css VJ1206X123KXX Capacitor 1206 12nF, 25V 1 Vishay Cc1 VJ1206A2R2KXX Capacitor 1206 2.2pF 10% 1 Vishay Cc2 VJ1206A181KXX Capacitor 1206 180pF 10% 1 Vishay Rin CRCW1206100J Resistor 1206 10 5% 1 Vishay Rfadj CRCW12066342F Resistor 1206 63.4k 1% 1 Vishay Rc1 CRCW12063923F Resistor 1206 392k 1% 1 Vishay Rfb1 CRCW12061002F Resistor 1206 10k 1% 1 Vishay Rfb2 CRCW12061002F Resistor 1206 10k 1% 1 Vishay Rcs CRCW1206222J Resistor 1206 2.2k 5% 1 Vishay Table 2. Bill of Materials for Circuit of Figure 31 (Identical to BOM for 1.5V except as noted below) ID Part Number Size Parameters Qty. Vendor L1 RLF12560T-2R7N110 Inductor Type 12.5x12.8x6mm 2.7H, 14.4A 4.5m 1 TDK Co1, Co2, Co3, Co4 10TPB100M POSCAP 7.3x4.3x2.8mm 100F 10V 1.9Arms 4 Sanyo Cc1 VJ1206A6R8KXX Capacitor 1206 6.8pF 10% 1 Vishay Cc2 VJ1206A271KXX Capacitor 1206 270pF 10% 1 Vishay Cc3 VJ1206A471KXX Capacitor 1206 470pF 10% 1 Vishay Rc2 CRCW12068451F Resistor 1206 8.45k 1% 1 Vishay Rfb1 CRCW12061102F Resistor 1206 11k 1% 1 Vishay Qty. Vendor 1 NSC Table 3. Bill of Materials for Circuit of Figure 32 ID 22 Part Number Type Synchronous Controller Size Parameters U1 LM2742 Q1 Si4442DY N-MOSFET SO-8 30V, 4.1m, @ 4.5V, 36nC 1 Vishay Q2 Si4442DY N-MOSFET SO-8 30V, 4.1m, @ 4.5V, 36nC 1 Vishay D1 BAT-54 SOT-23 30V 1 Vishay Lin SLF12575T-1R2N8R2 Inductor 12.5x12.5x7.5mm 12H, 8.2A, 6.9m 1 Coilcraft L1 D05022-152HC Inductor 22.35x16.26x8mm 1.5H, 15A,4m 1 Coilcraft 16mm D 25mm H 5600F10V 2.35Arms 2 Sanyo Schottky Diode Cin1, Cin2 10MV5600AX Aluminum Electrolytic Cinx TSSOP-14 C3216X7R1E105K Capacitor 1206 1F, 25V 1 TDK Co1, Co2, Co3 10MV5600AX Aluminum Electrolytic 16mm D 25mm H 5600F10V 2.35Arms 2 Sanyo Cboot VJ1206X104XXA Capacitor 1206 0.1F, 25V 1 Vishay Cin C3216X7R1E225K Capacitor 1206 2.2F, 25V 1 TDK Css VJ1206X123KXX Capacitor 1206 12nF, 25V 1 Vishay Cc1 VJ1206A4R7KXX Capacitor 1206 4.7pF 10% 1 Vishay Submit Documentation Feedback Copyright (c) 2004-2013, Texas Instruments Incorporated Product Folder Links: LM2742 LM2742 www.ti.com SNVS266C - MARCH 2004 - REVISED MARCH 2013 Table 3. Bill of Materials for Circuit of Figure 32 (continued) ID Part Number Size Parameters Qty. Vendor Cc2 VJ1206A102KXX Capacitor Type 1206 1nF 10% 1 Vishay Rin CRCW1206100J Resistor 1206 10 5% 1 Vishay Rfadj CRCW12068872F Resistor 1206 88.7k 1% 1 Vishay Rc1 CRCW12062293F Resistor 1206 229k 1% 1 Vishay Rfb1 CRCW12064991F Resistor 1206 4.99k 1% 1 Vishay Rfb2 CRCW12064991F Resistor 1206 4.99k 1% 1 Vishay Rcs CRCW1206152J Resistor 1206 1.5k 5% 1 Vishay Qty. Vendor 1 NSC 30V, 24m/ 8nC Top 16.5m/ 15nC 1 Vishay Table 4. Bill of Materials for Circuit of Figure 33 ID Part Number U1 LM2742 Type Q1/Q2 Si4826DY L1 DO3316P-222 Inductor 12.95x9.4x 5.21mm 2.2H, 6.1A, 12m 1 Coilcraft Cin1 10TPB100ML POSCAP 7.3x4.3x3.1mm 100F 10V 1.9Arms 1 Sanyo Co1 4TPB220ML POSCAP 7.3x4.3x3.1mm 220F 4V 1.9Arms 1 Sanyo Cc C3216X7R1E105K Capacitor 1206 1F, 25V 1 TDK Cin C3216X7R1E225K Capacitor 1206 2.2F, 25V 1 TDK Css VJ1206X123KXX Capacitor 1206 12nF, 25V 1 Vishay Cc1 VJ1206A100KXX Capacitor 1206 10pF 10% 1 Vishay Cc2 VJ1206A561KXX Capacitor 1206 560pF 10% 1 Vishay Rin CRCW1206100J Resistor 1206 10 5% 1 Vishay Rfadj CRCW12064222F Resistor 1206 42.2k 1% 1 Vishay Rc1 CRCW12065112F Resistor 1206 51.1k 1% 1 Vishay Rfb1 CRCW12062491F Resistor 1206 2.49k 1% 1 Vishay Rfb2 CRCW12064991F Resistor 1206 4.99k 1% 1 Vishay Rcs CRCW1206272J Resistor 1206 2.7k 5% 1 Vishay Qty. Vendor 1 NSC Synchronous Controller Asymetric Dual N-MOSFET Size Parameters TSSOP-14 SO-8 Table 5. Bill of Materials for Circuit of Figure 34 ID Part Number U1 LM2742 Type Q1 Si4884DY N-MOSFET SO-8 30V, 13.5m, @ 4.5V 15.3nC 1 Vishay Q2 Si4884DY N-MOSFET SO-8 30V, 13.5m, @ 4.5V 15.3nC 1 Vishay SOT-23 30V 1 Vishay 7.29x7.29 3.51mm 1H, 11A 3.7m 1 Pulse 12x12x4.5 mm 1H, 11A, 3.7m 1 Pulse 16mm D 25mm H 5600F 10V 2.35Arms 1 Sanyo Synchronous Controller D1 BAT-54 Lin P1166.102T Schottky Diode Inductor Inductor L1 P1168.102T Cin1 10MV5600AX Aluminum Electrolytic Size Parameters TSSOP-14 Cinx C3216X7R1E105K Capacitor 1206 1F, 25V 1 TDK Co1, Co2, Co3 16MV4700WX Aluminum Electrolytic 12.5mm D 30mm H 4700F 16V 2.8Arms 2 Sanyo Cboot VJ1206X104XXA Capacitor 1206 0.1F, 25V 1 Vishay Cin C3216X7R1E225K Capacitor 1206 2.2F, 25V 1 TDK Css VJ1206X123KXX Capacitor 1206 12nF, 25V 1 Vishay Cc1 VJ1206A4R7KXX Capacitor 1206 4.7pF 10% 1 Vishay Submit Documentation Feedback Copyright (c) 2004-2013, Texas Instruments Incorporated Product Folder Links: LM2742 23 LM2742 SNVS266C - MARCH 2004 - REVISED MARCH 2013 www.ti.com Table 5. Bill of Materials for Circuit of Figure 34 (continued) ID Part Number Size Parameters Qty. Vendor Cc2 VJ1206A681KXX Capacitor Type 1206 680pF 10% 1 Vishay Rin CRCW1206100J Resistor 1206 10 5% 1 Vishay Rfadj CRCW12064992F Resistor 1206 49.9k 1% 1 Vishay Rc1 CRCW12061473F Resistor 1206 147k 1% 1 Vishay Rfb1 CRCW12061492F Resistor 1206 14.9k 1% 1 Vishay Rfb2 CRCW12064991F Resistor 1206 4.99k 1% 1 Vishay Rcs CRCW1206332J Resistor 1206 3.3k 5% 1 Vishay Qty. Vendor 1 NSC 30V, 24m/ 8nC Top 16.5m/ 15nC 1 Vishay Table 6. Bill of Materials for Circuit of Figure 35 ID Part Number U1 LM2742 Type Q1/Q2 Si4826DY Assymetric Dual N-MOSFET Schottky Diode Synchronous Controller Size Parameters TSSOP-14 SO-8 D1 BAT-54 SOT-23 30V 1 Vishay Lin RLF7030T-1R0N64 Inductor 6.8x7.1x3.2mm 1H, 6.4A, 7.3m 1 TDK Inductor L1 RLF7030T-3R3M4R1 6.8x7.1x3.2mm 3.3H, 4.1A, 17.4m 1 TDK Cin1 C4532X5R1E156M MLCC 1812 15F 25V 3.3Arms 1 Sanyo Co1 C4532X5R1E156M MLCC 1812 15F 25V 3.3Arms 1 Sanyo Cboot VJ1206X104XXA Capacitor 1206 0.1F, 25V 1 TDK Cin C3216X7R1E225K Capacitor 1206 2.2F, 25V 1 TDK Css VJ1206X393KXX Capacitor 1206 39nF, 25V 1 Vishay Cc1 VJ1206A220KXX Capacitor 1206 22pF 10% 1 Vishay Cc2 VJ1206A681KXX Capacitor 1206 680pF 10% 1 Vishay Cc3 VJ1206A681KXX Capacitor 1206 680pF 10% 1 Vishay Rin CRCW1206100J Resistor 1206 10 5% 1 Vishay Rfadj CRCW12061742F Resistor 1206 17.4k 1% 1 Vishay Rc1 CRCW12061072F Resistor 1206 10.7k 1% 1 Vishay Rc2 CRCW120666R5F Resistor 1206 66.5 1% 1 Vishay Rfb1 CRCW12064991F Resistor 1206 4.99k 1% 1 Vishay Rfb2 CRCW12061002F Resistor 1206 10k 1% 1 Vishay Rcs CRCW1206152J Resistor 1206 1.5k 5% 1 Vishay Vendor Table 7. Bill of Materials for 3.3V Circuit of Figure 35 (Identical to BOM for 1.8V except as noted below) 24 ID Part Number L1 RLF7030T-4R7M3R4 Cc1 VJ1206A270KXX Cc2 Cc3 Rc1 Type Size Parameters Qty. 6.8x7.1x 3.2mm 4.7H, 3.4A, 26m 1 TDK Capacitor 1206 27pF 10% 1 Vishay VJ1206X102KXX Capacitor 1206 1nF 10% 1 Vishay VJ1206A821KXX Capacitor 1206 820pF 10% 1 Vishay CRCW12061212F Resistor 1206 12.1k 1% 1 Vishay Inductor Rc2 CRCW12054R9F Resistor 1206 54.9 1% 1 Vishay Rfb1 CRCW12062211F Resistor 1206 2.21k 1% 1 Vishay Rfb2 CRCW12061002F Resistor 1206 10k 1% 1 Vishay Submit Documentation Feedback Copyright (c) 2004-2013, Texas Instruments Incorporated Product Folder Links: LM2742 LM2742 www.ti.com SNVS266C - MARCH 2004 - REVISED MARCH 2013 Table 8. Bill of Materials for Circuit of Figure 36 ID Part Number U1 LM2742 Synchronous Controller Type U2 LM78L05 Voltage Regulator SO-8 Q1/Q2 Si4826DY Assymetric Dual NMOSFET SO-8 Schottky Diode Size Parameters TSSOP-14 Qty. Vendor 1 NSC 1 NSC 30V, 24m/ 8nC Top 16.5m/ 15nC 1 Vishay D1 BAT-54 SOT-23 30V 1 Vishay Lin RLF7030T-1R0N64 Inductor 6.8x7.1x3.2mm 1H, 6.4A, 7.3m 1 TDK L1 SLF12565T-4R2N5R5 Inductor 12.5x12.5x6.5mm 4.2H, 5.5A, 15m 1 TDK Sanyo Cin1 16MV680WG D: 10mm L: 12.5mm 680F 16V 3.4Arms 1 Cinx C3216X5R1C106M Al-E MLCC 1210 10F 16V 3.4Arms 1 TDK Co1 Co2 16MV680WG MLCC 1812 15F 25V 3.3Arms 1 Sanyo Cox C3216X5R10J06M MLCC 1206 10F 6.3V 2.7A TDK Cboot VJ1206X104XXA Capacitor 1206 0.1F, 25V 1 Cin C3216X7R1E225K Capacitor 1206 2.2F, 25V 1 Vishay TDK Css VJ1206X123KXX Capacitor 1206 12nF, 25V 1 Vishay Cc1 VJ1206A8R2KXX Capacitor 1206 8.2pF 10% 1 Vishay Cc2 VJ1206X102KXX Capacitor 1206 1nF 10% 1 Vishay Cc3 VJ1206X472KXX Capacitor 1206 4.7nF 10% 1 Vishay Rfadj CRCW12063252F Resistor 1206 32.5k 1% 1 Vishay Rc1 CRCW12065232F Resistor 1206 52.3k 1% 1 Vishay Rc2 CRCW120662371F Resistor 1206 2.37 1% 1 Vishay Rfb1 CRCW12062211F Resistor 1206 2.21k 1% 1 Vishay Rfb2 CRCW12061002F Resistor 1206 10k 1% 1 Vishay Rcs CRCW1206202J Resistor 1206 2k 5% 1 Vishay Qty. Vendor Table 9. Bill of Materials for Circuit of Figure 37 ID Part Number Type Size Synchronous Controller TSSOP-14 U1 LM2742 Q1 Si4894DY D2 MBRS330T3 L1 SLF12565T-470M2R4 D1 MBR0520 Cin1 16MV680WG Cinx C3216X5R1C106M Co1, Co2 16MV680WG Cox C3216X5R10J06M Cboot Parameters 1 NSC N-MOSFET SO-8 30V, 15m, 11.5nC 1 Vishay Schottky Diode SO-8 30V, 3A 1 ON TDK Inductor 12.5x12.8x 4.7mm 47H, 2.7A 53m 1 Schottky Diode 1812 20V 0.5A 1 ON Al-E 1206 680F, 16V, 1.54Arms 1 Sanyo MLCC 1206 10F, 16V, 3.4Arms 1 TDK Sanyo Al-E D: 10mm L: 12.5mm 680F 16V 26m 2 MLCC 1206 10F, 6.3V 2.7A 1 TDK VJ1206X104XXA Capacitor 1206 0.1F, 25V 1 Vishay Cin C3216X7R1E225K Capacitor 1206 2.2F, 25V 1 TDK Css VJ1206X123KXX Capacitor 1206 12nF, 25V 1 Vishay Cc1 VJ1206A561KXX Capacitor 1206 56pF 10% 1 Vishay Cc2 VJ1206X392KXX Capacitor 1206 3.9nF 10% 1 Vishay Cc3 VJ1206X223KXX Capacitor 1206 22nF 10% 1 Vishay Rfadj CRCW12062673F Resistor 1206 267k 1% 1 Vishay Rc1 CRCW12066192F Resistor 1206 61.9k 1% 1 Vishay Rc2 CRCW12067503F Resistor 1206 750k 1% 1 Vishay Rfb1 CRCW12061371F Resistor 1206 1.37k 1% 1 Vishay Rfb2 CRCW12061002F Resistor 1206 10k 1% 1 Vishay Rcs CRCW1206122F Resistor 1206 1.2k 5% 1 Vishay Submit Documentation Feedback Copyright (c) 2004-2013, Texas Instruments Incorporated Product Folder Links: LM2742 25 LM2742 SNVS266C - MARCH 2004 - REVISED MARCH 2013 www.ti.com REVISION HISTORY Changes from Revision B (March 2013) to Revision C * 26 Page Changed layout of National Data Sheet to TI format .......................................................................................................... 25 Submit Documentation Feedback Copyright (c) 2004-2013, Texas Instruments Incorporated Product Folder Links: LM2742 PACKAGE OPTION ADDENDUM www.ti.com 10-Sep-2014 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (C) Device Marking (4/5) LM2742MTC/NOPB ACTIVE TSSOP PW 14 94 Green (RoHS & no Sb/Br) CU NIPDAU | CU SN Level-1-260C-UNLIM -40 to 125 2742 MTC LM2742MTCX/NOPB ACTIVE TSSOP PW 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU | CU SN Level-1-260C-UNLIM -40 to 125 2742 MTC (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 10-Sep-2014 In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 15-Aug-2017 TAPE AND REEL INFORMATION *All dimensions are nominal Device LM2742MTCX/NOPB Package Package Pins Type Drawing TSSOP PW 14 SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 2500 330.0 12.4 Pack Materials-Page 1 6.95 B0 (mm) K0 (mm) P1 (mm) 5.6 1.6 8.0 W Pin1 (mm) Quadrant 12.0 Q1 PACKAGE MATERIALS INFORMATION www.ti.com 15-Aug-2017 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM2742MTCX/NOPB TSSOP PW 14 2500 367.0 367.0 35.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated (TI) reserves the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. TI's published terms of sale for semiconductor products (http://www.ti.com/sc/docs/stdterms.htm) apply to the sale of packaged integrated circuit products that TI has qualified and released to market. Additional terms may apply to the use or sale of other types of TI products and services. Reproduction of significant portions of TI information in TI data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such reproduced documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyers and others who are developing systems that incorporate TI products (collectively, "Designers") understand and agree that Designers remain responsible for using their independent analysis, evaluation and judgment in designing their applications and that Designers have full and exclusive responsibility to assure the safety of Designers' applications and compliance of their applications (and of all TI products used in or for Designers' applications) with all applicable regulations, laws and other applicable requirements. Designer represents that, with respect to their applications, Designer has all the necessary expertise to create and implement safeguards that (1) anticipate dangerous consequences of failures, (2) monitor failures and their consequences, and (3) lessen the likelihood of failures that might cause harm and take appropriate actions. Designer agrees that prior to using or distributing any applications that include TI products, Designer will thoroughly test such applications and the functionality of such TI products as used in such applications. TI's provision of technical, application or other design advice, quality characterization, reliability data or other services or information, including, but not limited to, reference designs and materials relating to evaluation modules, (collectively, "TI Resources") are intended to assist designers who are developing applications that incorporate TI products; by downloading, accessing or using TI Resources in any way, Designer (individually or, if Designer is acting on behalf of a company, Designer's company) agrees to use any particular TI Resource solely for this purpose and subject to the terms of this Notice. TI's provision of TI Resources does not expand or otherwise alter TI's applicable published warranties or warranty disclaimers for TI products, and no additional obligations or liabilities arise from TI providing such TI Resources. TI reserves the right to make corrections, enhancements, improvements and other changes to its TI Resources. TI has not conducted any testing other than that specifically described in the published documentation for a particular TI Resource. Designer is authorized to use, copy and modify any individual TI Resource only in connection with the development of applications that include the TI product(s) identified in such TI Resource. NO OTHER LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE TO ANY OTHER TI INTELLECTUAL PROPERTY RIGHT, AND NO LICENSE TO ANY TECHNOLOGY OR INTELLECTUAL PROPERTY RIGHT OF TI OR ANY THIRD PARTY IS GRANTED HEREIN, including but not limited to any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information regarding or referencing third-party products or services does not constitute a license to use such products or services, or a warranty or endorsement thereof. Use of TI Resources may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. TI RESOURCES ARE PROVIDED "AS IS" AND WITH ALL FAULTS. TI DISCLAIMS ALL OTHER WARRANTIES OR REPRESENTATIONS, EXPRESS OR IMPLIED, REGARDING RESOURCES OR USE THEREOF, INCLUDING BUT NOT LIMITED TO ACCURACY OR COMPLETENESS, TITLE, ANY EPIDEMIC FAILURE WARRANTY AND ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, AND NON-INFRINGEMENT OF ANY THIRD PARTY INTELLECTUAL PROPERTY RIGHTS. TI SHALL NOT BE LIABLE FOR AND SHALL NOT DEFEND OR INDEMNIFY DESIGNER AGAINST ANY CLAIM, INCLUDING BUT NOT LIMITED TO ANY INFRINGEMENT CLAIM THAT RELATES TO OR IS BASED ON ANY COMBINATION OF PRODUCTS EVEN IF DESCRIBED IN TI RESOURCES OR OTHERWISE. IN NO EVENT SHALL TI BE LIABLE FOR ANY ACTUAL, DIRECT, SPECIAL, COLLATERAL, INDIRECT, PUNITIVE, INCIDENTAL, CONSEQUENTIAL OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF TI RESOURCES OR USE THEREOF, AND REGARDLESS OF WHETHER TI HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. Unless TI has explicitly designated an individual product as meeting the requirements of a particular industry standard (e.g., ISO/TS 16949 and ISO 26262), TI is not responsible for any failure to meet such industry standard requirements. Where TI specifically promotes products as facilitating functional safety or as compliant with industry functional safety standards, such products are intended to help enable customers to design and create their own applications that meet applicable functional safety standards and requirements. Using products in an application does not by itself establish any safety features in the application. Designers must ensure compliance with safety-related requirements and standards applicable to their applications. Designer may not use any TI products in life-critical medical equipment unless authorized officers of the parties have executed a special contract specifically governing such use. Life-critical medical equipment is medical equipment where failure of such equipment would cause serious bodily injury or death (e.g., life support, pacemakers, defibrillators, heart pumps, neurostimulators, and implantables). Such equipment includes, without limitation, all medical devices identified by the U.S. Food and Drug Administration as Class III devices and equivalent classifications outside the U.S. TI may expressly designate certain products as completing a particular qualification (e.g., Q100, Military Grade, or Enhanced Product). Designers agree that it has the necessary expertise to select the product with the appropriate qualification designation for their applications and that proper product selection is at Designers' own risk. Designers are solely responsible for compliance with all legal and regulatory requirements in connection with such selection. Designer will fully indemnify TI and its representatives against any damages, costs, losses, and/or liabilities arising out of Designer's noncompliance with the terms and provisions of this Notice. Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright (c) 2017, Texas Instruments Incorporated Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: Texas Instruments: LM2742MTC LM2742MTC/NOPB LM2742MTCX LM2742MTCX/NOPB