D Very Low Power Consumption D Typical Supply Current . . . 200 A (Per Amplifier) Voltage Ranges Low Input Bias and Offset Currents Common-Mode Input Voltage Range Includes VCC+ 7 3 6 4 5 NC VCC+ OUT OFFSET N2 1OUT 1IN- 1IN+ VCC- 13 3 12 4 11 5 10 6 9 7 8 4OUT 4IN- 4IN+ VCC- 3IN+ 3IN- 3OUT NC - No internal connection 3 6 4 5 VCC+ 2OUT 2IN- 2IN+ NC 1OUT NC VCC+ NC 14 2 7 TL064 . . . FK PACKAGE (TOP VIEW) NC 1IN- NC 1IN+ NC 4 3 2 1 20 19 18 5 17 6 16 7 15 8 14 9 10 11 12 13 NC 2OUT NC 2IN- NC NC VCC- NC 2IN+ NC 1 8 2 TL062 . . . FK PACKAGE (TOP VIEW) TL064 . . . D, J, N, NS, PW, OR W PACKAGE TL064A, TL064B . . . D OR N PACKAGE (TOP VIEW) 1OUT 1IN- 1IN+ VCC+ 2IN+ 2IN- 2OUT 1 1IN- 1OUT NC 4OUT 4IN- 8 2 1IN+ NC VCC+ NC 2IN+ 4 3 2 1 20 19 18 5 17 6 16 7 15 8 14 9 10 11 12 13 4IN+ NC VCC- NC 3IN+ 2IN- 2OUT NC 3OUT 3IN- 1 Output Short-Circuit Protection High Input Impedance . . . JFET-Input Stage Internal Frequency Compensation Latch-Up-Free Operation High Slew Rate . . . 3.5 V/s Typ TL062 . . . D, JG, P, PS, OR PW PACKAGE TL062A . . . D, P, OR PS PACKAGE TL062B . . . D OR P PACKAGE (TOP VIEW) TL061, TL061A . . . D, P, OR PS PACKAGE TL061B . . . P PACKAGE (TOP VIEW) OFFSET N1 IN- IN+ VCC- SLOS078J - NOVEMBER 1978 - REVISED SEPTEMBER 2004 D D D D D D Wide Common-Mode and Differential D D description/ordering information The JFET-input operational amplifiers of the TL06_ series are designed as low-power versions of the TL08_ series amplifiers. They feature high input impedance, wide bandwidth, high slew rate, and low input offset and input bias currents. The TL06_ series features the same terminal assignments as the TL07_ and TL08_ series. Each of these JFET-input operational amplifiers incorporates well-matched, high-voltage JFET and bipolar transistors in an integrated circuit. The C-suffix devices are characterized for operation from 0C to 70C. The I-suffix devices are characterized for operation from -40C to 85C, and the M-suffix devices are characterized for operation over the full military temperature range of -55C to 125C. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright 2004, Texas Instruments Incorporated !" # $%&" !# '%()$!" *!"&+ *%$"# $ " #'&$$!"# '& ",& "&# &-!# #"%&"# #"!*!* .!!"/+ *%$" '$&##0 *&# " &$&##!)/ $)%*& "&#"0 !)) '!!&"&#+ '*%$"# $')!" " 12313 !)) '!!&"&# !& "&#"&* %)&## ",&.#& "&*+ !)) ",& '*%$"# '*%$" '$&##0 *&# " &$&##!)/ $)%*& "&#"0 !)) '!!&"&#+ POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 1 SLOS078J - NOVEMBER 1978 - REVISED SEPTEMBER 2004 description/ordering information (continued) ORDERING INFORMATION TA VIOMAX AT 25C TL062CP TL062CP TL064CN TL064CN PDIP (N) Tube of 25 Tube of 75 TL061CD Reel of 2500 TL061CDR Tube of 75 TL062CD Reel of 2500 TL062CDR Tube of 50 TL064CD Reel of 2500 TL064CDR T062 TL064CNSR TL064 Reel of 2000 Tube of 150 TL062CPW Reel of 2000 TL062CPWR Tube of 90 TL064CPW Reel of 2000 TL064CPWR T062 T064 TL061ACP TL061ACP TL062ACP TL062ACP TL064ACN TL064ACN PDIP (P) Tube of 50 PDIP (N) Tube of 25 Tube of 75 TL061ACD Reel of 2500 TL061ACDR Tube of 75 TL062ACD Reel of 2500 TL062ACDR Tube of 50 TL064ACD Reel of 2500 TL064ACDR Reel of 2000 TL064C TL062CPSR SOP (NS) SOP (PS) TL062C T061 Reel of 2000 SOIC (D) TL061C TL061CPSR SOP (PS) TSSOP (PW) 6 mV TL061CP Tube of 50 15 mV TOP-SIDE MARKING TL061CP PDIP (P) SOIC (D) 0C to 70C ORDERABLE PART NUMBER PACKAGE 061AC 062AC TL064AC TL061ACPSR T061A TL062ACPSR T062A TL061BCP TL061BCP PDIP (P) Tube of 50 TL062BCP TL062BCP PDIP (N) Tube of 25 TL064BCN TL064BCN Tube of 75 TL062BCD Reel of 2500 TL062BCDR Tube of 50 TL064BCD Reel of 2500 TL064BCDR 3 mV SOIC (D) 062BC TL064BC Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. 2 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 SLOS078J - NOVEMBER 1978 - REVISED SEPTEMBER 2004 description/ordering information (continued) ORDERING INFORMATION (continued) TA -40C to 85C VIOMAX AT 25C 9 mV TL061IP TL061IP TL062IP TL062IP TL064IN TL064IN Tube of 50 PDIP (N) Tube of 25 Tube of 75 TL061ID Reel of 2000 TL061IDR Tube of 75 TL062ID Reel of 2000 TL062IDR Tube of 50 TL064ID Reel of 2500 TL064IDR TSSOP (PW) Reel of 2000 TL062IPWR TL062I CDIP (JG) Tube of 50 TL062MJG TL062MJG LCCC (FK) Tube of 55 TL062MFK TL062MFK CDIP (J) Tube of 25 TL064MJ TL064MJ CFP (W) Tube of 150 TL064MW TL064MW LCCC (FK) Tube of 55 TL064MFK SOIC (D) -55C -55 C to 125 125C C TOP-SIDE MARKING PDIP (P) 6 mV 6 mV ORDERABLE PART NUMBER PACKAGE TL061I TL062I TL064I TL064MFK Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 3 SLOS078J - NOVEMBER 1978 - REVISED SEPTEMBER 2004 symbol (each amplifier) IN+ + IN- - OFFSET N1 OUT OFFSET N2 Offset Null/Compensation TL061 Only schematic (each amplifier) VCC+ IN+ 50 IN- 100 C1 OFFSET N1 OFFSET N2 OUT TL061 Only C1 = 10 pF on TL061, TL062, and TL064 Component values shown are nominal. 4 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 VCC- SLOS078J - NOVEMBER 1978 - REVISED SEPTEMBER 2004 absolute maximum ratings over operating free-air temperature range (unless otherwise noted) TL06_C TL06_AC TL06_BC TL06_I TL06_M UNIT Supply voltage, VCC+ (see Note 1) 18 18 18 V Supply voltage, VCC- (see Note 1) -18 -18 -18 V Differential input voltage, VID (see Note 2) 30 30 30 V V 15 15 15 Unlimited Unlimited Unlimited D (8-pin) package 97 97 D (14-pin) package 86 86 N package 80 80 NS package 76 76 P package 85 85 PS package 95 95 PW (8-pin) package 149 149 PW (14-pin) package 113 113 Input voltage, VI (see Notes 1 and 3) Duration of output short circuit (see Note 4) Package thermal impedance, JA (see Notes 5 and 6) Package thermal impedance, JC (see Notes 7 and 8) C/W C/W FK package 5.61 J package 15.05 JG package 14.5 W package 14.65 C/W 150 C Case temperature for 60 seconds FK package 260 C Lead temperature 1,6 mm (1/16 inch) from case for 60 seconds J, JG, U, or W package 300 C Lead temperature 1,6 mm (1/6 inch) from case for 10 seconds D, N, NS, P, PS, or PW package Operating virtual junction temperature, TJ 150 260 150 260 C Storage temperature range, Tstg -65 to 150 -65 to 150 -65 to 150 C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. All voltage values except differential voltages are with respect to the midpoint between VCC+ and VCC-. 2. Differential voltages are at IN+ with respect to IN-. 3. The magnitude of the input voltage should never exceed the magnitude of the supply voltage or 15 V, whichever is less. 4. The output may be shorted to ground or to either supply. Temperature and/or supply voltages must be limited to ensure that the dissipation rating is not exceeded. 5. Maximum power dissipation is a function of TJ(max), JA, and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ(max) - TA)/JA. Operating at the absolute maximum TJ of 150C can affect reliability. 6. The package thermal impedance is calculated in accordance with JESD 51-7. 7. Maximum power dissipation is a function of TJ(max), JC, and TC. The maximum allowable power dissipation at any allowable case temperature is PD = (TJ(max) - TC)/JC. Operating at the absolute maximum TJ of 150C can affect reliability. 8. The package thermal impedance is calculated in accordance with MIL-STD-883. POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 5 SLOS078J - NOVEMBER 1978 - REVISED SEPTEMBER 2004 electrical characteristics, VCC = 15 V (unless otherwise noted) PARAMETER TL061C TL062C TL064C TEST CONDITIONS MIN VIO V IO IIO IIB TA = 25C TA = Full range Temperature coefficient of input offset voltage VO = 0, RS = 50 , TA = Full range VO = 0 TA = 25C TA = Full range 5 Input offset current 30 VO = 0 TA = 25C TA = Full range MIN 200 5 400 30 10 11 11 -12 to 15 13.5 10 13.5 TA = 25C TA = Full range 10 RL 10 k, Large-signal differential voltage amplification VO = 10 V, RL 10 k TA = 25C TA = Full range 3 AVD Unity-gain bandwidth RL = 10 k, TA = 25C Input resistance Common-mode rejection ratio TA = 25C VIC = VICRmin, VO = 0, RS = 50 , TA = 25C PD Supply-voltage rejection ratio (VCC/VIO) Total power dissipation (each amplifier) VCC = 9 V to 15 V, VO = 0, RS = 50 , TA = 25C VO = 0, TA = 25C, No load ICC Supply current (each amplifier) VO = 0, No load MAX 6 10 100 pA 3 nA 200 pA 7 nA V V 10 6 4 3 6 V/mV 4 1 12 10 mV V/C 10 -12 to 15 RL = 10 k, UNIT 7.5 5 Maximum peak output voltage swing TA = 25C TYP 3 10 VOM kSVR 15 20 Common-mode input voltage range CMRR MAX 3 Input offset voltage VICR B1 ri TYP VO = 0, RS = 50 Input bias current TL061AC TL062AC TL064AC 1 12 10 MHz 70 86 80 86 dB 70 95 80 95 dB TA = 25C, 6 7.5 6 7.5 mW 200 250 200 250 A VO1/VO2 Crosstalk attenuation AVD = 100, TA = 25C 120 120 dB All characteristics are measured under open-loop conditions with zero common-mode input voltage unless otherwise specified. Full range for TA is 0C to 70C for TL06_C, TL06_AC, and TL06_BC and -40C to 85C for TL06_I. Input bias currents of an FET-input operational amplifier are normal junction reverse currents, which are temperature sensitive, as shown in Figure 15. Pulse techniques are used to maintain the junction temperature as close to the ambient temperature as possible. 6 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 SLOS078J - NOVEMBER 1978 - REVISED SEPTEMBER 2004 electrical characteristics, VCC = 15 V (unless otherwise noted) PARAMETER TL061BC TL062BC TL064BC TEST CONDITIONS MIN VIO V IO IIO IIB TA = 25C TA = Full range Temperature coefficient of input offset voltage VO = 0, RS = 50 , TA = Full range VO = 0 TA = 25C TA = Full range 5 Input offset current 30 VO = 0 TA = 25C TA = Full range 9 10 13.5 VO = 10 V, RL 10 k TA = 25C TA = Full range 4 Unity-gain bandwidth RL = 10 k, ICC Supply current (each amplifier) VO = 0, No load 30 13.5 Large-signal differential voltage amplification PD 200 11 AVD VCC = 9 V to 15 V, VO = 0, RS = 50 , TA = 25C VO = 0, TA = 25C, No load 5 11 10 Supply-voltage rejection ratio (VCC/VIO) Total power dissipation (each amplifier) 100 10 100 pA 10 nA 200 pA 20 nA V V 10 6 4 4 6 V/mV 4 1 1012 mV V/C 10 -12 to 15 TA = 25C TA = Full range Common-mode rejection ratio 6 7 RL 10 k, TA = 25C TA = 25C VIC = VICRmin, VO = 0, RS = 50 , TA = 25C MAX 3 -12 to 15 RL = 10 k, TA = 25C UNIT TYP 3 Maximum peak output voltage swing Input resistance MIN 10 VOM kSVR 3 5 Common-mode input voltage range CMRR MAX 2 Input offset voltage VICR B1 ri TYP VO = 0, RS = 50 Input bias current TL061I TL062I TL064I 1 1012 MHz 80 86 80 86 dB 80 95 80 95 dB TA = 25C, 6 7.5 6 7.5 mW 200 250 200 250 A VO1/VO2 Crosstalk attenuation AVD = 100, TA = 25C 120 120 dB All characteristics are measured under open-loop conditions with zero common-mode input voltage, unless otherwise specified. Full range for TA is 0C to 70C for TL06_C, TL06_AC, and TL06_BC and -40C to 85C for TL06_I. Input bias currents of an FET-input operational amplifier are normal junction reverse currents, which are temperature sensitive, as shown in Figure 15. Pulse techniques are used to maintain the junction temperature as close to the ambient temperature as possible. POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 7 SLOS078J - NOVEMBER 1978 - REVISED SEPTEMBER 2004 electrical characteristics, VCC = 15 V (unless otherwise noted) TL061M TL062M TEST CONDITIONS PARAMETER MIN VIO V IO IIO TA = 25C TA = -55C to 125C Input offset voltage VO = 0, RS = 50 Temperature coefficient of input offset voltage VO = 0, RS = 50 , TA = -55C to 125C Input offset current VO = 0 Input bias current VO = 0 TA = 25C TA = -55C TA = -55C TA = 125C TYP 3 100 5 20* 20 30 50* 50 50 13.5 10 13.5 TA = 25C 4 voltage amplification VO = 10 V, RL 10 k TA = -55C to 125C 4 Unity-gain bandwidth RL = 10 k, TA = 25C 200 50* 10 Large-signal differential 100 20 200 10 4 pA nA pA nA V V 10 6 mV V/C 20* -12 to 15 TA = 25C TA = -55C to 125C 9 10 11.5 RL = 10 k, RL 10 k, UNIT MAX 15 -12 to 15 Maximum peak output voltage swing CMRR MIN 11.5 VOM Common-mode rejection ratio 6 30 TA = 25C Input resistance 3 5 Common-mode input voltage range B1 ri MAX 10 VICR AVD TYP 9 TA = 125C TA = 25C IIB TL064M 6 V/mV 4 MHz 1012 TA = 25C VIC = VICRmin, VO = 0, RS = 50 , TA = 25C 1012 80 86 80 86 dB 80 95 80 95 dB PD Supply-voltage rejection ratio (VCC/VIO) Total power dissipation (each amplifier) VO = 0, No load TA = 25C, 6 7.5 6 7.5 mW ICC Supply current (each amplifier) VO = 0, No load TA = 25C, 200 250 200 250 A kSVR VCC = 9 V to 15 V, VO = 0, RS = 50 , TA = 25C VO1/VO2 Crosstalk attenuation AVD = 100, TA = 25C 120 120 dB * This parameter is not production tested. All characteristics are measured under open-loop conditions, with zero common-mode voltage, unless otherwise specified. Input bias currents of an FET-input operational amplifier are normal junction reverse currents, which are temperature sensitive, as shown in Figure 15. Pulse techniques are used to maintain the junction temperature as close to the ambient temperature as possible. operating characteristics, VCC = 15 V, TA = 25C PARAMETER SR Slew rate at unity gain (see Note 5) tr Rise time TEST CONDITIONS Overshoot factor Vn Equivalent input noise voltage NOTE 5: Slew rate at -55C to 125C is 0.7 V/s min. 8 VI = 10 V, RL = 10 k, CL = 100 pF, See Figure 1 VI = 20 mV, CL = 100 pF, RL = 10 k, See Figure 1 RS = 20 , f = 1 kHz POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 MIN TYP 1.5 3.5 0.2 10% 42 MAX UNIT V/s ss nV/Hz SLOS078J - NOVEMBER 1978 - REVISED SEPTEMBER 2004 PARAMETER MEASUREMENT INFORMATION 10 k - VI 1 k - OUT + OUT CL = 100 pF RL = 2 k + RL Figure 1. Unity-Gain Amplifier IN- Figure 2. Gain-of-10 Inverting Amplifier TL061 OUT N2 + IN+ CL = 100 pF - VI N1 100 k 1.5 k VCC- Figure 3. Input Offset-Voltage Null Circuit POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 9 SLOS078J - NOVEMBER 1978 - REVISED SEPTEMBER 2004 TYPICAL CHARACTERISTICS Table of Graphs FIGURE 10 Maximum peak output voltage vs Supply voltage 4 Maximum peak output voltage vs Free-air temperature 5 Maximum peak output voltage vs Load resistance 6 Maximum peak output voltage vs Frequency 7 Differential voltage amplification vs Free-air temperature 8 Large-signal differential voltage amplification vs Frequency 9 Phase shift vs Frequency 9 Supply current vs Supply voltage 10 Supply current vs Free-air temperature 11 Total power dissipation vs Free-air temperature 12 Common-mode rejection ratio vs Free-air temperature 13 Normalized unity-gain bandwidth vs Free-air temperature 14 Normalized slew rate vs Free-air temperature 14 Normalized phase shift vs Free-air temperature 14 Input bias current vs Free-air temperature 15 Voltage-follower large-signal pulse response vs Time 16 Output voltage vs Elapsed time 17 Equivalent input noise voltage vs Frequency 18 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 SLOS078J - NOVEMBER 1978 - REVISED SEPTEMBER 2004 TYPICAL CHARACTERISTICS MAXIMUM PEAK OUTPUT VOLTAGE vs FREE-AIR TEMPERATURE MAXIMUM PEAK OUTPUT VOLTAGE vs SUPPLY VOLTAGE 15 VOM - Maximum Peak Output Voltage - V VOM - Maximum Peak Output Voltage - V 15 RL = 10 k TA = 25C See Figure 2 12.5 12.5 10 7.5 5 AA AA 10 7.5 5 AA AA 2.5 2.5 0 0 2 4 6 8 10 12 14 0 -75 16 VCC = 15 V RL = 10 k See Figure 2 -50 |VCC| - Supply Voltage - V -25 MAXIMUM PEAK OUTPUT VOLTAGE vs LOAD RESISTANCE AAAAA AAAAA 15 VCC = 15 V TA = 25C See Figure 2 VOM - Maximum Peak Output Voltage - V VOM - Maximum Peak Output Voltage - V 50 75 100 125 MAXIMUM PEAK OUTPUT VOLTAGE vs FREQUENCY 15 AA AA 25 Figure 5 Figure 4 12.5 0 TA - Free-Air Temperature - C 10 7.5 5 RL = 10 k TA = 25C See Figure 2 12.5 VCC = 12 V 10 7.5 5 AA AA 2.5 AAAA AAAA AAAA AAAA VCC = 15 V VCC = 5 V 2.5 0 0 100 200 400 700 1 k 2k 4k 7 k 10 k 1k RL - Load Resistance - 10 k 100 k 1M 10 M f - Frequency - Hz Figure 6 Figure 7 Data at high and low temperatures are applicable only within the specified operating free-air temperature ranges of the various devices. POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 11 SLOS078J - NOVEMBER 1978 - REVISED SEPTEMBER 2004 TYPICAL CHARACTERISTICS DIFFERENTIAL VOLTAGE AMPLIFICATION vs FREE-AIR TEMPERATURE AVD - Differential Voltage Amplification - V/mV 10 VCC = 15 V RL = 10 k 7 4 2 1 -75 -50 -25 0 25 50 75 100 TA - Free-Air Temperature - C 125 Figure 8 LARGE-SIGNAL DIFFERENTIAL VOLTAGE AMPLIFICATION AND PHASE SHIFT vs FREQUENCY VCC = 15 V Rext = 0 RL = 10 k TA = 25C 10 Phase Shift (right scale) 1 0 45 90 0.1 AVD (left scale) 0.01 135 0.001 1 10 100 1k Phase Shift AVD - Large-Signal Differential Voltage Amplification - V/mV 100 10 k 100 k 1M 180 10 M f - Frequency - Hz Figure 9 Data at high and low temperatures are applicable only within the specified operating free-air temperature ranges of the various devices. 12 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 SLOS078J - NOVEMBER 1978 - REVISED SEPTEMBER 2004 TYPICAL CHARACTERISTICS SUPPLY CURRENT vs SUPPLY VOLTAGE SUPPLY CURRENT vs FREE-AIR TEMPERATURE 250 TA = 25C No Signal No Load 200 I CC ICC - Supply Current - A I CC ICC - Supply Current - A 250 150 AA AA AA 100 50 200 150 AA AA AA IIIIII IIIIII IIIIII 100 50 0 0 2 4 6 8 10 12 14 16 0 -75 VCC = 15 V No Signal No Load -50 -25 Figure 10 87 CMRR - Common-Mode Rejection Ratio - dB P PD D - Total Power Dissipation - mW 25 TL064 VCC = 15 V No Signal No Load 15 TL062 AA AA 10 TL061 5 -50 -25 0 25 50 75 100 125 ALL EXCEPT TL06_C COMMON-MODE REJECTION RATIO vs FREE-AIR TEMPERATURE 30 0 -75 25 Figure 11 TOTAL POWER DISSIPATION vs FREE-AIR TEMPERATURE 20 0 TA - Free-Air Temperature - C |VCC| - Supply Voltage - V 50 75 100 125 VCC = 15 V RL = 10 k 86 85 84 83 82 81 -75 -50 -25 0 25 50 75 100 125 TA - Free-Air Temperature - C TA - Free-Air Temperature - C Figure 12 Figure 13 Data at high and low temperatures are applicable only within the specified operating free-air temperature ranges of the various devices. POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 13 SLOS078J - NOVEMBER 1978 - REVISED SEPTEMBER 2004 TYPICAL CHARACTERISTICS 1.03 1.3 1.2 Unity-Gain Bandwidth (left scale) 1.02 Phase Shift (right scale) 1.01 1.1 Slew Rate (left scale) 1 1 0.99 0.9 0.8 0.7 -75 VCC = 15 V RL = 10 k f = B1 for Phase Shift -50 Normalized Phase Shift Normalized Unity-Gain Bandwidth and Slew Rate NORMALIZED UNITY-GAIN BANDWIDTH, SLEW RATE, AND PHASE SHIFT vs FREE-AIR TEMPERATURE 0.98 -25 0 25 50 75 100 TA - Free-Air Temperature - C 0.97 125 Figure 14 VOLTAGE-FOLLOWER LARGE-SIGNAL PULSE RESPONSE vs TIME INPUT BIAS CURRENT vs FREE-AIR TEMPERATURE IIB IIB - Input Bias Current - nA 40 AAAAA 6 Input VCC = 15 V 4 Input and Output Voltages - V 100 10 4 1 AA AA 0.4 0.1 0 Output -2 VCC = 15 V RL = 10 k CL = 100 pF TA = 25C -4 0.04 0.01 -50 2 -25 0 25 50 75 100 TA - Free-Air Temperature - C 125 -6 0 Figure 15 14 2 4 6 t - Time - s Figure 16 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 8 10 SLOS078J - NOVEMBER 1978 - REVISED SEPTEMBER 2004 TYPICAL CHARACTERISTICS EQUIVALENT INPUT NOISE VOLTAGE vs FREQUENCY OUTPUT VOLTAGE vs ELAPSED TIME V n - Equivalent Input Noise Voltage - nV/ Hz 24 VO - Output Voltage - mV AAAAA AAAAA AAAAA 100 28 Overshoot 20 90% 16 12 8 4 10% VCC = 15 V RL = 10 k TA = 25C 0 tr -4 0 0.2 0.4 0.6 0.8 1 t - Elapsed Time - s 1.2 1.4 AA AA VCC = 15 V RS = 20 TA = 25C 90 80 70 60 50 40 30 20 10 0 10 40 100 400 1 k 4 k 10 k f - Frequency - Hz 40 k 100 k Figure 18 Figure 17 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 15 SLOS078J - NOVEMBER 1978 - REVISED SEPTEMBER 2004 APPLICATION INFORMATION Table of Application Diagrams PART NUMBER FIGURE Instrumentation amplifier TL064 19 0.5-Hz square-wave oscillator TL061 20 High-Q notch filter TL061 21 Audio-distribution amplifier TL064 22 Low-level light detector preamplifier TL061 23 AC amplifier TL061 24 Microphone preamplifier with tone control TL061 25 Instrumentation amplifier TL062 26 IC preamplifier TL062 27 APPLICATION DIAGRAM VCC+ 10 k 0.1% 10 k 0.1% - TL064 100 k + Input A VCC+ VCC- - Output TL064 100 k + VCC+ 1 M VCC+ VCC- Input B + - TL064 10 k 0.1% - TL064 10 k 0.1% 100 k + 100 k VCC- VCC- Figure 19. Instrumentation Amplifier RF = 100 k VCC+ - Output Input - TL061 + CF = 3.3 F TL061 R1 C3 + 15 V 3.3 k VCC- 1 k -15 V C1 3.3 k f+ 2p 1 RF CF 9.1 k Figure 20. 0.5-Hz Square-Wave Oscillator 16 POST OFFICE BOX 655303 Output R2 R3 C2 R1 = R2 = 2 x R3 = 1.5 M C1 + C2 + C3 + 110 pF 2 1 + 1 kHz fo + 2p R1 C1 Figure 21. High-Q Notch Filter * DALLAS, TEXAS 75265 SLOS078J - NOVEMBER 1978 - REVISED SEPTEMBER 2004 APPLICATION INFORMATION VCC+ - 1 M TL064 VCC+ Output A + - 1 F TL064 + TL064 100 k Output B + VCC+ VCC+ - 100 k 100 F VCC+ - Input 100 k TL064 Output C + Figure 22. Audio-Distribution Amplifier 15 V 10 k 10 k 10 k + TIL601 100 pF 10 k TL061 Output - 10 k 5 k 10 k -15 V Figure 23. Low-Level Light Detector Preamplifier POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 17 SLOS078J - NOVEMBER 1978 - REVISED SEPTEMBER 2004 APPLICATION INFORMATION VCC+ 0.1 F 10 k 10 k 1 M - Output TL061 50 + N2 10 k 0.1 F N1 250 k Figure 24. AC Amplifier 10 k 0.1 F 100 k 0.06 F 0.06 F + TL061 - 1.2 M 47 k 1 k 1 F 10 k 0.002 F 100 k 50 k 2.7 k 270 100 k 0.003 F 10 k 100 k 0.001 F + 50 k 20 F Figure 25. Microphone Preamplifier With Tone Control + TL062 - IN+ Output 100 k 1 k 1 k 100 k IN- - TL062 + Figure 26. Instrumentation Amplifier 18 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 0.02 F SLOS078J - NOVEMBER 1978 - REVISED SEPTEMBER 2004 APPLICATION INFORMATION IC PREAMPLIFIER RESPONSE CHARACTERISTICS 25 AAAAA AAAAA AAAAA Max Bass 20 VCC = 15 V TA = 25C 15 Voltage Amplification - dB Max Treble 10 5 0 -5 -10 AAA AAA -15 -20 -25 20 40 AAA AAA Min Treble Min Bass 100 200 400 1k 2k 4k 10 k 20 k f - Frequency - Hz 220 k 0.00375 F 0.01 F 10 k 27 k MIN 100 k Bass MAX VCC+ 100 1 F Input 100 0.003 F 0.03 F + TL062 - 10 k 3.3 k MIN 100 k Treble MAX VCC+ + TL062 0.03 F 0.003 F VCC- VCC- 10 k Balance 10 pF 75 F 47 k + 50 pF Output - 10 pF 5 k Gain + 68 k 47 F Figure 27. IC Preamplifier POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 19 PACKAGE OPTION ADDENDUM www.ti.com 11-Nov-2009 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty 81023012A OBSOLETE LCCC FK 20 81023022A ACTIVE LCCC FK 20 1 TBD 8102302HA ACTIVE CFP U 10 1 TBD A42 N / A for Pkg Type 8102302PA ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type 81023032A ACTIVE LCCC FK 20 1 TBD 8102303CA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type 8102303DA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type TL061ACD ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL061ACDE4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL061ACDG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL061ACDR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL061ACDRE4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL061ACDRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL061ACP ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type TL061ACPE4 ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type TL061BCD OBSOLETE SOIC D 8 TBD Call TI TL061BCP ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type TL061BCPE4 ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type TL061CD ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL061CDE4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL061CDG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL061CDR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL061CDRE4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL061CDRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL061CP ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type TL061CPE4 ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type TL061CPSR ACTIVE SO PS 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL061CPSRE4 ACTIVE SO PS 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TBD Addendum-Page 1 Lead/Ball Finish Call TI MSL Peak Temp (3) Call TI POST-PLATE N / A for Pkg Type POST-PLATE N / A for Pkg Type Call TI PACKAGE OPTION ADDENDUM www.ti.com 11-Nov-2009 Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty TL061CPSRG4 ACTIVE SO PS 8 TL061CPWLE OBSOLETE TSSOP PW 8 TBD Call TI TL061ID ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL061IDE4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL061IDG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL061IDR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL061IDRE4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL061IDRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL061IP ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type TL061IPE4 ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type TL061MJG OBSOLETE CDIP JG 8 TBD Call TI Call TI TL061MJGB OBSOLETE CDIP JG 8 TBD Call TI Call TI TL062ACD ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL062ACDE4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL062ACDG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL062ACDR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL062ACDRE4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL062ACDRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL062ACJG OBSOLETE CDIP JG 8 TL062ACP ACTIVE PDIP P 8 TL062ACPE4 ACTIVE PDIP P 8 TL062ACPSR ACTIVE SO PS 8 TL062ACPSRE4 ACTIVE SO PS TL062ACPSRG4 ACTIVE SO TL062BCD ACTIVE TL062BCDE4 2000 Green (RoHS & no Sb/Br) Lead/Ball Finish CU NIPDAU MSL Peak Temp (3) Level-1-260C-UNLIM Call TI TBD Call TI 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM PS 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL062BCDG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL062BCDR ACTIVE SOIC D 8 2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM Addendum-Page 2 Call TI PACKAGE OPTION ADDENDUM www.ti.com 11-Nov-2009 Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty TL062BCDRE4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL062BCDRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL062BCP ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type TL062BCPE4 ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type TL062CD ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL062CDE4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL062CDG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL062CDR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL062CDRE4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL062CDRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL062CJG OBSOLETE CDIP JG 8 TBD Call TI TL062CP ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type TL062CPE4 ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type TL062CPSLE OBSOLETE SO PS 8 TBD Call TI TL062CPSR ACTIVE SO PS 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL062CPSRE4 ACTIVE SO PS 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL062CPSRG4 ACTIVE SO PS 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL062CPW ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL062CPWE4 ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL062CPWG4 ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL062CPWLE OBSOLETE TSSOP PW 8 TBD Call TI TL062CPWR ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL062CPWRE4 ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL062CPWRG4 ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL062ID ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL062IDE4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL062IDG4 ACTIVE SOIC D 8 75 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM Lead/Ball Finish MSL Peak Temp (3) no Sb/Br) Addendum-Page 3 Call TI Call TI Call TI PACKAGE OPTION ADDENDUM www.ti.com 11-Nov-2009 Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty TL062IDR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL062IDRE4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL062IDRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL062IJG OBSOLETE CDIP JG 8 TBD Call TI TL062IP ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type TL062IPE4 ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type TL062IPWR ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL062IPWRE4 ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL062IPWRG4 ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL062MFKB ACTIVE LCCC FK 20 1 TBD TL062MJG ACTIVE CDIP JG 8 1 TBD TL062MJGB ACTIVE CDIP JG 8 1 TL064ACD ACTIVE SOIC D 14 50 TL064ACDE4 ACTIVE SOIC D 14 50 TL064ACDG4 ACTIVE SOIC D 14 50 TL064ACDR ACTIVE SOIC D TL064ACDRE4 ACTIVE SOIC TL064ACDRG4 ACTIVE TL064ACN Lead/Ball Finish MSL Peak Temp (3) no Sb/Br) Call TI POST-PLATE N / A for Pkg Type A42 N / A for Pkg Type TBD A42 N / A for Pkg Type Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type TL064ACNE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type TL064BCD ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL064BCDE4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL064BCDG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL064BCDR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL064BCDRE4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL064BCDRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL064BCN ACTIVE PDIP N 14 CU NIPDAU N / A for Pkg Type 25 Addendum-Page 4 Pb-Free (RoHS) PACKAGE OPTION ADDENDUM www.ti.com 11-Nov-2009 Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty TL064BCNE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type TL064CD ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL064CDBR ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL064CDBRE4 ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL064CDBRG4 ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL064CDE4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL064CDG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL064CDR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL064CDRE4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL064CDRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL064CN ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type TL064CNE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type TL064CNSR ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL064CNSRE4 ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL064CNSRG4 ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL064CPW ACTIVE TSSOP PW 14 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL064CPWE4 ACTIVE TSSOP PW 14 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL064CPWG4 ACTIVE TSSOP PW 14 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL064CPWLE OBSOLETE TSSOP PW 14 TBD Call TI TL064CPWR ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL064CPWRE4 ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL064CPWRG4 ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL064ID ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL064IDE4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL064IDG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL064IDR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Addendum-Page 5 Lead/Ball Finish MSL Peak Temp (3) Call TI PACKAGE OPTION ADDENDUM www.ti.com 11-Nov-2009 Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty TL064IDRE4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL064IDRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL064IN ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type TL064INE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type TL064INS ACTIVE SO NS 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL064INSG4 ACTIVE SO NS 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL064INSR ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL064INSRG4 ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Lead/Ball Finish MSL Peak Temp (3) TL064MFK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type TL064MFKB ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type TL064MJ ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type TL064MJB ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type TL064MWB ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 6 PACKAGE MATERIALS INFORMATION www.ti.com 29-Jul-2009 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant TL061ACDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 TL061CDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 TL061CDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 TL061CPSR SO PS 8 2000 330.0 16.4 8.2 6.6 2.5 12.0 16.0 Q1 TL061IDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 TL061IDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 TL062ACDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 TL062ACPSR SO PS 8 2000 330.0 16.4 8.2 6.6 2.5 12.0 16.0 Q1 TL062BCDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 TL062CDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 TL062CDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 TL062CPSR SO PS 8 2000 330.0 16.4 8.2 6.6 2.5 12.0 16.0 Q1 TL062CPWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1 TL062IDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 TL062IDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 TL062IPWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1 TL064ACDR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 TL064BCDR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 29-Jul-2009 Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant TL064CDBR SSOP DB 14 2000 330.0 16.4 8.2 6.6 2.5 12.0 16.0 Q1 TL064CDR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 TL064CNSR SO NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1 TL064CPWR TSSOP PW 14 2000 330.0 12.4 7.0 5.6 1.6 8.0 12.0 Q1 TL064IDR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 TL064INSR SO NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TL061ACDR SOIC D 8 2500 340.5 338.1 20.6 TL061CDR SOIC D 8 2500 340.5 338.1 20.6 TL061CDR SOIC D 8 2500 346.0 346.0 29.0 TL061CPSR SO PS 8 2000 346.0 346.0 33.0 TL061IDR SOIC D 8 2500 340.5 338.1 20.6 TL061IDR SOIC D 8 2500 346.0 346.0 29.0 TL062ACDR SOIC D 8 2500 340.5 338.1 20.6 TL062ACPSR SO PS 8 2000 346.0 346.0 33.0 TL062BCDR SOIC D 8 2500 340.5 338.1 20.6 TL062CDR SOIC D 8 2500 340.5 338.1 20.6 TL062CDR SOIC D 8 2500 346.0 346.0 29.0 Pack Materials-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 29-Jul-2009 Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TL062CPSR SO PS 8 2000 346.0 346.0 33.0 TL062CPWR TSSOP PW 8 2000 346.0 346.0 29.0 TL062IDR SOIC D 8 2500 340.5 338.1 20.6 TL062IDR SOIC D 8 2500 346.0 346.0 29.0 TL062IPWR TSSOP PW 8 2000 346.0 346.0 29.0 TL064ACDR SOIC D 14 2500 346.0 346.0 33.0 TL064BCDR SOIC D 14 2500 346.0 346.0 33.0 TL064CDBR SSOP DB 14 2000 346.0 346.0 33.0 TL064CDR SOIC D 14 2500 346.0 346.0 33.0 TL064CNSR SO NS 14 2000 346.0 346.0 33.0 TL064CPWR TSSOP PW 14 2000 346.0 346.0 29.0 TL064IDR SOIC D 14 2500 346.0 346.0 33.0 TL064INSR SO NS 14 2000 346.0 346.0 33.0 Pack Materials-Page 3 MECHANICAL DATA MSSO002E - JANUARY 1995 - REVISED DECEMBER 2001 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 28 PINS SHOWN 0,38 0,22 0,65 28 0,15 M 15 0,25 0,09 8,20 7,40 5,60 5,00 Gage Plane 1 14 0,25 A 0-8 0,95 0,55 Seating Plane 2,00 MAX 0,10 0,05 MIN PINS ** 14 16 20 24 28 30 38 A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 DIM 4040065 /E 12/01 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-150 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 MECHANICAL DATA MLCC006B - OCTOBER 1996 FK (S-CQCC-N**) LEADLESS CERAMIC CHIP CARRIER 28 TERMINAL SHOWN 18 17 16 15 14 13 NO. OF TERMINALS ** 12 19 11 20 10 A B MIN MAX MIN MAX 20 0.342 (8,69) 0.358 (9,09) 0.307 (7,80) 0.358 (9,09) 28 0.442 (11,23) 0.458 (11,63) 0.406 (10,31) 0.458 (11,63) 21 9 22 8 44 0.640 (16,26) 0.660 (16,76) 0.495 (12,58) 0.560 (14,22) 23 7 52 0.739 (18,78) 0.761 (19,32) 0.495 (12,58) 0.560 (14,22) 24 6 68 0.938 (23,83) 0.962 (24,43) 0.850 (21,6) 0.858 (21,8) 84 1.141 (28,99) 1.165 (29,59) 1.047 (26,6) 1.063 (27,0) B SQ A SQ 25 5 26 27 28 1 2 3 4 0.080 (2,03) 0.064 (1,63) 0.020 (0,51) 0.010 (0,25) 0.020 (0,51) 0.010 (0,25) 0.055 (1,40) 0.045 (1,14) 0.045 (1,14) 0.035 (0,89) 0.045 (1,14) 0.035 (0,89) 0.028 (0,71) 0.022 (0,54) 0.050 (1,27) 4040140 / D 10/96 NOTES: A. B. C. D. E. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. This package can be hermetically sealed with a metal lid. The terminals are gold plated. Falls within JEDEC MS-004 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 MECHANICAL DATA MTSS001C - JANUARY 1995 - REVISED FEBRUARY 1999 PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 14 PINS SHOWN 0,30 0,19 0,65 14 0,10 M 8 0,15 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 1 7 0- 8 A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 8 14 16 20 24 28 A MAX 3,10 5,10 5,10 6,60 7,90 9,80 A MIN 2,90 4,90 4,90 6,40 7,70 9,60 DIM 4040064/F 01/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-153 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 MECHANICAL DATA MPDI001A - JANUARY 1995 - REVISED JUNE 1999 P (R-PDIP-T8) PLASTIC DUAL-IN-LINE 0.400 (10,60) 0.355 (9,02) 8 5 0.260 (6,60) 0.240 (6,10) 1 4 0.070 (1,78) MAX 0.325 (8,26) 0.300 (7,62) 0.020 (0,51) MIN 0.015 (0,38) Gage Plane 0.200 (5,08) MAX Seating Plane 0.010 (0,25) NOM 0.125 (3,18) MIN 0.100 (2,54) 0.021 (0,53) 0.015 (0,38) 0.430 (10,92) MAX 0.010 (0,25) M 4040082/D 05/98 NOTES: A. All linear dimensions are in inches (millimeters). B. This drawing is subject to change without notice. C. Falls within JEDEC MS-001 For the latest package information, go to http://www.ti.com/sc/docs/package/pkg_info.htm POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 MECHANICAL DATA MCER001A - JANUARY 1995 - REVISED JANUARY 1997 JG (R-GDIP-T8) CERAMIC DUAL-IN-LINE 0.400 (10,16) 0.355 (9,00) 8 5 0.280 (7,11) 0.245 (6,22) 1 0.063 (1,60) 0.015 (0,38) 4 0.065 (1,65) 0.045 (1,14) 0.310 (7,87) 0.290 (7,37) 0.020 (0,51) MIN 0.200 (5,08) MAX Seating Plane 0.130 (3,30) MIN 0.023 (0,58) 0.015 (0,38) 0-15 0.100 (2,54) 0.014 (0,36) 0.008 (0,20) 4040107/C 08/96 NOTES: A. B. C. D. E. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. This package can be hermetically sealed with a ceramic lid using glass frit. Index point is provided on cap for terminal identification. Falls within MIL STD 1835 GDIP1-T8 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI's terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI's standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications. TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Amplifiers Data Converters DLP(R) Products DSP Clocks and Timers Interface Logic Power Mgmt Microcontrollers RFID RF/IF and ZigBee(R) Solutions amplifier.ti.com dataconverter.ti.com www.dlp.com dsp.ti.com www.ti.com/clocks interface.ti.com logic.ti.com power.ti.com microcontroller.ti.com www.ti-rfid.com www.ti.com/lprf Applications Audio Automotive Broadband Digital Control Medical Military Optical Networking Security Telephony Video & Imaging Wireless www.ti.com/audio www.ti.com/automotive www.ti.com/broadband www.ti.com/digitalcontrol www.ti.com/medical www.ti.com/military www.ti.com/opticalnetwork www.ti.com/security www.ti.com/telephony www.ti.com/video www.ti.com/wireless Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright (c) 2009, Texas Instruments Incorporated