Applications
CGA Series
Soft Termination
Type: CGA3 [EIA CC0603], CGA4 [EIA CC0805], CGA5 [EIA CC1206],
CGA6 [EIA CC1210], CGA7 [EIA CC1808], CGA8 [EIA CC1812],
CGA9 [EIA CC2220]
L Body Length
W Body Width
T Body Height
B Terminal Width
G Terminal Spacing
Shape &
Dimensions
.
Features
Standard Product Soft Termination
Series Name
Dimensions L x W (mm)
Temperature Characteristics Rated Voltage (DC)
Nominal Capacita nce (pF) Capacitanc e Toler ance
Packaging Style
Nominal Thickness
Code Length Width Terminal
*Dimension tolerance are typical values
Code V oltage (DC)
1C 16V
1E 25V
1V 35V
1H 50V
2A 100V
2E 250V
Code Tolerance
K±10%
M±20%
Code Style
A 178 mm Reel, 4 mm Pitch
K 178 mm Reel, 8 mm Pitch
Temperature
Characteristics Temperature
Range
X7R ±15% -55 to +125 °C
X7S ±22% -55 to +125°C
X7T +22/-33% -55 to +125 °C
The capacitance is expressed in three digit codes and in units of pico Farads (pF).
The first and second digits identify the first and second significant figures of the
capacitance. The third digit identifies the multiplier. R designates a decimal point.
Ex. 0R2 = 0.2pF; 103 = 10,000pF; 105 = 1,000,000pF = 1,000nF = 1ȝ)
CGA 6 P 3 X7S 1H 106 K 250 A E
Code Thickness
080 0.80 mm
085 0.85 mm
160 1.60 mm
130 1.30 mm
250 2.50 mm
*See Thickness T Code for complete list
Special Re s e rv e d Code
Code Description
E Soft Termination
Code Thickness
E
F
H
J
K
L
M
N
P
0.80 mm
0.85 mm
1.15 mm
1.25 mm
1.30 mm
1.60 mm
2.00 mm
2.30 mm
2.50 mm
Thickness T Code (mm)
Symbol Condition
11 × R.V.
22 × R.V.
31.5 × R.V.
41.2 × R.V.
Voltage Condition
for Life Test
Code Voltage (DC)
2W 450V
2J 630V
3A 1000V
3D 2000V
3F 3000V
Improved board bending resistance, drop impact resistance,
thermal shock resistance, and heat cycle properties.
Conductive resin absorb external stress to protect solder joint
parts and capacitor body.
Compliance with the RoHS Directive.
AEC-Q200 compliant.
Switching power supply
Telecom base station
Electronic circuits mounted on alumina
substrate
SMT application which requires bending
robustness in which solder joint reliability is
problematic
2.00 + 0.45/-0.20 1.25 + 0.25/-0.20 0.20 min.
1.60 + 0.20/-0.10 0.80 + 0.15/-0.10 0.20 min.
3.20 + 0.40/-0.20 1.60 + 0.30/-0.20 0.20 min.
3.20 + 0.50/-0.40 2.50 ± 0.30
±0.15 0.20 min.
5.70 + 0.50/-0.40 3.20 ± 0.40 0.20 min.
4.50 + 0.30/-0.20
4.50 + 0.50/-0.40 2.00 0.20 min.
5.00 ± 0 .40 0.20 min.
-
C0G 0 ±30ppm/°C 55 to +125°C
Temperature Coefficient or
Capacitance Change
3
4
5
6
7
8
9
Catalog Number
Construction
Page 2
MULTILAYER CERAMIC CHIP CAPACITORS
20150330 / mlcc_automotive_soft_en
Please be sure to request delivery specifi cations that provide further details on the features and specifi cations of the products for proper and safe use.
Please note that the contents may change without any prior notice due to reasons such as upgrading.