MM74HCT04MTCX - Fairchild Semiconductor

MM74HCT04 — Hex Inverter

MM74HCT04 Rev. 1.3.0

February 2008

MM74HCT04

Hex Inverter

Features

■

TTL, LS pin-out and threshold compatible

■

Fast switching: t

PLH

, t

PHL

=

12 ns (typ)

■

Low power: 10 µW at DC, 3.7 mW at 5 MHz

■

High fanout:

≥

10 LS loads

■

Inverting, triple buffered

General Description

The MM74HCT04 is a logic function fabricated by using

advanced silicon-gate CMOS technology which provides

the inherent benefits of CMOS—low quiescent power

and wide power supply range. This device is input and

output characteristic as well as pin-out compatible with

standard 74LS logic families. The MM74HCT04, triple

buffered, hex inverters, features low power dissipation

and fast switching times. All inputs are protected from

static discharge by internal diodes to V

CC

and ground.

MM74HCT devices are intended to interface between

TTL and NMOS components and standard CMOS

devices. These parts are also plug-in replacements for

LS-TTL devices and can be used to reduce power

consumption in existing designs.

Ordering Information

Device also available in Tape and Reel. Specify by appending suffix letter “X” to the ordering number.

All packages are lead free per JEDEC: J-STD-020B standard.

Order Number

Package

Number Package Description

MM74HCT04M M14A 14-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150"

Narrow

MM74HCT04SJ M14D 14-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide

MM74HCT04MTC MTC14 14-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153,

4.4mm Wide

MM74HCT04N N14A 14-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300" Wide

MM74HCT04 Rev. 1.3.0 2

MM74HCT04 — Hex Inverter

Connection Diagram

Pin Assignments for DIP, SOIC, SOP and TSSOP

Top View

MM74HCT04 Rev. 1.3.0 3

MM74HCT04 — Hex Inverter

Absolute Maximum Ratings

(1)

Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be

operable above the recommended operating conditions and stressing the parts to these levels is not recommended.

In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability.

The absolute maximum ratings are stress ratings only.

Notes:

1. Unless otherwise specified all voltages are referenced to ground.

2. Power Dissipation temperature derating — plastic “N” package: –12mW/°C from 65°C to 85°C.

Recommended Operating Conditions

The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended

operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not

recommend exceeding them or designing to absolute maximum ratings.

Symbol Parameter Rating

V

CC

Supply Voltage –0.5 to +7.0V

V

IN

DC Input Voltage –1.5 to V

CC

+1.5V

V

OUT

DC Output Voltage –0.5 to V

CC

+0.5V

I

IK

, I

OK

Clamp Diode Current ±20mA

I

OUT

DC Output Current, per pin ±25mA

I

CC

DC V

CC

or GND Current, per pin ±50mA

T

STG

Storage Temperature Range –65°C to +150°C

P

D

Power Dissipation

Note 2 600mW

S.O. Package only 500mW

T

L

Lead Temperature (Soldering 10 seconds) 260°C

Symbol Parameter Min. Max. Units

V

CC

Supply Voltage 4.5 5.5 V

V

IN

, V

OUT

DC Input or Output Voltage 0 V

CC

V

T

A

Operating Temperature Range –40 +85 °C

t

r

, t

f

Input Rise or Fall Times 500 ns

MM74HCT04 Rev. 1.3.0 4

MM74HCT04 — Hex Inverter

DC Electrical Characteristics

V

CC

=

5V ± 10% (unless otherwise specified)

Note:

3. This is measured per input with all other inputs held at V

CC

or ground.

Symbol Parameter Conditions

T

A

=

25°C

T

A

=

–40°C

to 85°C

T

A

=

–55°C

to 125°C

UnitsTyp. Guaranteed Limits

V

IH

Minimum HIGH Level

Input Voltage

2.0 2.0 2.0 V

V

IL

Maximum LOW Level

Input Voltage

0.8 0.8 0.8 V

V

OH

Minimum HIGH Level

Output Voltage

V

IN

=

V

IH

or V

IL

,

|I

OUT

|

=

20µA

V

CC

V

CC

– 0.1 V

CC

– 0.1 V

CC

– 0.1 V

V

IN

=

V

IH

or V

IL

,

|I

OUT

|

=

4.0mA,

V

CC

=

4.5V

4.2 3.98 3.84 3.7

V

IN

=

V

IH

or V

IL

,

|I

OUT

|

=

4.8mA,

V

CC

=

5.5V

5.2 4.98 4.84 4.7

V

OL

Maximum LOW Level

Voltage

V

IN

=

V

IH

,

|I

OUT

|

=

20µA

0 0.1 0.1 0.1 V

V

IN

=

V

IH

,

|I

OUT

|

=

4.0mA,

V

CC

=

4.5V

0.2 0.26 0.33 0.4

V

IN

=

V

IH

,

|I

OUT

|

=

4.8mA,

V

CC

=

5.5V

0.2 0.26 0.33 0.4

I

IN

Maximum Input

Current

V

IN

=

V

CC

or GND,

V

IH

or V

IL

±0.1 ±1.0 ±1.0 µA

I

CC

Maximum Quiescent

Supply Current

V

IN

=

V

CC

or GND,

I

OUT

=

0µA

2.0 20 40 µA

V

IN

=

2.4V or 0.5V

(3)

0.3 0.4 0.5 mA

MM74HCT04 Rev. 1.3.0 5

MM74HCT04 — Hex Inverter

AC Electrical Characteristics

V

CC

= 5.0V, t

r

= t

r

= 6ns, C

L

= 15pF, T

A

= 25°C (unless otherwise noted)

AC Electrical Characteristics

V

CC

= 5.0V ±10%, t

r

= t

f

= 6ns, C

L

= 50pF (unless otherwise noted)

Note:

4. C

PD

determines the no load dynamic power consumption, P

D

=

C

PD

V

CC2

f + I

CC

V

CC

, and the no load dynamic

current consumption, I

S

=

C

PD VCC f + ICC.

Symbol Parameter Conditions Typ.

Guaranteed

Limit Units

tPLH, tPHL Maximum Propagation Delay 10 18 ns

Symbol Parameter Conditions

TA = 25°C

TA = –40°C

to 85°C

TA = –55°C

to 125°C

UnitsTyp. Guaranteed Limits

tPLH, tPHL Maximum Propagation Delay 14 20 25 30 ns

tTHL, tTLH Maximum Output Rise and

Fall Time

815 19 22 ns

CPD Power Dissipation

Capacitance

(4) 20 pF

CIN Input Capacitance 5 10 10 10 pF

MM74HCT04 Rev. 1.3.0 6

MM74HCT04 — Hex Inverter

Physical Dimensions

Figure 1. 14-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150" Narrow

Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner

without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or

obtain the most recent revision. Package speciﬁcations do not expand the terms of Fairchild’s worldwide terms and conditions,

speciﬁcally the warranty therein, which covers Fairchild products.

Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:

http://www.fairchildsemi.com/packaging/

LAND PATTERN RECOMMENDATION

NOTES: UNLESS OTHERWISE SPECIFIED

A) THIS PACKAGE CONFORMS TO JEDEC

MS-012, VARIATION AB, ISSUE C,

B) ALL DIMENSIONS ARE IN MILLIMETERS.

C) DIMENSIONS DO NOT INCLUDE MOLD

FLASH OR BURRS.

D) LANDPATTERN STANDARD:

SOIC127P600X145-14M

E) DRAWING CONFORMS TO ASME Y14.5M-1994

F) DRAWING FILE NAME: M14AREV13

PIN ONE

INDICATOR

8°

0°

SEATING PLANE

DETAIL A

SCALE: 20:1

GAGE PLANE

0.25

X45°

1

0.10

C

BC A

7

M

14 B

A

8

SEE DETAIL A

5.60

0.65

1.70 1.27

8.75

8.50

7.62

6.00 4.00

3.80

(0.33)

1.27 0.51

0.35

1.75 MAX

1.50

1.25

0.25

0.10

0.25

0.19

(1.04)

0.90

0.50

0.36

R0.10

0.50

0.25

MM74HCT04 Rev. 1.3.0 7

MM74HCT04 — Hex Inverter

Physical Dimensions (Continued)

Figure 2. 14-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide

Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner

without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or

obtain the most recent revision. Package speciﬁcations do not expand the terms of Fairchild’s worldwide terms and conditions,

speciﬁcally the warranty therein, which covers Fairchild products.

Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:

http://www.fairchildsemi.com/packaging/

MM74HCT04 Rev. 1.3.0 8

MM74HCT04 — Hex Inverter

Physical Dimensions (Continued)

Figure 3. 14-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide

Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner

without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or

obtain the most recent revision. Package speciﬁcations do not expand the terms of Fairchild’s worldwide terms and conditions,

speciﬁcally the warranty therein, which covers Fairchild products.

Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:

http://www.fairchildsemi.com/packaging/

C. DIMENSIONS ARE EXCLUSIVE OF BURRS, MOLD FLASH,

AND TIE BAR EXTRUSIONS

F. DRAWING FILE NAME: MTC14REV6

R0.09 min

12.00°TOP & BOTTO

M

0.43 TYP

1.00

D. DIMENSIONING AND TOLERANCES PER ANSI

Y14.5M, 1982

R0.09min

E. LANDPATTERN STANDARD: SOP65P640X110-14M

0.65

6.10

1.65

0.45

A. CONFORMS TO JEDEC REGISTRATION MO-153,

VARIATION AB, REF NOTE 6

B. DIMENSIONS ARE IN MILLIMETERS

MM74HCT04 Rev. 1.3.0 9

MM74HCT04 — Hex Inverter

Physical Dimensions (Continued)

Figure 4. 14-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300" Wide

Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner

without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or

obtain the most recent revision. Package speciﬁcations do not expand the terms of Fairchild’s worldwide terms and conditions,

speciﬁcally the warranty therein, which covers Fairchild products.

Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:

http://www.fairchildsemi.com/packaging/

14 8

7

1

NOTES: UNLESS OTHERWISE SPECIFIED

A)

THIS PACKAGE CONFORMS TO

JEDEC MS-001 VARIATION BA

B) ALL DIMENSIONS ARE IN MILLIMETERS.

C)

DIMENSIONS ARE EXCLUSIVE OF BURRS,

MOLD FLASH, AND TIE BAR EXTRUSIONS.

D) DIMENSIONS AND TOLERANCES PER

ASME Y14.5-1994

E) DRAWING FILE NAME: MKT-N14AREV7

6.60

6.09

8.12

7.62

0.35

0.20

19.56

18.80

3.56

3.30 5.33 MAX

0.38 MIN

1.77

1.14

0.58

0.35 2.54

3.81

3.17 8.82

(1.74)

MM74HCT04 Rev. 1.3.0 10

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Build it Now™

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CROSSVOLT™

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Current Transfer Logic™

EcoSPARK®

EZSWITCH™ *

™

®

Fairchild®

Fairchild Semiconductor®

FACT Quiet Series™

FACT®

FAST®

FastvCore™

FlashWriter®*

FPS™

FRFET®

Global Power ResourceSM

Green FPS™

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GTO™

i-Lo™

IntelliMAX™

ISOPLANAR™

MegaBuck™

MICROCOUPLER™

MicroFET™

MicroPak™

MillerDrive™

Motion-SPM™

OPTOLOGIC®

OPTOPLANAR®

®

PDP-SPM™

Power220®

POWEREDGE®

Power-SPM™

PowerTrench®

Programmable Active Droop™

QFET®

QS™

QT Optoelectronics™

Quiet Series™

RapidConfigure™

SMART START™

SPM®

STEALTH™

SuperFET™

SuperSOT™-3

SuperSOT™-6

SuperSOT™-8

SupreMOS™

SyncFET™®

The Power Franchise®

TinyBoost™

TinyBuck™

TinyLogic®

TINYOPTO™

TinyPower™

TinyPWM™

TinyWire™

µSerDes™

UHC®

Ultra FRFET™

UniFET™

VCX™

*EZSWITCH™ and FlashWriter®are trademarks of System General Corporation, used under license by Fairchild Semiconductor.

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FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS

HEREIN TO IMPROVE RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE

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As used herein:

1. Life support devices or systems are devices or systems

which, (a) are intended for surgical implant into the body or

(b) support or sustain life, and (c) whose failure to perform

when properly used in accordance with instructions for use

provided in the labeling, can be reasonably expected to

result in a significant injury of the user.

2. A critical component in any component of a life support,

device, or system whose failure to perform can be

reasonably expected to cause the failure of the life support

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PRODUCT STATUS DEFINITIONS

Definition of Terms

Datasheet Identification Product Status Definition

Advance Information Formative or In Design This datasheet contains the design specifications for product

development. Specifications may change in any manner without notice.

Preliminary First Production

This datasheet contains preliminary data; supplementary data will be

published at a later date. Fairchild Semiconductor reserves the right to

make changes at any time without notice to improve design.

No Identification Needed Full Production

This datasheet contains final specifications. Fairchild Semiconductor

reserves the right to make changes at any time without notice to improve

the design.

Obsolete Not In Production

This datasheet contains specifications on a product that has been

discontinued by Fairchild Semiconductor. The datasheet is printed for

reference information only.

Rev. I33

MM74HCT04 — Hex Inverter